JP2003163440A - Method of manufacturing circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a circuit board in which a high-accuracy circuit pattern is formed at least on one face by suppressing the deformation of a flexible film whose dimension is easy to change due to the influence of heat, humidity and an external force. <P>SOLUTION: In the method of manufacturing the circuit board, a reinforcing sheet and the flexible film are pasted via an organic substance layer capable of being stripped, the circuit pattern is formed on a face on which the flexible film is not pasted on the reinforcing sheet, and the flexible film is stripped. In the method of manufacturing the circuit board, the product A×B×C of a release force A (g/cm) used to strip the flexible film multiplied by an inverse number B (μm<SP>-1</SP>) of the thickness of the flexible film, and an inverse number C (mm<SP>2</SP>/kg) of Young's modulus of the flexible film is within a range of 4.3×10<SP>-6</SP>to 4.3×10<SP>-3</SP>. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a circuit board using a flexible film having a highly accurate circuit pattern and excellent in productivity.

[0002]

2. Description of the Related Art As the weight and size of electronic products are reduced, the patterning of printed circuit boards is required to be highly accurate. Among them, the flexible film substrate has a growing demand because it can be bent so that three-dimensional wiring is possible and it is suitable for downsizing of electronic products. TAB (Tape Automated Bonding) used for IC connection to a liquid crystal display panel
The g) technique can obtain the finest pattern as a resin substrate by processing a long polyimide film substrate having a relatively narrow width, but is approaching the limit with respect to the progress of miniaturization. For miniaturization, there are an index represented by a line width and a space width between lines and an index represented by a pattern position on a substrate. The latter index, so-called cumulative accuracy, is related to the alignment between the electrode pad and the circuit board pattern when connecting the circuit board and an electronic component such as an IC, and the accuracy required as the number of pins in the IC increases. It has become to.

[0003]

In terms of the accumulative accuracy, it is becoming difficult to improve the film substrate processing, in particular. The circuit board processing process includes a heat treatment process such as drying and curing, and a wet process such as etching and development, and the flexible film repeats expansion and contraction. The hysteresis at this time causes the displacement of the circuit pattern on the substrate. Further, when there are a plurality of processes that require alignment, if there is expansion or contraction between these processes, misalignment occurs between the formed patterns. The deformation caused by the expansion and contraction of the flexible film has a greater effect in the case of an FPC (flexible printed circuit board) in which processing is performed with a relatively large area substrate size. Further, the positional displacement is also caused by an external force such as pulling or twisting, and special attention is required when using a thin substrate to increase flexibility.

An object of the present invention is to solve the above problems and to provide a method of manufacturing a highly accurate flexible film circuit board having circuit patterns on both sides.

[0005]

In order to achieve the above object of the present invention, the present invention has the following constitution.

(1) A reinforcing plate and a flexible film are attached to each other via an organic layer which can be peeled off, and then a circuit pattern is formed on the surface of the flexible film which is not attached to the reinforcing plate. From the above, a method of manufacturing a circuit board for peeling a flexible film, comprising: a peeling force A (g / cm) when peeling the flexible film and a reciprocal number B (μm ⁻¹ of the thickness of the flexible film). ) And the reciprocal C of Young's modulus of the flexible film
The product A × B × C with (mm ² / kg) is 4.3 × 10 ⁻⁶
A method of manufacturing a circuit board, wherein the range is 4.3 × 10 ⁻³ or less.

(2) After forming a circuit pattern on one surface of the flexible film, the reinforcing plate and the circuit pattern forming surface of the flexible film are bonded together via a peelable organic material layer, and then the flexible film is bonded. A method of manufacturing a circuit board in which a circuit pattern is formed on the other surface of a flexible film and then the flexible film is peeled off. A peeling force A (g / cm) when peeling the flexible film And the reciprocal B (μm ⁻¹ ) of the thickness of the flexible film and the reciprocal C of the Young's modulus of the flexible film.
The product A × B × C with (mm ² / kg) is 4.3 × 10 ⁻⁶
A method of manufacturing a circuit board, wherein the range is 4.3 × 10 ⁻³ or less.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION In the present invention, the flexible film is a plastic film, and it is important that it has heat resistance enough to withstand a thermal process in a circuit pattern manufacturing process and electronic component mounting, Films such as polycarbonate, polyether sulfide, polyethylene terephthalate, polyethylene naphthalate, polyphenylene sulfide, polyimide, polyamide and liquid crystal polymer can be adopted. Among them, the polyimide film is preferably used because it has excellent heat resistance and chemical resistance. A liquid crystal polymer is preferably used because it has excellent electrical characteristics such as low dielectric loss. It is also possible to employ a flexible glass fiber reinforced resin plate. Examples of the resin for the glass fiber reinforced resin plate include polyphenylene sulfide, polyphenylene ether, maleimide, polyamide, and polyimide.

The thickness of the flexible film is preferably thin in order to reduce the weight and size of electronic equipment or to form fine via holes, while maintaining the flatness in order to secure mechanical strength. In order to be thick, it is preferable that
The range of 7.5 μm to 125 μm is preferable.

The metal layer for forming the circuit pattern is
It can be formed by adhering a metal foil such as a copper foil with an adhesive layer, or can be formed by sputtering, plating, or a combination thereof. A flexible film with a metal layer can also be obtained by applying a raw material resin for a flexible film or a precursor thereof onto a metal foil such as copper, followed by drying and curing.

The substrate used as the reinforcing plate in the present invention is a substrate made of inorganic glass such as soda lime glass, borosilicate glass, and quartz glass, a metal such as stainless steel, Invar alloy, titanium, or a glass fiber reinforced resin plate. Can be adopted. Both are preferable in that the linear expansion coefficient and the hygroscopic expansion coefficient are small, but the heat resistance in the circuit pattern manufacturing process, the excellent chemical resistance, and the large surface area and high surface smoothness of the substrate are easily available at low cost. A substrate made of an inorganic glass is preferable because it is less likely to undergo plastic deformation. Above all, borosilicate glass represented by aluminoborosilicate glass is particularly preferable because it has a high elastic modulus and a small thermal expansion coefficient. Further, when the peelable organic material layer is of a type in which the adhesive force and the adhesive force are reduced by ultraviolet irradiation,
It is preferably a substrate that transmits ultraviolet rays. In particular, although a specific example will be described later, when a reinforcing plate is attached to both sides of the film during the process, and when only one reinforcing plate is desired to be peeled off, the peelable organic material layer has an adhesive force and an adhesive force by ultraviolet irradiation. It is preferable that the reinforcing plate is a type that reduces the number of rays and the reinforcing plate is a substrate that transmits ultraviolet rays.

When a metal or glass fiber reinforced resin is used for the reinforcing plate, a long continuous body can be manufactured, but the method of manufacturing the circuit board of the present invention is a single-wafer type because it is easy to secure positional accuracy. It is preferable to carry out. The sheet is not a long continuous body but a state of being handled as individual sheets.

The glass substrate used for the reinforcing plate has a small Young's modulus or a small thickness, and the warping and twisting of the flexible film increases due to the expansion and contraction force of the flexible film. The board may crack. In addition, the vacuum adsorption / desorption deforms the flexible film, which tends to make it difficult to secure positional accuracy. On the other hand, when the glass substrate is thick, the flatness may be deteriorated due to the uneven thickness and the exposure accuracy tends to be deteriorated. In addition, the load increases during handling by a robot or the like, which makes quick handling difficult, which causes a decrease in productivity, and also tends to increase transportation costs. From this point, the Young's modulus (kg /
The product of the cube of mm ² ) and the thickness (mm) is 850 kg · m
The range is preferably m or more and 860000 kg · mm or less, and 1500 kg · mm or more and 190000 kg ·
It is more preferable that the range is less than or equal to mm
The most preferable range is from kg · mm to 110000 kg · mm. The Young's modulus of the glass substrate is JIS R
The value is obtained by 1602.

When a metal substrate is used as the reinforcing plate, if the Young's modulus of the metal substrate is small or the metal substrate is thin, warping or twisting is increased due to the expansion / contraction force of the flexible film, and vacuum adsorption onto a flat stage is possible. It disappears, the warp and twist of the metal substrate, the flexible film deforms,
It becomes difficult to maintain the position accuracy. Also, if there is a break, it becomes a defective product at that time. On the other hand, if the metal substrate is thick, the flatness may be deteriorated due to the uneven thickness, and the exposure accuracy may be deteriorated. In addition, the load is increased during handling by a robot or the like, which makes it difficult to handle it quickly, which reduces productivity, and also increases transport costs. From this point, the Young's modulus (kg / mm
² ) The product of the cube of thickness (mm) is 2kg · mm or more 1
It is preferably in the range of 62560 kg · mm or less, more preferably in the range of 10 kg · mm or more and 30,000 kg · mm or less, and 15 kg · mm or more 2
Most preferably, the range is 0500 kg · mm or less.

The releasable organic material layer used in the present invention is composed of an adhesive or a pressure-sensitive adhesive. After the flexible film is attached to the reinforcing plate via the organic material layer and processed,
There is no particular limitation as long as the flexible film can be peeled off. Examples of such adhesives or pressure-sensitive adhesives include pressure-sensitive adhesives called acrylic or urethane-based removable pressure-sensitive adhesives. Further, a cross-linking type in which a main agent of an adhesive or a pressure-sensitive adhesive and a curing agent are mixed is preferable because the molecule can be easily designed and the solvent resistance is excellent. It has a sufficient adhesive force during the processing of the flexible film, can be easily peeled off at the time of peeling, and does not cause distortion in the flexible film substrate, and thus the adhesive force in the region called weak adhesion is preferable. The silicone resin film may be used as a release agent, but one having tackiness can be used as the peelable organic material layer in the present invention. In addition, it is also possible to use an epoxy resin film having tackiness as the peelable organic material layer.

In the present invention, the peeling force is a 180 ° peel strength when peeling a 1 cm wide flexible film bonded to a reinforcing plate via an organic material layer. Also,
Peeling speed when measuring peeling force is 300 mm / min
And The peeling force measuring device is not particularly limited, and a tensilon generally used for measuring strength and elongation can be preferably used.

In order to control the adhesive force of the adhesive or the pressure-sensitive adhesive to a region called weak adhesion, one or both of the main component of the adhesive or the pressure-sensitive adhesive and the curing agent are made to have a high molecular weight so that the flow after cross-linking can be improved. Therefore, it is possible to control the anchoring property of the adhesive or the pressure-sensitive adhesive to the flexible film. On the other hand, in order to improve the heat resistance of the adhesive or pressure-sensitive adhesive, it is preferable that one or both of the main component of the adhesive or pressure-sensitive adhesive and the curing agent have a high molecular weight. Further, in order to control the adhesive strength of the adhesive or the pressure-sensitive adhesive to a region called weak adhesion, the number of functional groups introduced into the molecular chain of the main agent of the adhesive or the pressure-sensitive adhesive is increased to increase the cross-linking site with the curing agent. This is also effective, and it is preferable that the peeling force can be adjusted by changing the mixing ratio of the main agent and the curing agent. In addition, in order to control the adhesive strength of the adhesive or pressure sensitive adhesive to a region called weak adhesion, as a method of controlling the anchoring property of the adhesive or pressure sensitive adhesive to the flexible film, the thickness of the adhesive or pressure sensitive adhesive is adjusted. It is effective because it can be optimized easily.

From this point, the thickness of the organic layer is preferably in the range of 1 μm to 30 μm. If it is too thin, the flatness becomes poor, and if it is too thick, the adhesive property of the adhesive or pressure-sensitive adhesive to the flexible film is improved, so that the adhesive strength becomes too strong.

When the flexible film is peeled from the organic layer,
If the peel force is too low, it will be flexible during circuit pattern formation.
The film peels from the organic material layer. On the other hand, flexible film
If the peeling force when peeling the film from the organic layer is too high,
The flexible film deforms and curls. Also flexible
As the film becomes thinner, the flexibility after peeling
The film is easily deformed and curled. Furthermore, it is flexible
As the Young's modulus of the film becomes smaller,
The flexible film is easy to deform and curl. This point
In the present invention, when peeling the flexible film
Of peeling force A (g / cm) and thickness of flexible film
Number B (μm^-1) And the reciprocal C of Young's modulus of the flexible film
(Mm²/ Kg) and the product A × B × C is expressed numerically
When 4.3 × 10^-6Above 4.3 × 10^-3The following range
8.6 × 10 ^-68.6 x 10 or more
^-FourThe following range is preferable, and 2.15 × 10^-Five
5.16 x 10 or more^-FourThe following range is more preferable
Good A × B × C is 4.3 × 10^-6Less than organic
Onto a flexible film laminated with a reinforcing plate through the product layer
During the circuit pattern formation, the flexible film is separated from the organic layer.
For peeling, a highly accurate circuit pattern is formed on the flexible film.
Can not be formed.

When it exceeds 4.3 × 10 ^-3 , a highly accurate circuit pattern can be formed on a flexible film laminated with a reinforcing plate through an organic material layer. The flexible film is deformed when peeled from
The accuracy of the formed circuit pattern decreases.

The peeling interface may be either the interface between the reinforcing plate and the organic material layer or the interface between the organic material layer and the flexible film, but since the step of removing the organic material layer from the flexible film can be omitted, the organic material layer can be omitted. It is more preferable to peel at the interface between the film and the flexible film.

In addition, those having reduced adhesive strength and adhesive strength in the low temperature region, those having decreased adhesive strength and adhesive strength by irradiation of ultraviolet rays, and those having decreased adhesive strength and adhesive strength by heat treatment are also preferably used. Among these, ultraviolet irradiation is preferable because of large changes in adhesive strength and adhesive strength. As an example of the adhesive whose adhesive strength and adhesive strength are reduced by irradiation with ultraviolet rays, a two-liquid cross-linking acrylic adhesive can be mentioned. Further, as an example of the adhesive whose adhesive strength and adhesive strength are reduced in a low temperature region, there is an acrylic adhesive which reversibly changes between a crystalline state and an amorphous state.

According to the first manufacturing method of the present invention, the reinforcing plate and the flexible film are bonded to each other via the peelable organic material layer, and then the flexible film is not bonded to the reinforcing plate. The flexible film is peeled off after the circuit pattern is formed on the surface. In the second manufacturing method, the flexible film is further attached prior to the attachment with the reinforcing plate. It is necessary that a circuit pattern is formed on one of the surfaces. In this case, it is preferable to form the alignment mark with the circuit pattern formed on the other surface at the same time when the pattern is formed. It is very effective to provide an alignment mark for alignment in order to utilize the high definition of the high definition pattern formed on the surface opposite to the bonding surface. You can read the alignment mark through a transparent reinforcing plate,
Although it may be read through the flexible film, when a metal layer is formed on the side opposite to the laminating surface of the flexible film, the reading can be performed regardless of the pattern of the metal layer, so that the reading from the reinforcing plate side is possible. Read is preferred. This alignment mark can also be used for alignment when the flexible film is attached to the reinforcing plate. The shape of the alignment mark is not particularly limited, and a shape generally used in an exposure device or the like can be preferably adopted.

The circuit pattern formed on the surface of the flexible film opposite to the surface to which the flexible film is attached after being attached to the reinforcing plate can prevent the flexible film from being deformed by the reinforcing plate and the metal layer during processing. Therefore, a highly accurate pattern can be formed. On the other hand, before attaching to the reinforcing plate,
Or, the pattern formed on the surface to be attached to the reinforcing plate after being peeled off from the reinforcing plate mainly serves as the input / output terminals for the printed wiring board and the surrounding wiring, and the power supply and ground potential wiring. Therefore, there is a case where the high definition as high as that of the pattern formed on the surface opposite to the surface attached to the reinforcing plate is not required. According to the present invention, it is possible to easily provide a double-sided wiring circuit board in which a particularly fine pattern is formed on one surface as described above. The advantage of being double-sided wiring is that LSI can be operated at high speed by allowing wiring to intersect through through holes, increasing the degree of freedom in wiring design, and by propagating the ground potential to the vicinity of the required location with thick wiring. Noise can be reduced. Similarly, by propagating the power supply potential to the vicinity of the required place with a thick wiring, the potential drop is prevented even at high speed switching, the operation of the LSI is stabilized, and external noise is shielded as an electromagnetic wave shield. This is very important as the speed of the LSI increases and the number of pins increases due to the multi-functionalization.

In addition, even in the processing of the surface on which the circuit pattern is first formed, since it is attached to the glass substrate, a high-definition pattern can be formed on both surfaces.

An example of the method of manufacturing the circuit board of the present invention will be described below, but the present invention is not limited to this.

A weakly tacky re-release agent is applied to a 0.7 mm thick aluminoborosilicate glass by a spin coater, a blade coater, a roll coater, a bar coater, a die coater, screen printing or the like. It is preferable to use a die coater to uniformly coat a single-wafer substrate that is intermittently sent. After the re-release agent is applied, it is dried by heating or vacuum drying to obtain a re-release agent layer having a thickness of 20 μm. An air barrier film consisting of a release film having a silicone resin layer provided on a polyester film is attached to the applied re-release agent layer and aged for 1 week. Instead of attaching the air barrier film, it can be stored in a nitrogen atmosphere or in a vacuum. It is also possible to apply the weakly adhesive re-release agent to a long film substrate, dry it, and transfer it to a single-wafer substrate.

Next, the air barrier film is peeled off and a polyimide film is attached. The thickness of the polyimide film is preferably 7.5 μm to 125 μm. As described above, a metal layer may be previously formed on one side or both sides of the polyimide film. It is preferable to provide a metal layer on the side of the polyimide film on which the reinforcing plate is attached because it can be used as a ground layer for shielding electromagnetic waves. The polyimide film may be formed into a cut sheet having a predetermined size in advance and attached, or may be attached and cut while being unwound from a long roll. A roll type laminator or a vacuum laminator can be used for such a pasting operation.

When a metal layer is not previously provided on the bonding surface of the polyimide film, the metal layer can be formed by a full additive method or a semi-additive method.

The full additive method is the following process. The surface on which the metal layer is formed is treated with a catalyst such as palladium, nickel or chromium, and dried. The catalyst here does not act as a nucleus for plating growth as it is, but becomes a nucleus for plating growth by performing activation treatment. Next, the photoresist is applied by a spin coater, a blade coater, a roll coater, a bar coater, a die coater, screen printing or the like and dried. The photoresist is exposed and developed through a photomask having a predetermined pattern to form a resist layer on a portion where the plating film is unnecessary. Then, after activating the catalyst, the polyimide film is dipped in an electroless plating solution composed of a combination of copper sulfate and formaldehyde to have a thickness of 2 μm.
A circuit pattern is obtained by forming a copper plating film of m to 20 μm.

The semi-additive method is the following process. On the surface on which the metal layer is formed, chromium, nickel, copper or an alloy thereof is sputtered to form a base layer. The thickness of the underlayer is in the range of 1 nm to 1000 nm. A copper sputtered film having a thickness of 50 nm is further formed on the underlayer.
To 3000 nm is effective for ensuring sufficient conduction for the subsequent electrolytic plating, improving the adhesive force of the metal layer, and preventing pinhole defects. Prior to forming the underlayer, in order to improve the adhesive strength on the surface of the polyimide film,
Plasma treatment, reverse sputtering treatment, primer layer coating, and adhesive layer coating are appropriately permitted. Of these, epoxy resin-based, acrylic resin-based, polyamide resin-based, polyimide resin-based, and NBR-based adhesive layer coatings are preferable because they have a large effect of improving the adhesive strength. These treatments and coatings may be performed before the glass substrate is attached or after the glass substrate is attached. It is preferable to perform continuous roll-to-roll treatment on a long polyimide film before sticking the glass substrate, because productivity can be improved. A photoresist is applied to the underlayer thus formed by a spin coater, a blade coater, a roll coater, a die coater, screen printing or the like and dried. The photoresist is exposed and developed through a photomask having a predetermined pattern to form a resist layer on a portion where the plating film is unnecessary. Next, electrolytic plating is performed using the base layer as an electrode. As the electrolytic plating solution, a copper sulfate plating solution, a copper cyanide plating solution, a copper pyrophosphate plating solution, or the like is used.
After forming a copper plating film with a thickness of 2 μm to 20 μm, further plating with gold, nickel, tin, etc. is performed if necessary, the photoresist is peeled off, and then the underlying layer is removed by slight etching to remove the circuit pattern. To get

After peeling off the air barrier film on the glass substrate and bonding the polyimide film to the glass substrate with the surface on which the circuit pattern is formed as the bonding surface, the above-mentioned semi-additive method, full-additive method,
Alternatively, a high-definition circuit pattern is formed on the surface opposite to the bonding surface by the subtractive method.

The subtractive method is a method of forming a circuit pattern by using a photoresist and an etching solution when a solid metal layer is formed on a polyimide film, and the manufacturing process is short and the cost is low. Is the way.

In order to obtain a particularly fine circuit pattern, it is preferable to employ the semi-additive method or the full-additive method.

Further, the polyimide film may be provided with a connection hole. That is, it is possible to provide a via hole for electrical connection with the metal layer provided on the bonding surface side with the glass substrate, or to provide a hole for ball installation in the ball grinder array. As the method of providing the connection hole, laser hole formation such as carbon dioxide gas laser, YAG laser, excimer laser, or chemical etching can be adopted. When laser etching is adopted, it is preferable that the etching stopper layer has a metal layer on the glass substrate attachment surface side of the polyimide film.

As the chemical etching liquid for the polyimide film, hydrazine, potassium hydroxide aqueous solution or the like can be adopted. A patterned photoresist or a metal layer can be used as the chemical etching mask. In the case of making electrical connection, it is preferable that after forming the connection hole, the inner surface of the hole is made conductive by a plating method at the same time when the metal layer pattern is formed. The diameter of the connection hole for electrical connection is preferably 15 μm to 200 μm. The hole for ball installation has a diameter of 80 μm to 800 μm.
m is preferred.

Particularly, it is preferable to form the connection hole from the surface opposite to the surface of the flexible film bonded to the glass substrate.

Next, the polyimide film having the circuit pattern formed thereon is peeled off from the glass substrate. The polyimide film with the circuit pattern is cut into individual pieces or an assembly of individual pieces before peeling by using a laser, a high-pressure water jet, a cutter, or the like so that the electronic component mounting device for the circuit pattern can be easily handled. It is preferable. Further, in order to maintain the positional accuracy of the connection with the electronic component, it is more preferable to peel the film from the glass substrate after connecting the electronic component to the circuit pattern on the polyimide film. As a method of connecting with an electronic component, solder connection, anisotropic conductive film connection, metal eutectic connection, non-conductive adhesive connection, wire bonding connection, or the like can be adopted.

In the above-mentioned example, a metal layer is provided on the surface of the polyimide film to be attached, and a circuit pattern is first formed on one surface of the flexible film which is not fixed, and then the flexible film is attached to a glass substrate. Although the circuit pattern on the other surface was formed after it was attached to the surface of the flexible film, if a particularly high-definition circuit pattern is formed on both surfaces of the flexible film, the glass is also used when processing the surface on which the circuit pattern is first formed. It is preferably attached to the substrate. In this case, first, the surface to be processed later is attached to a glass substrate to form a circuit pattern by the subtractive method, semi-additive method or full-additive method, and then the circuit forming surface side is attached to another glass substrate. After the matching, the first glass substrate is peeled off, a circuit pattern is formed on the other surface by a subtractive method, a semi-additive method or a full additive method, and then the glass substrate is peeled off. The peeling force when peeling the flexible film from the organic layer is
It is preferably 0.4 g / cm to 300 g / cm.

In the process of peeling off the glass substrate on only one side from the state where the glass substrates are adhered on both sides of the flexible film, the peelable organic material layer reduces the adhesive force and the adhesive force by ultraviolet irradiation. It is preferred that the flexible film is of a type and has a function of blocking ultraviolet rays or has a solid metal layer on the flexible film, and that this metal layer blocks ultraviolet rays.

The circuit board obtained by the manufacturing method of the present invention is preferably used as a wiring board for electronic equipment, an interposer for IC packages, and the like. It is appropriately permitted to insert a resistance element or a capacitance element in the circuit pattern.

[0042]

The present invention will be described in more detail below with reference to examples, but the present invention is not limited thereto. The Young's modulus in the present invention is JIS R16.
The value obtained by 02.

<Peeling Force Measuring Method> The peeling force of the polyimide film was measured by the following method. After the polyimide film was stuck on the re-release agent layer formed on the reinforcing plate, the polyimide film was cut into a width of 10 mm. T
The peeling force was defined as the force when peeling a 10 mm wide polyimide film in the 180 ° direction at a peeling speed of 300 mm / min using MI Tensilon.

Example 1 An adhesive for improving the metal layer adhesive strength was prepared as follows. The inside of the flask was replaced with a nitrogen atmosphere, 228 parts by weight of N, N-dimethylacetamide was added, and 1,1,3,
19.88 parts by weight of 3-tetramethyl-1,3-bis (3-aminopropyl) disiloxane was dissolved. Next, 25.76 parts by weight of 3,3 ′, 4,4′-benzophenone tetracarboxylic acid dianhydride was added, and the mixture was stirred under a nitrogen atmosphere at 10 ° C. for 1 hour. Subsequently, the mixture was reacted at 50 ° C. for 3 hours while stirring to obtain an adhesive composed of a polyimide precursor varnish.

Young's modulus of 930 using a comma coater
Long polyimide film of kg / mm ² , thickness of 25 μm and width of 300 mm (“Upilex” Ube Industries, Ltd.)
The adhesive was continuously applied to one side of the product. Then 8
10 minutes at 0 ℃, 10 minutes at 130 ℃, 15 at 150 ℃
It was dried for 1 minute and cured at 250 ° C. for 5 minutes. The film thickness of the adhesive layer after curing was 1 μm. Five polyimide films with different lots were prepared.

Aluminoborosilicate glass having a thickness of 0.7 mm and 300 mm square was dye-coated by a die coater and was used as an acrylic weak adhesive re-release agent "Olivine" EXK01-257 (manufactured by Toyo Ink Co., Ltd.) and a curing agent BXX5134 ( Apply a mixture of Toyo Ink Co., Ltd. at 100: 9 and apply 1
It was dried at 00 ° C. for 30 seconds. The thickness of the removable agent after drying is 1
It was 5 μm. Then, an air-blocking film made of a film having a silicone resin layer on the polyester film which facilitates release is attached to the re-release agent layer (aluminoborosilicate glass / re-release agent layer / silicone resin layer / polyester film). It's been a week.

While peeling off the air barrier film consisting of the polyester film and the silicone resin layer, a polyimide film was stuck on the side of the glass substrate on which the removable agent layer was formed by a roll laminator.

A chromium-nickel alloy film having a thickness of 50 nm and a copper film having a thickness of 100 nm were laminated in this order on the adhesive layer provided on the surface opposite to the bonding surface in this order. A positive photoresist was applied on the copper film with a spin coater and dried at 80 ° C. for 10 minutes. The photoresist was exposed through a photomask. The photoresist was developed to form a resist layer having a thickness of 10 μm on the portion where the plating film was unnecessary. The test photomask pattern was a grid pattern having a line width of 10 μm and a pitch of 500 μm. After development, it was post-baked at 120 ° C. for 10 minutes. Next, electrolytic plating was performed using the copper film as an electrode. The electrolytic plating solution was a copper sulfate plating solution. Thickness 6μ
After forming the copper-plated film of m, the photoresist is removed with a photoresist remover, and then the metal film and the chromium-nickel alloy film under the resist layer are removed by soft etching with an aqueous iron chloride solution. A grid pattern was obtained.

Peeling force of the polyimide film and peeling force A (g / cm) when peeling the polyimide film
And the reciprocal B of the thickness of the polyimide film (μm ⁻¹ ),
Reciprocal number of Young's modulus of polyimide film C (mm ² / k
The product A x B x C (hereinafter, A x B x C represents these products; the same applies to Table 1) with g) is shown in Table 1.
The polyimide film was not peeled from the organic layer during the circuit pattern formation. Further, the polyimide film did not peel off and curl at the interface with the organic layer.

Length measuring machine SNIC-800 (Sokia Corporation)
Manufactured), the position of the intersection of the grid-shaped metal patterns was measured as the intersection of the center lines of the intersecting metal film lines. Two points that were originally about 283 mm apart in the diagonal direction (200 m in the x direction)
When a distance of 200 mm in the m and y directions) was measured, all five polyimide films of different lots were within ± 5 μm with respect to the photomask pattern, which was very good.

Example 2 An adhesive composed of a polyimide precursor varnish was obtained in the same manner as in Example 1.

Using a comma coater as in Example 1, Young's modulus 930 kg / mm ² , thickness 25 μm, width 3
The adhesive was continuously applied to a 00 mm long polyimide film ("UPILEX" manufactured by Ube Industries, Ltd.). Then, at 80 ° C for 10 minutes, 130 ° C for 10 minutes,
It was dried at 150 ° C. for 15 minutes and cured at 250 ° C. for 5 minutes. The film thickness of the adhesive layer after curing was 1 μm. Five polyimide films with different lots were prepared.

Then, a chromium-nickel alloy film having a thickness of 50 nm and a copper film having a thickness of 100 nm were laminated in this order on the adhesive layer of the polyimide film by the sputtering method. The alloy film was provided on the side of the surface of the polyimide film which is to be attached to the reinforcing plate. Using the alloy film as an electrode, electrolytic plating was performed in a copper sulfate solution to form a copper plating film having a thickness of 5 μm.

The polyimide film having the copper plating film formed thereon is cut into a sheet shape, a dry film is laminated on the copper plating film, and the dry film resist is exposed and developed through a photomask having a predetermined pattern. , A dry film resist pattern was formed. Immerse the polyimide film on which the dry film resist pattern is formed in the copper chloride etching solution to pattern the copper film and at the same time pattern the chromium-nickel alloy film under the copper film to form the wiring circuit and alignment mark. did. Next, the dry film resist was stripped with a stripping agent.

Aluminoborosilicate glass having a thickness of 0.7 mm and 300 mm square was dye-coated by a die coater with an acrylic weak adhesive removability agent "Olivine" EXK01-257 (manufactured by Toyo Ink Co., Ltd.) and a curing agent BXX5134 ( Apply a mixture of Toyo Ink Co., Ltd. at 100: 9 and apply 1
It was dried at 00 ° C. for 30 seconds. The thickness of the removable agent after drying is 1
It was 5 μm. Then, an air barrier film consisting of a film having a silicone resin layer on the polyester film for easy release is attached to the removable layer (aluminoborosilicate glass / removable agent layer / silicone resin layer / polyester film). It's been a week.

A polyimide film having a circuit pattern formed by a roll laminator on the side of the glass substrate on which the re-release agent layer is formed while peeling off the air barrier film made of the polyester film and the silicone resin layer from the glass substrate. Was attached so that the surface on which the circuit pattern was formed faces the glass substrate.

Next, carbon dioxide laser was used to form connection holes having a diameter of 100 μm arranged in a grid pattern at a pitch of 10 mm. The connection hole reaches the wiring circuit on the attachment surface side.

A chromium-nickel alloy film having a thickness of 50 nm and a copper film having a thickness of 100 nm were stacked in this order on the adhesive layer provided on the surface opposite to the bonding surface in this order. A positive photoresist was applied on the copper film with a spin coater and dried at 80 ° C. for 10 minutes. The photoresist was exposed through a photomask in alignment with the circuit pattern on the bonding surface using the alignment mark formed on the bonding surface side with the glass. The photoresist was developed to form a resist layer having a thickness of 10 μm on the portion where the plating film was unnecessary. The test photomask pattern was a black-and-white inverted pattern in which a grid pattern having a line width of 10 μm and a pitch of 500 μm and a circle having a diameter of 300 μm repeatedly arranged in a portion perforated with a laser having a pitch of 10 mm. That is, a grid-shaped plating pattern and a circular pattern with a pitch of 10 mm can be obtained. After development, it was post-baked at 120 ° C. for 10 minutes. Next, electrolytic plating was performed using the copper film as an electrode. The electrolytic plating solution was a copper sulfate plating solution. After forming a copper plating film having a thickness of 6 μm, the photoresist is stripped with a photoresist stripping solution, and then the metal film and the chromium-nickel alloy film under the resist layer are removed by soft etching with an aqueous iron chloride solution. To obtain a grid pattern.

Peeling force and A × B of polyimide film
× C is shown in Table 1. The polyimide film was not peeled from the organic layer during the circuit pattern formation. Further, the polyimide film did not peel off and curl at the interface with the organic layer.

Length measuring machine SNIC-800 (Sokia Corporation)
Manufactured), the position of the intersection of the grid-shaped metal patterns was measured as the intersection of the center lines of the intersecting metal film lines. Two points that were originally about 283 mm apart in the diagonal direction (200 m in the x direction)
When a distance of 200 mm in the m and y directions) was measured, all five polyimide films of different lots were within ± 5 μm with respect to the photomask pattern, which was very good.

Example 3 Aluminoborosilicate glass having a thickness of 0.7 mm and 300 mm square was cured with a die coater using an acrylic weakly adhesive removable agent "Olivine" BPS5227-1 (manufactured by Toyo Ink Co., Ltd.). Agent BXX5134 (Toyo Ink Co., Ltd.)
A polyimide having a metal film pattern formed in the same manner as in Example 1 except that a mixture of 100: 5) was applied, dried at 100 ° C. for 30 seconds, and the thickness of the removable agent after drying was 15 μm. The film was vacuum-adsorbed and gradually peeled from the reinforcing plate from the end. The peeling force and A × B × C of the polyimide film are shown in Table 1. The polyimide film was not peeled from the organic layer during the circuit pattern formation. Further, the polyimide film did not peel off and curl at the interface with the organic layer.

Length measuring machine SNIC-800 (Sokia Corporation)
Manufactured), the position of the intersection of the grid-shaped metal patterns was measured as the intersection of the center lines of the intersecting metal film lines. Two points that were originally about 283 mm apart in the diagonal direction (200 m in the x direction)
When a distance of 200 mm in the m and y directions) was measured, all 5 polyimide films of different lots were within ± 10 μm with respect to the photomask pattern, which was very good.

Example 4 A 0.7 mm thick, 300 mm square aluminoborosilicate glass was cured with a die coater using an acrylic weakly adhesive removable agent "Olivine" BPS5227-1 (manufactured by Toyo Ink Co., Ltd.). Agent BXX5134 (Toyo Ink Co., Ltd.)
A polyimide film having a metal pattern formed thereon in the same manner as in Example 2 except that a mixture of 100: 2 of the above) was applied, dried at 100 ° C. for 30 seconds, and the thickness of the removable agent after drying was 15 μm. Was vacuum-adsorbed and gradually separated from the reinforcing plate from the end. The peeling force and A × B × C of the polyimide film are shown in Table 1. It was 2.58 × 10 ^-3 . The polyimide film was not peeled from the organic layer during the circuit pattern formation. The polyimide film was slightly curled, but peeled off at the interface with the organic layer.

Length measuring machine SNIC-800 (Sokia Corporation)
Manufactured), the position of the intersection of the grid-shaped metal patterns was measured as the intersection of the center lines of the intersecting metal film lines. Two points that were originally about 283 mm apart in the diagonal direction (200 m in the x direction)
When a distance of 200 mm in the m and y directions) was measured, some of the photomask patterns were distorted by 26 μm toward the outside of the substrate. Although the level was a problem in comparatively fine processing with a copper-plated wiring pitch of 120 μm or less, it was very good as compared with the comparative example.

Example 5 Acrylic adhesive "SKDyne" SW-11A (Soken Chemical Co., Ltd.) whose adhesive strength is reduced by curing by ultraviolet irradiation
50%) and a curing agent L45 (manufactured by Soken Chemical Industry Co., Ltd.) in a ratio of 50: 1 are applied to a glass substrate and dried at 80 ° C. for 2 minutes to give a pressure-sensitive adhesive thickness after drying of 20 μm and reinforcement. Before peeling from the plate, 100% UV light from the glass substrate side
A polyimide film having a metal pattern formed thereon was vacuum-adsorbed in the same manner as in Example 2 except that irradiation with 0 mJ / cm 2 was performed, and the polyimide film was gradually peeled from the end portion from the end. The peeling force and A × B × C of the polyimide film are shown in Table 1. The polyimide film was not peeled from the organic layer during the circuit pattern formation. Further, the polyimide film did not peel off and curl at the interface with the organic layer.

Length measuring machine SNIC-800 (Sokia Corporation)
Manufactured), the position of the intersection of the grid-shaped metal patterns was measured as the intersection of the center lines of the intersecting metal film lines. Two points that were originally about 283 mm apart in the diagonal direction (200 m in the x direction)
When a distance of 200 mm in the m and y directions) was measured, all five polyimide films of different lots were within ± 5 μm with respect to the photomask pattern, which was very good.

Example 6 Acrylic adhesive "SKDyne" SW-11A (Soken Chemical Co., Ltd.) whose adhesive strength is lowered by curing by ultraviolet irradiation
Manufactured by Soken Chemical Co., Ltd.) and a curing agent E-
5XM (manufactured by Soken Chemical Industry Co., Ltd.) mixed at 100: 2: 0.7 was applied to a glass substrate, dried at 80 ° C. for 2 minutes, and the thickness of the adhesive after drying was 10 μm. A polyimide film having a metal pattern formed thereon was vacuum-sucked in the same manner as in Example 5, and was gradually peeled from the end portion from the reinforcing plate. The peeling force and A × B × C of the polyimide film are shown in Table 1. A part of the edge of the polyimide film was peeled from the organic layer during the formation of the circuit pattern, but the region where the circuit pattern was formed was not peeled from the organic layer. Further, the polyimide film did not peel off and curl at the interface with the organic layer.

Length measuring machine SNIC-800 (Sokia Corporation)
Manufactured), the position of the intersection of the grid-shaped metal patterns was measured as the intersection of the center lines of the intersecting metal film lines. Two points that were originally about 283 mm apart in the diagonal direction (200 m in the x direction)
When a distance of 200 mm in the m and y directions) was measured, all five polyimide films of different lots were within ± 5 μm with respect to the photomask pattern, which was very good.

Example 7 Young's modulus of 930 kg / m using a comma coater
A long polyimide film (“upilex” manufactured by Ube Industries, Ltd.) of m ² , thickness of 125 μm and width of 300 mm was continuously coated with an adhesive for improving the adhesive strength of the metal layer, and a thickness of 0. 7mm, 300mm square aluminoborosilicate glass with a die coater, acrylic weak adhesive removability agent "Olivine" BPS5227-1 (Toyo Ink Co., Ltd.) and curing agent BXX5134 (Toyo Ink Co., Ltd.) The mixture of 100: 4 was applied and 10
Dry for 30 seconds at 0 ° C, and remove the re-peeling agent to a thickness of 15μ
A polyimide film having a metal film pattern formed thereon was vacuum-adsorbed in the same manner as in Example 2 except that m was set, and the polyimide film was gradually peeled from the end portion from the end portion. The peeling force and A × B × C of the polyimide film are shown in Table 1. The polyimide film was not peeled from the organic layer during the circuit pattern formation. Further, the polyimide film was not peeled off and curled at the interface with the organic layer.

Length measuring machine SNIC-800 (Sokia Corporation)
Manufactured), the position of the intersection of the grid-shaped metal patterns was measured as the intersection of the center lines of the intersecting metal film lines. Two points that were originally about 283 mm apart in the diagonal direction (200 m in the x direction)
When a distance of 200 mm in the m and y directions) was measured, all 5 polyimide films of different lots were within ± 5 μm with respect to the photomask pattern, which was very good.

Example 8 Young's modulus of 930 kg / m 2 using a comma coater
m ^2, a thickness of 75 [mu] m, and that the adhesive for the metal layer adhesion improvement was continuously coated on the polyimide film of the long width 300 mm ( "UPILEX" manufactured by Ube Industries, Ltd.), the adhesive after drying A polyimide film having a metal pattern formed thereon was vacuum-adsorbed in the same manner as in Example 6 except that the agent thickness was 15 μm, and the polyimide film was gradually peeled from the end portion from the reinforcing plate. The peeling force and A × B × C of the polyimide film are shown in Table 1. A part of the edge of the polyimide film was peeled from the organic layer during the formation of the circuit pattern, but the region where the circuit pattern was formed was not peeled from the organic layer. Further, the polyimide film was not peeled off and curled at the interface with the organic layer.

Length measuring machine SNIC-800 (Sokia Corporation)
Manufactured), the position of the intersection of the grid-shaped metal patterns was measured as the intersection of the center lines of the intersecting metal film lines. Two points that were originally about 283 mm apart in the diagonal direction (200 m in the x direction)
When a distance of 200 mm in the m and y directions) was measured, all five polyimide films of different lots were within ± 5 μm with respect to the photomask pattern, which was very good.

Example 9 Young's modulus of 930 kg / m using a comma coater
Example 6 except that a long polyimide film (“upilex” manufactured by Ube Industries, Ltd.) of m ² , thickness of 75 μm and width of 300 mm was continuously coated with an adhesive for improving the metal layer adhesive strength. Similarly, a polyimide film having a metal pattern formed thereon was vacuum-adsorbed and gradually peeled from the end portion from the reinforcing plate. Peeling force of polyimide film A × B × C
Are shown in Table 1. During formation of the circuit pattern, a region of several mm from the end of the polyimide film was peeled from the organic layer, but the region where the circuit pattern was formed was not peeled from the organic layer. Further, the polyimide film was not peeled off and curled at the interface with the organic layer.

Length measuring machine SNIC-800 (Sokia Corporation)
Manufactured), the position of the intersection of the grid-shaped metal patterns was measured as the intersection of the center lines of the intersecting metal film lines. Two points that were originally about 283 mm apart in the diagonal direction (200 m in the x direction)
When a distance of 200 mm in the m and y directions) was measured, all five polyimide films of different lots were within ± 5 μm with respect to the photomask pattern, which was very good.

Example 10 Young's modulus of 650 kg / m using a comma coater
Example 2 except that a long polyimide film (“Kapton” manufactured by DuPont Toray Co., Ltd.) having a width of m ² , a thickness of 25 μm and a width of 300 mm was continuously coated with an adhesive for improving the adhesive strength of the metal layer. In the same manner as above, the polyimide film having a metal pattern formed thereon was vacuum-adsorbed, and gradually peeled from the end portion from the reinforcing plate. Peeling force of polyimide film and A ×
B × C is shown in Table 1. The polyimide film was not peeled from the organic layer during the circuit pattern formation. Further, the polyimide film was not peeled off and curled at the interface with the organic layer.

Length measuring machine SNIC-800 (Sokia Corporation)
Manufactured), the position of the intersection of the grid-shaped metal patterns was measured as the intersection of the center lines of the intersecting metal film lines. Two points that were originally about 283 mm apart in the diagonal direction (200 m in the x direction)
When a distance of 200 mm in the m and y directions) was measured, all 5 polyimide films of different lots were within ± 8 μm with respect to the photomask pattern, which was very good.

Example 11 Young's modulus of 650 kg / m using a comma coater
A continuous polyimide film (“Kapton” manufactured by Toray-DuPont Co., Ltd.) of m ² , thickness of 50 μm and width of 300 mm was continuously coated with an adhesive for improving the adhesive strength of the metal layer, and the thickness was 0. Aluminoborosilicate glass of 0.7 mm and 300 mm square is die-coated with an acrylic weak adhesive re-release agent "Olivine" BPS5227-1 (manufactured by Toyo Ink Co., Ltd.) and a curing agent BXX5134 (Toyo Ink Co., Ltd.).
A polyimide film having a metal pattern formed thereon in the same manner as in Example 2 except that a mixture of 100: 2 of the above) was applied, dried at 100 ° C. for 30 seconds, and the thickness of the removable agent after drying was 15 μm. Was vacuum-adsorbed and gradually separated from the reinforcing plate from the end. The peeling force and A × B × C of the polyimide film are shown in Table 1. The polyimide film was not peeled from the organic layer during the circuit pattern formation. The polyimide film was slightly curled, but peeled off at the interface with the organic layer.

Length measuring machine SNIC-800 (Sokia Corporation)
Manufactured), the position of the intersection of the grid-shaped metal patterns was measured as the intersection of the center lines of the intersecting metal film lines. Two points that were originally about 283 mm apart in the diagonal direction (200 m in the x direction)
When a distance of 200 mm in the m and y directions) was measured, some of the photomask patterns were distorted by 21 μm toward the outside of the substrate. Although it was better than the comparative example, it was at a level that would be a problem in comparatively fine processing with a copper plating wiring pitch of 120 μm or less. Although inferior to the other examples, there was virtually no problem.

Example 12 Young's modulus of 930 kg / m using a comma coater
A long polyimide film (“upilex” manufactured by Ube Industries, Ltd.) of m ² , thickness of 125 μm and width of 300 mm was continuously coated with an adhesive for improving the adhesive strength of the metal layer, and a thickness of 0. 7mm, 300mm square aluminoborosilicate glass with a die coater, acrylic weak adhesive re-release agent "Ciavine" SH-101 (manufactured by Toyo Ink Co., Ltd.) and curing agent T-501B (Toyo Ink Co., Ltd.)
A polyimide film having a metal pattern formed thereon in the same manner as in Example 2 except that a mixture of 100: 3) was applied, dried at 100 ° C. for 2 minutes, and the thickness of the removable agent after drying was 30 μm. Was vacuum-adsorbed and gradually separated from the reinforcing plate from the end. The peeling force and A × B × C of the polyimide film are shown in Table 1. The polyimide film was not peeled from the organic layer during the circuit pattern formation. Further, the polyimide film did not peel off and curl at the interface with the organic layer.

Length measuring machine SNIC-800 (Sokia Corporation)
Manufactured), the position of the intersection of the grid-shaped metal patterns was measured as the intersection of the center lines of the intersecting metal film lines. Two points that were originally about 283 mm apart in the diagonal direction (200 m in the x direction)
When a distance of 200 mm in the m and y directions) was measured, all five polyimide films of different lots were within ± 13 μm with respect to the photomask pattern, which was very good.

Comparative Example 1 Acrylic pressure sensitive adhesive "SKDyne" SW-11A (Soken Chemical Co., Ltd.) whose adhesive strength is reduced by curing by ultraviolet irradiation
Manufactured by Soken Chemical Co., Ltd.) and a curing agent E-
A mixture of 5XM (manufactured by Soken Chemical Industry Co., Ltd.) at 100: 3: 1.5 was applied and dried at 80 ° C. for 2 minutes. A polyimide film having a metal pattern formed thereon was vacuum-adsorbed in the same manner as in Example 5 except that the thickness of the adhesive after drying was set to 5 μm, and the polyimide film was gradually peeled from the end portion from the end portion. The peeling force and A × B × C of the polyimide film are shown in Table 1.
The polyimide film peeled from the organic layer during the formation of the circuit pattern, resulting in the chipping of the resist pattern and the chipping of the circuit pattern.

Comparative Example 2 Acrylic medium adhesive re-release agent "Olivine" BPS-
5673 (manufactured by Toyo Ink Co., Ltd.) and curing agent BHS-85
A mixture of 15 (manufactured by Toyo Ink Co., Ltd.) at 100: 5 was applied and dried at 100 ° C. for 2 minutes. The thickness of the adhesive after drying was set to 8 μm. A polyimide film having a metal film pattern formed thereon was vacuum-adsorbed in the same manner as in Example 2 except that the pressure-sensitive adhesive was changed, and the polyimide film was gradually peeled from the end portion from the reinforcing plate. The peeling force and A × B × C of the polyimide film are shown in Table 1. The polyimide film was not peeled from the organic layer during the circuit pattern formation. Further, the polyimide film was peeled off at the interface with the organic layer, but was significantly curled.

Length measuring machine SNIC-800 (Sokia Corporation)
Manufactured), the position of the intersection of the grid-shaped metal patterns was measured as the intersection of the center lines of the intersecting metal film lines. Two points that were originally about 283 mm apart in the diagonal direction (200 m in the x direction)
When a distance of 200 mm in the m and y directions) was measured, some of the photomask patterns were distorted by 130 μm toward the outside of the substrate. Even a relatively rough processing with a pitch of 200 μm or more was at a level to be a problem.

Comparative Example 3 Young's modulus of 930 kg / m 2 using a comma coater
Example 6 except that a long polyimide film (“upilex” manufactured by Ube Industries, Ltd.) having a length of m ² , a thickness of 125 μm and a width of 300 mm was continuously coated with an adhesive for improving the adhesive strength of the metal layer. Similarly, a polyimide film having a metal pattern formed thereon was vacuum-adsorbed and gradually peeled from the end portion from the reinforcing plate. Peeling force of polyimide film and A
× B × C is shown in Table 1. The polyimide film peeled from the organic layer during the formation of the circuit pattern, resulting in the chipping of the resist pattern and the chipping of the circuit pattern.

Comparative Example 4 Young's modulus of 930 kg / m 2 using a comma coater
Long polyimide film of m ² , thickness of 12.5 μm and width of 300 mm (“UPILEX” manufactured by Ube Industries, Ltd.)
A polyimide film having a metal film pattern formed thereon was vacuum-adsorbed in the same manner as in Example 4 except that an adhesive for improving the adhesive strength of the metal layer was continuously applied, and the polyimide film was gradually peeled from the end portion from the reinforcing plate. . Regarding the peeling force of the polyimide film and A × B × C, the polyimide film was not peeled from the organic layer during the formation of the circuit pattern. Further, the polyimide film was peeled off at the interface with the organic layer, but was significantly curled.

Length measuring machine SNIC-800 (Sokia Corporation)
Manufactured), the position of the intersection of the grid-shaped metal patterns was measured as the intersection of the center lines of the intersecting metal film lines. Two points that were originally about 283 mm apart in the diagonal direction (200 m in the x direction)
When a distance of 200 mm in the m and y directions) was measured, it was found that the photomask pattern was distorted 110 μm toward the outside of the substrate. Even a relatively rough processing with a pitch of 200 μm or more was at a level to be a problem.

[0087]

[Table 1]

[0088]

According to the present invention, a flexible film is bonded to a reinforcing plate, a circuit pattern is processed on the surface of the film opposite to the bonding surface to the reinforcing plate, and then the flexible film is peeled off. And the product of the peeling force A, the thickness of the flexible film and the reciprocal B and C of the Young's modulus at this time is 4.3 × 1.
It is a method of manufacturing a circuit board having a size of 0-6 or more and 4.3 × 10-3 or less. , A × B × C within a specific range,
It suppresses the deformation of the flexible film by heat treatment process in the processing process, expansion and contraction by the wet process, or external force such as pulling and twisting, enabling microfabrication closer to the design value, and particularly high precision on at least one side It is possible to manufacture a circuit board on which various circuit patterns are formed. In particular, it is highly effective in improving the accumulative accuracy relating to the alignment accuracy between the electrode pad and the circuit board pattern when connecting an electronic component such as an IC. In addition, before bonding the reinforcing plate and the flexible film, a circuit pattern is formed in advance on the reinforcing plate bonding surface of the film, and the reinforcing plate and the circuit pattern forming surface are separated via an organic material layer. By sticking them together, a double-sided wiring circuit board can be obtained.

Claims (3)

[Claims] 1. A reinforcing plate and a flexible film are adhered to each other via a peelable organic layer, and then a circuit pattern is formed on the surface of the flexible film which is not adhered to the reinforcing plate. A method of manufacturing a circuit board for peeling a flexible film, comprising a peeling force A (g / cm) when peeling the flexible film and a reciprocal B of the thickness of the flexible film.
(Μm ⁻¹ ) and the reciprocal of the Young's modulus of the flexible film C (m
m ² / kg) and the product A × B × C are in the range of 4.3 × 10 ⁻⁶ or more and 4.3 × 10 ⁻³ or less. 2. A circuit pattern is formed on one surface of a flexible film, and a reinforcing plate and a circuit pattern forming surface of the flexible film are bonded together via a peelable organic material layer, and then flexible. A method of manufacturing a circuit board in which a circuit pattern is formed on the other surface of a flexible film and then the flexible film is peeled off, and a peeling force A (g / cm) for peeling the flexible film , The reciprocal of the thickness of the flexible film B
(Μm ⁻¹ ) and the reciprocal of the Young's modulus of the flexible film C (m
m ² / kg) and the product A × B × C are in the range of 4.3 × 10 ⁻⁶ or more and 4.3 × 10 ⁻³ or less. 3. The method for manufacturing a circuit board according to claim 1, wherein the reinforcing plate is glass.