JP2003249745A - Conductive connecting portion of conductive circuit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a conductive connecting portion of a conductive circuit which can use a conductive ink which is hardened under higher temperature by utilizing a heat resistant base material such as polyimide as the base material of peeling sheet, moreover is capable of transferring, with a transfer method, an electric circuit formed on the peeling sheet to a bonding agent layer of an adhesive sheet using the base material such as low price paper and also obtaining excellent bonding with a good electrical conductive material. <P>SOLUTION: The conductive connecting portion of a conductive circuit formed on a bonding base material is composed of single wire having the width of 0.2 to 0.5 mm. Otherwise, the conductive connecting portion has the comb type or lattice type shape where the width is 0.2 to 0.5 mm and distance between wires is 0.3 to 3 mm. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive connection portion of a conductive circuit formed on an adhesive base material, and more specifically to a thin information transmission / reception type recording medium such as a non-contact IC tag. RF-ID (RadioFrequ
(energy IDentification) media,
The present invention relates to a conductive connection portion of a conductive circuit such as a paper computer and a disposable electric product.

[0002]

2. Description of the Related Art An antenna circuit (conductive circuit) used in a thin information transmission / reception type recording medium or the like is divided into an IC chip mounting interposer and an antenna holder according to FIGS. An interposer and an antenna holder are formed in advance, and a method of connecting the conductive connection portions when the antenna circuit is formed using them will be described.

FIG. 5 shows a process of forming one of the IC chip mounting interposers. First, a base material 1 having a predetermined size is prepared so as to extend over a terminal portion of an antenna holder, which will be described later (a). Conductive part 2 for mounting IC chip on material 1
And a pair of conductive patterns 4 in which the conductive connection portion 3 is continuous
(B). Thereafter, the IC chip 5 is mounted so as to extend over the IC chip mounting conductive portion 2 to form the IC chip mounting interposer A (C), and at least the IC
A conductive adhesive is applied on the conductive connection portion 3 (scheduled joining portion) on which the chip 5 is mounted to form the adhesive portion 6 (d).

FIG. 6 shows a process of forming the other antenna holder B. A base material 7 having a predetermined size is prepared (a), and the antenna conductive portion 8 and the antenna conductive portion 8 are provided on the base material 7. Conductive connection portion 9 located at the end of the terminal and serving as a terminal portion
The conductive pattern 10 composed of (the part to be joined) is provided (b), and thereby the antenna holder B is formed.
The conductive connecting portion 9 is provided so as to correspond to the conductive connecting portion 3 of the IC chip mounting interposer A. 1
Reference numeral 1 is an insulating portion.

The IC chip mounting interposer A
And the antenna holder B are overlapped so that the conductive connecting portions 3 and 9 face each other via the adhesive portion 6, and the conductive connecting portions 3 and 9 are bonded via the adhesive portion 6 and electrically. By connecting the IC chip mounting interposer A and the antenna holder B to each other for conduction, the RF-
ID medium C is obtained.

The antenna conductive portion 8, conductive connecting portion 9, insulating portion 11 and the like on the base material 7 are printed by screen printing using thermosetting conductive ink or thermosetting insulating paste, and are heated to a high temperature. Since it is often formed by curing, the base material 7 has to be made of heat-resistant material such as polyimide, polyamide, polyethylene naphthalate, glass epoxy, etc., resulting in cost increase. was there.

Therefore, in order to solve this problem, FIG.
As shown in FIG. 1, a method has been proposed in which the conductive pattern 10 is once formed on a release sheet and then the conductive pattern 10 is transferred to an adhesive base material. That is, first, a release sheet 13 in which a release agent layer 12 is formed on a heat resistant base material made of polyimide, polyamide, polyethylene naphthalate, glass epoxy or the like having a predetermined size is prepared (a), and the release sheet 13 is prepared. Similarly, a conductive pattern 10 including an antenna conductive portion 8 and a conductive connecting portion 9 (a portion to be joined) that is a terminal portion and is located at an end of the antenna conductive portion 8 is provided and heated to a high temperature to be solidified. (B),
The antenna holder B1 is formed. Reference numeral 11 is an insulating portion.
Next, the adhesive layer 14 of the adhesive base material 15 and the antenna carrier B1 in which the adhesive layer 14 is provided on the base material 7 such as paper, synthetic paper, polyester, PVC, ABS which is not so heat resistant but is inexpensive The conductive pattern 10 is superposed on the conductive pattern 10 so as to face each other, and is pressure-bonded (c), and the conductive pattern 10 including the insulating portion 11 is solidified.
It is transferred to four surfaces and both are peeled off (d). As a result, the antenna holder B is formed (e). And the above I
C chip mounting interposer A and this antenna holder B
Are superposed so that the conductive connection portions 3 and 9 face each other, and the conductive connection portions 3 and 9 are electrically connected to each other to form an IC.
By bonding the chip mounting interposer A and the antenna holder B with the adhesive layer 14 of the adhesive base material 15, FIG.
The RF-ID medium C shown in (f) is obtained. According to this method, the release sheet 13 in which the release agent layer 12 is formed on the heat resistant base material made of polyimide, polyamide, polyethylene naphthalate, glass epoxy or the like can be repeatedly used, and as the base material 7, inexpensive paper, Since polyester or the like can be used, the problem of cost increase can be avoided.

[0008]

However, according to these conventional methods, the adhesive force is insufficient and the conductive connecting portions 3 and 9 are not formed.
When an external force is concentrated on the electric connection, there is a problem that the electric connection is partially interrupted and the electric resistance is increased, or the electric connection is interrupted. An object of the present invention is to solve the conventional problems, to obtain a good conduction between conductive connection parts by a method of once forming a conductive pattern on a release sheet and then transferring this conductive pattern to an adhesive substrate. It is an object of the present invention to provide a conductive connection part of a conductive circuit which can obtain good adhesion.

[0009]

As a result of intensive studies to solve the above-mentioned problems, the inventor has a single wire having a specific line width or a specific line width and a line-to-line distance as the conductive connecting portion. The inventors have found that the use of the comb-shaped or grid-shaped conductive connecting portions makes it possible to obtain good adhesion and conduction between the conductive connecting portions, and have completed the present invention.

That is, the conductive connecting portion of the conductive circuit according to claim 1 of the present invention is the conductive connecting portion of the conductive circuit formed on the adhesive base material, and has a line width of 0.2 to 0.5 mm. It is characterized by consisting of a single wire.

The conductive connection portion of the conductive circuit according to claim 2 of the present invention is the conductive connection portion of the conductive circuit formed on the adhesive base material, and has a line width of 0.2 to 0.5 mm and a space between lines. Distance is 0.
It is characterized by having a comb shape or a lattice shape of 3 to 3 mm.

According to a third aspect of the present invention, there is provided the conductive connection portion of the conductive circuit according to the first or second aspect, wherein the conductive circuit is an antenna circuit.

The conductive connecting portion of the present invention has a single wire having a specific line width, or a comb-shaped or lattice-shaped conductive connecting portion having a specific line width and a distance between lines formed on an adhesive base material. Is. For example, at least one of a substrate on which an IC chip is mounted and a conductive connection portion of another electric circuit is formed on a bonding base material as a conductive connection portion having a shape of a single wire, a comb shape, a lattice shape, or the like, and both conductive connections are formed. When the parts are overlapped so that they face each other, and they are pressed and heated, the conductive connecting parts directly contact each other at the contact part without the use of an adhesive, and good electrical continuity is obtained, as well as good adhesion by the adhesive. Is obtained.

[0014]

DETAILED DESCRIPTION OF THE INVENTION An embodiment of the present invention will be described below with reference to the drawings. 1A to 1E are explanatory views showing a process of forming a conductive connection portion of a conductive circuit (antenna circuit) formed on the adhesive base material of the invention. A release sheet 13 in which a release agent layer 12 is formed on a heat-resistant base material made of polyimide, polyamide, polyethylene naphthalate, glass epoxy, or the like having a predetermined size is prepared (a),
The release sheet 13 is composed of an antenna conductive portion 8 using conductive ink or the like, and a comb-shaped conductive connecting portion 9A (planned joining portion) that is located at an end of the antenna conductive portion 8 and is a terminal portion. The conductive pattern 10 is provided and heated to a high temperature to be solidified to form the antenna holder B1 (b). Reference numeral 11 is an insulating portion formed using insulating ink or the like. The conductive connection portion 9A includes a plurality of conductive portions 20 having a line width d and a line distance w. Reference numeral 21 is a non-conductive portion 21. The conductive portion 20 is formed on the base material by a printing method using conductive ink or the like, or is formed by etching a metal foil. On the other hand, the non-conductive part 21 is a part where the conductive part 20 is not formed.

Next, the adhesive layer 14 of the adhesive base material 15 in which the adhesive layer 14 is provided on the inexpensive base material 7 such as paper or polyester which is not very heat resistant, and the conductive pattern 10 of the antenna holder B1 are formed. The conductive patterns 10 including the insulating patterns 11 are overlapped with each other so as to face each other and are pressure-bonded (c), and all of the solidified conductive patterns 10 including the insulating portion 11 are transferred to the surface of the adhesive layer 14 of the adhesive base material 15, and both are separated (d). As a result, the antenna holder B having the conductive connection portion of the conductive circuit (antenna circuit) formed on the adhesive base material of the present invention is formed (e).

FIG. 2 shows a process of forming an IC chip mounting interposer. First, a base material 1 such as paper having a predetermined size so as to extend over the terminal portion of the antenna holder B is prepared (a), and the base 1 is prepared. A conductive portion 2 for mounting an IC chip on the material 1;
A pair of conductive patterns 4 in which the conductive connection portion 9A and the conductive connection portion 3A having a comb shape similar to that of the conductive connection portion 9 are continuous are provided (b). After that, the IC chip 5 is mounted so as to extend over the IC chip mounting conductive portion 2 to form the IC chip mounting interposer A (C).

The IC chip mounting interposer A
And the antenna holder B are respectively connected to the conductive connection portions 3A and 9A.
The RF-ID shown in FIG. 3 is obtained by stacking so that A faces each other, adhering them through the adhesive layer 14 and achieving electrical conduction, and joining the IC chip mounting interposer A and the antenna holder B. Media C is obtained.

That is, when the IC chip mounting interposer A and the antenna holder B are superposed so that the conductive connecting portions 3A and 9A face each other, and are pressed and heated,
A large number of contacts directly contact the conductive parts 20 without interposing an adhesive to obtain good electrical conduction, and the conductive parts 2
The lines of 0 are adhered to each other by the adhesive layer 14 and good adhesion is obtained. In addition, IC chip mounting interposer A
About 0.5 m to the edge of the base material 1 on the periphery of the conductive connecting portion 3A
Since there is an interval of m or more, this portion is also adhered by the adhesive layer 14 and good adhesion can be obtained. IC
The bond between the chip-mounted interposer A and the antenna holder B is strengthened, and as a result, for example, the conductive connecting portions 3A and 9A.
Even if external force is concentrated on the
Even if the thin paper 7 is thin paper or the like having low strength and rigidity, the interposer A is not peeled off.

The line width d of the conductive portion 20 is 0.2 to 0.5 mm.
And the distance w between lines is 0.3 to 3 mm,
It is preferably 0.6 to 3 mm, more preferably 0.8 to
It is preferably 3 mm. If the line width d is less than 0.2 mm, it may be difficult to form the conductive portion 20 by printing the conductive portion 20 with a conductive ink, which may cause printing failure, and the electrical resistance of the connection portion may increase. If the line width d exceeds 0.5 mm, if the size of the conductive connection portion is constant, the distance between the lines becomes small, the exposed portion of the adhesive layer becomes small, and there is a risk of adhesion and connection failure, which is not preferable. On the other hand, if the line-to-line distance w is less than 0.3 mm, it is difficult to print by using conductive ink, and if the line-to-line distance w exceeds 3 mm, the function is good but the area of the conductive connecting portion becomes large, which is uneconomical. Therefore, both are not preferable.

In the above embodiment, the conductive connecting portion 3
Both of A and 9A have shown the example of the conductive connection part having a comb shape, but it may be a single wire type, a double wire type, a grid type, a single grid type, a net type, etc., and both have the same shape. However, it may be a conductive connecting portion having a different shape, and the other may be a conductive connecting portion having a conventional shape instead of the conductive connecting portion of the present invention.

A line width of a comb-shaped conductive connecting portion having a length of 20 mm × 5 formed on a paper base having a width of 7 mm and a length of 25 mm and a line distance of 0.6 mm is 0.1 mm to 0.7 mm. Changed to copper foil (before etching) and adhesive (Chemite TNP0300, Toshiba Chemical Co., thickness 20
μm) for bonding (0.4 MPa, 150 ° C., 10
Min.), A tester was applied to the wire pattern and the copper foil to measure the DC electric resistance and whether or not they were well adhered and connected. Table 1 shows the relationship between the line width, the electric resistance (Ω), and the adhesion / connection rate (%) (the larger the value, the better the adhesion / connection).

[0022]

[Table 1]

When the line width is 0.1 mm, printing is defective,
I couldn't test. From Table 1, the line width is 0.2 to 0.5 mm
It can be seen that when the line width is 0.6 or more, the DC electric resistance is low, but the DC electric resistance is low, but the adhesion / connection ratio is low, although the DC electric resistance is low and the adhesion / connection ratio is high.

A conductive pattern is once formed on the release sheet, and then this conductive pattern is 11.2 mm wide and 2 mm long.
Using a method of transferring to a 5 mm adhesive base material, a length of 20 m
m.times.4 pieces, comb-shaped conductive connecting portions having a line width of 0.3 mm, in which the distance between lines was changed from 0.2 mm to 3.5 mm, were bonded to a copper foil (before etching) (0. 4MP
a, 150 ° C., 10 minutes), and whether or not the line pattern and the copper foil are well adhered and connected was measured. As a result, when the distance between the lines was 0.2 mm, it was difficult to form it by the printing method and it was not practical. Distance between lines is 0.3-0.5m
In the range of m, the adhesion between the lines was insufficient, but the adhesion was performed via the adhesive layer around the conductive connection part, and good adhesion.
The connection was obtained and the electrical continuity was good.
When the distance between the lines is in the range of 0.6 to 3.0 mm, the lines are sufficiently adhered, and the adhesive layer around the conductive connection portion is also sufficiently adhered. The connection was obtained and the electrical continuity was good. When the distance between the lines was 3.5 mm, the conductive connection portion was larger than the adhesive base material having a width of 11.2 mm and protruded, so that the conductive connection portion could not be formed on the adhesive base material having a predetermined size. .
In this case, the adhesive base material may be made large, but it cannot be downsized, and it is uneconomical, which is not preferable in practice.

FIGS. 4 (A) to 4 (F) are explanatory views schematically showing conductive connecting portions having other shapes according to the present invention. Figure 4 (a)
Indicates a conductive connecting portion having a lattice type shape. The conductive connection part 16 has a shape in which a plurality of conductive parts 20 having a line width d and a plurality of non-conductive parts 21 are mixed between the conductive parts 20 (inter-line distance w). FIG. 4B shows a conductive connecting portion having another lattice type shape. The conductive connection part 17 has a shape in which a plurality of conductive parts 20 having a line width d and a plurality of non-conductive parts 21 are mixed between the conductive parts 20 (inter-line distance w). Figure 4
(C) shows a conductive connecting portion having a single wire shape. The conductive connection portion 18 is composed of a single-wire conductive portion 20 having a line width d. FIG. 4D shows another conductive connecting portion having the shape of a single wire. The conductive connection portion 19 is composed of a single-wire conductive portion 20 having a line width d. FIG. 4E shows a conductive connecting portion having a double-lined shape. The conductive connection portion 22 is a double-wire conductive portion 20 having a line width d.
And one non-conductive part 2 between the conductive parts 20 (distance w between lines).
1 has a shape that is present. FIG. 4F shows a conductive connection portion having a single lattice type shape. Conductive connection 23
Has a shape in which a conductive portion 20 having a line width d and one non-conductive portion 21 are present between the conductive portions 20 (interval distance w). The line width d of the conductive portion 20 is 0.2 to 0.5 m as described above.
m is preferable, and the line distance w is 0.3 to 3 mm.
Is preferred.

The method of conductively connecting the IC chip mounting interposer and the antenna holder is not particularly limited. For example, after the conductive connection portions are aligned with each other, a known method such as thermocompression bonding or press bonding may be used. In addition, any method such as a method using light, an electromagnetic wave, an electron beam or a combination thereof, a method of sandwiching with an ultrasonic welding tool and conductively connecting with an ultrasonic wave may be used.

In this embodiment, the conductive connection portions 3A and 9A are electrically connected without using an adhesive. However, in the present invention, an electrically conductive connection can be made by appropriately interposing an adhesive or an adhesive.

The material of the base material 1 or base material 7 used in the present invention is a woven fabric, a non-woven fabric, a mat, a paper or a combination thereof made of an inorganic or organic fiber such as glass fiber, alumina fiber, polyester fiber or polyamide fiber. Or a composite substrate formed by impregnating these with resin varnish, a polyamide resin substrate, a polyester resin substrate, a polyolefin resin substrate, a polyimide resin substrate, an ethylene / vinyl alcohol copolymer group Material,
Polyvinyl alcohol resin substrate, polyvinyl chloride resin substrate, polyvinylidene chloride resin substrate, polystyrene resin substrate, polycarbonate resin substrate, acrylonitrile butadiene styrene copolymer resin substrate, polyether sulfone resin Select from known plastic substrates such as substrates, or those that have undergone surface treatment such as corona discharge treatment, plasma treatment, ultraviolet irradiation treatment, electron beam irradiation treatment, flame plasma treatment and ozone treatment. Can be used.

The IC chip mounting interposer and the antenna holder may be formed by using the same base material or different base materials. Further, the IC chip mounting interposer and the antenna carrier may not be formed one by one, but may be formed in plural (and may be of the same kind or different kinds).

The formation of the conductive pattern 4 on the IC chip mounting interposer and the formation of the conductive pattern 10 on the antenna holder can be performed by known methods. For example, a method in which a conductive paste is printed by screen printing or inkjet printing to be dried and fixed, attachment of a coated or uncoated metal wire, etching, dispersion, metal foil attachment, direct vapor deposition of metal, metal vapor deposition film transfer, Examples thereof include formation of a conductive polymer layer, but are not limited thereto.

Further, in the antenna holder, the conductive pattern 10 is not necessarily limited to one side, and may be formed on the back side as well as on the inner layer as long as the connection which finally functions as the antenna is guaranteed. Further, it may be an antenna in which they are multiplexed. Further, it may be a pattern in which other lines are crossed by jumper lines as needed. It may be coated to protect the formed antenna.

The mounting of the IC chip in the process of forming the IC chip mounting interposer includes wire bonding (WB) and anisotropic conductive film (AC).
F), conductive paste (ACP), insulating resin (NCP),
The connection can be made by a known method such as using an insulating film (NCF) or a cream solder ball. If necessary, the connection portion may be protected and reinforced with a known underfill material or potting material.

The pressure-sensitive adhesives and adhesives used in the present invention are those described in I.
The C-chip mounting interposer and the antenna holder are not particularly limited as long as they can be firmly conductively joined to each other. Specifically, for example, a hot melt adhesive, a pressure sensitive adhesive, a thermoplastic resin adhesive or a thermosetting adhesive is used. Examples thereof include resin adhesives, adhesives that are cured by ultraviolet rays, electron beams, etc., natural rubber adhesives, synthetic rubber adhesives, and the like, and pressure-sensitive adhesives and adhesives composed of combinations thereof. Further, a conductive adhesive in which silver, aluminum or the like is added to these pressure-sensitive adhesives or adhesives to impart conductivity is also usable. As an adhesive, a tackifier (rosin and rosin derivative, polyterbene resin,
Rubber system containing known additives such as terpene phenol resin, petroleum resin), softening agent (liquid polybutene, mineral oil, liquid polyisobutylene, liquid polyacrylate), anti-aging agent, etc., multiple acrylics with different glass transition temperatures Acrylics obtained by copolymerizing acid esters and other functional monomers, silicones made of silicone rubber and resin, polyethers and polyurethane adhesives can be preferably used. These adhesives and pressure-sensitive adhesives are, in addition to a solution type dissolved in a solution, an aqueous emulsion type, a hot-melt type that is solidified by cooling after heating and melting application, after applying a liquid oligomer or monomer, etc. Some of them can be cured by irradiation with radiation such as rays, but any of them can be used.

Insulating powders such as silica, alumina, glass, talc and various rubbers, or mold release agents, surface treatment agents, fillers, pigments, dyes may be added to the pressure-sensitive adhesives and adhesives used in the present invention, if necessary. Known additives such as the above can be added.

The conductive connecting portion between the IC chip mounting interposer and the antenna holder may be formed by any method that is easy to design and manufacture, and has a processing tolerance that does not require the precision of the conductive portion for mounting the IC chip. High structure is enough.

In the above embodiment, the RF-type used in a thin information transmission / reception type recording medium such as a non-contact IC tag.
Although the connection between the conductive connection portions of the ID medium has been described, the present invention can be applied to the connection between other conductive connection portions, and specifically, for example, between the conductive connection portions such as a paper computer and a disposable electric product. It can also be applied to connections and the like.

The above description of the embodiments is for explaining the present invention, and does not limit the invention described in the claims or reduce the scope thereof. Further, the configuration of each part of the present invention is not limited to the above embodiment, and various modifications can be made within the technical scope described in the claims.

[0038]

The present invention will be described in more detail with reference to the following examples, but the present invention is not limited to these examples. (Example 1) An antenna portion was printed on a release paper (SP-8K AO, manufactured by Lintec Co., Ltd.) using a conductive ink (LS415C-K, manufactured by Asahi Chemical Laboratory), and 150
After heating at ℃ for 30 minutes, tack paper (copy tack, manufactured by Toppan Forms Co., Ltd.) is attached using a rubber roller (2 kg / cm ² , 40 ° C.), the antenna part is transferred to the tack paper side, and the paper substrate is used. An antenna was produced on the above, and an antenna holder B (adhesive base material provided with a conductive connection portion of the conductive circuit of the present invention) shown in FIG. The shape of the conductive connecting portion was a comb shape having a line distance of 0.8 mm and a line width of 0.3 mm. On the other hand, the IC is mounted on the conductive portion (land portion) for mounting the IC chip printed on NIP (non-impact printer) compatible paper (230 ° C., 0.4 MPa, 2
Second), the IC chip mounting interposer A shown in FIG. The antenna holder thus produced and the IC chip mounting interposer are superposed so that their respective conductive connecting portions face each other, and they are bonded via an adhesive layer and electrical conduction is achieved, and the IC chip mounting interposer and the antenna are mounted. By joining with the holder,
The RF-ID medium C shown in was produced. NIP this
Although it was left in an environment of 85 ° C. and 85% RH in a state of being stuck to the above, the communication state did not change and the good state was maintained. In addition, by using the IC chip mounting interposer shown in FIG. 1 by the copper foil etching method, the R shown in FIG. 3 is used.
Even when the F-ID medium C was manufactured, a similarly good state was maintained.

Example 2 An antenna portion was printed on a peeled polyamide film with a conductive ink (N-5845-1, manufactured by Shoei Chemical Industry Co., Ltd.), and after heating at 180 ° C. for 30 minutes, both surfaces were printed. Tape (No.500, manufactured by Nitto Denko Corporation)
Using a rubber roller for bonding (2 kg / cm ² , 4
(0 ° C.), the antenna portion was transferred to the double-sided tape side to produce an antenna on a paper base material, and an antenna holder B shown in FIG. The shape of the conductive connection is 0.6 mm between lines,
It had a comb shape with a line width of 0.5 mm. On the other hand, the IC is mounted on the conductive portion (land portion) for mounting the IC chip printed on NIP (non-impact printer) compatible paper (230 ° C., 0.4 MPa, 2 seconds), and the adhesive is applied to the conductive connecting portion. The IC chip mounting interposer A shown in FIG. The antenna holder thus produced and the IC chip mounting interposer are superposed so that their respective conductive connecting portions face each other, and they are bonded via an adhesive layer and electrical conduction is achieved, and the IC chip mounting interposer and the antenna are mounted. The RF-ID medium C shown in FIG. 3 was produced by joining it with a holder. When this was bonded to NIP and left in an environment of 85 ° C. and 85% RH, there was no change in the communication state and a good state was maintained.

[0040]

The conductive connecting portion of the conductive circuit according to claim 1 of the present invention is a conductive connecting portion of the conductive circuit formed on the adhesive base material and has a line width of 0.2 to 0.5 mm. Since it consists of a single wire, the structure is simple, and if a heat-resistant base material made of polyimide, polyamide, polyethylene naphthalate, glass epoxy, etc. is used as the base material of the release sheet (release paper), it will be possible to form a conductive pattern at a high temperature. Hardened conductive ink, conductive paste, etc. can be used, and the electric circuit formed on the release sheet (release paper) can be printed on inexpensive paper by transfer method,
Since it can be transferred onto the adhesive layer of an adhesive base material that uses a base material such as synthetic paper, polyester, PVC, ABS, etc., the problem of cost increase can be avoided, and the conductive connection parts do not have an adhesive at the contact part. There is a remarkable effect that good electrical conduction can be obtained by directly contacting with and the good adhesion can be obtained by adhering via the adhesive layer.

The conductive connecting portion of the conductive circuit according to claim 2 of the present invention is the conductive connecting portion of the conductive circuit formed on the adhesive base material, and has a line width of 0.2 to 0.5 mm and a space between lines. Distance is 0.
Since it has a comb-shaped or lattice-shaped shape of 3 to 3 mm, if a heat-resistant base material made of polyimide, polyamide, polyethylene naphthalate, glass epoxy or the like is used as the base material of the release sheet (release paper), a conductive pattern, etc. High-temperature curing conductive ink or conductive paste can be used to form the resin, and the electric circuit formed on the release sheet (release paper) is transferred by an inexpensive paper, synthetic paper, polyester, PV.
Since it can be transferred onto the pressure-sensitive adhesive layer of a pressure-sensitive adhesive sheet using a base material such as C or ABS, the problem of cost increase can be avoided. For example, at least the conductive connection portion of the IC chip mounting interposer A and the antenna holder B is One of them is formed on the adhesive base material as a conductive connecting portion having a comb shape or a lattice type shape, and the conductive connecting portions are overlapped with each other so that they face each other, and are pressed and heated. There is a remarkable effect that good electrical conduction can be obtained by directly contacting at a large number of contact portions without interposing an adhesive, and that good adhesion can be obtained by adhering via a adhesive layer.

The conductive connecting portion of the conductive circuit according to claim 3 of the present invention is the conductive connecting portion of the conductive circuit according to claim 1 or 2, because the conductive circuit is an antenna circuit, so that a non-contact IC tag or the like is used. The present invention has the further remarkable effect that it can be applied to RF-ID media such as thin information transmission / reception type recording media, paper computers and the like.

[Brief description of drawings]

1A to 1E are explanatory views showing a process of forming a conductive connection portion of a conductive circuit of the present invention.

2A to 2C are explanatory views showing a process of forming an IC chip mounting interposer.

FIG. 3 is an explanatory diagram showing an RF-ID medium.

4A to 4F are explanatory views showing the shapes of other conductive connection portions of the present invention.

5A to 5D are explanatory views showing a process of forming a conventional IC chip mounting interposer.

6A to 6B are explanatory views showing a process of forming an antenna holder having a conventional conductive connecting portion.

FIG. 7 is an explanatory diagram showing a conventional RF-ID medium.

8A to 8F are conventional RF-Is by a transfer method.
It is explanatory drawing which shows the formation process of D media.

[Explanation of symbols]

1 base material 2 IC chip mounting conductive part 3, 3A conductive connection 4 Conductive pattern 5 IC chip 6 Adhesive part 7 Base material 8 Antenna conductive part 9, 9A conductive connection 10 Conductive pattern 11 Insulation part 12 Release agent layer 13 Release sheet 14 Adhesive layer 15 Adhesive substrate 16, 17, 18, 19, 22, 23 Conductive connection part 20 Conductive part 21 Non-conductive part A IC chip mounting interposer B Antenna holder C RF-ID media Line width d Distance between lines w

Claims (3)

[Claims] 1. A conductive connection portion of a conductive circuit formed on an adhesive base material, which is a single wire having a line width of 0.2 to 0.5 mm. 2. A conductive connection portion of a conductive circuit formed on an adhesive base material, which has a line width of 0.2 to 0.5 mm and a distance between lines of 0.3 to 3 mm, and is of a comb type or a lattice type. A conductive connection portion of a conductive circuit having a shape. 3. The conductive connection portion of the conductive circuit according to claim 1 or 2, wherein the conductive circuit is an antenna circuit.