JP2003257919A - Liquid supplying method and apparatus therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid supplying method and an apparatus therefor in which a mechanism is simplified, less number of areas are contaminated, and liquid is supplied uniformly to the lower surface of a rotating substrate in an entire circumferential direction without depending on liquid pressure in the amount of liquid to be supplied. <P>SOLUTION: The liquid supply apparatus is capable of supplying liquid to the lower surface of the rotating substrate 3 supported by a substrate supporting base 1. A liquid pooling area 5 having an annular internal circumferential is provided on the lower surface of the substrate 3, and a fin 7 which rotates together with a rotating shaft 2 is also provided to give a centrifugal force to the liquid within the liquid pooling area 5. By the centrifugal force given to the liquid by the fin 7, the liquid is supplied to the entire circumferential direction of the lower surface of the substrate 3. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention supplies a liquid such as pure water in the entire circumferential direction of the lower surface of a substrate such as a semiconductor wafer which is supported and rotated by a rotating device which rotates about a rotating shaft (the liquid is applied to the lower surface). The present invention relates to a liquid supply method and a liquid supply device suitable for

[0002]

2. Description of the Related Art Conventionally, in order to uniformly supply (spray the liquid on the lower surface) the liquid from the rotating side to the lower surface of a substrate such as a semiconductor wafer which is supported and rotated by a rotating device which rotates about a rotating shaft as described above. Sends liquid through a rotary joint and piping to a liquid jet nozzle provided on the rotating side, jets the liquid from the liquid jet nozzle toward the lower surface of the substrate, and the liquid that reaches the lower surface by the centrifugal force of the rotating substrate is placed on the lower surface of the substrate. Along the radial direction. And the flow rate of the supplied liquid is
The liquid pressure through the piping is adjusted.

As described above, the conventional liquid supply method has a problem that the mechanism is complicated because the rotary joint is used. Also, since rotary joints and pipes are used, due to contamination of the rotary joints and pipes,
There is also a problem that the liquid is contaminated and, as a result, the substrate is also contaminated. Further, since the liquid jetting nozzle is used, the liquid can be sprayed only on the portion where the nozzle is present, so that there is a problem that it is difficult to uniformly supply the liquid to the entire peripheral surface of the lower surface of the substrate. Further, since the liquid flow rate to be supplied is adjusted using the liquid pressure, there is also a problem that the liquid flow rate to be supplied changes due to fluctuations in the liquid pressure.

[0004]

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and has a simple mechanism, a small number of contaminated parts, and a liquid flow rate to be supplied without being influenced by the liquid pressure. It is an object of the present invention to provide a liquid supply method and a liquid supply device capable of uniformly supplying liquid in the entire circumferential direction of the lower surface of a substrate.

[0005]

In order to solve the above problems, the invention according to claim 1 is a liquid supply method for supplying a liquid to the lower surface of a substrate which is supported by substrate supporting means and rotates.
A liquid pool having an annular inner circumference is provided below the substrate, a centrifugal force is applied to the liquid in the liquid pool, and the liquid is supplied to the lower surface of the substrate by the centrifugal force.

As described above, a centrifugal force is applied to the liquid in the liquid pool provided under the substrate, and the liquid is supplied to the lower surface of the substrate by the centrifugal force, so that the liquid pool does not have to pass through a nozzle, a rotary joint, or a pipe. The liquid can be easily supplied directly to the entire circumference of the lower surface of the substrate. Further, the liquid can be stably supplied without changing the liquid supply amount due to the liquid supply pressure or the like. Further, the number of places where the liquid is contaminated can be reduced.

According to a second aspect of the invention, there is provided a liquid supply device for supplying a liquid to the lower surface of the substrate which is supported by the substrate supporting means and rotates, and a liquid pool having an annular inner circumference is provided below the substrate. At the same time, a centrifugal force applying means for applying a centrifugal force to the liquid in the liquid pool is provided, and the liquid is supplied to the lower surface of the substrate by the centrifugal force applied to the liquid by the centrifugal force applying means.

As described above, since the liquid is supplied to the liquid in the liquid pool provided under the substrate by the centrifugal force applied by the centrifugal force applying means, the liquid is supplied in the entire circumferential direction of the lower surface of the substrate. Can directly supply the liquid to the lower surface of the substrate without using a nozzle, a rotary joint, or a pipe, and the liquid supply device has a simple structure. Moreover, since the liquid supply amount does not change due to the liquid supply pressure and the like, and the structure is simple, the number of places where the liquid is contaminated can be reduced.

According to a third aspect of the present invention, in the liquid supply apparatus according to the second aspect, the substrate supporting means is a substrate supporting means that rotates about a rotation axis and supports and rotates the substrate surface. The pool is characterized in that it is a pool having concentric grooves arranged on the outer circumference of the rotation axis of the substrate supporting means.

By imparting a centrifugal force to the liquid in the liquid pool of the concentric grooves arranged on the outer periphery of the rotation shaft of the substrate supporting means as described above, the liquid rises from the concentric grooves by the centrifugal force and directly moves to the substrate. It is uniformly supplied in the entire circumferential direction of the lower surface.

According to a fourth aspect of the present invention, in the liquid supply apparatus according to the third aspect, the centrifugal force applying means is interlocked with the rotation of the rotating shaft of the rotating means, and the fins move in the circumferential direction in the liquid pool. Is characterized in that.

Since the centrifugal force applying means is a fin that moves in the circumferential direction in the liquid pool in conjunction with the rotation of the rotating shaft of the rotating means, a special force for applying a centrifugal force to the liquid in the liquid pool is provided. It does not require that transmission mechanism.

According to a fifth aspect of the present invention, in the liquid supply apparatus according to the fourth aspect, a guide plate for guiding the liquid diffused by centrifugal force toward the lower surface of the substrate is provided above the liquid pool. Is characterized by.

By providing the guide plate above the liquid pool as described above, the liquid diffused by centrifugal force can be guided in the entire circumferential direction of the lower surface of the substrate, and the liquid can be efficiently supplied to the lower surface of the substrate. can do.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram showing the configuration of a liquid supply apparatus according to the present invention. In FIG. 1, reference numeral 1 denotes a substrate support base that rotates in a direction of an arrow A about a rotation axis 2. A substrate 3 such as a semiconductor wafer is placed and supported on the substrate support base 1 by vacuum suction or the like. There is. A liquid pool 5 having an annular groove 4 concentric with the rotary shaft 2 is arranged near the outer circumference of the rotary shaft 2. Pure water Q is supplied from the liquid supply port 6 into the annular groove 4 of the liquid pool 5.

Reference numeral 7 denotes a cylindrical fin, the tip (lower end) of which is submerged in the pure water Q in the annular groove 4, and the upper end of which is fixed to the substrate support 1 and It rotates with the rotation. Above the liquid pool 5, a trumpet-shaped tubular guide plate 8 is arranged continuously to the outer peripheral wall of the annular groove 4.

In the liquid supply device having the above structure, when pure water Q is supplied from the liquid supply port 6 into the annular groove 4 of the liquid pool 5 and the substrate support 1 is rotated at high speed in the direction of arrow A about the rotation shaft 2. The pure water Q in the annular groove 4 becomes a flow that moves in the annular groove 4 in the circumferential direction as the fin 7 rotates, and centrifugal force is applied. Due to this centrifugal force, the pure water Q flows up along the inner surface of the guide plate 8 while expanding in the circumferential direction and the radial direction,
After reaching the lower surface of the substrate 3, the centrifugal force by which the substrate 3 rotates further expands in the radial direction and flows along the lower surface to be drained.

As described above, the pure water Q is applied to the inner surface of the guide plate 8 by the centrifugal force as shown by arrows a to d only by rotating the fin 7 whose tip is submerged in the annular groove 4 of the liquid pool 5. The pure water Q is supplied to the lower surface of the substrate 3 as it flows up and rises in the circumferential direction along the radial direction to reach the lower surface of the substrate 3 and further flows in the radial direction along the lower surface of the substrate 3. Therefore, the pure water Q can be directly supplied uniformly in the entire circumferential direction of the lower surface of the substrate 3 with a simple configuration without using a nozzle, a rotary joint, or a pipe unlike the conventional case.

Further, since the pure water Q is stored in the annular groove 4 of the liquid pool 5, the pure water Q is stably applied to the lower surface of the substrate 3 without being affected by the supply pressure of the pure water Q which is conventionally supplied. Water Q can be supplied. Further, by simply rotating the fin 7 fixed to the substrate support base 1 together with the substrate support base 1,
Since the pure water Q in the annular groove 4 can be directly supplied to the lower surface of the substrate 3, it is possible to minimize the contamination from the piping and the like.

FIG. 2 is a diagram showing another structure of the liquid supply apparatus according to the present invention. 1 is different from the liquid supply device of FIG. 1 in that the liquid pool 5 having an annular groove 4 concentric with the rotary shaft 2 is provided at the base of the rotary shaft 2 in FIG. In the apparatus, as shown in FIG. 2, it is near the outer periphery of the upper part of the rotary shaft 2 and the water outlet of the annular groove 4 is close to the lower surface of the substrate 3. Further, the cylindrical fin 9 has an inverted trapezoidal cross section.

Also in the liquid supply apparatus having the structure shown in FIG.
By rotating the fins 9, the pure water Q flows upward by the centrifugal force while expanding in the circumferential direction and the radial direction along the inner surface of the guide plate 8 by the centrifugal force, as shown by the arrows a to c. Since it flows along the lower surface of the substrate 3 while further expanding in the radial direction, the pure water Q can be directly supplied uniformly in the entire circumferential direction of the lower surface of the substrate 3 with a simple configuration.

Further, like the liquid supply device of FIG. 1, since the pure water Q is stored in the annular groove 4 of the liquid pool 5, it is stable without being affected by the supply pressure of the pure water supplied as in the conventional case. Then, the pure water Q can be supplied to the entire lower surface of the substrate 3 in the circumferential direction. Further, by simply rotating the fin 9 fixed to the substrate support 1 together with the substrate support 1, pure water Q in the annular groove 4
Since it can be supplied to the lower surface of the substrate 3, it is possible to minimize contamination from the piping.

In the liquid supply apparatus shown in FIGS. 1 and 2, the rotation shaft 2 of the substrate support base 1 which rotates about the rotation shaft 2 is used.
A case where a liquid pool 5 having an annular groove 4 concentric with the rotary shaft 2 is provided near the outer periphery of the substrate is not limited to this, and as shown in FIG. The table 11 is structured so as to adsorb and support the upper surface of the substrate 13 and rotate in the direction of arrow B around the rotary shaft 12, and a liquid pool 15 having a circular annular groove 14 is arranged below the substrate 13 and further. A liquid supply in which a rotary shaft 20 is arranged at the center of the liquid pool 15 and a cylindrical fin 21 whose tip (lower end) is submerged in the pure water Q in the annular groove 14 is arranged on the rotary shaft 20. It may be a device. Pure water Q is supplied to the annular groove 14 of the liquid pool 15 from the liquid supply port 16.

In the liquid supply apparatus having the structure shown in FIG. 3, the substrate support 11 is rotated about the rotary shaft 12 in the direction of arrow B, and the fins 21 are rotated about the rotary shaft 20 in the direction of arrow C (arrow B). And the arrow C is in the same direction), the pure water Q in the annular groove 14 becomes a flow that moves in the circumferential direction as the fins 21 rotate, and the centrifugal force thereof causes a guide plate as shown by arrows a to c. Along the inner surface of 18 while flowing in the circumferential direction and in the radial direction, the flow rises and reaches the lower surface of the substrate 13,
It flows along the lower surface of the substrate 13 while further expanding in the radial direction. As a result, as with the liquid supply device having the configuration shown in FIGS. 1 and 2, the pure water Q can be directly and uniformly supplied to the entire lower surface of the substrate 13 with a simple configuration.

A liquid jet nozzle is arranged inside the rotary shaft 20, and the liquid discharge port 20a of the liquid jet nozzle is provided on the substrate 13.
The front surface of the pure water Q by causing the pure water Q to be ejected toward the back surface (lower surface) of the substrate 13 from the liquid discharge port 20a as shown by an arrow d so that the pure water Q approaches the back surface (lower surface). The tension is used to make the supply of pure water Q to the peripheral portion of the back surface of the substrate 13 efficient. Further, a cover 22 may be provided on the outer peripheral portion of the substrate 13 in order to prevent it from being transmitted along the back surface of the substrate 13 and diffused and scattered to the outside (this is shown in FIGS. 1 and 2).
The same applies to the liquid supply device shown in FIG.

Although FIG. 3 shows an example in which the liquid pool 15 has the circular annular groove 14, in the liquid pool 15, pure water Q is caused to flow in the circumferential direction, and by the centrifugal force applied,
Any structure may be used as long as it is suitable for raising pure water, so that it is sufficient that at least the inner periphery has a side wall having a circular shape.

FIG. 4 is a diagram showing another structure of the liquid supply apparatus according to the present invention. The liquid supply device includes a cylindrical cover 30 having an open upper end, a substrate mounting portion 31 on which the substrate 3 is mounted is formed inside the upper end of the cover 30, and the upper end of the cover 30 has a circular circumference. A plurality of spin chucks 33 that rotate around the rotation shaft 32 at predetermined intervals in the direction are provided. The substrate 3 can be fixed by the spin chuck 33 while being placed on the substrate rest 31. Cover 3
An annular groove 34 is provided inside 0, and a trumpet-shaped guide plate 35 is disposed on the outer peripheral upper portion of the annular groove 34.
The cover 30 can rotate about a rotation shaft 36.

A fixed liquid jet nozzle 37 is arranged inside the rotary shaft 36. The liquid ejection port 37a of the liquid jet nozzle 37 is arranged close to the back surface (lower surface) of the substrate 3. Pure water Q supplied to the liquid jet nozzle 37 is supplied to the annular groove 34 through a rotary joint 38. Further, fins 39 are fixedly arranged on the liquid jet nozzle 37 so that the lower end is inserted into the annular groove 34.

In the liquid supply apparatus having the structure shown in FIG. 4, when the cover 30 is rotated about the rotary shaft 36 in the direction of arrow D, the annular groove 34 is rotated and the pure water Q therein is also rotated. Due to this rotation, the pure water Q is caused by its centrifugal force and is indicated by arrows ac
As shown in FIG. 5, the inner surface of the guide plate 35 expands in the circumferential direction and then rises to reach the lower surface of the substrate 3. Further, the pure water Q is jetted from the liquid discharge port 37a of the liquid jet nozzle 37 as shown by the arrow d, reaches the back surface of the substrate 3, and is transmitted to the peripheral portion by the surface tension of the liquid itself and is efficiently supplied. Pure water, which is about to be scattered on the outer periphery of the substrate 3, contacts the inner surface of the cover 30 and is not scattered to the outside.

In the above example, pure water is supplied, but the liquid supplied by the liquid supply apparatus according to the present invention is not limited to pure water, and any kind of liquid may be used. The good thing is right.

[0031]

As described above, according to the invention described in each claim, the following excellent effects can be obtained.

According to the first aspect of the present invention, the centrifugal force is applied to the liquid in the liquid pool provided below the substrate, and the centrifugal force causes the liquid to be supplied to the lower surface of the substrate. It is possible to provide a liquid supply method for directly and directly supplying liquid from the liquid reservoir to the entire circumference of the lower surface of the substrate without using a rotary joint or piping. Further, since the liquid is stored in the liquid pool, it is possible to stably supply the liquid without changing the liquid supply amount due to the liquid supply pressure and the like, and it is possible to reduce the number of places where the liquid is contaminated. be able to.

According to the second aspect of the invention, the liquid is supplied to the liquid in the liquid pool provided below the substrate by the centrifugal force applied by the centrifugal force applying means in the entire circumferential direction of the lower surface of the substrate. Similarly to the above, the liquid can be directly supplied to the lower surface of the substrate from the liquid reservoir without passing through the nozzle, the rotary joint, or the pipe, and the liquid supply device having a simple structure can be provided. Further, since the liquid is stored in the liquid pool, it is possible to stably supply the liquid without changing the liquid supply amount due to the liquid supply pressure or the like. Further, since the structure is simple, the number of places where the liquid is contaminated can be reduced, so that the liquid can be prevented from being contaminated.

According to the third aspect of the present invention, the centrifugal force is applied to the liquid in the liquid pool of the concentric grooves arranged on the outer circumference of the rotation axis of the substrate supporting means, whereby the liquid is centrifugally applied to the concentric grooves. Thus, it is possible to provide a liquid supply device having a simple structure in which the liquid is directly supplied to the entire surface of the lower surface of the substrate evenly.

According to the fourth aspect of the invention, the centrifugal force imparting means is a fin that moves in the circumferential direction in the liquid pool in conjunction with the rotation of the rotary shaft of the rotating means. It is possible to provide a liquid supply device having a simple structure that does not require a special power for imparting a centrifugal force to and a transmission mechanism therefor.

According to the invention described in claim 5, by providing the guide plate on the upper part of the liquid pool, the liquid diffused by centrifugal force can be guided in the entire circumferential direction of the lower surface of the substrate, and the efficiency can be improved. It is possible to provide a liquid supply device having a simple structure that can well supply liquid to the lower surface of the substrate.

[Brief description of drawings]

FIG. 1 is a diagram showing a configuration of a liquid supply apparatus according to the present invention.

FIG. 2 is a diagram showing another configuration of the liquid supply apparatus according to the present invention.

FIG. 3 is a diagram showing another configuration of the liquid supply apparatus according to the present invention.

FIG. 4 is a diagram showing another configuration of the liquid supply apparatus according to the present invention.

[Explanation of symbols]

1 Substrate support 2 rotation axes 3 substrates 4 annular groove 5 pool 6 liquid supply port 7 fins 8 information board 9 fins 11 Substrate support 12 rotation axes 13 board 14 annular groove 15 Liquid pool 16 liquid supply port 18 Information board 20 rotation axis 21 fins 22 cover 30 covers 31 Substrate placement section 32 rotation axis 33 Spin chuck 34 annular groove 35 guide plate 36 rotation axis 37 Liquid injection nozzle 38 Rotary joint 39 fins

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Norio Kimura             11-1 Haneda Asahi-cho, Ota-ku, Tokyo Co., Ltd.             Inside the EBARA CORPORATION F term (reference) 3B116 AA03 AB03 AB34 AB47 BB21                 3B201 AA03 AB03 AB34 AB47 BB21

Claims (5)

[Claims] 1. A liquid supply method for supplying a liquid to a lower surface of a substrate which is supported and rotated by a substrate supporting means, wherein a liquid pool having an annular inner periphery is provided below the substrate, and the liquid pool in the liquid pool is provided. A liquid supply method, wherein a centrifugal force is applied to the liquid, and the liquid is supplied to the lower surface of the substrate by the centrifugal force. 2. A liquid supply device for supplying a liquid to a lower surface of a substrate which is supported by a substrate supporting means and rotates, wherein a liquid pool having an annular inner periphery is provided below the substrate, and the liquid pool is provided in the liquid pool. A liquid supply device, wherein a centrifugal force applying means for applying a centrifugal force to the liquid is provided, and the liquid is supplied to the lower surface of the substrate by the centrifugal force applied to the liquid by the centrifugal force applying means. 3. The liquid supply apparatus according to claim 2, wherein the substrate supporting unit is a substrate supporting unit that rotates about a rotation axis and supports and rotates a substrate surface, and the liquid pool is the substrate supporting unit. A liquid supply device comprising a liquid pool having concentric circular grooves arranged on the outer circumference of the rotating shaft of the means. 4. The liquid supply apparatus according to claim 3, wherein the centrifugal force applying means is a fin that moves in the circumferential direction in the liquid pool in conjunction with the rotation of the rotating shaft of the rotating means. Characteristic liquid supply device. 5. The liquid supply apparatus according to claim 4, wherein a guide plate for guiding the liquid diffused by the centrifugal force toward the lower surface of the substrate is provided above the liquid pool. Liquid supply device.