JP2004253756A - Substrate mounting apparatus, carrying arm, positioning methodology of semiconductor wafer, and device and method for inspecting substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce blots of a substrate and hold it surely during rotation. <P>SOLUTION: When compressed air is supplied to an air pathway 17, a lifting plate 20 rises up and a slide strip 30 moves toward the center of a rotating table 10 by biasing force of a spring 34 and then a clamp claw 40 opens. And when a semiconductor wafer 1 is put on an inclined plane 12 of the rotating table 10 and the compressed air is discharged, the lifting plate 20 goes down and the slide strip 30 moves toward the periphery of the rotating table 10 against the biasing force of the spring 34 and the clamp claw 40 closes. A spring 36 which biases a shaft 32 toward the periphery of the rotating table 10 is put inside the slide strip 30 to generate seizing force of the clamp claw 40. When the rotating table 10 rotates, the slide strip 30 moves toward the periphery of the table 10 by the centrifugal force and the spring 36 is compressed and then the seizing force of the clamp claw 40 become large. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a substrate mounting apparatus that holds a semiconductor wafer, a glass substrate, a disk substrate (substrate), and the like in a manufacturing process of, for example, a semiconductor device, a liquid crystal display device, and a magnetic disk. The present invention relates to an apparatus for mounting a substrate.
[0002]
The present invention also relates to a transfer arm and a substrate mounting device suitable for positioning a semiconductor wafer having a notch, and a semiconductor wafer positioning method using the same.
[0003]
The present invention further relates to a board inspection apparatus and a board inspection method using the above-described board mounting apparatus.
[0004]
[Prior art]
In a manufacturing process of a semiconductor device, a liquid crystal display device, a magnetic disk, and the like, various processes are performed while a semiconductor wafer, a glass substrate, a disk substrate, and the like are held by a substrate mounting device. Substrate processing is often performed while rotating the substrate. For example, in a surface inspection for inspecting the surface of a semiconductor wafer for defects such as scratches or foreign matter, the inspection light is rotated by rotating the substrate mounting apparatus. Detects a defect or foreign matter on the surface of the semiconductor wafer while scanning the surface of the semiconductor wafer in a spiral manner.
[0005]
In the conventional substrate mounting apparatus, it is general that the back surface of the substrate is fixed by vacuum suction while being supported by a plurality of projection pins or the like. As for a disk substrate having a center hole, there is one in which an inner edge of the center hole is fixed by a chuck (Patent Document 1).
[Patent Document 1]
JP-A-6-314456
[0006]
[Problems to be solved by the invention]
In a conventional substrate mounting apparatus that performs vacuum suction, there is a possibility that dirt such as the projection pins may adhere to a portion of the rear surface of the substrate where the projection pins or the like come into contact, thereby contaminating the rear surface of the substrate. On the other hand, in the device described in Patent Document 1, since the chuck contacts only the inner edge of the center hole, the contamination is small, but it can be applied only to a substrate having a center hole such as a disk substrate.
[0007]
In order to suppress the contamination of the substrate, the area where the substrate mounting device contacts the substrate must be reduced. However, in the conventional substrate mounting apparatus, if the area in contact with the substrate is reduced, it is difficult to reliably hold the substrate when rotating.
[0008]
When rotating the substrate, the rotation of the substrate is not smooth unless the center of the substrate is aligned with the rotation axis of the substrate mounting device. For this reason, in a conventional substrate mounting apparatus that performs vacuum suction, the substrate must be positioned before the substrate is mounted on the substrate mounting apparatus, and a positioning apparatus having an XY moving mechanism is required. In addition, when positioning the substrate, there is a possibility that dirt from the positioning device may adhere to the substrate and contaminate the substrate.
[0009]
SUMMARY OF THE INVENTION It is an object of the present invention to provide a substrate mounting apparatus that can hold a substrate reliably during rotation while reducing contamination of the substrate.
[0010]
Another object of the present invention is to easily position a semiconductor wafer having a notch with low contamination.
[0011]
Another object of the present invention is to suppress contamination of the substrate during inspection.
[0012]
[Means for Solving the Problems]
A substrate mounting apparatus according to the present invention includes a rotating table having an inclined surface for supporting an outer periphery of a lower surface of a substrate, a fastening unit for fastening an outer peripheral side surface of the substrate, and an opening / closing unit for opening and closing the fastening unit. And a tightening force generating means that changes the tightening force according to the rotation of the turntable.
[0013]
Only the outer periphery of the lower surface of the substrate is in contact with the inclined surface of the turntable, and the clamping means clamps the outer peripheral side surface of the substrate, so that contamination of the substrate is small. The opening / closing means has a tightening force generating means, and the tightening force changes according to the rotation of the turntable, so that the tightening means can securely hold the substrate during rotation.
[0014]
As an example, in the substrate mounting apparatus of the present invention, the clamping force generating means is provided on the rotary table, and a movable piece movable in an outer peripheral direction of the rotary table, and is attached to the movable piece in a direction in which the outer peripheral side surface of the substrate is tightened. And an elastic body for urging the fastening means.
[0015]
The elastic body generates a tightening force of the tightening means by urging the tightening means in a direction of tightening the outer peripheral side surface of the substrate. When the turntable rotates, centrifugal force is applied to the movable piece, and the moveable piece moves toward the outer periphery of the turntable. At this time, the elastic body attached to the movable piece is compressed, and the urging force for urging the tightening means increases, and the tightening force increases. The centrifugal force applied to the movable piece increases as the rotation of the turntable increases, and the tightening force increases accordingly.
[0016]
Further, in the substrate mounting apparatus according to the present invention, the opening / closing means includes a moving means for contacting the movable piece, a first urging means for pressing the movable piece against the moving means, and a direction in which the movable piece moves in the outer circumferential direction of the turntable. Urging means for urging the moving means, and moving means in the direction in which the movable piece moves toward the center of the turntable against the urging force of the second urging means by the pressure of the compressed air. And a displacement means for displacing.
[0017]
When the compressed air is supplied, the displacement means displaces the moving means against the urging force of the second urging means, and the movable piece pressed against the moving means by the first urging means moves to the center of the turntable. In the direction, the fastening means open. When the compressed air is discharged after the substrate is mounted on the inclined surface of the turntable, the moving means returns to the original position by the urging force of the second urging means, and the movable piece moves in the outer peripheral direction of the turntable, The fastening means closes.
[0018]
The following is particularly used for a semiconductor wafer having a notch, the transfer arm of the present invention is a sloped surface supporting the outer periphery of the lower surface of the semiconductor wafer, positioning means for contacting the outer peripheral side surface of the semiconductor wafer, A first pressing means for pressing the outer peripheral side surface of the wafer to press the semiconductor wafer against the positioning means. In the method of positioning a semiconductor wafer according to the present invention, the semiconductor wafer is lifted by the transfer arm, and the semiconductor wafer is pressed against the positioning means by the first pressing means to adjust the position of the semiconductor wafer on the transfer arm. .
[0019]
The semiconductor wafer pressed against the positioning means by the first pressing means is positioned on the transfer arm such that the center is substantially constant. The semiconductor wafer does not need to be accurately positioned in advance using a positioning device as in the related art. Then, only the outer periphery of the lower surface of the semiconductor wafer comes into contact with the inclined surface of the transfer arm, and the first pressing means and the positioning means come into contact with the outer peripheral side surface of the semiconductor wafer.
[0020]
Similarly, the substrate mounting apparatus of the present invention includes a turntable having an inclined surface that supports the outer periphery of the lower surface of the semiconductor wafer, guide pins provided on the inclined surface of the turntable, and contacting the notches of the semiconductor wafer, Second pressing means for pressing the outer peripheral side surface to press the semiconductor wafer against the guide pins. Further, in the method for positioning a semiconductor wafer according to the present invention, the semiconductor wafer is mounted on the substrate mounting apparatus, and the semiconductor wafer is pressed against the guide pins by the second pressing means to adjust the position of the semiconductor wafer on the substrate mounting apparatus. Things.
[0021]
The semiconductor wafer pressed against the guide pins by the second pressing means is positioned on the substrate mounting apparatus such that the center coincides with the center (rotation axis) of the turntable. The semiconductor wafer does not need to be accurately positioned in advance using a positioning device as in the related art. Then, only the outer periphery of the lower surface of the semiconductor wafer contacts the inclined surface of the turntable, and the second pressing means contacts the outer peripheral side surface of the semiconductor wafer.
[0022]
In the substrate mounting apparatus of the present invention, further, the second pressing means has a plurality of tightening means for tightening the outer peripheral side surface of the semiconductor wafer, and reduces the tightening force of the tightening means at a position far from the guide pin to a position close to the guide pin. When the tightening force is larger than the tightening force of the second tightening means, the semiconductor wafer can be pressed against the guide pins while holding the semiconductor wafer by the plurality of tightening means, and the second pressing means and the tightening means for holding the semiconductor wafer can be shared. .
[0023]
A substrate inspection apparatus according to the present invention includes any one of the above-described substrate mounting apparatuses and a unit for optically inspecting the substrate. Further, a method for inspecting a substrate according to the present invention includes mounting the substrate on any of the above-described substrate mounting apparatuses, and inspecting the surface of the substrate mounted on the substrate mounting apparatus by an optical inspection unit. By using any one of the above-described substrate mounting apparatuses, contamination of the substrate during inspection is suppressed.
[0024]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1A is a top view of a substrate mounting apparatus according to an embodiment of the present invention, and FIG. 1B is a partial cross-sectional side view of an AA section of FIG. 1A. This embodiment shows an example of a substrate mounting apparatus for a semiconductor wafer. The substrate mounting apparatus is roughly composed of a rotary table 10 for mounting a semiconductor wafer, a plurality of clamp claws 40 for clamping the outer peripheral side surface of the semiconductor wafer, and a clamp claw opening / closing mechanism for opening and closing the clamp claw 40. I have.
[0025]
The disk-shaped rotary table 10 is mounted on a spindle 16 and is rotated by driving a motor (not shown) connected to the spindle 16. On the upper surface of the turntable 10, a plurality of concave portions 14 are provided radially at equal intervals. Providing the recess 14 reduces the mass of the turntable 10 and reduces the force required for rotation.
[0026]
On the lower surface of the turntable 10, a plurality of adjustment holes 15 are provided radially at equal intervals, as shown in FIG. By attaching / detaching a weight (not shown) to / from the adjustment hole 15, the balance of the mass of the turntable 10 can be adjusted and the rotation can be made smooth.
[0027]
In the vicinity of the outer periphery of the upper surface of the turntable 10, an inclined surface 12 that descends toward the center is provided. A guide pin 11 is attached to one position of the inclined surface 12 (the lower side in FIG. 1A). The semiconductor wafer is mounted on the inclined surface 12 such that the notch of the semiconductor wafer contacts the guide pins 11. Generally, the outer periphery of the semiconductor wafer is chamfered, and the inclined surface 12 supports the chamfered portion of the outer periphery of the lower surface of the semiconductor wafer.
[0028]
The rotary table 10 is provided with a plurality of grooves 13 radially. A clamp claw 40 is attached to each groove 13 near the outer periphery of the turntable 10. In each groove 13, a slide piece 30 constituting a clamp claw opening / closing mechanism is arranged near the center of the rotary table 10. An elevating plate 20 constituting a clamp pawl opening / closing mechanism is attached to the center of the rotary table 10.
[0029]
The spindle 16 is provided with an air passage 17 as shown in FIG. The compressed air is supplied to or exhausted from the air passage 17 using an air pump (not shown) or the like. FIG. 2A is a partial cross-sectional side view of a portion BB of FIG. 1A when compressed air is supplied, and FIG. 2B is a view of FIG. 1A when compressed air is discharged. It is a partial cross section side view of -B part.
[0030]
The slide piece 30 and the clamp claw 40 are connected by a shaft 32. The shaft 32 is slidably supported by a shaft receiver 33 fixed to the rotary table 10, and a spring 34 inserted between a retaining ring 35 (see FIG. 4) attached to the shaft 32 and the shaft receiver 33. As a result, the rotary table 10 is urged toward the center.
[0031]
When the compressed air is supplied to the air passage 17, the lifting plate 20 moves up, and the slide piece 30 moves toward the center of the turntable 10 by the urging force of the spring 34. Thereby, the clamp claws 40 are opened as shown in FIG. 2A, and the semiconductor wafer 1 is mounted on the inclined surface 12 of the turntable 10 in this state.
[0032]
When the compressed air is discharged from the air passage 17 after the semiconductor wafer 1 is mounted, the lifting plate 20 descends, and the slide piece 30 moves in the outer peripheral direction of the rotary table 10 against the urging force of the spring 34. Thereby, as shown in FIG. 2B, the clamp claws 40 are closed and come into contact with the outer peripheral side surface of the semiconductor wafer 1.
[0033]
FIG. 3A is a partial sectional side view of the clamp pawl opening / closing mechanism when compressed air is supplied, and FIG. 3B is a partial sectional side view of the clamp pawl opening / closing mechanism when compressed air is discharged. The compressed air supplied to the air passage 17 in FIG. 2A passes through the air port 23 provided in the cover 22 in FIG. A diaphragm 27 is attached to the inside of the case 21 by a retaining ring 28. Above the diaphragm 27, a bush 24 is fitted inside the case 21, and a stopper 25 is inserted into the inner periphery of the bush 24. The stopper 25 is supported by a bush 24 so as to be able to move up and down, and is urged downward by a spring 26 attached to the bush 24.
[0034]
The lifting plate 20 is attached to the upper end of the stopper 25. The elevating plate 20 has an inclined portion 20a whose diameter becomes smaller as it goes down. The roller 31 attached to the slide piece 30 is pressed against the inclined portion 20a by the urging force of the spring 34 shown in FIG. The clamp claw 40 is rotatably attached to the side surface of the groove 13 by a pin 41, and a lower portion of the clamp claw 40 is connected to the shaft 32 by a pin 42.
[0035]
When the compressed air is supplied, the diaphragm 27 raises the stopper 25 against the urging force of the spring 26 by the pressure of the compressed air, as shown in FIG. Therefore, the lift plate 20 moves up, and the slide piece 30 moves toward the center of the turntable 10. At this time, the lower portion of the clamp claw 40 is pulled toward the center of the rotary table 10 by the shaft 32, and the clamp claw 40 is rotated and opened about the pin 41.
[0036]
When the compressed air is discharged, as shown in FIG. 3B, the diaphragm 27 returns to its original position, and the stopper 25 is lowered by the urging force of the spring 26. Therefore, the elevating plate 20 descends, and the slide piece 30 moves toward the outer periphery of the turntable 10. At this time, the lower part of the clamp claw 40 is pushed toward the outer periphery of the rotary table 10 by the shaft 32, and the clamp claw 40 is rotated around the pin 41 to be in a closed state.
[0037]
FIG. 4A is a side view of the slide piece, and FIG. 4B is a partial cross-sectional side view of the CC section of FIG. 4A. A roller 31 is rotatably attached to the slide piece 30. As shown in FIG. 4B, the slide piece 30 has a through hole through which the shaft 32 passes, and a spring 36 for urging the shaft 32 in the outer peripheral direction of the rotary table 10 is inserted into the through hole. I have. The spring 36 urges the shaft 32 toward the outer periphery of the turntable 10 in a state where the clamp claw 40 is closed, and generates a clamping force of the clamp claw 40.
[0038]
According to the embodiment described above, only the chamfered portion on the outer periphery of the lower surface of the semiconductor wafer 1 comes into contact with the inclined surface 12 of the rotary table 10, and the clamp claw 40 clamps the outer peripheral surface of the semiconductor wafer 1. In addition, contamination of the semiconductor wafer 1 is small.
[0039]
When the rotary table 10 is rotated after the outer peripheral side surface of the semiconductor wafer 1 is clamped by the clamp claws 40, a centrifugal force is applied to the slide piece 30, and the slide piece 30 is in the groove 13 against the urging force of the spring 34. Is moved toward the outer periphery of the turntable 10. At this time, the spring 36 inserted into the through hole of the slide piece 30 is compressed, the urging force for urging the shaft 32 toward the outer periphery of the rotary table 10 increases, and the clamping force of the clamp claw 40 increases. The centrifugal force applied to the slide piece 30 increases as the rotation of the rotary table 10 increases, and the tightening force of the clamp claw 40 increases accordingly. Therefore, the clamp claw 40 can securely hold the semiconductor wafer 1 when the rotary table 10 rotates.
[0040]
Further, according to the embodiment described above, by adjusting the strength (spring constant) of the spring 36 that urges the shaft 32 in the outer peripheral direction of the turntable 10, the clamp claw 40 before and during rotation is adjusted. The tightening force can be adjusted. Further, by adjusting the mass of the slide piece 30 and adjusting the centrifugal force applied to the slide piece 30, the tightening force of the clamp claw 40 during rotation can be adjusted.
[0041]
In the embodiment described above, the clamp claws 40 are provided at five places in addition to the guide pins 11 that contact the notches of the semiconductor wafer. However, the clamp claws 40 may be provided in at least two places other than the guide pins 11 and at least three places when the guide pins 11 are not provided, and may be provided in more places.
[0042]
The substrate mounting apparatus according to the embodiment described above is not limited to a semiconductor wafer, and can be applied to various substrates that perform processing while rotating, such as a glass substrate of a liquid crystal display device and a disk substrate of a magnetic disk.
[0043]
Next, a transfer arm and a substrate mounting device that are particularly suitable for positioning a semiconductor wafer having a notch will be described. FIG. 5A is a top view of a transfer arm according to an embodiment of the present invention, and FIG. 5B is a partial cross-sectional side view of a DD section of FIG. 5A. The transfer arm 60 is attached to an arm base 70, and the arm base 70 is connected to a handling arm (not shown) or the like. Projections 61 and 62 for supporting the semiconductor wafer 1 are attached to the upper surface of the transfer arm 60, and the projections 61 and 62 have conical inclined surfaces. At the center of the projection 62, a positioning pin 63 is attached. As shown by broken lines in FIGS. 5A and 5B, when the transfer arm 60 lifts the semiconductor wafer 1, the chamfered portion on the outer periphery of the lower surface of the semiconductor wafer 1 is formed by the inclined surfaces of the protrusions 61 and 62. Supported.
[0044]
A pusher 72 is movably attached to the arm base 70 by a guide 71. A spring 73 is mounted between the pusher 72 and the transfer arm 60, and the pusher 72 is urged downward by the spring 73 in the drawing of FIG. As shown in FIG. 5B, a vertical portion 72a is provided on the lower surface of the pusher 72, and the rod of the air motor 75 is connected to the vertical portion 72a. By driving the air motor 75, the pusher 72 moves along the guide 71 in the upward direction in the drawing of FIG. When the pusher 72 moves along the guide 71, an opening 74 is provided in the arm base 70 so that the vertical portion 72a of the pusher 72 does not come into contact.
[0045]
FIG. 6A is a top view of a substrate mounting apparatus according to another embodiment of the present invention, and FIG. 6B is a partial cross-sectional side view of a portion EE in FIG. 6A. The difference between the substrate mounting apparatus of the present embodiment and the substrate mounting apparatus shown in FIG. 1 is that the rotary table 10 'has the notch 19, the tightening force of the clamp claws 40a, 40b, 40c and the clamp pawl 40d. , 40e are different from each other as described later. Other configurations are the same as those of the substrate mounting apparatus shown in FIG. As shown in FIGS. 6A and 6B, a plurality of notches 19 are provided at equal intervals on the outer periphery of the turntable 10 '.
[0046]
The substrate mounting apparatus of the present embodiment is used in combination with the substrate receiving table shown in FIG. The substrate receiving table is for receiving the semiconductor wafer from the transfer arm 60 and delivering it to the substrate mounting device. FIG. 7A is a top view of the substrate receiving stand, and FIG. 7B is a cross-sectional view of a portion FF in FIG. 7A. A plurality of columns 51 are attached to the substrate receiving base 50. An inclined surface 51 a facing the center of the substrate receiving base 50 is provided at the tip of each support 51. An opening 52 is provided at the center of the substrate receiving base 50.
[0047]
FIG. 8A is a top view of a substrate mounting apparatus combined with a substrate receiving table, and FIG. 8B is a partial cross-sectional side view of a GG section in FIG. 8A. As shown in FIG. 8B, the turntable 10 'is located above the substrate receiving table 50. The support column 51 attached to the substrate receiving table 50 extends through the notch 19 of the rotary table 10 'to the space above the rotary table 10'. 8A and 8B, the support 51 receives the semiconductor wafer 1 from the transfer arm 60 above the turntable 10 '. At this time, the chamfered portion of the outer periphery of the lower surface of the semiconductor wafer 1 is supported by the inclined surface 51 a of the column 51. In this embodiment, four pillars 51 are used to support four locations on the outer periphery of the lower surface of the semiconductor wafer 1, but the pillars 51 may be provided at least at three locations, and more pillars 51 may be provided. .
[0048]
On the other hand, the spindle 16 mounted below the turntable 10 ′ is inserted into an opening 52 provided in the substrate receiving table 50. An air cylinder 18 is attached to the spindle 16, and the rotary table 10 ′ moves up and down by driving the air cylinder 18. When the column 51 receives the semiconductor wafer 1 from the transfer arm 60, the turntable 10 'is in the lowered standby position, and FIG. 8B shows this state.
[0049]
Next, a method for positioning a semiconductor wafer using the transfer arm and the substrate mounting device will be described. First, the semiconductor wafer 1 is prepared in a state where the notch 1a is oriented in a certain direction. This is done, for example, by a conventional notch positioning device. The notch positioning device detects the notch of the semiconductor wafer by a detecting device including a light emitting element and a sensor while rotating the semiconductor wafer, and stops the rotation of the semiconductor wafer at a position where the notch faces in a certain direction. .
[0050]
Subsequently, in FIG. 5, the air motor 75 is driven to move the pusher 72 upward in FIG. 5A. Then, the handling arm or the like connected to the arm base 70 is driven, and the prepared semiconductor wafer 1 is lifted by the transfer arm 60 from the notch positioning device or the like. At this time, the handling arm and the like are controlled such that the notch 1a of the semiconductor wafer 1 faces the tip of the transfer arm 60 as shown by a broken line in FIG.
[0051]
Subsequently, the driving of the air motor 75 is stopped. The pusher 72 presses the outer peripheral side surface of the semiconductor wafer 1 downward in the drawing of FIG. 5A by the urging force of the spring 73, and presses the semiconductor wafer 1 against the positioning pins 63. As a result, the semiconductor wafer 1 is positioned on the transfer arm 60 such that the center is substantially constant.
[0052]
Subsequently, the handling arm or the like connected to the arm base 70 is driven to move the transfer arm 60 that has lifted the semiconductor wafer 1 above the substrate mounting apparatus. FIG. 9 is a top view showing a state where the transfer arm is located above the substrate mounting apparatus. FIG. 9 shows a state in which the semiconductor wafer 1 lifted by the transfer arm 60 is removed, and only the outline of the semiconductor wafer 1 is indicated by a broken line.
[0053]
Above the substrate mounting apparatus, the air motor 75 is driven to move the pusher 72 upward in FIG. Then, the handling arm and the like connected to the arm base 70 are driven to lower the transfer arm 60. FIG. 10A is a side view showing a state before the transfer arm is lowered, and FIG. 10B is a side view showing a state after the transfer arm is lowered. As shown in FIG. 10B, the semiconductor wafer 1 is transferred from the transfer arm 60 to the support column 51 when the transfer arm 60 is lowered. Then, the handling arm and the like are driven, and the transfer arm 60 is retracted from above the substrate mounting apparatus in a state of being lowered. The board mounting device is in the state shown in FIG.
[0054]
Subsequently, in the same manner as in FIG. 2A, compressed air is supplied to the air passage of the turntable 10 'to open the clamp claws 40a, 40b, 40c, 40d, 40e. Then, the air cylinder 18 is driven to raise the turntable 10 '. FIG. 10C is a side view showing a state after the rotary table is raised. As shown in FIG. 10 (c), the semiconductor wafer 1 is transferred from the support column 51 to the turntable 10 'by raising the turntable 10'.
[0055]
Subsequently, similarly to FIG. 2B, the compressed air is discharged from the air passage of the turntable 10 ', and the clamp claws 40a, 40b, 40c, 40d, and 40e are closed. 11A is a top view of the substrate mounting apparatus on which the substrate is mounted and the clamp claws are closed, FIG. 11B is an enlarged view around the guide pin before closing the clamp claws, and FIG. It is an enlarged view of the periphery of a guide pin after closing. Note that, in FIG. 11A, the substrate receiving table is omitted.
[0056]
As shown in FIG. 11A, the clamp claws 40a, 40b, 40c, 40d, 40e clamp the outer peripheral side surface of the semiconductor wafer 1. At this time, in the substrate mounting apparatus of the present embodiment, the clamping force of the clamp claws 40a, 40b, 40c far from the guide pin 11 is greater than the clamping force of the clamp claws 40d, 40e near the guide pin 11. . This is performed by adjusting the strength (spring constant) of the spring 36 (see FIG. 4B) inserted into the slide pieces 30a, 30b, 30c, 30d, 30e in FIG. 6A. ing.
[0057]
As shown in FIG. 11B, before the clamp claws 40a, 40b, 40c, 40d, and 40e are closed, the notch 1a of the semiconductor wafer 1 is not in contact with the guide pin 11 attached to the turntable 10 '. . When the clamp claws 40a, 40b, 40c, 40d, and 40e are closed, the clamping force of the clamp claws 40a, 40b, and 40c is larger than the clamping force of the clamp claws 40d and 40e. As shown in FIG. 11C, the notch 1a contacts the guide pin 11. As a result, the semiconductor wafer 1 is positioned such that the center coincides with the center of the turntable 10 '.
[0058]
According to the transfer arm of the embodiment shown in FIG. 5, the semiconductor wafer 1 prepared with the notch 1a facing in a fixed direction is positioned on the transfer arm 60 such that the center is substantially constant. Can be. The semiconductor wafer 1 need only be prepared with the notch oriented in a fixed direction, and it is not necessary to perform accurate positioning in advance using a positioning device as in the related art. Then, only the outer periphery of the lower surface of the semiconductor wafer 1 contacts the inclined surfaces of the projections 61 and 62 of the transfer arm 60, and the pusher 72 and the positioning pins 63 contact the outer peripheral side surface of the semiconductor wafer 1. Less is.
[0059]
According to the substrate mounting apparatus of the embodiment shown in FIG. 6, the semiconductor wafer 1 can be positioned on the substrate mounting apparatus such that the center coincides with the center (rotation axis) of the turntable 10 '. It is only necessary to position the semiconductor wafer 1 using the transfer arm 60 so that the center is substantially constant, and it is not necessary to perform accurate positioning in advance using a positioning device as in the related art. Then, only the outer periphery of the lower surface of the semiconductor wafer 1 comes into contact with the inclined surface 12 of the turntable 10 ', and the clamp claws 40a, 40b, 40c, 40d, and 40e come into contact with the outer peripheral side surface of the semiconductor wafer 1. 1. Low contamination.
[0060]
Further, according to the board mounting apparatus of the embodiment shown in FIG. 6, the tightening force of the clamp claws 40a, 40b, 40c far from the guide pin 11 is reduced by the clamp claws 40d, 40e close to the guide pin 11. By making the clamping force larger than the clamping force, the semiconductor wafer 1 can be positioned without separately providing a pressing means for pressing the semiconductor wafer 1 against the guide pins 11.
[0061]
Next, a substrate inspection apparatus and a substrate inspection method using the substrate mounting apparatus described above will be described. FIG. 12 is a plan view showing a schematic configuration of the substrate inspection apparatus according to one embodiment of the present invention. The present embodiment is an example of a foreign substance inspection apparatus, which inspects whether or not a foreign substance exists on the surface of a substrate in the manufacture of a semiconductor device, a liquid crystal display device, a magnetic disk, and the like. is there. In this embodiment, a semiconductor wafer will be described as an example of a substrate.
[0062]
The substrate inspection apparatus includes a load port 110, a transport unit 120, a notch positioning unit 130, and an inspection unit 140. A wafer cassette 100 containing a plurality of semiconductor wafers 1 is loaded into the load port 110. A plurality of semiconductor wafers 1 are stored in the wafer cassette 100 at predetermined intervals in the depth direction of the drawing. The wafer cassette 100 has a plurality of protrusions at predetermined intervals on the inner surface. In a state where the semiconductor wafer 1 is stored in the wafer cassette 100, the vicinity of the outer peripheral portion on the lower surface is supported by the projection on the inner surface of the wafer cassette 100.
[0063]
The transport unit 120 includes a transport assembly 121, and a handling arm 122 is attached to the transport assembly 121. The transport arm 60 is connected to the tip of the handling arm 122. The transport assembly 121 moves and rotates the handling arm 122 using a servomotor. The transfer arm 60 enters the lower part of the semiconductor wafer 1 accommodated in the wafer cassette 100 by driving the transfer assembly 121, and rises at a position where the center of the inner diameter of the U-shaped portion substantially coincides with the center of the semiconductor wafer 1. As a result, the semiconductor wafer 1 is lifted from the wafer cassette 100. Then, the semiconductor wafer 1 is transferred from the load port 110 to the notch positioning section 130.
[0064]
The notch positioning section 130 includes a chuck 131 and a detection device 132. The outer diameter of the chuck 131 is configured to be smaller than the inner diameter of the U-shaped portion of the transfer arm 60. The transfer arm 60 advances above the chuck 131 while lifting the semiconductor wafer 1, and lowers at a position where the center of the semiconductor wafer 1 substantially coincides with the center of the chuck 131, thereby mounting the semiconductor wafer 1 on the chuck 131. I do. The chuck 131 fixes the lower surface of the semiconductor wafer 1 by vacuum suction.
[0065]
The chuck 131 is configured to be rotatable by a motor (not shown). The detection device 132 includes a light emitting unit that generates light such as laser light and a light receiving unit including a CCD line sensor and the like, and detects the position and intensity of light generated from the light emitting unit and reaching the light receiving unit. The position of the notch of the semiconductor wafer 1 mounted on the chuck 131 is detected. While rotating the semiconductor wafer 1 by the chuck 131, the notch of the semiconductor wafer 1 is positioned by stopping the rotation of the semiconductor wafer 1 at a position where the notch faces in a certain direction based on the detection result of the detection device 132. .
[0066]
When the positioning of the notch of the semiconductor wafer 1 is completed, the chuck 131 releases the vacuum suction of the semiconductor wafer 1. The transfer arm 60 penetrates below the semiconductor wafer 1 mounted on the chuck 131 and chucks the semiconductor wafer 1 by raising the center of the inner diameter of the U-shaped portion substantially at the center of the semiconductor wafer 1. Lift from 131. Then, as described above, the transfer arm 60 positions the semiconductor wafer 1 on the transfer arm 60 so that the center is substantially constant, and then transfers the semiconductor wafer 1 from the notch positioning section 130 to the inspection section 140.
[0067]
The inspection section 140 is provided with an inspection stage 141 having a substrate mounting device. The transfer arm 60 advances above the turntable 10 'while lifting the semiconductor wafer 1, and lowers the semiconductor wafer 1 at a position where the center of the semiconductor wafer 1 is substantially coincident with the center of the turntable 10', whereby the semiconductor wafer 1 is moved. Deliver to the substrate receiving table 50. Then, after the transfer arm 60 retreats from above the substrate mounting device, the rotary table 10 ′ is raised, so that the semiconductor wafer 1 is transferred from the substrate receiving table 50 to the rotary table 10 ′. The substrate mounting apparatus closes the clamp claws and positions the semiconductor wafer 1 such that the center coincides with the center of the turntable 10 'as described above.
[0068]
The inspection stage 141 is configured to be movable in X, Y, Z, and θ directions by a servo motor (not shown). Above the inspection stage 141, a light projecting device and a light receiving device (not shown) are arranged. The light projection system irradiates a light beam such as a laser beam onto the surface of the semiconductor wafer 1 mounted on the turntable 10 ′. By moving the inspection stage 141 in the Y and X directions while rotating the semiconductor wafer 1 with the turntable 10 ′, the light beam emitted from the light projecting system causes the surface of the semiconductor wafer 1 to spiral. Scan. The light receiving system device detects reflected light or scattered light generated on the surface of the semiconductor wafer 1. The detection result of the light receiving system device is processed by an image signal processing device (not shown), whereby foreign matter present on the surface of the semiconductor wafer 1 is detected.
[0069]
FIG. 13 is a flowchart showing an outline of the manufacturing process of the semiconductor device. The manufacturing process of a semiconductor device is roughly divided into the following six processes.
(1) Design process (Step 210)
The work of designing a device, including the steps of logic design, circuit design, layout design, and test design.
(2) Mask manufacturing process (Step 220)
The operation of manufacturing a mask includes processes such as mask blank manufacturing, pattern formation, correction, and inspection.
(3) Substrate manufacturing process (Step 230)
This is an operation for manufacturing a substrate such as a semiconductor wafer, and includes the steps shown in FIG.
(4) Substrate processing step (pre-process) (step 240)
The operation of forming a chip on a substrate includes the steps shown in FIG.
(5) Assembly process (post-process) (Step 250)
The process of converting a chip on a substrate into a device, including processes such as dicing, bonding, packaging, finishing, and marking.
(6) Inspection process (Step 260)
In product inspection, product inspection, reliability test, etc. are performed.
[0070]
FIG. 14 is an example of a flowchart of a substrate manufacturing process. FIG. 15 is an example of a flowchart of a substrate processing step (previous step). The substrate inspection apparatus and the substrate inspection method of the present invention are used in an inspection in a substrate manufacturing process (Step 380) and an inspection in a substrate processing process (pre-process) (Step 490). In the inspection of the substrate, the contamination of the substrate at the time of inspection can be suppressed by using the substrate mounting apparatus of the present invention.
[0071]
【The invention's effect】
According to the present invention, only the outer periphery of the lower surface of the substrate comes into contact with the inclined surface of the turntable, and the tightening means tightens the outer peripheral side surface of the substrate. The opening / closing means has a tightening force generating means, and the tightening force changes according to the rotation of the turntable, so that the tightening means can securely hold the substrate during rotation.
[0072]
Further, according to the transfer arm and the substrate mounting apparatus of the present invention, and the semiconductor wafer positioning method using the same, the semiconductor wafer having the notch can be easily positioned with less contamination.
[0073]
Furthermore, according to the substrate inspection apparatus and the substrate inspection method of the present invention, contamination of the substrate at the time of inspection can be suppressed.
[Brief description of the drawings]
FIG. 1A is a top view of a substrate mounting apparatus according to an embodiment of the present invention, and FIG. 1B is a partial cross-sectional side view of an AA part of FIG. 1A.
FIG. 2A is a partial cross-sectional side view of a portion BB in FIG. 1A when compressed air is supplied, and FIG. 2B is a diagram when FIG. It is a partial sectional side view of BB part of a).
FIG. 3A is a partial cross-sectional side view of the clamp claw opening and closing mechanism when compressed air is supplied, and FIG. 3B is a partial cross-sectional side view of the clamp claw opening and closing mechanism when compressed air is discharged; FIG.
4 (a) is a side view of a slide piece, and FIG. 4 (b) is a partial cross-sectional side view of a CC section of FIG. 4 (a).
5A is a top view of a transfer arm according to an embodiment of the present invention, and FIG. 5B is a partial cross-sectional side view of a DD section of FIG. 5A.
6 (a) is a top view of a substrate mounting apparatus according to another embodiment of the present invention, and FIG. 6 (b) is a partial cross-sectional side view of an EE portion of FIG. 6 (a). .
7 (a) is a top view of a substrate receiving table, and FIG. 7 (b) is a cross-sectional view taken along a line FF in FIG. 7 (a).
8A is a top view of a substrate mounting apparatus combined with a substrate receiving table, and FIG. 8B is a partial cross-sectional side view of a GG portion of FIG. 8A.
FIG. 9 is a top view illustrating a state where the transfer arm is above the substrate mounting apparatus.
10A is a side view showing a state before the transfer arm is lowered, FIG. 10B is a side view showing a state after the transfer arm is lowered, and FIG. 10C is a state after the rotary table is raised. FIG.
11 (a) is a top view of the substrate mounting apparatus on which the substrate is mounted and the clamp claws are closed, FIG. 11 (b) is an enlarged view around a guide pin before the clamp claws are closed, and FIG. 11 (c). FIG. 4 is an enlarged view around the guide pin after the clamp claw is closed.
FIG. 12 is a plan view showing a schematic configuration of a substrate inspection apparatus according to an embodiment of the present invention.
FIG. 13 is a flowchart schematically showing a manufacturing process of a semiconductor device.
FIG. 14 is an example of a flowchart of a substrate manufacturing process.
FIG. 15 is an example of a flowchart of a substrate processing step (pre-step).
[Explanation of symbols]
1. Semiconductor wafer
10,10 '... rotating table
11… Guide pin
12 ... Slope
13 ... groove
14 ... recess
15 Adjustment hole
16 ... Spindle
17 ... Air passage
18 Air cylinder
19: Notch
20 ... elevating plate
21 ... Case
22 ... Cover
23 ... air vent
24 ... Bush
25 ... Stopper
26 ... Spring
27 ... Diaphragm
28 ... Retaining ring
30, 30a, 30b, 30c, 30d, 30e ... slide pieces
31 ... Roller
32 ... shaft
33 ... Shaft receiver
34 ... Spring
35 ... Retaining ring
36 ... Spring
40, 40a, 40b, 40c, 40d, 40e ... clamp claws
41, 42 ... pin
50 ... Substrate support
51 ... prop
52 ... Opening
60 ... Transfer arm
61, 62 ... projection
63 ... Positioning pin
70 ... Arm base
71… Guide
72 ... Pusher
73 ... Spring
74 ... opening
75 ... Air motor
110 ... Load port
120 ... Conveying unit
130 ... Notch positioning part
140… Inspection unit

Claims (10)

A turntable having an inclined surface that supports the outer periphery of the lower surface of the substrate,
Fastening means for fastening the outer peripheral side surface of the substrate,
Opening and closing means for opening and closing the fastening means,
The opening and closing means,
A substrate mounting apparatus comprising: a tightening force generating unit that generates a tightening force of the tightening unit and changes the tightening force according to the rotation of the turntable. The fastening force generating means includes:
A movable piece provided on the turntable and movable in an outer peripheral direction of the turntable,
2. The substrate mounting apparatus according to claim 1, further comprising: an elastic body attached to the movable piece and biasing the tightening unit in a direction of tightening an outer peripheral side surface of the substrate. The opening and closing means,
Moving means for contacting the movable piece,
First urging means for pressing the movable piece against the moving means,
Second urging means for urging the moving means in a direction in which the movable piece moves in an outer circumferential direction of the turntable;
A displacing means for displacing the moving means in a direction in which the movable piece moves toward the center of the turntable against the urging force of the second urging means by the pressure of the compressed air. The substrate mounting apparatus according to claim 2, wherein An inclined surface supporting the outer periphery of the lower surface of the semiconductor wafer,
Positioning means for contacting the outer peripheral side surface of the semiconductor wafer,
A first pressing means for pressing an outer peripheral side surface of the semiconductor wafer to press the semiconductor wafer against the positioning means. Lifting the semiconductor wafer with the transfer arm according to claim 4,
A method for positioning a semiconductor wafer, wherein the position of the semiconductor wafer on a transfer arm is adjusted by pressing the semiconductor wafer against the positioning means by the first pressing means. Turntable having an inclined surface that supports the outer periphery of the lower surface of the semiconductor wafer,
A guide pin provided on the inclined surface of the turntable and in contact with the notch of the semiconductor wafer,
A second pressing means for pressing an outer peripheral side surface of the semiconductor wafer to press the semiconductor wafer against the guide pins. The second pressing means has a plurality of tightening means for tightening the outer peripheral side surface of the semiconductor wafer,
7. The substrate mounting apparatus according to claim 6, wherein the tightening force of the tightening means at a position far from the guide pin is larger than the tightening force of the tightening means at a position near the guide pin. Mounting the semiconductor wafer on the substrate mounting apparatus according to claim 6,
A method for positioning a semiconductor wafer, wherein the position of the semiconductor wafer on a substrate mounting device is adjusted by pressing the semiconductor wafer against the guide pins by the second pressing means. A substrate mounting device according to claim 1 or 6,
Means for optically inspecting a substrate. Mounting the substrate on the substrate mounting apparatus according to any one of claims 1 or 6,
A method for inspecting a substrate, wherein the surface of the substrate mounted on the substrate mounting device is inspected by optical inspection means.

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