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JP2004103880A - Airtight structure of ceramic package - Google Patents

Airtight structure of ceramic package Download PDF

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Publication number
JP2004103880A
JP2004103880A JP2002264710A JP2002264710A JP2004103880A JP 2004103880 A JP2004103880 A JP 2004103880A JP 2002264710 A JP2002264710 A JP 2002264710A JP 2002264710 A JP2002264710 A JP 2002264710A JP 2004103880 A JP2004103880 A JP 2004103880A
Authority
JP
Japan
Prior art keywords
metal
side wall
ceramic
plating
ceramic package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002264710A
Other languages
Japanese (ja)
Inventor
Masanori Hanzawa
半澤 正則
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Communication Equipment Co Ltd
Original Assignee
Toyo Communication Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Communication Equipment Co Ltd filed Critical Toyo Communication Equipment Co Ltd
Priority to JP2002264710A priority Critical patent/JP2004103880A/en
Publication of JP2004103880A publication Critical patent/JP2004103880A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161Cap
    • H01L2924/1615Shape
    • H01L2924/16195Flat cap [not enclosing an internal cavity]

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  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem wherein, when a metal upper cover is placed on a seaming ring fixed to an upper surface of a sidewall of a ceramic container and the container is welded to the cover by seam welding, a molten brazing material becomes fine particles which are scattered and mixed within the container. <P>SOLUTION: The seaming ring 13 having V shape or U shape grooves 12 are provided at a center of an overall periphery of an upper surface is fixed to the upper surface of the sidewall 15 of the container 11, and the ring 13 is welded to the cover 14 by the seam welding. <P>COPYRIGHT: (C)2004,JPO

Description

【0001】
【発明の属する技術分野】
本発明は、水晶振動子等のパッケージの構造に関し、特にセラミックパッケージの気密構造に関する。
【0002】
【従来の技術】
従来より、携帯電話等に使用される水晶振動子等、そのパッケージ内部に部品を収容して気密封止するセラミック容器の小型デバイスには、そのセラミック容器に金属製の上蓋を溶接する手段として、シームリングを用いて溶接するシーム溶接や、ラミック容器に金属メッキを施して溶接するレーザ溶接等の方法が用いられている。
図3は、従来の水晶振動子等に用いられるセラミックパッケージの気密構造の一例を示す図で、(a)は上蓋を開放した外形斜視図、(b)は側面断面図である。同図に示されるように、本パッケージ30(上蓋を開いて図示)は上方が開放されたセラミック容器31内に水晶振動素子等の部品(図示しない)を装着して上方からコバール等の金属上蓋32で蓋をして密封するものである。
そして、前記セラミック容器31を密封する際は、該セラミック容器31の側壁33上面に固定したシームリング34の上に前記金属上蓋32を載せ、シーム溶接によって前記シームリング34を溶融してセラミック容器31と金属上蓋32とを溶着するものである。
【0003】
また、図4は、従来の水晶振動子等に用いられるセラミックパッケージの気密構造の他の例を示す図で、(a)は上蓋を開放した外形斜視図、(b)は側面断面図である。同図に示されるように、本パッケージ40(上蓋を開いて図示)は上方が開放されたセラミック容器41内に水晶振動素子等の部品(図示しない)を装着して上方からコバール等の金属上蓋42で蓋して密封するものである。
前記セラミック容器41側壁43上面にはタングステン(W)等のめっき44が施され、また、前記金属上蓋42下面には銀(Ag)等のろう材45が圧着されており、前記セラミック容器41を密封する際は、容器41側壁43の上面に前記金属上蓋42を載置し、レーザ溶接によって前記側壁43上面に接する部分のろう材45を溶融して前記セラミックの容器41と金属上蓋42とを溶着するものである。
【0004】
【発明が解決しようとする課題】
しかしながら、前述の図3(a)、(b)においてシームリング34をシーム溶接等によって溶融すると、あるいは、図4において側壁43上面のめっき44部に接する部分の金属上蓋42のろう材45をレーザ溶接によって溶融すると、溶融したろう材金属が微粒となってセラミック容器31、41内に飛散混入し、容器内に収容した部品等に直接付着して障害を与えるという問題がある。さらに、また、当初は不具合を起こさないが製品として使用中に飛散した微粒の金属が移動して製品の性能を劣化させる可能性があるという問題がある。
上記の溶融したろう材金属がセラミック容器内に飛散混入する不具合の防止策として、金属上蓋に改良を加え、図5の改良型金属上蓋の断面図に示されるように、セラミック容器31のシームリング34と接する部分に段差35を設けた段差付きの金属蓋36が考案されているが、この手段は溶融金属が直接容器内の部品等に付着するおそれは低減するが、容器内部への混入を完全に防止するものではない。
本発明は、上記課題を解決するためになされたものであって、上蓋溶接時に溶融金属が容器内に飛散混入することを防止できる構造のセラミックパッケージの構造を提供することを目的とする。
【0005】
【課題を解決するための手段】
上記課題を解決するため、請求項1の発明においては、上面に形成した凹部内に部品を収容し、該凹部を囲む側壁上面と金属蓋との間に全周に亘って配置したシームリングを介して前記凹部を気密封止する構造のセラミックパッケージであって、前記シームリングの上面全周に亘って中央に溝を設けたことを特徴とする。
また、請求項2の発明においては、上面に形成した凹部内に部品を収容し、該凹部を囲む側壁上面の内側寄り及び外側寄りに前記側壁の全周に亘ってそれぞれ帯状のめっき処理部分を備え、前記外側のめっき処理部分と金属蓋とをろう材を介して気密封止したことを特徴とする。
さらにまた、請求項3の発明においては、請求項2発明のセラミックパッケージであって、前記内側の帯状めっきを外側のめっき処理と同一の厚みのアルミナコーティングに置換したことを特徴とする。
【0006】
【発明の実施の形態】
以下、本発明を図面に示した実施の形態に基づいて詳細に説明する。
図1は、本発明に係わるセラミックパッケージの気密構造の実施の一形態例を示す図で、(a)は上蓋を開放した外形斜視図、(b)は側面断面図である。
同図に示されるように、本パッケージ10(上蓋を開いて図示)は、上方が開放されたセラミック容器11、溝12が設けられたシームリング13、コバール等の金属上蓋14で構成される。そして、例えば、本パッケージが水晶振動子パッケージの場合、前記セラミック容器11内底面に水晶振動素子(図示しない)を装着し、該セラミック容器11の側壁15の上面に載置した前記シームリング13上方からコバール等の金属上蓋14で蓋をして、シーム溶接によって前記シームリング13で密封するものである。
【0007】
本発明の特徴は、同図に示されるように、前記セラミック容器11の側壁15上面に載置した前記シームリング13上面中央全周に亘って、断面形状が略V字または略U字状の溝12を設けたことである。
そして、例えば、断面が0.3×0.3(mm)のシームリングであって、その上面全周に亘って開口部の幅0.05mm、深さ0.05mmのV字溝12を設けたシームリング13に前記金属上蓋14を載せ、シーム溶接によって前記シームリング13を溶融して前記セラミック容器11と金属上蓋14とを溶着した場合、溶融した金属は、前記V字溝12の部分に集まり、溶融した金属がセラミック容器11内へ飛散混入することが防止されたことが確認された。
【0008】
図2は、本発明に係わるセラミックパッケージの気密構造の実施の他の一形態例を示す図で、(a)は上蓋を開放した外形斜視図、(b)は側面断面図である。
同図に示されるように、本パッケージ20(上蓋を開いて図示)は、上方が開放され、側壁21の上面に二重の帯状めっきが施されたセラミック容器22、コバール等の金属上蓋23で構成される。そして、例えば、本パッケージが水晶振動子パッケージの場合、前記セラミック容器22内底面に水晶振動素子(図示しない)を装着し、該セラミック容器22の側壁21上面を、例えば、銀(Ag)のろう材24が圧着されたコバール等の金属上蓋23で蓋をして、レーザ溶接等によって密封するものである。
【0009】
本発明の特徴は、同図に示されるように、セラミック容器22の側壁21上面全周に亘って、外側のめっき25と内側のめっき26に分離した帯状の、例えばタングステン(W)のめっき処理が施されていることである。そして、前記側壁21上に前記金属上蓋23を載せ、レーザ溶接によって外側のめっき25に接する部分の前記金属上蓋23のろう材24を溶融して前記セラミック容器22と金属上蓋23とを溶着するものである。
前記セラミック容器22側壁21上面のめっき処理を上記のように分離した帯状の構造にすることによって、レーザ溶接で前記外側のめっき25の部分の溶接を行った際、溶融した前記金属上蓋23のろう材24は内側のめっき26で堰き止められて前記セラミック容器11内へ飛散混入することが防止される。
【0010】
また、図2のセラミック容器22側壁21上面の内側のめっき26を、外側めっき25と同一の厚みのアルミナコーティングに変更することも有効な手段である。即ち、既に知られているように、該アルミナコーティングが他の金属との金属間結合が起こりにくい特性をもつことから、溶融した外側のめっき25の部分のろう材24が該アルミナコーティングで堰き止められる効果が得られるので、前記セラミック容器22内へ溶融したろう材の微粒が飛散混入することを防止できる。
なお、内側のめっき26をアルミナコーティングに変更した場合には、外側のめっき25上面にろう材を圧着することによって、前記金属上蓋23下面のろう材24を省くことができる。
【0011】
【発明の効果】
本発明のセラミックパッケージは、シームリングを用いてシーム溶接によってセラミック容器側壁上面と金属上蓋とを溶接する場合は、シームリング上面中央に溝を設けたので、溶融したろう材は溝の部分集まる。また、ろう材を塗布した金属上蓋とセラミック容器側壁上面に施された金属めっきとをレーザ溶接によって溶接する場合は、側壁上面の金属めっきを内側と外側の離れた帯状のめっき処理として、外側のめっき部分を溶接するようにしたので、溶融したろう材は内外側のめっき部分で堰き止められて、溶融したろう材の微粒がセラミック容器の内部に飛散混入することを防止することができる。
そのため、本発明の気密構造によれば、セラミックパッケージの密封作業の信頼性が向上し、また、製品として使用中の、容器内に飛散混入した微粒ろう材による事故の発生を低減することができ、高い信頼性をもつ、小型セラミックパッケージ部品を提供する上で大いに貢献できる。
【図面の簡単な説明】
【図1】本発明に係わるセラミックパッケージの気密構造の実施の一形態例を示す図で、(a)は、上蓋を開放した外形斜視図、(b)は、側面断面図。
【図2】本発明に係わるセラミックパッケージの気密構造の実施の他の一形態例を示す図で、(a)は、上蓋を開放した外形斜視図、(b)は、側面断面図。
【図3】従来の水晶振動子等に用いられるセラミックパッケージの気密構造の一例を示す図で、(a)は、上蓋を開放した外形斜視図、(b)は側面断面図。
【図4】従来の水晶振動子等に用いられるセラミックパッケージの気密構造の他の例を示す図で、(a)は、上蓋を開放した外形斜視図、(b)は側面断面図。
【図5】従来のセラミックパッケージの改良型金属上蓋の断面図。
【符号の説明】
10・・セラミックパッケージ、 11・・セラミック容器、  12・・溝、13・・シームリング、          14・・金属上蓋、        15・・側壁、
20・・セラミックパッケージ、 21・・側壁、  22・・セラミック容器、
23・・金属上蓋、      24・・ろう材、        25・・外側のめっき、
26・・内側のめっき、
30・・セラミックパッケージ、31・・セラミック容器、32・・金属上蓋、
33・・側壁、  34・・シームリング、  35・・段差、36・・金属上蓋、
40・・セラミックパッケージ、41・・セラミック容器、42・・金属上蓋、
43・・側壁、  44・・めっき、  45・・ろう材、
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a structure of a package such as a quartz oscillator, and more particularly to a hermetic structure of a ceramic package.
[0002]
[Prior art]
Conventionally, small devices such as quartz oscillators used in mobile phones and the like, which house components inside the package and hermetically seal them, include means for welding a metal top lid to the ceramic container. A method such as seam welding in which welding is performed using a seam ring, and laser welding in which a metal plate is plated with metal and welded is used.
3A and 3B are views showing an example of a hermetic structure of a ceramic package used for a conventional crystal unit or the like. FIG. 3A is an external perspective view in which an upper lid is opened, and FIG. 3B is a side sectional view. As shown in the figure, a package (not shown) such as a quartz vibrating element is mounted in a ceramic container 31 having an open top and a metal cover such as Kovar from above. At 32, the lid is sealed.
When the ceramic container 31 is sealed, the metal upper lid 32 is placed on a seam ring 34 fixed to the upper surface of the side wall 33 of the ceramic container 31, and the seam ring 34 is melted by seam welding to form the ceramic container 31. And the metal upper lid 32 are welded.
[0003]
4A and 4B are diagrams showing another example of the hermetic structure of a ceramic package used for a conventional crystal unit or the like. FIG. 4A is an external perspective view with an upper lid opened, and FIG. 4B is a side sectional view. . As shown in the figure, the package 40 (opening the upper lid shown) mounts a component (not shown) such as a quartz vibrating element in a ceramic container 41 having an open upper side and a metal upper lid such as Kovar from above. The lid is sealed with 42.
Plating 44 such as tungsten (W) is applied to the upper surface of the side wall 43 of the ceramic container 41, and a brazing material 45 such as silver (Ag) is pressed to the lower surface of the metal upper cover 42. At the time of sealing, the metal upper lid 42 is placed on the upper surface of the side wall 43 of the container 41, and the brazing material 45 in a portion in contact with the upper surface of the side wall 43 is melted by laser welding to separate the ceramic container 41 and the metal upper lid 42. Weld.
[0004]
[Problems to be solved by the invention]
However, when the seam ring 34 is melted by seam welding or the like in FIGS. 3 (a) and 3 (b), or the brazing material 45 of the metal upper lid 42 at the portion in contact with the plating 44 on the upper surface of the side wall 43 in FIG. When melted by welding, there is a problem that the molten brazing metal becomes fine particles and scatters into the ceramic containers 31 and 41 and directly adheres to components and the like accommodated in the containers, causing a problem. In addition, there is a problem that fine metal which does not cause a problem at first but is scattered during use as a product may move and deteriorate the performance of the product.
As a measure to prevent the above-mentioned problem that the molten brazing metal is scattered and mixed into the ceramic container, an improvement is made to the metal cover, and as shown in the sectional view of the improved metal cover in FIG. Although a stepped metal lid 36 having a step 35 at a portion in contact with 34 has been devised, this means reduces the possibility that the molten metal adheres directly to parts and the like in the container. It does not completely prevent it.
The present invention has been made to solve the above-described problem, and has as its object to provide a structure of a ceramic package having a structure capable of preventing molten metal from being scattered and mixed into a container during welding of an upper lid.
[0005]
[Means for Solving the Problems]
In order to solve the above problems, in the invention of claim 1, a part is accommodated in a concave portion formed on the upper surface, and a seam ring arranged over the entire periphery between the upper surface of the side wall surrounding the concave portion and the metal lid is provided. A ceramic package having a structure in which the recess is hermetically sealed with a groove provided in the center over the entire periphery of the upper surface of the seam ring.
According to the second aspect of the present invention, the components are accommodated in the concave portion formed on the upper surface, and the strip-shaped plating portions are respectively formed over the entire periphery of the side wall near the inner side and the outer side of the upper surface of the side wall surrounding the concave portion. Wherein the outer plated portion and the metal lid are hermetically sealed via a brazing material.
Still further, according to a third aspect of the present invention, there is provided the ceramic package according to the second aspect of the present invention, wherein the inner strip plating is replaced with an alumina coating having the same thickness as the outer plating.
[0006]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, the present invention will be described in detail based on an embodiment shown in the drawings.
FIGS. 1A and 1B show an embodiment of an airtight structure of a ceramic package according to the present invention. FIG. 1A is an external perspective view with an upper lid opened, and FIG. 1B is a side sectional view.
As shown in FIG. 1, the package 10 (shown with an upper lid opened) includes a ceramic container 11 having an open top, a seam ring 13 provided with a groove 12, and a metal upper lid 14 such as Kovar. For example, when the package is a crystal resonator package, a crystal resonator (not shown) is mounted on the inner bottom surface of the ceramic container 11, and the seam ring 13 is mounted on the upper surface of the side wall 15 of the ceramic container 11. The cover is covered with a metal upper cover 14 such as Kovar, and is sealed with the seam ring 13 by seam welding.
[0007]
The feature of the present invention is that, as shown in the figure, the cross-sectional shape is substantially V-shaped or substantially U-shaped over the entire circumference of the center of the upper surface of the seam ring 13 placed on the upper surface of the side wall 15 of the ceramic container 11. That is, the groove 12 is provided.
For example, a V-shaped groove 12 having a cross section of 0.3 × 0.3 (mm) and a width of 0.05 mm and a depth of 0.05 mm is provided over the entire upper surface thereof. When the metal upper lid 14 is placed on the seam ring 13, and the seam ring 13 is melted by seam welding to weld the ceramic container 11 and the metal upper lid 14, the molten metal is applied to the V-shaped groove 12. It was confirmed that the collected and molten metal was prevented from scattering and mixing into the ceramic container 11.
[0008]
2A and 2B are views showing another embodiment of the hermetic structure of the ceramic package according to the present invention, wherein FIG. 2A is an external perspective view with an upper lid opened, and FIG. 2B is a side sectional view.
As shown in the figure, the package 20 (shown with the top lid open) is opened at the top, and is provided with a ceramic container 22 having a double band-shaped plating on the upper surface of the side wall 21 and a metal top lid 23 such as Kovar. Be composed. For example, when the package is a crystal resonator package, a crystal resonator (not shown) is mounted on the inner bottom surface of the ceramic container 22, and the upper surface of the side wall 21 of the ceramic container 22 is made of, for example, silver (Ag) solder. The material 24 is covered with a metal top cover 23 such as Kovar to which the material 24 is crimped, and sealed by laser welding or the like.
[0009]
The feature of the present invention is that, as shown in the figure, a strip-shaped plating process of, for example, tungsten (W), which is separated into an outer plating 25 and an inner plating 26 over the entire periphery of the upper surface of the side wall 21 of the ceramic container 22. It is that has been given. Then, the metal upper lid 23 is placed on the side wall 21, and the brazing material 24 of the metal upper lid 23, which is in contact with the outer plating 25, is fused by laser welding to weld the ceramic container 22 and the metal upper lid 23. It is.
By making the plating process on the upper surface of the side wall 21 of the ceramic container 22 into a band-like structure separated as described above, when the outer plating 25 is welded by laser welding, the molten metal upper cover 23 is soldered. The material 24 is blocked by the inner plating 26 and is prevented from being scattered and mixed into the ceramic container 11.
[0010]
It is also an effective means to change the inner plating 26 on the upper surface of the side wall 21 of the ceramic container 22 in FIG. 2 to an alumina coating having the same thickness as the outer plating 25. That is, as already known, since the alumina coating has a property that intermetallic bonding with other metals is unlikely to occur, the brazing material 24 of the molten outer plating 25 is blocked by the alumina coating. Therefore, it is possible to prevent the fine particles of the brazing filler metal from being scattered and mixed into the ceramic container 22.
When the inner plating 26 is changed to the alumina coating, the brazing material 24 on the lower surface of the metal upper lid 23 can be omitted by pressing the brazing material on the upper surface of the outer plating 25.
[0011]
【The invention's effect】
In the ceramic package of the present invention, when the upper surface of the side wall of the ceramic container and the metal lid are welded to each other by seam welding using a seam ring, a groove is provided at the center of the upper surface of the seam ring. Further, when welding the metal upper lid coated with the brazing material and the metal plating applied to the upper surface of the side wall of the ceramic container by laser welding, the metal plating on the upper surface of the side wall is treated as a strip-shaped plating process separated from the inner side to the outer side, and the outer side is plated. Since the plated portion is welded, the molten brazing material is blocked by the inner and outer plating portions, and it is possible to prevent fine particles of the molten brazing material from scattering and mixing into the inside of the ceramic container.
Therefore, according to the airtight structure of the present invention, the reliability of the sealing operation of the ceramic package is improved, and the occurrence of accidents due to fine brazing material scattered and mixed in the container during use as a product can be reduced. It can greatly contribute to providing small ceramic package parts having high reliability.
[Brief description of the drawings]
FIG. 1 is a view showing an embodiment of an airtight structure of a ceramic package according to the present invention, wherein (a) is an external perspective view with an upper lid opened, and (b) is a side sectional view.
FIGS. 2A and 2B are views showing another embodiment of the hermetic structure of the ceramic package according to the present invention, wherein FIG. 2A is an external perspective view with an upper lid opened, and FIG.
3A and 3B are diagrams showing an example of a hermetic structure of a ceramic package used for a conventional crystal unit or the like, wherein FIG. 3A is an external perspective view in which an upper lid is opened, and FIG.
4A and 4B are diagrams showing another example of the hermetic structure of a ceramic package used for a conventional crystal unit or the like, wherein FIG. 4A is an external perspective view in which an upper lid is opened, and FIG.
FIG. 5 is a cross-sectional view of an improved metal cover of a conventional ceramic package.
[Explanation of symbols]
10. Ceramic package, 11. Ceramic container, 12. Groove, 13. Seam ring, 14. Metal cover, 15. Side wall,
20 .. ceramic package, 21 .. side wall, 22 .. ceramic container,
23..Metal cover, 24..Braze, 25..Outer plating,
26 ... Plating inside,
30 · · · ceramic package, 31 · · · ceramic container, 32 · · · metal lid,
33 side wall, 34 seam ring, 35 steps, 36 metal lid,
40 ceramic package, 41 ceramic container, 42 metal lid,
43 ・ ・ side wall, 44 ・ ・ plating, 45 ・ ・ brazing material,

Claims (3)

上面に形成した凹部内に部品を収容し、該凹部を囲む側壁上面と金属蓋との間に全周に亘って配置したシームリングを介して前記凹部を気密封止する構造のセラミックパッケージであって、
前記シームリングの上面全周に亘って中央に溝を設けたことを特徴とするセラミックパッケージの気密構造。
A ceramic package having a structure in which components are accommodated in a concave portion formed on the upper surface, and the concave portion is hermetically sealed via a seam ring disposed over the entire periphery between the upper surface of the side wall surrounding the concave portion and the metal lid. hand,
An airtight structure for a ceramic package, wherein a groove is provided at the center over the entire periphery of the upper surface of the seam ring.
上面に形成した凹部内に部品を収容し、該凹部を囲む側壁上面の内側寄り及び外側寄りに前記側壁の全周に亘ってそれぞれ帯状のめっき処理部分を備え、前記外側のめっき処理部分と金属蓋とをろう材を介して気密封止したことを特徴とするセラミックパッケージの気密構造。A component is accommodated in a concave portion formed on the upper surface, and a strip-shaped plating portion is provided around the entire periphery of the side wall on the inner side and the outer side of the upper surface of the side wall surrounding the concave portion. An airtight structure for a ceramic package, wherein a lid and an airtight seal are provided via a brazing material. 前記内側の帯状めっきを外側のめっき処理と同一の厚みのアルミナコーティングに置換したことを特徴とする請求項2記載のセラミックパッケージの気密構造。3. The hermetic structure of a ceramic package according to claim 2, wherein said inner strip plating is replaced with an alumina coating having the same thickness as the outer plating.
JP2002264710A 2002-09-10 2002-09-10 Airtight structure of ceramic package Pending JP2004103880A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019140281A (en) * 2018-02-13 2019-08-22 スタンレー電気株式会社 Light source package and manufacturing method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019140281A (en) * 2018-02-13 2019-08-22 スタンレー電気株式会社 Light source package and manufacturing method thereof
JP7107692B2 (en) 2018-02-13 2022-07-27 スタンレー電気株式会社 Light source package and light source package manufacturing method

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