JP2003105278A - Pressure-sensitive adhesive sheet for reinforcing electronic parts and reinforced electronic parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive sheet for reinforcing electronic parts with which electronic parts such as a thin-layered semiconductor wafer are reinforced, and in which damages in producing step and in assembling step of parts, and the like, are prevented, and is free from floating, peeling, and the like, originated form bubbles, voids, and the like, in high-temperature heating. SOLUTION: The pressure-sensitive adhesive sheet for reinforcing electronic parts has an adhesive layer formed on at least one side of a supporter, wherein this adhesive layer is a photopolymerized compound of a photopolymerizable composition composed of (a) a monomer mixture of 100 pts.wt. composed of mainly an alkyl (meth)acrylate having a 2-14C alkyl group on average and a monoethylenic unsaturated acid of 1-30 wt.% capable of copolymerizing with the above alkyl (meth)acrylate, (b) a polyfunctional (meth)acrylaet of 0.02-5 pts.wt. as a cross-bonding agent, (C) a photopolymerization initiator of 0.01-4 pts.wt., and (d) an epoxy resin of 5-30 pts.wt.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a pressure-sensitive adhesive sheet for reinforcing electronic parts and a reinforcing electronic part. The pressure-sensitive adhesive sheet for reinforcing an electronic component of the present invention is used in the form of a sheet or a tape, and the electronic component to be reinforced is a semiconductor wafer such as a silicon wafer in the electronic component. In particular, the pressure-sensitive adhesive sheet for reinforcing electronic parts of the present invention is used by being attached to the back surface (the surface on which electrodes, patterns, etc. are not formed) with respect to the surface of a thin semiconductor wafer on which predetermined electrodes, patterns, etc. have been formed.

[0002]

2. Description of the Related Art In recent years, along with the miniaturization of computers and portable equipment, electronic parts mounted on these are also required to be light, thin and short. Under these circumstances, semiconductor chips have been made smaller and thinner, but on the other hand, the strength of semiconductor chips has decreased due to the thin layer, and the semiconductor chips have become weaker in the transportation and assembly process of the semiconductor chips. There is a problem that it is easily damaged. In particular, a CSP, TCP, or the like having a structure in which the back surface of the semiconductor chip is exposed is easily damaged.

In order to solve such a problem, it has been proposed to form a protective film on the back surface of the semiconductor chip or to attach the protective film with an adhesive (Japanese Patent Laid-Open No. 11-260974). However, forming the protective film is not preferable because the process is complicated. Also, to attach the protective film with an adhesive,
It is conceivable to use an adhesive sheet, but nothing is specifically disclosed.

[0004]

As a conventionally known adhesive sheet for a semiconductor wafer, there is one used in a dicing process or the like. However, since these pressure-sensitive adhesive sheets are intended to be finally peeled off, they are difficult to use for reinforcing semiconductor chips.

Further, since the semiconductor chip undergoes an assembling process and the like under high temperature heating, when a general adhesive tape is used, the adhesive tape shrinks during high temperature heating, and air bubbles and voids caused by generated gas cause floating and peeling. Etc. occur.
Further, electronic parts such as semiconductor chips are easily affected by static electricity, and a general adhesive tape has such a static electricity problem.

The present invention is a pressure-sensitive adhesive sheet for reinforcing electronic parts, which is capable of reinforcing electronic parts such as semiconductor wafers whose strength is reduced due to thinning, and preventing damage during the manufacturing process and the assembling of parts. An object of the present invention is to provide a pressure-sensitive adhesive sheet for reinforcing electronic components, which does not float or peel due to the generation of bubbles or voids when heated at high temperatures. Another object of the present invention is to provide a pressure-sensitive adhesive sheet for reinforcing electronic components, which is less affected by static electricity during the electronic component manufacturing process on electronic components such as semiconductor wafers. Furthermore, it aims at providing the reinforced electronic component to which the said adhesive sheet for electronic component reinforcement is stuck.

[0007]

Means for Solving the Problems As a result of intensive studies to solve the above-mentioned problems, the inventors have found that the above-mentioned object can be achieved by the following adhesive sheet for reinforcing electronic parts. It came to completion.

That is, the present invention relates to a pressure-sensitive adhesive sheet for reinforcing electronic parts, wherein a pressure-sensitive adhesive layer is formed on at least one surface of a support, wherein the pressure-sensitive adhesive layer has (a) an alkyl group having 2 to 14 carbon atoms on average. 100 parts by weight of a monomer mixture containing (meth) acrylic acid alkyl ester as a main component and containing 1 to 30% by weight of a monoethylenically unsaturated acid copolymerizable therewith, (b) a cross-linking agent 0.02 to 5 parts by weight of a polyfunctional (meth) acrylate, (c) 0.01 to 4 parts by weight of a photopolymerization initiator, and (d) an epoxy resin 5
The present invention relates to a pressure-sensitive adhesive sheet for reinforcing electronic parts, which is a photopolymerized product of a photopolymerizable composition containing 30 to 30 parts by weight.

The pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet for reinforcing electronic parts according to the present invention has a pressure-sensitive adhesive property at room temperature and can be smoothly bonded to a semiconductor wafer for easy temporary adhesion. Cured in a short time by the reaction of the acrylic polymer in the photopolymer and the epoxy resin,
It exhibits strong adhesive strength to semiconductor wafers. Moreover, it has a thermosetting pressure-sensitive property showing good high heat resistance without floating or peeling due to generation of bubbles or voids even at high temperatures, and exhibits excellent performance in reinforcing applications of electronic parts.

In the pressure-sensitive adhesive sheet for reinforcing electronic parts,
It is preferable that the pressure-sensitive adhesive layer contains at least one selected from an inorganic filler, an antistatic agent, a conductive agent, and a surfactant. Addition of these can prevent the adhesive tape from being charged.

In the pressure-sensitive adhesive sheet for reinforcing electronic parts,
When the pressure-sensitive adhesive layer is provided with a release sheet, the release electrification voltage of the pressure-sensitive adhesive layer when the release sheet is peeled off is 50.
It is preferably 00 V or less.

When the pressure-sensitive adhesive layer is provided with a release sheet, the release sheet is peeled off when the electronic component reinforcing pressure-sensitive adhesive sheet is used, but the peeling electrification voltage is 5 at that time.
If the voltage exceeds 000V, electrostatic damage may occur to a semiconductor wafer such as a silicon wafer, and the performance of electronic components may be lost. The peeling electrification voltage is preferably 5000 V or less, more preferably 4000 V or less.

In the pressure-sensitive adhesive sheet for reinforcing electronic parts,
The support has a melting point of 200 ° C. or higher and Young's modulus (23
C) of 980 N / mm ² or more and a surface resistance value of 1.
0 × 10 ¹⁷ Ω or less and a thickness of 12 to 200 μ
It is preferable that it is a thin leaf substrate of m.

A material having a melting point of 200 ° C. or higher is suitable as a reinforcing material because it is difficult for the pressure sensitive adhesive sheet to shrink or the support to melt even at high temperatures. The melting point is more preferably 300 ° C. or higher. The Young's modulus (23 ° C) is 98
A material having a high elasticity of 0 N / mm ² or more has a good effect of reinforcing the semiconductor wafer. Young's modulus (23 ° C) is 2000 N / m
It is more preferably m ² or more. Further, if the surface resistance value exceeds 1.0 × 10 ¹⁷ Ω, there is a possibility that trouble due to charging may occur. The surface resistance value is more preferably 1.0 × 10 ¹⁵ Ω or less. In addition, the support has a thickness of the thin base material of 1 so as not to impair thinning of the semiconductor wafer.
It is preferably 2 to 200 μm. In particular, the thickness is more preferably 25 to 100 μm because it has a good balance between thinning and reinforcing effect.

In the pressure-sensitive adhesive sheet for reinforcing electronic parts,
The amount of gas generated by heating the adhesive layer at 100 ° C is 1000 pp
It is preferably m or less.

The pressure-sensitive adhesive sheet for reinforcing electronic parts according to the present invention has good resistance to high-temperature heating without causing deterioration of adhesiveness due to floating and peeling due to generation of bubbles, voids, etc. even at high temperatures during the manufacturing process of electronic parts. For example, the generation of bubbles, voids, etc. at a high temperature of 100 ° C. is 1000 ppm when the generated gas amount is heated.
The following is preferable. The amount of gas generated by heating is 1000
If it exceeds ppm, gas bubbles may be generated or the semiconductor wafer may be lifted or peeled off from the semiconductor wafer, resulting in a decrease in adhesiveness and a decrease in reinforcing function.

In the pressure-sensitive adhesive sheet for reinforcing electronic parts,
It is preferable that an antistatic agent layer containing no metal ion of an alkali metal or an alkaline earth metal is provided between the support and the pressure-sensitive adhesive layer.

The static induction preventing agent layer can prevent static electricity more effectively. The antistatic agent layer is provided between the support and the pressure-sensitive adhesive layer. However, the metal ions of the alkali metal and the alkaline earth metal may adversely affect the electronic parts, and it is preferable that the antistatic agent layer does not contain the metal ions of the alkali metal and the alkaline earth metal.

Further, the present invention relates to a reinforced electronic component to which the pressure-sensitive adhesive sheet for reinforcing an electronic component is attached.

The reinforced electronic component to which the pressure-sensitive adhesive sheet for reinforcing electronic components is attached compensates for the strength of the electronic component such as a semiconductor wafer which has been reduced due to the thin layer, and is not damaged during the manufacturing process or when the component is assembled. Effectively prevented. Further, there is no floating or peeling due to the generation of bubbles or voids during high temperature heating, and the influence of static electricity during the electronic component manufacturing process on electronic components such as semiconductor wafers is small.

[0021]

BEST MODE FOR CARRYING OUT THE INVENTION The pressure-sensitive adhesive sheet for reinforcing electronic parts of the present invention has a pressure-sensitive adhesive layer formed on at least one surface of a support, and the pressure-sensitive adhesive layer comprises the component (a)
A photopolymerization product of a photopolymerizable composition containing the component (d).

The monomer mixture as the component (a) is a (meth) acrylic acid alkyl ester in which the alkyl group has 2 to 14 carbon atoms on average {(meth) acrylic acid alkyl ester is an acrylic acid alkyl ester. And / or methacrylic acid alkyl ester, which in the present invention has the same meaning as (meth)} and contains a monoethylenically unsaturated acid copolymerizable therewith.

Examples of the (meth) acrylic acid alkyl ester include ethyl (meth) acrylate, n-butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isooctyl (meth) acrylate and isononyl (meth) acrylate. I can give you
Among these, one type or two or more types are used so that the carbon number of the alkyl group becomes 2 to 14 on average.
Examples of the monoethylenically unsaturated acid copolymerizable with these include carboxylic acid-containing monomers such as (meth) acrylic acid and itaconic acid, and sulfonic acid-containing monomers such as 2-acrylamidopropanesulfonic acid.

In the monomer mixture which is the component (a),
The proportion of the (meth) acrylic acid alkyl ester and the monoethylenically unsaturated acid copolymerizable therewith is usually 70 to 99% by weight, preferably 80 to 95% by weight, the former.
The latter should be 1 to 30% by weight, preferably 5 to 20% by weight. If it is out of the above range, it is difficult to obtain good results in the adhesive properties after photopolymerization and epoxy curing reaction. The (meth) acrylic acid alkyl ester in the monomer mixture is usually used in an amount of 30% by weight or less as a monomer for modifying a general acrylic pressure-sensitive adhesive such as vinyl acetate, styrene or acrylonitrile. It may be replaced with various known vinyl-based monomers.

As the polyfunctional (meth) acrylate as the cross-linking agent of the component (b), for example, trimethylolpropane tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, 1,2-ethylene glycol di ( Bifunctional or higher polyvalent alkyl (meth) acrylate monomers such as (meth) acrylate, 1,6-hexanediol di (meth) acrylate, and 1,12-dodecanediol di (meth) acrylate are used.

The amount of these polyfunctional (meth) acrylates to be used varies somewhat depending on the number of functional groups and the like, but is 0 .. per 100 parts by weight of the monomer mixture which is the component (a). 0 2 to 5
Parts by weight, preferably 0.2 to 3 parts by weight. By using the polyfunctional (meth) acrylate in such a ratio, a good cohesive force is maintained due to the crosslinking effect on the acrylic polymer, and high heat resistance can be obtained.

As the photopolymerization initiator which is the component (c),
For example, benzoin methyl ether, benzoin ethers such as benzoin isopropyl ether, substituted benzoin ethers such as anisoin methyl ether,
Substituted acetophenones such as 2,2-diethoxyacetophenone and 2,2-dimethoxy-2-phenoneacetophenone, substituted-α-ketols such as 2-methyl-2-hydroxypropionenone, 2- Aromatic sulfonyl chlorides such as naphthalene sulfonyl chloride, and photoactive oximes such as 1-phenone-1,1-propanedione-2- (o-ethoxycarbonyl) oxime.

The amount of these photopolymerization initiators used is 0.01 to 100 parts by weight per 100 parts by weight of the monomer mixture which is the component (a).
4 parts by weight, preferably 0.05 to 1 part by weight. 0.0
If it is less than 1 part by weight, it will be consumed early due to light energy, so that the polymerization rate will decrease, and if it is more than 4 parts by weight, the polymerization rate will increase, but the molecular weight of the polymer will decrease and the cohesive strength of the adhesive will decrease. Is easy to fall.

The epoxy resin as the component (d) is a compound containing two or more epoxy groups in the molecule, and examples thereof include bisphenol epoxy resin, phenolic epoxy resin and halogenated bisphenol epoxy resin. Among these, it is appropriately selected and used. These epoxy resins do not have a photopolymerizable group in the molecule.

The amount of such epoxy resin used is
5 per 100 parts by weight of the monomer mixture as the component (a)
-30 parts by weight, preferably 5-20 parts by weight. If the amount is less than 5 parts by weight, the crosslinking reaction between the acrylic polymer and the epoxy resin does not proceed sufficiently and heat resistance becomes insufficient. On the other hand, if the amount is more than 30 parts by weight, the cured product is excessively crosslinked, so that a peeling phenomenon occurs on the surface of the adherend and the storage stability is reduced.

The photopolymerizable composition comprises the above-mentioned component (a): monomer mixture, component (b): polyfunctional (meth) acrylate,
The component (c): a photopolymerization initiator and the component (d): an epoxy resin are contained as essential components.
The component: monomer mixture can be prepolymerized to some extent by using the component (c): photopolymerization initiator. When component (d): epoxy resin is used during prepolymerization, gelation may occur, and component (d): epoxy resin is preferably added after prepolymerization. It is not necessary to add a generally known curing agent for epoxy resin to the photopolymerizable composition.

In the photopolymerizable composition, the components (a) to
In addition to the component (d), it is possible to prevent the pressure-sensitive adhesive tape from being charged by adding an inorganic filler, an antistatic agent, a conductive agent, and a surfactant as optional components. Examples of the inorganic filler include silica, alumina, aluminum hydroxide, magnesium hydroxide and the like. As the antistatic agent, both low-molecular type and high-molecular type can be used. As the high-molecular type antistatic agent, polyether ester amide, quaternary ammonium salt or the like
Examples thereof include copolymers having a primary base, and examples of the low molecular weight antistatic agent include anionic, cationic, nonionic or amphoteric surfactants. Examples of the conductive agent include metal oxides, metal powders and carbon black. These are a total of 10 of the components (a) to (d).
100 parts by weight or less, especially 0.1 to 10 parts by weight
It is preferable to add 0 part by weight.

If desired, various known additives such as organic fillers, pigments and antioxidants may be added to the photopolymerizable composition within a range that does not interfere with photopolymerization by ultraviolet rays or the like.

The photopolymerizable composition is applied to one side or both sides of a support, and then 400 to 1500 mj / cm ²
It is irradiated with a certain amount of ultraviolet rays to be photopolymerized to obtain a photopolymerized product.
The photopolymerized product itself forms a tackified pressure-sensitive adhesive layer having pressure-sensitive adhesiveness on the support. The thickness of the pressure-sensitive adhesive layer is preferably 3 to 70 μm, more preferably 10 to 50 μm.

The support used for the pressure-sensitive adhesive sheet for reinforcing electronic parts of the present invention has a melting point of 200 ° C. or higher and Young's modulus (23
C) of 980 N / mm ² or more and a surface resistance value of 1.
0 × 10 ¹⁷ Ω or less and a thickness of 12 to 200 μ
It is preferable that it is a thin leaf substrate of m. As the base material of the support satisfying these physical properties, for example, polystyrene,
Examples thereof include plastic films such as polyester, polycarbonate, polyphenylene sulfide, polyether sulfone, polyether ether ketone, polyamide and polyimide.

Between the support and the pressure-sensitive adhesive layer, an antistatic agent layer containing no metal ion of alkali metal or alkaline earth metal can be provided. The antistatic agent layer can be formed by applying and drying an organic antistatic agent or a metal oxide dispersed in a binder.

A release sheet is optionally provided on the surface of the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet for reinforcing electronic parts of the present invention.
Examples of the constituent material of the release sheet include paper, synthetic resin films such as polyethylene, polypropylene and polyethylene terephthalate. The surface of the release sheet may be subjected to a release treatment such as silicone treatment, long-chain alkyl treatment, or fluorine treatment, if necessary, in order to enhance the releasability from the pressure-sensitive adhesive layer. The thickness of the release sheet is usually 10 to 2
It is about 00 μm, preferably about 25 to 100 μm.

[0038]

EXAMPLES The present invention will be described below with reference to examples, but the present invention is not limited to these examples. The parts in each example are parts by weight.

Example 1 90 parts of isononyl acrylate, 10 parts of acrylic acid and 0.05 parts of 2,2-dimethoxy-2-phenylacetophenone were placed in a four-necked flask and exposed to ultraviolet rays under a nitrogen atmosphere to partially Photopolymerization was performed to obtain a syrup having a viscosity of about 30 poise. 100 parts of this partially polymerized syrup was uniformly mixed with 0.2 part of trimethylolpropane triacrylate as a cross-linking agent and 15 parts of an epoxy resin (Epicote 828 manufactured by Yuka Shell Epoxy Co., Ltd.). Further, as an antistatic agent, ROLEX AS (manufactured by Daiichi Kogyo Seiyaku Co., Ltd., cationic type;
20 parts by weight of a quaternary ammonium salt group-containing copolymer) was added to prepare a photopolymerizable composition. This photopolymerizable composition was provided with a polyimide film having a thickness of about 50 μm (melting point: none, Young's modulus (23 ° C.): 4000 N / mm ² ,
Surface resistance value: 1 × 10 ¹⁴ Ω), then 900mj
/ Cm ² of ultraviolet rays to photopolymerize, release sheet (silicone treated polyethylene terephthalate,
It was laminated to a thickness of 50 μm). Then, it was cut into a width of 20 mm to prepare an adhesive tape having a thermosetting pressure-sensitive adhesive layer with a thickness of 50 μm.

Example 2 50 parts isooctyl acrylate, 35 parts butyl acrylate, 15 parts acrylic acid and 2-dimethoxy-2-
0.05 part of phenylacetophenone was charged into a four-necked flask and exposed to ultraviolet rays in a nitrogen atmosphere to partially photopolymerize to obtain a syrup having a viscosity of about 30 poise. 100 parts of this partially polymerized syrup was mixed with 0.3 part of 1,6-hexanediol diacrylate as a cross-linking agent.
Parts and 10 parts of an epoxy resin (Yukaka Shell Epoxy Co., Ltd., Epicoat 828) were uniformly mixed. Further, 20 parts by weight of Reolex AS (manufactured by Dai-ichi Kogyo Seiyaku Co., Ltd., cationic type; quaternary ammonium base-containing copolymer) was added to this as an antistatic agent to prepare a photopolymerizable composition. Thereafter, an adhesive tape was prepared in the same manner as in Example 1.

Comparative Example 1 A photopolymerizable composition was prepared in the same manner as in Example 1 except that the epoxy resin and the antistatic agent were not used in the preparation of the photopolymerizable composition. Using this, an adhesive tape was prepared in the same manner as in Example 1.

Comparative Example 2 0.5 part of a polymerization initiator (benzoyl peroxide) was added to 50 parts of isooctyl acrylate, 35 parts of butyl acrylate and 15 parts of acrylic acid, and the mixture was polymerized in toluene to obtain an acrylic polymer. . 100 parts (solid content) of this acrylic polymer was mixed with 4 parts of an isocyanate crosslinking agent as a crosslinking agent to prepare an acrylic pressure-sensitive adhesive. This acrylic pressure-sensitive adhesive was applied to a polyimide film having a thickness of about 50 μm, dried at 130 ° C. for 3 minutes, and then attached to a release sheet (silicone-treated polyethylene terephthalate, thickness 50 μm). Then, the adhesive tape was cut into a width of 20 mm to prepare an adhesive tape having a thickness of the adhesive layer of 50 μm.

Each of the pressure-sensitive adhesive tapes obtained in Examples 1 and 2 and Comparative Examples 1 and 2 described above has adhesiveness at room temperature,
I was able to temporarily bond it to the wafer. With respect to each of these adhesive tapes, the following high temperature resistance and the voltage applied when the release sheet was peeled off were evaluated. The results are shown in Table 1.

(Heat Resistance) (1) After the adhesive tape was temporarily adhered to the wafer and then heated in a dryer at 200 ° C. for 1 hour, the appearance was evaluated according to the following criteria. ◯: No change. Δ: Some floating is seen. X: There is floatation as a whole.

(2) Amount of gas generated by heating at 100 ° C. (pp
m) was measured by gas chromatography.

(Peeling electrification voltage) The electrification voltage on the surface of the pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape when the release sheet was peeled off was measured by a surface potential meter.

[0047]

[Table 1]

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H05K 3/32 H05K 3/32 B (72) Inventor Kazuto Hosokawa 1-1-1 Shimohozumi, Ibaraki-shi, Osaka No. 2 F term in Nitto Denko Corporation (reference) 4J004 AA10 AA13 AB07 CA04 CA06 CB03 CC02 CE01 DA02 DA03 FA05 4J040 DF011 DF041 DF051 DG001 EC062 EC072 HB03 HB07 HB14 HB18 HD37 KA11 LA08 LA09 MA10 MB03 NA19 5E319

Claims (7)

[Claims] 1. A pressure-sensitive adhesive sheet for reinforcing electronic parts, wherein a pressure-sensitive adhesive layer is formed on at least one surface of a support, wherein the pressure-sensitive adhesive layer has (a) an alkyl group having 2 to 14 carbon atoms on average.
The main component is an alkyl ester of (meth) acrylic acid, and a monoethylenically unsaturated acid copolymerizable therewith 1 to
100 parts by weight of a monomer mixture containing 30% by weight,
(B) 0.02 to 5 parts by weight of a polyfunctional (meth) acrylate as a cross-linking agent, (c) a photopolymerization initiator 0.01 to 4
An adhesive sheet for reinforcing electronic parts, which is a photopolymerization product of a photopolymerizable composition containing 5 parts by weight of (d) an epoxy resin and 5 to 30 parts by weight of (d). 2. An adhesive, an inorganic filler, an antistatic agent,
The pressure-sensitive adhesive sheet for reinforcing electronic components according to claim 1, which contains at least one selected from a conductive agent and a surfactant. 3. The release sheet is provided on the pressure-sensitive adhesive layer, and the peeling electrification voltage of the pressure-sensitive adhesive layer when the release sheet is peeled off is 5000 V or less. Adhesive sheet for electronic component reinforcement. 4. The support has a melting point of 200 ° C. or more, a Young's modulus (23 ° C.) of 980 N / mm ² or more, and a surface resistance value of 1.0 × 10 ¹⁷ Ω or less, and Thickness is 1
The adhesive sheet for reinforcing electronic components according to any one of claims 1 to 3, which is a thin base material having a thickness of 2 to 200 µm. 5. The amount of gas generated by heating at 100 ° C. of the adhesive layer is 1000 ppm or less.
The pressure-sensitive adhesive sheet for reinforcing electronic components according to any one of 4 above. 6. An antistatic agent layer containing no metal ion of alkali metal or alkaline earth metal is provided between the support and the pressure-sensitive adhesive layer.
The pressure-sensitive adhesive sheet for reinforcing electronic components according to any one of to 5. 7. A reinforced electronic component to which the pressure-sensitive adhesive sheet for reinforcing an electronic component according to claim 1 is attached.