JP2003324084A - Polishing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a polishing technology capable of suppressing the occurrence of scratching, peeling, dishing, and erosion and suppressing the costs of expendables such as abrasive and polishing cloth without requiring a complicated cleaning process or an abrasive supplying/processing device. <P>SOLUTION: A metallic film 21 formed on the surface of an insulating film 23 having grooves is polished by a polishing solution containing substances capable of dissolving oxidizing substances and oxides into water and not containing grinding grains. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to polishing a metal film, and more particularly to a polishing method in a wiring process of a semiconductor device.

[0002]

2. Description of the Related Art In recent years, a new fine processing technique has been developed in accordance with higher integration and higher performance of semiconductor integrated circuits (hereinafter referred to as LSI). Chemical mechanical polishing (hereinafter referred to as CMP)
The method is one of them, and flattening of the interlayer insulating film, metal plug formation,
This is a technique often used in the formation of embedded wiring. This technique is disclosed, for example, in US Pat. 49444836
Is disclosed in.

Recently, in order to achieve high-speed LSI performance, it has been attempted to use a low-resistance copper alloy as a wiring material instead of a conventional aluminum alloy.
However, it is difficult to perform fine processing on a copper alloy by a dry etching method which is frequently used for forming an aluminum alloy wiring. Therefore, a copper alloy thin film is deposited on the insulating film in which the groove is formed by processing, and the copper alloy thin film other than the portion embedded in the groove is removed by CMP to form a buried wiring.
The so-called damascene method is mainly adopted. This technique is disclosed in, for example, Japanese Patent Laid-Open No. 2-278822.

CMP of metal such as copper alloy used for wiring
The polishing agent used for is generally one containing solid abrasive grains and an oxidizing substance as main components. The basic mechanism of CMP is to mechanically remove the oxide by the solid abrasive while oxidizing the metal surface by the oxidizing action of the oxidizing substance. Regarding this, published by Science Forum Co., Ltd., edited by Masahiro Kashiwagi, "Science of CMP", August 1997
It is disclosed on page 299 issued on the 20th of each month.

As the solid abrasive grains, several tens to several hundreds nm
Alumina abrasive grains and silica abrasive grains having a particle size of are known, but most of the solid abrasive grains for metal polishing which are generally commercially available are the former.

As the oxidizing substance, hydrogen peroxide (H
₂ O ₂ ), ferric nitrate (Fe (NO ₃ ) ₃ ), and potassium periodate (KIO ₃ ) are generally widely used, and they are, for example, the above-mentioned 299 of “Science of CMP”.
Pp. 300-300.

[0007]

However, when wiring and plugs are formed by CMP using a conventional polishing agent containing solid abrasive grains for polishing a metal film as a main component, the following (1) to (8) are used. The problems listed in () are occurring.

(1) Phenomenon in which the central portion of the surface of the metal wiring embedded in the groove formed in the insulating film is dented due to excessive polishing compared to the peripheral portion (hereinafter referred to as dishing) and the surface of the insulating film around the wiring portion Occurs (hereinafter referred to as erosion) (FIGS. 5A and 5B).

Originally, the metal / insulating film selection ratio of a polishing agent for polishing a metal film is as high as 10 or more, but this value is only for a wafer on which only a flat metal film is formed and a flat insulating film. CMs using wafers on which
It is obtained by performing P and taking the ratio of the polishing rates of both.

However, it is known that in CMP of a wafer in which a metal film is deposited on an insulating film in which a groove to be a wiring pattern is formed, locally excessively polished portions occur. This is because the wafer surface before CMP has irregularities reflecting the grooves that will be the wiring pattern on the surface of the metal film.
This is because when CMP is performed, locally high pressure is applied according to the pattern density, and the polishing rate at that portion is increased.

Therefore, dicing or erosion becomes a serious problem in a pad (area of about 0.1 mm square) having a large area of a metal portion or a dense wiring pattern. These are Journal of Electrochemical Society Vol. 141, No. 10, October 1994, pages 2842 to 2848 (J. Electrochem. So.
c. Vol. 141, No. 10, October 1
994, p. 2842-p. 2848).

(2) Scratches (polishing scratches) are generated by the solid abrasive grains for polishing. In particular, alumina, which is the main material of the abrasive grains for metal polishing, has higher hardness than silicon oxide, which is the main material of the insulating film. Therefore, scratches occur not only on the surface of the wiring metal film but also on the surface of the insulating film exposed by CMP. Abrasive remains on the scratches on the surface of the insulating film to cause malfunction of the semiconductor device due to heavy metal ion contamination, or to affect the processed shape of the upper layer wiring to cause short circuit defects. In addition, scratches on the surface of the metal film cause poor conduction and deterioration of electromigration resistance.

In order to prevent scratches, a method of performing CMP by reducing the polishing load and the number of rotations of the platen has been adopted. However, it is difficult to prevent scratches even with this method using a soft metal such as copper.

Although scratches can be reduced by using a soft polishing cloth, dicing and erosion increase and flatness after CMP deteriorates. Therefore, there is also proposed a two-step CMP in which CMP is performed halfway with a hard polishing cloth and then final polishing is performed with a soft polishing cloth. However, in this case, a new problem arises that the throughput is reduced.

(3) When CMP is performed, a high frictional force is generated between the polishing abrasive grains and the surface of the metal film. Therefore, the coated glass (hereinafter referred to as SOG) between the metal film and the base insulating layer. Peeling occurs between the oxide film and the chemical vapor deposition (hereinafter referred to as CVD) oxide film. As a measure for preventing peeling, there is a method of lowering the polishing load and the number of rotations of the platen. In some cases, using a soft polishing cloth can solve the problem, but dicing and erosion increase, and CMP
Later flatness deteriorates.

(4) Since many polishing abrasive grains remain on the wafer surface immediately after CMP, cleaning is performed before the next step, and the cleaning is performed before the next step. The number of foreign substances must be removed to 100 or less). For this purpose, a washing machine that uses not only chemical washing but also mechanical washing was required.

The cleaning technique is very complicated as shown in FIG. 11, and brush cleaning and megasonic cleaning mainly using a chemical solution are performed. The brush material must be a special material that does not damage the surface of the metal film, and as the chemical liquid, for example, ammonium hydroxide or hydrofluoric acid aqueous solution is used.

The megasonic cleaning is a cleaning method in which a high frequency vibration of 800 kHz or more is added to the cleaning liquid to release the abrasive grains from the substrate, and is a stronger cleaning means than the conventional ultrasonic vibration (40 kHz) cleaning method. In this cleaning, it is necessary to apply enough energy or force to release the abrasive grains from the substrate. On the other hand, the output must be set in a range that does not damage the metal film or the insulating film.
As an example of the post-CMP cleaning process as described above, for example, “Monthly Semiconductor World (Semicond)
uctor World) ", May 1995, 172
It is disclosed on the page.

(5) The cost of consumables used for CMP is high. This is because the production cost of the abrasive grains used in the polishing agent is high, and it is necessary to be extremely careful to make the grain sizes uniform. In particular, alumina abrasive grains are several times more expensive than silica abrasive grains.

As the polishing cloth, generally, foamed polyurethane is used. When CMP is carried out, abrasive grains adhere to this polishing cloth, causing a so-called "clogging" phenomenon, and the polishing rate decreases.

In order to prevent this, it was necessary to grind the surface of the polishing cloth with a grindstone (hereinafter referred to as a conditioner) to which diamond particles were appropriately fixed. Therefore, the life of the polishing cloth was shortened, and it was a high-cost consumable item next to the polishing abrasive grains. Regarding the cost of the CMP process, for example, it is described in "Latest Technology Course of Realize Co., Ltd., May 1996," Latest Trends of CMP Equipment and Related Materials and Their Problems ".

(6) As a problem of the CMP-related apparatus and equipment, in addition to the CMP apparatus and the post-cleaning apparatus described above, a polishing agent supply apparatus and a processing apparatus for waste liquid containing polishing agent are required.
The cost of the entire P facility was very high. The abrasive agent supply device also required a stirring device for preventing the precipitation of abrasive grains, and a mechanism for constantly circulating the abrasive agent so as not to precipitate in the pipes. The waste liquid treatment cost is also high, and recycling technology is also required.

(7) The low throughput of the entire CMP process is also a problem. In the CMP apparatus, the conditioning of the polishing cloth, the primary CMP for polishing the metal film and the secondary CM for removing the exposed damaged layer on the insulating film surface
It is common to perform P (buffing). Since the above-mentioned post-cleaning device has brush cleaning, wafers are usually cleaned single-wafer. Therefore, the throughput of the entire CMP process is the lowest in the semiconductor device manufacturing process. CM
As an example of the process of the entire P process, for example, “Monthly Semiconductor World (Semiconductor W
Ord) ”, May 1995, p. 172.

(8) The CMP apparatus has a problem that it must be installed in a clean room even though it uses a large amount of abrasive grains that cause dust generation. C
The MP device is equipped with a mechanism that suppresses dust generation in the exhaust duct,
It is necessary to maintain the cleanliness by installing a special room in the clean room, which incurs costs.

All of the above problems are caused by performing CMP with an abrasive containing a high concentration of abrasive grains. However, the conventional CMP method oxidizes the metal surface with an oxidizing substance, and mechanically removes this oxide layer with abrasive grains to oxidize the newly exposed metal surface again to form an oxide layer. The mechanical removal was repeated to increase the polishing rate. That is, the abrasive grains are necessary for producing a mechanical removal effect for promptly removing the oxide layer, and a practical polishing rate could not be reached without adding the abrasive grains.

Japanese Patent Laid-Open No. 7-233485 discloses a polishing liquid containing no abrasive grains (0.1% by weight of aminoacetic acid and 1% by weight).
A comparative example is described in which CMP is carried out with 3% by weight hydrogen peroxide). The polishing rate in this case is 10 nm / min
And about 1/10 of the polishing liquid containing alumina polishing abrasive grains,
It is described that the polishing rate is about 2/7 that of a polishing liquid containing silica polishing abrasive grains.

FIG. 2 shows the result of the additional test based on the above publication. This is to reproduce the result of the above publication,
The dependency of the polishing rate and the etching rate on the hydrogen peroxide concentration was measured with a polishing liquid containing 0.1% by weight of aminoacetic acid and hydrogen peroxide (not containing abrasive grains). In addition,
In FIG. 2, the concentration of 30% hydrogen peroxide solution is shown, and in order to correspond to the drawing described in the above publication, it may be converted by multiplying by 0.3. Hard cloth IC1 from Rodel Co. as polishing cloth
000 was used. The number of rotations of the surface plate (surface plate diameter: 340 mm) and the holder are both 60 rpm, and the polishing load is 220 g /
cm ² (the same as the CMP conditions of the present invention). From the results of FIG. 2, it is at most 20 n when the abrasive grains are not included.
It can be seen that a practical polishing rate cannot be obtained at m / min. When the hydrogen peroxide concentration is low, the etching rate is high and the polishing stability becomes poor. On the other hand, if the hydrogen peroxide concentration is increased, the stability is increased, but the polishing rate is remarkably reduced, which is disadvantageous in terms of processing ability.

A more detailed examination shows that the etching rate of the still water solution (the etching rate when the stationary sample is dipped in the polishing solution without stirring) is completely zero even on the high concentration side of the hydrogen peroxide solution.
I also found that it was not. Also, when the polishing liquid is stirred and the etching rate is similarly measured (stirring liquid etching rate: close to the etching rate during CMP), it is found that the etching rate increases and exceeds 1/2 times the polishing rate.

Therefore, it has been found that the polishing liquid cannot be used as a polishing liquid unless the polishing rate is increased by containing the abrasive grains and the ratio between the polishing rate and the stirring etching rate (hereinafter, referred to as a rate ratio) is increased. If the speed ratio is low, the etching progresses in the recesses not in contact with the polishing surface and the flatness is impaired. As a result of actually performing CMP using these polishing liquids having different concentrations of hydrogen peroxide solution, polishing time of 40 minutes to 1 hour 30 minutes was required.

A sectional view of the formed copper wiring is shown in FIG. Most of the copper that should be left in the processed groove of the silicon oxide film is etched and eluted, and the meandering wiring (wiring width 0.
3 to 3 micrometers, length 40
mm), the yield test was 0%
Met. Therefore, it could not be used as an LSI wiring. This is because the polishing rate was slow and the etching proceeded during a long polishing time.

When the concentration of aminoacetic acid is increased, the polishing rate is increased, but at the same time, the stirring etching rate is also increased, which is the same as the above result. It is described in the above publication that potassium hydroxide may be added to make the polishing liquid alkaline to have a pH of 10.5 in order to suppress etching. But,
Since potassium hydroxide etches the silicon oxide film, the selection ratio is lowered and erosion occurs. Further, the remaining potassium ions diffuse in the insulating film, causing a problem that the characteristics of the semiconductor element are deteriorated.

The above-mentioned problems result from the fact that aminoacetic acid itself has a low property of making copper oxide water-soluble. This is based on the pH-oxidation-reduction potential diagram (M. Poolbay, “Atlas of Electrochemical Equilibria in Aquarius Solution” (M. Po
urbaix, "Atlas of Electroch
electrical Equilibria in Aqueo
us Solutions "), page 387, published by NACE, 1975. ), You can see
PH is the range where copper becomes water-soluble as copper ions (corrosion zone)
This is because aminoacetic acid is neutral and its effect is weak, while it is 7 or less.

FIG. 26 shows the difference in corrosion rate (etching rate) between the corrosion area and the passive area of copper. The solid line is Fig. 9
Shows the corrosion rate when the redox potentials are the same. As a representative example, the corrosion rate of a polishing liquid in which citric acid and hydrogen peroxide solution were mixed in the corrosion region and a polishing liquid in which aminoacetic acid and hydrogen peroxide solution were mixed in the passive state region were plotted. Both polishing liquids were prepared at an equimolar ratio and compared. As described above, in the corrosion area, copper is water-solubilized and ionized at a much higher rate than in the passive area.

Regarding this point, 1996 CMP-M
It is also described in IC Conference Proceedings, page 123. Actually, the above-mentioned paper describes that aminoacetic acid does not have an effect of etching copper oxide, but if it does not have an effect of making copper oxide water-soluble, copper oxide is not formed on the insulating film exposed after CMP. The remainder remains an electrical short circuit between wirings. If the polishing agent contains abrasive grains, the copper oxide can be easily removed by a mechanical action.

Although a conventional metal etching solution is in the above-mentioned corrosive region, it cannot always be used as it is as a CMP polishing solution for forming an LSI multilayer wiring. This is because, on the contrary, a CMP polishing liquid having a lower etching rate is more suitable. For example, Journal of Abrasive Processing, 19
1997, Vol. 41, No. 1, p. 231 to p. 233, it describes about the polishing experiment of the copper surface using nitric acid aqueous solution. Although the polishing rate is low without abrasive grains, it is said that it is suitable as a polishing liquid because scratches do not occur, but the etching rate of this polishing liquid has not been investigated, and the formation of wiring structures has not been performed. Not done. As a result of actually performing a supplementary test of this polishing liquid, the etching rate of still water of copper in a 1% nitric acid aqueous solution is 50 nm / min, which is a sufficiently large ratio to the polishing rate of about 80 nm / min described in the above journal. I couldn't get it. Further, when CMP was performed to form a buried wiring, copper in a portion which should be left as a wiring portion was also etched and almost disappeared. As described above, polishing can be performed with a polishing liquid whose etching rate is not controlled, but embedded wiring cannot be formed.

The present invention has been made in view of the above points, and (1) suppresses the occurrence of dicing and erosion during the formation of embedded wiring, (2) reduces damage such as scratches and (3) peeling, and (4) ) At least one of simplification of cleaning after CMP, (5) cost reduction of polishing liquid and polishing cloth, (6) simplification of polishing agent supply / treatment equipment, (7) high throughput, (8) low dust generation It is an object of the present invention to provide a polishing method and a semiconductor device manufacturing method capable of realizing the above-mentioned two.

[0037]

The above object is to provide a method for polishing a metal film in which a low concentration of polishing abrasive grains of less than 1% by weight is contained, even if it contains no polishing abrasive grains or contains polishing abrasive grains. This is accomplished by mechanically rubbing the surface of the metal film with a polishing liquid that is the corroded area of the film. If necessary, a substance that suppresses corrosion (anticorrosive substance) may be added to the polishing liquid.

The above-mentioned object is to machine the surface of a metal film by using a polishing liquid 1 containing an oxidizing substance (a substance having a function of robbing electrons of a metal to increase its valence) and a substance which makes an oxide water-soluble. It is achieved by friction. In this case, it can be applied to a metal film of Cu, W, Ti, TiN, Al or the like.

The above object is achieved by mechanically rubbing the surface of the metal film with the polishing liquid 2 containing a substance that makes the metal water-soluble. In this case, it can be applied to a metal film such as Al, which is a metal whose ionization tendency is lower than hydrogen. Examples of the substance that makes the metal water-soluble include acids such as hydrochloric acid and organic acids, and alkalis such as ammonium hydroxide. Further, copper, which has a higher ionization tendency than hydrogen, can also achieve the above object by using ammonium hydroxide as a substance that makes the metal water-soluble.

Since the pH and redox potential of the polishing liquid are in the metal corrosion region, the metal can be made water-soluble, and the metal residue on the surface of the insulating film exposed on the surface of the polishing substrate can be reduced. can do. The corroded area of each metal is described in the pH-oxidation-reduction potential diagram of the pool bay. For example, in the case of copper, if pH <7 and oxidation-reduction potential> 0.2 as shown in FIG. 9, it dissolves as Cu ²⁺ ions. Or C in the alkaline range where pH> 12.5
It dissolves as uO ^{22 −} ions. Therefore, when polishing copper, it is desirable to set it to any corrosion area.

However, the Pool Bay diagram is of the H ₂ O system, and when other reactants are contained in the polishing liquid, the range occupied by the corrosion region in the pH-redox potential diagram changes. The corrosion region shown in the present invention is defined by whether the polishing liquid, including such additives, contains a substance in the range of pH and redox potential that corrode metals. When the polishing liquid contains both a corrosive substance and an anticorrosive substance, the former falls into the corrosive region shown in the present invention.

When CMP is performed with the polishing liquid 1 containing the above substances, the metal surface is first oxidized by the oxidizing substance,
A thin oxide layer is formed on the surface. Then, when a substance that makes the oxide water-soluble is supplied, the oxide layer becomes an aqueous solution and is eluted, and the thickness of the oxide layer is reduced. The portion where the oxide layer becomes thin is again exposed to the oxidizing substance to increase the thickness of the oxide layer, and CMP progresses by repeating this reaction. At that time,
Since the convex portion 50 on the metal surface as shown in (a) is always subjected to mechanical friction of the polishing cloth, the reaction product on the surface is easily removed, and the reaction is promoted due to local heating, The above-mentioned repeated oxidation / water-solubilization reaction proceeds faster than in the recess 49. That is, the polishing rate of the convex portion 50 is increased and the surface is flattened.

The anticorrosive substance has the effect of adhering to the metal surface and suppressing the reaction of the recesses, and finally improving the flatness. Even if the anticorrosive substance is added, if the polishing liquid is in the corroded area of the pool bay diagram, the above reaction proceeds on the convex part of the metal surface where the anticorrosive substance has been removed due to the friction of the polishing cloth, and finally the surface is flattened. To be done. That is, the polishing liquid has both the corrosive property and the anticorrosive property, and the mechanical friction of the polishing cloth exerts both effects on the CM.
The point of control during P is important. The concentration of the anticorrosive substance added to the polishing liquid may be such that the anticorrosive substance attached to the convex portions of the metal surface is removed by mechanical friction of the polishing cloth. As a measure of the added concentration, it is desirable that the polishing rate be maintained at 50 nm / min or more and the stirring etching rate be several nm / min or less (rate ratio is about 50). If added at a higher concentration, the CMP rate may decrease.
However, if the polishing rate is sufficiently high without addition and the etching rate is as low as several nm / min or less, polishing can be performed with good flatness without adding an anticorrosive substance.

While the conventional CMP method oxidizes the metal surface with an oxidizing substance and mechanically removes this oxide layer with abrasive grains, the polishing rate is increased. By adding a substance that makes the oxide water-soluble instead of reducing the grain concentration, a practical polishing rate can be obtained substantially only by the mechanical friction of the polishing cloth.

The above objects (1) to (8) are achieved in the following range of abrasive grain concentration.

The above-mentioned object (1) of suppressing dicing and erosion is achieved by setting the concentration of the above-mentioned abrasive grains to 0.05% by weight or less.

The above-mentioned (2) the purpose of reducing the scratches generated on the surface of the insulating film is achieved by setting the concentration of the above-mentioned abrasive grains to less than 1% by weight.

The purpose of (2) reducing the scratches generated on the surface of the metal film is to reduce the concentration of the abrasive grains to 0.1.
It is achieved by adjusting the content to be not more than weight%.

The above-mentioned purpose (3) of reducing peeling is achieved by setting the concentration of the above-mentioned abrasive grains to 0.5% by weight or less.

The above object (4) of improving the cleaning property is achieved by setting the concentration of the above-mentioned abrasive grains to 0.01% by weight or less.

The purpose (5) of reducing the cost of the polishing liquid and the polishing cloth is achieved by setting the concentration of the polishing abrasive grains to 0.001% by weight or less.

The purpose of solving the above-mentioned problem (6) of the abrasive supply / treatment facility is to adjust the concentration of the above-mentioned abrasive grains to 0.000.
It is achieved by making it 1% by weight or less.

The above object (7) of improving the throughput is achieved by setting the concentration of the abrasive grains to 0.01% by weight or less.

The purpose (8) of suppressing dust generation is achieved by not adding the above-mentioned abrasive grains.

As the above-mentioned oxidizing substance, hydrogen peroxide is most preferable because it does not contain a metal component and is not a strong acid.
Although ferric nitrate and potassium periodate contain metal components, they have strong oxidizing power and therefore have an effect of increasing the polishing rate.

As a substance for making the above oxides water-soluble, there is an acid, which is a metal ion (for example, Cu 2+ surface type).

The organic acid or its salt has low toxicity and is easy to handle as a polishing liquid. For example, citric acid, phthalic acid,
Organic acids represented by acetic acid, lactic acid, tartaric acid and salts thereof can be mentioned. It is desirable that the salt has the effect of increasing the solubility and does not contain a metal component, for example, an ammonium salt or a salt that does not adversely affect the semiconductor element (for example, aluminum).

Of the above-mentioned acids, citric acid is generally used as a food additive, has low toxicity, has little harm as a waste liquid, has no odor, and has a high solubility in water, so that the polishing of the present invention is possible. Desirable as the acid used in the liquid.

Since phthalic acid has low solubility in water, it is desirable to make it into a salt. However, it is necessary to keep the polishing liquid in the metal corrosive region even if the pH is changed to salt. For example, when phthalic acid is used as a polishing liquid for copper, hydrogen phthalate in which only one of the two carboxyl groups in the phthalic acid molecule is substituted will increase the solubility in water and increase the acidity of the pH. It is suitable as a polishing liquid because it can be kept in the (corrosion region). With phthalates substituted with two carboxyl groups, the polishing liquid becomes almost neutral and the CMP rate decreases. The same applies to other organic acids.

The above-mentioned oxidizing substance and the substance which makes the oxide water-soluble may be one kind as long as it is a drug having both actions. An example is nitric acid, which dissolves copper.
By reducing the amount of the added chemical liquid, it becomes possible to reduce the time and cost required for preparing the polishing liquid. It is also possible to mix other oxidizing substances such as hydrogen peroxide to increase the oxidizing power.

The water-soluble substance of the above oxide may contain any one of ammonium hydroxide, ammonium nitrate and ammonium chloride. When the polishing liquid contains ammonium ions, the corrosion region changes as shown above, and Cu (N
It has a function of dissolving copper as H ₃ ) ²⁺ ions. Incidentally, Cu-NH ₃ -H pH- redox potential diagram for the ₂ O system, for example, Journal of Electrochemical Chemical Sosaetei, 142 vol, No. 7, July 1995, 23
81 pages (J. Electrochem. Soc. Vo
l. 142, No. 7, July, 1995, p. 23
81).

Examples of substances that suppress oxidation and etching include anticorrosive substances and surfactants. Any substance can be used as long as it is a substance capable of suppressing etching by mixing in a polishing liquid and obtaining a sufficient polishing rate. In particular, benzotriazole (hereinafter referred to as BTA) is most effective as an anticorrosive substance for copper alloys. Other practically usable products include tolyltriazole (hereinafter referred to as TTA) and BTA.
BTA such as carboxylic acid (hereinafter referred to as BTA-COOH)
, Cystine, haloacetic acid, glucose, dodecyl mercaptan and the like also have an anticorrosive effect.

Means for applying the above mechanical friction is 1% by weight
It is possible to use a polishing cloth that does not supply the above polishing abrasive grains to the polishing liquid. Although the optimum hardness of the polishing cloth varies depending on the object to be CMP'd, for example, if a 0.1 mm square copper electrode pattern is formed by the damascene method and the allowable dicing amount is 100 nm or less, polishing is performed with a load to perform CMP. When the cloth is pressed against the opening of 0.1 mm square, the polishing cloth is compressed and pushed out from the opening of 100 n.
It is preferably m or less. A hard polishing cloth satisfies this condition, and by using this, dicing can be suppressed. Note that the damascene method is a technique in which a metal film is formed over an insulating film having an opening and then polished to leave the metal film inside the opening.

However, a soft polishing cloth may be used when forming a plug having a maximum size of about 1 μm.
The hardness of the polishing cloth is preferably as high as possible so that scratches and peeling do not occur, but a polishing cloth with a hardness that is soft enough to follow irregularities on the substrate surface other than the wiring and plug patterns, such as wafer warpage. Need to be

The upper limit of the polishing abrasive grains supplied from the polishing cloth differs depending on the purposes (1) to (8) above, similarly to the abrasive grain concentration of the polishing liquid. For example, the purpose (1) of suppressing dicing and erosion is achieved by setting the abrasive grain concentration to 0.05% by weight or less.

Here, a polishing liquid having a polishing rate of 10 nm / min or less is not practical for producing a wiring structure because it takes 80 minutes to perform CMP of a metal film having a thickness of 800 nm, for example, and the above-mentioned throughput is required. Since it does not solve the above problem and the cost problem, it is not defined as a polishing liquid in the present invention.

The ratio of polishing rate to etching rate is 5
It is preferably twice or more, and more preferably 10 times or more. If it is less than this, even if the polishing rate is high, the wiring structure cannot be produced with high dimensional accuracy due to the etching action generated during CMP. The etching rate is preferably several nm / min or less.

In the present invention, C of a copper alloy or an aluminum alloy, which easily causes scratches, dicing, erosion, etc.
Although most effective in MP, other metal CMP, such as tungsten and tungsten alloys, titanium and titanium alloys (particularly titanium nitride), are also effective in reducing scratches generated on the insulating film.

[0069]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be specifically described below with reference to the drawings.

(Embodiment 1) In this embodiment, a method of forming a copper wiring by performing CMP of copper will be described. FIG. 1 is a schematic diagram showing a CMP apparatus used in an embodiment of the present invention. The structure is such that the holder 12 supporting the wafer 14 is rotated by the backing pad 18 on the surface plate 11 to which the polishing cloth 17 is attached to perform the CMP. A retainer ring 13 is provided so that the wafer does not come off during CMP. The polishing load during CMP was 220 g / cm ² , and the rotation numbers of the surface plate and the holder were both 60 rpm. The polishing load and the number of rotations are not limited to this. Generally, the polishing rate is increased by increasing the load and the number of rotations of the platen, but scratches are likely to occur as shown in FIG. However, in the present invention, since the abrasive grain concentration is low or not included, the occurrence of polishing scratches against a load is small. Hard cloth IC1000 manufactured by Rodel was used as the polishing cloth.

The polishing liquid of the present invention is the first one provided on the surface plate.
CMP is performed by dropping it from the supply port 15 onto the polishing cloth at a rate of about 30 cc / min. No. 1 when CMP is completed
Is closed to stop the supply of the polishing liquid, and pure water is supplied from the second supply port 16 at a rate of about 3000 cc / min to rinse for 15 to 30 seconds. Thereafter, megasonic cleaning is performed in a state where the wafer is not dried, the polishing liquid is removed, and then the wafer is dried.

First, the polishing characteristics of the polishing liquid of the present invention were examined using a wafer on which no wiring pattern was formed. The sample is a silicon oxide film having a thickness of 200 nm formed on a silicon wafer, and then a TiN film having a thickness of 50 nm and a Cu film having a thickness of 800 nm are continuously formed as an adhesive layer in a vacuum by a sputtering method. The wafer diameter is 4 inches.

The polishing liquid used in this example is a mixture of an oxidizing substance and an organic acid which is a substance for making an oxide water-soluble. Hydrogen peroxide solution (30% H ₂
O ₂ aqueous solution) and citric acid was used as the organic acid. Citric acid has the advantage of being highly soluble in water. In order to optimize the mixing ratio, the polishing rate and the etching rate were investigated by changing the concentration. The temperature of the polishing liquid is room temperature. The etching rate is the rate at which the copper surface is etched when the sample is immersed in the polishing liquid, and if the etching progresses excessively during CMP, the wiring structure will not be formed, and thus the etching rate is preferably as low as possible. As for the etching rate, the hydrostatic solution etching rate and the stirring solution etching rate were examined as in FIG.
The polishing rate and the etching rate were calculated from the change in electric resistance.

FIG. 3 shows the results of examining the hydrogen peroxide concentration dependence of the polishing liquid. The citric acid concentration was constant at 0.03% by weight. The ratio between the polishing rate and the hydrostatic solution etching rate is also shown. The polishing rate is 10% hydrogen peroxide concentration.
The maximum value of 84 nm / min is shown at the volume%, but since the etching rate is a low value of 5 nm / min or less at 5 volume% or less, the ratio of the polishing rate to the etching rate is 5 volume%. The highest ratio of 30 was 30.
10 nm with hydrogen peroxide alone or citric acid alone
The polishing rate is not higher than / min, which is not a sufficient polishing rate for the purpose of forming embedded wiring. That is, it is necessary that both citric acid and hydrogen peroxide solution are contained. Therefore, a copper-embedded wiring pattern was prepared by using a polishing liquid prepared by mixing pure water with 5% by volume of hydrogen peroxide and 0.03% by weight of citric acid. As shown in FIG. 9, the polishing liquid is in the copper corrosion area.

FIG. 4A shows an example of the cross-sectional structure of the sample for forming the buried wiring before polishing. A BPSG film (silicon oxide film to which boron and phosphorus are added) 24 having a thickness of 500 nm and a silicon oxide film 23 having a thickness of 500 nm are formed on a silicon substrate 25 on which an impurity doped layer and an insulating film are formed, and a lithography process is performed. And a groove pattern for wiring having a depth of 500 nm is formed on the silicon oxide film 2 by a dry etching process.
Formed within 3. After forming a TiN layer 22 having a thickness of 50 nm as an adhesive layer thereon, a copper thin film 2 having a thickness of 800 nm is formed.
1 was continuously deposited in vacuum by a sputtering method. Further, in order to improve the step coverage, vacuum heat treatment was carried out at 450 ° C. for 30 minutes in the sputtering apparatus. Impurity-doped layers such as sources and drains are formed on the silicon substrate 25, but they are not shown here.

This sample was subjected to CMP using a polishing liquid in which pure water was mixed with 5% by volume of hydrogen peroxide and 0.03% by weight of citric acid. As a result, as shown in FIG. It was possible to process into a shape with dicing or erosion of about 50 nm or less. As a result of measuring the electrical resistivity of the formed copper wiring, a value of 1.9 micro ohm centimeter including the TiN layer was obtained. Conduction / insulation test is performed using meandering wiring (wiring width 0.3 μm to 3 μm, length 40 mm) and comb-shaped wiring (wiring interval 0.3 μm to 3 μm, length 40 mm). As a result, a yield of almost 100% was obtained.

Next, an example in which a copper plug is formed by the polishing liquid of the present invention will be shown. The film forming method and the CMP conditions are the same as the above-mentioned embedded wiring forming method. 17 (a) to 1
The structure of the copper plug with a diameter of 0.5 micrometers formed in FIG. 17A is a sectional structure before CMP, FIG. 17B is a sectional structure after CMP, and FIG.
Is the structure seen from above. In the case of a plug, since the opening of the insulating film is 1 μm or less, a soft polishing cloth (for example, Suba800 or XHGM11 manufactured by Rodel Co.) is used.
58), it could be formed without dicing or erosion as shown in FIG. Hard polishing cloth (IC10
It goes without saying that you can use 00).

The CMP end point could be detected without any problem. When the end point detection method was performed based on the change of the rotation torque of the polishing platen of the CMP apparatus or the wafer holder, the signal shown in FIG. 23 was obtained. About 350
It can be determined from the fact that the polishing of Cu is completed after a lapse of seconds, and the torque signal strength becomes strong at the stage of polishing TiN, and the strength decreases at a time of about 400 seconds thereafter.

Further, the end point could be detected based on the change in the optical spectrum of the polishing liquid after the polishing treatment. The polishing liquid before the polishing treatment is transparent, but by polishing copper, copper ions are dissolved in the polishing liquid and the polishing liquid becomes blue. Therefore, as shown in FIG. 24, as a result of measuring the optical signal intensity of the polishing liquid flowing out after the polishing treatment at a wavelength of 725 nm,
It was found that when the polishing was completed, the strength decreased and the end point could be detected. In the conventional polishing liquid to which abrasive grains are added, the polishing liquid becomes cloudy, which makes it difficult to measure the change in the optical spectrum. It was also possible to make a hole in a part of the polishing cloth and detect the end point based on the change in the light reflection spectrum from the wafer surface. Also in this case, if the polishing liquid contains abrasive grains, the signal becomes noisy due to the cloudy polishing liquid adhering to the wafer surface, which makes measurement difficult.

In this embodiment, hydrogen peroxide was used as the oxidizing agent, but a wiring structure can be formed by using ferric nitrate or potassium periodate instead of hydrogen peroxide. However, measures against iron and potassium contamination are necessary.

Further, a polishing liquid containing any one of ammonium hydroxide, ammonium nitrate and ammonium chloride is used for CM.
Even if P was performed, a buried wiring structure could be similarly formed.

(Example 2) In this example, a method of adding an anticorrosive substance to the polishing liquid used in Example 1 to further improve polishing characteristics will be described. The addition of the anticorrosive substance lowers the etching rate shown in FIG. 3 and further increases the ratio of the polishing rate to the etching rate. This makes it possible to prevent the copper surface from being excessively etched during CMP, and to prevent the copper polishing surface from being oxidized after CMP.

BTA was used as the anticorrosive agent. 0.1% of BTA was added to a polishing liquid in which pure water was mixed with 5% by volume of hydrogen peroxide and 0.03% by weight of citric acid. Even if BTA is added, the pH and oxidation-reduction potential of the polishing liquid hardly change, and the polishing liquid is in the copper corrosion region shown in FIG. As a result of investigating the etching rate of copper in the same manner as in Example 1, it was possible to reduce the etching rate to about 1/6 of that before the addition of BTA. Therefore, as a result of performing CMP using this polishing liquid under the same conditions as in Example 1, it was possible to suppress the corrosion of the copper polishing surface and form the embedded wiring shown in FIG. As a result of measuring the electrical resistivity of the formed copper wiring, a value of 1.9 micro ohm centimeter including the TiN layer was obtained. In addition, meandering wiring (wiring width 0.3 μm to 3 μm, length 40 mm) and comb-shaped wiring (wiring interval 0.3 μm to 3 μm, length 40 mm)
As a result of conducting a continuity / insulation test using, a yield of almost 100% was obtained.

In addition, over CMP is performed for a long time (for example, 2
16 times, it was observed that with the polishing liquid containing no BTA, the copper wiring portion was etched to a depth of about 100 nm and recessed from the surrounding insulating film portion as shown in FIG. 16 (a). , BTA was added, it was possible to suppress to several tens nm or less as shown in FIG. The over CMP is performed so that no polishing residue remains on the entire wafer.

A wiring structure could be prepared in the same manner even when the polishing liquid was concentrated. For example, a mixture of 30% by volume hydrogen peroxide solution, 0.15% by weight citric acid and 0.3% BTA in pure water was good. If the polishing liquid is thick,
There was an effect of improving the polishing uniformity in the wafer. The uniformity when the polishing liquid was diluted was 10% or more, whereas the uniformity of the concentrated liquid was 8% or less. However, the dilute solution has the effect that the polishing solution can be produced at a low cost.

Also, when ammonium hydroxide is used as the substance for making the metal water-soluble, the above effect can be obtained by using the polishing liquid containing BTA, and the embedded copper wiring can be formed.

Example 3 In this example, the effect of suppressing the dicing and erosion by reducing the abrasive grain concentration was examined. The polishing liquid of Example 2 (5% by volume of hydrogen peroxide solution, 0.03% by weight of citric acid, and 0.1% of BTA mixed in pure water), and this polishing liquid as a comparative example were used for alumina polishing. The thing which added 2.5% of particles (particle diameter: about 200 nm) was prepared.
Embedded wirings were formed using these polishing solutions in the same manner as in Example 2, and the wiring width dependence of the dishing amount and the erosion amount defined in FIG.
A cross-sectional photograph of a wiring having a length of 0 μm and a length of 400 μm was taken by a scanning electron microscope (SEM) and measured. The measurement results are shown in FIGS. 6A and 6B.
The cross-sectional shape drawn based on the SEM observation is shown in FIG.

From FIGS. 6 (a) and 6 (b), both the dishing amount and the erosion amount tend to increase as the wiring width becomes thicker. However, by eliminating the alumina abrasive grains, the dishing amount was reduced to about half, and the width was 4 μm. The amount of erosion of the wiring of less than or equal to a meter was reduced to a level (10 nm or less) that could hardly be observed by SEM. Figure 8
From the comparison between (a) and (b), a remarkable difference is observed in the wiring width of 90 μm.

Next, the dependency of the amount of dicing and the amount of erosion on the alumina abrasive grain concentration was investigated. Both values were measured according to the definitions shown in FIG. Alumina abrasive grain concentration is 0.000
1% by weight, 0.001% by weight, 0.01% by weight, 0.0
5% by weight, 0.1% by weight, 0.5% by weight, 1% by weight of 7
Different kinds of polishing liquid were prepared. As a result, when the alumina abrasive grain concentration was 0.05% by weight or less, both values were about the same as those of the polishing liquid containing no alumina abrasive grains, and within the error range (20 nm or less) of FIG. In agreement with the results. From this, it was found that by performing CMP using a polishing liquid having an alumina abrasive grain concentration of 0.05 wt% or less, a buried wiring structure with suppressed dicing and erosion can be formed.

Example 4 In this example, the effect of suppressing scratches by reducing the abrasive grain concentration was examined. The polishing liquid of Example 2 (5% by volume of hydrogen peroxide solution, 0.03% by weight of citric acid, and 0.1% of BTA mixed with pure water) and alumina abrasive grains (particle size: Approx. 200 nm) 0.0001
% By weight, 0.001% by weight, 0.01% by weight, 0.05
%, 0.1%, 0.5%, 1%, 2.
A polishing liquid containing 5% by weight and 5% by weight was prepared. Using these polishing liquids, CMP was performed on the surface of the copper thin film having no wiring pattern and the surface of the silicon oxide film.

As a result, on the surface of the silicon oxide film which was CMP-processed with a polishing liquid having an alumina abrasive grain concentration of 1% by weight or more,
As shown in FIG. 25, 100 to 1000 point scratches per wafer were observed with an optical microscope.
The number of wafers subjected to CMP with a polishing liquid having an alumina abrasive grain concentration of not more than wt% was suppressed to about several wafers. Since the size of scratches is 1 μm or less, a scratch number of this level is not a problem for the purpose of forming a wiring structure.

Next, scratches formed on the copper surface were examined. C with a polishing liquid having an alumina abrasive grain concentration of 0.5% by weight or more
Linear scratches that could be visually identified were generated on the copper surface subjected to MP. The number of scratches generated per wafer tended to increase as the alumina abrasive grain concentration increased. C with a polishing liquid having an alumina abrasive grain concentration of 0.1% by weight
The number of scratches generated on the wafer subjected to MP is several, but this sample was observed by SEM on the wafer cross section and AF was performed.
As a result of observing the unevenness of the surface with M (atomic force microscope),
It was found that the scratch depth was about 100 nm. 1 because the depth of the embedded copper wiring is 500 nm
00 nm scratches are a problem.

The visually discernible scratches disappeared on the copper surface subjected to CMP with a polishing liquid having an alumina abrasive grain concentration of 0.1% by weight or less. As a result of observing these samples by SEM and AFM, it was found that the scratch depth was about 10 nm. At this level, the electric resistance of the wiring is hardly affected.

Further, since it is possible to reduce the occurrence of scratches, it is possible to increase the polishing load and the number of rotations of the platen, and it is possible to increase the polishing rate.

An embedded wiring was actually formed in the same manner as in Example 1 using a polishing liquid having an abrasive grain concentration of 0.1% by weight or less.
Serpentine wiring (wiring width 0.3 μm to 3 μm, length 40 mm) and comb-shaped wiring (wiring spacing of 0.
3 to 3 micrometers, length 40
The result of conducting / insulation test was about 10 mm.
A yield of 0% was obtained.

(Embodiment 5) In this embodiment, the effect of suppressing peeling by reducing the abrasive grain concentration was examined. The polishing liquid of Example 2 (5
A mixture of pure water containing 0.1% by volume of hydrogen peroxide, 0.03% by weight of citric acid and 0.1% of BTA), and 0.0001% by weight and 0.001% by weight of alumina abrasive grains. ,
0.01% by weight, 0.05% by weight, 0.1% by weight, 0.
A polishing liquid containing 5% by weight, 1% by weight, 5% by weight and 10% by weight was prepared. The sample used was a copper thin film with a thickness of 800 nm formed by sputtering on a silicon oxide film with a TiN layer having a thickness of 5 nm (1/10 of the thickness in Example 1) interposed therebetween. This sample was subjected to CMP using the above polishing liquid.

As a result, peeling occurred between the copper layer and the TiN layer from the peripheral portion of the wafer subjected to CMP with a polishing liquid having an alumina abrasive grain concentration of 1% by weight or more. The cause is considered to be the frictional force generated between the alumina abrasive grains and the copper surface. 0.5% by weight
The wafer subjected to CMP with a polishing liquid having the following alumina abrasive grain concentration had a reduced frictional force and did not peel at all.
Further, when the occurrence of peeling is reduced, the polishing load and the number of rotations of the platen can be increased, and the polishing rate can be increased.

Therefore, a buried wiring was formed in the same manner as in Example 2 using a polishing liquid having an abrasive grain concentration of 0.5% by weight or less. As the sample, a sample in which the TiN layer 22 of FIG. 4 has a thickness of 5 nm was used. As a result, the embedded wiring could be formed without peeling of the copper thin film.

Example 6 In this example, the effect of improving the cleaning property by reducing the abrasive grain concentration was investigated. The polishing liquid of Example 2 (5% by volume of hydrogen peroxide solution, 0.03% by weight of citric acid, and 0.1% of BTA mixed with pure water) and 0.0001 of alumina abrasive grains were added thereto. % By weight, 0.001% by weight, 0.01% by weight, 0.05% by weight, 0.1% by weight,
A polishing liquid containing 0.5% by weight, 1% by weight, 5% by weight and 10% by weight was prepared. The copper thin film and the TiN thin film formed on the silicon oxide film are removed by CMP with these polishing liquids, and the surface of the silicon oxide film exposed on the surface is washed with pure water. ) Was investigated using a face plate defector. The number of defects per wafer having a size of 0.2 μm or more was measured.
The size of the wafer is 4 inches.

As a result, as shown in FIG. 10, the number of defects decreases as the alumina abrasive grain concentration decreases. If the concentration is 0.01% by weight or less, the number of defects is 10 only by megasonic cleaning.
It was found that the number could be reduced to 0 or less. Conventionally, since the alumina abrasive grain polishing liquid having a concentration of 1% by weight or more has been used, the number of defects is reduced to 100 or less by using brush cleaning of polyvinyl alcohol (PVA) and megasonic cleaning together. Therefore, polishing with a polishing liquid having an abrasive grain concentration of 0.01 wt% or less has the effect of reducing the number of cleaning steps. Alternatively, the same washing process as the conventional one is effective in reducing the number of foreign matters.

(Embodiment 7) This embodiment shows that the number of CMP treatment steps can be reduced by reducing the abrasive grain concentration. FIG. 11 shows a CMP processing step when a conventional polishing liquid is used. In a conventional CMP apparatus, for example, the alumina abrasive grain concentration is as high as 1% by weight or more, and the polishing cloth is conditioned for several tens of seconds to several minutes before the CMP in order to prevent the abrasive cloth from being clogged. Was there.

For the purpose of removing the damaged layer on the surface of the insulating film such as the silicon oxide film exposed by polishing, the CMP of the insulating film is performed for several tens of seconds to 2 minutes after the metal CMP for forming the buried wiring layer. I was about to go. afterwards,
Without drying the wafer, the process moves to the cleaning step, and the first brush cleaning is performed with an ammonia solution for the purpose of removing the abrasive grains. Further, a second brush cleaning with dilute hydrofluoric acid (HF) is performed in order to remove metal contamination of the damaged layer on the surface of the insulating film such as a silicon oxide film. Finally, the wafer was dried after removing the abrasive grains to a target level by megasonic cleaning.

FIG. 12 shows the entire CMP process in the case of using the polishing liquid containing a low concentration polishing abrasive grain of less than 0.01% by weight according to the present invention. In the CMP apparatus, almost no clogging of the abrasive grains occurs, so conditioning is almost unnecessary except when a new polishing cloth is used. When the abrasive grain concentration was increased by 1/10, the life of the polishing cloth was increased by 10 times. Further, since the damage layer due to scratches on the surface of the silicon oxide film is eliminated, the CMP of the insulating film is also unnecessary. In the cleaning process, it was possible to clean to the conventional level (number of defects) only by megasonic cleaning.

As a result of evaluation of heavy metal contamination by total reflection X-ray fluorescence, it was possible to clean up to the conventional level also in this point only by megasonic cleaning. Finally conventional CMP
Compared with the process, the process time was shortened by about half. The process of FIG. 12 can be practically used if the abrasive grain concentration is 0.01% by weight or less, but 0.005% by weight or less is desirable.

(Embodiment 8) In this embodiment, the effect of reducing the cost of the polishing cloth and the polishing agent by reducing the abrasive grain concentration was investigated.

The alumina polishing agent for copper CMP has a CMP time of 5 minutes including the over-polishing time, and when the polishing agent is supplied into the CMP apparatus at a rate of 100 cc / min, one CM is obtained.
1 liter of P is used. Moreover, one polishing cloth is consumed by about 400 CMP. Furthermore, a post-cleaning device is required in addition to the CMP device.

FIG. 13 shows a breakdown of CMP-related costs when performing CMP using a conventional polishing liquid having an alumina abrasive grain concentration of 1% by weight or more. It can be seen that unlike other semiconductor-related devices, the cost of consumable polishing cloth and polishing agent accounts for about 70% of the total cost.

On the other hand, in the polishing liquid of the present invention, by reducing the concentration of alumina abrasive grains to 0.001% or less, C
MP-related costs can be significantly reduced. Although the cost of the chemical liquid added to the polishing liquid is necessary, it is about 1/100 of the cost of the conventional alumina polishing agent. The cost of the polishing cloth can also be reduced because the frequency of conditioning that has been conventionally performed is reduced.

With respect to the CMP apparatus, if the alumina abrasive grain concentration is 0.0001% or less, the equipments such as the polishing agent supply device, the polishing agent stirring mechanism, and the polishing agent processing device are not necessary, and the alumina polishing grain concentration becomes zero. If this is the case, it will not be necessary to take measures to prevent dust generation in the clean room, resulting in cost reduction compared to conventional products. As for the cleaning device, the conventional brush cleaning is not necessary, and the cost is about half. From the above results, by using the polishing liquid of the present invention, about 7
It is possible to reduce the cost by 0%.

Example 9 In this example, nitric acid and BTA were used.
A method of forming a buried copper wiring with a polishing liquid using is explained. Nitric acid has an oxidizing effect on copper, and because it is possible to make copper water-soluble by the nature of the acid of nitric acid itself,
It is possible for one chemical solution to have the two functions of the present invention. BTA has the effect of suppressing etching as in Example 2, and can increase the ratio of the polishing rate to the etching rate. This makes it possible to prevent the copper surface from being excessively etched during CMP and prevent the copper polished surface from being excessively oxidized after CMP. The concentration of the polishing liquid was nitric acid: 0.2% by volume, BTA: 0.
This is an aqueous solution prepared by mixing 01% by weight with pure water. As shown in FIG. 9, the polishing liquid is in the copper corrosion area.

As a result of examining the etching rate of copper in the same manner as in Example 1, it was possible to reduce the etching rate to about 1/6 by adding BTA. Then, using this polishing liquid, CMP was performed under the same conditions as in Example 1, and as a result, it was possible to suppress the corrosion of the copper polishing surface and form the embedded wiring. As a result of measuring the electrical resistivity of the formed copper wiring, a value of 1.9 micro ohm centimeter including the TiN layer was obtained. Conduction / insulation test is performed using meandering wiring (wiring width 0.3 μm to 3 μm, length 40 mm) and comb-shaped wiring (wiring interval 0.3 μm to 3 μm, length 40 mm). As a result, a yield of almost 100% was obtained.

Further, with the polishing liquid containing no BTA, a phenomenon was observed in which the copper wiring portion was etched and recessed from the surrounding insulating film portion (especially when the nitric acid concentration was as high as 1% or more, copper disappeared). ) And BTA were used, it was possible to suppress the thickness to several tens of nm or less as shown in FIG.

When alumina abrasive grains are added to this polishing liquid,
Scratches occurred on the copper-polished surface at a concentration of more than 0.1% by weight and on the silicon oxide film at a concentration of more than 1% by weight. Further, peeling occurred when CMP was performed on a copper thin film having an underlying TiN layer of 5 nm with a polishing liquid having a concentration exceeding 0.5% by weight.
It was possible to prevent scratches and peeling by reducing the alumina abrasive grains to these concentrations or less. Further concentration 0.0
It has been found that if the amount is 1% by weight or less, the number of defects can be reduced to 100 or less only by megasonic cleaning, and brush cleaning with a chemical solution is unnecessary.

Next, the dicing amount and the erosion amount of the embedded wiring formed were evaluated. Similar to the results shown in FIG. 6, when the alumina abrasive grain concentration was 0.05% by weight or less, both values were about the same as those of the polishing liquid containing no alumina abrasive grains, and the error range (20 nm or less) In Fig. 6 (b)
Matched with. Therefore, by performing CMP using this polishing liquid, a buried wiring structure and a plug structure with suppressed dicing and erosion as shown in FIGS. 4 and 17 could be formed.

(Example 10) In this example, the polishing liquid of Example 9 (nitric acid: 0.5% by volume, BTA: 0.01% by weight).
Then, a laminated wiring structure was produced, and an experiment showing its effect was conducted. As a comparative experiment, CMP using a polishing liquid containing 1% by weight of conventional alumina abrasive grains was also performed.

FIG. 14 shows a two-layer wiring structure obtained as a result of performing CMP with a conventional polishing liquid. A semiconductor element in which diffusion layers such as a source and a drain are formed in the silicon substrate portion 25 is manufactured, but it is omitted here (not shown in FIGS. 15 to 20). First-layer wiring 21
Due to the dicing 36, erosion 37, and scratches on the surface of the insulating film portion 23 caused by the dents on the surface, the surface of the insulating film 35 formed thereon has unpolished portions 32, 33, and 34 of the metal film, respectively. The polishing residue occurred as a problem of electrical short circuit between the copper wirings 31 of the second layer. In addition, 39 is a TiN layer and 52 is an insulating film layer of a through hole layer.

On the other hand, as shown in FIG. 15, such a problem did not occur in the sample subjected to CMP with the polishing liquid containing no abrasive grains. Since there is no TiN layer on the copper wiring, copper may diffuse in the silicon oxide film and contaminate the semiconductor element. To prevent this, a silicon nitride film having a thickness of 50 nm is formed on the copper wiring, but it is not shown in FIGS. 14 and 15 (also omitted in FIGS. 18, 19, and 20). .

FIG. 18 shows a portion in which the first-layer wiring 21 and the second-layer wiring 31 are connected by the copper plug 40. Each layer including the plug was prepared by performing CMP with the above-mentioned polishing liquid. The problem of electrical short circuit due to dicing, erosion and scratch as shown in FIG. 14 did not occur at all. Further, the polishing liquids described in Examples 1 and 2 were also able to form the multilayer wiring in the same manner.

As shown in FIG. 20, the plug portion can be formed of a tungsten film having a high covering property by the CVD method. However, tungsten has a seam 43 at the center of the plug.
(Sometimes called a keyhole etc.) is easily formed,
From there, the polishing liquid may soak into the interior and cause a problem of corroding the underlying copper wiring 21 in an instant. Figure 20
The state is shown in (a). Reference numeral 44 is a corroded copper wiring portion. In that case, a copper anti-corrosion agent in the tungsten polishing liquid,
For example, by adding BTA, it was possible to prevent the corrosion of the copper wiring before the polishing liquid soaked in the tungsten was removed in the cleaning step. The result is shown in FIG. Further, since the polishing liquid does not contain abrasive grains, the abrasive grains do not remain in the seam.

FIG. 19 shows a case of using the dual damascene method.
The sample in which the layer wiring is formed is shown. This is a technique in which the plug for the first layer wiring and the second layer wiring are manufactured by one-time polishing. Here, after polishing the first wiring layer with the above polishing liquid, the plug and the second wiring layer are also CM with the above polishing liquid.
It was produced by performing P. 41 is a plug part formed by dual damascene. The problem of electrical short circuit due to dicing, erosion and scratch as shown in FIG. 14 did not occur at all. Further, the polishing liquids described in Examples 1 and 2 were also able to form the multilayer wiring in the same manner.

In FIG. 21, the tungsten plug 4 is formed on the impurity-doped layer 45 of the silicon substrate using the polishing liquid of the present invention.
2 is formed and connected to the copper wiring 21. It was confirmed that by forming the multilayer wiring on the upper layer as described above, the semiconductor elements were connected to each other to fabricate the LSI and operate.

[0122]

EFFECT OF THE INVENTION With the polishing liquid containing no abrasive grains of the present invention, C
The method of performing MP is a polishing agent containing conventional abrasive grains
Compared with the method of performing P, it has an effect of suppressing scratches, peeling, dicing, and erosion, and does not require a high-level cleaning process or an abrasive supply / treatment device, so that consumables such as abrasives and polishing cloths can be used. It is possible to suppress the cost and perform CMP at a practical polishing rate.

[Brief description of drawings]

FIG. 1 is a diagram showing a CMP apparatus embodying the present invention.

FIG. 2 is a diagram showing hydrogen peroxide concentration dependence of a polishing rate and an etching rate of copper when CMP is performed by a conventional method.

FIG. 3 is a diagram showing hydrogen peroxide concentration dependence of a polishing rate and an etching rate of copper when CMP is performed by the method of the present invention.

4A is a diagram showing a sectional structure of a wiring portion of a sample before CMP, FIG. 4B is a diagram showing a sectional structure of a wiring portion of the sample after CMP, and FIG. 4C is a plan view of the sample after CMP. It is a figure. The dotted line is the cross-sectional position of (b).

5A is a diagram showing dishing, and FIG. 5B is a diagram showing erosion.

6A and 6B are diagrams showing effects of the present invention, in which FIG. 6A is an erosion amount and dishing amount of a sample subjected to CMP by a conventional method, and FIG. 6B is an erosion amount of a sample subjected to CMP in the method of the present invention. Amount and dishing amount.

7A is a sectional view of a sample subjected to CMP by a conventional method, and FIG. 7B is a sectional view of a sample subjected to CMP by the method of the present invention.

8A is a sectional view of a sample subjected to CMP by a conventional method, and FIG. 8B is a sectional view of a sample subjected to CMP by the method of the present invention.

FIG. 9 is a pH-oxidation-reduction potential diagram of copper.

FIG. 10 is a diagram showing the dependence of the number of defects on a wafer in the concentration of alumina abrasive grains in a polishing liquid.

FIG. 11 is an explanatory diagram showing a conventional CMP process.

FIG. 12 is an explanatory diagram showing a CMP process of the present invention.

FIG. 13 is a diagram showing the effect of reducing CMP-related costs according to the present invention.

14A is a diagram showing a cross-sectional structure of a sample in which a multilayer wiring is formed by a conventional polishing liquid, and FIG. 14B is a plan view of the sample. The dotted line is the cross-sectional position of (a).

15A is a diagram showing a cross-sectional structure of a sample in which multilayer wiring is formed by the polishing liquid of the present invention, and FIG. 15B is a plan view of the sample. The dotted line is the cross-sectional position of (a).

16A is a diagram showing a cross-sectional structure of a sample in which a wiring portion is etched by over CMP, and FIG. 16B is a diagram in which etching is suppressed by an anticorrosive substance.

17A is a diagram showing a sectional structure of a plug portion of a sample before CMP, FIG. 17B is a diagram showing a sectional structure of a plug portion of the sample after CMP, and FIG. 17C is a plan view of the sample after CMP. It is a figure. The dotted line is the cross-sectional position of (b).

18A is a diagram showing a cross-sectional structure of a sample in which a multilayer wiring is formed by the polishing liquid of the present invention, and FIG. 18B is a plan view of the sample. The dotted line is the cross-sectional position of (a).

19A is a diagram showing a cross-sectional structure of a sample in which a multilayer wiring is formed by the polishing liquid of the present invention by a dual damascene method, and FIG. 19B is a plan view of the sample. The dotted line is the cross-sectional position of (a).

FIG. 20 (a) is a diagram showing a state in which the underlying copper wiring is corroded by the polishing liquid of tungsten when the tungsten plug is formed by the polishing liquid of the present invention;
FIG. 3 is a diagram showing a state in which corrosion is prevented by adding BTA to a polishing liquid for tungsten.

FIG. 21 is a cross-sectional view of a sample showing a state where a plug and a wiring are formed on a diffusion layer of a substrate with the polishing liquid of the present invention.

FIG. 22 (a) is a CM using an aminoacetic acid-based polishing liquid.
FIG. 3B is a cross-sectional view of the wiring portion of the sample subjected to P, and FIG. The dotted line is the cross-sectional position of (a).

FIG. 23 is a diagram showing the results of end point detection from the torque signal intensity of the CMP apparatus using the polishing liquid of the present invention.

FIG. 24 is a diagram showing results of end point detection from optical signal intensity using the polishing liquid of the present invention.

FIG. 25 is a diagram showing polishing load dependence of the number of scratches generated on a silicon oxide film when CMP is performed using a polishing liquid containing abrasive grains.

FIG. 26 is a diagram showing a difference in corrosion rate between a corrosion area and a passive area of copper.

[Explanation of symbols]

11 ... Polishing surface plate, 12 ... Wafer holder, 13 ... Retainer, 14 ... Wafer, 15 ... Polishing liquid supply port, 16 ... Pure water supply port, 17 ... Polishing cloth, 18 ... Backing pad, 21 ...
Cu, 22 ... TiN, 23: Si in the wiring layer portion of the first layer
O ₂ film, 24 ... BPSG film, 25 ... Si substrate on which impurity-doped layer or insulating film is formed, 31 ... Cu wiring of second layer,
32 ... The polishing residue of the metal film formed in the recess of the insulating film of the second layer due to the dicing of the Cu wiring of the first layer, 33 ... 1
The metal film formed in the recess of the second insulating film due to erosion in the vicinity of the Cu wiring of the second layer is left unpolished, and is formed in the recess of the second insulating film by scratching the surface of the first insulating film 34 ... Polished metal film remains, 35 ... S of the second layer
io ₂ film, 36 ... Dicing of Cu wiring of the first layer, 37
... Erosion near the Cu wiring of the first layer, 38 ... Scratch on the surface of the insulating film of the first layer, 39 ... TiN of the second layer, 4
0 ... Plug, 41 ... Plug formed by dual damascene, 42 ... Tungsten, 43 ... Seam, 44 ...
Corrosion part of the first layer copper wiring, 45 ... Impurity doped layer, 4
8 ... A portion where copper is eluted and the insulating film is exposed, 49 ... A concave portion on the surface of the metal film, 50 ... A convex portion on the surface of the metal film, 52 ... Through between the first wiring layer and the second wiring layer Insulation film for hole layer.

Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H01L 21/306 H01L 21/88 K 21/3205 M 21/768 21/90 A 21/306 M (72) Inventor Sakuma Noriyuki Tokyo, Kokubunji City, 1-280, Higashi Koikeku, Central Research Laboratory, Hitachi, Ltd. (72) Inventor Kenichi Takeda 1-280, Higashi Koikeku, Kokubunji City, Tokyo, Hitachi Ltd. Central Research Laboratory (72) Inventor Kenji Hinode Tokyo Metropolitan Government 1-280, Higashi-Kengokubo, Kokubunji F-Term (Central), Central Research Laboratory, Hitachi, Ltd. (Reference) 3C058 AA07 CA01 CB02 DA02 DA12 5F033 HH11 HH12 HH33 JJ01 JJ11 JJ19 JJ33 KK01 KK11 KK33 Q49 QQQQQQQQQQQQQQQQQQQQQQQQQQQQQQQQQQQQQQQQQQQQQQQQQQ QQ50 QQ73 QQ85 QQ91 QQ98 RR04 RR06 RR15 TT02 WW04 XX00 XX01 XX02 XX03 XX13 XX14 XX18 XX20 XX21 XX28 XX31 XX34 5F043 AA27 BB18 DD16

Claims (9)

[Claims] 1. A step of forming a wiring groove in an insulating film on a semiconductor substrate, and a step of forming a first metal film in the groove and on the insulating film and a second metal film on the first metal film. And a step of polishing and flattening the convex portion of the second metal film to leave the second metal film in the groove, and polishing the first metal film to remove the first metal film on the insulating film. Then, in the method of manufacturing a semiconductor device, which comprises a step of leaving the groove in the groove, in the step of polishing and planarizing the convex portion of the second metal film, a polishing liquid containing nitric acid, benzotriazole, and an oxidizer is used. A method of manufacturing a semiconductor device, which comprises polishing with a liquid. 2. The method of manufacturing a semiconductor device according to claim 1, wherein the second group film contains copper, an alloy containing copper as a main component, or a copper compound. 3. The method of manufacturing a semiconductor device according to claim 1, wherein the first metal film is a substance containing titanium nitride. 4. The method of manufacturing a semiconductor device according to claim 1, wherein the oxidizing agent is a substance containing hydrogen peroxide, ferric nitrate, and potassium periodate. 5. The method of manufacturing a semiconductor device according to claim 1, wherein the polishing liquid contains a surfactant. 6. The polishing method according to claim 1, wherein the polishing liquid contains polishing abrasive grains having a concentration of less than 1% by weight. 7. The polishing method according to claim 1, wherein the polishing liquid contains polishing abrasive grains at a concentration of 0.1% by weight or less. 8. The polishing method according to claim 1, wherein the polishing liquid contains polishing abrasive grains in a concentration of 0.01% by weight or less. 9. The polishing method according to claim 1, wherein the polishing liquid does not contain polishing abrasive grains.