JP2004276618A - 三次元物体を製造するための方法及び装置並びにそのように得られた成形体 - Google Patents
三次元物体を製造するための方法及び装置並びにそのように得られた成形体 Download PDFInfo
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- JP2004276618A JP2004276618A JP2004073386A JP2004073386A JP2004276618A JP 2004276618 A JP2004276618 A JP 2004276618A JP 2004073386 A JP2004073386 A JP 2004073386A JP 2004073386 A JP2004073386 A JP 2004073386A JP 2004276618 A JP2004276618 A JP 2004276618A
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- B33Y10/00—Processes of additive manufacturing
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Abstract
【解決手段】マイクロ波放射を吸収しないか又は劣悪に吸収するに過ぎない粉末状基質からなる層上で、サセプタを層の結合すべき領域に施与し、該サセプタがマイクロ波放射を吸収することができ、かつ吸収されたエネルギーが熱の形で該サセプタを包囲している基質上へ放出し、それにより、前記の領域内の層もしくは場合によりその下にか又はその上にある層の基質が融解又は焼結により結合されることによって、マイクロ波放射を用いて粉末状基質から三次元物体を製造する。
【選択図】図1
Description
a) 粉末状基質の層を準備する工程、
b) a)からの層の処理すべき領域に、マイクロ波を吸収する少なくとも1つのサセプタを選択的に施与する工程、その際、サセプタが施与される領域は、三次元物体の断面に従い、しかも三次元物体の断面を構成する領域にサセプタが施与されるように選択される、及び
c) 層をマイクロ波放射で少なくとも1回処理する工程、こうして、サセプタが設けられている層の領域並びに場合によりその下にある層のサセプタが設けられている領域は、融解又は焼結により互いに結合される、
を含むことにより特徴付けられる三次元物体の製造方法並びにこの方法により製造された成形体である。
・ 操作架台にか、又は場合により既に操作架台上に存在している処理されたか又は未処理の粉末状基質(2)の層に、粉末状基質を層状に施与するための可動装置、
・ 粉末状基質からなる層の選択領域にサセプタ(4)を施与するためのx,y−平面において可動性の装置(3)及び
・ 300MHz〜300GHzの範囲内のマイクロ波放射を発生させるのに適しているマイクロ波発振器(5)
を有することにより特徴付けられる。
a) 粉末状基質の層を準備する工程、
b) a)からの層の処理すべき領域に、マイクロ波を吸収する少なくとも1つのサセプタを選択的に施与する工程、その際、サセプタが施与される領域は、三次元物体の断面に従い、しかも、三次元物体の断面を構成する領域にのみサセプタが施与されるように選択され、かつ
c) マイクロ波放射で層を少なくとも1回処理する工程、こうして、サセプタが設けられている層の領域並びに場合によりその下にある層のサセプタが設けられている領域は、融解又は焼結により互いに結合される、
を含むことに傑出している。
本発明による方法を用いて、すなわち、1つ又はそれ以上の官能化層が設けられていてよい三次元物体が製造可能である。例えば、官能化、例えば全部の成形部材又はしかしまた特定の領域にのみ伝導性を設けることは、サセプタに類似して、相応する顔料又は物質を施与することによるか又はこれらの顔料を含有する粉末状物質から層を準備することにより、行われることができる。
・ 操作架台にか又は場合により操作架台上に既に存在している処理されたか又は未処理の粉末状基質の層に、粉末状基質を層状に施与するための可動装置、例えばナイフ、
・ 粉末状基質からなる層の選択領域にサセプタを施与するためのx,y−平面において可動性の装置、例えば印刷ヘッド、及び
・ 基質が、サセプタが基質に施与された領域中で、融解又は焼結により結合するようにサセプタを温めることができる、300MHz〜300GHz、好ましくは430〜6800MHzの範囲内のマイクロ波放射の発生に適しているマイクロ波発振器
を有することにより特徴付けられる。
図1により記載された装置中で、コポリアミド粉末(VESTAMELT 840、Degussa AG、Marl)からなり、80mmの外径、60mmの高さ及び1.5mmの壁厚を有するカップのモデルを製造する。サセプタとして、水40質量%、グラファイト40質量%及びイソプロパノール20質量%を含有するグラファイトを基礎とする懸濁液を使用する。装置は、約40℃の運転温度を有する。マイクロ波発振器の周波数は2450MHzである。層厚は0.15mmである。1層当たり、700Wの出力を、その都度30秒導入する。粉末のD50値は60μmである。
既に記載された装置中で、ポリアミド12粉末(EOSINT P PA 2200、EOS GmbH Electro Optical Systems、Krailling、Deutschland)からなり、160mmの長さ、10mmの幅及び4mmの高さを有する引っ張り棒を製造する。サセプタとして、エチレングリコールを使用する。装置は約160℃の運転温度を有する。マイクロ波発振器の周波数は2450MHzである。粉末層が施与された高さは、0.15mmであった。1層当たり、750Wの出力を45秒導入する。使用された粉末は55μmのd50値を有していた。
Claims (22)
- 三次元物体を製造する方法において、次の工程:
a) 粉末状基質の層を準備する工程、
b) a)からの層の処理すべき領域に、マイクロ波を吸収する少なくとも1つのサセプタを選択的に施与する工程、その際、サセプタが施与される領域は、三次元物体の断面に従い、しかも、三次元物体の断面を構成する領域にのみサセプタが施与されるように選択される、及び
c) 層をマイクロ波放射で少なくとも1回処理する工程、こうして、サセプタが設けられている層の領域並びに場合によりその下にある層のサセプタが設けられている領域は、融解又は焼結により互いに結合される、
ことを含むことを特徴とする、三次元物体の製造方法。 - 工程a)及び工程b)をその都度x回実施した後に、工程c)を実施し、ここでxは1ないし実施された工程a)及びb)の数に等しい、請求項1記載の方法。
- 工程a)を一回、引き続いて工程b)及び続いて工程a)をさらに一回実施した後に、工程c)を初めに一回実施し、引き続いて別の工程をb)、a)及びc)の順序で実施する、請求項1記載の方法。
- 三次元物体が組み立てられている全ての断面が、マトリックス中に存在しており、かつ物体の外部限界が、施与されたサセプタを有する粉末材料と未処理の粉末材料との間の境界により形成されるまで工程a)及びb)を何度も繰り返し、引き続いて工程c)を実施する、請求項1から3までのいずれか1項記載の方法。
- 工程c)を、装置の下部構造空間中で実施する、請求項4記載の方法。
- 工程c)を、工程a)及びb)を実施するための装置以外の他の装置中で実施する、請求項1から5までのいずれか1項記載の方法。
- 工程c)を、市販の調理用の電子レンジ中で実施する、請求項1から6までのいずれか1項記載の方法。
- 使用される粉末状基質が10〜150μmの平均粒度を有する、請求項1から7までのいずれか1項記載の方法。
- 430〜6800MHzの周波数範囲内のマイクロ波放射を使用する、請求項1から8までのいずれか1項記載の方法。
- サセプタとして、金属もしくは金属化合物の粉末、セラミック粉末、グラファイト又は活性炭あるいはバルクでか又は水との混合物での一価又は多価で線状、分枝鎖状又は環状の脂肪族飽和アルコール又は水単独の群から選択されるプロトン性液体を使用する、請求項1から9までのいずれか1項記載の方法。
- プロトン性液体として、グリセリン、トリメチロールプロパン、エチレングリコール、ジエチレングリコール又はブタンジオール又はその混合物をバルクでか又は水との混合物で使用する、請求項10記載の方法。
- 粉末状基質としてポリマーを使用する、請求項1から11までのいずれか1項記載の方法。
- 粉末状基質として、好ましくはポリエステル、ポリ塩化ビニル、ポリアセタール、ポリプロピレン、ポリエチレン、ポリスチレン、ポリカーボネート、PMMI、PMMA、イオノマー、ポリアミド、コポリエステル、コポリアミド、ターポリマー、ABS又はその混合物から選択されるポリマー又はコポリマーを使用する、請求項12記載の方法。
- 流動助剤0.05〜5質量%を含有する粉末状基質を使用する、請求項1から13までのいずれか1項記載の方法。
- 無機充填物を含有する粉末状基質を使用する、請求項1から14までのいずれか1項記載の方法。
- 充填物としてガラスビーズを使用する、請求項15記載の方法。
- 無機又は有機の顔料を含有する粉末状基質を使用する、請求項1から16までのいずれか1項記載の方法。
- レーザーで活性化できる添加剤を含有する粉末状基質を使用する、請求項1から17までのいずれか1項記載の方法。
- 熱作用により焼結されうるか又は融解されうる材料を有する粉末状基質として、砂、セラミック、金属及び/又は合金からなる被覆粒子又は金属粉末を使用する、請求項1から11までのいずれか1項記載の方法。
- 三次元物体を層状に製造するための装置において、装置が、
・ 操作架台にか、又は場合により既に操作架台上に存在している処理されたか又は未処理の粉末状基質の層に、粉末状基質を層状に施与するための可動装置、
・ 粉末状基質からなる層の選択領域にサセプタを施与するためのx,y−平面において可動性の装置及び
・ 300MHz〜300GHzの範囲内のマイクロ波放射を発生させるのに適しているマイクロ波発振器
を有していることを特徴とする、三次元物体を層状に製造するための装置。 - 請求項1から19までのいずれか1項記載の方法により製造された成形体。
- 成形体が、ガラスビーズ、ケイ酸類又は金属粒子から選択される充填物又はアルミニウム粒子を含有している、請求項21記載の成形体。
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DE10337707A1 (de) * | 2003-08-16 | 2005-04-07 | Degussa Ag | Verfahren zur Erhöhung des Molekulargewichts bei Polyamiden |
DE10347665A1 (de) * | 2003-10-09 | 2005-05-19 | Degussa Ag | Vernetzbare Basisschicht für Fixiereinlagen nach dem Doppelpunktverfahren |
DE10347628A1 (de) * | 2003-10-09 | 2005-05-19 | Degussa Ag | Vernetzbare Basisschicht für Fixiereinlagen nach dem Doppelpunktverfahren |
DE102004029217A1 (de) * | 2004-06-16 | 2006-01-05 | Degussa Ag | Mehrschichtfolie |
DE102004063220A1 (de) * | 2004-12-29 | 2006-07-13 | Degussa Ag | Transparente Formmassen |
DE102005007663A1 (de) * | 2005-02-19 | 2006-08-24 | Degussa Ag | Transparente, dekorierbare mehrschichtige Folie |
DE102005007664A1 (de) * | 2005-02-19 | 2006-08-31 | Degussa Ag | Transparente Formmasse |
DE102005026264A1 (de) * | 2005-06-08 | 2006-12-14 | Degussa Ag | Transparente Formmasse |
DE102005051126A1 (de) * | 2005-10-26 | 2007-05-03 | Degussa Gmbh | Folie mit Deckschicht aus einer Polyamidzusammensetzung |
DE102005053071A1 (de) * | 2005-11-04 | 2007-05-16 | Degussa | Verfahren zur Herstellung von ultrafeinen Pulvern auf Basis Polymaiden, ultrafeinen Polyamidpulver sowie deren Verwendung |
DE102005056286A1 (de) * | 2005-11-24 | 2007-05-31 | Degussa Gmbh | Schweißverfahren mittels elektromagnetischer Strahlung |
DE102007021199B4 (de) * | 2006-07-17 | 2016-02-11 | Evonik Degussa Gmbh | Zusammensetzungen aus organischem Polymer als Matrix und anorganischen Partikeln als Füllstoff, Verfahren zu deren Herstellung sowie deren Verwendung und damit hergestellte Formkörper |
-
2004
- 2004-02-19 EP EP04100652A patent/EP1459871B1/de not_active Expired - Lifetime
- 2004-03-11 CA CA002460664A patent/CA2460664A1/en not_active Abandoned
- 2004-03-12 CN CNB2004100387275A patent/CN100339208C/zh not_active Expired - Lifetime
- 2004-03-12 PL PL36619004A patent/PL366190A1/xx unknown
- 2004-03-15 JP JP2004073386A patent/JP4455107B2/ja not_active Expired - Lifetime
- 2004-03-15 US US10/799,874 patent/US7708929B2/en active Active
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JP4914341B2 (ja) * | 2004-03-16 | 2012-04-11 | エボニック デグサ ゲーエムベーハー | レーザ技術およびインキジェット法による吸収体の塗布によって3次元の対象物を製造するための方法および装置 |
JP2007529340A (ja) * | 2004-03-16 | 2007-10-25 | デグサ ゲーエムベーハー | レーザ技術およびインキジェット法による吸収体の塗布によって3次元の対象物を製造するための方法および装置 |
JP2007039631A (ja) * | 2004-12-21 | 2007-02-15 | Degussa Ag | 三次元の粉末をベースとする型を使用しない製造方法におけるポリアリーレンエーテルケトン粉末の使用およびこれから製造される成形体 |
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JP2007137065A (ja) * | 2005-11-17 | 2007-06-07 | Degussa Gmbh | 立体の構造部材の製造法およびこのように製造された成形体 |
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KR20170015321A (ko) * | 2014-06-11 | 2017-02-08 | 어플라이드 나노스트럭처드 솔루션스, 엘엘씨. | 마이크로파 복사를 이용한 3 차원 인쇄된 목적물을 처리하기 위한 방법 |
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JP2016190321A (ja) * | 2015-03-30 | 2016-11-10 | 株式会社リコー | 立体造形用粉末材料、立体造形材料セット、立体造形物製造装置、及び立体造形物の製造方法 |
JP2018043525A (ja) * | 2016-07-01 | 2018-03-22 | 宇部興産株式会社 | 熱溶解積層型3次元プリンタ用材料及びそれを用いた熱溶解積層型3次元プリンタ用フィラメント |
Also Published As
Publication number | Publication date |
---|---|
US20040232583A1 (en) | 2004-11-25 |
EP1459871A2 (de) | 2004-09-22 |
JP4455107B2 (ja) | 2010-04-21 |
EP1459871A3 (de) | 2009-08-05 |
US7708929B2 (en) | 2010-05-04 |
CN100339208C (zh) | 2007-09-26 |
PL366190A1 (en) | 2004-09-20 |
CN1532043A (zh) | 2004-09-29 |
EP1459871B1 (de) | 2011-04-06 |
CA2460664A1 (en) | 2004-09-15 |
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