JP2003174154A - Solid-state imaging device and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To securely connect a solid-state imaging element and to improve the adhesion quality of sealing glass of an optical filter, etc., by suppressing thermal deformation of a resin structure such as a solid printed board. <P>SOLUTION: The device is equipped with a structure 1 which is made of an insulating resin composed of a thermoplastic resin and has a through opening part 1C and has a wiring part 5 on the surface, a solid-state imaging element 4 which is connected to a wiring part and mounted on the through opening part 1C, and a translucent member 3 which is arranged at a specific interval with the solid-state imaging element 4 so as to close the through opening part 1C. The structure 1 has boundary surfaces which differ in molecular bonding direction at positions which are nearby the solid-state imaging element mount surface 9 and parallel to the mount surface 9 for the solid-state imaging element 4. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state image pickup device and a method of manufacturing the same, and more particularly to a small solid-state image pickup device formed by using a semiconductor image pickup device such as a surveillance camera, a medical camera, a vehicle-mounted camera, and the like. The present invention relates to a manufacturing method thereof.

[0002]

[Prior art]

In recent years, this type of image pickup apparatus outputs an image input through an optical system such as a lens as an electric signal. Along with the downsizing and high performance of this image pickup apparatus, cameras have been downsized and are used in various fields, expanding the market as an image input apparatus.

In a conventional image pickup apparatus using a semiconductor image pickup device, parts such as an LSI having a lens, a semiconductor image pickup device, a driving circuit thereof and a signal processing circuit are formed in a housing or a structure, respectively, and these are combined. ing. The mounting structure based on such a combination has been conventionally formed by mounting each element on a flat printed circuit board.

It was formed by mounting each element on a substrate.

Therefore, in order to further reduce the size of the device, the applicant of the present invention, as shown in FIGS. 10 and 11, has a rectangular trapezoidal leg portion 101A as a mounting member and a body formed thereon. A three-dimensional printed circuit board 101 made of resin is proposed, which is composed of a portion 101B and has an opening portion 101C formed at a boundary portion between the leg portion 101A and the body portion 101B (Japanese Patent Application Laid-Open No. 20-200200).
01-245186). And this three-dimensional printed circuit board 101
Of the printed wiring pattern 12 on the back side of the leg portion 101A.
2, the lens 102 is fitted on the inner periphery of the body 101B, and the optical filter 117 is located above the opening 101C and the solid-state image sensor is located below the lens 101 with the optical axis 117 as the center. Image pickup device 10 which is one of the
4 and the chip component 108 are arranged. Then, by connecting with solder paste 114 to the terminal pattern 122 disposed on the leg portion 101A, a mobile phone,
It is connected to the main board 113 of various devices such as a personal computer. FIG. 12 is an explanatory view of the main part thereof. The semiconductor image sensor 104 is connected to the terminal pattern 105 formed on the leg portion 101A through the bumps 106 formed on the surface,
The three-dimensional printed circuit board 101 is connected by being sealed with the sealing resin 107. The same parts are designated by the same reference numerals.

Such a three-dimensional printed circuit board is obtained by injection molding, but it is usually used in order to reduce the linear expansion coefficient of the resin material in terms of molding accuracy and durability of the molding die. There is a problem that the extender pigment (filler) to be added cannot be added in a certain amount or more. Further, it has anisotropy that the filler is oriented in the molding flow direction and is large in the vertical direction.

Further, since the thermoplastic resin generally used in injection molding has a linear molecular bond structure, the coefficient of linear expansion is small in the molecular bond direction and large in the perpendicular direction. is doing. Therefore, there is a problem that deformation is likely to occur particularly in a specific direction (direction perpendicular to the molecular bonding direction).

[0009]

Therefore, the three-dimensional printed circuit board is largely deformed in the heating step when mounting the solid-state image sensor on the three-dimensional printed circuit board, and the connection portion between the solid-state image sensor and the three-dimensional printed circuit board is extremely deformed. A large amount of stress was applied, which sometimes resulted in connection failure due to cracks. Usually, this connecting portion is composed of a pad provided on the solid-state image pickup device and a terminal electrode of a three-dimensional printed circuit board, and a connection using a conductive adhesive such as silver paste is used for connection between them. Sonic bonding, thermocompression bonding, etc. are used.

In either method, thermal deformation of the three-dimensional printed circuit board tends to cause peeling of the solid-state image pickup device, which causes a reduction in yield. As described above, when the printed circuit board has a three-dimensional structure, the strain due to heat is three times as large as that in the case of the normal planar structure, and the deformation due to the difference in the linear expansion coefficient has been a serious problem that hinders the improvement in yield.

The present invention has been made in view of the above-mentioned circumstances, and suppresses thermal deformation of a resin structure such as a three-dimensional printed circuit board to ensure connection of a solid-state image pickup device and sealing glass such as an optical filter. The purpose is to improve the adhesive quality of.

[0012]

Therefore, in the present invention, a structure made of an insulating resin made of a thermoplastic resin, having a through-opening portion and having a wiring portion on the surface thereof,
A solid-state image sensor connected to the wiring part and attached to the structure so as to close the through-opening, and the structure so as to close the through-opening with a predetermined distance from the solid-state image sensor. A translucent member mounted on the body, wherein the structure is located in the vicinity of the solid-state image sensor mounting surface on which the solid-state image sensor is mounted and parallel to the solid-state image sensor mounting surface. In addition, it has a boundary surface in which the molecular bonding direction or the filler arrangement direction is different from each other.

By the way, when the structure is made of a thermoplastic resin formed by injection molding, deformation is apt to occur particularly at the time of curing, and when it is in a high temperature environment during use,
Deformation occurs, and the solid-state image sensor and structure (3D wiring board)
There is a problem that poor connection is likely to occur at the connection portion with. In particular, this deformation is likely to occur in the direction perpendicular to the injection direction. Therefore, according to the above configuration, since the molecular bonding directions are different from each other in the vicinity of the solid-state imaging device mounting surface and in a position parallel to the mounting surface of the solid-state imaging device,
Since the directions of expansion differ from each other at this boundary surface, the stresses cancel each other out, expansion and contraction due to heat are also reduced, deformation of the structure is suppressed during mounting and use, and the translucency of optical filters etc. is suppressed. The positional accuracy between the member and the solid-state image sensor can be maintained with high accuracy, the connection failure between the solid-state image sensor and the wiring part of the structure can be reduced, and the reliability of the connection of the solid-state image sensor can be improved, and the solid-state image sensor with high reliability can be obtained. It is possible to provide an imaging device. Further, occurrence of connection failure such as peeling on the optical filter mounting surface is also reduced. Furthermore, since the structures can be formed of the same material, there is no difference in the coefficient of thermal expansion, and the occurrence of strain can be suppressed. Here, the term “vicinity” refers to a distance that can increase the certainty when mounting the solid-state image pickup device, including the case where it is in direct contact or in the vicinity thereof.

The boundary surface of the structure is 45 degrees to 9 degrees.
It is characterized in that it is formed so as to have a deviation of 0 degree in the molecular bonding direction or the filler arrangement direction.

Particularly, by forming them so as to have a deviation of 45 to 90 degrees in the molecular bonding direction, the deformation of the boundary surface near the mounting surface can be efficiently suppressed by the directional anisotropy of the elongation due to the molecular bonding direction. be able to. Therefore, the connection failure can be prevented most efficiently, and the reliability of the connection of the solid-state imaging device can be increased.

Desirably, the boundary surface of the structure is affixed to the mounting surface of the light-transmissive member with a fixing plate made of a thermoplastic resin molded so that the molecular bonding directions are different on the mounting surface. It is characterized by being formed by.

According to this structure, the translucent member is arranged in the through opening of the structure through the fixing plate made of a thermoplastic resin molded so as to have a deviation in the molecular bonding direction. Since the deformation of the structure is suppressed in the fixing portion of the translucent member and in the vicinity thereof, it is possible to suppress the thermal deformation of the structure in the vicinity of the solid-state image sensor and increase the reliability of connection of the solid-state image sensor. . Moreover, since the fixing plate can be formed of the same material as the structure, there is no difference in the coefficient of thermal expansion, and the occurrence of strain can be suppressed.

Preferably, the fixing plate is two plate-shaped members arranged in parallel with each other along the molecular arrangement direction or the filler arrangement direction of the thermoplastic resin.

According to such a constitution, by forming the two plate-like bodies so as to be parallel to the molecular arrangement direction, it becomes possible to suppress the elongation in the direction perpendicular to the molecular bonding direction.

Preferably, the fixing plate is a ring-shaped plate attached to the through opening.

According to this structure, since the fixing plate is the ring-shaped plate, the expansion in all directions is suppressed and the deformation is significantly suppressed. Therefore, the heat of the structure near the solid-state image sensor is suppressed. The deformation can be suppressed, and the reliability of the connection of the solid-state imaging device can be improved.

Further preferably, the structure is a structure made of a thermoplastic resin integrally molded so as to have the boundary surface by injection molding of a thermoplastic resin.

According to such a construction, it is easy to manufacture because the boundary surface is formed integrally by molding only by changing the injection direction, and bonding is unnecessary.

Preferably, the structure is composed of at least two divided structures made of a thermoplastic resin which are divided and molded so that there is a deviation in the direction of molecular bonding at the boundary surface, and the divided structures are attached to each other. It is characterized by being formed by combining them.

According to such a structure, the structure is divided and formed so that there is a deviation in the molecular bonding direction at the boundary surface, and this is attached, so that the structure of the mold can be simplified, and the cavity of a normal mold can be formed. It is only necessary to change the injection direction by using half the number, no adjustment is required, and the number of steps is increased, but the manufacturing process itself can be simplified.

Preferably, the structure is integrally molded so as to enclose a fixing plate made of a thermoplastic resin, and a molecular bonding direction is different at a boundary surface with the fixing plate.

According to this structure, a fixing plate made of a thermoplastic resin molded so as to have a deviation in the direction of molecular bonding is mounted in a mold for injection molding, and ordinary injection molding is performed. , The fixing plate can be easily sealed, and the deformation of the structure is suppressed at and around the sealing position.
It is possible to suppress the thermal deformation of the structure near the solid-state image sensor and increase the reliability of connection of the solid-state image sensor. Moreover, since the fixing plate can be formed of the same material as the structure, there is no difference in the coefficient of thermal expansion, and the occurrence of strain can be suppressed.

Preferably, the structure has a leg portion forming a wiring portion and a tubular body portion provided on the leg portion, and between the body portion and the leg portion. It is characterized by having the through opening.

According to this structure, in particular, the structure of the entire device can be miniaturized, but there is a problem that connection failure is likely to occur due to deformation of the connection portion due to thermal deformation.
However, according to the present invention, by changing the molecular arrangement direction, the thermal deformation of the structure made of the insulating resin can be suppressed very easily, and the reliability of the connection of the solid-state imaging device can be enhanced.

Further, in the method of the present invention, the through opening, the solid-state image sensor mounting surface on which the solid-state image sensor can be mounted in the through-hole, and the through hole at a predetermined distance from the solid-state image sensor mounting surface. A structure forming step of forming a structure having a translucent member mounting surface for mounting the translucent member so as to block the portion; and a wiring part forming step of forming a wiring part in the structure, A solid-state image sensor mounting step of mounting a solid-state image sensor on the solid-state image sensor mounting surface, and a translucent member mounting step of mounting the translucent member on the translucent member mounting surface, and forming the structure. A step of forming a structure in which a step is performed in the vicinity of the mounting surface of the solid-state imaging device and in a position parallel to the mounting surface of the solid-state imaging device so as to have a boundary surface having mutually different molecular bonding directions. It is characterized by being a process.

According to such a method, the thermoplastic insulating resin is injected into the molding die from different directions with the boundary surface as a boundary so that the molecular bonding directions have different boundary surfaces. , A structure in which the solid-state image sensor mounting surface is less likely to be deformed can be formed, and the positional accuracy between the translucent member such as an optical filter and the solid-state image sensor can be maintained with high accuracy. Poor connection with the wiring portion of the structure is also reduced, the reliability of the connection of the solid-state imaging device is enhanced, and a solid-state imaging device with high reliability can be provided.

Further preferably, the boundary surface is formed so as to have a deviation of 45 degrees to 90 degrees.

Preferably, in the structure molding step, the thermoplastic resin is injected into the molding die from different directions with the boundary surface as a boundary, and the injection direction is set in the die. The method is characterized by including a step of performing injection molding so as to have a deviation.

According to this structure, the deformation of the structure is easily suppressed by changing the injection direction and performing normal injection molding in the mold for injection molding. It is possible to suppress the thermal deformation of the structure at 1, and increase the reliability of connection of the solid-state imaging device. Further, the structural bodies are formed of the same material, and there is no difference in the coefficient of thermal expansion, so that the generation of strain can be suppressed.

Preferably, the structure molding step includes a step of injection-molding in a molding die in which a resin-made fixing plate having different molecular arrangement directions or filler arrangement directions is previously inserted. It is characterized by

According to this structure, a fixing plate made of a thermoplastic resin molded so as to have a deviation in the molecular bonding direction is mounted in a mold for injection molding, and ordinary injection molding is performed. , The fixing plate can be easily sealed, and the deformation of the structure is suppressed at and around the sealing position.
It is possible to suppress the thermal deformation of the structure near the solid-state image sensor and increase the reliability of connection of the solid-state image sensor. Moreover, since the fixing plate can be formed of the same material as the structure, there is no difference in the coefficient of thermal expansion, and the occurrence of strain can be suppressed.

Desirably, a through opening, and a solid-state image sensor mounting surface on which a solid-state image sensor can be mounted in the through-hole,
And a translucent member mounting surface for mounting a translucent member so as to close the through opening at a predetermined distance from the solid-state image sensor mounting surface, and a structure made of an insulating resin is formed. A structure molding step, a wiring section forming step of forming a wiring section in the structure, a solid-state image sensor mounting step of mounting a solid-state image sensor on the solid-state image sensor mounting surface, and a molecule on the translucent member mounting surface. And a translucent member mounting step of mounting the translucent member via a fixing plate made of a thermoplastic resin having a different array direction or filler array direction.

According to this structure, since the translucent member is mounted through the fixing plate made of a thermoplastic resin molded so as to have a deviation in the direction of molecular bonding, the structure is close to the fixing plate. Since the deformation is suppressed, the thermal deformation of the structure near the solid-state image sensor can be suppressed, and the reliability of connection of the solid-state image sensor can be increased. Moreover, since the fixing plate can be formed of the same material as the structure, there is no difference in the coefficient of thermal expansion, and the occurrence of strain can be suppressed.

Further preferably, the boundary surface is formed so as to have a deviation of 45 degrees from 90 degrees.

Further preferably, the through opening, the solid-state image sensor mounting surface on which the solid-state image sensor can be mounted in the through-opening, and the through-opening portion are closed at a predetermined distance from the solid-state image sensor mounting surface. A translucent member mounting surface for mounting a translucent member such that a structure made of an insulating resin is provided in the vicinity of the solid-state image sensor mounting surface and on the mounting surface of the solid-state image sensor. Split structure molding step of molding as at least two split structures made of thermoplastic resin split and molded so as to have a deviation in the molecular bonding direction from each other at parallel boundary surfaces, and a wiring portion is formed in the split structure. A wiring part forming step, a bonding step of bonding the divided structures to form a structure, and a solid-state image sensor mounting step of mounting a solid-state image sensor on the solid-state image sensor mounting surface,
And a translucent member mounting step of mounting the translucent member on the translucent member mounting surface via a fixing plate made of a thermoplastic resin having a different molecular arrangement direction or a different filler arrangement direction.

According to this structure, in the resin molding step, the two divided structures are separately molded so that they have a deviation in the direction of molecular bonding, and these are bonded to each other, so that the solid-state image sensor mounting surface can be extremely easily and reliably mounted. Deformation in the vicinity is suppressed, mounting is easy, and connection failure due to deformation during use is reduced.

Further preferably, the boundary surface is formed so as to have a deviation of 45 degrees to 90 degrees.

Preferably, the structure forming step is
It is characterized in that it is a step of injecting thermoplastic insulating resin into the molding die from different directions with the boundary surface as a boundary, and performing injection molding so that there is a deviation in the injection direction at the boundary surface. .

According to this structure, it is sufficient to form the structural bodies which are injection-molded so that the injection directions are different from each other as the divided structural bodies and to bond the structural bodies together, which is extremely easy to manufacture.

[0045]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

First Embodiment

FIG. 1 is an explanatory view of the main part of the solid-state image pickup device according to the first embodiment of the present invention. In this solid-state imaging device, when the solid-state imaging device 4 is connected to the resin structure 1S including a wiring portion such as the terminal pattern 5, the optical filter mounting surface 8 on which the optical filter 3 of the resin structure is mounted is The fixing plate 1Q made of polyphthalamide resin is adhered so that the attachment surface 8 is formed so that the molecular bonding directions are different. And again, the fixed plate 1
The boundary surface between Q and the resin structure 1S is the optical filter mounting surface 8
Is located close to.

That is, as shown in FIG. 2, the fixing plate 1Q has a square ring shape with a thickness t = t = 0.1 to 0.2 mm and a coefficient of thermal expansion of about 10 ppm / ° C.
It is made of insulating polyphthalamide resin. Then, a rectangular trapezoidal leg portion 1A and a body portion 1B formed on the leg portion 1A
And a resin structure 1 made of polyphthalamide resin having a through opening 1C formed at the boundary between the leg 1A and the body 1B. The resin structure 1 has the through opening 1C and is formed on a part of the surface. A resin structure 1 including a wiring portion including a terminal pattern 5, and a solid-state imaging device connected to the wiring portion, mounted in the through opening 1C, and electrically connected to the terminal pattern 5. 4 and a fixing plate 1 so as to close the through opening at a predetermined distance from the solid-state image sensor 4.
And an optical filter 3 made of a translucent resin attached via Q.

Next, a method of manufacturing this solid-state image pickup device will be described. First, as shown in FIG. 4 (a), a rectangular trapezoidal leg portion 1A and a body portion 1B formed on the leg portion 1A are formed, and a through opening portion 1C is formed at a boundary portion between the leg portion 1A and the body portion 1B. The formed resin structure 1 made of polyphthalamide resin is formed by injection molding. Then, a wiring portion including the terminal pattern 5 formed on the back surface side of the leg portion 1A is formed in a predetermined region of the resin structure 1 by a thin film process such as a plating process or a sputtering method.

Then, as shown in FIG. 4B, the fixing plate 1Q made of polyphthalamide resin as shown in FIG. 2 is attached to the optical filter of the resin structure 1 by using an adhesive resin (not shown). Stick on surface 8.

Subsequently, as shown in FIG. 4C, the solid-state image pickup element (chip) 4 is mounted on one surface of the through opening 1C of the resin structure 1. Bumps 6 are formed on the connection electrodes of the solid-state image sensor 4, and are connected to one end of the terminal pattern 5 formed on the leg portion 1A of the resin structure by thermocompression bonding or a conductive adhesive. Then, resin sealing is performed so that the surface of the solid-state image sensor 4 is covered with the sealing resin 7.

Thereafter, as shown in FIG. 4D, the optical filter 3 is attached to the fixing plate 1Q using an adhesive resin. The fixing plate 1Q and the optical filter 3 may be attached at the same time by using the same adhesive resin.

Here, the optical filter 3 is a dielectric interference filter formed by vapor-depositing a dielectric thin film having a multilayer structure having a desired refractive index on the surface of a transparent substrate made of a plate glass material.

In the solid-state image pickup device thus formed, the resin structure is molded so as to have a deviation in the molecular bonding direction on or near the optical filter mounting surface 8 near the solid-state imaging element mounting surface 9. Since the optical filter 3 is attached through the fixing plate 1Q made of thermoplastic resin,
Since the fixing plate 1Q suppresses the thermal deformation of the resin structure, the reliability of the connection of the solid-state image sensor to the resin structure can be increased. Further, since the fixing plate 1Q can be formed of the same material as the structure, there is no difference in the coefficient of thermal expansion and it is possible to suppress the occurrence of strain.

This resin structure is obtained by injection molding, but since this polyphthalamide resin has a linear molecular bond structure, the coefficient of thermal expansion is small in the molecular bond direction and in the vertical direction. It has a large anisotropy.

Therefore, in the first embodiment, the square ring-shaped ceramic plate is used as shown in FIG. 2, but as shown in FIG. 3, the injection direction of the thermoplastic resin or the filler arranging direction is set. Two strip-shaped fixing plates 1Q that are parallel to each other and parallel to the mounting surface.
You may attach A, 1QB.

According to this structure, since the elongation in the direction of large elongation is suppressed and the deformation is greatly suppressed, the thermal deformation of the resin structure in the vicinity of the solid-state image sensor is suppressed and the solid-state image sensor is connected. The certainty can be increased.

Second Embodiment Next, a second embodiment of the present invention will be described with reference to FIG. This solid-state imaging device has a resin structure 1 made of a PPS resin, in which the molecular arrangement directions are 90
It is characterized in that a fixed plate 1Q made of different PPS resin is integrally molded in a state of being sandwiched. Here, the back surface of the optical filter 3 is integrally molded with the fixed plate 1Q sandwiched at a position where it comes into contact with the surface of the fixed plate 1Q sandwiched in the resin structure 1. Here, the molecular arrangement directions are changed on both surfaces of the fixing plate 1Q and the boundary surface between the resin structure 1 and the extension at these two boundary surfaces is suppressed.

This solid-state image pickup device, as shown in FIG.
A square ring-shaped fixing plate 1Q is integrally molded between the optical filter mounting surface and the solid-state image sensor mounting surface of the resin structure 1 made of a thermoplastic resin having a wiring portion so as to be parallel to these. Thus, the deformation of the solid-state image sensor mounting surface is suppressed.

Other parts are formed in the same manner as in the first embodiment. The same parts are designated by the same reference numerals.

Next, a method of manufacturing this solid-state image pickup device will be described. First, as shown in FIG. 6A, a rectangular ring-shaped fixing plate 1Q is mounted in a cavity of an injection molding die (not shown), and a fixing plate 1Q whose molecular alignment direction is made of PPS resin is formed. By setting the injection direction so as to differ by 90 degrees, injecting the PPS resin and curing it, the resin structure 1 made of the PPS resin integrally formed with the fixing plate is formed. And in a predetermined area of this resin structure,
The wiring portion including the terminal pattern 5 formed on the back surface side of the leg portion 1A is formed by a thin film process such as a plating process or a sputtering method.

Then, as shown in FIG. 6B, the fixing plate 1Q is enclosed to prevent deformation and a solid-state image is formed on one surface of the through opening of the resin structure 1 having the optical filter 3 mounted thereon. Mount the element (chip) 4. Bumps 6 are formed on the connection electrodes of the solid-state imaging device, and are connected to one end of the terminal pattern 5 formed on the leg portion 1A of the resin structure 1 by thermocompression bonding. Then, after this, the surface of the solid-state image sensor 4 is sealed with resin.

Subsequently, as shown in FIG. 6C, the optical filter 3 is attached to the filter mounting surface 8 of this resin structure using an adhesive resin.

Here, in the optical filter 3, as in the case of the first embodiment, a dielectric thin film having a multilayer structure having a desired refractive index is vapor-deposited on the surface of a transparent substrate made of a plate glass material. It is assumed that a dielectric interference filter is formed.

In the solid-state image pickup device thus formed, the PPS resin whose molecular array direction is different from this resin structure 1 by 90 degrees on the optical filter mounting surface near the solid-state image sensor mounting surface 9 of the resin structure. Since the solid-state image sensor is mounted in the state where the fixed plate 1Q is sealed, the fixed plate 1Q suppresses thermal deformation of the resin structure, and the reliability of connection of the solid-state image sensor can be increased. .

Further, according to this structure, in the resin molding process, the molecular arrangement direction is different from the resin structure body by 90 degrees.
Since the fixing plate 1Q made of PS resin is molded so as to be embedded, the fixing plate is extremely easily and reliably formed, and the mounting is easy. Further, since the fixing plate and the resin structure body are made of the same resin, there is no difference in the coefficient of thermal expansion at the interface,
There is no risk of peeling. In the injection molding process, the boundary surface with the fixing plate is in a fused state, and the adhesion is extremely good.

Desirably, the melting point of the resin forming the fixing plate is set to be slightly higher than the melting point of the resin forming the resin structure, whereby the fixing plate does not melt during injection molding. As a result, it is possible to reliably maintain a good shape of the fixing plate and thus the molecular arrangement direction, and it is possible to increase the strength at the boundary surface.

Third Embodiment Next, a third embodiment of the present invention will be described with reference to FIG. In the second embodiment described above, the fixing plate 1Q made of PPS resin having the molecular arrangement directions different by 90 degrees is a resin structure so that the back surface of the optical filter 3 comes into contact with the surface of the fixing plate 1Q. Although the one integrally molded in the state of being sealed in 1 is used, in this embodiment, as shown in FIG.
The fixing plate 1Q is completely sealed in the resin structure 1 as shown in FIG.

Other parts are formed in the same manner as in the second embodiment. The same parts are designated by the same reference numerals.

According to this structure, although the mold design becomes slightly complicated, the adhesion between the resin structure and the fixing plate is further improved, and a highly reliable mounting structure can be provided.

Fourth Embodiment Next, a fourth embodiment of the present invention will be described with reference to FIG. In the first to third embodiments, the fixing plates 1Q made of resin having different molecular arrangement directions are attached or integrally formed to form the boundary surface having different molecular arrangement directions. As shown in FIG. 2, at least 2 made of polyphthalamide resin divided and molded so as to have a deviation in the molecular bonding direction at the boundary surface Ba.
It is characterized in that it is composed of two divided structural bodies 1PA and 1PB, and is formed by bonding the divided structural bodies.

Other parts are formed similarly to the first to third embodiments. The same parts are designated by the same reference numerals.

Next, a method of manufacturing this solid-state image pickup device will be described. First, as shown in FIGS. 9A and 9B, a rectangular trapezoidal leg portion 1A and a body portion 1B formed on the leg portion 1A.
And a through opening portion 1C is formed at the boundary between the leg portion 1A and the body portion 1B, and an intermediate portion of the through opening portion 1C is divided into two parts, respectively. The resin structure 1 made of a polyphthalamide resin, which is composed of the first structure 1PA and the second structure 1PB, is formed by injection molding. The first structure 1PA and the second structure 1PB
Is a terminal formed on the back surface side of the leg 1A in such a manner that the molecular arrangement direction is different by 90 degrees on the bonding surface and in a predetermined region of the resin structure by a thin film process such as a plating process or a sputtering method. A wiring portion including the pattern 5 is formed.

Then, as shown in FIG. 9C, the first structure and the second structure are bonded together to form a resin structure 1 in which the molecular arrangement direction is different by 90 degrees at the interface. At this time, an adhesive may be used at the time of bonding, but after the interface is cleaned, only the vicinity of the interface may be heated and pressed under vacuum to be directly bonded.

Then, as shown in FIG. 9D, the solid-state image pickup element (chip) 4 is mounted on one surface of the through opening of the resin structure 1. Bumps 6 are formed on the connection electrodes of the solid-state image sensor 4, and are connected to one end of the terminal pattern formed on the leg portion 1A of the resin structure by thermocompression bonding. Then, resin sealing is performed so that the surface of the solid-state image sensor 4 is covered with the sealing resin 7.

Thereafter, as shown in FIG. 9 (e), the optical filter 3 is attached using an adhesive resin.

According to this structure, since the divided cavities are divided and formed so that there is a deviation in the molecular bonding direction at the boundary surface, and the halves are bonded together, a normal mold having half cavities is used. You don't need to adjust,
Although the number of steps is increased, the manufacturing process itself can be simplified. Further, the structure of the mold can be simplified and the manufacturing is easy.

Although the optical filter is used as the translucent member in the first to fourth embodiments, it is not limited to the optical filter, and a translucent sealing member, a lens or the like can be appropriately modified.

As the resin forming the resin structure, a thermoplastic resin such as polyphthalamide resin or PPS resin, or a thermosetting resin such as epoxy resin can be applied.

Further, in the first to fourth embodiments, the optical filter is used as the translucent member, but the transmissive sealing member, the lens and the like can be appropriately modified without being limited to the optical filter.

Further, the solid-state image pickup device of the present invention is not limited to the field of optical communication as a camera, and may be a CD or a DVD.
It can be applied to various optical devices such as a reading device such as a reading device, a reading device of a copying machine, a medical device or a doorphone.

[0082]

As described above, according to the present invention, a boundary surface having mutually different molecular bonding directions is provided at a position in the vicinity of the mounting surface of the solid-state imaging device and parallel to the mounting surface of the solid-state imaging device. Therefore, since the directions of elongation differ from each other at this boundary surface, the stresses cancel each other out, the expansion and contraction due to heat are reduced, and the deformation of the structure is suppressed during both mounting and use, and the optical filter The positional accuracy between the translucent member such as a solid-state image sensor and the solid-state image sensor can be maintained with high accuracy, the connection failure between the solid-state image sensor and the wiring portion of the structure can be reduced, and the reliability of the connection of the solid-state image sensor can be improved. It is possible to provide a highly reliable solid-state imaging device. In addition, the occurrence of connection failure such as peeling at the optical filter mounting portion is also reduced.
Furthermore, since the structures can be formed of the same material, there is no difference in the coefficient of thermal expansion, and the occurrence of strain can be suppressed.

Further, according to the present invention, the structure is divided and formed so that the boundary faces have a deviation in the direction of molecular bonding, and the structures are bonded together. It is only necessary to change the injection direction by using a mold with half the cavity, no adjustment is required, the number of steps increases, but the manufacturing process itself can be simplified. Can be provided.

Further, according to the present invention, when the thermoplastic resin is injection-molded by integral molding so as to have the boundary surfaces in which the molecular arrangement directions are different, only by changing the injection direction,
Forming the boundary surface by integral molding eliminates the need for pasting and facilitates manufacturing.

Further, according to the present invention, a fixing plate made of a thermoplastic resin molded so as to have a deviation in the molecular bonding direction is mounted in a mold for injection molding, and ordinary injection molding is performed. As a result, the fixing plate can be easily sealed, and deformation of the structure is suppressed at and near the sealing position, so that thermal deformation of the structure near the solid-state image sensor can be suppressed and connection of the solid-state image sensor can be suppressed. The certainty of can be improved. Moreover, since the fixing plate can be formed of the same material as the structure, there is no difference in the coefficient of thermal expansion, and the occurrence of strain can be suppressed.

[Brief description of drawings]

FIG. 1 is a sectional view showing a solid-state imaging device according to a first embodiment of the present invention.

FIG. 2 is a diagram showing a fixing plate used in the first embodiment of the present invention.

FIG. 3 is a diagram showing a modified example of a fixing plate used in the first embodiment of the present invention.

FIG. 4 is a diagram showing a mounting process of the solid-state imaging device according to the first embodiment of the present invention.

FIG. 5 is a sectional view showing a solid-state imaging device according to a second embodiment of the present invention.

FIG. 6 is a diagram showing a mounting process of the solid-state imaging device according to the second embodiment of the present invention.

FIG. 7 is a diagram showing a solid-state imaging device according to a third embodiment of the present invention.

FIG. 8 is a sectional view showing a solid-state imaging device according to a fourth embodiment of the present invention.

FIG. 9 is a diagram showing a mounting process of a solid-state imaging device according to a fourth embodiment of the present invention.

FIG. 10 is a perspective view showing a conventional solid-state imaging device.

FIG. 11 is a sectional view showing a conventional solid-state imaging device.

FIG. 12 is a main part explanatory view showing a conventional solid-state imaging device.

[Explanation of symbols]

1 resin structure 1Q fixed plate 1A leg 1B body 1C through opening 1QA First structure 1QB second structure 3 Optical filter 4 Solid-state image sensor 5 terminal pattern 6 bumps 7 Sealing resin 8 Optical filter mounting surface 9 Solid-state image sensor mounting surface

Claims (18)

[Claims] 1. A structure made of an insulating resin made of a thermoplastic resin and having a through opening, a wiring portion formed on a surface of the structure, a wiring portion connected to the wiring portion, and the through-hole. A solid-state image sensor mounted on the structure so as to close the opening; and a translucent member mounted on the structure so as to close the through opening at a predetermined distance from the solid-state image sensor. Comprising, the structure, in the vicinity of the solid-state imaging device mounting surface on which the solid-state imaging device is mounted and in a position parallel to the mounting surface of the solid-state imaging device, the molecular bonding direction or the filler arrangement direction is mutually A solid-state imaging device having different boundary surfaces. 2. The solid-state imaging device according to claim 1, wherein the boundary surface of the structure is formed so as to have a deviation of 45 degrees to 90 degrees in a molecular bonding direction or a filler arrangement direction. apparatus. 3. The boundary surface of the structure is formed by attaching a fixing plate made of a thermoplastic resin formed on the mounting surface of the translucent member so that the molecular bonding directions are different on the mounting surface. It is formed, The claim 1 or 2 characterized by the above-mentioned.
The solid-state imaging device according to. 4. The fixing plate is two plate-shaped members arranged in parallel to each other along a molecular arrangement direction or a filler arrangement direction of the thermoplastic resin. Solid-state imaging device. 5. The fixing plate is a ring-shaped plate-like member attached to the through opening.
The solid-state imaging device according to. 6. The solid-state imaging device according to claim 1, wherein the structure is integrally molded by injection molding a thermoplastic resin so as to have the boundary surface. 7. The structure comprises at least two divided structures made of a thermoplastic resin divided and molded so that a molecular bonding direction or a filler arrangement direction is different at the boundary surface, and the divided structures are bonded together. The solid-state imaging device according to claim 1 or 2, wherein the solid-state imaging device is formed by 8. The structure is integrally molded so as to enclose a fixing plate made of a thermoplastic resin, and a molecular bonding direction is different at a boundary surface with the fixing plate. Alternatively, the solid-state imaging device described in 2. 9. The structure has a leg portion formed with a wiring portion and a tubular body portion provided on the leg portion, and between the body portion and the leg portion. 9. The solid-state imaging device according to claim 1, wherein the solid-state imaging device has the through opening. 10. A through-opening, a solid-state image sensor mounting surface on which a solid-state image sensor can be mounted in the through-opening, and a transparent member that closes the through-hole at a predetermined distance from the solid-state image sensor mounting surface. A structure forming step of forming a structure having a translucent member mounting surface for mounting an optical member; a wiring part forming step of forming a wiring part in the structure; A solid-state image sensor mounting step of mounting a solid-state image sensor on the solid-state image sensor, and a translucent member mounting step of mounting the translucent member on the translucent member mounting surface, wherein the structure forming step is the solid-state imaging step. A structure forming step of forming a structure so as to have a boundary surface having a mutually different molecular bonding direction at a position near the device and parallel to the mounting surface of the solid-state imaging device. Manufacturing method of solid-state imaging device. 11. The method of manufacturing a solid-state imaging device according to claim 10, wherein the boundary surface of the structure is configured to have a deviation in a molecular bonding direction of 45 degrees to 90 degrees. 12. In the structure forming step, thermoplastic insulating resin is injected into a molding die from different directions with the boundary surface as a boundary, and the injection direction is shifted at the boundary surface. The process according to claim 1, which is a step of injection molding.
0. The method for manufacturing the solid-state imaging device according to 0 or 11. 13. The structure molding step includes a step of performing injection molding with a resin-made fixing plate, which is formed so as to have a different molecular arrangement direction, inserted into a molding die in advance. The method for manufacturing the solid-state imaging device according to claim 10. 14. A through-opening, a solid-state image sensor mounting surface on which a solid-state image sensor can be mounted in the through-opening, and the through-opening being closed at a predetermined distance from the solid-state image sensor mounting surface. A structure forming step of forming a resin structure made of an insulating resin, the structure forming step including a transparent member mounting surface for mounting the transparent member; and a wiring part forming step of forming a wiring part in the structure. A solid-state imaging device mounting step of mounting a solid-state imaging device on the solid-state imaging device mounting surface, and the translucent member on the translucent member mounting surface via a fixing plate made of a thermoplastic resin having different molecular arrangement directions. A method of manufacturing a solid-state imaging device, comprising: a step of mounting a translucent member to be mounted. 15. The method for manufacturing a solid-state imaging device according to claim 14, wherein the boundary surface of the structure is configured to have a deviation in the molecular bonding direction of 45 degrees to 90 degrees. 16. A through-opening, a solid-state image sensor mounting surface on which a solid-state image sensor can be mounted in the through-opening, and the through-opening is closed at a predetermined distance from the solid-state image sensor mounting surface. A transparent member mounting surface for mounting a transparent member, and a structure made of an insulating resin is provided in the vicinity of the solid-state image sensor mounting surface and parallel to the solid-state image sensor mounting surface. At least 2 made of thermoplastic resin divided and molded so that the boundary surface has a deviation in the direction of molecular bonding.
A divided structure molding step of molding as one divided structure; a wiring part forming step of forming a wiring part in the divided structure; a bonding step of bonding the divided structures to form a structure; Solid-state imaging including a solid-state imaging device mounting step of mounting a solid-state imaging element on an imaging element mounting surface, and a translucent member mounting step of mounting the translucent member on the translucent member mounting surface Device manufacturing method. 17. The method of manufacturing a solid-state image pickup device according to claim 16, wherein the boundary surface of the structure is configured to have a deviation in a molecular bonding direction of 45 degrees to 90 degrees. 18. In the structure forming step, a thermoplastic insulating resin is injected into a molding die from different directions with the boundary surface as a boundary, and the injection direction is shifted at the boundary surface. The process according to claim 1, which is a step of injection molding.
The method for manufacturing a solid-state imaging device according to 6 or 17.