JP2004128244A - Substrate transferring/receiving equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide substrate transferring/receiving equipment which is capable of shortening the production unit time. <P>SOLUTION: The substrate transferring/receiving equipment is used for enabling a board mounted with electronic parts to be transferred, positioned at a prescribed position, and supported from below and carries out its function in such a manner wherein the receiving jigs 23 of the receiving units 21 and 22 are made to start ascending on the basis of the time when the substrates 7A and 7B moved by substrate transferring mechanisms 1, 2, and 3 are detected by optical sensors PH3 and PH5, and upsetting pins 24 are made to bear against the undersurfaces of the substrates 7A and 7B after the substrates 7A and 7B are stopped by a first stopper 4A and a second stopper 4B respectively. By this setup, the movement of the substrates and the ascending motion of the undersetting jigs can be carried out as they are interlocking with each other, and a substrate transferring/receiving operation is capable of shortening its production unit time. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board transfer receiving device for transferring and positioning a substrate at a predetermined position in an electronic component mounting apparatus and the like, and for receiving a lower surface of the positioned substrate.
[0002]
[Prior art]
In an electronic component mounting apparatus, a substrate to be mounted is transported by a substrate moving means such as a conveyor, and is positioned at a predetermined position such as an electronic component mounting position. Then, the positioned substrate is received by an under receiving member in order to hold the mounting surface at a predetermined mounting height. This lower receiving is performed by bringing a lower receiving member, which is arranged to be vertically movable, into contact with the lower surface of the substrate.
[0003]
[Patent Document 1]
Japanese Patent Application Laid-Open No. Hei 10-135698
[Problems to be solved by the invention]
In the above-described substrate transport / under receiving operation, the timing of the elevating operation of the under receiving member is set by detecting that the substrate moving on the conveyor has reached a stop position by a positioning stopper or the like. That is, the operation sequence is set in advance so that when the substrate is detected by the optical sensor or the like, the ascending operation of the cylinder for elevating the lower receiving member is started. For this reason, even when the board has reached the stop position, the mounting of the electronic component by the transfer head cannot be started until the lower receiving member is raised, which prevents a reduction in mounting tact time. I was
[0005]
Therefore, an object of the present invention is to provide a substrate transfer receiving device capable of reducing a tact time.
[0006]
[Means for Solving the Problems]
A substrate transport receiving device according to claim 1, wherein the substrate on which the electronic component is mounted is transported and positioned at a predetermined position, and the lower surface of the positioned substrate is supported and received by a lower receiving portion. Wherein the substrate moving means for moving the substrate, positioning means for stopping and positioning the substrate on the substrate moving means, elevating means for elevating the lower receiving portion, and moving the substrate by the substrate moving means A substrate detecting unit that detects the position before the positioning unit; and an elevating control unit that operates the elevating unit based on the timing at which the substrate is detected by the substrate detecting unit. The lifting operation of the lower receiving portion by the lifting means is performed in an overlapping manner.
[0007]
According to the present invention, there is provided a substrate detecting means for detecting a substrate being moved by the substrate moving means on the front side of the positioning means, and an elevating means for elevating the lower receiving portion based on the timing at which the substrate is detected by the substrate detecting means. An operation of raising and lowering control means is provided, and the tact time can be shortened by superposing the movement of the substrate by the substrate moving means and the raising operation of the lower receiving portion by the lifting means.
[0008]
BEST MODE FOR CARRYING OUT THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a side view of a board transfer receiving device according to one embodiment of the present invention, FIG. 2 is a block diagram of a control system of the board transfer receiving device of one embodiment of the present invention, and FIG. FIG. 4 is an explanatory diagram of a substrate transfer lower receiving operation of the embodiment.
[0009]
First, the substrate transfer lower receiving device will be described with reference to FIG. The board transfer receiving device transfers a board on which electronic components are mounted and positions the board at a predetermined position, and supports and supports the lower surface of the positioned board by a lower receiving portion.
[0010]
In FIG. 1, reference numerals 1, 2, and 3 denote substrate transport mechanisms connected in the longitudinal direction, and pulleys 5 a, 5 b are disposed on frame portions 11, 12, 13, respectively, and belt 6 is adjusted. It has a structure. Motors M1, M2, and M3 are coupled to the pulley 5b, respectively, and by driving the motors M1, M2, and M3, the substrates mounted on the belt 6 (see the substrates 7A and 7B shown in FIG. 3). Move horizontally. Therefore, the motors M1, M2, M3, the pulleys 5a, 5b, and the belt 6 constitute substrate moving means for moving the substrate.
[0011]
A first stopper 4A and a first stopper 4B are provided at the front ends of the frames 11 and 12 of the substrate transport mechanisms 1 and 2, respectively. The first stopper 4A and the second stopper 4B are respectively provided with the first stopper 4A. Is moved up and down by the stopper cylinder 4a and the second stopper cylinder 4b. The substrate advances on the belt with the first stopper 4A and the second stopper 4B protruding above the belt 6, so that the front end of the substrate comes into contact with the first stopper 4A and the second stopper 4B. . Thus, the substrate is stopped and positioned at the positions of the first stopper 4A and the second stopper 4B. Then, operations such as mounting of electronic components by the mounting head are performed on the positioned substrate. That is, the first stopper 4A and the second stopper 4B are positioning means for stopping and positioning the substrate.
[0012]
Each substrate transport mechanism is provided with optical sensors PH1 to PH5 for detecting a substrate moving on the belt 6, the substrate transport mechanism 1 has optical sensors PH1 and PH2, and the substrate transport mechanism 2 has optical sensors PH1 and PH2. The optical sensors PH3 and PH4, and the optical sensor PH5 are arranged on the substrate transport mechanism 3, respectively. The optical sensors PH1 and PH3 are used to detect a substrate stopped by the first stopper 4A and the second stopper 4B, respectively.
[0013]
The optical sensors PH2 and PH4 are used for detecting a motor speed switching timing for switching the transport speed to a low speed in order to decelerate the substrate approaching the stopper position in the substrate transport mechanisms 1 and 2. The optical sensor PH5 is used for detecting the passage of the substrate on the substrate transport mechanism 3. In the above configuration, the optical sensors PH3 and PH5 serve as substrate detecting means for detecting the substrate being moved by the substrate moving means on the near side of the positioning means as described later.
[0014]
Below the substrate transport mechanisms 1 and 2, lower receiving portions 21 and 22 are provided. Each of the lower receiving portions 21 and 22 includes a lower receiving jig 23 on which a lower receiving pin 24 is erected. The lower receiving jig 23 includes a first elevating mechanism 25 and a second elevating mechanism 26. To go up and down. When the lower receiving jig 23 is raised by the first lifting mechanism 25 and the second lifting mechanism 26, the lower receiving height at which the upper end of the lower receiving pin 24 comes into contact with the lower surface of the substrate on the belt 6 and is received. It is located in.
[0015]
Next, a configuration of a control system of the substrate transfer receiving device will be described with reference to FIG. In FIG. 2, a conveyor driving unit 31 controls a first motor M1, a second motor M2, and a third motor M3 for driving the substrate transport mechanisms 1, 2, and 3. The stopper driving section 32 drives the first stopper 4A and the second stopper 4B. The lower receiving drive unit 33 drives a first lifting mechanism 25 and a second lifting mechanism 26 that raise and lower the lower receiving jig 23. The conveyor driving unit 31, the stopper driving unit 32, and the lower receiving driving unit 33 are controlled by the transport control unit 30.
[0016]
The substrate detection unit 34 detects the presence or absence of a substrate based on signals from the optical sensors PH1 to PH5. The substrate detection result is sent to the transport control unit 30. The transport control unit 30 controls the conveyor driving unit 31, the stopper driving unit 32, and the lower receiving driving unit 33 based on the board detection result, so that various timing controls are realized in the substrate lower receiving operation.
[0017]
For example, by controlling the conveyor driving unit 31 based on the board detection result, the board to be carried is sequentially fed from the board transport mechanism 3 to the board transport mechanism 2 and the board transport mechanism 1, and the board transport speed is adjusted at a predetermined timing. Can slow down. Further, by controlling the stopper driving unit 32 based on the substrate detection result, the stop positioning operation of the substrate is controlled.
[0018]
Further, by controlling the lower receiving drive unit 33 based on the substrate detection result, the lower receiving jig 23 can be raised at an arbitrary timing during the substrate transport operation, and thereby, as described later, The raising operation of the jig 23 can be performed in a manner superimposed on the substrate transport operation, and the time required for the substrate transport positioning operation can be shortened. Therefore, the transport control unit 30 is a lifting control unit that operates the lifting unit based on the timing at which the substrate is detected by the substrate detection unit.
[0019]
The substrate transport receiving device is configured as described above. Next, the substrate transport receiving operation will be described with reference to FIG. First, as shown in FIG. 3A, the substrate 7A is placed on the substrate transport mechanism 3, and by driving the third motor M3 (FIG. 1), the substrate 7A moves on the substrate transport mechanism 3. I do. At this time, the first stopper 4A has already been raised and is in a position where it can be positioned, and the second stopper 4B is in a lowered state so as not to obstruct the passage of the substrate.
[0020]
Then, when the substrate 7A is detected by the optical sensor PH5, the driving of the second motor M2 of the substrate transport mechanism 2 is started. Thus, as shown in FIG. 3B, the substrate 7A moves onto the substrate transport mechanism 2 and further moves in the transport direction. At this time, the next substrate 7B is placed on the substrate transport mechanism 3 and starts moving in the transport direction in the same manner.
[0021]
In the movement of the substrate 7A, when the substrate 7A is detected by the optical sensor PH3 of the substrate transport mechanism 2, the first lifting / lowering mechanism 25 is driven, whereby the lower receiving jig 23 starts to rise in the lower receiving portion 21. I do. Similarly, when the substrate 7B is detected by the optical sensor PH5 of the substrate transport mechanism 3 during the movement of the substrate 7B, the second lifting mechanism 26 is driven, thereby raising the lower receiving jig 23 in the lower receiving portion 22. Starts.
[0022]
Thereafter, as shown in FIG. 3 (c), the substrate 7A is transferred to the substrate transfer mechanism 1, and the substrate 7B is transferred to the substrate transfer mechanism 2, respectively. It is rising at a predetermined rising speed. Then, after the substrate 7A passes, the second stopper 4B rises. Next, when the optical sensor PH2 detects the substrate 7A, the transport speed of the substrate transport mechanism 1 is switched to a low speed.
[0023]
Thereafter, the substrates 7A and 7B further move, and as shown in FIG. 3 (d), in the substrate transport mechanism 1, the substrate 7A comes into contact with the first stopper 4A and stops, and the optical sensor PH1 moves the substrate 7A. To detect the presence of In the mechanical transport mechanism 2, when the optical sensor PH4 detects the substrate 7B, the transport speed is switched to a low speed.
[0024]
Thereafter, as shown in FIG. 3E, the lower receiving jig 23 reaches the raised position in the lower receiving portion 21 of the substrate transport mechanism 1, and the upper end of the lower receiving pin 24 comes into contact with the lower surface of the substrate 7A. Accept. In the lower receiving portion 21 of the substrate transport mechanism 1, the substrate 7B comes into contact with the second stopper 4B and stops, and the optical sensor PH3 detects the presence of the substrate 7B. At this time, the lower receiving jig 23 is in a state immediately before reaching the ascending position. Thereafter, the substrate 7B is also received by the lower receiving pins 24.
[0025]
In the above-described board transfer lower receiving operation, a predetermined timing before the board to be transferred / received reaches the positioning stop position (in the above example, the board detection optical sensor provided in the near side board transfer mechanism is used). At the timing when the substrate is detected), by starting to raise the lower receiving jig 23, the movement of the substrate by the substrate moving means and the raising operation of the lower receiving jig provided in the lower receiving portion are overlapped. I'm trying to do it. This makes it possible to shorten the time required to complete the lower receiving of the substrate and reduce the operation tact time, as compared with the conventional substrate transport lower receiving device in which the lifting operation is started after the substrate reaches the stop position. It is possible.
[0026]
【The invention's effect】
According to the present invention, there is provided a substrate detecting means for detecting a substrate being moved by the substrate moving means on the front side of the positioning means, and an elevating means for elevating the lower receiving portion based on the timing at which the substrate is detected by the substrate detecting means. Lifting and lowering control means for operating, and the movement of the substrate by the substrate moving means and the raising operation of the lower receiving portion by the raising and lowering means are performed in an overlapping manner, so that the substrate is stopped for positioning and the lower receiving is completed. It is possible to shorten the operation tact time until the operation.
[Brief description of the drawings]
FIG. 1 is a side view of a substrate transfer receiving device according to an embodiment of the present invention; FIG. 2 is a block diagram of a control system of the substrate transfer receiving device according to an embodiment of the present invention; FIG. Explanatory drawing of one embodiment of board transfer lowering operation [Description of reference numerals]
1, 2, 3 Substrate transport mechanism 4A First stopper 4B Second stopper 6 Belts 7A, 7B Substrates 21, 22 Lower receiving part 23 Lower receiving jig 24 Lower receiving pin 30 Transport controller M1, M2, M3 Motor

Claims (1)

What is claimed is: 1. A substrate transport lower receiving device for transporting a substrate on which electronic components are mounted, positioning the substrate at a predetermined position, and supporting and receiving a lower surface of the positioned substrate by a lower receiving portion, wherein the substrate moving means moves the substrate. Positioning means for stopping and positioning the substrate on the substrate moving means, elevating means for elevating and lowering the lower receiving portion, and substrate detecting means for detecting the substrate being moved by the substrate moving means on the front side of the positioning means And elevating control means for operating the elevating means based on the timing at which the substrate is detected by the substrate detecting means, wherein the movement of the substrate by the substrate moving means and the elevating operation of the lower receiving part by the elevating means are overlapped. A substrate transfer receiving device, which is performed together.

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