JP2003257622A - Organic el display device and manufacturing method therefor - Google Patents
Organic el display device and manufacturing method thereforInfo
- Publication number
- JP2003257622A JP2003257622A JP2002053194A JP2002053194A JP2003257622A JP 2003257622 A JP2003257622 A JP 2003257622A JP 2002053194 A JP2002053194 A JP 2002053194A JP 2002053194 A JP2002053194 A JP 2002053194A JP 2003257622 A JP2003257622 A JP 2003257622A
- Authority
- JP
- Japan
- Prior art keywords
- organic
- layer
- substrate
- light emitting
- transparent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000000758 substrate Substances 0.000 claims abstract description 75
- 238000007789 sealing Methods 0.000 claims abstract description 63
- 230000002093 peripheral effect Effects 0.000 claims abstract description 33
- 239000010409 thin film Substances 0.000 claims abstract description 23
- 238000010030 laminating Methods 0.000 claims abstract description 3
- 239000010410 layer Substances 0.000 claims description 142
- 239000000463 material Substances 0.000 claims description 41
- 238000006243 chemical reaction Methods 0.000 claims description 29
- 239000000853 adhesive Substances 0.000 claims description 20
- 230000001070 adhesive effect Effects 0.000 claims description 20
- 239000011241 protective layer Substances 0.000 claims description 16
- 229920001296 polysiloxane Polymers 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 4
- 229920002379 silicone rubber Polymers 0.000 claims description 4
- 239000004945 silicone rubber Substances 0.000 claims description 4
- 239000000565 sealant Substances 0.000 claims description 2
- 239000008393 encapsulating agent Substances 0.000 claims 1
- 238000002347 injection Methods 0.000 description 17
- 239000007924 injection Substances 0.000 description 17
- 239000010408 film Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 239000011521 glass Substances 0.000 description 6
- 230000006835 compression Effects 0.000 description 5
- 238000007906 compression Methods 0.000 description 5
- 229910044991 metal oxide Inorganic materials 0.000 description 5
- 150000004706 metal oxides Chemical class 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- -1 or the like Substances 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 230000008646 thermal stress Effects 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 150000001340 alkali metals Chemical class 0.000 description 2
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 2
- 150000001342 alkaline earth metals Chemical class 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- IOJUPLGTWVMSFF-UHFFFAOYSA-N benzothiazole Chemical compound C1=CC=C2SC=NC2=C1 IOJUPLGTWVMSFF-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 239000011575 calcium Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000007850 fluorescent dye Substances 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 239000003550 marker Substances 0.000 description 2
- 230000000116 mitigating effect Effects 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 239000011591 potassium Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 229910052712 strontium Inorganic materials 0.000 description 2
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910017107 AlOx Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910003070 TaOx Inorganic materials 0.000 description 1
- 229910003087 TiOx Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 229910052809 inorganic oxide Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- HLLICFJUWSZHRJ-UHFFFAOYSA-N tioxidazole Chemical compound CCCOC1=CC=C2N=C(NC(=O)OC)SC2=C1 HLLICFJUWSZHRJ-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
- H10K59/8792—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. black layers
Landscapes
- Electroluminescent Light Sources (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、高精細で、耐環境
性ならびに生産性に優れ、携帯端末機や産業用計測器の
表示など、広範囲な用途に応用可能な有機ELディスプ
レイに関し、特に、いわゆるトップエミッション型の有
機ELディスプレイとその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic EL display having high definition, excellent environmental resistance and productivity, which can be applied to a wide range of applications such as displays of portable terminals and industrial measuring instruments, and in particular, The present invention relates to a so-called top emission type organic EL display and a manufacturing method thereof.
【0002】[0002]
【従来の技術】近年、情報通信の高速化と応用範囲の拡
大が急速に進んでいる。この中で、表示デバイスには携
帯性や動画表示の要求に対応可能な低消費電力・高速応
答性を有する高精細な表示デバイスについて、数々の発
明がなされている。中でも、カラー化方式に対して、薄
膜トランジスタ(以下でTFTともいう)を用いた駆動
方式のカラー表示装置が考えられている。この場合、T
FTが形成されている基板側に光を取り出す構成では、
配線部分の光の遮光効果により、開口率が上がらないた
め、最近ではTFTが形成されている基板とは反対側に
光を取り出す構成、すなわちトップエミッション型の表
示装置の開発が進んでいる。2. Description of the Related Art In recent years, the speed of information communication and the range of applications have been rapidly increasing. Among them, various inventions have been made on the display device, which is a high-definition display device having low power consumption and high-speed responsiveness that can meet the requirements of portability and moving image display. Above all, a driving type color display device using a thin film transistor (hereinafter, also referred to as a TFT) is being considered for the colorization type. In this case, T
In the configuration where light is extracted to the side of the substrate on which the FT is formed,
Since the aperture ratio does not increase due to the light shielding effect of the wiring portion, recently, a structure for extracting light to the side opposite to the substrate on which the TFT is formed, that is, a top emission type display device has been developed.
【0003】トップエミッション型の場合でも、赤、
青、緑の3原色の発光体をマトリクス状に分離配置する
構成では、RGB用の発光材料をマトリクス状に高精細
に配置しなくてはならないため、効率的かつ安価に製造
することは困難であり、同時に、3種の発光材料の輝度
変化特性や駆動条件が異なるために、色再現性を長時間
確保することが困難であるなどの欠点が残されている。Even in the case of the top emission type, red,
In the structure in which the luminous bodies of the three primary colors of blue and green are separately arranged in a matrix, it is necessary to arrange the luminous materials for RGB with high precision in a matrix, so that it is difficult to manufacture efficiently and inexpensively. However, at the same time, the three types of light-emitting materials have different brightness change characteristics and driving conditions, and thus it is difficult to ensure color reproducibility for a long time.
【0004】また、白色で発光するバックライトにカラ
ーフィルタを用い、3原色を透過分離させる構成でも、
バックライトの高効率化といった問題点は残されてい
る。分離配置した蛍光体に吸収させ、それぞれの蛍光体
から多色の蛍光を発光させる色変換型においては、TF
T駆動方式を用いたトップエミッション型を採用するこ
とで、高精細で高輝度の有機ELディスプレイを提供で
きる可能性を有するものであり、特開平11−2510
59号公報、特開2000−77191号公報に開示さ
れている。In addition, a color filter is used for a backlight that emits white light, and the three primary colors are transmitted and separated.
The problem of high backlight efficiency remains. In the color conversion type in which the phosphors that are separately arranged absorb each other, and each phosphor emits multicolored fluorescence,
By adopting the top emission type using the T drive system, there is a possibility that an organic EL display with high definition and high brightness can be provided.
It is disclosed in Japanese Patent Laid-Open No. 59 and Japanese Patent Laid-Open No. 2000-77191.
【0005】従来のトップエミッション型の有機ELデ
ィスプレイの例を、断面概略図として図2に示す。基板
1の上に、TFT2、陽極3、有機EL発光層4、陰極
5形成する。続いて、透明基板11の上にカラーフィル
タ12、ブラックマスク13を形成する。次に、基板1
の周辺を、例えば室温硬化型2液エポキシ系接着剤を使
用して封止層31を形成し、透明基板と貼り合わせを行
う。この時、2枚の基板の間には内部空間32が形成さ
れる。封止層31の硬化時間は室温で24時間とかなり
の長時間が必要で、有機EL発光層とカラーフィルタと
の位置合わせを行った場合、室温硬化の間、固定して位
置ずれを起こさないようにする必要がある。An example of a conventional top emission type organic EL display is shown in FIG. 2 as a schematic sectional view. The TFT 2, the anode 3, the organic EL light emitting layer 4, and the cathode 5 are formed on the substrate 1. Then, the color filter 12 and the black mask 13 are formed on the transparent substrate 11. Next, substrate 1
A sealing layer 31 is formed on the periphery of, using, for example, a room temperature curable two-component epoxy adhesive, and is bonded to a transparent substrate. At this time, an internal space 32 is formed between the two substrates. The curing time of the sealing layer 31 is 24 hours at room temperature, which is a considerably long time, and when the organic EL light emitting layer and the color filter are aligned with each other, the sealing layer 31 is fixed during the room temperature curing so as not to be displaced. Need to do so.
【0006】図2に示すディスプレイでは、詳細なカラ
ー表示機能を有するとともに、EL素子が色再現性を含
め長期間安定性を有し、かつ短時間で製造可能である必
要がある。In the display shown in FIG. 2, it is necessary that the EL element has a detailed color display function, the EL element has long-term stability including color reproducibility, and can be manufactured in a short time.
【0007】[0007]
【発明が解決しようとする課題】図2の構成のような有
機ELディスプレイでは、有機EL発光層4とカラーフ
ィルタ12との精密な位置合わせが必要で、アライメン
トが完了するまでは、封止層31に使用した接着剤は粘
度変化やゲル化等の性状変化が起こらずに自由にアライ
メント調整が行えることが求められる。一方、アライメ
ントが完了した時点では、早く硬化を完了しなければな
らないという相反した硬化特性が求められる。In the organic EL display having the structure shown in FIG. 2, precise alignment between the organic EL light emitting layer 4 and the color filter 12 is required, and the sealing layer is required until the alignment is completed. The adhesive used for No. 31 is required to be able to freely perform alignment adjustment without changing properties such as viscosity change and gelation. On the other hand, when the alignment is completed, the contradictory curing characteristics that the curing must be completed quickly are required.
【0008】また、2枚の基板間に形成された内部空間
32の影響で、有機EL発光層4からの発光が屈折率の
大きく異なる空気層界面で反射してしまう問題がある。
この問題を解決するため、内部空間32に屈折率の大き
な材料を充填し硬化することが考えられる。しかし、例
えば充填する材料の弾性率が高いと、使用環境の温度変
化により発生する熱応力により、有機EL発光層やカラ
ーフィルタ層から、剥離が発生するという重大な問題が
ある。Further, due to the influence of the internal space 32 formed between the two substrates, there is a problem that the light emitted from the organic EL light emitting layer 4 is reflected at the air layer interface having a large difference in refractive index.
In order to solve this problem, it is possible to fill the internal space 32 with a material having a large refractive index and cure the material. However, for example, when the elastic modulus of the material to be filled is high, there is a serious problem that peeling occurs from the organic EL light emitting layer and the color filter layer due to the thermal stress generated by the temperature change of the use environment.
【0009】尚、ここで、特開平3−190084号公
報には、2枚の基板を接着部でエポキシ樹脂を用い接着
し、内部空間には絶縁性材料を充填するという記載があ
る。しかし、この特開平3−190084号公報に記載
された発明においては、トップエミッション型有機EL
ディスプレイ特有の課題の解決はなされていない。第1
に、有機EL発光層とカラーフィルタとの正確な位置合
わせを行う必要から、位置合わせのあいだは接着剤が硬
化を開始してはならない点であり、なおかつ位置合わせ
が完了した時点では、接着剤の短時間硬化が外周封止層
に求められる点である。第2は、有機EL発光層からの
光を反射させずにカラーフィルタに有効に光を伝える機
能として、屈折率が高く、熱応力による剥離を緩和する
機能がある材料が、内部封止層に求められる点である。Incidentally, Japanese Patent Application Laid-Open No. 3-190084 describes that two substrates are adhered to each other by using an epoxy resin at their adhering portions, and an internal space is filled with an insulating material. However, in the invention disclosed in Japanese Patent Laid-Open No. 190084/1993, a top emission type organic EL is used.
The problem peculiar to the display has not been solved. First
In addition, since it is necessary to perform accurate alignment between the organic EL light emitting layer and the color filter, the adhesive must not start curing during alignment, and at the time when alignment is completed, the adhesive cannot be cured. That is, the short-time curing is required for the outer peripheral sealing layer. Secondly, a material having a high refractive index and a function of mitigating peeling due to thermal stress as a function of effectively transmitting light to the color filter without reflecting light from the organic EL light emitting layer is used as the internal sealing layer. This is the point required.
【0010】本発明の目的は、有機EL発光層とカラー
フィルタの正確な位置合わせを行い、かつ短時間硬化が
可能な外周封止の構成と、有機EL発光層からの光を反
射させずにカラーフィルタに有効に伝え、外部環境から
の水分等の浸入を防止し、長期にわたって安定した発光
特性を維持可能な有機ELディスプレイとその製造方法
を提供することにある。It is an object of the present invention to perform a precise alignment between an organic EL light emitting layer and a color filter, and a peripheral sealing structure capable of curing for a short time, and to prevent light from the organic EL light emitting layer from being reflected. It is an object of the present invention to provide an organic EL display capable of effectively transmitting to a color filter, preventing intrusion of moisture or the like from the external environment, and maintaining stable light emitting characteristics for a long period of time, and a manufacturing method thereof.
【0011】[0011]
【課題を解決するための手段】上記の目的を達成するた
めに、本発明によれば、基板上に形成されたソース及び
ドレインを有する薄膜トランジスタと、この薄膜トラン
ジスタの上部に前記ソースまたはドレインに接続された
導電性薄膜材料からなる第1の電極、有機EL発光層、
及び少なくとも透明導電性材料を備えてなる第2の電極
と、保護層とを積層して構成され、前記薄膜トランジス
タによって駆動される有機EL発光素子と、透明基板
と、この透明基板に形成された色変換フィルタ層とを有
する積層体とを、前記有機EL発光層と前記色変換フィ
ルタ層との位置を合わせて封止接合する有機ELディス
プレイにおいて、基板と透明基板とを封止接合する外周
封止層と、この外周封止層の内側に有機EL発光層の発
光の内部空間界面における反射を抑制するために充填さ
れる内部封止層とを設けたこととする。In order to achieve the above-mentioned object, according to the present invention, a thin film transistor having a source and a drain formed on a substrate, and the source or the drain connected to the upper portion of the thin film transistor. A first electrode made of a conductive thin film material, an organic EL light emitting layer,
And an organic EL light-emitting element that is formed by laminating a second electrode including at least a transparent conductive material and a protective layer, and is driven by the thin film transistor, a transparent substrate, and a color formed on the transparent substrate. In an organic EL display in which a laminated body having a conversion filter layer is sealed and bonded by aligning the organic EL light emitting layer and the color conversion filter layer, a peripheral sealing for sealing and bonding a substrate and a transparent substrate. It is assumed that a layer and an inner sealing layer filled to suppress reflection of light emitted from the organic EL light emitting layer at the internal space interface are provided inside the outer peripheral sealing layer.
【0012】ここで、外周封止層に紫外線硬化型接着剤
もしくは可視光硬化型接着剤を使用し、内部封止層に屈
折率が1.3から2.5の弾性透明封止剤を使用するこ
とが好ましい。弾性透明封止剤として透明シリコーンゴ
ム材料もしくは透明シリコーンゲル材料を使用すること
がよい。一方、本発明の製造方法は、基板上に形成され
たソース及びドレインを有する薄膜トランジスタと、こ
の薄膜トランジスタの上部に前記ソースまたはドレイン
に接続された導電性薄膜材料からなる第1の電極、有機
EL発光層、及び少なくとも透明導電性材料を備えてな
る第2の電極と、保護層とを積層して構成され、前記薄
膜トランジスタによって駆動される有機EL発光素子を
形成する工程と、透明基板と、この透明基板に形成され
た色変換フィルタ層とを有する積層体を形成する工程
と、前記基板と前記透明基板との外周を、一部に未塗布
部分を有する外周封止層により正確な位置合わせを行な
って接着する工程と、この未塗布部分より、基板と透明
基板と外部封止層とにより囲まれた空間に内部封止層を
充填する工程と、前記外周封止層の未塗布部分を塞ぐ工
程と、を有することとする。Here, an ultraviolet curable adhesive or a visible light curable adhesive is used for the outer peripheral sealing layer, and an elastic transparent sealing agent having a refractive index of 1.3 to 2.5 is used for the inner sealing layer. Preferably. A transparent silicone rubber material or a transparent silicone gel material may be used as the elastic transparent sealant. On the other hand, the manufacturing method of the present invention comprises a thin film transistor having a source and a drain formed on a substrate, a first electrode made of a conductive thin film material connected to the source or the drain on the thin film transistor, and organic EL light emission. A layer, a second electrode including at least a transparent conductive material, and a protective layer, and a step of forming an organic EL light emitting device driven by the thin film transistor; a transparent substrate; A step of forming a laminated body having a color conversion filter layer formed on a substrate, and accurate alignment of the outer peripheries of the substrate and the transparent substrate with an outer peripheral sealing layer partially having an uncoated portion And a step of filling the space surrounded by the substrate, the transparent substrate, and the outer sealing layer with the inner sealing layer from the uncoated portion, and the outer peripheral sealing. And further comprising the step of closing the uncoated portion of the layer, the.
【0013】外周封止層には、有機EL発光層とカラー
フィルタとの正確な位置合わせを行い、かつ短時間に硬
化する機能と、硬化後の外部環境からの水分等の浸入を
防止する機能が求められるので、上記材料が適してい
る。内部封止層には、有機EL発光層からの光をカラー
フィルタに伝えるため、屈折率が高く、硬化時の硬化収
縮による剥離の防止と環境温度からの熱応力による剥離
を緩和する機能がもとめられるため、屈折率が1.3か
ら2.5で、圧縮弾性率が50kg/mm2(490M
Pa)以下の上記の材料が適している。屈折率は、有機
発光素子の他の構成要素(例えば陰極)の屈折率が1.
3〜2.5の範囲なので、この範囲の材料を充填するこ
と、すなわち屈折率の差を小さくすることが、光のロス
の低減につながる。また、圧縮弾性率の上記範囲は、経
験的に求められた値である。The outer peripheral sealing layer has a function of accurately aligning the organic EL light emitting layer and the color filter and curing in a short time, and a function of preventing moisture or the like from entering from the external environment after curing. Therefore, the above materials are suitable. Since the internal sealing layer transmits the light from the organic EL light emitting layer to the color filter, it has a high refractive index and is required to have a function of preventing peeling due to curing shrinkage during curing and mitigating peeling due to thermal stress from ambient temperature. Therefore, the refractive index is 1.3 to 2.5, and the compression elastic modulus is 50 kg / mm 2 (490M
The above materials below Pa) are suitable. Regarding the refractive index, the refractive index of other constituent elements (eg, cathode) of the organic light emitting device is 1.
Since it is in the range of 3 to 2.5, filling the material in this range, that is, reducing the difference in refractive index, leads to reduction of light loss. Further, the above range of the compression elastic modulus is a value obtained empirically.
【0014】[0014]
【発明の実施の形態】本発明の有機ELディスプレイに
ついて以下に説明する。図1は、本発明の実施形態を示
す有機ELディスプレイの構成断面図である。以下の説
明では、第1の電極が陽極3である場合を説明するが、
第1の電極を陰極とすることも可能である。BEST MODE FOR CARRYING OUT THE INVENTION The organic EL display of the present invention will be described below. FIG. 1 is a configuration cross-sectional view of an organic EL display showing an embodiment of the present invention. In the following description, the case where the first electrode is the anode 3 will be described.
The first electrode can also be the cathode.
【0015】A.有機EL発光素子
本発明の有機EL発光素子は、基板1と、基板1上に形
成されるTFT2と、図示しない平坦化絶縁膜と、陽極
3と、有機EL発光層4と、陰極5と、保護層6とを含
む。
1:TFT部
本発明の有機ELディスプレイのTFT部は、基板1
と、TFT2と、平坦化絶縁膜と、陽極3とを含む。A. Organic EL Light Emitting Element The organic EL light emitting element of the present invention includes a substrate 1, a TFT 2 formed on the substrate 1, a flattening insulating film (not shown), an anode 3, an organic EL light emitting layer 4, and a cathode 5. And a protective layer 6. 1: TFT part The TFT part of the organic EL display of the present invention is the substrate 1
A TFT 2, a flattening insulating film, and an anode 3.
【0016】ガラスやプラスチックなどからなる絶縁性
基板、または、半導電性や導電性基板に絶縁性の薄膜を
形成した基板1上に、TFT2がマトリクス状に配置さ
れ、各画素に対応した陽極3にソース電極が接続され
る。TFT2の上部には、平坦化された絶縁膜が形成さ
れる。この絶縁膜は、ソース電極と陽極3との接続およ
びその他の回路の接続に必要な部分以外に設けられ、基
板1表面を平坦化して、引き続く層の高精細なパターン
形成を容易にする。ソース電極と陽極3とは、平坦化絶
縁膜内に設けられたコンタクトホールに充填された導電
性プラグにより接続されてもよい。TFTs 2 are arranged in a matrix on an insulating substrate made of glass, plastic, or the like, or a substrate 1 having a semiconductive or conductive substrate on which an insulating thin film is formed, and an anode 3 corresponding to each pixel is formed. The source electrode is connected to. A flattened insulating film is formed on the TFT 2. This insulating film is provided in a portion other than the portion necessary for connecting the source electrode and the anode 3 and for connecting other circuits, and flattens the surface of the substrate 1 to facilitate formation of a highly precise pattern in the subsequent layer. The source electrode and the anode 3 may be connected by a conductive plug filled in a contact hole provided in the planarization insulating film.
【0017】陽極3は、TFT2上に形成された平坦化
絶縁膜上に形成される。正孔の注入を効率よく行うため
に、陽極3には仕事関数が大きい材料が用いられる。本
発明のトップエミッション方式の場合、陽極3は透明で
ある必要は無いが、ITO、IZOなどの導電性金属酸
化物を用いることができる。さらに、ITOなどの導電
性金属酸化物を用いる場合、その下に反射率の高いメタ
ル電極(アルミ、銀、モリブデン、タングステンなど)
を用いることが好ましい。このメタル電極は、導電性金
属酸化物より抵抗率が低いので、補助電極として機能す
ると同時に、有機EL発光層4にて発光される光をカラ
ーフィルタ12側に反射して、光の有効利用を図ること
が可能となる。The anode 3 is formed on the flattening insulating film formed on the TFT 2. A material having a large work function is used for the anode 3 in order to efficiently inject holes. In the case of the top emission method of the present invention, the anode 3 does not need to be transparent, but a conductive metal oxide such as ITO or IZO can be used. Furthermore, when a conductive metal oxide such as ITO is used, a metal electrode with high reflectance (aluminum, silver, molybdenum, tungsten, etc.) is formed under the conductive metal oxide.
Is preferably used. Since this metal electrode has a resistivity lower than that of the conductive metal oxide, it functions as an auxiliary electrode, and at the same time, reflects the light emitted from the organic EL light emitting layer 4 toward the color filter 12 side to effectively use the light. It is possible to plan.
【0018】第1の電極を陰極として用いる場合、TF
T2のドレインと接続される。また、導電性金属酸化物
に代えて、仕事関数が小さい材料であるリチウム、ナト
リウム等のアルカリ金属、カリウム、カルシウム、マグ
ネシウム、ストロンチウム等のアルカリ土類金属、また
はこれらのフッ化物等からなる電子注入性の金属、その
他の金属との合金や化合物を用いる。
2:有機EL発光層および陰極
TFT2と陽極3がパターン形成されたTFT2部上
に、有機EL発光層4および陰極5を設ける。色変換方
式を用いる場合、有機EL発光層4から発光される近紫
外から可視領域の光、好ましくは青色から青緑色領域の
光を色変換フィルタ層に入射させて、所望の色を呈する
可視光を放出する。When the first electrode is used as a cathode, TF
It is connected to the drain of T2. Further, instead of the conductive metal oxide, an electron injection consisting of a material having a small work function such as lithium, sodium or the like alkali metal, potassium, calcium, magnesium, strontium or the like alkaline earth metal, or a fluoride or the like thereof. Use a metal or an alloy or compound with other metals. 2: Organic EL light emitting layer and cathode The organic EL light emitting layer 4 and the cathode 5 are provided on the TFT 2 portion in which the TFT 2 and the anode 3 are patterned. When the color conversion method is used, the near-ultraviolet to visible region light, preferably the blue to blue-green region light emitted from the organic EL light emitting layer 4 is made incident on the color conversion filter layer, and visible light having a desired color is obtained. To release.
【0019】有機EL発光層4は、陽極3と陰極5とを
併せた構成で表現すると、必要に応じて、正孔注入層、
正孔輸送層、および/または電子注入層を介在させた構
造を有し、具体的には下記のような層構成からなるもの
が採用される。
陽極、有機EL発光層、陰極
陽極、正孔注入層、有機EL発光層、陰極
陽極、有機EL発光層、電子注入層、陰極
陽極、正孔注入層、有機EL発光層、電子注入層、陰極
陽極、正孔注入層、正孔輸送層、有機EL発光層、電子
注入層、陰極
上記の各層の材料としては、公知のものが使用される。
青色から青緑色の発光を得るためには、有機EL発光層
4中に、例えばベンゾチアゾール系等の蛍光増白剤、金
属キレート化オキソニウム化合物等が好ましく使用され
る。When the organic EL light emitting layer 4 is expressed by a structure in which the anode 3 and the cathode 5 are combined, if necessary, a hole injection layer,
It has a structure in which a hole transport layer and / or an electron injection layer are interposed, and specifically, one having the following layer structure is adopted. Anode, organic EL light emitting layer, cathode anode, hole injection layer, organic EL light emitting layer, cathode anode, organic EL light emitting layer, electron injection layer, cathode anode, hole injection layer, organic EL light emitting layer, electron injection layer, cathode Known materials are used as materials for the anode, hole injection layer, hole transport layer, organic EL light emitting layer, electron injection layer, and cathode.
In order to obtain blue to blue green light emission, for example, a fluorescent brightening agent such as a benzothiazole type, a metal chelated oxonium compound, or the like is preferably used in the organic EL light emitting layer 4.
【0020】陰極5に用いる材料は、電子を効率よく注
入するために仕事関数が小さいことが求められる。さら
に、本実施形態のトップエミッション色変換方式では、
有機EL発光層4からの光が陰極5を通して放出される
ので、この光の波長域において透明であることが必要で
ある。この2つの特性を両立するため、本発明において
陰極5を複数層からなる積層構造とすることが好まし
い。何故なら、仕事関数の小さい材料は、一般的に透明
性が低いからである。すなわち、有機EL発光層と接触
する部位に、リチウム、ナトリウム等のアルカリ金属、
カリウム、カルシウム、マグネシウム、ストロンチウム
等のアルカリ土類金属、またはこれらのフッ化物等から
なる電子注入性の金属、その他の金属との合金や化合物
の薄膜を用いる。仕事関数の小さい材料を用いるもとに
より効率のよい電子注入を可能とし、さらに薄膜とする
ことにより、これらの材料による透明性低下を最低限と
することが可能となる。この薄膜の上には、ITOまた
はIZO等の透明導電膜を形成する。これらの導電膜は
補助膜として機能し、陰極5全体の抵抗値を減少させ有
機EL発光層に対して十分な電流を供給できる。The material used for the cathode 5 is required to have a small work function in order to efficiently inject electrons. Furthermore, in the top emission color conversion system of this embodiment,
Since the light from the organic EL light emitting layer 4 is emitted through the cathode 5, it is necessary to be transparent in the wavelength range of this light. In order to make these two characteristics compatible with each other, in the present invention, the cathode 5 preferably has a laminated structure composed of a plurality of layers. This is because a material having a low work function generally has low transparency. That is, an alkali metal such as lithium or sodium is added to a portion in contact with the organic EL light emitting layer,
A thin film of an alkaline earth metal such as potassium, calcium, magnesium, or strontium, an electron-injecting metal such as a fluoride thereof, an alloy with another metal, or a compound is used. It is possible to more efficiently inject electrons by using a material having a low work function, and by using a thin film, it is possible to minimize deterioration in transparency due to these materials. A transparent conductive film such as ITO or IZO is formed on this thin film. These conductive films function as an auxiliary film, reduce the resistance value of the entire cathode 5, and can supply a sufficient current to the organic EL light emitting layer.
【0021】第2の電極を陽極として用いる場合、正孔
注入効率を高めるために仕事関数の大きな材料を用いる
必要がある。また、有機EL発光層4からの発光が第2
の電極を通過するために、透過性の高い材料を用いる必
要がある。ITOやIZOが好ましい。
3:保護層6
以上のように形成される第2の電極以下の各層を覆っ
て、保護層6が設けられる。保護層6は、外部環境から
の酸素、低分子成分、水分の透過を防止し、それらによ
る有機EL発光層4の機能低下の防止に有効である。保
護層6は、その上への他の層の形成を容易にするため、
適当な硬度を有することが好ましい。When the second electrode is used as the anode, it is necessary to use a material having a large work function in order to enhance the hole injection efficiency. Further, the light emitted from the organic EL light emitting layer 4 is the second
It is necessary to use a highly transparent material in order to pass through the electrodes of ITO and IZO are preferred. 3: Protective layer 6 The protective layer 6 is provided so as to cover the layers below the second electrode formed as described above. The protective layer 6 is effective in preventing the permeation of oxygen, low molecular weight components, and water from the external environment and preventing the functional deterioration of the organic EL light emitting layer 4 due to them. The protective layer 6 facilitates the formation of other layers thereon,
It preferably has an appropriate hardness.
【0022】これらの要請を満たすために、保護層6
は、可視域における透明性が高く(400〜700nm
の範囲で透過率50%以上)、電気絶縁性を有し、水
分、酸素等に対するバリア性を有し、好ましくは2H以
上の膜硬度を有する材料で形成される。例えば、SiO
x,SiNx,AlOx,TiOx,TaOx,ZnO
x等の無機酸化物、無機窒化物等の材料を使用できる。
この保護層の形成方法としては、スパッタ法、蒸着法、
ディップ法、CVD法等がある。To meet these requirements, the protective layer 6
Has high transparency in the visible range (400 to 700 nm).
(Transmittance of 50% or more in the above range), electrical insulation, barrier properties against moisture, oxygen, etc., and preferably a material having a film hardness of 2H or more. For example, SiO
x, SiNx, AlOx, TiOx, TaOx, ZnO
Materials such as inorganic oxides such as x and inorganic nitrides can be used.
As the method of forming this protective layer, a sputtering method, a vapor deposition method,
There are a dip method, a CVD method and the like.
【0023】また、保護層6として、様々なポリマー材
料を用いることができる。イミド変性シリコーン樹脂、
酸化チタン等の無機金属化合物をアクリル、ポリイミ
ド、シリコーン樹脂等の中に分散した材料等を使用可能
である。上述の保護層6は単層でも良いが、複数の層を
積層するとその効果が大きい。保護層6の厚さは、0.
1〜10μmであることが好ましい。
B.色変換フィルタ
本発明の色変換フィルタは、第2の基板である透明基板
11と、この透明基板11に積層され、所望される各色
に対応するカラーフィルタ12および/またはカラーフ
ィルタ12と図示を省略した蛍光変換層との積層体と、
ブラックマスク13とを含む。尚、本明細書において、
「色変換フィルタ」とは、透明基板と、カラーフィルタ
12、およびカラーフィルタ12と蛍光変換層との積層
体の総称である。
1:透明基板
透明基板11としては、フィルム状をなすプラスチック
材料が好ましい。厚さは20μmから500μmが適当
である。基板としてフィルム状をなすプラスチック類を
用いると、本発明の有機ELディスプレイをガラスを用
いる場合に比べ軽量にでき、かつ曲げ応力にも強いもの
にできる。但し、本発明においては、透明基板として、
ガラスを除外するものではない。As the protective layer 6, various polymer materials can be used. Imide-modified silicone resin,
A material in which an inorganic metal compound such as titanium oxide is dispersed in acrylic, polyimide, silicone resin or the like can be used. The above-mentioned protective layer 6 may be a single layer, but when a plurality of layers are laminated, the effect is great. The protective layer 6 has a thickness of 0.
It is preferably 1 to 10 μm. B. Color Conversion Filter The color conversion filter of the present invention includes a transparent substrate 11 that is a second substrate, a color filter 12 and / or a color filter 12 that is laminated on the transparent substrate 11 and corresponds to each desired color, and is not shown. A laminate with the fluorescence conversion layer,
And a black mask 13. In the present specification,
“Color conversion filter” is a general term for a transparent substrate, a color filter 12, and a laminate of the color filter 12 and a fluorescence conversion layer. 1: Transparent Substrate The transparent substrate 11 is preferably a film-shaped plastic material. A suitable thickness is 20 μm to 500 μm. By using film-shaped plastics as the substrate, the organic EL display of the present invention can be made lighter in weight and stronger in bending stress than when glass is used. However, in the present invention, as the transparent substrate,
It does not exclude glass.
【0024】尚、本明細書において「透明」とは、可視
光を10〜100%透過するものを言うが、可視光透過
率は、蛍光変換層で使用される蛍光色素の変換性能にも
依存するが、好ましくは40〜80%程度である。
2:色変換フィルタ層
本明細書において、色変換フィルタ層とは、カラーフィ
ルタ12、またはカラーフィルタ12と図示しない蛍光
変換層との積層体である。蛍光変換層は、有機EL発光
層で発光される近紫外領域ないし可視領域の光、特に青
色ないし青緑色領域の光を吸収して、異なる波長の可視
光を蛍光として発光するものである。フルカラー表示を
可能にするには、少なくとも青色領域、緑色領域、赤色
領域の光を放出する独立した層が設けられる。The term "transparent" as used herein refers to a material that transmits 10% to 100% of visible light, but the visible light transmittance also depends on the conversion performance of the fluorescent dye used in the fluorescent conversion layer. However, it is preferably about 40 to 80%. 2: Color Conversion Filter Layer In this specification, the color conversion filter layer is the color filter 12 or a laminated body of the color filter 12 and a fluorescent conversion layer (not shown). The fluorescence conversion layer absorbs light in the near-ultraviolet region or visible region, particularly light in the blue or blue-green region emitted by the organic EL light emitting layer, and emits visible light of different wavelengths as fluorescence. To enable full color display, separate layers are provided that emit at least blue, green and red light.
【0025】赤色に関しては、蛍光変換層のみから形成
されても良い。しかし、蛍光色素による変換のみでは十
分な色純度が得られない場合は、蛍光変換層とカラーフ
ィルタとの積層体としても良い。緑色も赤色と同様であ
る。一方、青色に関しては、有機EL発光層から青色光
を発光させる場合、カラーフィルタのみとすることがで
きる。その厚さは1〜10μmが好ましい。Regarding red, it may be formed only from the fluorescence conversion layer. However, when sufficient color purity cannot be obtained only by conversion with a fluorescent dye, a laminate of a fluorescence conversion layer and a color filter may be used. Green is the same as red. On the other hand, for blue, when the organic EL light emitting layer emits blue light, only the color filter can be used. The thickness is preferably 1 to 10 μm.
【0026】色変換フィルタ層の形状は、公知のよう
に、各色ごとに分離したストライプパターンとしてもよ
いし、各画素のサブピクセルごとに分離させた構造を有
しても良い。各色に対応する色変換フィルタ層のあいだ
の領域には、ブラックマスク13を形成することが好ま
しい。ブラックマスクを設けることにより、隣接するサ
ブピクセルの色変換フィルタへの光の漏れを防止して、
にじみの無い所望の蛍光変換色のみを得ることが可能と
なる。ブラックマスクは好ましくは1〜6μmの厚さを
有する。
C.封止層
1:内部封止層
内部封止層22は、従来法のディスプレイにおいて形成
される内部空間32を充填して、有機EL発光層4の発
光の内部空間界面における反射を抑制し、発光をカラー
フィルタ12へと効率良く透過させるために設ける。内
部封止層22は、波長400〜800nmの光に対して
10〜100%、好ましくは50%以上の可視光透過率
と、1.3〜2.5の屈折率とを有する材料から形成さ
れる。そのような材料の例は、透明シリコーンゴム、透
明シリコーンゲルのような有機材料が挙げられる。As is well known, the shape of the color conversion filter layer may be a stripe pattern in which each color is separated, or a structure in which it is separated for each subpixel of each pixel. A black mask 13 is preferably formed in the region between the color conversion filter layers corresponding to each color. Providing a black mask prevents light from leaking to the color conversion filters of adjacent sub-pixels,
It is possible to obtain only the desired fluorescence conversion color without bleeding. The black mask preferably has a thickness of 1-6 μm. C. Sealing Layer 1: Inner Sealing Layer The inner sealing layer 22 fills the inner space 32 formed in the conventional display, suppresses reflection of light emitted from the organic EL light emitting layer 4 at the inner space interface, and emits light. Are provided in order to efficiently transmit the light to the color filter 12. The inner sealing layer 22 is formed of a material having a visible light transmittance of 10 to 100%, preferably 50% or more, and a refractive index of 1.3 to 2.5 with respect to light having a wavelength of 400 to 800 nm. It Examples of such materials include organic materials such as transparent silicone rubber, transparent silicone gel.
【0027】充填剤は、2つの基板を外周封止層により
貼りあわされた後に、外周封止層21に設けられた注入
口を通して、基板間に充填されるとよい。このような充
填剤を用いることにより、有機EL発光層4からの発光
の伝達経路の屈折率差を小さくすることができ、各界面
における反射を抑制し、カラーフィルタ12への光の伝
達をより効率的に行うことが可能となる。
2:外周封止層
外周封止層21は、基板外周部に設けられ、基板1と透
明基板11とを接着するとともに、内部の各構成要素を
外部環境の酸素、水分等から保護する。外周封止層21
は、可視光硬化型接着剤もしくは紫外線硬化型接着剤か
ら形成され、内部に、直径3〜50μmのビーズを含む
こともできる。この場合、ビーズにより、基板間距離を
規定するとともに、接着のために印加される圧力を負担
できる。さらに、ディスプレイ駆動時に発生する応力も
負担して、この応力によるディスプレイの劣化を防止す
る。The filler may be filled between the substrates through the injection port provided in the outer peripheral sealing layer 21 after the two substrates are pasted together by the outer peripheral sealing layer. By using such a filler, it is possible to reduce the difference in the refractive index of the transmission path of the light emitted from the organic EL light emitting layer 4, suppress the reflection at each interface, and further transmit the light to the color filter 12. It becomes possible to carry out efficiently. 2: Outer peripheral sealing layer The outer peripheral sealing layer 21 is provided on the outer peripheral portion of the substrate, adheres the substrate 1 and the transparent substrate 11, and protects each internal constituent element from oxygen, moisture and the like in the external environment. Outer peripheral sealing layer 21
Is formed of a visible light curable adhesive or an ultraviolet curable adhesive, and may have beads having a diameter of 3 to 50 μm therein. In this case, the beads can define the distance between the substrates and bear the pressure applied for adhesion. Further, the stress generated when the display is driven is also borne and the deterioration of the display due to this stress is prevented.
【0028】内部封止層22が基板1と透明基板11と
の貼り合わせ後に注入により形成される場合、外周封止
層21の一部に未塗布部分を設けて、この未塗布部分を
内部封止層の注入口として使用できる。この注入口は、
注入終了後に、外周封止層材料を付着および硬化させ
て、塞ぐことができる。
実施例1
以下に、本発明の実施例を具体的に述べる。When the inner sealing layer 22 is formed by injection after the substrate 1 and the transparent substrate 11 are bonded together, an uncoated portion is provided in a part of the outer peripheral sealing layer 21, and this uncoated portion is internally sealed. Can be used as an injection port for a stop layer. This inlet is
After the injection is complete, the peripheral sealing layer material can be deposited and cured to plug it. Example 1 An example of the present invention will be specifically described below.
【0029】基板1(本実施例ではガラス基板)の上
に、TFT2、陽極3、有機EL発光層4、陰極5、保
護層6を順次形成する。次に、透明基板11(本実施例
では透明ガラス基板)の上に、カラーフィルタ12、ブ
ラックマスク13を順次形成する。このようにして形成
された2枚の基板をグローブボックス内の乾燥窒素雰囲
気下(酸素および水分濃度ともに1ppm以下)で次の
工程を行う。A TFT 2, an anode 3, an organic EL light emitting layer 4, a cathode 5 and a protective layer 6 are sequentially formed on a substrate 1 (a glass substrate in this embodiment). Next, the color filter 12 and the black mask 13 are sequentially formed on the transparent substrate 11 (transparent glass substrate in this embodiment). The two substrates thus formed are subjected to the next step in a dry nitrogen atmosphere in a glove box (both oxygen and water concentrations are 1 ppm or less).
【0030】有機EL発光層側のガラス基板1の外周部
分にディスペンサーロボット(接着剤の塗布装置で、X
Yロボットにより駆動される)により、エポキシ系材料
である、紫外線硬化型接着剤(スリーボンド社製、商品
名:30Y−437)を使用した外周封止層21を形成
し、カラーフィルタ12側の透明ガラス基板11を貼り
合わせる。A dispenser robot (adhesive coating device, X
Driven by a Y robot) to form an outer peripheral sealing layer 21 using an ultraviolet curable adhesive (manufactured by ThreeBond, trade name: 30Y-437), which is an epoxy material, and is transparent on the color filter 12 side. The glass substrate 11 is attached.
【0031】この時、外周封止層21の塗布形状は、一
部に未塗布部分(図示せず)を設けた形状(本実施例で
は、四角形のディスプレイ外周の一部に未塗布部分を設
ける)で塗布を行い、未塗布部分を内部封止層22の材
料注入口として後に使用する。その後、有機EL発光層
4とカラーフィルタ12とを対応させるべくアライメン
トを行い、紫外線硬化条件として波長365nm、10
0mW/cm2の照度で30秒間紫外線を照射して外周
封止層21を硬化させる。At this time, the coating shape of the outer peripheral sealing layer 21 is a shape in which an uncoated portion (not shown) is partially provided (in the present embodiment, the uncoated portion is provided in a portion of the outer periphery of the rectangular display). ) Is applied, and the uncoated portion is used later as a material injection port of the internal sealing layer 22. After that, alignment is performed so that the organic EL light emitting layer 4 and the color filter 12 correspond to each other, and a wavelength of 365 nm and a wavelength of 10 are set as ultraviolet curing conditions.
The outer peripheral sealing layer 21 is cured by irradiating with ultraviolet rays for 30 seconds at an illuminance of 0 mW / cm 2 .
【0032】次に、外周封止層21の一部に設けられた
注入口から、ディスペンサーにより屈折率がおよそ1.
45で圧縮弾性率が0.5kg/mm2以下の透明シリ
コーンゴム材料(信越化学工業製、商品名:KE10
3)を注入し、80℃60分で硬化を行い、内部封止層
22を形成する。その後、外周封止層21に設けた材料
注入口を、外周封止層21と同じ紫外線硬化型接着剤を
用いて封止し、有機ELディスプレイが完成する。Next, from the injection port provided in a part of the outer peripheral sealing layer 21, the refractive index is about 1.
A transparent silicone rubber material with a compression elastic modulus of 45 and a compression elastic modulus of 0.5 kg / mm 2 or less (manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KE10
3) is injected and cured at 80 ° C. for 60 minutes to form the internal sealing layer 22. After that, the material injection port provided in the outer peripheral sealing layer 21 is sealed using the same UV-curable adhesive as the outer peripheral sealing layer 21, and the organic EL display is completed.
【0033】尚、本実施例では、有機EL発光層からは
青色光を発光させている。よって、カラーフィルタ12
のBは、フィルタのみで構成されているが、カラーフィ
ルタ12のGならびにRは、波長変換を行う図示しない
蛍光層がフィルタと積層されている。また、内部封止層
の厚さは、3〜5μm(最大で10μm程度)、外周封
止層の厚さは、5〜30μm(最大で100μm程度)
である。In this embodiment, blue light is emitted from the organic EL light emitting layer. Therefore, the color filter 12
B of No. 2 is composed of only a filter, but G and R of the color filter 12 have a fluorescent layer (not shown) that performs wavelength conversion laminated with the filter. The thickness of the inner sealing layer is 3 to 5 μm (maximum of about 10 μm), and the thickness of the outer peripheral sealing layer is 5 to 30 μm (maximum of about 100 μm).
Is.
【0034】以上のようにして、基板1と基板11との
間隔(ギャップ)は、5〜100μmの間隔で固定さ
れ、外部環境からの水分の浸入が防止され、長期信頼性
を有する有機ELディスプレイとなる。ここで、本発明
によれば、上記の実施例のようにディスプレイを形成す
ることにより、有機EL発光層4とカラーフィルタ12
との正確な位置合わせが可能となる。すなわち、基板1
と透明基板11のそれぞれに取り付けられた、図示を省
略したマーカにより位置合わせを行うが、この時、外周
封止層21に使用される接着剤には、次の2つの特性が
求められる。塗布された接着剤は、両方の基板が組み合
わされ、マーカによる位置合わせが完了するまでは、硬
化せずに自由な位置合わせ(微動)が行える必要があ
り、位置合わせが完了した時点では、短時間で硬化を完
了することが求められる。上記のような紫外線硬化型接
着剤、ならびに下記する可視光硬化型接着剤を使用する
ことにより、この2つの特性が満足される。As described above, the distance between the substrate 1 and the substrate 11 is fixed at a distance of 5 to 100 μm, moisture is prevented from entering from the external environment, and the organic EL display has long-term reliability. Becomes Here, according to the present invention, the organic EL light emitting layer 4 and the color filter 12 are formed by forming the display as in the above embodiment.
Accurate alignment with That is, the substrate 1
Positioning is performed by a marker (not shown) attached to each of the transparent substrate 11 and the transparent substrate 11. At this time, the adhesive used for the outer peripheral sealing layer 21 is required to have the following two characteristics. The applied adhesive needs to be able to be freely aligned (fine movement) without curing until both substrates are combined and the alignment by the marker is completed. It is required to complete curing in time. These two characteristics are satisfied by using the ultraviolet curable adhesive as described above and the visible light curable adhesive described below.
【0035】実施例2
本実施例の基本構成は実施例1と同様である。ただし、
外周封止層21には可視光硬化型接着剤を使用し、内部
封止層22には透明シリコーンゲル材料を使用する。こ
の可視光硬化型接着剤は、例えば東亜合成製、商品名ラ
ックストラックLCR0275であり、アクリル系材料
である。また硬化条件は、波長400nm、照度100
mW/cm2、照射時間30秒である。可視光硬化型接
着剤は、紫外線硬化型接着剤に比べ、照射装置が安価
で、設備コストが有利である。透明シリコーンゲル材料
は、信越化学工業製、商品名KE104Gelで、屈折
率はおよそ1.45、圧縮弾性率は0.5kg/mm2
以下である。Embodiment 2 The basic structure of this embodiment is the same as that of the first embodiment. However,
A visible light curable adhesive is used for the outer peripheral sealing layer 21, and a transparent silicone gel material is used for the inner sealing layer 22. This visible light curable adhesive is, for example, LUXTRACK LCR0275, manufactured by Toagosei, and is an acrylic material. The curing conditions are: wavelength 400 nm, illuminance 100
mW / cm 2 , irradiation time 30 seconds. The visible light curable adhesive has a cheaper irradiation device and is more costly than the ultraviolet curable adhesive. The transparent silicone gel material is Shin-Etsu Chemical Co., Ltd., trade name KE104Gel, and has a refractive index of about 1.45 and a compression elastic modulus of 0.5 kg / mm 2.
It is the following.
【0036】[0036]
【発明の効果】本発明によれば、上記の構成を採用した
結果、外周封止層により、有機EL発光層とカラーフィ
ルタとの正確な位置合わせと短時間での固定が行なえ、
外部環境からの水分等の浸入を防止することが可能とな
った。さらに、内部封止層により、有機EL発光層から
の光の反射を防止し、カラーフィルタに光を有効に伝え
ることができ、併せて、硬化時の硬化収縮による剥離の
防止と環境温度からの熱応力による剥離を緩和するこ
と、ならびに外部環境からの水分等の浸入を防止し、長
期にわたって安定した発光特性を維持することが可能と
なった。According to the present invention, as a result of adopting the above-mentioned structure, the outer peripheral sealing layer enables the organic EL light emitting layer and the color filter to be accurately aligned and fixed in a short time.
It has become possible to prevent the ingress of moisture and the like from the external environment. Furthermore, the internal sealing layer can prevent the reflection of light from the organic EL light emitting layer and can effectively transmit the light to the color filter, and at the same time, prevent the peeling due to the curing shrinkage at the time of curing and the ambient temperature. It has become possible to alleviate peeling due to thermal stress, prevent the ingress of moisture and the like from the external environment, and maintain stable emission characteristics over a long period of time.
【図1】本発明の有機ELディスプレイの構造を示す断
面図FIG. 1 is a sectional view showing a structure of an organic EL display of the present invention.
【図2】従来の有機ELディスプレイの構造を示す断面
図FIG. 2 is a sectional view showing a structure of a conventional organic EL display.
1:基板 2:薄膜トランジスタ(TFT) 3:陽極 4:有機EL発光層 5:陰極 6:保護層 11:透明基板 12:カラーフィルタ 13:ブラックマスク 21:外周封止層 22:内部封止層 31:封止層 32:内部空間 1: substrate 2: Thin film transistor (TFT) 3: Anode 4: Organic EL light emitting layer 5: cathode 6: Protective layer 11: Transparent substrate 12: Color filter 13: Black mask 21: Peripheral sealing layer 22: Internal sealing layer 31: Sealing layer 32: Internal space
Claims (5)
有する薄膜トランジスタと、この薄膜トランジスタの上
部に前記ソースまたはドレインに接続された導電性薄膜
材料からなる第1の電極、有機EL発光層、及び少なく
とも透明導電性材料を備えてなる第2の電極と、保護層
とを積層して構成され、前記薄膜トランジスタによって
駆動される有機EL発光素子と、透明基板と、この透明
基板に形成された色変換フィルタ層とを有する積層体と
を、前記有機EL発光層と前記色変換フィルタ層との位
置を合わせて封止接合する有機ELディスプレイにおい
て、基板と透明基板とを封止接合する外周封止層と、こ
の外周封止層の内側に有機EL発光層の発光の内部空間
界面における反射を抑制するために充填される内部封止
層とを設けたことを特徴とする有機ELディスプレイ。1. A thin film transistor having a source and a drain formed on a substrate, a first electrode made of a conductive thin film material connected to the source or the drain, an organic EL light emitting layer, and at least an upper portion of the thin film transistor. An organic EL light emitting element that is formed by stacking a second electrode including a transparent conductive material and a protective layer, and is driven by the thin film transistor, a transparent substrate, and a color conversion filter formed on the transparent substrate. An organic EL display in which a laminate having a layer is sealed and joined by aligning the organic EL light emitting layer and the color conversion filter layer, and a peripheral sealing layer that seals and joins a substrate and a transparent substrate. And an inner sealing layer that is filled inside the outer peripheral sealing layer to suppress reflection of light emitted from the organic EL light emitting layer at the internal space interface. Organic EL display which is characterized.
可視光硬化型接着剤を使用した請求項1記載の有機EL
ディスプレイ。2. The organic EL device according to claim 1, wherein an ultraviolet curable adhesive or a visible light curable adhesive is used for the outer peripheral sealing layer.
display.
弾性透明封止剤を使用した請求項1または請求項2に記
載の有機ELディスプレイ。3. The organic EL display according to claim 1, wherein an elastic transparent encapsulant having a refractive index of 1.3 to 2.5 is used for the inner encapsulating layer.
材料もしくは透明シリコーンゲル材料を使用した請求項
3に記載の有機ELディスプレイ。4. The organic EL display according to claim 3, wherein a transparent silicone rubber material or a transparent silicone gel material is used as the elastic transparent sealant.
有する薄膜トランジスタと、この薄膜トランジスタの上
部に前記ソースまたはドレインに接続された導電性薄膜
材料からなる第1の電極、有機EL発光層、及び少なく
とも透明導電性材料を備えてなる第2の電極と、保護層
とを積層して構成され、前記薄膜トランジスタによって
駆動される有機EL発光素子を形成する工程と、透明基
板と、この透明基板に形成された色変換フィルタ層とを
有する積層体を形成する工程と、前記基板と前記透明基
板との外周を、一部に未塗布部分を有する外周封止層に
より正確な位置合わせを行なって接着する工程と、この
未塗布部分より、基板と透明基板と外部封止層とにより
囲まれた空間に内部封止層を充填する工程と、前記外周
封止層の未塗布部分を塞ぐ工程と、を有することを特徴
とする有機ELディスプレイの製造方法。5. A thin film transistor having a source and a drain formed on a substrate, a first electrode made of a conductive thin film material connected to the source or the drain, an organic EL light emitting layer, and at least an upper portion of the thin film transistor. A step of forming an organic EL light emitting element which is constituted by laminating a second electrode provided with a transparent conductive material and a protective layer, and is driven by the thin film transistor; a transparent substrate; and a transparent substrate formed on the transparent substrate. And a step of forming a laminate having a color conversion filter layer, and a step of precisely aligning and bonding the outer peripheries of the substrate and the transparent substrate with an outer peripheral sealing layer having an uncoated part in part. And a step of filling an inner sealing layer into a space surrounded by the substrate, the transparent substrate, and the outer sealing layer from the uncoated portion, and the uncoated portion of the outer peripheral sealing layer. Method of manufacturing an organic EL display, characterized in that and a step for closing the.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002053194A JP2003257622A (en) | 2002-02-28 | 2002-02-28 | Organic el display device and manufacturing method therefor |
TW092115723A TW200428311A (en) | 2002-02-28 | 2003-06-10 | Organic EL display and manufacturing method therefor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002053194A JP2003257622A (en) | 2002-02-28 | 2002-02-28 | Organic el display device and manufacturing method therefor |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2003257622A true JP2003257622A (en) | 2003-09-12 |
Family
ID=28664682
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002053194A Pending JP2003257622A (en) | 2002-02-28 | 2002-02-28 | Organic el display device and manufacturing method therefor |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2003257622A (en) |
TW (1) | TW200428311A (en) |
Cited By (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2400981A (en) * | 2003-03-12 | 2004-10-27 | Fuji Electric Holdings Co | Method and apparatus for manufacturing an el display device |
JP2005108825A (en) * | 2003-09-12 | 2005-04-21 | Semiconductor Energy Lab Co Ltd | Light emitting apparatus and method of manufacturing the same |
JP2005190703A (en) * | 2003-12-24 | 2005-07-14 | Tohoku Pioneer Corp | Organic el panel and its manufacturing method |
JP2005332589A (en) * | 2004-05-18 | 2005-12-02 | Hitachi Displays Ltd | Organic electroluminescent display device |
JP2006106448A (en) * | 2004-10-07 | 2006-04-20 | Dainippon Printing Co Ltd | Optical filter and organic el display using the optical filter |
WO2006109493A1 (en) * | 2005-03-24 | 2006-10-19 | Kyocera Corporation | Luminescent element, light emitting deivce comprising said luminescent element, and process for producing the same |
JP2006302878A (en) * | 2005-03-24 | 2006-11-02 | Kyocera Corp | Light emitting element, light emitting device equipped with light emitting element, and its manufacturing method |
JP2006302879A (en) * | 2005-03-24 | 2006-11-02 | Kyocera Corp | Light emitting element, light emitting device equipped with light emitting element, and its manufacturing method |
JP2008235089A (en) * | 2007-03-22 | 2008-10-02 | Fuji Electric Holdings Co Ltd | Organic el display panel and its manufacturing method |
CN100433352C (en) * | 2003-09-25 | 2008-11-12 | 友达光电股份有限公司 | Top-lighting organic electroluminescent display device and its mfg method |
US7508005B2 (en) | 2004-03-25 | 2009-03-24 | Sanyo Electric Co., Ltd. | Light emitting display apparatus with slight color shifting |
US7554259B2 (en) * | 2004-03-24 | 2009-06-30 | Sanyo Electric Co., Ltd. | Light emitting display apparatus having excellent color reproducibility |
JP2010027599A (en) * | 2008-07-17 | 2010-02-04 | Samsung Mobile Display Co Ltd | Organic light-emitting display device and method of manufacturing the same |
EP1763095A3 (en) * | 2005-09-08 | 2010-12-22 | OSRAM Opto Semiconductors GmbH | Efficiency enhancement methods for OLED light source through index bridging |
JP2011108568A (en) * | 2009-11-20 | 2011-06-02 | Nec Lighting Ltd | Illumination fixture using organic light emitting element |
JP2012064479A (en) * | 2010-09-17 | 2012-03-29 | Casio Comput Co Ltd | Light emitting device |
US8283862B2 (en) | 2003-09-12 | 2012-10-09 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device and method for manufacturing the same |
JP2013533587A (en) * | 2010-06-22 | 2013-08-22 | コーニンクレッカ フィリップス エヌ ヴェ | Organic electroluminescent device with separating foil |
EP2284924A3 (en) * | 2009-07-28 | 2014-02-26 | Samsung Display Co., Ltd. | Organic light emitting diode display |
CN104253234A (en) * | 2013-06-28 | 2014-12-31 | 精工爱普生株式会社 | Electro-optical device, manufacturing method of electro-optical device and electronic apparatus |
JP2017228543A (en) * | 2004-09-17 | 2017-12-28 | 株式会社半導体エネルギー研究所 | Light-emitting device |
CN109841654A (en) * | 2017-11-29 | 2019-06-04 | 乐金显示有限公司 | Display device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110021647A (en) * | 2019-03-27 | 2019-07-16 | 武汉华星光电半导体显示技术有限公司 | A kind of OLED display panel and preparation method thereof |
-
2002
- 2002-02-28 JP JP2002053194A patent/JP2003257622A/en active Pending
-
2003
- 2003-06-10 TW TW092115723A patent/TW200428311A/en unknown
Cited By (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7182664B2 (en) | 2003-03-12 | 2007-02-27 | Fuji Electric Holdings Co., Ltd. | Method and an apparatus for manufacturing an organic EL display device |
GB2400981B (en) * | 2003-03-12 | 2006-03-29 | Fuji Electric Holdings Co | A method and an apparatus for manufacturing an organic EL display device |
GB2400981A (en) * | 2003-03-12 | 2004-10-27 | Fuji Electric Holdings Co | Method and apparatus for manufacturing an el display device |
JP2005108825A (en) * | 2003-09-12 | 2005-04-21 | Semiconductor Energy Lab Co Ltd | Light emitting apparatus and method of manufacturing the same |
US8283862B2 (en) | 2003-09-12 | 2012-10-09 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device and method for manufacturing the same |
CN100433352C (en) * | 2003-09-25 | 2008-11-12 | 友达光电股份有限公司 | Top-lighting organic electroluminescent display device and its mfg method |
JP2005190703A (en) * | 2003-12-24 | 2005-07-14 | Tohoku Pioneer Corp | Organic el panel and its manufacturing method |
US7554259B2 (en) * | 2004-03-24 | 2009-06-30 | Sanyo Electric Co., Ltd. | Light emitting display apparatus having excellent color reproducibility |
US7508005B2 (en) | 2004-03-25 | 2009-03-24 | Sanyo Electric Co., Ltd. | Light emitting display apparatus with slight color shifting |
JP2005332589A (en) * | 2004-05-18 | 2005-12-02 | Hitachi Displays Ltd | Organic electroluminescent display device |
JP4695345B2 (en) * | 2004-05-18 | 2011-06-08 | 株式会社 日立ディスプレイズ | Organic electroluminescence display device |
JP2020115472A (en) * | 2004-09-17 | 2020-07-30 | 株式会社半導体エネルギー研究所 | Electronic apparatus |
JP2017228543A (en) * | 2004-09-17 | 2017-12-28 | 株式会社半導体エネルギー研究所 | Light-emitting device |
JP2006106448A (en) * | 2004-10-07 | 2006-04-20 | Dainippon Printing Co Ltd | Optical filter and organic el display using the optical filter |
JP2006302879A (en) * | 2005-03-24 | 2006-11-02 | Kyocera Corp | Light emitting element, light emitting device equipped with light emitting element, and its manufacturing method |
KR100883306B1 (en) * | 2005-03-24 | 2009-02-11 | 쿄세라 코포레이션 | Luminescent element, light emitting device comprising said luminescent element, and process for producing the same |
JP2006302878A (en) * | 2005-03-24 | 2006-11-02 | Kyocera Corp | Light emitting element, light emitting device equipped with light emitting element, and its manufacturing method |
US8680543B2 (en) | 2005-03-24 | 2014-03-25 | Lg Display Co., Ltd. | Light Emitting Element Having a Capping Layer on an Electrode, Light Emitting Device Having the Same and Method for Manufacturing the Same |
WO2006109493A1 (en) * | 2005-03-24 | 2006-10-19 | Kyocera Corporation | Luminescent element, light emitting deivce comprising said luminescent element, and process for producing the same |
EP1763095A3 (en) * | 2005-09-08 | 2010-12-22 | OSRAM Opto Semiconductors GmbH | Efficiency enhancement methods for OLED light source through index bridging |
US8232721B2 (en) | 2005-09-08 | 2012-07-31 | Osram Opto Semiconductors Gmbh | Efficiency enhancement methods for OLED light source through index bridging |
JP2008235089A (en) * | 2007-03-22 | 2008-10-02 | Fuji Electric Holdings Co Ltd | Organic el display panel and its manufacturing method |
US8304989B2 (en) | 2008-07-17 | 2012-11-06 | Samsung Display Co., Ltd. | Organic light-emitting display device and method of manufacturing the same |
JP2010027599A (en) * | 2008-07-17 | 2010-02-04 | Samsung Mobile Display Co Ltd | Organic light-emitting display device and method of manufacturing the same |
EP2284924A3 (en) * | 2009-07-28 | 2014-02-26 | Samsung Display Co., Ltd. | Organic light emitting diode display |
US9112179B2 (en) | 2009-07-28 | 2015-08-18 | Samsung Display Co., Ltd. | Organic light emitting diode display |
JP2011108568A (en) * | 2009-11-20 | 2011-06-02 | Nec Lighting Ltd | Illumination fixture using organic light emitting element |
JP2013533587A (en) * | 2010-06-22 | 2013-08-22 | コーニンクレッカ フィリップス エヌ ヴェ | Organic electroluminescent device with separating foil |
JP2012064479A (en) * | 2010-09-17 | 2012-03-29 | Casio Comput Co Ltd | Light emitting device |
CN104253234A (en) * | 2013-06-28 | 2014-12-31 | 精工爱普生株式会社 | Electro-optical device, manufacturing method of electro-optical device and electronic apparatus |
CN104253234B (en) * | 2013-06-28 | 2018-01-09 | 精工爱普生株式会社 | Electro-optical device, the manufacture method of electro-optical device and electronic equipment |
CN109841654A (en) * | 2017-11-29 | 2019-06-04 | 乐金显示有限公司 | Display device |
CN109841654B (en) * | 2017-11-29 | 2023-09-15 | 乐金显示有限公司 | display device |
Also Published As
Publication number | Publication date |
---|---|
TW200428311A (en) | 2004-12-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2003257622A (en) | Organic el display device and manufacturing method therefor | |
WO2004112436A1 (en) | Organic el display and method for producing the same | |
US6897087B2 (en) | Method for producing organic EL display | |
JP3865245B2 (en) | Manufacturing method and manufacturing apparatus for organic EL display | |
TWI655764B (en) | Method for manufacturing organic light-emitting device, organic light-emitting device, and electronic device including display portion | |
JP3594018B2 (en) | Organic EL display | |
US20060128252A1 (en) | Organic electroluminescent panel and method for fabricating the same | |
WO2003101155A1 (en) | Organic el display | |
JP2005123089A (en) | Color organic el display and its manufacturing method | |
JP4036854B2 (en) | Organic electroluminescent device and manufacturing method thereof | |
WO2004112439A1 (en) | Organic el display | |
JP7564084B2 (en) | Display device and electronic device | |
JP2007103027A (en) | Organic electroluminescent display device and its manufacturing method | |
JP2012069256A (en) | Top-emission type organic el display and manufacturing method therefor | |
JP2008165108A (en) | Color filter substrate combinedly having rib function, color conversion filter substrate combinedly having rib function, color organic el element using them and manufacturing method of them | |
JP4061588B2 (en) | Manufacturing method and manufacturing apparatus for organic EL display | |
JP2004087153A (en) | Organic el display | |
JP2011054424A (en) | Top-emission type organic el display and method of manufacturing the same, and color filter used for it | |
JP2004103519A (en) | Color conversion color filter substrate and organic color display using this | |
KR20060031590A (en) | Organic el display and method of manufacturing the same | |
JP4010286B2 (en) | Manufacturing method of organic EL display | |
JP2010225325A (en) | Top-emission organic el display and method for manufacturing the same | |
JP3867914B2 (en) | Organic EL display and manufacturing method thereof | |
JP2003282261A (en) | Organic el display | |
US11495775B2 (en) | Light-emitting device including encapsulation layers having different refractive indexes, method of manufacturing the same and electronic apparatus |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20040518 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20040525 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20040721 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20040810 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20040917 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20041101 |
|
A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20050325 |