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JP2003174251A5 - - Google Patents

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Publication number
JP2003174251A5
JP2003174251A5 JP2001374745A JP2001374745A JP2003174251A5 JP 2003174251 A5 JP2003174251 A5 JP 2003174251A5 JP 2001374745 A JP2001374745 A JP 2001374745A JP 2001374745 A JP2001374745 A JP 2001374745A JP 2003174251 A5 JP2003174251 A5 JP 2003174251A5
Authority
JP
Japan
Prior art keywords
electronic component
resin sheet
mounting method
circuit board
predetermined position
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001374745A
Other languages
Japanese (ja)
Other versions
JP2003174251A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2001374745A priority Critical patent/JP2003174251A/en
Priority claimed from JP2001374745A external-priority patent/JP2003174251A/en
Publication of JP2003174251A publication Critical patent/JP2003174251A/en
Publication of JP2003174251A5 publication Critical patent/JP2003174251A5/ja
Pending legal-status Critical Current

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Claims (6)

電子部品に設けられた複数の外部接続用端子それぞれに対応させた複数の開口部が形成された樹脂シートを介して電子部品を回路基板の所定位置に装着してリフロー半田付けすることを特徴とする電子部品の実装方法。  The electronic component is mounted at a predetermined position on the circuit board and reflow soldered via a resin sheet formed with a plurality of openings corresponding to the plurality of external connection terminals provided on the electronic component. Mounting method for electronic components. 開口部にクリーム半田または半田ボールを充填する請求項１に記載の電子部品の実装方法。The electronic component mounting method according to claim 1, wherein the opening is filled with cream solder or solder balls . リフロー半田付け時に樹脂シートの溶融により電子部品の接合部を封止する請求項１〜２いずれか一項に記載の電子部品の実装方法。The electronic component mounting method according to any one of claims 1 to 2 , wherein a joint portion of the electronic component is sealed by melting the resin sheet during reflow soldering. 各開口部がそれぞれ各外部接続用端子に位置するように樹脂シートを取り付けた電子部品を回路基板に装着する請求項１〜３いずれか一項に記載の電子部品の実装方法。The mounting method of the electronic component as described in any one of Claims 1-3 which mounts the electronic component which attached the resin sheet so that each opening part may be located in each external connection terminal, respectively. 樹脂シートを回路基板の所定位置に装着した後、電子部品を樹脂シート上に装着する請求項１〜３いずれか一項に記載の電子部品の実装方法。The mounting method of the electronic component as described in any one of Claims 1-3 which mounts an electronic component on a resin sheet after mounting a resin sheet in the predetermined position of a circuit board. メタルマスクを用いた半田を回路基板に供給する工程と、Supplying a circuit board with solder using a metal mask;
電子部品に設けられた複数の外部接続用端子に対応させた複数の開口部が形成された樹脂シートを回路基板につける工程と、Attaching a resin sheet formed with a plurality of openings corresponding to a plurality of external connection terminals provided in an electronic component to a circuit board;
電子部品を回路基板の所定位置に装着する工程と、Mounting the electronic component at a predetermined position on the circuit board;
リフロー半田付けする工程とReflow soldering and
からなる電子部品の実装方法。An electronic component mounting method comprising:
JP2001374745A 2001-12-07 2001-12-07 Method for mounting electronic parts Pending JP2003174251A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001374745A JP2003174251A (en) 2001-12-07 2001-12-07 Method for mounting electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001374745A JP2003174251A (en) 2001-12-07 2001-12-07 Method for mounting electronic parts

Publications (2)

Publication Number Publication Date
JP2003174251A JP2003174251A (en) 2003-06-20
JP2003174251A5 true JP2003174251A5 (en) 2005-07-21

Family

ID=19183261

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001374745A Pending JP2003174251A (en) 2001-12-07 2001-12-07 Method for mounting electronic parts

Country Status (1)

Country Link
JP (1) JP2003174251A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020126869A (en) * 2019-02-01 2020-08-20 パナソニックＩｐマネジメント株式会社 Mask design equipment and determination method of mask aperture dimension

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