JP2003100998A - Solid state image sensor - Google Patents
Solid state image sensorInfo
- Publication number
- JP2003100998A JP2003100998A JP2001285722A JP2001285722A JP2003100998A JP 2003100998 A JP2003100998 A JP 2003100998A JP 2001285722 A JP2001285722 A JP 2001285722A JP 2001285722 A JP2001285722 A JP 2001285722A JP 2003100998 A JP2003100998 A JP 2003100998A
- Authority
- JP
- Japan
- Prior art keywords
- solid
- chip
- state image
- adhesive
- transparent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、固体撮像素子チッ
プと透明キャップとの間に接着性透明樹脂で充填させた
固体撮像装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state image pickup device in which an adhesive transparent resin is filled between a solid-state image pickup element chip and a transparent cap.
【０００２】[0002]
【従来の技術】従来より、ＣＣＤ固体撮像素子チップ
（以下、ＣＣＤチップという）を中空構造でパッケージ
化した固体撮像装置が提供されている。図４は、このよ
うな従来の固体撮像装置のパッケージング工程を示す断
面図である。まず、図４（Ａ）において、ＣＣＤチップ
１０の上面には、中央にオンチップマイクロレンズ１３
を配置した受光部１４が設けられており、その周辺に電
極パッド１１が配置されている。なお、マイクロレンズ
１３は、受光部１４の感度向上を行うためのものであ
り、通常は、屈折率が１．５から１．６の有機材料より
形成されている。そして、この電極パッド１１上に予め
バンプ１２が固着されており、このバンプ１２にＴＡＢ
（tape automated bonding）テープ２０のインナリード
部２１が接続される。2. Description of the Related Art Conventionally, there has been provided a solid-state image pickup device in which a CCD solid-state image pickup element chip (hereinafter referred to as CCD chip) is packaged in a hollow structure. FIG. 4 is a sectional view showing a packaging process of such a conventional solid-state imaging device. First, in FIG. 4A, the on-chip microlens 13 is provided in the center on the upper surface of the CCD chip 10.
Is provided, and the electrode pad 11 is arranged around it. The microlens 13 is for improving the sensitivity of the light receiving section 14, and is usually made of an organic material having a refractive index of 1.5 to 1.6. Then, the bumps 12 are fixed in advance on the electrode pads 11, and the TABs are fixed to the bumps 12.
(Tape automated bonding) The inner lead portion 21 of the tape 20 is connected.
【０００３】次に、図４（Ｂ）に示すように、ガラス製
の透明キャップ４０に枠状に半硬化型接着樹脂４１を塗
布したものをＣＣＤチップ１０に位置決めして突き合わ
せ、図４（Ｃ）に示すように、加圧ツール５０とヒート
ブロック５１によって加圧、加熱によって接着樹脂４１
を硬化する。この段階で、図４（Ｄ）に示すように、Ｃ
ＣＤチップ１０の上面と透明キャップ４０との間に中空
部６０を有するチップサイズパッケージが構成され、中
空部６０が接着樹脂４１によって封止されたチップサイ
ズパッケージを完成する。Next, as shown in FIG. 4B, a glass transparent cap 40 coated with a semi-curable adhesive resin 41 in a frame shape is positioned and abutted on the CCD chip 10, and then, as shown in FIG. ), The adhesive resin 41 is pressed and heated by the pressure tool 50 and the heat block 51.
To cure. At this stage, as shown in FIG.
A chip size package having a hollow portion 60 is formed between the upper surface of the CD chip 10 and the transparent cap 40, and the chip size package in which the hollow portion 60 is sealed with the adhesive resin 41 is completed.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、上記従
来のＴＡＢ技術を用いた中空パッケージ構造では、接着
樹脂４１を用いて透明キャップ４０とＣＣＤチップ１０
を接着する場合に、マイクロレンズ１３上は中空とする
ため、透明キャップ４０とＣＣＤチップ１０の接着面積
が小さくなるという制約がある。これにより、耐湿性を
確保するための完全な樹脂封止が困難となっていた。ま
た、オンチップマイクロレンズ１３の上面に透明接着剤
を用いて透明キャップ４０を接着するパッケージ構造を
採用する方法もある。しかし、この場合には、透明接着
剤は屈折率を下げる目的を優先するため、耐湿性が高い
樹脂構造をとることが困難となる。However, in the above hollow package structure using the conventional TAB technique, the transparent resin 40 and the CCD chip 10 are formed by using the adhesive resin 41.
Since the microlens 13 is hollow when adhering, there is a restriction that the adhering area between the transparent cap 40 and the CCD chip 10 becomes small. This makes it difficult to completely seal the resin to ensure moisture resistance. There is also a method of adopting a package structure in which the transparent cap 40 is bonded to the upper surface of the on-chip microlens 13 using a transparent adhesive. However, in this case, since the transparent adhesive prioritizes the purpose of lowering the refractive index, it becomes difficult to form a resin structure having high moisture resistance.
【０００５】そこで本発明の目的は、固体撮像素子の感
度を向上しつつ、固体撮像素子チップと透明キャップの
接着性や耐湿性を向上できる固体撮像装置を提供するこ
とにある。Therefore, an object of the present invention is to provide a solid-state image pickup device capable of improving the adhesiveness and moisture resistance between the solid-state image pickup element chip and the transparent cap while improving the sensitivity of the solid-state image pickup element.
【０００６】[0006]
【課題を解決するための手段】本発明は前記目的を達成
するため、固体撮像素子チップの受光部の上面に接着剤
を介して透明キャップを装着し、前記固体撮像素子チッ
プおよび透明キャップの外周部にシール材を設けて前記
受光部の上部を封止した固体撮像装置において、前記接
着剤は、前記受光部の表面に設けられたマイクロレンズ
よりも低屈折率の透明接着樹脂よりなり、前記受光部の
マイクロレンズと透明キャップとの間に充填され、前記
シール材は、耐湿性の高い接着樹脂よりなることを特徴
とするものである。In order to achieve the above-mentioned object, the present invention mounts a transparent cap on the upper surface of a light receiving portion of a solid-state image pickup device chip with an adhesive, and surrounds the solid-state image pickup device chip and the transparent cap. In a solid-state imaging device in which a sealing material is provided in a portion to seal the upper portion of the light receiving portion, the adhesive is made of a transparent adhesive resin having a lower refractive index than a microlens provided on the surface of the light receiving portion, The sealant is filled between the microlens of the light receiving part and the transparent cap, and the sealing material is made of an adhesive resin having high moisture resistance.
【０００７】本発明による固体撮像装置では、固体撮像
素子チップと透明キャップとを接合する接着剤に、受光
部側のマイクロレンズよりも低屈折率の透明接着樹脂を
用いるとともに、この接着剤を受光部と透明キャップと
の間に充填することにより、受光部の受光感度を落とす
ことなく、中空部のない充填構造で固体撮像素子チップ
と透明キャップとを接合する。そして、耐湿性の高い接
着樹脂よりなるシール材を固体撮像素子チップおよび透
明キャップの外周部に設けて受光部の上部を封止するこ
とで、パッケージ内に湿気の浸入を防止する。したがっ
て、固体撮像素子の感度を向上しつつ、固体撮像素子チ
ップと透明キャップの接着性や耐湿性を向上できるパッ
ケージ構造を提供することが可能である。In the solid-state image pickup device according to the present invention, a transparent adhesive resin having a refractive index lower than that of the microlenses on the light receiving portion side is used as an adhesive for joining the solid-state image pickup element chip and the transparent cap, and this adhesive is used for receiving light. By filling between the transparent section and the transparent cap, the solid-state image sensor chip and the transparent cap are bonded to each other with a filling structure having no hollow portion without lowering the light receiving sensitivity of the light receiving section. Then, a sealing material made of an adhesive resin having high moisture resistance is provided on the outer peripheral portions of the solid-state image sensor chip and the transparent cap to seal the upper portion of the light receiving portion, thereby preventing moisture from entering the package. Therefore, it is possible to provide a package structure capable of improving the adhesiveness and moisture resistance of the solid-state imaging device chip and the transparent cap while improving the sensitivity of the solid-state imaging device.
【０００８】[0008]
【発明の実施の形態】以下、本発明による固体撮像装置
の実施の形態例について説明する。なお、以下に説明す
る実施の形態は、本発明の好適な具体例であり、技術的
に好ましい種々の限定が付されているが、本発明の範囲
は、以下の説明において、特に本発明を限定する旨の記
載がない限り、これらの態様に限定されないものとす
る。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of a solid-state image pickup device according to the present invention will be described below. The embodiments described below are preferred specific examples of the present invention, and various technically preferable limitations are given. However, the scope of the present invention is not limited to the present invention in the following description. Unless otherwise stated, the present invention is not limited to these embodiments.
【０００９】図１は、本発明の実施の形態による固体撮
像装置を示す断面図であり、図２は、図１に示す固体撮
像装置の平面図である。なお、図１は図２のＡ−Ａ線断
面図である。本例の固体撮像装置は、ＣＣＤチップをＴ
ＡＢ技術を用いてチップサイズパッケージ化したもので
ある。ＣＣＤチップ１１０は、上面中央にフォトセンサ
をマトリクス状に配置した方形状の受光部１１４を有
し、その両側部に電極パッド１１１が配置されている。
各電極パッド１１１の上部には、バンプ１１２が設けら
れており、このバンプ１１２にＴＡＢテープ１２０のイ
ンナリード部１２１が接続されている。なお、バンプ１
１２は、予め電極パッド１１１側でなくＴＡＢテープ１
２０のインナリード部１２１側に設けられていてもよ
い。また、受光部１１４の上面には、受光感度を向上す
るためのオンチップマイクロレンズ１１３が設けられて
いる。なお、マイクロレンズ１１３は、屈折率が１．５
から１．６の有機材料より形成されている。FIG. 1 is a sectional view showing a solid-state imaging device according to an embodiment of the present invention, and FIG. 2 is a plan view of the solid-state imaging device shown in FIG. 1 is a sectional view taken along the line AA of FIG. The solid-state imaging device of this example has a CCD chip
It is a chip size package using AB technology. The CCD chip 110 has a rectangular light receiving portion 114 in which photosensors are arranged in a matrix at the center of the upper surface, and electrode pads 111 are arranged on both sides thereof.
A bump 112 is provided on each electrode pad 111, and the inner lead portion 121 of the TAB tape 120 is connected to the bump 112. Note that bump 1
12 is not the electrode pad 111 side in advance but the TAB tape 1
It may be provided on the inner lead portion 121 side of 20. Further, an on-chip microlens 113 for improving the light receiving sensitivity is provided on the upper surface of the light receiving section 114. The microlens 113 has a refractive index of 1.5.
To 1.6 of the organic material.
【００１０】また、このようなＣＣＤチップ１１０の上
面には、接着剤１４１を介して透明キャップ１４０が設
けられている。この透明キャップ１４０は、ＣＣＤチッ
プ１１０よりやや大きいサイズの方形状のガラス板より
形成されている。また、接着剤１４１は、マイクロレン
ズ１１３と透明キャップ１４０との間に充填状態で設け
られている。この接着剤１４１は、マイクロレンズ１１
３よりも低屈折率である１．３から１．４の透明接着樹
脂よりなる。このようにマイクロレンズ１１３よりも低
屈折率の接着剤１４１により、受光部１１４の感度を低
下させることなく、ＣＣＤチップ１１０と透明キャップ
１４０とを充填状態で接合している。A transparent cap 140 is provided on the upper surface of the CCD chip 110 with an adhesive agent 141. The transparent cap 140 is formed of a rectangular glass plate slightly larger than the CCD chip 110. Further, the adhesive agent 141 is provided in a filled state between the microlens 113 and the transparent cap 140. The adhesive 141 is used for the microlens 11
It is made of a transparent adhesive resin having a refractive index of 1.3 to 1.4, which has a lower refractive index than 3. As described above, the adhesive 141 having a lower refractive index than the microlens 113 joins the CCD chip 110 and the transparent cap 140 in a filled state without lowering the sensitivity of the light receiving unit 114.
【００１１】また、ＣＣＤチップ１１０と透明キャップ
１４０の外周部にはシール材１３０が設けられ、ＣＣＤ
チップ１１０と透明キャップ１４０の間を封止してい
る。このシール材１３０は、耐湿性の高いエポキシ系樹
脂よりなり、透明キャップ１４０の裏面からＣＣＤチッ
プ１１０の外周縁部にかけて充填状態で設けられてい
る。なお、本例において、接着剤１４１およびシール材
１３０は、ＵＶ硬化型、あるいは熱硬化型、あるいはＵ
Ｖ熱併用硬化型のものが用いられており、硬化前はペー
スト状または半硬化状で、ＵＶ照射や熱加熱によって硬
化を行うものとなっている。A sealing material 130 is provided on the outer periphery of the CCD chip 110 and the transparent cap 140, and
The space between the chip 110 and the transparent cap 140 is sealed. The sealing material 130 is made of an epoxy resin having high moisture resistance, and is provided in a filled state from the back surface of the transparent cap 140 to the outer peripheral edge portion of the CCD chip 110. In this example, the adhesive agent 141 and the sealing material 130 are UV-curable type, thermosetting type, or U-type.
A V-heat combined curing type is used, and it is a paste or semi-cured state before curing and is cured by UV irradiation or heat heating.
【００１２】次に、このような固体撮像装置のパッケー
ジング工程について説明する。図３は、以上のような本
例の固体撮像装置のパッケージング工程を示す断面図で
ある。まず、図３（Ａ）において、インナリードボンデ
ィングによってＣＣＤチップ１１０の電極パッド１１１
とＴＡＢテープ１２０のインナリード部１２１とをバン
プ１１２を介して接続する。次に、図３（Ｂ）におい
て、ＣＣＤチップ１１０のマイクロレンズ１１３の上面
に接着剤１４１となる低屈折率透明接着樹脂１４１Ａを
塗布する。Next, a packaging process of such a solid-state image pickup device will be described. FIG. 3 is a cross-sectional view showing a packaging process of the solid-state imaging device of this example as described above. First, in FIG. 3A, the electrode pad 111 of the CCD chip 110 is formed by inner lead bonding.
The inner lead portion 121 of the TAB tape 120 is connected via the bump 112. Next, in FIG. 3B, a low-refractive-index transparent adhesive resin 141A, which serves as an adhesive 141, is applied to the upper surface of the microlens 113 of the CCD chip 110.
【００１３】次に、図３（Ｃ）において、加圧ピン１５
０等を用いて低屈折率透明接着樹脂１４１Ａを透明キャ
ップ１４０側に圧接し、接着剤１４１として所定の充填
状態に保持する。そして、この状態で、ＵＶ光源による
ＵＶ照射、または熱源による加熱、またはＵＶ照射と加
熱とを行い、接着剤１４１を硬化する。次に、図３
（Ｄ）において、透明キャップ１４０の裏面からＣＣＤ
チップ１１０および接着剤１４１の外周部にかけて、シ
ール材１３０となる高耐湿性エポキシ系接着樹脂１３０
Ａを塗布し、これをＵＶ光源によるＵＶ照射、または熱
源による加熱、またはＵＶ照射と加熱とを行い、シール
材１３０を硬化する。このようにして図３（Ｅ）に示す
ような強度や耐湿性に優れた小型チップサイズパッケー
ジを完成する。Next, referring to FIG. 3C, the pressure pin 15
0 or the like is used to press the low-refractive-index transparent adhesive resin 141A into pressure contact with the transparent cap 140 side to keep the adhesive 141 in a predetermined filled state. Then, in this state, UV irradiation by a UV light source, heating by a heat source, or UV irradiation and heating is performed to cure the adhesive agent 141. Next, FIG.
In (D), from the rear surface of the transparent cap 140 to the CCD
A highly moisture-resistant epoxy adhesive resin 130 serving as a sealing material 130 extending to the outer periphery of the chip 110 and the adhesive 141.
A is applied, and the sealing material 130 is cured by performing UV irradiation with a UV light source, heating with a heat source, or UV irradiation and heating. In this way, a small chip size package having excellent strength and moisture resistance as shown in FIG. 3E is completed.
【００１４】以上のような本例の固体撮像装置では、マ
イクロレンズ１１３よりも低屈折率の透明接着剤１４１
でＣＣＤチップ１１０と透明キャップ１４０とを接合す
ることにより、ＣＣＤチップ１１０の受光感度を落とす
ことなく、十分な接着面積でＣＣＤチップ１１０と透明
キャップ１４０を固定でき、十分な強度を得ることがで
きる。また、ＣＣＤチップ１１０の外周部を高耐湿性の
シール材１３０で封止することにより、低屈折率を重視
した接着剤１４１の弱点を補強でき、耐湿性に優れたパ
ッケージ構造を得ることが可能となる。また、充填構造
で接着剤１４１を配置することから、接着剤１４１のは
み出し等による不具合を生じることなくパッケージング
を行うことができ、組み立て作業を容易化できる利点も
ある。In the solid-state image pickup device of this example as described above, the transparent adhesive agent 141 having a refractive index lower than that of the microlens 113 is used.
By bonding the CCD chip 110 and the transparent cap 140 with each other, the CCD chip 110 and the transparent cap 140 can be fixed with a sufficient adhesive area without lowering the light receiving sensitivity of the CCD chip 110, and sufficient strength can be obtained. . Further, by sealing the outer peripheral portion of the CCD chip 110 with the highly moisture-resistant sealing material 130, the weak points of the adhesive agent 141 that emphasizes the low refractive index can be reinforced, and a package structure having excellent moisture resistance can be obtained. Becomes Further, since the adhesive 141 is arranged in the filling structure, there is an advantage that packaging can be performed without causing a problem due to the adhesive 141 protruding and the assembly work can be facilitated.
【００１５】[0015]
【発明の効果】以上説明したように本発明の固体撮像装
置では、固体撮像素子チップと透明キャップとを接合す
る接着剤に、受光部側のマイクロレンズよりも低屈折率
の透明接着樹脂を用いるとともに、この接着剤を受光部
と透明キャップとの間に充填することにより、受光部の
受光感度を落とすことなく、中空部のない充填構造で固
体撮像素子チップと透明キャップとを接合し、かつ、耐
湿性の高い接着樹脂よりなるシール材を固体撮像素子チ
ップおよび透明キャップの外周部に設けて受光部の上部
を封止することで、パッケージ内に湿気の浸入を防止す
る。したがって、固体撮像素子の感度を向上しつつ、固
体撮像素子チップと透明キャップの接着性や耐湿性を向
上できる効果がある。As described above, in the solid-state image pickup device of the present invention, a transparent adhesive resin having a refractive index lower than that of the microlenses on the light-receiving portion side is used as the adhesive for joining the solid-state image pickup element chip and the transparent cap. At the same time, by filling this adhesive between the light-receiving portion and the transparent cap, the solid-state image sensor chip and the transparent cap are joined by a filling structure without a hollow portion without lowering the light-receiving sensitivity of the light-receiving portion, and A sealing material made of an adhesive resin having high moisture resistance is provided on the outer peripheral portion of the solid-state image sensor chip and the transparent cap to seal the upper portion of the light receiving portion, thereby preventing moisture from entering the package. Therefore, it is possible to improve the adhesiveness and moisture resistance between the solid-state image sensor chip and the transparent cap while improving the sensitivity of the solid-state image sensor.
【図１】本発明の実施の形態による固体撮像装置を示す
断面図である。FIG. 1 is a sectional view showing a solid-state imaging device according to an embodiment of the present invention.
【図２】図１に示す固体撮像装置の平面図である。FIG. 2 is a plan view of the solid-state imaging device shown in FIG.
【図３】図１に示す固体撮像装置のパッケージング工程
を示す断面図である。FIG. 3 is a cross-sectional view showing a packaging process of the solid-state imaging device shown in FIG.
【図４】従来の固体撮像装置のパッケージング工程を示
す断面図である。FIG. 4 is a cross-sectional view showing a packaging process of a conventional solid-state imaging device.
１１０……ＣＣＤチップ、１１１……電極パッド、１１
２……バンプ、１２０……ＴＡＢテープ、１２１……イ
ンナリード部、１３０……シール材、１４０……透明キ
ャップ、１４１……接着剤。110 ... CCD chip, 111 ... Electrode pad, 11
2 ... Bump, 120 ... TAB tape, 121 ... Inner lead part, 130 ... Sealing material, 140 ... Transparent cap, 141 ... Adhesive.
フロントページの続き Ｆターム(参考） 4M109 AA02 BA07 CA10 DA04 EA02 EA15 EC11 EE12 GA01 4M118 AA01 AA08 AA10 AB01 GD04 GD07 HA02 HA09 HA11 HA27 HA31 5F044 NN02 RR17 RR18 RR19 Continued front page F-term (reference) 4M109 AA02 BA07 CA10 DA04 EA02 EA15 EC11 EE12 GA01 4M118 AA01 AA08 AA10 AB01 GD04 GD07 HA02 HA09 HA11 HA27 HA31 5F044 NN02 RR17 RR18 RR19
Claims (5)
着剤を介して透明キャップを装着し、前記固体撮像素子
チップおよび透明キャップの外周部にシール材を設けて
前記受光部の上部を封止した固体撮像装置・部の表面に
設けられたマイクロレンズよりも低屈折率の透明接着樹
脂よりなり、前記受光部のマイクロレンズと透明キャッ
プとの間に充填され、 前記シール材は、耐湿性の高い接着樹脂よりなる、 ことを特徴とする固体撮像装置。1. A solid cap is mounted on an upper surface of a light receiving portion of a solid-state image pickup device chip via an adhesive, and a sealing material is provided on an outer peripheral portion of the solid-state image pickup device chip and the transparent cap to seal an upper portion of the light receiving portion. It is made of a transparent adhesive resin having a refractive index lower than that of the microlens provided on the surface of the solid-state imaging device / section that is stopped, and is filled between the microlens of the light receiving section and the transparent cap, and the sealing material is moisture resistant A solid-state image pickup device comprising: a high adhesive resin.
の周辺に電極パッドが配置され、前記電極パッドにバン
プを介してＴＡＢテープのリード部が接続されているこ
とを特徴とする請求項１記載の固体撮像装置。2. The solid-state image pickup device chip, wherein electrode pads are arranged around the light receiving portion, and lead portions of a TAB tape are connected to the electrode pads via bumps. The solid-state imaging device described.
プと同一サイズまたはやや大きいサイズを有する方形板
状に形成され、前記透明キャップと固体撮像素子の外周
部に前記ＴＡＢテープのリード部を導出させた状態でシ
ール材を配置することによりチップチップサイズパッケ
ージを構成していることを特徴とする請求項２記載の固
体撮像装置。3. The transparent cap is formed in the shape of a rectangular plate having the same size as or a slightly larger size than the solid-state image sensor chip, and the lead portion of the TAB tape is led out to the outer periphery of the transparent cap and the solid-state image sensor. 3. The solid-state imaging device according to claim 2, wherein the chip chip size package is configured by disposing the sealing material in the closed state.
ら１．６の有機材料よりなり、前記接着剤は屈折率が
１．３から１．４の透明樹脂よりなることを特徴とする
請求項１記載の固体撮像装置。4. The microlens is made of an organic material having a refractive index of 1.5 to 1.6, and the adhesive is made of a transparent resin having a refractive index of 1.3 to 1.4. Item 2. The solid-state imaging device according to item 1.
ことを特徴とする請求項１記載の固体撮像装置。5. The solid-state imaging device according to claim 1, wherein the sealing material is made of epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001285722A JP5044878B2 (en) | 2001-09-19 | 2001-09-19 | Solid-state imaging device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001285722A JP5044878B2 (en) | 2001-09-19 | 2001-09-19 | Solid-state imaging device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003100998A true JP2003100998A (en) | 2003-04-04 |
| JP5044878B2 JP5044878B2 (en) | 2012-10-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001285722A Expired - Fee Related JP5044878B2 (en) | 2001-09-19 | 2001-09-19 | Solid-state imaging device |
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| JPWO2013179764A1 (en) * | 2012-05-30 | 2016-01-18 | オリンパス株式会社 | Imaging device manufacturing method and semiconductor device manufacturing method |
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