JP2003258499A - Inspection subject decision unit, program, and method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inspection subject unit, a decision program and a method therefor, in which a part to be inspected is inspected in a proper inspection process according to characteristics of an inspection process. <P>SOLUTION: The unit is composed of a process information input section 2 for inputting the characteristic information of the inspection process, an inspection content input section 1 for inputting inspection items for each inspection process and inputting subject parts inspectable by the inspection items, a duplicated inspection determining section 3 that determines the existence of parts and inspection items which are capable of duplicated inspection in a plurality of inspection processes, a subject part deciding section 4 that decides the inspection subject parts for the inspection items in each inspection process, and an inspection subject output section 5 that outputs the information of the inspection subject parts for the inspection items in the inspection process. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inspection of an electronic circuit board, and more particularly to a technique of deciding an inspection target component to be instructed to an inspection device for automatically inspecting an object.

[0002]

2. Description of the Related Art Conventionally, in the process of inspecting a component mounted on an electronic circuit board, even though there are two or more inspecting processes, the inspection method in each process is different, and therefore the inspection is guaranteed in one process. In some cases, inspection guarantees may be duplicated for parts even in different processes. In addition, it is known that even a component that does not cause a real defect is often inspected, and a large number of inspection man-hours are included more than necessary. In addition, as a conventional problem with automatic inspection, it takes a lot of time to create an inspection program for the inspection device, and the time required for humans to visually check and repair the defective parts and defective items judged by the inspection device. It is said that one of the problems is that it causes a lot of problems.
Usually, in the automatic inspection by the inspection device in a certain process,
The situation where an abnormality that should be detected could not be detected (hereinafter,
If “missing” occurs, there is a problem that an inspection target having a defect moves to the next process. In the inspection by the inspection apparatus as described above, data indicating a certain allowable range, that is, threshold data is usually set in advance, but an oversight occurs when the set value is set wide.

In order to prevent overlooking, the allowable range should be set narrower, but if it is set too narrow, when an inspection object that is abnormal in the inspection is sent to the repair work, the worker repairs it. A situation (hereinafter referred to as "overdetection") that is determined to be unnecessary is generated. An object that is judged to be abnormal at the inspection stage by the inspection device, even though the inspection object is judged to be normal by the operator's eye due to over-detection and judged not to require repair. However, the number of inspection objects to be sent to the repair work increases more than necessary, and the burden on the worker in charge of the repair work increases. To avoid this, it is necessary to properly set the data indicating the allowable range used for inspection (to the extent that the allowable range does not become excessive), but it is very difficult to set the data indicating the allowable range properly. If there are many parts, it will take time to properly set the data. In addition, the inspection time of the automatic inspection device itself increases as the number of target parts increases. To solve this problem, for example, the inspection system described in Japanese Patent Laid-Open No. 2001-77600 stores the threshold data that is initially set in the process of storing the threshold data input to the appearance inspection device in the device and performing the inspection. Is configured to be changed by using the inspection result by human visual inspection. Therefore, it is possible to reduce the overdetection in which the inspection device determines a non-defective product as a defective product, and the oversight in which the inspection device determines a non-defective product as a non-defective product, and repairs an erroneous determination (overdetection or overlooking) in the inspection device. The number of steps can be reduced.

[0004]

However, in the above-mentioned prior art, although the improper inspection is improved and the adequacy of the inspection is improved, the number of parts to be inspected remains unchanged, so that the number of man-hours in the visual inspection is reduced. It is not possible to reduce the threshold setting man-hours (inspection program creation man-hours) for inspection. In addition, it is inevitable that the inspection time of the appearance inspection apparatus itself will increase when the number of mounted components increases. Also,
There is a problem that the threshold cannot be appropriately changed in the inspection process in which humans cannot perform visual inspection. Furthermore, depending on the inspection process, there are some inspections that require a lot of time and effort for creating a program for an automatic inspection machine and the inspection itself. The present invention has been made to solve the above problems, and an inspection target component determination device for determining a component to be inspected in an appropriate inspection process according to the characteristics of the inspection process, and determination. The purpose is to provide programs and methods. Another purpose is to reduce the number of parts to be inspected in the inspection process that requires a lot of man-hours and pass the inspection process to another inspection process that requires less man-hours, thereby reducing the man-hours required for the inspection and the man-hours required to create the inspection program. An object of the present invention is to provide an inspection target part determination device, a determination program, and a method.

[0005]

In order to solve the above-mentioned problems, in the inspection object component determining apparatus according to claim 1, an electronic circuit board having a plurality of inspection steps is provided for determining the quality of the mounting state of the electronic component. A device for determining parts to be inspected in a process, a process information input section for inputting characteristic information of the inspection process, and an inspection content input for inputting an inspection item for each inspection process and an inspectable target part in the inspection item. Part, a duplicate inspection determination part that determines the presence or absence of inspectionable parts and inspection items in a plurality of inspection processes, a target component determination part that determines inspection target parts of inspection items in each inspection process, and an inspection process And an inspection target output unit that outputs information on the inspection target component of the inspection item in the above, and the target component determination unit is an inspection target component that is inspected in duplicate for inspection items of a plurality of inspection processes. , Based on the process information characteristic information input by the input unit, and deletes from the test item in a predetermined order. Further, in the invention according to claim 2, in the inspection target component determination device according to claim 1, the characteristic information of the inspection process is information regarding an inspection process having the largest load, and the target component determination unit is It is characterized in that the inspection target component in the inspection item in the inspection process with a heavy load is deleted.

According to the invention described in claim 3, claim 1
In the inspection target component determination device described, the characteristic information of the inspection process is information regarding the load in each inspection process, and the target component determination unit deletes the inspection target component in the inspection item in order from the inspection process with the largest load. It is characterized by Further, the inspection target component determination program according to claim 4 is a determination program of an inspection target component in an electronic circuit board creating process having a plurality of inspection processes in determining the quality of the mounting state of the electronic component, and the characteristics of the inspection process. The step of inputting information, the step of inputting an inspection item for each inspection step and the target parts that can be inspected by the inspection item, and the presence / absence of parts and inspection items that can be inspected in multiple inspection steps are determined. And a step of determining an inspection item and an inspection target part in each inspection process, and a step of outputting information of the inspection target part in the inspection item of the inspection process, and the step of determining the target part includes a plurality of steps. The inspection target parts to be inspected in duplicate in the inspection item of the inspection process are input in the step of inputting the characteristic information of the inspection process. Based on distribution, and deletes from the test item in a predetermined order. Further, in the invention according to claim 5, in the inspection target part determination program according to claim 4, the characteristic information of the inspection process is information regarding the inspection process having the largest load, and the step of determining the target part includes: The inspection target component in the inspection item in the inspection process having the highest load is deleted.

In the invention according to claim 6, the invention according to claim 4
In the inspection target component determination program described, the characteristic information of the inspection process is information regarding the load in each inspection process, and the step of determining the target component is to delete the inspection target component in the inspection item in order from the inspection process with the largest load. It is characterized by doing. The inspection target component determination method according to claim 7 is a method of determining an inspection target component in an electronic circuit board creating process having a plurality of inspection processes in determining the quality of the mounting state of the electronic component. Based on the information and the information of the inspection item for each inspection process and the target parts that can be inspected by the inspection item, the presence or absence of redundantly inspectable parts and inspection items in a plurality of inspection processes is determined, and a plurality of inspections are performed. Based on the characteristic information of the inspection process, the inspection target parts that are inspected in duplicate in the inspection item of the process,
It is characterized in that the inspection items are deleted in a predetermined order.
Further, in the invention described in claim 8, in the inspection object component determination method according to claim 7, the characteristic information of the inspection step is:
It is information about the inspection process with the largest load, and the inspection target component in the inspection item in the inspection process with the largest load is deleted. Further, in the invention according to claim 9, in the method for determining an inspection target component according to claim 7, the characteristic information of the inspection process is information regarding a load in each inspection process, and the inspection items in the inspection items are sequentially arranged from the inspection process having the largest load. The feature is that the inspection target component is deleted.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings. First, the good / bad state of the mounted components detected by the visual inspection machine will be described. FIG. 5 shows various good / bad states detected by the appearance inspection machine. In the figure, the left side is an example of a good product and the right side is an example of a defective product. The visual inspection machine is used for the assembly of printed circuit boards.
Assembly difference (a), direction difference (b), missing item (c)
A so-called erroneous mounting such as the above, and a short circuit (d) due to excessive supply of solder can be detected. Although not shown, the visual inspection machine is also widely used because it is effective for detecting defects at the stage when soldering is completed, such as unjoined due to lack of solder during soldering, unjoined due to deformation of component lead shape, etc. There is. FIG. 6 is a diagram showing a state of the soldered chip component. FIG. 1A is an example of a non-defective product showing a soldering shape when a soldered component is viewed from the side. Further, FIG. 2B is an example of a defective product showing the soldering shape when the soldered component is viewed from the side. Then, FIGS. 6C and 6D show images when FIGS. 6A and 6B are viewed from the upper surface by the inspection machine. With a device that processes captured images with a camera and inspects the appearance after soldering,
6A, the hatched portion shown in FIG. 6C is displayed in a color indicating the inclination, and the electrode of the component and the land of the board are properly wet and spread. It can be judged that soldering has been performed. However, with respect to the above inspection, the same inspection can be performed by an electrical assembly inspection method (hereinafter referred to as “in-circuit tester”) which is a step after the appearance inspection step. Especially Figure 5
Regarding the difference in parts as shown in (a), the inspection method of the in-circuit tester in which the land is probed with the probe pin and the electric value is compared with the set value is highly effective in terms of detection power. In this way, the same inspection item may be detected by different inspection methods, and the same inspection process may be set for other than different parts.

FIG. 7 is an example of a power table in which the inspection items of a visual inspection device for a board and an in-circuit tester are summarized in a table. The power table is a summary of whether or not the inspection items that can be inspected by each facility for the mounted components can be inspected. In the figure, the appearance inspection and the in-circuit tester of eight parts are represented by O when each inspection item can be inspected, X when they cannot be inspected, and-when they have no meaning. In FIG. 7, it can be seen that the missing parts can be inspected by the appearance inspection device but can also be inspected by the in-circuit tester. Therefore, for these eight parts, the inspection in either one of the inspection steps can be deleted.

Embodiments of the present invention will be described in detail below with reference to the drawings. FIG. 1 is a block diagram of an inspection target part determination device of the present invention. Further, FIG. 2 is an example of a hardware configuration for implementing the present invention. The present invention can be implemented by hardware having the same configuration as a normal personal computer as shown in FIG. In the figure, an MPU 21 (sometimes referred to as a microprocessor unit or CPU) that processes data and controls the entire apparatus and a memory 22 that stores a program or data being executed are connected by a bus 27. There is. Further, to the bus 27, a KB 24 (keyboard) for exchanging information between a person and a device and a mouse (not shown) are connected as a data input device, and a display device 25 is connected as an output device. The HD 23 (hard disk) is adapted to store the programs and data required for processing of the present invention. Further, if necessary, the communication interface 26 can be used to exchange data with other computers or terminals. The program and data are not limited to the hard disk 23, and may be stored in a medium of another storage device (not shown) such as a CD-ROM or a floppy disk.

Next, the configuration of the inspection object part determination device of the present invention will be described with reference to FIG. The inspection content input unit 1 is for a user of the apparatus to input an inspection item and an inspection target component for each inspection process. Specifically, the data items shown in FIG. 3 are input, but it is usual that data of parts and arrangements on the board are created at the designing stage of the electronic circuit board, so the design data is transmitted from another computer to the communication interface. 26 can also be used. The data items will be described later. In the present invention, in addition to the data input in the inspection content input unit 1 described above, the process information input unit 2
Inputs the characteristic information of the inspection process. The data input as the characteristic information represents, for example, the degree of load in the inspection process, and may be any data as long as it is digitized according to a predetermined rule. What is the degree of load?
For example, the man-hour required for programming the inspection device and the time required for the inspection may be evaluated in 10 levels, or 1 may be designated for the process with the largest load and 0 may be set as the default for other processes. good. Duplicate inspection determination unit 3
Is for determining whether or not the same component can be inspected in duplicate by the same inspection item in different inspection processes, for example, the appearance inspection and the lead bending inspection in the inspection process in the lead component mounting device. Then, the target component determination unit 4 determines the target component in the inspection item in each inspection process based on the result of the duplicate inspection determination unit 3 and the characteristic information input by the process information input unit 2. For example, overlapping inspection target parts are deleted from the inspection items of the process with a high load so that they are inspected in the inspection process with a low load. The inspection target output unit 5 outputs the inspection process determined by the target component determination unit 4 and the target component information for each inspection item. If the process with the largest load is specified in the process information input section 2,
The part to be inspected in the process (for example, part number) is displayed on the display device. Alternatively, the data may be written on a storage medium such as paper, magnetism, or light, or may be output via a communication interface. When the degree of load is input for each inspection process in the process information input unit 2, the information of the inspection target component in the inspection item in each inspection process is similarly output.

FIG. 3 is a diagram showing inspection contents and inspection target parts, which are data obtained by combining the inspection contents input unit 1 and the process information input unit 2. Basically, it is the same as the power table shown in FIG. 7, but a column of process characteristic value is added. The duplication inspection determination unit 3 searches for a target component to be inspected redundantly based on this table, and the target component determination unit 4 determines in what inspection process the found component is to be inspected. FIG. 4 is a flow chart showing an inspection target part determination algorithm according to the present invention. The processing contents will be described in detail based on FIG. Although the notation of loop (repetition) is simplified in the figure, it should be well understood by those skilled in the art. First, the outermost loop is a loop for checking all processes in order from the inspection process with the largest load (step S1).
0). That is, this loop indicates that the processes are performed in the descending order of process characteristic values. The next inner loop is a loop (step S11) for all the items in the inspection process. When the inspection process and inspection items are determined in steps S10 and S11, the third loop is
It is a loop for checking all target parts in the process (step S12). Then, except for the inspection process currently being checked, if there are inspection items that can inspect this part in duplicate in the inspection items in the other inspection processes (step S13), this part is It is deleted from the inspection items (step S14). In terms of the power table, it corresponds to the operation of replacing ○ with-or blank. Then, the inspection process having the next largest load is processed, and when all the inspection processes are sequentially completed (step S15), the process ends. In the above process, since the overlapping inspection target parts are deleted from the inspection target in order from the inspection process with the largest load, the inspection process for finally inspecting the parts is the inspection process with the smallest load. If the inspection process with the highest load is specified, the outermost loop (step S1
If the loop is rotated only once for the inspection process specified in 0), the parts to be inspected redundantly are deleted from that process, and the result of which part should be inspected can be obtained.

[0013]

As described above, the inspection items in all the inspection steps are investigated to prepare the power table, and the present invention is carried out. Therefore, the inspection in the desired inspection step or the inspection step with a heavy load can be performed. The target parts can be reduced, and the man-hours and time required for the inspection can be reduced. In addition to simply viewing the resulting output on a display device or printed output,
Since it can be output as electronic data, it can be used as input data to the inspection device. Further, although the load of the inspection is focused on in the above-described embodiment, if the data focused on the detection accuracy of the inspection is used as the process characteristic value, the inspection target component can be transferred to the inspection process with the high detection accuracy. It becomes possible to efficiently perform high inspection.

[Brief description of drawings]

FIG. 1 is a block diagram of an inspection target part determination device of the present invention.

FIG. 2 is a diagram showing an example of a hardware configuration for implementing the present invention.

FIG. 3 is a diagram showing inspection contents and inspection target parts.

FIG. 4 is a flowchart showing an inspection target part determination algorithm of the present invention.

FIG. 5 is a diagram showing a defective state detected by an appearance inspection machine.

FIG. 6 is a diagram showing a state of a soldered chip component.

FIG. 7 is a diagram showing an example of a power table in which inspection items are summarized in a table.

[Explanation of symbols]

1 inspection content input unit, 2 process information input unit, 3 duplicate inspection determination unit, 4 target component determination unit, 5 inspection target output unit

Claims (9)

[Claims] 1. A device for deciding a component to be inspected in an electronic circuit board manufacturing process having a plurality of inspection processes for determining the mounting state of an electronic component, and a process information input section for inputting characteristic information of the inspection process. , An inspection content input section for inputting an inspection item and a target part inspectable by the inspection item for each inspection step, and a duplicate inspection for determining the presence or absence of parts and inspection items that can be inspected in a plurality of inspection steps The target component determination unit includes a determination unit, a target component determination unit that determines the inspection target component of the inspection item in each inspection process, and an inspection target output unit that outputs information of the inspection target component of the inspection item in the inspection process. Deletes inspection target parts that are inspected in duplicate in inspection items of a plurality of inspection processes from the inspection items in a predetermined order based on the characteristic information input in the process information input unit. An inspection object part determination device characterized by the above. 2. The characteristic information of the inspection process is information regarding the inspection process having the largest load, and the target component determination unit deletes the inspection target component in the inspection item in the inspection process having the largest load. Claim 1 characterized by the above-mentioned.
The inspection target part determination device described. 3. The characteristic information of the inspection process is information regarding the load in each inspection process, and the target component determination unit deletes the inspection target components in the inspection items in order from the inspection process with the largest load. The inspection target part determination device according to claim 1. 4. A program for determining a component to be inspected in an electronic circuit board manufacturing process having a plurality of inspection processes in determining the mounting state of an electronic component, the step of inputting characteristic information of the inspection process, and each inspection. A step of inputting an inspection item and a target part that can be inspected by the inspection item for each process, a step of determining the presence or absence of an inspectable part and an inspection item in a plurality of inspection processes, and an inspection in each inspection process The step of determining the item and the inspection target part, and the step of outputting the information of the inspection target part in the inspection item of the inspection process, the step of determining the target part is duplicated in the inspection items of a plurality of inspection processes. Based on the information input in the step of inputting the characteristic information of the inspection process, the inspection target parts to be inspected are deleted from the inspection items in a predetermined order. A program for determining parts to be inspected, which is characterized by: 5. The characteristic information of the inspection process is information regarding the inspection process having the largest load, and the step of determining the target component deletes the inspection target component in the inspection item in the inspection process having the largest load. The inspection target part determination program according to claim 4, wherein: 6. The characteristic information of the inspection process is information about a load in each inspection process, and the step of determining the target component deletes the inspection target component in the inspection item in order from the inspection process having the largest load. The inspection target part determination program according to claim 4. 7. A method of deciding a component to be inspected in an electronic circuit board manufacturing process having a plurality of inspection processes in determining the mounting state of an electronic component, the characteristic information of the inspection process, and the inspection for each inspection process. Based on the information of the item and the target component that can be inspected in the inspection item, the presence or absence of the component and the inspection item that can be inspected in the inspection process is determined, and the inspection items in the plurality of inspection processes are inspected in duplicate. A method of determining a part to be inspected, characterized by deleting parts to be inspected from inspection items in a predetermined order based on characteristic information of the inspection step. 8. The characteristic information of the inspection process is information relating to the inspection process having the largest load, and only the inspection target component in the inspection item in the inspection process having the largest load is deleted. 7. The method for determining the inspection target part described in 7. 9. The inspection information according to claim 7, wherein the characteristic information of the inspection process is information regarding a load in each inspection process, and the inspection target parts in the inspection items are deleted in order from the inspection process having the largest load. Target part determination method.