JP2003322625A - Method and apparatus for inspecting semiconductor chip - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce a time for processing an image data and quickly inspect defects on surfaces of semiconductor chips accommodated in a tray. <P>SOLUTION: A tray mounting part 61 for mounting and fixing the small tray 2 is provided on a platform 60. Elevation mechanisms 62a, 62b, 62c, 62d elevate four corners of the platform 60 and incline the small tray 2. Vibrators 63a, 63b, 63c, 63d vibrate the small tray 2. Each semiconductor chip 1 accommodated in the small tray 2 moves within an accommodating part of the small tray 2 in one direction by a vibration applied in an inclined state of the small tray 2 and is approximately aligned with the same position within each accommodating part. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip inspection method and a semiconductor chip inspection method for inspecting the surface of a semiconductor chip manufactured by dicing a semiconductor wafer for abnormalities such as chipping and adhesion of foreign matter. Regarding inspection equipment.

[0002]

2. Description of the Related Art A conventional semiconductor device is generally one in which lead wires are connected to input / output terminals of a semiconductor chip and the entire semiconductor chip is covered with a resin mold. In recent years, due to the demand for miniaturization of semiconductor devices, a chip size package (Chip Size Package) in which a protective film or the like is formed on the surface of a semiconductor chip and is not covered with a resin mold
e) is becoming mainstream. Chip size packages include wire bonding and flip chip (Flip
It is mounted on the substrate by a technique such as Chip Attach. In particular, the flip chip is a mounting method in which the protruding electrodes formed on the input / output terminals are directly bonded to the electrode terminals of the board, which not only reduces the size of the semiconductor device but also reduces the mounting area of the semiconductor device on the board. Therefore, high-density mounting becomes possible.

With the spread of such chip size packages, there are increasing opportunities to handle semiconductor chips in a state of being diced from a semiconductor wafer. When shipping semiconductor chips diced from a semiconductor wafer or when processing semiconductor chips diced from a semiconductor wafer, chip chips, burrs, or foreign substances are attached to the surface of the semiconductor chips before shipping or before processing. It must be inspected for abnormalities such as.

Conventionally, a visual inspection of a semiconductor chip after dicing has been conducted by a visual inspection by an inspector. recent years,
An inspection apparatus using an image processing apparatus has been proposed, for example, JP-A-5-152406 and JP-A-8-1458.
There is a 95 publication. It is expected that such an inspection apparatus will become more and more important as the number of opportunities for handling semiconductor chips diced from a semiconductor wafer increases in the future.

[0005]

Generally, when shipping semiconductor chips after dicing or moving to the next step, a plurality of semiconductor chips are housed in a tray and transported. Therefore, it is efficient to perform a visual inspection of the semiconductor chip when the semiconductor chip is stored in the tray. All of the inspection devices described in the above documents are inspection devices that inspect the semiconductor chips stored in the tray.

The tray for storing the semiconductor chips has a plurality of storage portions, and each storage portion is made with a sufficient size so that the semiconductor chips can be taken in and out. Therefore, the semiconductor chips stored and transported in the tray move in the storage portion of the tray during transportation, and the positions in the storage portion of the tray are different one by one. Japanese Unexamined Patent Publication No. 8-145895 discloses a technique for preventing displacement of a semiconductor chip when capturing an image signal. However, none of the above documents mentions how to process and inspect an image of a semiconductor chip that has been misaligned in the tray storage.

When an abnormality is detected from the image data of the semiconductor chips, a method of comparing the image data of the semiconductor chips adjacently stored in the tray with each other or a comparison with the image data of the semiconductor chip prepared in advance without any abnormality. There are possible ways to do this. In any case, before the comparison, the reference position of the semiconductor chip is detected from the image data of the semiconductor chip having a different position in the storage portion of the tray, and the coordinate conversion of the image data is performed based on the detected reference position. There is a need. Therefore, if the positions of the semiconductor chips in the storage portion of the tray are greatly different, the amount of data to be processed is increased when the reference position of the semiconductor chip is detected and the coordinate conversion is performed, and the processing time of the image data is lengthened. . Further, when the rotation of the semiconductor chip is corrected by coordinate conversion, the luminance information of each pixel is changed and an error occurs. Therefore, if the rotation angle of the semiconductor chip is large, the accuracy of detecting an abnormality decreases.

An object of the present invention is to shorten the processing time of image data and inspect the surface abnormality of the semiconductor chips housed in the tray in a short time.

Another object of the present invention is to reduce the error caused by the correction of the rotation of the semiconductor chip and accurately detect the abnormality of the surface of the semiconductor chip housed in the tray.

[0010]

According to the semiconductor chip inspection method of the present invention, a plurality of semiconductor chips are stored in a tray having a plurality of storage portions, and after aligning the positions of the respective semiconductor chips in the storage portion of the tray, Acquire the image of the semiconductor chip stored in the tray, create image data including coordinate information,
The coordinate information of the reference position of the semiconductor chip is detected from the created image data, the coordinate information of the created image data is corrected based on the detected coordinate information of the reference position of the semiconductor chip, and the corrected image data Is compared with comparison data including coordinate information to detect an abnormality on the surface of the semiconductor chip.

The semiconductor chip inspection apparatus of the present invention is
A stage that mounts a tray in which semiconductor chips are stored in a plurality of storage units, a position alignment unit that aligns the positions of the trays of the semiconductor chips in the storage unit, and an illumination light of the semiconductor chips in the tray mounted in the stage. Illuminating means for irradiating the surface, image detecting means for detecting reflected light or scattered light from the surface of the semiconductor chip and outputting an image signal, memory for storing comparison data including coordinate information, and image detecting means The output image signal is processed to create image data including coordinate information, the coordinate information of the reference position of the semiconductor chip is detected from the created image data, and the coordinate information of the created image data is detected. Is corrected based on the coordinate information of the reference position, and the corrected image data is compared with the comparison data stored in the memory to detect an abnormality on the surface of the semiconductor chip. It is obtained by a image signal processing means.

By aligning the positions of the respective semiconductor chips in the storage portion of the tray, the data to be processed when detecting the coordinate information of the reference position of the semiconductor chip from the image data and when correcting the coordinate information of the image data. The amount has decreased,
Image data processing time is shortened. Further, by aligning the positions of the respective semiconductor chips in the storage portion of the tray, the difference in the rotation angle of the respective semiconductor chips is reduced, so that the error caused by the correction of the rotation of the semiconductor chips is reduced.

If the position aligning means includes means for inclining the tray obliquely and means for vibrating the tray,
By using a simple device, the positions of the trays of the respective semiconductor chips can be aligned within the storage portion of the tray. Further, by applying vibration while inclining the tray at an angle, each semiconductor chip can be reliably moved in the storage portion of the tray, and the positions of the semiconductor chips in the storage portion of the tray can be surely aligned.

If the position aligning means is provided at a place different from the stage, the position of the semiconductor chip of the next tray can be aligned during the inspection of the semiconductor chips housed in one tray. Therefore, without affecting the inspection time,
The positions of the trays of the semiconductor chips can be aligned in the storage portion.

On the other hand, if the aligning means is provided on the stage, it is not necessary to move the tray to the stage after aligning the positions of the respective semiconductor chips, so there is no fear that the position of the semiconductor chips once aligned will be displaced by the movement of the tray.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 3 is a top view of the semiconductor chips stored in the tray. The plurality of semiconductor chips 1 are stored in the small tray 2, and the plurality of small trays 2 are further stored in the large tray 3. Although FIG. 3 shows an example in which 20 semiconductor chips 1 are stored in the small tray 2, any number of semiconductor chips may be stored in the small tray 2. Although FIG. 3 shows an example in which 12 small trays 2 are stored in the large tray 3, the number of small trays stored in the large tray 3 may be any number.
In the embodiment described below, the case where the semiconductor chip inspection device inspects the semiconductor chip 1 in the small tray 2 will be described. However, the semiconductor chip inspection device further stores the small tray 2 in the large tray 3. You may inspect in the condition.

FIG. 4 is a top view of the semiconductor chips housed in the small tray. The arrow in FIG. 4 indicates the scanning direction of the semiconductor chip inspection apparatus. The semiconductor chips CH1, CH2, CH3, CH4, C are moved by the movement of the XYZ-θ stage of the semiconductor chip inspection apparatus equipped with the small tray 2.
H5 sequentially moves to the measurement location of the semiconductor chip inspection device.

FIG. 5 is a view showing a state in which the semiconductor chips are stored in the small tray. FIG. 5A shows a case where the semiconductor chip 1 is located substantially in the center of the storage portion 2 a of the small tray 2. 5B and 5C show the semiconductor chip 1
Is rotating in the storage portion 2a of the small tray 2. FIG. 5D shows a case where the semiconductor chip 1 is located in the storage portion 2a of the small tray 2 with a position offset to the lower right of the drawing. When the position of each semiconductor chip 1 in the storage portion 2a of the small tray 2 is different as described above, the abnormality can be accurately detected even when the image data of the semiconductor chip 1 is compared with the prepared comparison data. Can not. Therefore, in the present embodiment, the coordinates of the reference position of the semiconductor chip 1 are obtained from the image data created by acquiring the image of the semiconductor chip 1 after aligning the positions of the small trays 2 of the respective semiconductor chips 1 in the storage portion 2a. The information is detected, and the coordinate information of the image data is corrected based on the coordinate information of the reference position of the semiconductor chip 1.

First, FIG. 1 is a perspective view of a position aligning mechanism according to an embodiment of the present invention, and FIG. 2 is a perspective view of a position aligning mechanism having a small tray mounted thereon. The alignment mechanism is a pedestal 60.
And a lifting mechanism 62a, 62b, 62c, 62d and a vibrator 63a, 63b, 63c, 63d.

The pedestal 60 is provided with a tray mounting portion 61 for mounting and fixing the small tray 2. Lifting mechanism 62
The a, 62b, 62c, and 62d are attached to the four corners of the pedestal 60, and the four corners of the pedestal 60 are raised and lowered to
Tilt the small tray 2 mounted on the tray in any direction. In addition,
The pedestal 60 may be configured to fix the small tray 2 by a pressing tool, vacuum suction or the like instead of the tray mounting portion 61. Further, the lifting mechanism does not necessarily have to be provided at the four corners of the pedestal 60 as long as the small tray 2 mounted on the pedestal 60 can be tilted at an angle.

Vibrators 63a, 63b, 63c, 6
3d is a lifting mechanism 62a, 62b, 62c, 6 respectively.
2d, the lifting mechanism 62a, 62b,
Vibration is applied to the small tray 2 via the 62c and 62d and the pedestal 60. The semiconductor chips 1 accommodated in the small tray 2 move in one direction within the accommodation portion of the small tray 2 by being vibrated while the small tray 2 is inclined. Then, each semiconductor chip 1 is, for example, as shown in FIG.
As shown in (d), the small trays 2 are in a state of being offset to the corners of the storage portions 2a, and are aligned at substantially the same position in each storage portion 2a.

According to the present embodiment, it is possible to align the positions of the semiconductor chips in the tray accommodating portion in a short time using a simple device. Further, by vibrating the tray while inclining the tray obliquely, the semiconductor chips can be reliably moved in the storage portion of the tray, and the positions of the semiconductor chips in the storage portion of the tray can be surely aligned. However, if tilting the tray is sufficient, the vibrator is not needed. Further, the vibrator may be attached to one or a plurality of lifting mechanisms, or may be attached to the pedestal.

Next, FIG. 6 is a diagram showing a schematic configuration of a semiconductor chip inspection apparatus according to an embodiment of the present invention. The small tray 2 in which the positions of the semiconductor chips in the storage unit are aligned by the alignment mechanism of FIG. 1 is mounted on the XYZ-θ stage 10. XYZ-θ stage 1
0 is movable in the X direction, the Y direction, the Z direction, and the θ direction. The stage drive circuit 11 is controlled by the stage control circuit 220 in the personal computer 200, and drives the XYZ-θ stage 10.
By moving the XYZ-θ stage 10 in the X direction and the Y direction, the plurality of semiconductor chips in the small tray 2 are moved one by one to the measurement location of the semiconductor chip inspection apparatus.
Further, by moving the XYZ-θ stage 10 in the Z direction and the θ direction, focus adjustment on the surface of the semiconductor chip of the semiconductor chip inspection apparatus is performed.

The bright-field light source 20 produces illumination light containing light of a predetermined wavelength. As the bright-field light source 20, either a white light source or a laser device may be used. The illumination light from the bright-field light source 20 passes through the condenser lens 21, and then enters the bright-field color filter 23. The bright-field color filter 23 transmits light in a specific wavelength range of the incident light and blocks other light. The light transmitted through the bright-field color filter 23 is reflected by the half mirror 25, passes through the condenser lens 22, and is vertically irradiated to the surface of the semiconductor chip placed at the measurement location.

On the other hand, the dark-field light source 30 generates illumination light containing light having a wavelength different from the wavelength of light transmitted by the bright-field color filter 23. As the dark-field light source 30, either a white light source or a laser device may be used. When both the bright-field light source 20 and the dark-field light source 30 are laser devices, the wavelengths of the laser light generated by the both are different. The illumination light from the dark-field light source 30 is collected by the condenser lens 31.
After passing through, the light enters the dark field color filter 33. The dark-field color filter 33 transmits, of the incident light, light in a wavelength range different from that of the bright-field color filter 23, and blocks other light. The light transmitted through the dark field color filter 33 passes through the condenser lens 32 and is obliquely applied to the surface of the semiconductor chip placed at the measurement location. Although only one set of the dark field light source 30, the condenser lenses 31 and 32, and the dark field color filter 33 is shown in FIG. 6, a plurality of sets may be provided around the measurement place.

The light applied to the surface of the semiconductor chip is reflected and scattered by the surface of the semiconductor chip, and reflected light and scattered light are generated from the surface of the semiconductor chip. As for the light radiated perpendicularly to the surface of the semiconductor chip, most of the reflected light reaches the condenser lens 22, and the scattered light hardly reaches the condenser lens 22 because the directions are scattered. Regarding the light obliquely irradiated to the surface of the semiconductor chip, the reflected light hardly reaches the condenser lens 22, but a part of the scattered light reaches the condenser lens 22.

The reflected light and scattered light that have reached the condenser lens 22 pass through the condenser lens 22, pass through the half mirror 25, and enter the half mirror 35. Half mirror 35
Transmits half of the incident light and reflects half of it. The light transmitted through the half mirror 35 enters the bright field color filter 24. The bright-field color filter 24 has the same filter characteristics as the bright-field color filter 23. Therefore, of the light incident on the bright field color filter 24, the reflected light of the illumination light generated from the bright field light source 20 is transmitted, and the scattered light of the illumination light generated from the dark field light source 30 is blocked.

On the other hand, the light reflected by the half mirror 35 enters the dark field color filter 34. The dark-field color filter 34 has the same filter characteristics as the dark-field color filter 33. Therefore, of the light that has entered the dark-field color filter 34, the reflected light of the illumination light generated from the bright-field light source 20 is blocked and the scattered light of the illumination light generated from the dark-field light source 30 is transmitted.

FIG. 7 is a diagram showing the relationship between the transmittance of the color filter and the wavelength. Curve B in FIG. 7 is the bright-field color filter 2.
3 and 24 show the filter characteristics, and curve D shows the filter characteristics of the dark-field color filters 33 and 34. When both the bright-field light source 20 and the dark-field light source 30 are laser devices, the wavelength of the laser light of the bright-field light source 20 is selected in the wavelength range that the bright-field color filters 23 and 24 pass through to select the dark-field. The wavelength of the laser light of the light source 30 is selected in the wavelength range that the dark field color filters 33 and 34 transmit.

In FIG. 6, the image sensor 40 detects the reflected light that has passed through the bright field color filter 24 and creates a bright field image signal by converting the intensity of the detected light into an electric signal. On the other hand, the image sensor 50 detects the scattered light that has passed through the dark field color filter 34 and creates a dark field image signal by converting the intensity of the detected light into an electric signal. These image sensors 40 and 50 may be either one-dimensional image sensors such as line sensors or two-dimensional image sensors such as cameras.

The bright field image signal output by the image sensor 40 and the dark field image signal output by the image sensor 50 are
It is input to the image signal processing device 100. The image signal processing device 100 includes a CPU 110, a memory 120, and a bus 13.
0, a bright field image signal processing circuit 140, and a dark field image signal processing circuit 150. CPU11
0 is a memory 120, a bright field image signal processing circuit 140, and a dark field image signal processing circuit 15 via a bus 130.
Control 0. The memory 120 stores in advance bright field image comparison data including coordinate information and dark field image comparison data including coordinate information.

The bright field image signal processing circuit 140 processes the bright field image signal output from the image sensor 40 to create bright field image data including coordinate information. Next, the bright field image signal processing circuit 140 detects the coordinate information of the reference position of the semiconductor chip from the created bright field image data.
The reference position of the semiconductor chip may be an alignment mark provided on the surface of the semiconductor chip, or an edge or corner of the semiconductor chip. Then, the bright field image signal processing circuit 140 corrects the coordinate information of the bright field image data based on the detected coordinate information of the reference position of the semiconductor chip. As a result, even if the position of each semiconductor chip in the storage portion of the small tray 2 is slightly different, the coordinate information of the corrected bright-field image data is constant for each point on the surface of the semiconductor chip. Then, the bright-field image signal processing circuit 140 reads the comparison data of the bright-field image stored in the memory 120 via the bus 130, compares the corrected bright-field image data with the comparison data, and compares them. A point where data differs by a predetermined value or more in the coordinate information is detected as an abnormality. In this way, chip defects, burrs, relatively large foreign matter, etc. are detected from the bright field image. The bright field image signal processing circuit 140 notifies the CPU 110 of the detection result via the bus 130.

On the other hand, the dark field image signal processing circuit 150 is
The dark field image signal output from the image sensor 50 is processed to create dark field image data including coordinate information. Next, the dark field image signal processing circuit 150 inputs the coordinate information of the reference position of the semiconductor chip detected by the bright field image signal processing circuit 140 via the bus 130. Subsequently, the dark field image signal processing circuit 150 corrects the coordinate information of the dark field image data based on the input coordinate information of the reference position of the semiconductor chip. As a result, even if the position of each semiconductor chip in the storage portion of the small tray 2 is slightly different, the coordinate information of the corrected dark field image data becomes constant for each point on the surface of the semiconductor chip. Then, the dark field image signal processing circuit 1
The reference numeral 50 reads the comparison data of the dark field image stored in the memory 120 via the bus 130, compares the corrected dark field image data with the comparison data, and the data has the same coordinate information and is equal to or larger than a predetermined value. Detect different points as abnormal. In this way, minute foreign matter that is difficult to detect in the bright field image is detected from the dark field image signal. The bright field image signal processing circuit 150 notifies the CPU 110 of the detection result via the bus 130.

When the processing of the bright field image signal processing circuit 140 and the dark field image signal processing circuit 150 for one semiconductor chip is completed, the CPU 110 notifies the CPU board 210 of the personal computer 200 of the detection result. The CPU board 210 stores the detection result in the storage device of the personal computer 200, displays it on the display device, or outputs it by the output device. The stage control circuit 220 of the personal computer 200 instructs the stage drive circuit 11 to drive the XYZ-θ stage 10,
As shown by the arrow in FIG. 4, the next semiconductor chip moves to the measurement location of the semiconductor chip inspection apparatus.

According to the present embodiment, the alignment mechanism is set to X
By providing it separately from the -Y-Z-θ stage, the positions of the semiconductor chips in the next tray can be aligned during the inspection of the semiconductor chips housed in one tray. Therefore,
It is possible to align the positions of the trays of the semiconductor chips in the storage portion without affecting the inspection time.

FIG. 8 is a diagram showing a schematic configuration of a semiconductor chip inspection apparatus according to another embodiment of the present invention. The present embodiment is different from the embodiment shown in FIG. 6 in that the alignment mechanism is provided on the XYZ-θ stage 10. Others are the same as those of the embodiment shown in FIG.

According to the present embodiment, since it is not necessary to move the tray to the XYZ-θ stage after aligning the positions of the semiconductor chips, the position of the semiconductor chips once aligned is displaced by the movement of the tray. Don't worry. Also, X-
The Z-direction moving mechanism of the YZ-θ stage can also be used as the elevating mechanism of the alignment mechanism.

According to the embodiment described above, by aligning the positions of the respective semiconductor chips in the storage portion of the tray, it is possible to detect the coordinate information of the reference position of the semiconductor chip from the image data and the coordinate information of the image data. When correcting, the amount of data to be processed is reduced, and the processing time of image data is shortened. Further, by aligning the positions of the respective semiconductor chips in the storage portion of the tray, the difference in the rotation angle of the respective semiconductor chips is reduced, so that the error caused by the correction of the rotation of the semiconductor chips is reduced.

Further, according to the embodiment described above,
The coordinate information of the reference position of the semiconductor chip is detected from the bright field image data, and the coordinate information of the bright field image data and the dark field image data is corrected based on the detected coordinate information of the reference position of the semiconductor chip. Even if the position of the chip in the storage portion of the tray is slightly different, the abnormality can be detected by comparing the bright-field image data and the dark-field image data with the comparison data. Therefore, it is possible to detect chips such as chips and burrs by the bright-field image and fine foreign matters that are difficult to detect in the bright-field image by the dark-field image. Since the abnormality detection by the bright-field image and the abnormality detection by the dark-field image are performed at the same time, the detection accuracy can be improved as compared with the case of only one of them, and the inspection time is shortened as compared with the case of performing both separately. be able to. Further, by making a part of the detection optical system that detects the reflected light from the surface of the semiconductor chip and a part of the detection optical system that detects the scattered light in common, it is possible to reduce the size of the entire device.

[0040]

According to the present invention, the processing time of image data is shortened, and the abnormality of the surface of the semiconductor chip housed in the tray can be inspected in a short time.

Further, according to the present invention, since the error caused by the correction of the rotation of the semiconductor chip is reduced, it is possible to accurately detect the abnormality of the surface of the semiconductor chip housed in the tray.

[Brief description of drawings]

FIG. 1 is a perspective view of a position alignment mechanism according to an embodiment of the present invention.

FIG. 2 is a perspective view of an alignment mechanism having a small tray.

FIG. 3 is a top view of a semiconductor chip stored in a tray.

FIG. 4 is a top view of semiconductor chips housed in a small tray.

FIG. 5 is a diagram showing a storage state of semiconductor chips in a small tray.

FIG. 6 is a diagram showing a schematic configuration of a semiconductor chip inspection apparatus according to an embodiment of the present invention.

FIG. 7 is a diagram showing the relationship between the transmittance of a color filter and the wavelength.

FIG. 8 is a diagram showing a schematic configuration of a semiconductor chip inspection apparatus according to another embodiment of the present invention.

[Explanation of symbols]

1 ... Semiconductor chip, 2 ... Small tray, 3 ... Large tray, 10
... XYZ-θ stage, 11 ... Stage drive circuit,
20 ... Bright-field light source, 21, 22, 31, 32 ... Condensing lens, 23, 24 ... Bright-field color filter, 25, 35 ...
Half mirror, 30 ... Dark field light source, 33, 34 ... Dark field color filter, 40, 50 ... Image sensor, 60 ... Pedestal, 61 ... Tray mounting part, 62a, 62b, 62c, 6
2d ... Elevating mechanism, 63a, 63b, 63c, 63d ... Vibrator, 100 ... Image signal processing device, 110 ... CP
U, 120 ... Memory, 130 ... Bus, 140 ... Bright-field image signal processing circuit, 150 ... Dark-field image signal processing circuit, 2
00 ... Personal computer, 210 ... CPU board, 220 ... Stage control circuit

Claims (5)

[Claims] 1. A plurality of semiconductor chips are accommodated in a tray having a plurality of accommodating parts, the positions of the semiconductor chips in the accommodating part of the trays are aligned, and an image of the semiconductor chips accommodated in the tray is acquired. , Create image data including coordinate information, detect the coordinate information of the reference position of the semiconductor chip from the created image data, and generate the image data of the created image data based on the coordinate information of the detected reference position of the semiconductor chip. A method for inspecting a semiconductor chip, which comprises correcting coordinate information, and comparing the corrected image data with comparison data including the coordinate information to detect an abnormality on the surface of the semiconductor chip. 2. A stage on which a tray having semiconductor chips stored in a plurality of storage sections is mounted, a position aligning unit for aligning the positions of the trays of the semiconductor chips in the storage section, and illumination light is mounted on the stage. Illuminating means for irradiating the surface of the semiconductor chip in the tray, image detecting means for detecting reflected light or scattered light from the surface of the semiconductor chip and outputting an image signal, and memory for storing comparison data including coordinate information And processing the image signal output by the image detection means to create image data including coordinate information, detecting the coordinate information of the reference position of the semiconductor chip from the created image data, and the coordinates of the created image data The information is corrected based on the coordinate information of the detected reference position of the semiconductor chip, and the corrected image data is compared with the comparison data stored in the memory. The semiconductor chip test apparatus characterized by comprising an image signal processing means for detecting an abnormality of the surface of the-up. 3. The semiconductor chip inspection apparatus according to claim 2, wherein the alignment means includes means for inclining the tray obliquely and means for vibrating the tray. 4. The semiconductor chip inspection apparatus according to claim 2, wherein the alignment means is provided at a place different from the stage. 5. The semiconductor chip inspection apparatus according to claim 2, wherein the alignment means is provided on the stage.