JP2003283145A - Method of inspecting misregistration of multilayer wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a simplified and effective method of inspecting misregistration of a multilayer wiring board. <P>SOLUTION: The method is capable of inspecting misregistration of the multilayer layer wiring board 102 which may be obtained by laminating at a time a plurality of circuit substrates, each of which is provided with a conductive circuit, an insulation layer and a conductive post connected with a conductive circuit through the insulation layer. This method of inspecting misregistration of the multilayer wiring board 102 is characterized by determining misregistration through the electrical conductivity between a misregistration inspection post 100 formed on the circuit substrate surface and a misregistration inspection land 101 which is punched in the area larger than the cross-section of the misregistration inspection post 100 formed on the circuit substrate surface opposing to such post. <P>COPYRIGHT: (C)2004,JPO

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for inspecting the position of a multilayer wiring board. 2. Description of the Related Art With the recent demand for higher functionality and lighter and smaller electronic devices, high-density integration and high-density mounting of electronic components have been progressing. Semiconductor packages to be used are becoming smaller and have more pins than ever before. In recent years, build-up multilayer wiring boards have been adopted. The build-up multilayer wiring board is formed by stacking an insulating layer made of only a resin and a conductor. In order to stack the layers at once, a via hole is provided in each layer, a via post is formed by filling the via hole with a conductive material, and a solder layer is provided on the upper end thereof. Each layer is provided with a solder layer and a land corresponding thereto, and the via posts and the lands can be stacked and pressurized at once so that the via posts and the lands are joined by soldering. Since the layers are collectively laminated, each layer can be manufactured individually, which leads to lower costs and simplified processes as compared with the conventional lamination method. [0004] However, this multilayer wiring board needs to be inspected because there is a possibility that a defect occurs due to displacement. As a method of inspecting the positional deviation, there are a positional deviation inspection using X-rays and a positional deviation inspection due to conduction. [0005] In the method of inspecting the displacement using X-rays, the displacement within the multilayer wiring board can be observed with an X-ray device. However, the X-ray device is disadvantageous in that it is expensive. It takes time to inspect each item visually. In the method of the position shift inspection by conduction, the accuracy of the position shift can be checked by forming a position shift test via post and a position shift test land on each layer and checking the conduction in the layer. For example, after the positional deviation inspection land is circular, its diameter is set to Da, the diameter of the positional deviation inspection post is set to Db, and the multilayer wiring board is formed by batch lamination. Measure the continuity of the land. However, according to this method, even if the via hole for positional deviation inspection is not on the land for positional deviation inspection, the determination is good if the via post for positional deviation inspection and the land for positional deviation inspection are in slight contact. .
Therefore, since the position accuracy is expressed by ± (Da + Db) / 2 ≦ position accuracy, the position accuracy is ± (Da−Db) / 2 ≦ position accuracy, which is a method of calculating the position accuracy with respect to the diameter of a normal post and land. Position accuracy is increased. For this reason, there has been a problem that the conductor circuit and the conductor posts are becoming finer and more difficult to cope with strict positional accuracy. SUMMARY OF THE INVENTION An object of the present invention is to provide a method for easily and effectively detecting a positional deviation of a multilayer wiring board with reduced positional accuracy. That is, the present invention provides a method of laminating a plurality of circuit boards having a conductor circuit, an insulating layer, and a conductor post penetrating the insulating layer and connecting to the conductor circuit. A method for inspecting the positional deviation of a multilayer wiring board obtained by the method described above, wherein the cross-sectional area of the positional deviation inspection post formed on the circuit board surface and the cross-sectional area of the position deviation inspection post formed on the opposing circuit board surface This is a method for inspecting the positional deviation of a multilayer wiring board, characterized in that the judgment is made based on the electrical continuity with the land for the positional deviation inspection, which is largely hollowed out. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a method for inspecting a position shift according to the present invention will be described, but the present invention is not limited thereto. [0009] A method for inspecting a misalignment of a multilayer wiring board according to the present invention is obtained by laminating a plurality of circuit boards each having a conductor circuit, an insulating layer, and a conductor post penetrating the insulating layer and connecting to the conductor circuit. This method is applied to a multi-layered wiring board to be used, and a method of inspecting the position of the multi-layered wiring board will be described with reference to the drawings. In the method for inspecting the positional deviation according to the present invention, the continuity of the continuity check terminal 104 formed on the surface of the circuit board of each layer constituting the multilayer wiring board 102 (FIG. 1B) is confirmed, and the continuity is not confirmed. Then, the alignment of the corresponding layer is within the effective range, and if it is conductive, it can be confirmed that the alignment is out of the effective range. FIG. 1A shows an image when the position shift inspection portion 103 is not conducting at this time. In the present invention, the position shift inspection portion 103
As an example, a misalignment inspection post 100 exposed on one surface of the connection layer and a conduction confirmation terminal 104 exposed on the other surface are connected to each other by a conductor post. Furthermore, a connection layer side inspection portion connected by the conduction confirmation conductor circuit 105 and a position displacement inspection land 101 are formed on the surface of the opposing connected layer, and a conduction confirmation conductor circuit and a conductor post are formed in the same manner as described above. And a connected layer inspection portion having a conduction confirmation terminal formed on the other surface. In the present invention, the multilayer wiring board 102 includes:
For each circuit board, a post 100 for position deviation inspection, a land 101 for position deviation inspection, and a conductor circuit 105 for conduction confirmation
It is necessary that the conduction confirmation terminals 104 of each layer are formed on the multilayer wiring board 102 so as to be exposed to the surface layer. The position accuracy in the present invention is as follows.
The diameter of the circular shape from which the land for inspection for positional deviation 101 has passed is D1,
When the diameter of the displacement inspection post 100 is D2, it can be expressed by ± (D1−D2) / 2 ≦ position accuracy, and by adjusting each diameter,
Position accuracy can be determined. For example, if the diameter of the circle from which the displacement inspection land 101 has passed is φ150 μm and the diameter of the displacement inspection post 100 is φ50 μm, the positional accuracy ≦
Inspection of ± 50 μm can be easily performed. The feature of the position shift inspection of the present invention is that the position shift inspection of the multilayer wiring board can be surely performed only by inspecting the continuity. Inspection can be performed automatically. Further, after the position shift inspection, as shown in FIG. 1B, a position shift inspection portion 103 is designed around the multilayer wiring board 102 in advance, and cut and removed at the cut surfaces 106a and 106b. There is no position shift inspection portion left on the board, and the wiring pattern is not restricted. According to the present invention, the continuity between the displacement inspection land and the displacement inspection post is confirmed, so that the displacement of each layer of the multilayer wiring board with reduced positional accuracy is easy and effective. Can be confirmed.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing an image of a position shift inspection part and a cross-sectional view showing an example of a multilayer wiring board having a position shift inspection part built therein. [Description of Reference Numerals] 100: misalignment inspection post 101: misalignment inspection land 102: multilayer wiring board 103: misalignment inspection portion 104: conduction confirmation terminal 105: conduction confirmation conductor circuit 106a, 106a: cut surface

Claims (1)

1. A multilayer wiring board obtained by laminating a plurality of circuit boards having a conductor circuit, an insulating layer, and a conductor post penetrating through the insulating layer and connecting to the conductor circuit. A position shift inspection method, wherein a position shift test post formed on a circuit board surface and a position shift hollowed out larger than the cross-sectional area of the position shift test post formed on an opposing circuit board surface A method for inspecting positional deviation of a multilayer wiring board, wherein the method is determined by electrical conduction with an inspection land.