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JP2004289083A - Substrate for mounting electronic component and method of mounting electronic component - Google Patents

Substrate for mounting electronic component and method of mounting electronic component Download PDF

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Publication number
JP2004289083A
JP2004289083A JP2003082425A JP2003082425A JP2004289083A JP 2004289083 A JP2004289083 A JP 2004289083A JP 2003082425 A JP2003082425 A JP 2003082425A JP 2003082425 A JP2003082425 A JP 2003082425A JP 2004289083 A JP2004289083 A JP 2004289083A
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JP
Japan
Prior art keywords
electronic component
mounting
adhesive
component mounting
mounting position
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003082425A
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Japanese (ja)
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JP4100213B2 (en
Inventor
Mitsuru Osono
満 大園
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
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Priority to JP2003082425A priority Critical patent/JP4100213B2/en
Publication of JP2004289083A publication Critical patent/JP2004289083A/en
Application granted granted Critical
Publication of JP4100213B2 publication Critical patent/JP4100213B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/1134—Stud bumping, i.e. using a wire-bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81192—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate for mounting an electronic component and a method of mounting an electronic component which eliminate creeping-up of a resin adhesive to the upper face of the electronic component. <P>SOLUTION: An electronic component 4, having metal bumps 5 for external-connection electrodes on its lower face, is mounted on the substrate 1 for mounting an electronic component. A component mounting area 1b is located at the mounting position to which the electronic component 4 is stuck by the resin adhesive 3. A downward slope 1c is provided on the outer edge of the component mounting area 1b, wherein the height of the downward slope 1c is lower than the component mounting area 1b. In the component mounting process, the resin adhesive 3 pushed out by the electronic component 4 flows down on the downward slope 1c. Thereby, creeping-up of the resin adhesive 3 to the upper face of the electronic component 4 in the electronic-component mounting state is eliminated, and the problem in which the mounting tool is stained by the resin adhesive 3 is prevented. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は、電子部品が実装される電子部品実装用の基板および電子部品実装方法に関するものである。
【０００２】
【従来の技術】
電子部品の種類として、金属バンプなどの外部接続用電極が下面に設けられたフェイスダウン型の電子部品が知られている。このような電子部品を基板に実装する場合には、金属バンプを基板の実装位置に形成された回路電極に半田接合や導電性ペーストなどによって接続する（例えば特許文献１参照）。この実装構造において、金属バンプの接続部を補強してより高い信頼性を確保する必要がある場合には、電子部品と基板との間に樹脂接着材を介在させて補強樹脂部を形成することが行われる。この補強樹脂部の形成には、電子部品の搭載に先立って予め基板に樹脂を塗布しておく方法や、電子部品を基板に搭載した後に樹脂を注入する方法が用いられる。
【０００３】
【特許文献１】
特開昭６３−１２２１３５号公報
【０００４】
【発明が解決しようとする課題】
近年電子部品の薄型化が進み、１００μｍ以下の厚みのものが用いられるようになっている。このような薄型部品について上述の補強樹脂部を形成する場合には、樹脂接着材の挙動に起因して次のような問題が生じる。すなわち、ペースト状の樹脂接着材は、固体面と接触すると表面張力によって固体面に沿って這い上がるという性質を有しており、上述の電子部品実装において樹脂接着材上に電子部品を搭載すると、樹脂接着材は電子部品の側端部から這い上がる。
【０００５】
このとき、電子部品が薄いと這い上がった樹脂接着材が電子部品の上面まで到達してしまい、この樹脂接着材が電子部品の実装に用いられる実装ツールに付着して汚染するという不具合を招き易い。そしてこの問題は、電子部品の搭載後に樹脂接着材を注入する場合においても同様に生じる。
【０００６】
そこで本発明は、樹脂接着材の電子部品上面への這い上りを解消できる電子部品実装用の基板および電子部品実装方法を提供することを目的とする。
【０００７】
【課題を解決するための手段】
請求項１記載の電子部品実装用の基板は、外部接続用電極を介して電子部品が実装される電子部品実装用の基板であって、前記電子部品が接着材により固着される実装位置と、この実装位置に形成され前記外部接続用電極が接続される回路電極と、前記実装位置の外縁部に形成され実装位置に供給された前記接着材が流下する低部とを備えた。
【０００８】
請求項２記載の電子部品実装用の基板は、請求項１記載の電子部品実装用の基板であって、前記低部が下り勾配の傾斜面である。
【０００９】
請求項３記載の電子部品実装用の基板は、請求項１記載の電子部品実装用の基板であって、前記低部が段差部である。
【００１０】
請求項４記載の電子部品実装用の基板は、請求項１記載の電子部品実装用の基板であって、前記低部が溝部である。
【００１１】
請求項５記載の電子部品実装方法は、外部接続用電極を介して電子部品を基板に実装する電子部品実装方法であって、回路電極が形成され外縁部に高さが低い低部が形成された実装位置に接着材を供給する接着材供給工程と、接着材が供給された実装位置に前記電子部品を前記外部接続用電極を介して搭載する部品搭載工程と、前記実装位置からはみ出した余剰の接着材を前記低部内に流下させる接着材流下工程とを含む。
【００１２】
請求項６記載の電子部品実装方法は、外部接続用電極を介して電子部品を基板に実装する電子部品実装方法であって、回路電極が形成され外縁部に高さが低い低部が形成された実装位置に前記外部接続用電極を介して搭載する部品搭載工程と、前記電子部品の下面と実装位置の上面との間に接着材を供給する接着材供給工程と、前記実装位置からはみ出した余剰の接着材を前記低部内に流下させる接着材流下工程とを含む。
【００１３】
請求項７記載の電子部品実装方法は、請求項５または６記載の電子部品実装方法であって、前記低部が下り勾配の傾斜面である。
【００１４】
請求項８記載の電子部品実装方法は、請求項５または６記載の電子部品実装方法であって、前記低部が段差部である。
【００１５】
請求項９記載の電子部品実装方法は、請求項５または６記載の電子部品実装方法であって、前記低部が溝部である。
【００１６】
本発明によれば、電子部品が接着材により固着される実装位置の外縁部に、実装位置に供給された接着材が流下する低部を形成することにより、電子部品搭載状態における接着材の電子部品上面への這い上りを解消することができる。
【００１７】
【発明の実施の形態】
次に本発明の実施の形態を図面を参照して説明する。図１は本発明の一実施の形態の電子部品実装用の基板の斜視図、図２は本発明の一実施の形態の電子部品実装方法の工程説明図、図３は本発明の一実施の形態の電子部品実装用の基板の断面図、図４は本発明の一実施の形態の電子部品実装用の基板の断面図である。
【００１８】
まず、図１を参照して電子部品実装用の基板について説明する。基板１上面において電子部品が実装される実装位置には、平面視して４角形の凸状部１ａが形成されている。凸状部１ａの上面は電子部品が実装される部品実装面１ｂとなっており、部品実装面１ｂの周囲は高さが部品実装面１ｂよりも高さが低いテーパ状下り勾配の傾斜面１ｃとなっている（図２（ａ）も参照）。すなわち、実装位置の外縁部には、高さが部品実装面１ｂよりも低い低部が形成されている。
【００１９】
基板１の凸状部１ａの周囲には複数の回路電極２が形成されている。各回路電極２は部品実装面１ｂの４周まで延出しており、延出端部は部品接続用の端子２ａとなっている。電子部品が基板１に実装された状態では、電子部品の外部接続用電極が端子２ａに接続される。
【００２０】
次に電子部品実装方法について説明する。図２（ａ）は基板１の断面を示している。図２（ｂ）に示すように、部品実装面１ｂには、端子２ａを覆ってペースト状の樹脂接着材（接着材）３が供給される（接着材供給工程）。次いで図２（ｃ）に示すように、樹脂接着材塗布後の基板１には、回路が形成された回路形成面である下面に外部接続用電極である金属バンプ５が形成された電子部品４が搭載される（部品搭載工程）。すなわち、実装位置に電子部品が金属バンプ５を介して搭載される。
【００２１】
この搭載動作においては、電子部品４を下降させて樹脂接着材３を介して金属バンプ５を端子２ａに押し付ける。これにより、金属バンプ５が端子２ａと接続される。そして樹脂接着材３が硬化することにより、電子部品４は基板１に固着され、電子部品４の実装が完了する。
【００２２】
このとき、電子部品４の下面によって押しのけられて部品実装面１ｂの外側に移動した樹脂接着材３は、傾斜面１ｃに沿って下方に流動する。すなわち、電子部品４の下面と部品実装面１ｂとの間に収容されない余剰の樹脂接着材３は、低部である傾斜面１ｃに流下する（接着材流下工程）。
【００２３】
これにより、樹脂接着材３が電子部品４の側端部から這い上がって、電子部品４の上面に到達することによる実装ツールの汚染などの不具合を防止することができる。電子部品４の搭載後に電子部品４の下面と部品実装面１ｂ（実装位置の上面）との間に樹脂接着材３を供給する場合も同様である。但し、電子部品搭載前に実装位置に樹脂接着材３を供給する方が、接着材を迅速に供給できるので望ましい。
【００２４】
なお余剰の樹脂接着材３を流下させる低部の形態としては、上述例の傾斜面１ｃ以外にも各種の形態が可能であり、例えば図３に示すような基板を採用するようにしてもよい。図３（ａ）に示す基板１１は、実装位置に設けられ上面が部品実装面１１ｂである凸状部１１ａの４辺の外縁部に、周囲の基板上面との間に切り立った形状の高さ差がある段差部１１ｃを設けた例を示している。また図３（ｂ）に示す基板２１は、実装位置に設けられた部品実装面２１ａの外縁部に、基板上面から削り込まれた溝部２１ｂを設けた例を示している。
【００２５】
これらの場合においても、部品搭載時に実装位置からはみ出した余剰の樹脂接着材３は、部品実装面よりも高さが低い低部に流入し、同様に樹脂接着材３の電子部品４への這い上がりを防止することができる。
【００２６】
なお、上記実施の形態においては、下面に外部接続用電極を備えた電子部品を、この外部接続用電極が接続される回路電極が形成された基板に搭載する例を示したが、本発明はこれに限られるものではない。
【００２７】
例えば図４に示す基板１Ａのように、電子部品４Ａと接続される外部接続用電極としての金属バンプ５を回路電極２の上面に設けてもよい。要は電子部品が接着材により固着される実装位置の外縁部に実装位置に供給された接着材が流下する低部が存在すればよく、外部接続用電極が電子部品側にあっても回路電極側にあっても構わない。なお、外部接続用電極を電子部品側に設けた方が、基板の構造が容易になるので好ましい。
【００２８】
【発明の効果】
本発明によれば、電子部品が接着材により固着される実装位置の外縁部に、実装位置に供給された接着材が流下する低部を形成することにより、接着材の電子部品上面への這い上りを解消することができ、接着材が電子部品の上面に付着することによる実装ツールの汚染などの不具合を防止することができる。
【図面の簡単な説明】
【図１】本発明の一実施の形態の電子部品実装用の基板の斜視図
【図２】本発明の一実施の形態の電子部品実装方法の工程説明図
【図３】本発明の一実施の形態の電子部品実装用の基板の断面図
【図４】本発明の一実施の形態の電子部品実装用の基板の断面図
【符号の説明】
１，１１，２１ 基板
１ｂ、１１ｂ、２１ａ 部品実装面
１ｃ 傾斜面
２ 回路電極
３ 樹脂接着材
４ 電子部品
５ 金属バンプ
１１ｃ 段差部
２１ｂ 溝部[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electronic component mounting board on which electronic components are mounted and an electronic component mounting method.
[0002]
[Prior art]
As a type of electronic component, a face-down type electronic component in which an external connection electrode such as a metal bump is provided on a lower surface is known. When such an electronic component is mounted on a substrate, a metal bump is connected to a circuit electrode formed at a mounting position of the substrate by solder bonding, conductive paste, or the like (for example, see Patent Document 1). In this mounting structure, if it is necessary to reinforce the connection parts of the metal bumps to ensure higher reliability, form a reinforcing resin part by interposing a resin adhesive between the electronic component and the board. Is performed. For forming the reinforcing resin portion, a method of applying a resin to a substrate in advance before mounting the electronic component, or a method of injecting the resin after mounting the electronic component on the substrate is used.
[0003]
[Patent Document 1]
JP-A-63-122135
[Problems to be solved by the invention]
In recent years, electronic components have become thinner, and those having a thickness of 100 μm or less have been used. When the above-mentioned reinforcing resin portion is formed for such a thin component, the following problem occurs due to the behavior of the resin adhesive. That is, the paste-like resin adhesive has a property of crawling along the solid surface due to surface tension when it comes into contact with the solid surface, and when the electronic component is mounted on the resin adhesive in the electronic component mounting described above, The resin adhesive rises from the side edge of the electronic component.
[0005]
At this time, if the electronic component is thin, the cleaved resin adhesive reaches the upper surface of the electronic component, and this resin adhesive tends to adhere to a mounting tool used for mounting the electronic component and become contaminated. . This problem also occurs when a resin adhesive is injected after mounting the electronic component.
[0006]
Accordingly, it is an object of the present invention to provide an electronic component mounting board and an electronic component mounting method which can prevent the resin adhesive from climbing up to the upper surface of the electronic component.
[0007]
[Means for Solving the Problems]
The electronic component mounting board according to claim 1, wherein the electronic component is mounted on an electronic component via an external connection electrode, and a mounting position where the electronic component is fixed by an adhesive. A circuit electrode formed at the mounting position to which the external connection electrode is connected; and a lower portion formed at an outer edge of the mounting position and through which the adhesive supplied to the mounting position flows down.
[0008]
An electronic component mounting board according to a second aspect is the electronic component mounting board according to the first aspect, wherein the lower portion is a downward slope.
[0009]
An electronic component mounting board according to a third aspect is the electronic component mounting board according to the first aspect, wherein the low portion is a step portion.
[0010]
An electronic component mounting board according to a fourth aspect is the electronic component mounting board according to the first aspect, wherein the lower portion is a groove.
[0011]
An electronic component mounting method according to a fifth aspect is an electronic component mounting method for mounting an electronic component on a substrate via an external connection electrode, wherein a circuit electrode is formed and a low portion having a low height is formed at an outer edge portion. An adhesive supplying step of supplying an adhesive to the mounting position, a component mounting step of mounting the electronic component via the external connection electrode at the mounting position to which the adhesive is supplied, and a surplus that protrudes from the mounting position. Flowing down the adhesive into the lower portion.
[0012]
An electronic component mounting method according to claim 6, wherein the electronic component is mounted on a substrate via an external connection electrode, wherein the circuit electrode is formed and a low portion having a low height is formed at an outer edge portion. A component mounting step of mounting via the external connection electrode at the mounting position, an adhesive supplying step of supplying an adhesive between the lower surface of the electronic component and the upper surface of the mounting position, An adhesive flow-down step of flowing excess adhesive into the lower portion.
[0013]
An electronic component mounting method according to a seventh aspect is the electronic component mounting method according to the fifth or sixth aspect, wherein the lower portion is a downward slope.
[0014]
An electronic component mounting method according to an eighth aspect is the electronic component mounting method according to the fifth or sixth aspect, wherein the low portion is a step portion.
[0015]
An electronic component mounting method according to claim 9 is the electronic component mounting method according to claim 5 or 6, wherein the lower portion is a groove.
[0016]
According to the present invention, by forming a low portion where the adhesive supplied to the mounting position flows down at the outer edge portion of the mounting position where the electronic component is fixed by the adhesive, the electronic component of the adhesive in the electronic component mounted state is formed. Crawling up to the upper surface of the component can be eliminated.
[0017]
BEST MODE FOR CARRYING OUT THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of an electronic component mounting board according to one embodiment of the present invention, FIG. 2 is a process explanatory view of an electronic component mounting method according to one embodiment of the present invention, and FIG. FIG. 4 is a cross-sectional view of an electronic component mounting board according to an embodiment of the present invention. FIG. 4 is a cross-sectional view of an electronic component mounting board according to an embodiment of the present invention.
[0018]
First, a substrate for mounting electronic components will be described with reference to FIG. At the mounting position where the electronic component is mounted on the upper surface of the substrate 1, a quadrangular convex portion 1a is formed in plan view. The upper surface of the convex portion 1a is a component mounting surface 1b on which an electronic component is mounted, and the periphery of the component mounting surface 1b is a tapered downward slope 1c whose height is lower than the component mounting surface 1b. (See also FIG. 2A). That is, a lower portion whose height is lower than the component mounting surface 1b is formed at the outer edge portion of the mounting position.
[0019]
A plurality of circuit electrodes 2 are formed around the convex portion 1a of the substrate 1. Each of the circuit electrodes 2 extends up to four rounds of the component mounting surface 1b, and the extended end serves as a terminal 2a for component connection. When the electronic component is mounted on the substrate 1, the external connection electrode of the electronic component is connected to the terminal 2a.
[0020]
Next, an electronic component mounting method will be described. FIG. 2A shows a cross section of the substrate 1. As shown in FIG. 2B, a paste-like resin adhesive (adhesive) 3 is supplied to the component mounting surface 1b so as to cover the terminals 2a (adhesive supply step). Next, as shown in FIG. 2 (c), the electronic component 4 in which the metal bumps 5 serving as the external connection electrodes are formed on the lower surface which is the circuit forming surface on which the circuit is formed is formed on the substrate 1 after the resin adhesive is applied. Is mounted (component mounting process). That is, the electronic component is mounted at the mounting position via the metal bump 5.
[0021]
In this mounting operation, the electronic component 4 is lowered, and the metal bump 5 is pressed against the terminal 2 a via the resin adhesive 3. Thereby, the metal bump 5 is connected to the terminal 2a. Then, as the resin adhesive 3 cures, the electronic component 4 is fixed to the substrate 1, and the mounting of the electronic component 4 is completed.
[0022]
At this time, the resin adhesive 3 which has been pushed away by the lower surface of the electronic component 4 and moved to the outside of the component mounting surface 1b flows downward along the inclined surface 1c. That is, the surplus resin adhesive 3 that is not accommodated between the lower surface of the electronic component 4 and the component mounting surface 1b flows down to the lower inclined surface 1c (adhesive flowing step).
[0023]
Thereby, it is possible to prevent a problem such as contamination of the mounting tool due to the resin adhesive 3 crawling up from the side end of the electronic component 4 and reaching the upper surface of the electronic component 4. The same applies when the resin adhesive 3 is supplied between the lower surface of the electronic component 4 and the component mounting surface 1b (the upper surface of the mounting position) after the mounting of the electronic component 4. However, it is preferable to supply the resin adhesive 3 to the mounting position before mounting the electronic component because the adhesive can be supplied quickly.
[0024]
In addition, as a form of the lower part for flowing the surplus resin adhesive 3 down, various forms other than the inclined surface 1c of the above-described example are possible, and for example, a substrate as shown in FIG. 3 may be adopted. . The board 11 shown in FIG. 3A has a height of a shape that is steeply formed between the outer edges of the four sides of the convex portion 11a having the component mounting surface 11b at the mounting position and the upper surface thereof and the surrounding substrate upper surface. An example in which a step portion 11c having a difference is provided is shown. The board 21 shown in FIG. 3B shows an example in which a groove 21b cut from the upper surface of the board is provided on the outer edge of the component mounting surface 21a provided at the mounting position.
[0025]
Also in these cases, the surplus resin adhesive 3 protruding from the mounting position at the time of component mounting flows into a lower portion having a height lower than the component mounting surface, and similarly, the resin adhesive 3 crawls on the electronic component 4. The rise can be prevented.
[0026]
Note that, in the above-described embodiment, an example is shown in which an electronic component provided with an external connection electrode on a lower surface is mounted on a substrate on which a circuit electrode to which the external connection electrode is connected is formed. It is not limited to this.
[0027]
For example, like a substrate 1A shown in FIG. 4, a metal bump 5 as an external connection electrode connected to the electronic component 4A may be provided on the upper surface of the circuit electrode 2. In short, it is sufficient if there is a low part where the adhesive supplied to the mounting position flows down at the outer edge of the mounting position where the electronic component is fixed by the adhesive, and even if the external connection electrode is on the electronic component side, the circuit electrode You can be on the side. It is preferable that the external connection electrode be provided on the electronic component side, because the structure of the substrate becomes easier.
[0028]
【The invention's effect】
According to the present invention, by forming a low portion where the adhesive supplied to the mounting position flows down at the outer edge of the mounting position where the electronic component is fixed by the adhesive, the adhesive crawls on the upper surface of the electronic component. Ascending can be eliminated, and problems such as contamination of the mounting tool due to the adhesive material adhering to the upper surface of the electronic component can be prevented.
[Brief description of the drawings]
FIG. 1 is a perspective view of an electronic component mounting board according to an embodiment of the present invention; FIG. 2 is a process explanatory view of an electronic component mounting method according to an embodiment of the present invention; FIG. FIG. 4 is a cross-sectional view of an electronic component mounting board according to an embodiment of the present invention. FIG. 4 is a cross-sectional view of an electronic component mounting board according to an embodiment of the present invention.
1, 11, 21 Board 1b, 11b, 21a Component mounting surface 1c Inclined surface 2 Circuit electrode 3 Resin adhesive 4 Electronic component 5 Metal bump 11c Step 21b Groove

Claims (9)

外部接続用電極を介して電子部品が実装される電子部品実装用の基板であって、前記電子部品が接着材により固着される実装位置と、この実装位置に形成され前記外部接続用電極が接続される回路電極と、前記実装位置の外縁部に形成され実装位置に供給された前記接着材が流下する低部とを備えたことを特徴とする電子部品実装用の基板。An electronic component mounting board on which an electronic component is mounted via an external connection electrode, wherein a mounting position where the electronic component is fixed by an adhesive, and the external connection electrode formed at the mounting position are connected. A circuit electrode to be mounted, and a lower portion formed at an outer edge portion of the mounting position and flowing down the adhesive supplied to the mounting position. 前記低部が下り勾配の傾斜面であることを特徴とする請求項１記載の電子部品実装用の基板。2. The electronic component mounting board according to claim 1, wherein the lower portion is a downward slope. 前記低部が段差部であることを特徴とする請求項１記載の電子部品実装用の基板。2. The electronic component mounting board according to claim 1, wherein the lower portion is a step. 前記低部が溝部であることを特徴とする請求項１記載の電子部品実装用の基板。2. The electronic component mounting board according to claim 1, wherein the lower portion is a groove. 外部接続用電極を介して電子部品を基板に実装する電子部品実装方法であって、回路電極が形成され外縁部に高さが低い低部が形成された実装位置に接着材を供給する接着材供給工程と、接着材が供給された実装位置に前記電子部品を前記外部接続用電極を介して搭載する部品搭載工程と、前記実装位置からはみ出した余剰の接着材を前記低部内に流下させる接着材流下工程とを含むことを特徴とする電子部品実装方法。An electronic component mounting method for mounting an electronic component on a substrate via an external connection electrode, wherein an adhesive is supplied to a mounting position where a circuit electrode is formed and a low portion having a low height is formed on an outer edge portion. A supplying step, a component mounting step of mounting the electronic component via the external connection electrode at the mounting position to which the adhesive is supplied, and an adhesive for flowing an excess adhesive overflowing from the mounting position into the lower portion. An electronic component mounting method, comprising: a material flowing down step. 外部接続用電極を介して電子部品を基板に実装する電子部品実装方法であって、回路電極が形成され外縁部に高さが低い低部が形成された実装位置に前記外部接続用電極を介して搭載する部品搭載工程と、前記電子部品の下面と実装位置の上面との間に接着材を供給する接着材供給工程と、前記実装位置からはみ出した余剰の接着材を前記低部内に流下させる接着材流下工程とを含むことを特徴とする電子部品実装方法。An electronic component mounting method for mounting an electronic component on a substrate via an external connection electrode, wherein the circuit electrode is formed and a low portion having a low height is formed at an outer edge portion of the electronic component via the external connection electrode. Component mounting step, an adhesive supply step of supplying an adhesive between a lower surface of the electronic component and an upper surface of a mounting position, and an excess adhesive overflowing from the mounting position flowing down into the lower portion. An electronic component mounting method, comprising: an adhesive flowing down step. 前記低部が下り勾配の傾斜面であることを特徴とする請求項５または６記載の電子部品実装方法。7. The electronic component mounting method according to claim 5, wherein the lower portion is a downward slope. 前記低部が段差部であることを特徴とする請求項５または６記載の電子部品実装方法。7. The electronic component mounting method according to claim 5, wherein the lower portion is a step portion. 前記低部が溝部であることを特徴とする請求項５または６記載の電子部品実装方法。The electronic component mounting method according to claim 5, wherein the lower portion is a groove.
JP2003082425A 2003-03-25 2003-03-25 Electronic component mounting board and electronic component mounting method Expired - Fee Related JP4100213B2 (en)

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JP2006163450A (en) * 2004-12-02 2006-06-22 Fujitsu Ltd Rfid tag and manufacturing method therefor
WO2008078746A1 (en) * 2006-12-26 2008-07-03 Panasonic Corporation Semiconductor element mounting structure and semiconductor element mounting method
WO2015000248A1 (en) * 2013-07-04 2015-01-08 北京京东方光电科技有限公司 Chip on glass bonding method and structure
EP3300463A1 (en) * 2016-09-26 2018-03-28 Hitachi Power Semiconductor Device, Ltd. Semiconductor device
US10022850B2 (en) 2014-07-30 2018-07-17 Daemo Engineering Co., Ltd. Stepless variable auto stroke hydraulic breaker system
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Publication number Priority date Publication date Assignee Title
JP2006163450A (en) * 2004-12-02 2006-06-22 Fujitsu Ltd Rfid tag and manufacturing method therefor
WO2008078746A1 (en) * 2006-12-26 2008-07-03 Panasonic Corporation Semiconductor element mounting structure and semiconductor element mounting method
US8110933B2 (en) 2006-12-26 2012-02-07 Panasonic Corporation Semiconductor device mounted structure and semiconductor device mounted method
JP5039058B2 (en) * 2006-12-26 2012-10-03 パナソニック株式会社 Semiconductor device mounting structure
WO2015000248A1 (en) * 2013-07-04 2015-01-08 北京京东方光电科技有限公司 Chip on glass bonding method and structure
US10022850B2 (en) 2014-07-30 2018-07-17 Daemo Engineering Co., Ltd. Stepless variable auto stroke hydraulic breaker system
EP3300463A1 (en) * 2016-09-26 2018-03-28 Hitachi Power Semiconductor Device, Ltd. Semiconductor device
WO2020079744A1 (en) * 2018-10-16 2020-04-23 株式会社Ｆｕｊｉ Circuit formation method
JPWO2020079744A1 (en) * 2018-10-16 2021-03-18 株式会社Ｆｕｊｉ Circuit formation method
JP7083039B2 (en) 2018-10-16 2022-06-09 株式会社Fuji Circuit formation method

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