JP2003303852A - Semiconductor chip mounting structure, wiring board, electro-optical device, and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide IC mounting structure in which an interval between adjacent output bumps is sufficiently kept, the occurrence of electrical short circuit in the interval between the output bumps is avoided, and connection reliability can be secured, an electro-optical device on which the IC is mounted, and an electronic apparatus on which the electro-optical device is mounted. <P>SOLUTION: In an area in which connecting terminals 94 are overlaid, two kinds of terminals 94a, 94b with different lengths of portions overlaid on an active surface 7a of a driving IC (semiconductor chip) 7 alternately arranged so as to sufficiently cover each of output electrodes 73. In this case, two output electrodes 73 are connected to one terminal 94. The same signals are simultaneously transmitted from the two output electrodes 73, respectively. Consequently, the connecting area becomes wide because the same signals are transmitted from the two points, and the connection reliability is further secured. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip mounting structure, a wiring board, an electro-optical device, and electronic equipment.

[0002]

2. Description of the Related Art In a liquid crystal device which is an example of an electro-optical device, for example, a plurality of striped common electrodes formed on one transparent substrate and a plurality of striped segment electrodes formed on the other transparent substrate are mutually provided. A plurality of pixels in a dot matrix are formed by intersecting each other. Liquid crystal is sealed between both substrates, and drive signals such as address signals (line-sequential scanning signals) and display signals are output from the drive ICs to the common electrodes and the segment electrodes, respectively, and the voltage applied to each pixel is changed. By selectively changing, the light transmitted through the liquid crystal of each pixel is modulated, thereby displaying an image such as a character.

On the other hand, in the electro-optical device, a common electrode and a segment electrode are provided at an end of one substrate in order to secure a connection portion with an external circuit such as a driving IC of the electro-optical device or a wiring substrate. On the other hand, a connection terminal is formed which is electrically connected via a wiring. The connection terminal and the external circuit are electrically connected via conductive particles scattered in ACF (anisotropic conductive film). A thermocompression bonding method is used as this connection method.

In recent years, there has been a demand for higher definition of the display portion in liquid crystal devices. As an effective means for increasing the definition of a display screen in a liquid crystal device, it is conceivable to increase the number of outputs per driving IC, that is, to increase the number of bumps formed on each IC. Is required to have a fine pitch between bumps.

However, with the narrowing of the pitch between the bumps, when impurities are mixed between the pitches, the joint portion is displaced, and the conductivity in the anisotropic conductive film is increased. When the amount of mixed particles is increased, the anisotropic conductive film is softened and flows out by heat during thermocompression bonding and flows through between adjacent bumps or between adjacent terminals. There is a problem that an electrical short circuit may occur between the adjacent bumps or between the adjacent terminals due to the retention between the adjacent terminals.

Further, as the pitch between the bumps is narrowed, the connection between each bump and the wiring board is not sufficiently made, and the electric resistance of the connection portion is increased, which causes a problem that the reliability of the connection is impaired.

The present invention has been made in view of the above circumstances, and in addition to ensuring a sufficient space between adjacent output bumps to prevent the occurrence of an electrical short circuit between the output bumps, it also ensures reliability of connection. It is an object of the present invention to provide a semiconductor chip mounting structure, a wiring board, an electro-optical device, and an electronic device that can be manufactured.

[0007]

In order to solve such a problem, the present invention is configured as follows.

The semiconductor chip mounting structure of the present invention has an input bump electrode linearly arranged along one side and at least two or more output bump electrodes in a direction substantially orthogonal to the other side facing the one side. Then, a semiconductor chip having an output bump electrode group arranged in a zigzag pattern along the other side on the surface, and provided to face the semiconductor chip, corresponding to the input bump electrode and the output bump electrode. A substrate having a terminal electrode provided on the surface, and the output bump electrode and the input bump electrode and the terminal electrode, which are provided between the substrate and the semiconductor chip, and have conductive particles scattered inside. And an anisotropic conductive film for electrically connecting the two.

According to this structure, since the staggered arrangement is made, the distance between the output bump electrodes is secured,
Further, since it is formed by the output bump group consisting of at least two output bump electrodes, the output bump electrode group and the terminal electrode are surely connected in a larger number of points as compared with the case of one. . As a result of ensuring the distance, impurities and conductive particles in the anisotropic conductive film are not sandwiched, so that an electrical short circuit between the output bump electrodes can be prevented. Also, by connecting to a plurality of output bump electrodes, the reliability of connection can be ensured.

The semiconductor chip mounting structure of the present invention is characterized in that the distance between the adjacent output bump electrodes is at least 14 μm or more.

According to this structure, when the distance between the output bump electrodes is 14 μm or more, particles in the anisotropic conductive film are reliably prevented from staying between the output bump electrodes during thermocompression bonding. it can. This can prevent an electrical short circuit due to the retention of conductive particles in the anisotropic conductive film between the output bump electrodes.

The semiconductor chip mounting structure of the present invention is characterized in that the shape of the output bump electrode is substantially a cylinder in a direction perpendicular to a contact surface with the terminal electrode.

According to this structure, by forming the output bump electrode into a columnar shape, the conductive particles in the anisotropic conductive film are not blocked by the wall surface of the output bump electrode during thermocompression bonding. Since the current flows while sliding on the wall surface, it is possible to prevent the output bump electrodes from accumulating. This can prevent an electrical short circuit between the output bump electrodes.

In the semiconductor chip mounting structure of the present invention, the input bump electrodes linearly arranged along one side and the output bump electrodes staggered along the other side opposite to the one side are provided on the surface. A semiconductor chip having the above, a substrate provided on the surface opposite to the semiconductor chip and having terminal electrodes provided corresponding to the input bump electrodes and the output bump electrodes, the substrate and the semiconductor chip And an anisotropic conductive film electrically connecting the output bump electrode and the input bump electrode and the terminal electrode with conductive particles scattered inside.
A space for avoiding the output bump electrode is linearly provided from a region sandwiched between the input bump electrode and the output bump electrode toward a region outside the output bump electrode.

According to this structure, the output bump electrodes are arranged in a zigzag manner, so that the distance between the output bump electrodes is secured. This distance can secure a space in which the conductive particles in the anisotropic conductive film can linearly pass between the output bump electrodes. That is, when thermocompression-bonding the anisotropic conductive film, the conductive particles of the anisotropic conductive film can smoothly flow out of the space between the output bump electrodes. As a result, the conductive particles in the anisotropic conductive film do not stay between the output bump electrodes, so that an electrical short circuit can be prevented.

According to one aspect of the present invention, the space is at least 14 μm or more.

According to this structure, the space is 14
When it is at least μm, it is possible to reliably prevent the conductive particles in the anisotropic conductive film from staying between the output bump electrodes during thermocompression bonding. This can prevent an electrical short circuit due to the retention of conductive particles in the anisotropic conductive film between the output bump electrodes.

According to one aspect of the present invention, the shape of the output bump electrode is substantially a cylinder in a direction perpendicular to a contact surface with the terminal electrode.

According to this structure, by forming the output bump electrode into a cylindrical shape, the conductive particles in the anisotropic conductive film are not blocked by the wall surface of the output bump electrode during thermocompression bonding. Since the current flows while sliding on the wall surface, it is possible to prevent the output bump electrodes from accumulating. This can prevent an electrical short circuit between the output bump electrodes.

The circuit board of the present invention has input bump electrodes linearly arranged along one side and at least two or more output bump electrodes in a direction substantially orthogonal to the other side facing the one side. A driving IC having on its surface an output bump electrode group arranged in a zigzag pattern along a side and a driving IC provided to face the driving IC and provided corresponding to the input bump electrode and the output bump electrode. A substrate having the formed terminal electrode on the surface thereof, and the output bump electrode, the input bump electrode, and the terminal electrode which are provided between the substrate and the driving IC and have conductive particles scattered inside. And an anisotropic conductive film for electrically connecting the two.

According to this structure, since the staggered arrangement is made, the distance between the output bump electrodes is secured,
Further, since it is formed by the output bump group consisting of at least two output bump electrodes, the output bump electrode group and the terminal electrode are surely connected in a larger number of points as compared with the case of one. . As a result of ensuring the distance, impurities and conductive particles in the anisotropic conductive film are not sandwiched, so that an electrical short circuit between the output bump electrodes can be prevented. Also, by connecting to a plurality of output bump electrodes, the reliability of connection can be ensured. That is, it is possible to form a circuit board that secures the reliability of connection without causing an electrical short circuit.

According to one aspect of the present invention, the distance between the adjacent output bump electrodes is at least 14 μm or more.

According to this structure, if the distance between the output bump electrodes is 14 μm or more, the conductive particles in the anisotropic conductive film are reliably prevented from staying between the output bump electrodes during thermocompression bonding. it can. This makes it possible to form a circuit board that can prevent electrical short-circuiting without the conductive particles in the anisotropic conductive film remaining between the output bump electrodes.

According to one aspect of the present invention, the shape of the output bump electrode is substantially a cylinder in a direction perpendicular to a contact surface with the terminal electrode.

According to this structure, by forming the output bump electrode into a columnar shape, the conductive particles in the anisotropic conductive film are not blocked by the wall surface of the output bump electrode during thermocompression bonding. Since the current flows while sliding on the wall surface, it is possible to prevent the output bump electrodes from accumulating. This can prevent an electrical short circuit between the output bump electrodes.

The circuit board of the present invention has on its surface input bump electrodes linearly arranged along one side and output bump electrodes staggered along the other side opposite to the one side. A driving IC and a substrate provided on the surface of the driving IC so as to face the driving IC and having terminal electrodes provided corresponding to the input bump electrodes and the output bump electrodes,
An anisotropic conductive film, which is provided between the substrate and the semiconductor chip and electrically connects the output bump electrodes and the input bump electrodes to the terminal electrodes with conductive particles scattered inside. A space for avoiding the output bump electrode is provided linearly from a region sandwiched between the input bump electrode and the output bump electrode toward a region outside the output bump electrode. To do.

According to this structure, the output bump electrodes are arranged in a zigzag manner to secure the distance between the output bump electrodes. This distance can secure a space in which the conductive particles in the anisotropic conductive film can linearly pass between the output bump electrodes. That is, when thermocompression-bonding the anisotropic conductive film, the conductive particles of the anisotropic conductive film can smoothly flow out of the space between the output bump electrodes. As a result, it is possible to form a circuit board in which the conductive particles in the anisotropic conductive film do not stay between the output bump electrodes and an electrical short circuit is prevented.

According to one aspect of the present invention, the space is at least 14 μm or more.

According to this structure, the space is 14
When it is at least μm, it is possible to reliably prevent the conductive particles in the anisotropic conductive film from staying between the output bump electrodes during thermocompression bonding. As a result, it is possible to form a circuit board that prevents an electrical short circuit due to retention of conductive particles in the anisotropic conductive film between the output bump electrodes.

According to one aspect of the present invention, the shape of the output bump electrode is substantially a cylinder in a direction perpendicular to a contact surface with the terminal electrode.

According to this structure, by forming the output bump electrode into a columnar shape, the conductive particles in the anisotropic conductive film are not blocked by the wall surface of the output bump electrode during thermocompression bonding. Since the current flows while sliding on the wall surface, it is possible to prevent the output bump electrodes from accumulating. This makes it possible to form a circuit board that prevents an electrical short circuit between the output bump electrodes.

The electro-optical device of the present invention has an input bump electrode linearly arranged along one side and at least two or more output bump electrodes in a direction substantially orthogonal to the other side facing the one side. A driving IC having on its surface an output bump electrode group arranged in a zigzag pattern along the other side has a structure in which the output bump electrode, the input bump electrode, and the terminal electrode are formed by conductive particles scattered inside. A wiring board having a terminal electrode provided on the surface so as to face the driving IC via an anisotropic conductive film for electrically connecting the input bump electrode and the output bump electrode. And a substrate provided so as to face the wiring substrate, and an electro-optical material sandwiched between the wiring substrate and the substrate.

According to this structure, since the staggered arrangement is made, the distance between the output bump electrodes is secured,
Further, since it is formed by the output bump group consisting of at least two output bump electrodes, the output bump electrode group and the terminal electrode are surely connected in a larger number of points as compared with the case of one. . That is, by ensuring the distance, the impurities and the conductive particles in the anisotropic conductive film are not sandwiched, so that an electrical short circuit between the output bump electrodes can be prevented, and the plurality of output bump electrodes can be connected. By doing so, it is possible to form the electro-optical device in which the reliability of the connection is ensured.

According to one aspect of the present invention, the distance between the adjacent output bump electrodes is at least 14 μm or more.

According to this structure, if the distance between the output bump electrodes is 14 μm or more, it is ensured that the conductive particles in the anisotropic conductive film stay between the output bump electrodes during thermocompression bonding. It can be prevented. As a result, the electro-optical device can prevent an electrical short circuit due to the retention of the conductive particles of the anisotropic conductive film between the output bump electrodes.

According to one aspect of the present invention, the shape of the output bump electrode is substantially a cylinder in the direction perpendicular to the contact surface with the terminal electrode.

According to this structure, by forming the output bump electrode into a columnar shape, the conductive particles in the anisotropic conductive film are not blocked by the wall surface of the output bump electrode during thermocompression bonding. Since it flows while sliding on the wall surface, retention between the output bump electrodes is suppressed. As a result, the electro-optical device can prevent an electrical short circuit between the output bump electrodes.

In the electro-optical device of the present invention, the input bump electrodes linearly arranged along one side and the output bump electrodes staggered along the other side opposite to the one side are formed on the surface. The driving IC has a facing opposing driving IC via an anisotropic conductive film that electrically connects the output bump electrode and the input bump electrode to the terminal electrode with conductive particles scattered inside. A wiring board having on its surface terminal electrodes provided corresponding to the input bump electrodes and the output bump electrodes, a board provided so as to face the wiring board, the wiring board, and An electro-optical material sandwiched between the substrates, and the output bump electrode is linearly extended from a region sandwiched between the input bump electrode and the output bump electrode toward a region outside the output bump electrode. Characterized in that to avoid a space is provided.

According to this structure, the output bump electrodes are arranged in a zigzag manner, so that the distance between the output bump electrodes is secured. This distance can secure a space in which the conductive particles in the anisotropic conductive film can linearly pass between the output bump electrodes. That is, when thermocompression-bonding the anisotropic conductive film, the conductive particles of the anisotropic conductive film can smoothly flow out of the space between the output bump electrodes. As a result, the conductive particles in the anisotropic conductive film do not stay between the output bump electrodes, so that an electro-optical device that prevents an electrical short circuit can be formed.

According to one aspect of the present invention, the space is at least 14 μm or more.

With such a structure, if the space distance is 14 μm or more, it is possible to reliably prevent the conductive particles in the anisotropic conductive film from staying between the output bump electrodes during thermocompression bonding. As a result, the electro-optical device can prevent an electrical short circuit due to the retention of the conductive particles of the anisotropic conductive film between the output bump electrodes.

According to one aspect of the present invention, the shape of the output bump electrode is substantially a cylinder in the direction perpendicular to the contact surface with the terminal electrode.

According to this structure, by forming the output bump electrode into a columnar shape, the particles in the anisotropic conductive film are not blocked by the wall surface of the output bump electrode during thermocompression bonding. Since the current flows while sliding on the wall surface, it is possible to prevent the output bump electrodes from accumulating. As a result, the electro-optical device can prevent an electrical short circuit between the output bump electrodes.

The electro-optical device of the present invention is electrically connected to the first flexible mounting board by the first flexible mounting board having any one of the mounting structures described above and the electric wiring formed on the surface. And a second flexible mounting board having the mounting structure according to any one of the above, and an electrical wiring provided on the surface facing the first board and electrically connected to the second flexible board. A second substrate that is electrically connected, and an electro-optical material sandwiched between the first flexible substrate and the second flexible substrate.

With this structure, the mounting structure of the electro-optical device described above can be applied to an actual electro-optical device, and in particular, a semiconductor chip can be mounted on a flexible substrate.

The electronic equipment of the present invention is characterized in that the electro-optical device described above is mounted.

With such a configuration, the electronic apparatus of the present invention includes a personal computer, a mobile phone, a digital camera, a liquid crystal television, an electronic notebook, a word processor,
It can be mounted on an electronic device such as a device equipped with a videophone touch panel.

[0048]

BEST MODE FOR CARRYING OUT THE INVENTION (First Embodiment)
A passive matrix type liquid crystal device adopting a COG (Chip On Glass) system will be described as an example of the electro-optical device according to the invention with reference to FIG.

FIG. 1 is a perspective view schematically showing the outer appearance of the liquid crystal device of this embodiment. FIG. 2 is a perspective view schematically showing how the liquid crystal device is disassembled. FIG. 3 is a sectional view of the liquid crystal device. Figure 4 shows a driving IC (semiconductor chip)
FIG. 6 is a schematic partial plan view showing a pattern such as bump electrodes and connection electrodes on the surface. FIG. 5 is an enlarged view of a part of the staggered arrangement of the output electrodes 73.

As shown in FIGS. 1, 2 and 3, in the liquid crystal device 1, the second transparent substrate 10 made of glass, quartz or plastic and the like, and also made of glass, quartz or plastic are used. First transparent substrate 2
And 0 are bonded and fixed with a predetermined gap therebetween with the sealing material 30 sandwiched therebetween. A discontinuity portion is formed in the sealing material 30 as a liquid crystal injection port 301 when injecting liquid crystal, and the liquid crystal injection port 301 is made of an ultraviolet curable resin.
It is sealed with 2. In the second transparent substrate 10 and the first transparent substrate 20, the driving segment electrode 15 and the common electrode 25 are transparent ITO (Indi) in a direction orthogonal to each other.
um tin oxide) film or the like to form a stripe shape. In the case where the liquid crystal device is of a reflective type or a semi-transmissive reflective type, one of these electrodes may be formed of a reflective metal film such as aluminum.

Alignment films 101 and 201 are formed on the surfaces of the second transparent substrate 10 and the first transparent substrate 20, respectively.
As the liquid crystal 5, STN (Super Twisted N)
Various types of liquid crystal such as an electronic type can be used.

The pixel is composed of liquid crystal to which a voltage is applied at the intersection of the common electrode 15 and the segment electrode 25. The driving IC (semiconductor chip) 7 outputs an address signal to the common electrode 15 and a display signal to the segment electrode 25. Further, polarizing plates 19 and 29 are attached to the outer surfaces of the second transparent substrate 10 and the first transparent substrate 20, respectively. Further, a retardation plate for eliminating coloring generated in the liquid crystal device is interposed between the transparent substrates 10 and 20 and the polarizing plates 19 and 29, if necessary.

In the liquid crystal device 1 of this embodiment, the first transparent substrate 20 is larger than the second transparent substrate 10, so that
A part of the first transparent substrate 20 projects from the edge of the second transparent substrate 10. Of the protruding portion 200 of the first transparent substrate 20, the flexible wiring board connection region 80 is formed along the edge of the first transparent substrate 20,
An IC mounting region is formed inside the flexible wiring board connection region 80 in parallel with the flexible wiring board connection region 80. The IC mounting region 70 is a region for mounting a driving IC (semiconductor chip), and the flexible wiring board connection region 80 is a driving I from the outside.
This is a region for connecting the flexible wiring substrate 8 that supplies power and display data to the C (semiconductor chip) 7 to the first transparent substrate 20. The driving IC (semiconductor chip) 7 is
In order to drive each pixel of the liquid crystal device, a drive signal such as an address signal or a display signal is output to each of the common electrode 15 and the segment electrode 25, and a chip state is output to the first transparent substrate 20. In the COG method, the active surface is opposed to the substrate.

The common electrode 15 formed on the second transparent substrate 10 is the first transparent substrate 20 when the second transparent substrate 10 and the first transparent substrate 20 are adhered with a sealant. At, the end portions of the wiring 94 extending from both ends of the IC mounting area 70 are electrically connected via the inter-substrate conductive material included in the sealing material 30.

FIG. 4 schematically shows the positional relationship between the input electrode 71 and the output electrode 73 formed on the active surface 7a of the driving IC (semiconductor chip) 7 after the ACF film has been attached by thermal compression. It is a thing. As shown in FIG. 5, the output electrode 7
It is the figure which expanded a part of staggered arrangement of FIG.

The input electrodes 71 are arranged in a straight line in a line along the side 7b of the driving IC (semiconductor chip) 7. The intervals between the input electrodes 71 are evenly and sufficiently ensured, and the conductive particles 40 do not stay. In order to show the positional relationship between the input electrode 71 and the connection terminal 9 electrically connected, the region where the connection terminal 9 overlaps is shown by a broken line. The lengths of the portions of the connection terminals 9 that overlap the active surface 7a are substantially equal to each other.

On the other hand, the output electrodes 73 are arranged in a zigzag pattern along the side 7c of the driving IC (semiconductor chip) 7. A connection terminal 94 electrically connected to the output electrode 73
In order to show the positional relationship with, the region where the connection terminals 94 overlap is shown by a broken line. Connection terminal 9 connected to each output electrode 73
No. 4, the two types of terminals 94a and 94b having different lengths of the portion overlapping with the active surface 7a of the driving IC (semiconductor chip) 7 are alternately arranged to surely cover the respective output electrodes 73. ing. As shown in FIG. 5, conductive particles 4
The diameter of 0 is approximately 4 μm, while the output electrodes 73
The distance between them is at least 14 μm or more.
It is conceivable to reduce the content density of the conductive particles 40 or to reduce the diameter of the conductive particles 40 itself, but the connection between the electrodes 71 and 73 and the connection terminals 9 and 94 becomes insufficient, so that the connection Is not reliable. Therefore, the conductive particles 40 are prevented from staying by adjusting the distance between the output electrodes 73 to be 14 μm or more.

FIG. 6 illustrates a method of thermocompression-bonding the driving IC (semiconductor chip) 7 to the first transparent substrate 20 using an ACF, using a side view from the output electrode 73 side.

The driving IC (semiconductor chip) 7 has the input electrode 71 and the output electrode 73 formed on the peripheral portion of the active surface 7 a, and is mounted so that the active surface is in contact with the first transparent substrate 20.

First, as shown in FIG. 6A, after leaving an ACF of a predetermined size so as to cover a region corresponding to the IC mounting region 70 of the first transparent substrate 20, the pressure bonding head T is used. The driving IC (semiconductor chip) 7 is thermocompression bonded toward the first transparent substrate 20. Next, as shown in FIG. 6B, the resin component of ACF is melted. Further, as shown in FIG. 6C, the output electrode 7 of the driving IC (semiconductor chip) 7
3 is electrically connected to the connection terminal 94 of the first transparent substrate 20 through the conductive particles 40 contained in the anisotropic conductive film.

At this time, the driving IC (semiconductor chip) 7
The input electrode 71 and the output electrode 73 formed on the active surface 7a are electrically connected to the connection terminals 9 and 94 in a one-to-one relationship.

Further, these input electrode 71 and output electrode 73
Are usually formed in a bump shape as bump electrodes. Here, the illustration of the input electrode 71 and the connection terminal 9 is omitted.

The liquid crystal device 1 of the present embodiment has the output electrode 73.
By arranging the zigzags in a zigzag manner, the distance between the output electrodes 73 is secured. The distance between the output electrodes 73 can secure a space in which the conductive particles 40 in the anisotropic conductive film can linearly pass between the output electrodes. That is, when the anisotropic conductive film is thermocompression bonded, the anisotropic conductive film is softened by heat and flows out to the outside of the active surface 7a.
The conductive particles 40 can easily linearly pass between the output electrodes 73 in the direction of the arrow in FIG. 4, for example. That is, the conductive particles 40 of the anisotropic conductive film can smoothly flow out of the space between the output electrodes 73. This allows
Since the conductive particles 40 in the anisotropic conductive film do not stay between the output electrodes 73, an electrical short circuit can be prevented.

(Second Embodiment) FIG. 7 shows a driving IC (semiconductor chip) 7 after the ACF film is attached by thermal compression.
3 schematically shows the positional relationship between the input electrode 71 and the output electrode 73 formed on the active surface 7a of FIG.

The output electrodes 73 are added one by one at the position where they are moved in the direction parallel to the side 7d.
(Semiconductor chips) 7 are arranged in a staggered pattern along the side 7c. Further, the region where the connection terminals 94 shown by the broken line overlap is as shown by the broken line, the driving IC (semiconductor chip) 7
The two types of terminals 94a and 94b having different lengths of the overlapping portion on the active surface 7a are alternately arranged to surely cover the respective output electrodes 73. At this time,
Two output electrodes 73 are connected to one terminal 94. Also, two output electrodes 73 connected at the same time
The same signal is transmitted from each. As a result, the same signal is transmitted at two points, so that the connection area is widened and the connection reliability is further ensured.

At this time, the conductive particles 40 are prevented from staying between the output electrodes 73 by expanding so that the distance between the output electrodes 73 is maintained at least 14 μm or more as in the case shown in FIG. It is possible to prevent an electrical short circuit.

Since the input electrode 71 is the same as that shown in FIG. 4, description thereof will be omitted.

The liquid crystal device 1 according to the second embodiment is
The output electrodes 73 are arranged in a staggered pattern, and each output electrode 7
Since the distance between the electrodes 3 is secured, the conductive particles 40 are not sandwiched, and an electrical short circuit between the output electrodes 73 can be prevented. Further, the output bump group including the two output electrodes 73 and the connection terminal 94 are connected via the conductive particles 40. As a result, when compared with the first embodiment, 2
It will be connected in the double area. This ensures the reliability of the connection.

(Third Embodiment) A COF as an example of the electro-optical device according to the present invention will be described below with reference to FIGS.
A passive matrix type liquid crystal device adopting the (Chip On Film) system will be described. The description of the same structure as that of the first embodiment will be partially omitted.

FIG. 8 is a schematic exploded perspective view of the liquid crystal device.
FIG. 9 is a partial plan view of a driving IC (semiconductor chip) which constitutes a part of the liquid crystal device of FIG. FIG. 10 shows line B in FIG.
It is a sectional view in the position along with -BB '.

As shown in FIG. 8, the liquid crystal device is mainly composed of
The liquid crystal panel 110, two FPC boards 140X and 140Y connected to the liquid crystal panel 110, and these FPC boards 140X and 140Y.
It is configured to include a control circuit board (not shown) connected to the PC boards 140X and 140Y. Among them, the liquid crystal panel 110 includes a second transparent substrate 120 having a plurality of striped segment electrodes formed thereon and a first transparent substrate 130 having a plurality of striped common electrodes formed thereon.
The structure is such that the terminal regions 126 and 136 are projected to the outside and the electrode forming surfaces are opposed to each other by a sealing material. STN type liquid crystal is sandwiched between the first transparent substrate 130 and the second transparent substrate 120.

Although not shown in FIG. 8, the terminal region 126 of the second transparent substrate 120 is provided with connection terminals for drawing out each segment electrode to the outside. on the other hand,
In the terminal region 136 of the first transparent substrate 130, connection terminals are provided on the lower side of the substrate for drawing out the common electrode to the outside.

On the FPC board 140X, the driver 145X for driving each segment electrode is mounted as a driving IC (semiconductor chip) upside down with respect to FIG. On the other hand, on the FPC board 140Y, a driver 145Y that drives each common electrode is mounted as a driving IC (semiconductor chip) in the same direction as the top and bottom of FIG.

Here, in the FPC board 140X,
The terminals located at one end and extending the input wiring described below are joined to the control circuit board, while the terminals located at the other end and extending the output wiring described below are the second transparent. It is joined to the connection terminal formed in the terminal region 126 of the substrate 120. Similarly, the FPC board 1
Also in 40Y, the terminals located at one end and extending the input wirings described below are joined to the control circuit board, while the terminals located at the other ends and extending the output wirings described below are It is joined to the connection terminal formed in the terminal area 136 of the first transparent substrate 130.

With such a configuration, the driver 145Y
Generates an address signal according to the control signal supplied from the control circuit and supplies it to each common electrode of the first transparent substrate 130. On the other hand, the driver 145X supplies the display signal to each segment electrode of the first transparent substrate 130 according to the control signal supplied from the control circuit board.

FPC (Flexible as a circuit board)
e Printed Circuit board 140 is
A wiring pattern made of, for example, copper and a driving IC (semiconductor chip) 145 are formed on a base film 141 serving as a base material having insulation and flexibility. FPC
The wiring pattern formed on the substrate 140 includes a driving IC.
An input wiring 142 for inputting a power supply or a signal to the (semiconductor chip) 145, a driving IC (semiconductor chip) 145
The output wiring 142b for receiving an output signal from the dummy wiring layer 143 as a covering portion and the like are included.

Further, the output electrode 145b formed on the active surface of the driving IC (semiconductor chip) 145 is provided for the end portion of the output wiring 142b located in the IC mounting region.
Connect.

On the other hand, the driving IC (semiconductor chip) 145 having a rectangular parallelepiped shape has an input electrode 145a on the peripheral portion of the active surface.
And 145c and the output electrode 145b are formed, and the active surface is mounted so as to be in contact with the FPC board 140. Each first electrode 145a, second electrode 145c, output electrode 145
b is formed in advance with bumps (projection electrodes) made of, for example, Au. Between the driving IC (semiconductor chip) 145 and the FPC board 140, conductive particles are uniformly dispersed in an adhesive such as epoxy.
Connection and crimping is performed by interposing CF.

FIG. 9A shows the output electrode 145 after thermocompression bonding.
3 schematically shows the sequence of b. Output electrode 145
b are arranged in a zigzag pattern on the active surface of the driving IC (semiconductor chip) 145, as in the example of the COG mounting substrate. In addition, the output electrode 145b and the connection electrode 1
42b is connected in a one-to-one relationship.

The connection terminal 142b connected to each output electrode 145b has a driving IC (semiconductor chip) 145.
Of two types of terminals 14 having different lengths on the active surface of the
7a and 147b are arranged alternately so as to surely cover the respective output electrodes 145b.

FIG. 9B shows the driving IC of FIG. 9A.
(Semiconductor chip) 145 is a schematic view showing an enlarged part of the active surface of the semiconductor chip. The diameter of the conductive particles 40 is approximately 4 μm in the case of a flexible substrate as well,
By keeping the distance between the output electrodes 145b to be at least 14 μm or more, the conductive particles 40 are prevented from being discharged by the output electrodes 145b.
It is possible to prevent staying between the two. This can prevent an electrical short circuit between the output electrodes 145b.

The driving IC (semiconductor chip) 145 can be applied not only to the COG method but also to the COF method to the flexible substrate. (Fourth Embodiment) FIG. 11 is a partial plan view of an IC constituting a part of a liquid crystal device.

A passive matrix type liquid crystal device adopting the COF method will be described below as an example of the electro-optical device according to the present invention with reference to FIG. Note that the description of the same structure as that of the first to third embodiments will be partially omitted.

FIG. 11 shows a driving IC (semiconductor chip) 1
Each output electrode 145 arranged on 45 active surfaces
One of each b is added.

At this time, the conductive particles 40 are added so that the distance between the output electrodes 145b is maintained at least 14 μm or more as in the case shown in FIG.
It becomes possible to suppress the retention between 5b and prevent an electrical short circuit.

The connection terminal 142b connected to each output electrode 145b is a driving IC (semiconductor chip) 145.
Of two types of terminals 14 having different lengths on the active surface of the
7a and 147b are arranged alternately so as to surely cover the respective output electrodes 145b. At this time, two output electrodes 145b are connected to one terminal 142b. Also, the same signal is transmitted from the two output electrodes 145b that are simultaneously connected. As a result, the same signal is transmitted at two points, so that the connection area is widened and the connection reliability is further ensured.

Also in the COF method, as in the second embodiment using the COG method, for two output electrodes 145b,
It is also applicable when connecting with the corresponding one of the terminals 147a and 147b.

(Fifth Embodiment) FIG. 12 shows an output electrode 15
FIG. 3 is a plan view of a driving IC (semiconductor chip) 150 when the shape of 1 is a cylinder.

The output electrode 151 has a cylindrical shape, is provided on the active surface of the driving IC (semiconductor chip) 150, and has one side 150b of the driving IC (semiconductor chip) 150.
Are arranged in a staggered pattern. Further, two output electrodes 151 are connected to one connection electrode 152.

In thermocompression bonding, the ACF film softened by heat flows out to the outside of the driving IC (semiconductor chip) 150. At this time, if the output electrodes 151 are too close to each other, the conductive particles 40 in the film are blocked and retained between the output electrodes 151 to cause an electrical short circuit. Here, the output electrode 151
By making the shape of (1) cylindrical and reducing the blocking effect of the output electrode 151, the conductive particles 40 can smoothly move between the output electrodes 151. This can prevent the conductive particles 40 from staying between the output electrodes 151.

Further, the zigzag arrangement further contributes to suppressing the retention of the conductive particles 40, and the connection of the two output electrodes 151 to the one connection electrode 152 results in the connection. The reliability can be secured.

(Electronic Device) Next, some examples of using the liquid crystal device according to the above-described first embodiment in a specific electronic device will be described.

First, the liquid crystal device according to the first embodiment is
An example used for a light valve of a projector as an electronic device will be described. FIG. 13 is a plan view showing a configuration example of the projector.

As shown in the figure, the projector 172
Inside, a lamp unit 112 including a white light source such as a halogen lamp is provided. The projection light emitted from the lamp unit 112 is emitted by the light guide 114.
The liquid crystal device 1 as a light valve corresponding to each of the three primary colors of RGB is separated by four mirrors 116 and two dichroic mirrors 118 arranged inside.
It is incident on R, 1B and 1G.

The liquid crystal devices 1R, 1B, and 1G are the above-mentioned liquid crystal devices, and are driven by the R, G, and B primary color signals supplied via the driving IC (semiconductor chip) 7. The light modulated by these liquid crystal devices enters the dichroic prism 212 from three directions. In this dichroic prism 212,
The R and B lights are refracted at 90 degrees, while the G light goes straight. Therefore, as a result of combining the images of the respective colors, the color image is projected on the screen or the like via the projection lens 214.

Next, electronic equipment using the liquid crystal device 1 as a display portion will be described with reference to FIGS. 14 to 18.

FIG. 14 shows a mobile personal computer which is an embodiment of the electronic apparatus according to the present invention. The computer 173 shown here is a keyboard 1
Body part 173b provided with 73a, and liquid crystal display unit 1
And 73c. Liquid crystal display unit 173
In c, the liquid crystal device 1 is incorporated in the outer frame, and the liquid crystal device 1 can be configured using, for example, the liquid crystal device shown in the above-described embodiment.

FIG. 15 shows a mobile phone which is another embodiment of the electronic apparatus according to the present invention. The mobile phone 174 shown here has the liquid crystal device 1 incorporated in an outer frame having a plurality of operation buttons 174a, an earpiece 174b, and a mouthpiece 174c. The liquid crystal device 1 can be configured using, for example, the liquid crystal device shown in the above-described embodiment.

FIG. 16 shows a digital still camera which is still another embodiment of the electronic apparatus according to the present invention.
An ordinary camera exposes a film by a light image of a subject, whereas a digital still camera 175 detects a light image of a subject by a CCD (Charge Coupled Decode).
image) to generate an image pickup signal.

Here, the liquid crystal device 1 is provided on the rear surface of the case 175a of the digital still camera 175, and
The display is performed based on the image pickup signal of D. Therefore, the liquid crystal device 1 functions as a finder that displays the subject. Further, an optical lens or a CC is provided on the front side of the case 175a (the back side of the structure shown in FIG. 16).
A light receiving unit 175b including D and the like is provided. The liquid crystal device 1 can be configured using, for example, the liquid crystal device shown in the above-described embodiment. The photographer confirms the subject displayed on the liquid crystal device 1 and presses the shutter button 175c to perform photographing.

FIG. 17 shows a wrist watch 176, in which a display section using the liquid crystal device 1 is provided at the center of the front surface of the main body.

FIG. 18 shows a device 177 equipped with a touch panel on which a liquid crystal device is mounted. A device 177 equipped with a touch panel is equipped with the liquid crystal device 1, and a liquid crystal display area 177a in which display is performed by a liquid crystal panel forming a part of the liquid crystal device 1 and an input located in the lower part of the display unit 177a in the drawing And a first input area 177c in which a working sheet 177b is arranged. The liquid crystal device 1 has a structure in which a rectangular liquid crystal panel and a touch panel serving as a rectangular input panel are two-dimensionally overlapped with each other. The touch panel is larger than the liquid crystal panel, and the touch panel projects from one end of the liquid crystal panel. Has become.

Liquid crystal display area 177a and first input area 1
A touch panel is arranged on the 77c, and the area corresponding to the liquid crystal display area 177a also functions as the second input area 177d on which the input operation can be performed similarly to the first input area 177c. The touch panel has a second surface located on the liquid crystal panel side and a first surface facing the second surface.
The input sheet 17 is provided at a position corresponding to the input area 177c.
7b is attached. A frame for identifying the icon 177e and the handwritten character recognition area 137 is printed on the input sheet 177b. In the first input area 177c, the selection of the icon 177e and the character input by the character recognition unit 177f are input. Data input can be performed by applying a load to the first surface of the touch panel with an input unit such as a finger or a pen through the use sheet 177b. On the other hand, in the second input area 177d, the image of the liquid crystal panel can be observed, and, for example, a mode is displayed on the liquid crystal panel described later, and the displayed mode is selected by using the first surface of the touch panel with a finger or a pen. Data can be entered by applying a load at.

Other electronic devices include a liquid crystal television, a viewfinder type, a monitor direct-viewing type video tape recorder, a car navigation, a pager, an electronic notebook, a calculator, a word processor, a workstation, a videophone, and a POS terminal. To be It goes without saying that the above-mentioned display device can be applied as the display unit of these various electronic devices.

[Brief description of drawings]

FIG. 1 is a schematic perspective view of a liquid crystal device according to a first embodiment.

FIG. 2 is a schematic exploded perspective view of the liquid crystal device according to the first embodiment.

FIG. 3 is a line A in FIG. 1 of the liquid crystal device according to the first embodiment.
It is sectional drawing cut | disconnected by -A '.

FIG. 4 is a schematic plan view of the liquid crystal device according to the first embodiment.

FIG. 5 is an enlarged plan view in which a part of the liquid crystal device according to the first embodiment is enlarged.

FIG. 6 is a schematic cross-sectional view showing a process of thermocompression bonding of the liquid crystal device according to the first embodiment.

FIG. 7 is a schematic plan view of a liquid crystal device according to a second embodiment.

FIG. 8 is a schematic perspective view of a liquid crystal device according to a third embodiment.

FIG. 9 is a schematic plan view of a liquid crystal device according to a third embodiment and an enlarged plan view in which a part of the liquid crystal device is enlarged.

FIG. 10 shows a liquid crystal device according to a third embodiment,
It is sectional drawing cut | disconnected by the line BB 'of FIG.

FIG. 11 is a schematic plan view of a liquid crystal device according to a fourth embodiment.

FIG. 12 is a plan view of a liquid crystal device according to a fifth embodiment.

FIG. 13 is an example of an electronic device to which the liquid crystal device according to the first embodiment is applied.

FIG. 14 is a perspective view showing a mobile computer which is an embodiment of an electronic apparatus according to the invention.

FIG. 15 is a perspective view showing a mobile phone which is another embodiment of the electronic device according to the present invention.

FIG. 16 is a perspective view showing a wristwatch which is another embodiment of the electronic apparatus according to the invention.

FIG. 17 is a perspective view showing a digital still camera which is another embodiment of the electronic apparatus according to the invention.

FIG. 18 is a perspective view showing an electronic device according to another embodiment of the present invention, which is equipped with a touch panel.

[Explanation of symbols]

1 ... Liquid crystal device 5 ... Liquid crystal 7: Driving IC (semiconductor chip) 7a ... Active surface 7b ... side 7c ... side 7d ... side 9 ... Electrode terminal 10 ... Second transparent substrate 20 ... First transparent substrate 40 ... Conductive particles 70 ... IC mounting area 71 ... Input electrode 73 ... Output electrode 94 ... Connection terminal 120 ... second transparent substrate 140 ... FPC board 142b ... Connection electrode 145b ... Output electrode 145a ... Input electrode 145 ... Driving IC (semiconductor chip) 145a ... Connection terminal 150 ... Driving IC (semiconductor chip) 150b ... One side 151 ... Output electrode 172 ... Projector 173 ... Computer 174 ... Mobile phone 175 ... Digital still camera 176 ... Watch 177 ... Equipment equipped with touch panel

Claims (20)

[Claims] 1. An input bump electrode linearly arranged along one side, and at least two or more output bump electrodes in a direction substantially orthogonal to the other side facing the one side, and zigzag along the other side. A semiconductor chip having a group of output bump electrodes arranged in a line on the surface, and terminal electrodes provided corresponding to the semiconductor chip and provided corresponding to the input bump electrodes and the output bump electrodes on the surface. And an anisotropic device that is provided between the substrate and the semiconductor chip and electrically connects the output bump electrode and the input bump electrode to the terminal electrode with conductive particles scattered inside. A mounting structure for a semiconductor chip, comprising: a conductive conductive film. 2. The distance between the adjacent output bump electrodes is at least 14 μm or more.
The semiconductor chip mounting structure according to. 3. The semiconductor chip mounting structure according to claim 2, wherein the shape of the output bump electrode is substantially a cylinder in a direction perpendicular to a contact surface with the terminal electrode. 4. A semiconductor chip having on a surface thereof input bump electrodes linearly arranged along one side and output bump electrodes arranged in a staggered manner along the other side opposite to the one side. A substrate provided facing the semiconductor chip and having a terminal electrode provided on the surface corresponding to the input bump electrode and the output bump electrode on the surface, provided between the substrate and the semiconductor chip, and internally An anisotropic conductive film that electrically connects the output bump electrodes and the input bump electrodes to the terminal electrodes by scattered conductive particles, and is sandwiched between the input bump electrodes and the output bump electrodes. A semiconductor chip mounting structure, characterized in that a space for avoiding the output bump electrode is provided in a straight line from the opened region toward the region outside the output bump electrode. 5. The semiconductor chip mounting structure according to claim 4, wherein the space is at least 14 μm or more. 6. The semiconductor chip mounting structure according to claim 5, wherein the shape of the output bump electrode is substantially a cylinder in a direction perpendicular to a contact surface with the terminal electrode. 7. An input bump electrode linearly arranged along one side, and at least two or more output bump electrodes in a direction substantially orthogonal to the other side facing the one side, and zigzag along the other side. A driving IC having on its surface an output bump electrode group arranged in a pattern, and a terminal electrode provided facing the driving IC and provided corresponding to the input bump electrode and the output bump electrode. A substrate provided on the surface, and electrically connected between the output bump electrode and the input bump electrode and the terminal electrode by conductive particles that are provided between the substrate and the driving IC and are scattered inside And an anisotropic conductive film for controlling the circuit board. 8. The distance between the adjacent output bump electrodes is at least 14 μm or more.
The circuit board according to. 9. The circuit board according to claim 8, wherein the shape of the output bump electrode is substantially a cylinder in a direction perpendicular to a contact surface with the terminal electrode. 10. A driving IC having on its surface an input bump electrode linearly arranged along one side and output bump electrodes arranged in a staggered manner along the other side opposite to the one side. A substrate provided facing the driving IC and having terminal electrodes provided on the surface corresponding to the input bump electrodes and the output bump electrodes, and provided between the substrate and the semiconductor chip, An anisotropic conductive film that electrically connects the output bump electrode and the input bump electrode and the terminal electrode with conductive particles scattered inside, the input bump electrode and the output bump electrode A circuit board, wherein a space for avoiding the output bump electrode is linearly provided from a region sandwiched between the output bump electrode and a region outside the output bump electrode. 11. The circuit board according to claim 10, wherein the space is at least 14 μm or more. 12. The circuit board according to claim 11, wherein a shape of the output bump electrode is substantially a cylinder in a direction perpendicular to a contact surface with the terminal electrode. 13. An input bump electrode linearly arranged along one side, and at least two or more output bump electrodes in a direction substantially orthogonal to the other side facing the one side, and zigzag along the other side. A driving IC having on its surface an output bump electrode group arranged in a pattern electrically connects the output bump electrode and the input bump electrode to the terminal electrode by conductive particles scattered inside. A wiring board having terminal electrodes provided on the surface so as to face the driving IC via an anisotropic conductive film and corresponding to the input bump electrodes and the output bump electrodes, and to face the wiring board. An electro-optical device comprising: a substrate provided so as to be provided with an electro-optical material sandwiched between the wiring substrate and the substrate. 14. The electro-optical device according to claim 13, wherein the distance between the adjacent output bump electrodes is at least 14 μm or more. 15. The electro-optical device according to claim 14, wherein the shape of the output bump electrode is substantially a cylinder in a direction perpendicular to a contact surface with the terminal electrode. 16. A driving IC having on its surface an input bump electrode linearly arranged along one side and an output bump electrode arranged zigzag along the other side opposite to the one side. The input is provided so as to face the driving IC via an anisotropic conductive film electrically connecting the output bump electrode and the input bump electrode with the terminal electrode by conductive particles scattered inside. A wiring board having on its surface terminal electrodes provided corresponding to the bump electrodes and the output bump electrodes, a board provided so as to face the wiring board, and sandwiched between the wiring board and the board. A space for avoiding the output bump electrode in a straight line from a region sandwiched between the input bump electrode and the output bump electrode toward a region outside the output bump electrode. An electro-optical device characterized by being provided. 17. The electro-optical device according to claim 16, wherein the space is at least 14 μm or more. 18. The electro-optical device according to claim 17, wherein the shape of the output bump electrode is substantially a cylinder in a direction perpendicular to a contact surface with the terminal electrode. 19. A first flexible mounting board having the mounting structure according to any one of claims 1 to 6, and an electrical wiring formed on a surface of the first flexible mounting board to electrically connect to the first flexible mounting board. And a second flexible mounting substrate having the mounting structure according to any one of claims 1 to 6, and an electric wiring formed on the surface of the second flexible mounting substrate facing the first substrate. A second substrate electrically connected to the second flexible substrate, and an electro-optical material sandwiched between the first flexible substrate and the second flexible substrate. Optical device. 20. An electronic device comprising the electro-optical device according to claim 13 mounted therein.