JP2003243669A - Electro-optical device, liquid crystal device and projection type display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electro-optical device having excellent electrical characteristic which can surely control substrate floating effect such as parasitic bipolar phenomenon on a MIS transistor of SOI structure. <P>SOLUTION: The electro-optical device (liquid crystal light bulb) uses, as one substrate, a composite substrate including a quartz substrate having a first thermal expansion coefficient (substrate body 10A), an insulator layer formed on the quartz substrate (underlayer insulation film 12) and a single crystal silicon layer having a second thermal expansion coefficient formed on the insulator layer (semiconductor layer 1a). A TFT 30 forming the single crystal silicon layer as a channel region 1a' is formed on the insulator layer and at least one line defect D exists within the single crystal silicon layer as the channel region 1a'. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electro-optical device, a liquid crystal device, and a projection type display device, and in particular, a liquid crystal device which can sufficiently suppress the substrate floating effect and is suitable for use in the projection type display device. The present invention relates to the configuration of an electro-optical device represented by.

[0002]

2. Description of the Related Art SOI (Silicon on Insul) for forming a semiconductor layer made of a single crystal silicon layer on an insulator layer and forming a semiconductor device such as a transistor element on the semiconductor layer
The ator) technology has advantages such as high speed of elements, low power consumption, and high integration, and can be applied to electro-optical devices such as liquid crystal devices.

By the way, in a general bulk semiconductor device, MIS (Metal-Insulator-Sili
con) Since the channel region of the transistor can be fixed to a predetermined potential, the electrical characteristics such as the breakdown voltage of the element are not deteriorated due to the parasitic bipolar phenomenon or the like caused by the potential change of the channel region. On the other hand, in the MIS transistor having the SOI structure, since the lower part of the channel is completely separated by the base insulating film, the channel region cannot be fixed to the predetermined potential as described above, and the channel region is electrically disconnected. It will be in a floating state. (For example, see Non-Patent Document 1.)

At this time, excess carriers are generated by the impact ionization phenomenon due to the collision between the carriers accelerated by the electric field near the drain region and the crystal lattice, and the excess carriers are accumulated in the lower part of the channel. In this way, when excess carriers are accumulated in the lower portion of the channel and the channel potential rises, the source-channel-drain NPN (in the case of N-channel type) structure operates as an apparent bipolar element, so that the element is caused by an abnormal current. There is a problem that the electrical characteristics are deteriorated, such as the source-drain breakdown voltage is deteriorated. A series of phenomena caused by the electrically floating state of these channel portions is called a substrate floating effect.

Therefore, conventionally, a body contact region electrically connected to the channel region through a predetermined path is provided, and excess carriers accumulated in the channel region are extracted from the body contact region to suppress the substrate floating effect. Technology has been adopted. A semiconductor device including an MIS transistor having an SOI structure having a body contact region of this type is disclosed in, for example, Japanese Patent Application Laid-Open No. 2004-242242.

[Non-patent Document 1] Science of SOI "Science of SOI" REA edited by UCS Semiconductor Technology Group
SIZEINC.

[Patent Document 1] Japanese Patent Laid-Open No. 9-246562

[0006]

However, when a body contact region is provided in a MIS transistor used in a pixel region of an electro-optical device represented by a liquid crystal device or the like, the area occupied by each MIS transistor becomes large, so that the pixel becomes large. It becomes difficult to increase the degree of integration, and particularly in the case of a transmissive liquid crystal device, there is a problem that the aperture ratio becomes small. Also, in the peripheral drive circuit other than the pixel region, if the body contact region is provided, integration becomes difficult, the peripheral portion (frame portion) of the device becomes large, and there is a problem that miniaturization cannot be achieved.

Further, in an electro-optical device used in an electronic device such as a projection type display device, strong light from a light source causes the channel region of a pixel transistor or LDD (Lightly).
When the light enters the Doped Drain) region, carriers are generated by photoexcitation and electric charges leak from the pixel storage capacitor, resulting in display unevenness such as flicker.

The present invention has been made to solve the above problems, and in an electro-optical device including an MIS transistor having an SOI structure, it is possible to reliably suppress a substrate floating effect such as a parasitic bipolar phenomenon. It is an object of the present invention to provide an electro-optical device such as a liquid crystal device which is excellent in electrical characteristics.

[0009]

In order to achieve the above object, an electro-optical device of the present invention comprises a support substrate having a first coefficient of thermal expansion, and an insulating layer formed on the support substrate. ,
What is claimed is: 1. An electro-optical device, comprising: a composite substrate having a single crystal semiconductor layer having a second coefficient of thermal expansion different from the first coefficient of thermal expansion formed on the insulator layer; A thin film transistor having the single crystal semiconductor layer as a channel region is formed in, and at least one line defect is present in the single crystal semiconductor layer forming the channel region.

The present inventor has proposed a so-called SOI substrate, which is a composite substrate having a supporting substrate having a first thermal expansion coefficient and a single crystal semiconductor layer having a second thermal expansion coefficient, which is bonded to each other via an insulating layer. In the provided electro-optical device, when a supporting substrate having a different thermal expansion coefficient and a single crystal semiconductor layer are attached to each other, distortion occurs, which causes many line defects (also referred to as dislocations) in the single crystal semiconductor layer. I paid attention.
In general, line defects are known to have an adverse effect on electrical characteristics in that they increase the leak current of the pn junction of the transistor and deteriorate the minority carrier lifetime. However, the present inventor has found that this kind of line defect acts as a recombination center of excess carriers for the excess carriers in the channel region generated by impact ionization in the MIS transistor having the SOI structure.
The inventors have found that surplus carriers can be captured and disappeared, and have reached the configuration of the present invention.

That is, according to the electro-optical device of the present invention, a thin film transistor (hereinafter, referred to as TF) having a single crystal semiconductor layer as a channel region on an insulator layer is used.
T) is formed, and at least one line defect exists in the single crystal semiconductor layer that forms the channel region of the TFT. Therefore, the line defect acts as a recombination center of the excess carriers, Is prevented from being accumulated, and the substrate floating effect can be suppressed without making a body contact. As a result, it is possible to realize an electro-optical device having excellent electrical characteristics while maintaining a high aperture ratio. Further, in the TFT having the LDD structure, even if light is incident on the LDD region that cannot be shielded by the gate electrode and carriers are generated by photoexcitation, leakage current is prevented from flowing due to recombination centers composed of line defects. it can.

As specific examples of the supporting substrate and the single crystal semiconductor layer, for example, a glass substrate or a quartz substrate can be used as the supporting substrate. Alternatively, a single crystal silicon layer can be used as the single crystal semiconductor layer.

Generally, the coefficient of linear expansion of glass is 3 × 10 ^-6 ~
About 10 × 10 ^-6 / K, the coefficient of linear expansion of quartz is 5.5 × 1
About 0 ^-7 / K, the coefficient of linear expansion of silicon is 2.6 × 10 ^-6
/ K, therefore, when a glass substrate or a quartz substrate and a single crystal silicon layer are bonded to each other to form a composite substrate, lattice-like line defects (Line) are formed along the (111) plane of the single crystal silicon.
Defect) can be introduced. In particular, a combination of a quartz substrate and a single crystal silicon layer (SOQ (Silicon on Q
In (uartz) substrate), the difference in linear expansion coefficient becomes large, so that a large number of lattice-shaped line defects can be surely introduced, which is suitable for the present invention.

Further, in the electro-optical device of the present invention, a display section including a plurality of pixels and a peripheral drive circuit section for driving the display section are provided, and the TFT is provided in the display section and the peripheral drive circuit section. It is desirable to use both.

As described above, according to the TFT of the present invention, since it is not necessary to provide the body contact region, a display portion having a high aperture ratio can be obtained, and at the same time, the area occupied by the peripheral drive circuit portion can be reduced. Therefore, the frame and the size of the device can be reduced.

Another electro-optical device according to the present invention is a support substrate having a first coefficient of thermal expansion, an insulator layer formed on the support substrate, and the first substrate formed on the insulator layer. And a single-crystal semiconductor layer having a second coefficient of thermal expansion different from the coefficient of thermal expansion of the composite substrate, the thin-film transistor having the single-crystal semiconductor layer as a channel region on the insulator layer. Are formed, and at least one crystal defect is present in the single crystal semiconductor layer forming the channel region.

In the above description, a line defect which is usually apt to occur in an SOI substrate has been described as an example, but it is a "line defect" that functions as a recombination center of excess carriers and has a function of trapping and eliminating excess carriers. It is not limited, for example, vacancy, intrinsic point defects such as self-interstitial atoms, substitution impurity atoms, interstitial impurity atoms, "point defects" such as extrinsic point defects such as dangling bonds, stacking faults, grain boundaries. Other crystal defects such as "plane defects" such as "body defects" such as precipitates and voids also have similar effects. Therefore, by introducing this type of crystal defect into the single crystal semiconductor layer forming the channel region of the TFT, the accumulation of excess carriers is prevented, and the substrate floating effect can be suppressed without making a body contact.

In the liquid crystal device of the present invention, the composite substrate in the electro-optical device of the present invention is used as a first substrate,
A liquid crystal device in which a liquid crystal layer is sandwiched between a first substrate and a second substrate, wherein the first substrate has pixel electrodes arranged in a matrix and applying a voltage to the liquid crystal layer. A TFT electrically connected to the pixel electrode and having a channel region made of the single crystal semiconductor layer, a light-shielding film arranged on the liquid crystal layer side of the TFT, and a liquid crystal layer side of the TFT. And a data line which is electrically connected to the TFT, has a light-shielding property, and intersects the light-shielding film.

In the above liquid crystal device of the present invention, since the composite substrate in the electro-optical device of the present invention is used as the first substrate, the substrate floating effect can be suppressed.
It is possible to realize a liquid crystal device having excellent electrical characteristics while maintaining a high aperture ratio. Further, since the data line has a light-shielding property and the data line and the light-shielding film intersect on the liquid crystal layer side of the TFT, the channel region forming the TFT is double-shielded by the data line and the light-shielding film. Will be.

Therefore, according to the liquid crystal device of the present invention,
The channel region of the TFT is doubly shielded from the incident light by arranging the side on which the data line and the light shielding film are arranged toward the side on which the incident light (for example, projection light in the case of a projector application) is incident. be able to. At this time,
The light-shielding property obtained by the data line and the light-shielding film is, for example, the relation between the data line that slightly transmits light (having a transmittance of about 0.1%) in relation to the film thickness and the film thickness. Even if a light-shielding film that slightly transmits light (for example, has a transmittance of about 0.1%) is used, the light is double-shielded by both, and thus has an extremely high light-shielding property (for example, 0. A transmittance of about 00001 to 0.000001%) is obtained.

Moreover, in the liquid crystal device of the present invention, since the data line has a light-shielding property, not only the light perpendicular to the substrate surface, but also the oblique light inclined in the direction along the data line is TFT. It is difficult to enter the channel region of the. Further, in the liquid crystal device of the present invention, even the oblique light inclined in the direction along the main line portion of the light-shielding film (that is, the direction intersecting the data line) is TF due to the presence of the light-shielding film.
It is difficult to penetrate the T channel region. The strong incident light from the strong light source is mainly light perpendicular to the substrate surface, and since such oblique light is light of relatively low intensity accompanied by internal reflection and multiple reflection in the liquid crystal device, In order to shield the light oblique to the substrate surface, the light shielding performance sufficient to shield the light perpendicular to the substrate surface is not required. Therefore,
Light that obliquely enters the substrate surface is extremely effectively blocked by the data line and the light-shielding film (even in a single layer). As a result, even when a strong light source is used, it is possible to effectively prevent the deterioration of the transistor characteristics due to the light leak current caused by the incident light entering the channel region of the TFT.

Further, in the liquid crystal device of the present invention, the light-shielding layer and the data line can prevent light leakage in the image display region and lower the contrast ratio. Therefore, it is possible to define the opening area of each pixel by the light-shielding layer and the data line, and for example, it is provided on the counter substrate such as a light-shielding film called a black stripe (BS) or a light-shielding film called a black matrix (BM). It is also possible to omit a general light shielding film. In addition, since the light-shielding layer and the data line in the liquid crystal device of the present invention are provided relatively close to the TFT as compared with the general light-shielding film provided on the counter substrate,
It is possible to avoid unnecessarily widening the light-shielding region and never unnecessarily narrow the opening region of each pixel.

As described above, according to the liquid crystal device of the present invention,
TFT with high light resistance while suppressing an increase in the thickness of the light-shielding film
It is possible to realize a liquid crystal device in which the characteristic deterioration due to the light leakage is reduced, a high-contrast ratio can be displayed, and a high-quality image can be displayed.

Further, in the above liquid crystal device, it is preferable that the light shielding film has a light absorbing layer and a light shielding layer, and the light absorbing layer is laminated on a side facing the TFT.

According to this structure, since the light-shielding film has the light-absorbing layer and the light-shielding layer, and the light-absorbing layer is laminated on the side facing the TFT, the light-shielding film passes through the side of the TFT from the second substrate side. To the light-shielding layer (that is, the return light of the back surface of the liquid crystal device, or the light that is emitted from other liquid crystal devices and passes through the composite optical system in a multiple-plate projector that has multiple liquid crystal devices as light valves). Light) can be absorbed by the light absorbing layer. Therefore, while blocking the incident light incident from the outer surface side of the light shielding film (the side opposite to the side facing the TFT), the inner surface side of the light shielding film (the side facing the TFT)
It is possible to reduce the light reflected on the inner surface. As a result, light reaching the channel region of the TFT can be further reduced.

Further, in the above liquid crystal device, a relay conductive film for electrically connecting the pixel electrode and the TFT is formed on the side of the light shielding film facing the TFT through a dielectric layer. It is desirable that the light shielding film and the relay conductive film function as a capacitance electrode to form a storage capacitor.

In such a liquid crystal device, the light-shielding film functions not only as a light-shielding function but also as a capacitance electrode of the storage capacitor. Therefore, while suppressing an increase in the thickness of the light-shielding film as a whole, the light-shielding film and the storage capacitor are further provided. It is possible to effectively prevent the layered structure on the substrate and the manufacturing process from becoming complicated as compared with the case of separately manufacturing.

The projection type display device of the present invention comprises a light source, a light modulation means comprising the liquid crystal device of the present invention for modulating the light from the light source, and a projection means for projecting the light modulated by the light modulation means. It is characterized by having and.

Since the projection type display device of the present invention is provided with the light modulating means composed of the liquid crystal device of the present invention, deterioration of electrical characteristics due to light leak current and the like is suppressed even when a light source of high brightness is used. Therefore, it is possible to realize a projection type display device having excellent display quality.

[0030]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below with reference to FIGS. In the present embodiment, as an example of the electro-optical device of the present invention, an example of a liquid crystal light valve (liquid crystal device) used as a light modulator of a projection display device will be described. The liquid crystal light valve of this embodiment is an active matrix type liquid crystal panel, and uses an SOQ substrate on the element substrate side.

FIG. 1 is a schematic configuration diagram of a liquid crystal light valve which is an example of the electro-optical device of the present invention, and FIG. 2 is H-H 'of FIG.
4 is a cross-sectional view taken along the line, FIG. 3 is an equivalent circuit diagram of a plurality of pixels formed in a matrix which configures a liquid crystal light valve, and FIG.
5 is a plan view of a plurality of pixel groups, FIG. 5 is a cross-sectional view taken along the line AA ′ in FIG. 4, FIG. 6 is a cross-sectional view showing only the TFT portion, and FIG. 7 is a view for manufacturing a liquid crystal light valve. It is a top view which shows a bonded substrate. In each figure,
In order to make each layer and each member recognizable in the drawing, the scale is different for each layer and each member.

(Overall Structure of Liquid Crystal Light Valve) As shown in FIGS. 1 and 2, the liquid crystal light valve 1 according to the present embodiment has a sealing material 52 on the TFT array substrate 10 as shown in FIGS.
Are provided along the edge of the counter substrate 20, and the light-shielding film 53 (peripheral parting) as a frame is arranged in parallel with the inside of the counter substrate 20.
Is provided. A data line drive circuit 201 and an external circuit connection terminal 202 are provided along the one side of the TFT array substrate 10 in a region outside the sealing material 52.
The scanning line drive circuit 104 is provided along two sides adjacent to this one side.

Further, a plurality of wirings 105 for connecting the scanning line driving circuits 104 provided on both sides of the image display area are provided on the remaining one side of the TFT array substrate 10. The TFT array substrate 10 and the counter substrate 2 are provided at least at one corner of the counter substrate 20.
An upper and lower conducting member 106 is provided to establish electrical conduction with 0. Then, as shown in FIG. 2, the counter substrate 20 having substantially the same contour as the sealing material 52 shown in FIG. 1 is fixed to the TFT array substrate 10 by the sealing material 52, and the TFT array substrate 10 and the counter substrate 20 are Between T
N liquid crystal 50 is enclosed. Further, the opening provided in the sealing material 52 shown in FIG. 1 is a liquid crystal injection port 52a,
It is sealed by the sealing material 25.

(Structure of TFT Array Substrate) In FIG. 3, the pixel electrode 9 and the pixel electrode 9 are provided for each of a plurality of pixels formed in a matrix forming the image display region of the liquid crystal light valve 1 according to the present embodiment. A TFT 30 for switching control of 9 is formed, and the data line 6a to which the image signal is supplied is electrically connected to the source region of the TFT 30. The image signals S1, S2, ..., Sn to be written to the data line 6a may be line-sequentially supplied in this order, or may be supplied to each of a plurality of adjacent data lines 6a in groups. good.

Further, the scanning line 3a is connected to the gate of the TFT 30.
Are electrically connected to each other, and are configured to apply the scanning signals G1, G2, ..., Gm to the scanning line 3a in a pulse-wise manner in this order at a predetermined timing. The pixel electrode 9 is electrically connected to the drain of the TFT 30, and by turning on the TFT 30 which is a switching element for a certain period, the image signals S1, S2, ..., Sn supplied from the data line 6a are supplied. Write at a predetermined timing. The image signals S1, S2, ..., Sn having a predetermined level written in the liquid crystal through the pixel electrode 9 are the counter substrate 2
It is held for a certain period of time with a common electrode (described later) formed to 0. Here, in order to prevent the held image signal from leaking, the storage capacitor 70 is provided in parallel with the liquid crystal capacitor formed between the pixel electrode 9 and the common electrode.

As shown in FIG. 4, the TFT array substrate 10
A plurality of rectangular pixel electrodes 9 (outlined by a dotted line portion 9A) are provided in a matrix on the upper side,
A data line 6a and a scanning line 3a are provided along the vertical and horizontal boundaries of the pixel electrode 9, respectively. Further, in the semiconductor layer 1a that constitutes the TFT 30, the scanning line 3a is arranged so as to face the channel region 1a ′ shown by the diagonally upward-sloping region in FIG. 4, and the scanning line 3a remains as it is.
It functions as a 0 gate electrode. The detailed structure of the TFT 30 will be described later.

As shown in FIGS. 4 and 5, in the present embodiment, the storage capacitor 70 functions as a pixel potential side capacitance electrode electrically connected to the high-concentration drain region 1e of the TFT 30 and the pixel electrode 9. The relay conductive film 71a and a part of the capacitance line 300 as the fixed potential side capacitance electrode are formed by the dielectric film 75.
It is formed by being opposed to each other.

The storage capacitor 70 also has a function as a light shielding film. The relay conductive film 71a is made of a conductive polysilicon film or the like, has a higher light absorption property than the second film 73 forming the capacitance line 300, and has the second film 73 and the TFT3.
It has a function as a light absorption layer arranged between 0 and 0. Further, the relay conductive film 71a functions to relay the conduction between the pixel electrode 9 and the TFT 30.

The capacitance line 300 includes the first film 72 and the second film 72.
The film 73 is a multilayer film formed by stacking and functions as a light shielding film itself. The first film 72 is the second
It has a function as a light absorption layer arranged between the film 73 and the TFT 30, and is composed of, for example, a conductive polysilicon film, an amorphous silicon film, a single crystal silicon film or the like having a film thickness of about 50 nm to 150 nm. It The second film 73 is T
It has a function as a light shielding layer that shields the TFT 30 from the incident light on the upper side of the FT 30, and has a film thickness of 150 nm, for example.
To the extent that at least one of refractory metals such as Ti, Cr, W, Ta, Mo, and Pb is contained, a metal simple substance, an alloy, a metal silicide, a polysilicide, or a laminated body of these, or Al or the like. It is made of a metal that is not a refractory metal. The second film 73 does not need to have conductivity, but if it is made of a material having conductivity, the capacitance line 3 is formed.
00 can have a lower resistance.

A dielectric film 75 is arranged between the relay conductive film 71a and the capacitance line 300, as shown in FIG. The dielectric film 75 has a film thickness of 5 to 200 nm, for example.
Relatively thin silicon oxide film, silicon nitride film,
It is composed of a nitride oxide film or a laminated film thereof.
From the viewpoint of increasing the storage capacity 70, the dielectric film 75 is preferably as thin as possible so long as the reliability of the film is sufficiently obtained.

Further, the capacitance line 300 includes a main line portion extending in a stripe shape along the scanning line 3a when seen in a plan view, and a portion overlapping the TFT 30 from this main line portion is shown in FIG.
It protrudes up and down. In FIG. 4, the data lines 6a extending in the vertical direction and the capacitance lines 300 extending in the horizontal direction are shown.
The TFT 30 on the TFT array substrate 10 is arranged in a region where and intersect. That is, the TFT 30
Is the data line 6a and the capacitance line 3 when viewed from the counter substrate 20 side.
00 and double covered. The data lines 6a and the capacitance lines 300 that intersect each other form a lattice-shaped light-shielding layer when viewed in plan, and define the opening area of each pixel.

Further, T on the TFT array substrate 10
Below the FT 30, a lower light-shielding film 11a made of the same material as the above-mentioned second film 73 is provided in a grid pattern. The lower light-shielding film 11a is formed to be narrower than the width of the capacitance line 300 and the data line 6a, and is slightly smaller than the capacitance line 300 and the data line 6a. And
The channel region 1a of the TFT 30 is a low concentration source region 1
b and the junction with the low concentration drain region 1c,
It is located in the intersecting region of the lower light-shielding film 11a. A light absorption layer may be provided on the inner surface of the lower light-shielding film 11a.

The capacitance line 300 extends from the image display area in which the pixel electrode 9 is arranged to the periphery thereof and is electrically connected to a constant potential source to have a fixed potential. Further, the potential fluctuations of the lower light-shielding film 11a also depend on the TFT 30.
To avoid adversely affecting the
Like 00, it is preferable to extend from the image display area to its periphery and connect it to a constant potential source.

As shown in FIGS. 4 and 5, the data line 6
a is connected to the relay conductive film 71b for relay connection via the contact hole 81, and the relay conductive film 71b is connected to the high concentration source region 1d of the semiconductor layer 1a made of, for example, a polysilicon film via the contact hole 82. It is electrically connected. Further, the pixel electrode 9 is formed of the relay conductive film 71.
By relaying a, it is electrically connected to the high-concentration drain region 1e of the semiconductor layer 1a through the contact hole 83 and the contact hole 8. In addition,
The relay conductive film 71b is simultaneously formed from the same film as the relay conductive film 71a.

On the scanning line 3a, a first interlayer insulating film 41 is formed in which a contact hole 82 leading to the high-concentration source region 1d and a contact hole 83 leading to the high-concentration drain region 1e are opened. . Relay conductive films 71a and 71b and a capacitor line 300 are formed on the first interlayer insulating film 41, and contact holes 81 and contact holes 8 respectively leading to the relay conductive films 71a and 71b are opened on these. A perforated second interlayer insulating film 42 is formed. Further, the data line 6a is formed on the second interlayer insulating film 42, and the third interlayer insulating film 43 having the contact hole 8 leading to the relay conductive film 71a is formed thereon. There is.
The pixel electrode 9 has the third interlayer insulating film 4 configured as described above.
3 is provided on the upper surface.

As shown in FIGS. 4 and 5, the liquid crystal light valve 1 of the present embodiment has a TFT array substrate 10 having a transparent quartz substrate as a substrate body 10A, and a transparent counter substrate arranged to face the TFT array substrate 10. 20 and 20 are provided. The TFT array substrate 10 has an indium tin oxide (Indium Tin Oxid)
e, hereinafter abbreviated as ITO) is provided with a pixel electrode 9 made of a transparent conductive film, and an alignment film 16 subjected to a predetermined alignment treatment such as a rubbing treatment is provided above the pixel electrode 9. The alignment film 16 is made of, for example, an organic film such as a polyimide film. A polarizer 17 is provided on the TFT array substrate 10 on the opposite side of the substrate body 10A from the liquid crystal layer 50.

On the other hand, the counter substrate 20 has a substrate body 20A.
A common electrode 21 is provided over the entire upper surface, and an alignment film 22 that has been subjected to a predetermined alignment treatment such as a rubbing treatment is provided below the common electrode 21. Like the pixel electrode 9, the common electrode 21 is also made of a transparent conductive film such as an ITO film. The alignment film 22 is made of an organic film such as a polyimide film. A polarizer 24 is formed on the opposite substrate 20 on the opposite side of the substrate body 20A from the liquid crystal layer 50.

Between the TFT array substrate 10 and the counter substrate 20, which are arranged in this way and are arranged so that the pixel electrode 9 and the common electrode 21 face each other, liquid crystal is provided in the space surrounded by the sealing material 52. The liquid crystal layer 50 is formed by encapsulation. The liquid crystal layer 50 takes a predetermined alignment state by the alignment films 16 and 22 in a state where the electric field from the pixel electrode 9 is not applied. The liquid crystal layer 50 is made of, for example, liquid crystal in which one kind or several kinds of nematic liquid crystals are mixed. further,
A base insulating film 12 is provided below the TFT 30.
The base insulating film 12 has a function of insulating the TFT 30 from the lower light-shielding film 11a, and is formed on the entire surface of the TFT array substrate 10, so that the surface of the TFT array substrate 10 is roughened during polishing or remains after cleaning. It has a function of preventing the characteristics of the TFT 30 from changing.

(Structure of TFT) As shown in FIG.
T30 has an LDD structure, and includes a scanning line 3a, a channel region 1a 'of the semiconductor layer 1a in which a channel is formed by an electric field from the scanning line 3a, the scanning line 3a and the semiconductor layer 1.
An insulating thin film 2 including a gate insulating film that insulates a from the semiconductor layer 1a, a low concentration source region 1b and a low concentration drain region 1c of the semiconductor layer 1a, a high concentration source region 1d of the semiconductor layer 1a and a high concentration drain region 1e.

In the case of the present embodiment, the semiconductor layer 1a is composed of a single crystal silicon layer in which the surface in contact with the base insulating film 12 is the (100) plane. Then, as shown in FIG. 6, in the semiconductor layer 1a, the channel region 1a ′, the low concentration source region 1b and the low concentration drain region 1c, the high concentration source region 1d and the high concentration drain region 1e are made of single crystal silicon (111). A plurality of line defects D extending along the crystal plane are introduced. The pitch between adjacent line defects D is random. In FIG. 6, a large number of line defects D
However, it suffices that at least one line defect with a random pitch exists in the channel region 1a ′.

TFT array substrate 1 in the present embodiment
0 is an SOQ substrate (composite substrate) in which a quartz substrate and a single crystal silicon substrate are bonded together via an insulating layer. At the time of bonding, for example, a silicon oxide film may be formed on a single crystal silicon substrate and then bonded to a quartz substrate, or a silicon oxide film may be formed on both the quartz substrate and the single crystal silicon substrate and then silicon oxide may be formed. The films may be brought into contact with each other and bonded together. In either case, the coefficient of linear expansion of quartz is about 5.5 × 10 ⁻⁷ / K, and the coefficient of linear expansion of silicon is about 2.6 × 10 ⁻⁶ / K, so that as shown in FIG. In the state of the SOQ substrate 40 before processing (before patterning of the single crystal silicon layer),
It is possible to introduce lattice-like line defects D (Line Defect) having a random pitch on the single crystal silicon layer.

For example, in the TFT array substrate 10, the minimum size P-channel transistor has a gate length of 2 μm,
If the gate width is 5 μm and the minimum size N-channel transistor has a gate length of 4 μm and the gate width is 5 μm, the minimum size transistor on the TFT array substrate 10 has a gate length of 2 μm and a gate width of 5 μm. Become. In this case, the pitch is these channel widths,
If the line defects D are introduced so that the channel length is less than the larger one, that is, the pitch is less than 5 μm, all the TFTs on the TFT array substrate 10 are stochastically.
Therefore, at least one line defect will be introduced into the channel region.

(Structure of SOQ Substrate) Here, three SOQ substrates provided with a light shielding layer which can be used in the present embodiment are provided.
One specific configuration example will be described. (First Configuration Example) FIGS. 8 and 9 are views showing a method for producing an SOQ substrate in the first configuration example. The manufacturing process of this SOQ substrate will be described in detail. First, as shown in FIG. 8A, a light shielding layer 94 is formed on a support substrate 91 made of a transparent quartz substrate. Next, as shown in FIG.
A photoresist pattern 113 is formed on the light shielding layer 94. Next, as shown in FIG. 8C, the light shielding layer 94 is etched using the photoresist pattern 113 as a mask, the light shielding layer 94 other than the transistor formation region is removed by dry etching, and the photoresist pattern after etching is performed. 113 is peeled off. Next, as shown in FIG. 8D, an insulating layer 95 is deposited in order to ensure insulation between the light shielding layer 94 and the single crystal silicon layer formed thereon. A silicon oxide film was used for this insulating layer 95. This silicon oxide film is formed, for example, by sputtering or TE.
It can be formed by a plasma CVD method using OS (tetraethyl orthosilicate).

The insulating layer 95 has such a thickness that a sufficient insulating property from the single crystal silicon layer 92 can be secured on the light shielding layer 94 even if the step difference of the light shielding layer 94 is flattened by polishing. Specifically, the insulating layer 95 has a thickness of 500 with respect to the thickness of the light shielding layer 94.
It is preferable to deposit a large amount of about 1000 nm. In the present configuration example, the film thickness of the light shielding layer 94 is 400 nm, and the silicon oxide film is 1000 nm formed by plasma CVD of TEOS.
Deposited. The support substrate with the light-shielding layer thus obtained has unevenness on the substrate surface depending on the presence or absence of the light-shielding layer 94. Therefore, when the substrate is bonded to the single-crystal silicon substrate as it is, voids (voids) are formed in the stepped portion of the unevenness. Are formed, and the bonding strength becomes nonuniform when they are bonded together.

For this reason, as shown in FIG. 9E, the surface of the supporting substrate on which the light shielding layer 94 is formed is globally polished and flattened. As a method of flattening by polishing, CM
The P (chemical mechanical polishing) method was used. In CMP,
It is preferable that the polishing amount of the insulating layer 95 on the light shielding layer 94 is set to be 200 to 700 nm larger than the film thickness of the light shielding layer 94. By performing the CMP process under this condition, the step difference at the edge of the light-shielding layer pattern can be reduced to 3 nm or less. Therefore, even when the single crystal silicon substrates are bonded together, uniform bonding strength can be obtained over the entire surfaces of the substrates. Next, FIG. 9 (f)
As shown in, the support substrate having the light shielding layer and the single crystal silicon substrate 120 are attached to each other.

Single crystal silicon substrate 1 used for bonding
Reference numeral 20 has a thickness of 300 μm, and the surface thereof is previously oxidized by about 0.05 to 0.8 μm to form the oxide film layer 93. This is because the interface between the single crystal silicon layer 92 and the oxide film layer 93 formed after the bonding is formed by thermal oxidation, and the interface having good electric characteristics is secured. In the bonding step, for example, a method of directly bonding the two substrates by heat treatment at 300 ° C. for 2 hours can be adopted. In order to further increase the bonding strength, it is necessary to further raise the heat treatment temperature to about 450 ° C. However, since there is a large difference in the coefficient of thermal expansion between the quartz substrate and the single crystal silicon substrate,
If heated as it is, defects such as cracks occur in the single crystal silicon layer, and the quality of the substrate deteriorates.

In order to suppress the occurrence of defects such as cracks, the single crystal silicon substrate which has been once subjected to the heat treatment for bonding at 300 ° C. is thinned to about 100 to 150 μm by wet etching or CMP. After that, it is desirable to perform heat treatment at a higher temperature. In this embodiment, an 80 ° C. KOH aqueous solution is used,
Etching was performed so that the thickness of the single crystal silicon substrate was 150 μm. After that, the bonded substrates are heated to 450 ° C.
Is heat treated again to increase the bonding strength. Further, as shown in FIG. 9G, this bonded substrate was polished so that the single crystal silicon layer 92 had a thickness of 3 to 5 μm.

The laminated substrate thus thinned was finally subjected to PACE (Plasma Assisted Chemical Etchi).
ng) method to reduce the thickness of the single crystal silicon layer 92 to 0.05
Finish by etching to about 0.8 μm. This P
By the ACE treatment, the single crystal silicon layer 92 was obtained with a uniformity within 10% with respect to a film thickness of 100 nm, for example. Through the above steps, the SOQ substrate having the light shielding layer can be manufactured.

(Second Configuration Example) FIGS. 10 and 11 show SO
It is a figure which shows the 2nd structural example of a Q board. 8 and 9 indicate the layers or members formed in the same step. In this configuration example, the steps up to the step of flattening the surface of the supporting substrate with the patterned light shielding layer shown in FIG. 9E are completely the same as those of the first configuration example described above. FIG. 10A shows a single crystal silicon substrate used for bonding. This single crystal silicon substrate 1
Reference numeral 20 has a thickness of 600 μm, and the surface thereof is previously oxidized by about 0.05 to 0.8 μm to form the oxide film layer 93. Next, as shown in FIG. 10B, hydrogen ions 114 are implanted into the single crystal silicon substrate 120.
For example, in this configuration example, hydrogen ions (H ⁺ ) are implanted at an acceleration voltage of 100 keV and a dose amount of 10 × 10 ¹⁶ cm ^-2 . By this treatment, a high concentration layer 115 of hydrogen ions is formed in the single crystal silicon substrate 120. Next in FIG.
As shown in FIG. 0 (c), the ion-implanted single crystal silicon substrate 120 is attached to the support substrate 91 on which the light shielding layer 94 and the insulating layer 95 are formed. The bonding process is, for example, 30
A method of directly bonding two substrates by heat treatment at 0 ° C. for 2 hours can be adopted.

Further, in FIG. 11D, the oxide film 93 on the bonding surface side of the bonded single crystal silicon substrate 120 (this becomes an embedded oxide film when the SOQ substrate is completed) and the single crystal silicon layer 92 are provided on the supporting substrate. A heat treatment for peeling the single crystal silicon substrate 120 from the supporting substrate is performed while leaving it above. This peeling phenomenon of the substrate occurs because hydrogen ions introduced into the single crystal silicon substrate break the bond of silicon in a layer near the surface of the single crystal silicon substrate. In this configuration example, the two bonded substrates were heated to 600 ° C. at a heating rate of 20 ° C./min. By this heat treatment, the bonded single crystal silicon substrate 120 is separated from the supporting substrate,
A silicon oxide film 93 of about 400 nm and a single crystal silicon layer 92 of about 200 nm are formed on the surface of the supporting substrate.

FIG. 11E is a sectional view showing the SOQ substrate after separation. Since the surface of the SOQ substrate has irregularities of about several nm remaining on the surface of the single crystal silicon layer, it is necessary to flatten it. Therefore, in this configuration example, a touch polish for polishing the substrate surface to a very small amount (polishing amount less than 10 nm) by using the CMP method is used. As the planarization method, a hydrogen annealing method in which heat treatment is performed in a hydrogen atmosphere can also be used. The SOQ substrate manufactured as described above has a good single-crystal silicon film thickness uniformity and has a structure having a light-shielding layer that suppresses light leakage with respect to the device to be manufactured.

(Third Configuration Example) FIGS. 12 and 13 show SO
It is a figure which shows the 3rd structural example of a Q board. The parts having the same reference numerals as those in FIGS. 8 to 11 indicate layers or members formed in the same step. In this structural example, the steps up to the step of flattening the surface of the supporting substrate with the patterned light shielding layer shown in FIG. 9E are exactly the same as those of the first structural example. FIG. 12A shows a silicon substrate for forming a single crystal silicon layer for bonding. The silicon substrate 116 has a thickness of 600 μm, and its surface can be made into the porous layer 117 by anodizing in a HF / ethanol solution. By performing heat treatment at 1050 ° C. in a hydrogen atmosphere on the single crystal silicon substrate 116 whose surface is made porous by about 12 μm by this treatment,
The surface of the porous layer 117 is smoothed. This reduces the defect density of the single crystal silicon layer subsequently formed on the silicon substrate 116 and improves its quality.

Next, as shown in FIG. 12B, a silicon substrate 116 in which the surface of the porous silicon layer 117 is smoothed.
A single crystal silicon layer 92 is formed by epitaxial growth. Single crystal silicon layer 9 formed by epitaxial growth
The deposited film thickness of No. 2 was 500 nm in the present configuration example, but the film thickness of the single crystal silicon layer can be arbitrarily selected according to the device to be manufactured. Furthermore, FIG.
As shown in (c), the surface of the single crystal silicon layer 92 is 50 to 4
The oxide film layer 93 is formed by oxidation to a thickness of about 00 nm, and this is used as a buried oxide film of the SOQ substrate after being bonded.

Next, as shown in FIG. 13D, the substrate on which the single crystal silicon layer 92 and the oxide film layer 93 are formed is attached to the supporting substrate 91 on which the light shielding layer 94 and the insulating layer 95 are formed. In the bonding step, for example, a method of directly bonding the two substrates by heat treatment at 300 ° C. for 2 hours can be adopted. Next, as shown in FIG. 13E, the silicon substrate is ground leaving the surface oxide film 93 on the bonding surface side, the single crystal silicon layer 92, and the porous silicon layer 117. Then, as shown in FIG. 13F, the porous silicon layer 117 is removed by etching to obtain a single crystal silicon layer 92 on the supporting substrate. The etching of the porous silicon layer 117 is very good because the porous silicon layer 117 exhibits a high etching selectivity with respect to the single crystal silicon layer 92 when an etching solution having a composition of HF / H ₂ O ₂ is used. It is possible to completely remove only porous silicon while maintaining uniform film thickness of single crystal silicon.

In the SOQ substrate from which the porous silicon layer 117 has been removed in this way, the surface of the single crystal silicon layer 92 is covered by several n.
Since unevenness of about m remains, it is necessary to flatten it. Therefore, in this configuration example, a hydrogen annealing method is used in which heat treatment is performed in a hydrogen atmosphere. Further, as the planarizing method, it is also possible to use touch polishing for polishing the surface of the single crystal silicon layer 92 of the SOQ substrate to a very small amount (polishing amount less than 10 nm) by using the CMP method. The SOQ substrate manufactured as described above has a good single-crystal silicon film thickness uniformity and has a structure having a light-shielding layer that suppresses light leakage with respect to the device to be manufactured.

According to the present embodiment, the TFT in which the single crystal silicon layer is the semiconductor layer 1a on the TFT array substrate 10 is used.
Since 30 is provided, it is possible to provide a TFT array substrate having high mobility and high current driving capability. On the other hand, when a single crystal silicon layer is used, there is a problem that excess carriers are generated due to impact ionization and electrical characteristics are deteriorated due to a substrate floating effect. However, in the case of the present embodiment, since at least one line defect D exists in the channel region 1a ′ of the TFT 30, the line defect D acts as a recombination center of the excess carriers to prevent the accumulation of the excess carriers. Therefore, the floating body effect can be suppressed without providing a body contact region unlike the conventional structure. as a result,
It is possible to realize a liquid crystal light valve having excellent electrical characteristics while maintaining a high aperture ratio.

Further, although the TFT 30 has an LDD structure, even if light is incident on the LDD region and carriers are generated by photoexcitation, a leak current flows due to the recombination center composed of the line defect D. Can be prevented. Further, since it is not necessary to provide a body contact region in the TFT 30 of the present embodiment, a pixel display region having a high aperture ratio can be obtained, and at the same time, the area occupied by the peripheral drive circuit section can be reduced, and the device size can be reduced. It is possible to reduce the frame size and size.

Further, the data line 6a has a light-shielding property, and TF
Since the data line 6a and the capacitance line 300 forming the light-shielding film intersect on the liquid crystal layer side of T30, the channel region 1a ′ forming the TFT 30 is doubly shielded by the data line 6a and the capacitance line 300. Therefore, an extremely high light-shielding property can be obtained. In particular, since the opening area of each pixel is defined by the data line 6a and the capacitance line 300, it is possible to omit a general light-shielding film provided on the counter substrate 20 side. Therefore, according to the liquid crystal light valve 1 of the present embodiment, it is possible to display a high-quality image with a high contrast ratio, and further, it is possible to provide excellent durability while suppressing a reduction in the aperture ratio.

(Projection Type Liquid Crystal Device) FIG. 14 is a schematic configuration diagram showing an example of a so-called three-plate type projection type liquid crystal display device (liquid crystal projector) using the three liquid crystal light valves of the above embodiment. In the figure, reference numeral 1100 is a light source, and 110
8 is a dichroic mirror, 1106 is a reflecting mirror, 1
122, 1123, 1124 are relay lenses, 100
R, 100G and 100B are liquid crystal light valves 1112
Is a cross dichroic prism, and 1114 is a projection lens system.

The light source 1100 comprises a lamp 1102 such as a metal halide and a reflector 1101 which reflects the light from the lamp 1102. The dichroic mirror 1108 that reflects blue light and green light transmits red light of the white light from the light source 1100 and reflects blue light and green light. The transmitted red light is a reflection mirror 11.
The light is reflected at 06 and enters the liquid crystal light valve 100R for red light.

On the other hand, of the color light reflected by the dichroic mirror 1108, green light is reflected by the green light reflecting dichroic mirror 1108 and enters the green liquid crystal light valve 100G. On the other hand, the blue light also passes through the second dichroic mirror 1108. For blue light, the incident lens 1122 and the relay lens 112 are provided in order to compensate for the difference in the optical path length between green light and red light.
3, a light guide unit 1121 including a relay lens system including an emission lens 1124 is provided, and blue light is incident on the blue light liquid crystal light valve 100B via the light guide unit 1121.

Each light valve 100R, 100G, 10
The three color lights modulated by 0B enter the cross dichroic prism 1112. In this prism, four right-angled prisms are bonded together, and a dielectric multilayer film that reflects red light and a dielectric multilayer film that reflects blue light are formed in a cross shape on the inner surface thereof. Three color lights are combined by these dielectric multilayer films to form light representing a color image. The combined light is projected on the screen 1120 by the projection lens system 1114 which is a projection optical system, and the image is enlarged and displayed.

In the projection type liquid crystal display device having the above structure, by using the liquid crystal light valve of the above embodiment, deterioration of electrical characteristics due to light leak current and the like can be suppressed even when a high brightness light source is used. Thus, it is possible to realize a projection type liquid crystal display device having excellent display quality.

The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention. For example, the specific description about the configuration of the TFT array substrate that constitutes the liquid crystal light valve described in the above embodiment, the configuration of the TFT itself, and the like is merely an example, and can be changed as appropriate. Further, in the above description, the electro-optical device is described as a liquid crystal light valve, but the present invention is not limited to this, and the electrophoretic device, electroluminescence (EL), digital micromirror device ( It is needless to say that the present invention is also applicable to an electro-optical device using various electro-optical elements using DMD), or plasma emission or fluorescence due to electron emission, and electronic equipment equipped with the electro-optical device. Yes. Also,
Although the example of the line defect is described in the above embodiment, the same effect can be expected not only when the line defect is introduced but also when another crystal defect is introduced.

[0075]

As described above in detail, according to the present invention, since at least one line defect or other crystal defect exists in the channel region of the TFT, these defects cause the excess carriers. By acting as a recombination center, accumulation of surplus carriers is prevented, and the substrate floating effect can be suppressed without providing a body contact region unlike the conventional structure. As a result, it is possible to realize an electro-optical device such as a liquid crystal device which has a narrow aperture and a small size while maintaining a high aperture ratio and has excellent electrical characteristics.

[Brief description of drawings]

FIG. 1 is a plan view showing a schematic configuration of a liquid crystal light valve that is an electro-optical device according to an embodiment of the present invention.

2 is a view showing a sectional structure of the liquid crystal light valve of the same and is a sectional view taken along line HH ′ of FIG. 1. FIG.

FIG. 3 is an equivalent circuit diagram of a plurality of pixels that are formed in a matrix and that form a liquid crystal light valve.

FIG. 4 is a plan view of a plurality of pixel groups of the same.

5 is a cross-sectional view taken along the line AA ′ of FIG.

FIG. 6 is a cross-sectional view showing only the TFT portion in FIG.

FIG. 7 is a plan view showing a bonded substrate for producing the liquid crystal light valve of the same.

FIG. 8 is a diagram showing a manufacturing process of the SOQ substrate of the first configuration example used in the liquid crystal light valve.

FIG. 9 is a diagram showing the continuation of the manufacturing process of the same.

FIG. 10 is a diagram showing a manufacturing process of the SOQ substrate of the second configuration example used in the same liquid crystal light valve.

FIG. 11 is a diagram showing the continuation of the manufacturing process of the same.

FIG. 12 is a diagram showing a manufacturing process of the SOQ substrate of the third configuration example used in the same liquid crystal light valve.

FIG. 13 is a diagram showing the continuation of the manufacturing process of the same.

FIG. 14 is a schematic configuration diagram showing a projection type display device according to an embodiment of the present invention.

[Explanation of symbols]

1 Liquid crystal light valve (electro-optical device) 1a semiconductor layer 1a 'channel region 10 TFT array substrate 20 Counter substrate 30 TFT (thin film transistor) 40 SOQ substrate (composite substrate) 91 support substrate 92 Single crystal silicon layer 94 Light-shielding layer 95 insulating layer 104 scanning line drive circuit (peripheral drive circuit section) 120 single crystal silicon substrate 201 data line drive circuit (peripheral drive circuit section) D line defect

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H01L 27/12 H01L 29/78 618Z 612B 619B F term (reference) 2H088 EA14 EA15 EA18 HA13 HA24 HA28 MA01 MA02 MA20 2H090 JA09 JB02 JB04 JD18 LA04 LA05 LA12 LA15 LA16 2H092 JA23 JA26 JA28 JA34 JA37 JA41 JB51 KA03 KA04 KA10 KB25 MA05 MA08 MA13 MA18 MA26 MA27 MA30 NA01 NA29 5F110 AA04 AA15 AA21 BB02 CC02 DD02 DD03 gg15 gg GG17 NN03 NN42 NN43 NN44 NN46 NN47 NN48 NN72 NN73 QQ04 QQ17 QQ19

Claims (10)

[Claims] 1. A support substrate having a first coefficient of thermal expansion, an insulator layer formed on the support substrate, and a second substrate different from the first coefficient of thermal expansion formed on the insulator layer. An electro-optical device including a composite substrate having a single crystal semiconductor layer having a thermal expansion coefficient of, wherein a thin film transistor having the single crystal semiconductor layer as a channel region is formed on the insulator layer, An electro-optical device, wherein at least one line defect exists in the single crystal semiconductor layer. 2. The electro-optical device according to claim 1, wherein the support substrate is a glass substrate. 3. The electro-optical device according to claim 1, wherein the support substrate is a quartz substrate. 4. The electro-optical device according to claim 1, wherein the single crystal semiconductor layer is a single crystal silicon layer. 5. A display unit comprising a plurality of pixels and a peripheral drive circuit unit for driving the display unit, wherein the thin film transistor is used for both the display unit and the peripheral drive circuit unit. The electro-optical device according to any one of claims 1 to 4, which is characterized in that. 6. A support substrate having a first coefficient of thermal expansion, an insulator layer formed on the support substrate, and a second substrate different from the first coefficient of thermal expansion formed on the insulator layer. An electro-optical device including a composite substrate having a single crystal semiconductor layer having a thermal expansion coefficient of, wherein a thin film transistor having the single crystal semiconductor layer as a channel region is formed on the insulator layer, An electro-optical device characterized in that at least one crystal defect exists in the single crystal semiconductor layer. 7. The electro-optical device according to claim 1, wherein the composite substrate is a first substrate, and a liquid crystal layer is sandwiched between the first substrate and the second substrate. A liquid crystal device, wherein the first substrate has pixel electrodes arranged in a matrix and applying a voltage to the liquid crystal layer, and the single crystal semiconductor layer electrically connected to the pixel electrodes. A thin film transistor having a channel region composed of, a light-shielding film arranged on the liquid crystal layer side of the thin film transistor, and a light-shielding film arranged on the liquid crystal layer side of the thin film transistor, electrically connected to the thin film transistor, and having a light shielding property. And a data line intersecting with the light shielding film. 8. The liquid crystal device according to claim 7, wherein the light shielding film has a light absorbing layer and a light shielding layer, and the light absorbing layer is laminated on a side facing the thin film transistor. 9. A relay conductive film for electrically connecting the pixel electrode and the thin film transistor is formed on a side of the light blocking film facing the thin film transistor via a dielectric layer, and the light blocking film and the relay are formed. 9. The liquid crystal device according to claim 7, wherein the conductive film functions as a capacitance electrode to form a storage capacitor. 10. A light source, a light modulating means comprising the liquid crystal device according to claim 7, which modulates the light from the light source, and the light modulated by the light modulating means is projected. A projection-type display device comprising: a projection unit.