JP2004158601A

JP2004158601A - Electronic component for surface mounting, and method of manufacturing same

Info

Publication number: JP2004158601A
Application number: JP2002322253A
Authority: JP
Inventors: Taiji Kinoshita; 泰治木下; Seiji Hoshitoku; 聖治星徳
Original assignee: Matsushita Electric Industrial Co Ltd
Current assignee: Panasonic Holdings Corp
Priority date: 2002-11-06
Filing date: 2002-11-06
Publication date: 2004-06-03

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component for surface mounting having the folding strength resistive to breakdown to occur when stress is applied thereto in the manufacturing process or after the manufacturing thereof, and also to provide a method of manufacturing the same electronic component. <P>SOLUTION: A plurality of recesses 12, which do not reach the lower surface from the upper surface in the thickness direction of a substrate 11, are provided at the end faces which are provided oppositely of the substrate 11 as an electronic component body. Moreover, a resistor 13 as a function element is provided between the recesses 12 provided oppositely. In addition, an external electrode 17 connected to the resistor 13 is also provided to include the recesses 12. <P>COPYRIGHT: (C)2004,JPO

Description

【０００１】
【発明の属する技術分野】
本発明は各種電子機器に使用される面実装用電子部品およびその製造方法に関するものである。
【０００２】
【従来の技術】
従来のこの種の面実装用電子部品は、図１５，図１６に示すように構成されていた。すなわち、相対向する端面に複数個の上面から下面に貫通する切込み部２を設けた基板１の上面に、両端面の相対向する切込み部２にまたがるように抵抗などの機能素子３を形成し、かつこの機能素子３は切込み部２を含むように基板１の上面、側面、下面間にあらかじめ形成された外部電極４と電気的に接続され、そして前記機能素子３上に保護膜５を形成することにより構成されていた。
【０００３】
なお、この出願に関連する先行技術文献情報としては、例えば、特許文献１が知られている。
【０００４】
【特許文献１】
特開平５−３３５１１７号公報
【０００５】
【発明が解決しようとする課題】
しかしながら、上記従来の構成においては、数多くの切込み部２が基板１の上面から下面に貫通する形で存在するため、その製造工程中や完成品後の回路基板への実装時などに応力が加えられると、切込み部２をベースとして簡単に破損してしまうという課題を有するものであった。特に応力として抗折力が加えられた場合に破損する可能性が高いものとなっていた。
【０００６】
本発明は上記従来の課題を解決するもので、製造過程や完成品後に応力が加えられても破損しない抗折強度の優れた面実装用電子部品およびその製造方法を提供することを目的とするものである。
【０００７】
【課題を解決するための手段】
上記目的を達成するために、本発明は以下の構成を有するものである。
【０００８】
本発明の請求項１に記載の発明は、電子部品本体の相対向する端面に電子部品本体の厚さ方向に上面から下面に貫通しない複数の凹部を設け、かつこの相対向する凹部間に機能素子を設け、さらに前記凹部を含むように前記機能素子と接続される外部電極を設けたもので、この構成によれば、電子部品本体の相対向する端面に設けられる凹部が、電子部品本体の厚さ方向に上面から下面に貫通していないため、多少の抗折力を受けても破損するようなことはなくなり、その結果、製造過程や完成品後に応力が加えられても破損しない抗折強度の優れた面実装用電子部品を実現できるという作用効果が得られるものである。
【０００９】
本発明の請求項２に記載の発明は、特に、凹部の形状を、半円形状、四角形状、三角形状、多角形状、半星形状、蟻溝形状のいずれかから構成したもので、この構成によれば、必要に応じて任意の凹部の形状を採用することができるという作用効果が得られるものである。
【００１０】
本発明の請求項３に記載の発明は、特に、凹部の壁面を粗面化したもので、この構成によれば、凹部の壁面を粗面化しているため、凹部の壁面に外部電極を形成した場合における外部電極の凹部への結合強度は向上することになり、その結果、回路基板などへの実装後に外力が加えられても外部電極の剥がれは発生しないという作用効果が得られるものである。
【００１１】
本発明の請求項４に記載の発明は、特に、凹部の深さを電子部品本体の厚さの２／３以下で、かつ０．１ｍｍ以上としたもので、この構成によれば、凹部の深さを電子部品本体の２／３以下で、かつ０．１ｍｍ以上としているため、この条件を満たすことによって十分な抗折強度が保てるという作用効果が得られるものである。
【００１２】
本発明の請求項５に記載の発明は、特に、機能素子を、抵抗、インダクタ、コンデンサ、サーミスタ、バリスタのいずれかから構成したもので、この構成によれば、任意の機能素子を選択することができるという作用効果が得られるものである。
【００１３】
本発明の請求項６に記載の発明は、特に、機能素子を、抵抗、インダクタ、コンデンサ、サーミスタ、バリスタのうち、異なるものを２つ以上組合せて構成したもので、この構成によれば、同じ構成で種々の複合部品を実現することができるという作用効果が得られるものである。
【００１４】
本発明の請求項７に記載の発明は、特に、電子部品本体に形成される外部電極の色と、回路基板に面実装する際の接続体の色を異ならせたもので、この構成によれば、面実装したときの実装状態がより確実に認識できるという作用効果が得られるものである。
【００１５】
本発明の請求項８に記載の発明は、絶縁体、誘電体あるいは磁性体からなる基板に一定ピッチ毎に縦横に上面から基板の厚さ方向の途中まで凹部を形成し、かつこの基板の凹部間にまたがるように機能素子を形成し、その後、前記凹部を含むように外部電極を形成し、さらに少なくとも前記機能素子を含むように保護膜を形成し、その後、前記凹部を２分するように切断したもので、この製造方法によれば、抗折強度の優れた面実装用電子部品を効率的に生産することができるという作用効果が得られるものである。
【００１６】
本発明の請求項９に記載の発明は、あらかじめ機能素子を内蔵した電子部品本体を形成し、この電子部品本体に一定ピッチ毎に縦横に上面から電子部品本体の厚さ方向の途中まででしかも内部の機能素子の端部が露出するように凹部を形成し、かつこの凹部を形成した部分に凹部を含むように外部電極を形成し、その後、前記凹部を２分するように切断したもので、この製造方法によれば、あらかじめ機能素子を内蔵したものにおいても、抗折強度の優れた面実装用電子部品を効率的に生産することができるという作用効果が得られるものである。
【００１７】
本発明の請求項１０に記載の発明は、あらかじめ部分的に機能素子を内蔵した電子部品本体を形成し、この電子部品本体に一定ピッチ毎に縦横に上面から電子部品本体の厚さ方向の途中まででしかも内部の機能素子の端部が露出するように凹部を形成し、かつ前記電子部品本体の上面に他の機能素子を凹部間にまたがるように形成し、その後、前記凹部を含むように外部電極を形成し、さらに少なくとも前記電子部品本体の上面に形成した他の機能素子を含むように保護膜を形成し、その後、前記凹部を２分するように切断したもので、この製造方法によれば、複合部品においても、抗折強度の優れたものを効率的に生産することができるという作用効果が得られるものである。
【００１８】
本発明の請求項１１に記載の発明は、特に、請求項８記載の面実装用電子部品の製造方法において、凹部を、レーザー加工、ドリル加工、プレス加工、サンドブラスト加工、エッチング加工のいずれかの加工法、または複数の加工法で形成するようにしたもので、この製造方法によれば、面実装用電子部品の形状や大きさによって任意のものを選択することにより、高精度の凹部を形成することができるという作用効果が得られるものである。
【００１９】
本発明の請求項１２に記載の発明は、特に、請求項９記載の面実装用電子部品の製造方法において、凹部を、レーザー加工、ドリル加工、プレス加工、サンドブラスト加工、エッチング加工のいずれかの加工法、または複数の加工法で形成するようにしたもので、この製造方法によれば、面実装用電子部品の形状や大きさによって任意のものを選択することにより、高精度の凹部を形成することができるという作用効果が得られるものである。
【００２０】
本発明の請求項１３に記載の発明は、特に、請求項１０記載の面実装用電子部品の製造方法において、凹部を、レーザー加工、ドリル加工、プレス加工、サンドブラスト加工、エッチング加工のいずれかの加工法、または複数の加工法で形成するようにしたもので、この製造方法によれば、面実装用電子部品の形状や大きさによって任意のものを選択することにより、高精度の凹部を形成することができるという作用効果が得られるものである。
【００２１】
本発明の請求項１４に記載の発明は、特に、請求項８記載の面実装用電子部品の製造方法における基板として、あらかじめ凹部を形成したものを用いるようにしたもので、この製造方法によれば、基板の成型時に凹部を同時に形成するようにしているため、基板に後で凹部を形成するようにしたものに比べ、工程を簡素化することができるという作用効果が得られるものである。
【００２２】
本発明の請求項１５に記載の発明は、特に、請求項９記載の面実装用電子部品の製造方法における電子部品本体として、あらかじめ凹部を形成したものを用いるようにしたもので、この製造方法によれば、電子部品本体の成型時に凹部を同時に形成するようにしているため、電子部品本体に後で凹部を形成するようにしたものに比べ、工程を簡素化することができるという作用効果が得られるものである。
【００２３】
本発明の請求項１６に記載の発明は、特に、請求項１０記載の面実装用電子部品の製造方法における電子部品本体として、あらかじめ凹部を形成したものを用いるようにしたもので、この製造方法によれば、電子部品本体の成型時に凹部を同時に形成するようにしているため、電子部品本体に後で凹部を形成するようにしたものに比べ、工程を簡素化することができるという作用効果が得られるものである。
【００２４】
本発明の請求項１７に記載の発明は、特に、請求項８記載の面実装用電子部品の製造方法における凹部を、底面がＶ字状になる形状に形成したもので、この製造方法によれば、凹部を２分するように切断する場合の分割が簡単に行えるため、生産性の向上が図れるという作用効果が得られるものである。
【００２５】
本発明の請求項１８に記載の発明は、特に、請求項９記載の面実装用電子部品の製造方法における凹部を、底面がＶ字状になる形状に形成したもので、この製造方法によれば、凹部を２分するように切断する場合の分割が簡単に行えるため、生産性の向上が図れるという作用効果が得られるものである。
【００２６】
本発明の請求項１９に記載の発明は、特に、請求項１０記載の面実装用電子部品の製造方法における凹部を、底面がＶ字状になる形状に形成したもので、この製造方法によれば、凹部を２分するように切断する場合の分割が簡単に行えるため、生産性の向上が図れるという作用効果が得られるものである。
【００２７】
【発明の実施の形態】
以下、本発明の面実装用電子部品の具体的な構成ならびにその製造方法について、図面を参照しながら説明する。
【００２８】
（実施の形態１）
本発明の実施の形態１における面実装用電子部品の構成ならびにその製造方法について、図１〜図１２を用いて説明する。
【００２９】
まず、本発明の実施の形態１における面実装用電子部品の構成は、図１，図２に示すように、セラミック材、絶縁材または磁性材からなる電子部品本体としての基板１１の相対向する長辺側の端面に、一定ピッチ毎に半円形状の凹部１２を上面から下面に貫通しないように複数個設け、かつこの相対向する凹部１２間にまたがるようにニッケルクロム、酸化ニッケル、酸化クロムなどからなる機能素子としての抵抗体１３を形成し、そしてこの抵抗体１３の両端の一部と凹部１２に銀、銅またはニッケルなどからなる下地電極１４を形成するとともに、この下地電極１４の上面側の一部を含む抵抗体１３上にエポキシ樹脂などの保護膜１５を形成し、さらにこの保護膜１５から露出した下地電極１４の上にニッケルめっき、はんだまたはスズめっきによる上部電極１６を形成し、この上部電極１６と前記下地電極１４とによって外部電極１７を構成している。
【００３０】
上記外部電極１７は基板１１の上面および凹部１２に形成されているだけで、基板１１の下面までは形成されていない。したがって、回路基板に面実装するためには、図３に示すようにフェイスダウン方式を採用する。すなわち、回路基板１８の電極パッド１９上に上記構成の面実装用電子部品の上面の外部電極１７が当接するように配置し、そして凹部１２に形成された外部電極１７と電極パッド１９とを接続体としてのはんだ２０で接続することにより、面実装用電子部品は回路基板に面実装される。
【００３１】
また、上記構成においては、凹部１２の形状として半円形状のものを示したが、これ以外に、凹部１２の形状としては、図４（ａ）〜（ｅ）に示すように、四角形状、三角形状、多角形状、半星形状、蟻溝形状など種々の形状を選択することができるものである。これは、後述する電子部品本体、基板１１の構成や面実装時のはんだフィレットの形成を選択するに当たって任意のものを選択すればよい。
【００３２】
そしてまた、凹部１２の壁面には外部電極１７が形成されるが、この外部電極１７の凹部１２への結合強度を高めるために、本発明の実施の形態１においては、凹部１２の壁面に微細な凹凸を有する粗面化処理を施している。この粗面化処理により、外部電極１７を凹部１２の壁面に形成した場合における外部電極１７の凹部１２への結合強度は向上することになり、その結果、回路基板などへの実装後に外力が加えられても外部電極１７の剥がれは発生しないものである。また、この粗面化処理は、例えば、サンドブラスト加工法で凹部１２を形成すれば、凹部１２の加工と同時に簡単に施すことができる。なお、この凹部１２の加工は、サンドブラスト加工法以外に、レーザー加工法、ドリル加工法、プレス加工法、エッチング加工法でも行えるもので、これらの加工法においても、加工法の工夫により凹部１２の加工と同時に凹部１２の壁面を粗面化することができる。また、この凹部１２の粗面化処理は、凹部１２を形成した後、サンドブラストすることによっても粗面化することができる。
【００３３】
さらに、上記凹部１２の深さは、抗折強度を十分に保つために重要な要因となる。基本的には、電子部品本体としての基板１１の厚さの２／３以下とすることが条件となるが、これらに用いる材質や全体の厚さにも大きく影響を受けることから、最低でも０．１ｍｍ以上とすることが必要となる。この０．１ｍｍ以上としたのは、面実装したとき凹部１２内に形成されるはんだフィレットの認識が可能となる限界であるためである。
【００３４】
なお、上記構成においては、機能素子として抵抗体１３を示したが、基板１１を磁性体とし、相対向する凹部１２間に導体を形成してインダクタとすることもできる。この導体は蛇行状とすることによって直線状のものに比べて大きなインダクタンス値を得ることができる。このように磁性体材料を用いたインダクタ素子や、誘電体材料を用いたコンデンサ素子を機能素子として設けてもよいものである。
【００３５】
次に、上記構成の面実装用電子部品の製造方法について、図５〜図１２を用いて説明する。
【００３６】
まず、図５に示すように、セラミックの焼成体よりなる長方形状の大判の基板１１を準備する。
【００３７】
次に、図６に示すように、基板１１に一定ピッチでしかも縦横に長円形状の凹部１２を形成する。この凹部１２の形成は、レーザーを照射して形成したり、ドリルを用いて形成したり、サンドブラスト法で形成したり、あるいはエッチング法で形成することができる。また、この凹部１２の深さは、基板１１の厚みの２／３以下で、かつ０．１ｍｍ以上とする。
【００３８】
次に、図７に示すように、凹部１２の横列方向にかつ隣接する凹部１２間に、所定の長さ、厚さのニッケルクロム、酸化ニッケル、酸化クロムなどからなる機能素子としての抵抗体１３をスパッタリングや蒸着により形成する。
【００３９】
次に、図８に示すように、抵抗体１３の両端に接続され、かつ凹部１２にも形成されるように銀、銅またはニッケルなどからなる下地電極１４を形成する。
【００４０】
次に、図９に示すように、抵抗体１３の抵抗値を測定し、所定の抵抗値になるようにトリミング２１を施す。
【００４１】
次に、図１０に示すように、少なくとも抵抗体１３を覆うように今度は縦方向にエポキシ樹脂やガラスからなる保護膜１５を形成する。
【００４２】
次に、図１１に示すように、凹部１２の縦列方向に凹部１２の中心をダイシング加工して個々の多連形の面実装用電子部品２２に切断分離する。
【００４３】
そして最後に、図１２に示すように、個々に分離された面実装用電子部品２２における露出する下地電極１４上にニッケルめっき、はんだまたはスズめっきによる上部電極１６を形成することにより外部電極１７を構成して、完成品とする。
【００４４】
なお、上記本発明の実施の形態１においては、凹部１２を基板１１に後で形成するようにしているが、この凹部１２は基板１１にあらかじめ形成しておいてもよく、すなわち、基板１１をセラミックのスラリー状の状態で寸法成型する際に、凹部１２をプレス方式によってあらかじめ形成しておき、そしてこれを焼成することにより構成した凹部１２付きの基板１１を用いてもよいもので、このように、凹部１２を基板１１の成型時に同時に形成するようにすれば、基板１１に後で凹部１２を形成するようにしたものに比べ、工程を簡素化することができるものである。
【００４５】
また、この凹部１２の底面がＶ字状になるように、凹部１２の底面に、大判状態から個々の面実装用電子部品１７に分離する方向にＶ字状の切込みを形成しておくと、凹部１２を２分するように切断する場合の分割が簡単に行えるため、生産性の向上が図れるものである。
【００４６】
（実施の形態２）
次に、本発明の実施の形態２における面実装用電子部品の構成ならびにその製造方法について、図１３を用いて説明する。ここで示すものは、機能素子を内蔵した電子部品本体を備えた例であり、セラミックコンデンサ、サーミスタ、バリスタのアレーがその対象となる。
【００４７】
なお、この本発明の実施の形態２において、上記した本発明の実施の形態１における面実装用電子部品と同様の構成を有するものについては、同一番号を付している。
【００４８】
まず、その構成であるが、ここではセラミックコンデンサを例に説明する。このセラミックコンデンサは、図１３に示すように、誘電体セラミックをベースとしたセラミック層２３と電極２４を交互に複数層積層するとともに、下面側にセラミック無効層２５を設けた電子部品本体２６を備え、そしてこの電子部品本体２６の相対向する長辺側の２辺の端面に、電子部品本体２６の厚さの２／３以下で、かつ０．１ｍｍ以上の深さを有する凹部１２を上面から形成するとともに、この凹部１２の壁面に電子部品本体２６の電極２４の端部を交互に露出させている。
【００４９】
そしてまたこの電子部品本体２６の上面の一部には、凹部１２を含むように銀、銅またはニッケルなどからなる下地電極１４を形成し、さらにこの下地電極１４の上にニッケルめっき、はんだまたはスズめっきによる上部電極１６を形成し、この上部電極１６と前記下地電極１４とによって外部電極１７を構成している。このような構成により、セラミックコンデンサアレーの面実装用電子部品が完成するものである。
【００５０】
そしてこの面実装用電子部品の回路基板等への実装は、上記本発明の実施の形態１で示した実装方法と同様に、図３に示すフェイスダウン方式で実装される。
【００５１】
上記したセラミックコンデンサアレーの面実装用電子部品の製造方法は、本発明の実施の形態１における図５に示す基板１１の代わりに、一般的な大判状のセラミックコンデンサブロックを用い、凹部１２の加工、外部電極１７の形成を行うことにより製造することができるものである。
【００５２】
ただ、上記本発明の実施の形態２においては、凹部１２を設ける位置精度が重要であるとともに、電子部品本体２６の電極２４の端部をこの凹部１２の壁面に交互にきっちりと露出させる必要があり、これが狂ってしまうと、セラミックコンデンサとしての機能を果たさなくなってしまうものである。したがって、これにおいては、凹部１２の形成位置が正確になるように凹部１２の大きさ、凹部１２の中心を管理することが大切である。
【００５３】
また、サーミスタアレーの面実装用電子部品を得るためには、上記誘電体セラミックの代わりにチタン酸バリウムを主成分としたものを用いればよく、さらにバリスタアレーの面実装用電子部品を得るためには、酸化亜鉛を主成分としたものを用いればよく、これにより、機能素子内蔵の電子部品本体２６を構成することができるものである。
【００５４】
（実施の形態３）
次に、本発明の実施の形態３における面実装用電子部品の構成並びにその製造方法について、図１４を用いて説明する。ここで示すものは、機能素子を複数内蔵した電子部品本体を備えた例であり、ここでは、コンデンサと抵抗の複合部品アレーを例として説明する。
【００５５】
なお、この本発明の実施の形態３において、上記した本発明の実施の形態１および実施の形態２における面実装用電子部品と同様の構成を有するものについては、同一番号を付している。
【００５６】
この本発明の実施の形態３における複合部品は、図１４に示すように、本発明の実施の形態１と実施の形態２を組み合わせたものである。すなわち、誘電体セラミックをベースとしたセラミック層２３と電極２４を交互に複数層積層するとともに、下面側にセラミック無効層２５を設けた電子部品本体２６を備え、そしてこの電子部品本体２６の相対向する長辺側の２辺の端面に、電子部品本体２６の厚さの２／３以下で、かつ０．１ｍｍ以上の深さを有する複数の凹部１２を複数個一定ピッチ毎に形成するとともに、この凹部１２の壁面に電子部品本体２６の電極２４の端部を交互に露出させている。そしてまた前記電子部品本体２６の上面の相対向する凹部１２間には抵抗体１３を形成し、さらに前記電子部品本体２６の上面の一部には、前記抵抗体１３の両面と接続される銀、銅またはニッケルなどからなる下地電極１４を前記凹部１２を含むように形成し、また前記抵抗体１３の上方には、少なくともこの抵抗体１３を覆うようにエポキシ樹脂などの保護膜１５を形成し、そしてこの保護膜１５から露出した下地電極１４の上にニッケルめっき、はんだまたはスズめっきによる上部電極１６を形成し、この上部電極１６と前記下地電極１４とによって外部電極１７を構成したものである。このような構成により、ＣＲ複合部品アレーの面実装用電子部品が完成するものである。
【００５７】
そしてこの面実装用電子部品の回路基板への実装は、上記本発明の実施の形態１で示した実装方法と同様に、図３に示すフェイスダウン方式で実装される。
【００５８】
上記したＣＲ複合部品アレーの面実装用電子部品の製造方法は、本発明の実施の形態１における図５に示す基板１１の代わりに、電子部品本体２６の大判状のものを用いるだけで、それ以外は、本発明は実施の形態１と全く同一の方法で製造することができるものである。
【００５９】
なお、上記本発明の実施の形態１，２，３において、外部電極１７と回路基板１８の電極パッド１９とを接続する接続体としてのはんだ２０の色と、前記外部電極１７の色を異ならせると、面実装したときに凹部１２に形成されるはんだフィレットの形成状況がより確実に認識できるものである。
【００６０】
また、上記本発明の実施の形態２，３においては、凹部１２を電子部品本体２６に後で形成するようにしているが、この凹部１２は電子部品本体２６にあらかじめ形成しておいてもよく、このように、凹部１２を電子部品本体２６の成型時に同時に形成するようにすれば、電子部品本体２６に後で凹部１２を形成するようにしたものに比べ、工程を簡素化することができるものである。
【００６１】
【発明の効果】
以上のように本発明によれば、電子部品本体の相対向する端面に電子部品本体の厚さ方向に上面から下面に貫通しない複数の凹部を設け、かつこの相対向する凹部間に機能素子を設け、さらに前記凹部を含むように前記機能素子と接続される外部電極を設けたもので、前記電子部品本体の相対向する端面に設けられる凹部を、電子部品本体の厚さ方向に上面から下面に貫通しないようにしているため、多少の抗折力を受けても破損するようなことはなくなり、これにより、製造過程や完成品後に応力が加えられても破損しない抗折強度の優れたものとなるため、小形、薄型化が進む中において高い信頼性を確保することができるという優れた効果を奏するものである。
【図面の簡単な説明】
【図１】本発明の実施の形態１における面実装用電子部品の平面図
【図２】図１におけるＡ−Ａ線断面図
【図３】同面実装用電子部品を回路基板に実装した状態を示す説明図
【図４】（ａ）〜（ｅ）同面実装用電子部品における凹部の形状を示す部分平面図
【図５】同面実装用電子部品の製造方法における一工程の基板の平面図
【図６】同凹部を加工した状態の平面図
【図７】同抵抗体を形成した状態の平面図
【図８】同下地電極を形成した状態の平面図
【図９】同抵抗値を調整した状態の平面図
【図１０】同保護膜を形成した状態の平面図
【図１１】同ダイシングで切断分離した状態の平面図
【図１２】同完成品の平面図
【図１３】本発明の実施の形態２における面実装用電子部品の断面図
【図１４】本発明の実施の形態３における面実装用電子部品の断面図
【図１５】従来の面実装用電子部品の平面図
【図１６】図１５におけるＢ−Ｂ線断面図
【符号の説明】
１１基板
１２凹部
１３抵抗体（機能素子）
１４下地電極
１５保護膜
１６上部電極
１７外部電極
２１トリミング
２２面実装用電子部品
２３セラミック層
２４電極
２５セラミック無効層
２６電子部品本体[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a surface mounting electronic component used for various electronic devices and a method for manufacturing the same.
[0002]
[Prior art]
Conventional surface mount electronic components of this type have been configured as shown in FIGS. That is, a functional element 3 such as a resistor is formed on an upper surface of a substrate 1 provided with a plurality of cuts 2 penetrating from an upper surface to a lower surface on opposing end surfaces so as to straddle the opposing cut portions 2 on both end surfaces. The functional element 3 is electrically connected to an external electrode 4 previously formed between the upper surface, the side surface, and the lower surface of the substrate 1 so as to include the cutout 2, and a protective film 5 is formed on the functional element 3. It was constituted by doing.
[0003]
As prior art document information related to this application, for example, Patent Document 1 is known.
[0004]
[Patent Document 1]
JP-A-5-335117 [0005]
[Problems to be solved by the invention]
However, in the above-described conventional configuration, since a large number of cuts 2 are formed so as to penetrate from the upper surface to the lower surface of the substrate 1, stress is applied during the manufacturing process or during mounting on a circuit board after a completed product. If it is done, there is a problem that it is easily damaged based on the cut portion 2. In particular, there has been a high possibility of breakage when a bending force is applied as a stress.
[0006]
An object of the present invention is to solve the above-mentioned conventional problems, and an object of the present invention is to provide a surface-mounting electronic component having excellent bending strength, which is not damaged even when stress is applied after a manufacturing process or a finished product, and a method for manufacturing the same. Things.
[0007]
[Means for Solving the Problems]
In order to achieve the above object, the present invention has the following configuration.
[0008]
According to the first aspect of the present invention, a plurality of recesses that do not penetrate from the upper surface to the lower surface in the thickness direction of the electronic component body are provided on opposite end surfaces of the electronic component body, and a function is provided between the opposed recesses. The device further includes an external electrode connected to the functional element so as to include the concave portion. According to this configuration, the concave portion provided on the opposing end surfaces of the electronic component main body includes the concave portion of the electronic component main body. Since it does not penetrate from the upper surface to the lower surface in the thickness direction, it does not break even if it receives some bending force, and as a result, it does not break even if stress is applied after the manufacturing process or after the finished product The function and effect that an electronic component for surface mounting having excellent strength can be realized is obtained.
[0009]
The invention according to claim 2 of the present invention is particularly configured such that the shape of the concave portion is any one of a semicircular shape, a square shape, a triangular shape, a polygonal shape, a semistar shape, and a dovetail shape. According to the above, an operational effect that an arbitrary concave shape can be adopted as necessary is obtained.
[0010]
According to the third aspect of the present invention, the wall surface of the concave portion is particularly roughened. According to this configuration, since the wall surface of the concave portion is roughened, an external electrode is formed on the wall surface of the concave portion. In this case, the bonding strength of the external electrode to the concave portion is improved, and as a result, the effect that the external electrode does not peel even if an external force is applied after mounting on a circuit board or the like is obtained. .
[0011]
According to a fourth aspect of the present invention, in particular, the depth of the recess is not more than 2/3 of the thickness of the electronic component body and not less than 0.1 mm. Since the depth is not more than 2/3 of the electronic component body and not less than 0.1 mm, by satisfying this condition, the function and effect that sufficient bending strength can be maintained can be obtained.
[0012]
In the invention according to claim 5 of the present invention, in particular, the functional element is composed of any one of a resistor, an inductor, a capacitor, a thermistor, and a varistor. According to this configuration, an arbitrary functional element can be selected. This has the effect of being able to achieve
[0013]
The invention according to claim 6 of the present invention is particularly characterized in that the functional element is configured by combining two or more different elements among a resistor, an inductor, a capacitor, a thermistor, and a varistor. The operation and effect that various composite parts can be realized by the configuration can be obtained.
[0014]
The invention according to claim 7 of the present invention is particularly characterized in that the color of the external electrode formed on the electronic component main body and the color of the connection body when surface-mounted on the circuit board are different. For example, it is possible to obtain an operational effect that the mounting state at the time of surface mounting can be more reliably recognized.
[0015]
According to an eighth aspect of the present invention, a concave portion is formed on a substrate made of an insulator, a dielectric material or a magnetic material from a top surface to a middle portion in a thickness direction of the substrate at predetermined pitches in the vertical and horizontal directions, and the concave portion of the substrate is formed. A functional element is formed so as to extend between them, and thereafter, an external electrode is formed so as to include the concave portion, and further a protective film is formed so as to include at least the functional element, and then the concave portion is divided into two. According to this manufacturing method, it is possible to efficiently produce a surface-mounting electronic component having excellent bending strength.
[0016]
According to a ninth aspect of the present invention, an electronic component main body having a built-in functional element is formed in advance, and the electronic component main body is vertically and horizontally arranged at regular intervals from the upper surface to the middle in the thickness direction of the electronic component main body. A concave portion is formed so that an end of the internal functional element is exposed, and an external electrode is formed so as to include the concave portion at the portion where the concave portion is formed, and then cut so as to divide the concave portion into two. According to this manufacturing method, the function and effect that an electronic component for surface mounting having excellent bending strength can be efficiently produced can be obtained even in a device in which a functional element is built in advance.
[0017]
According to a tenth aspect of the present invention, there is provided an electronic component main body in which a functional element is partially built in advance, and the electronic component main body is vertically and horizontally spaced from the upper surface at a constant pitch in the thickness direction of the electronic component main body. In addition, a concave portion is formed so that the end of the internal functional element is exposed, and another functional element is formed on the upper surface of the electronic component body so as to straddle between the concave portions, and then includes the concave portion. Forming an external electrode, further forming a protective film so as to include at least another functional element formed on the upper surface of the electronic component main body, and then cutting the concave portion into two parts. According to this, even in the case of a composite part, an operation and effect of efficiently producing a part having excellent bending strength can be obtained.
[0018]
According to an eleventh aspect of the present invention, in the method of manufacturing an electronic component for surface mounting according to the eighth aspect, the recess is formed by any one of laser processing, drilling, pressing, sandblasting, and etching. According to this manufacturing method, a high-precision concave portion is formed by selecting an arbitrary one according to the shape and size of the surface-mount electronic component. That is, the operation and effect can be obtained.
[0019]
According to a twelfth aspect of the present invention, in the method for manufacturing a surface-mount electronic component according to the ninth aspect, the recess is formed by any one of laser processing, drilling, pressing, sandblasting, and etching. According to this manufacturing method, a high-precision concave portion is formed by selecting an arbitrary one according to the shape and size of the surface-mount electronic component. That is, the operation and effect can be obtained.
[0020]
According to a thirteenth aspect of the present invention, in particular, in the method for manufacturing a surface-mount electronic component according to the tenth aspect, the recess is formed by any one of laser processing, drilling, pressing, sandblasting, and etching. According to this manufacturing method, a high-precision concave portion is formed by selecting an arbitrary one according to the shape and size of the surface-mount electronic component. That is, the operation and effect can be obtained.
[0021]
According to a fourteenth aspect of the present invention, in particular, a substrate in which a concave portion is formed in advance is used as a substrate in the method of manufacturing an electronic component for surface mounting according to the eighth aspect. For example, since the concave portions are formed at the same time when the substrate is molded, an operational effect can be obtained in which the process can be simplified as compared with the case where the concave portions are formed later in the substrate.
[0022]
According to a fifteenth aspect of the present invention, in particular, in the method for manufacturing a surface-mount electronic component according to the ninth aspect, an electronic component body in which a concave portion is formed in advance is used. According to the method, since the concave portion is formed at the same time when the electronic component body is molded, the operation and effect can be simplified as compared with the case where the concave portion is formed later in the electronic component body. It is obtained.
[0023]
According to a sixteenth aspect of the present invention, in the method of manufacturing a surface-mount electronic component according to the tenth aspect, an electronic component body in which a concave portion is formed in advance is used. According to the method, since the concave portion is formed at the same time when the electronic component body is molded, the operation and effect can be simplified as compared with the case where the concave portion is formed later in the electronic component body. It is obtained.
[0024]
According to a seventeenth aspect of the present invention, in particular, the recess in the method for manufacturing a surface-mount electronic component according to the eighth aspect is formed to have a V-shaped bottom surface. For example, when the concave portion is cut so as to divide the concave portion into two, the effect can be obtained that the productivity can be improved because the division can be easily performed.
[0025]
According to an eighteenth aspect of the present invention, in particular, the concave portion in the method for manufacturing a surface-mount electronic component according to the ninth aspect is formed to have a V-shaped bottom surface. For example, when the concave portion is cut so as to divide the concave portion into two, the effect can be obtained that the productivity can be improved because the division can be easily performed.
[0026]
According to a nineteenth aspect of the present invention, in particular, the recess in the method of manufacturing a surface-mount electronic component according to the tenth aspect is formed in a shape having a V-shaped bottom surface. For example, when the concave portion is cut so as to divide the concave portion into two, the effect can be obtained that the productivity can be improved because the division can be easily performed.
[0027]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, a specific configuration of the electronic component for surface mounting according to the present invention and a manufacturing method thereof will be described with reference to the drawings.
[0028]
(Embodiment 1)
The configuration of the electronic component for surface mounting according to the first embodiment of the present invention and a method of manufacturing the electronic component will be described with reference to FIGS.
[0029]
First, the configuration of the surface-mounting electronic component according to the first embodiment of the present invention is, as shown in FIGS. 1 and 2, opposed to a substrate 11 as an electronic component body made of a ceramic material, an insulating material or a magnetic material. A plurality of semicircular concave portions 12 are provided at an end surface on the long side side at regular intervals so as not to penetrate from the upper surface to the lower surface, and nickel chrome, nickel oxide, chromium oxide A resistor 13 is formed as a functional element made of, for example, and a base electrode 14 made of silver, copper, nickel or the like is formed in a part of both ends of the resistor 13 and the recess 12, and an upper surface of the base electrode 14 is formed. A protective film 15 such as an epoxy resin is formed on the resistor 13 including a part of the side, and nickel plating, solder or tin is formed on the underlying electrode 14 exposed from the protective film 15. The upper electrode 16 is formed by Kki constitute the external electrode 17 by this upper electrode 16 and the base electrode 14.
[0030]
The external electrodes 17 are only formed on the upper surface of the substrate 11 and the concave portions 12, but are not formed up to the lower surface of the substrate 11. Therefore, for surface mounting on a circuit board, a face-down method is adopted as shown in FIG. That is, the external electrode 17 on the upper surface of the surface-mounted electronic component having the above-described configuration is arranged so as to be in contact with the electrode pad 19 of the circuit board 18, and the external electrode 17 formed in the recess 12 and the electrode pad 19 are connected. By connecting with the solder 20 as a body, the electronic component for surface mounting is surface-mounted on the circuit board.
[0031]
Further, in the above-described configuration, the shape of the concave portion 12 is shown as a semicircular shape, but in addition to this, the shape of the concave portion 12 may be a square shape, as shown in FIGS. Various shapes such as a triangular shape, a polygonal shape, a semi-star shape, and a dovetail shape can be selected. This can be achieved by selecting an arbitrary component in selecting the configuration of the electronic component body and the substrate 11 described later and the formation of the solder fillet at the time of surface mounting.
[0032]
Further, an external electrode 17 is formed on the wall surface of the concave portion 12. In order to increase the bonding strength of the external electrode 17 to the concave portion 12, in Embodiment 1 of the present invention, a fine The surface is roughened with various irregularities. By this roughening treatment, the bonding strength of the external electrode 17 to the concave portion 12 when the external electrode 17 is formed on the wall surface of the concave portion 12 is improved, and as a result, an external force is applied after the external electrode 17 is mounted on a circuit board or the like. The external electrode 17 does not peel off even if it is removed. In addition, if the concave portion 12 is formed by, for example, a sandblasting method, the roughening process can be easily performed simultaneously with the processing of the concave portion 12. The processing of the concave portion 12 can be performed by a laser processing method, a drill processing method, a press processing method, or an etching processing method, in addition to the sand blast processing method. The wall surface of the concave portion 12 can be roughened simultaneously with the processing. The surface roughening treatment of the concave portion 12 can also be performed by sandblasting after forming the concave portion 12.
[0033]
Further, the depth of the concave portion 12 is an important factor for maintaining sufficient bending strength. Basically, the condition is that the thickness is equal to or less than 2/3 of the thickness of the substrate 11 as the electronic component body. .1 mm or more. The reason why the thickness is 0.1 mm or more is that the solder fillet formed in the concave portion 12 at the time of surface mounting is a limit at which recognition is possible.
[0034]
In the above configuration, the resistor 13 is shown as a functional element. However, the substrate 11 may be made of a magnetic material, and a conductor may be formed between the opposing concave portions 12 to form an inductor. By making this conductor meandering, a larger inductance value can be obtained as compared to a straight conductor. As described above, an inductor element using a magnetic material or a capacitor element using a dielectric material may be provided as a functional element.
[0035]
Next, a method for manufacturing the electronic component for surface mounting having the above configuration will be described with reference to FIGS.
[0036]
First, as shown in FIG. 5, a rectangular large-sized substrate 11 made of a ceramic fired body is prepared.
[0037]
Next, as shown in FIG. 6, an elliptical concave portion 12 is formed in the substrate 11 at a constant pitch and vertically and horizontally. The recess 12 can be formed by irradiating a laser, by using a drill, by a sandblast method, or by an etching method. The depth of the recess 12 is ２ or less of the thickness of the substrate 11 and 0.1 mm or more.
[0038]
Next, as shown in FIG. 7, a resistor 13 as a functional element made of nickel chrome, nickel oxide, chromium oxide, or the like having a predetermined length and thickness is provided between the recesses 12 in the row direction of the recesses 12 and between the recesses 12 adjacent to each other. Is formed by sputtering or vapor deposition.
[0039]
Next, as shown in FIG. 8, a base electrode 14 made of silver, copper, nickel, or the like is formed so as to be connected to both ends of the resistor 13 and to be formed also in the recess 12.
[0040]
Next, as shown in FIG. 9, the resistance value of the resistor 13 is measured, and trimming 21 is performed so as to have a predetermined resistance value.
[0041]
Next, as shown in FIG. 10, a protective film 15 made of epoxy resin or glass is formed in the vertical direction so as to cover at least the resistor 13.
[0042]
Next, as shown in FIG. 11, the center of the concave portion 12 is diced in the column direction of the concave portion 12 to be cut and separated into individual multiple surface-mounting electronic components 22.
[0043]
Finally, as shown in FIG. 12, the external electrode 17 is formed by forming the upper electrode 16 by nickel plating, solder or tin plating on the exposed base electrode 14 of the individually separated surface mounting electronic component 22. Make up and complete.
[0044]
In the first embodiment of the present invention, the concave portion 12 is formed in the substrate 11 later. However, the concave portion 12 may be formed in the substrate 11 in advance, that is, the substrate 11 may be formed. When dimensions are formed in a ceramic slurry state, the recess 12 may be formed in advance by a press method, and the substrate 11 with the recess 12 formed by firing this may be used. If the concave portion 12 is formed at the same time as the molding of the substrate 11, the process can be simplified as compared with the case where the concave portion 12 is formed later on the substrate 11.
[0045]
If a V-shaped cut is formed in the bottom surface of the concave portion 12 in a direction separating the large-sized state into the individual surface-mounting electronic components 17 so that the bottom surface of the concave portion 12 becomes V-shaped, Since the division when cutting the recess 12 into two parts can be easily performed, the productivity can be improved.
[0046]
(Embodiment 2)
Next, a configuration of a surface mounting electronic component and a method of manufacturing the same according to Embodiment 2 of the present invention will be described with reference to FIG. What is shown here is an example in which an electronic component body having a built-in functional element is provided, and an array of a ceramic capacitor, a thermistor, and a varistor is the target.
[0047]
In the second embodiment of the present invention, components having the same configurations as those of the surface-mounting electronic component in the first embodiment of the present invention are given the same reference numerals.
[0048]
First, regarding the configuration, here, a ceramic capacitor will be described as an example. As shown in FIG. 13, this ceramic capacitor includes an electronic component main body 26 in which a plurality of ceramic layers 23 and electrodes 24 based on dielectric ceramic are alternately laminated and a ceramic invalid layer 25 is provided on the lower surface side. A concave portion 12 having a depth of not more than 2/3 of the thickness of the electronic component body 26 and having a depth of 0.1 mm or more is formed on an end face of two opposing long sides of the electronic component body 26 from above. At the same time, the ends of the electrodes 24 of the electronic component body 26 are exposed alternately on the wall surface of the concave portion 12.
[0049]
Further, a base electrode 14 made of silver, copper, nickel or the like is formed on a part of the upper surface of the electronic component body 26 so as to include the recess 12, and further, nickel plating, solder or tin is formed on the base electrode 14. An upper electrode 16 is formed by plating, and the upper electrode 16 and the base electrode 14 constitute an external electrode 17. With such a configuration, an electronic component for surface mounting of the ceramic capacitor array is completed.
[0050]
The electronic component for surface mounting is mounted on a circuit board or the like by the face-down method shown in FIG. 3, similarly to the mounting method described in the first embodiment of the present invention.
[0051]
The above-described method of manufacturing the electronic component for surface mounting of the ceramic capacitor array employs a general large-sized ceramic capacitor block instead of the substrate 11 shown in FIG. And the external electrodes 17 are formed.
[0052]
However, in the second embodiment of the present invention, it is important that the positional accuracy of providing the concave portion 12 is important, and that the ends of the electrodes 24 of the electronic component main body 26 be alternately and precisely exposed on the wall surface of the concave portion 12. Yes, if this goes wrong, it will no longer function as a ceramic capacitor. Therefore, in this case, it is important to manage the size of the recess 12 and the center of the recess 12 so that the formation position of the recess 12 is accurate.
[0053]
In addition, in order to obtain a surface mount electronic component of a thermistor array, a component mainly containing barium titanate may be used instead of the dielectric ceramic, and furthermore, in order to obtain a surface mount electronic component of a varistor array. The main component may be one containing zinc oxide as a main component, whereby the electronic component body 26 with a built-in functional element can be formed.
[0054]
(Embodiment 3)
Next, a configuration of a surface mounting electronic component and a method of manufacturing the same according to Embodiment 3 of the present invention will be described with reference to FIG. What is shown here is an example provided with an electronic component body having a plurality of built-in functional elements. Here, a composite component array of a capacitor and a resistor will be described as an example.
[0055]
In the third embodiment of the present invention, components having the same configuration as those of the above-described surface mounting electronic components in the first and second embodiments of the present invention are denoted by the same reference numerals.
[0056]
The composite part according to the third embodiment of the present invention is a combination of the first and second embodiments of the present invention, as shown in FIG. That is, an electronic component main body 26 is provided in which a plurality of ceramic layers 23 and electrodes 24 based on a dielectric ceramic are alternately laminated and a ceramic invalid layer 25 is provided on the lower surface side. A plurality of recesses 12 having a depth of not more than で of the thickness of the electronic component main body 26 and having a depth of not less than 0.1 mm are formed at a constant pitch on two end surfaces on the long side to be formed. The ends of the electrodes 24 of the electronic component body 26 are alternately exposed on the wall surfaces of the concave portions 12. Further, a resistor 13 is formed between the opposing concave portions 12 on the upper surface of the electronic component main body 26, and a part of the upper surface of the electronic component main body 26 has silver connected to both surfaces of the resistor 13. A base electrode 14 made of copper, nickel, or the like is formed so as to include the recess 12, and a protective film 15 such as an epoxy resin is formed above the resistor 13 so as to cover at least the resistor 13. An upper electrode 16 formed by nickel plating, solder or tin plating is formed on the underlying electrode 14 exposed from the protective film 15, and an external electrode 17 is constituted by the upper electrode 16 and the underlying electrode 14. . With this configuration, the electronic component for surface mounting of the CR composite component array is completed.
[0057]
The electronic component for surface mounting is mounted on the circuit board by the face-down method shown in FIG. 3, similarly to the mounting method described in the first embodiment of the present invention.
[0058]
The above-described method of manufacturing the electronic component for surface mounting of the CR composite component array uses only a large-sized electronic component main body 26 instead of the substrate 11 shown in FIG. 5 in the first embodiment of the present invention. Except for this point, the present invention can be manufactured by exactly the same method as the first embodiment.
[0059]
In the first, second, and third embodiments of the present invention, the color of the solder 20 as a connecting body for connecting the external electrode 17 and the electrode pad 19 of the circuit board 18 is different from the color of the external electrode 17. Thus, the state of formation of the solder fillet formed in the concave portion 12 when the surface is mounted can be more reliably recognized.
[0060]
In the second and third embodiments of the present invention, the concave portion 12 is formed later in the electronic component main body 26. However, the concave portion 12 may be formed in the electronic component main body 26 in advance. In this way, if the recess 12 is formed simultaneously with the molding of the electronic component body 26, the process can be simplified as compared with the case where the recess 12 is formed later in the electronic component body 26. Things.
[0061]
【The invention's effect】
As described above, according to the present invention, a plurality of recesses that do not penetrate from the upper surface to the lower surface in the thickness direction of the electronic component body are provided on the opposite end surfaces of the electronic component body, and the functional element is provided between the opposed recesses. And an external electrode connected to the functional element so as to include the concave portion. The concave portion provided on the opposite end face of the electronic component main body is formed from the upper surface to the lower surface in the thickness direction of the electronic component main body. Since it does not penetrate into the product, it will not be damaged even if it receives some bending force, and it has excellent bending strength that will not be damaged even if stress is applied during the manufacturing process or after the finished product Therefore, a high reliability can be ensured while the size and thickness are reduced.
[Brief description of the drawings]
FIG. 1 is a plan view of a surface-mounting electronic component according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view taken along line AA in FIG. 1. FIG. FIGS. 4 (a) to 4 (e) are partial plan views showing the shape of a concave portion in the electronic component for mounting on the same surface. FIG. 5 is a plan view of a substrate in one process in a method for manufacturing the electronic component for mounting on the same surface. FIG. 6 is a plan view showing a state in which the recess is processed. FIG. 7 is a plan view showing a state in which the resistor is formed. FIG. 8 is a plan view showing a state in which the base electrode is formed. FIG. 10 is a plan view showing a state in which the protective film is formed. FIG. 11 is a plan view showing a state in which the protective film is cut and separated by dicing. FIG. 12 is a plan view of the finished product. FIG. 14 is a cross-sectional view of an electronic component for surface mounting according to Embodiment 2 of the present invention. Sectional view and FIG. 15 is a plan view of a conventional electronic component surface mounting [16] sectional view taken along line B-B in FIG. 15 of the electronic component EXPLANATION OF REFERENCE NUMERALS
11 Substrate 12 Recess 13 Resistor (functional element)
Reference Signs List 14 base electrode 15 protective film 16 upper electrode 17 external electrode 21 trimming 22 electronic component for surface mounting 23 ceramic layer 24 electrode 25 ceramic invalid layer 26 electronic component body

Claims

A plurality of recesses that do not penetrate from the upper surface to the lower surface in the thickness direction of the electronic component body are provided on opposed end surfaces of the electronic component body, and a functional element is provided between the opposed recesses, and further includes the recess. Electronic components for surface mounting provided with external electrodes connected to functional elements.

2. The electronic component for surface mounting according to claim 1, wherein the shape of the recess is any one of a semicircle, a square, a triangle, a polygon, a semistar, and a dovetail.

The surface-mount electronic component according to claim 1, wherein a wall surface of the recess is roughened.

2. The electronic component for surface mounting according to claim 1, wherein the depth of the recess is not more than ／ of the thickness of the electronic component body and not less than 0.1 mm.

2. The electronic component for surface mounting according to claim 1, wherein the functional element is formed of any one of a resistor, an inductor, a capacitor, a thermistor, and a varistor.

The electronic component for surface mounting according to claim 1, wherein the functional element is configured by combining two or more different elements among a resistor, an inductor, a capacitor, a thermistor, and a varistor.

2. The electronic component for surface mounting according to claim 1, wherein the color of the external electrode formed on the electronic component body is different from the color of the connection body when the electronic component is surface-mounted on the circuit board.

A concave portion is formed on the substrate made of an insulator, a dielectric material or a magnetic material at predetermined pitches vertically and horizontally from the upper surface to halfway in the thickness direction of the substrate, and a functional element is formed so as to extend between the concave portions of the substrate. A method of manufacturing a surface-mount electronic component in which an external electrode is formed so as to include the concave portion, a protective film is formed so as to include at least the functional element, and then the cut portion is cut into two.

An electronic component main body with a built-in functional element is formed in advance, and the electronic component main body is vertically and horizontally spaced at regular intervals from the upper surface to the middle in the thickness direction of the electronic component main body, and the end of the internal functional element is exposed. A method of manufacturing a surface-mount electronic component in which a concave portion is formed, and an external electrode is formed so as to include the concave portion in the portion where the concave portion is formed, and then cut so as to divide the concave portion into two.

An electronic component body partially incorporating a functional element is formed in advance, and the end of the internal functional element is exposed from the top to the middle in the thickness direction of the electronic component body vertically and horizontally at regular intervals on this electronic component body. And forming another functional element on the upper surface of the electronic component main body so as to extend between the concave portions, and then forming an external electrode so as to include the concave portion, and further forming at least the electronic component main body. A method of manufacturing a surface-mount electronic component, comprising forming a protective film so as to include another functional element formed on the upper surface of the device, and then cutting the concave portion into two.

9. The method of manufacturing an electronic component for surface mounting according to claim 8, wherein the recess is formed by any one of laser processing, drilling, pressing, sandblasting, and etching, or a plurality of processing methods.

The method of manufacturing an electronic component for surface mounting according to claim 9, wherein the recess is formed by any one of laser processing, drilling, pressing, sandblasting, and etching, or a plurality of processing methods.

The method of manufacturing an electronic component for surface mounting according to claim 10, wherein the recess is formed by any one of laser processing, drill processing, press processing, sand blast processing, and etching processing, or a plurality of processing methods.

9. The method for manufacturing an electronic component for surface mounting according to claim 8, wherein a substrate having a recess formed in advance is used.

10. The method of manufacturing an electronic component for surface mounting according to claim 9, wherein an electronic component body having a recess formed in advance is used.

The method of manufacturing an electronic component for surface mounting according to claim 10, wherein an electronic component main body in which a concave portion is formed in advance is used.

9. The method of manufacturing an electronic component for surface mounting according to claim 8, wherein the concave portion is formed in a shape having a V-shaped bottom surface.

The method according to claim 9, wherein the concave portion is formed in a shape having a V-shaped bottom surface.

The method for manufacturing a surface-mount electronic component according to claim 10, wherein the concave portion is formed in a shape having a V-shaped bottom surface.