JP2003163177A - Apparatus for peeling protective tape of wafer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus for peeling a protective tape for a wafer, which does not break or damage the wafer due to loosening or shift during a peeling process or a mounting process, and is applicable to wafers of different sizes without exchanging a chucking table as in conventional cases, and which is simple in construction, compact in size, and superior in versatility. <P>SOLUTION: This protective tape peeling apparatus is provided with a rectangular central chucking table 20 having a length that reaches a wafer part W1 of a small-sized wafer transfer member F1 and a ring frame R2 of a large-sized wafer transfer member in the peeling direction and at the same time having a width that reaches the wafer part of the small-sized wafer transfer member in the direction B perpendicular to the peeling direction, and a support table 50 arranged on external sides in the direction of the width of the central chucking table, having a shape corresponding to an area that is not-supported by the central chucking table of a wafer part W2 of the large-sized wafer transfer member F2, and constituted so as to be able to move vertically to support the area. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer of a wafer transfer body in which a wafer having a protective tape is transferred (replaced) to a ring frame and a dicing tape in a manufacturing process of a small electronic component such as a semiconductor chip. , A wafer protective tape peeling device for peeling a protective tape.

[0002]

2. Description of the Related Art Recently, semiconductor wafers such as silicon have become extremely brittle because they have been thinned through a polishing process. Therefore, in order to prevent the wafer from being damaged or damaged during the processing of the wafer, JP-A-4-354333.
As disclosed in Japanese Unexamined Patent Publication, a backgrinding step is performed in which a protective tape is attached to the pattern forming surface (front surface) of the wafer, and the backside of the wafer is ground, and the wafer is attached via the dicing tape in the dicing step to form a ring. A method of peeling a protective tape attached to the surface of a semiconductor wafer after mounting on a frame is disclosed.

Further, in Japanese Patent No. 2877997, a ring-shaped frame is mounted on a suction table having a wide range covering the entire area of an adhesive tape attached to the lower surface of the frame, and the ring is attached via the adhesive tape. While holding the semiconductor wafer mounted on the suction frame on the suction table, attach the release tape to the protective adhesive tape attached to the surface of the semiconductor wafer, and remove the protective adhesive tape through this release tape. I have to.

[0004]

However, recently, since semiconductor wafers such as silicon have been increased in size to 8 inches and 12 inches, it becomes more difficult to handle the wafers. When the suction table having such a wide range as to cover the entire pressure sensitive adhesive tape is used, different sizes such as 6 inches and 8 inches are used.
It is impossible to apply to wafers of inch and 12 inches, or all of these sizes, and the suction table itself must be replaced with a wafer according to the size of the wafer to be handled. It is complicated, time-consuming, and expensive. Moreover, since there is also an apparatus section for feeding the peeling tape and adhering it to the protective tape on the suction table, the work of exchanging the suction table becomes more and more complicated.

Further, in the suction table having such a wide range as to cover the entire adhesive tape, since the suction table becomes large, a complicated structure is required and many materials must be used. In addition, the device becomes large. In consideration of such a current situation, the present invention causes the wafer to float or shift during peeling,
The wafer can be applied to different sizes, for example, 8 inch and 12 inch wafers without exchanging the suction table as in the conventional case without damaging and damaging the wafer, and has a simple structure. It is an object of the present invention to provide a compact and versatile wafer protective tape peeling device.

[0006]

The present invention has been made in order to achieve the problems and objects in the prior art as described above, and the wafer protection tape peeling apparatus of the present invention protects the surface. A wafer transfer body in which a wafer with a tape attached is attached to a ring frame via a dicing tape and integrated, and the protection tape is peeled from the wafer transfer body that is integrated using wafers of different sizes. A wafer protective tape peeling device for performing a peeling process, wherein a peeling direction is used for peeling a wafer transfer body of a smaller size among wafer transfer bodies integrated by using wafers of different sizes. At
It has a length that extends over the wafer portion of the small-sized wafer transfer body and the ring frame of the large-sized wafer transfer body, and has a width that extends over the wafer portion of the small-size wafer transfer body in the direction perpendicular to the peeling direction. A rectangular central suction table and a large-sized wafer transfer body are separated from each other in the width direction of the central suction table in order to peel off the wafer transfer body. A supporting table having a shape corresponding to an unsupported wafer portion and configured to support the wafer portion and capable of moving up and down; and when performing a peeling process on the small-sized wafer transfer body, the supporting table is It descends, puts a small-sized wafer transfer body on the central suction table, sucks it, and peels it off. Upon the release handle wafer transfer body serial large size, the support table is raised, characterized by being configured to support the wafer transfer body larger size.

With this configuration, when a small-sized wafer transfer body, for example, an 8-inch wafer transfer body is peeled off, the support table is lowered and is placed on the central suction table in the peeling direction. The wafer portion of the small-sized wafer transfer body and the ring frame portion can be placed, and the wafer portion of the small-sized wafer transfer body is placed and sucked in the width direction that is a direction perpendicular to the peeling direction. A peeling treatment can be performed.

Further, when a wafer transfer body having a size larger than that of the wafer transfer body having a smaller size, for example, a wafer transfer body having a size of 12 inches is peeled, the support table is raised and the central suction table moves the peeling direction. In addition, the wafer portion of the large-sized wafer transfer body and the ring frame portion can be placed, and at least the wafer portion of the wafer transfer body is covered by the central suction table and the support table in the width direction that is a direction perpendicular to the peeling direction. It can be placed, adsorbed, and peeled off.

Therefore, by selecting the central suction table and the support table for the wafer transfer bodies of different sizes as described above, at least the wafer portion of the wafer transfer body can be sucked and supported. The wafer does not float or shift, no force is applied to the wafer in the bending direction, and there is no damage or damage. Moreover, it can be applied to wafers of different sizes, for example, 6 inch, 8 inch and 12 inch, or all of these sizes without exchanging the suction table as in the conventional case, and it is simple and easy. Compact in structure and excellent in versatility.

Further, in the wafer protective tape peeling apparatus of the present invention, the central suction table is formed with a small-diameter suction portion for suctioning the outer edge of the wafer portion of the small wafer transfer member on the upstream side in the peeling direction of the wafer portion. It is characterized by In this way, since the outer edge of the wafer portion on the upstream side in the peeling direction of the wafer portion of the small wafer transfer body is sucked by the small-diameter suction portion, when peeling the protective tape from the small wafer transfer body, the outer edge of the wafer portion on the upstream side in the peeling direction is peeled off. The wafer is not lifted or displaced, no force is applied to the wafer in the bending direction, and the wafer is not damaged or damaged.

Further, in the wafer protective tape peeling apparatus of the present invention, the central suction table is provided with a large-diameter suction portion for sucking the outer edge of the wafer portion on the upstream side in the peeling direction of the wafer portion of the large wafer transfer body. It is characterized by being As a result, the outer edge of the wafer portion of the wafer portion of the large wafer transfer body on the upstream side in the peeling direction is attracted by the large-diameter suction portion, so when peeling the protective tape from the large wafer transfer body, the outer edge of the wafer portion on the upstream side of the peeling direction is peeled off. The wafer is not lifted or displaced, no force is applied to the wafer in the bending direction, and the wafer is not damaged or damaged.

As described above, since it is sufficient to form the small-diameter suction portion and the large-diameter suction portion for sucking the outer edge of the wafer portion on the upstream side in the peeling direction of the wafer portion, the whole suction table, for example,
Since it is not necessary to provide a suction hole or the like, a device having a complicated structure is unnecessary. Further, the wafer protective tape peeling apparatus of the present invention is a wafer transfer body in which a wafer having a protective tape adhered to the surface thereof is adhered to a ring frame via a dicing tape to be integrated, and wafers of different sizes are attached. A wafer protective tape peeling device for performing a peeling process of peeling a protective tape from a wafer transfer body integrated by using the wafer transfer body, wherein the wafer transfer body integrated by using wafers of different sizes is used. In order to perform the peeling process on the small-sized wafer transfer body, in the direction perpendicular to the peeling direction, the wafer portion of the small-sized wafer transfer body and the ring frame of the large-sized wafer transfer body have a length that extends, In the peeling direction, a rectangular central suction table having a width extending to the wafer portion of the small-sized wafer transfer body and a large size In order to perform a peeling process on a wafer transfer body of a size, a shape corresponding to a wafer portion of the large-sized wafer transfer body, which is arranged outside the peeling direction of the central suction table and is not supported by the central suction table, is formed. And a support table configured to be movable up and down for supporting the wafer portion. When the small-sized wafer transfer body is subjected to a peeling process, the support table descends to a small size on the central suction table. A wafer transfer body of a size is placed, adsorbed and subjected to a peeling process, and when the wafer transfer body of a large size is peeled, the support table is raised to support the wafer transfer body of a large size. It is characterized in that it is configured as follows.

With this configuration, when a small-sized wafer transfer body, for example, an 8-inch wafer transfer body is peeled off, the supporting table is lowered and is placed on the central suction table in the peeling direction. In the width direction which is the vertical direction, the wafer portion of the wafer transfer body of a small size and the ring frame portion can be placed, and in the peeling direction, the wafer portion can be placed and sucked to perform the peeling process. .

When a wafer transfer body having a larger size than a wafer transfer body having a smaller size, for example, a wafer transfer body having a size of 12 inches, is peeled off, the support table is raised and the central suction table moves the peeling direction. In the width direction, which is a direction perpendicular to, the wafer portion of the large-sized wafer transfer body and the ring frame portion can be placed, and in the peeling direction, at least the wafer portion of the wafer transfer body is held by the central suction table and the support table. It can be placed, adsorbed, and peeled off.

Therefore, by selecting the central suction table and the support table for the wafer transfer bodies having different sizes as described above, at least the wafer portion of the wafer transfer body can be sucked and supported, so that the wafer can be removed at the time of peeling. The wafer does not float or shift, no force is applied to the wafer in the bending direction, and there is no damage or damage. Moreover, it can be applied to wafers of different sizes, for example, 6 inch, 8 inch and 12 inch, or all of these sizes without exchanging the suction table as in the conventional case, and it is simple and easy. Compact in structure and excellent in versatility.

Further, in the wafer protective tape peeling apparatus of the present invention, the central suction table is provided with a small-diameter suction portion for sucking the outer edge of the wafer portion of the small wafer transfer body on the upstream side in the peeling direction of the wafer portion. It is characterized by In this way, since the small-diameter suction portion sucks the wafer portion outer edge of the small wafer transfer body on the upstream side in the peeling direction, when peeling the protective tape from the small wafer transfer body, the wafer portion outer edge of the peeling direction upstream side is peeled off. The wafer is not lifted or displaced, no force is applied to the wafer in the bending direction, and the wafer is not damaged or damaged.

Further, in the wafer protective tape peeling apparatus of the present invention, the support table is provided with a large-diameter suction portion for sucking the outer edge of the wafer portion on the upstream side in the peeling direction of the wafer portion of the large wafer transfer body. It is characterized by As a result, since the outer peripheral edge of the wafer portion on the upstream side in the peeling direction of the wafer portion of the large wafer transfer body is adsorbed, the wafer floats from the outer peripheral edge of the wafer portion on the upstream side in the peeling direction when the protective tape is peeled off from the large wafer transfer body. There is no deviation and no force is applied to the wafer in the bending direction, and there is no damage or damage.

As described above, since it is only necessary to form the small-diameter suction portion and the large-diameter suction portion that suck the outer edge of the wafer portion on the upstream side in the peeling direction of the wafer portion, for example, the whole suction table is
Since it is not necessary to provide a suction hole or the like, a device having a complicated structure is unnecessary. Further, the wafer protective tape peeling apparatus of the present invention is characterized in that the support tables are arranged on both sides of the central suction table on the outer side in the peeling direction.

With this structure, when a large-sized wafer transfer member is peeled off, the supporting table is raised and the central suction table causes the large size in the width direction perpendicular to the peeling direction. Since the wafer part of the wafer transfer body and the ring frame part can be placed, the wafer is not lifted or misaligned, and the wafer does not come into contact with the wafer and is not damaged or damaged. You can

Further, the wafer protective tape peeling apparatus of the present invention is characterized in that the supporting table is arranged on the upstream side in the peeling direction outside the peeling direction of the central suction table. With this configuration, when a large-sized wafer transfer body is peeled off, the support table arranged on the upstream side in the peeling direction outside the peeling direction of the central suction table rises, and by this central suction table, Since the upstream side in the peeling direction can be adsorbed and held, the wafer is not lifted or displaced from the upstream side in the peeling direction and is not damaged or damaged by contact with the wafer, so that the peeling process can be performed stably. .

[0021]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments (examples) of a wafer protective tape peeling apparatus of the present invention will be described below with reference to the accompanying drawings. 1 is a front view of the entire apparatus of a first embodiment of a wafer protective tape peeling apparatus of the present invention, FIG.
1 is a front cross-sectional view of the protective tape peeling table portion of the wafer protective tape peeling device of FIG. 1, FIG. 3 is a top plan view of FIG. 2, and FIG. 4 is a protective tape peeling tape of a wafer transfer body used in the present invention. It is sectional drawing which shows the state.

In FIG. 1, reference numeral 10 denotes a wafer protective tape peeling device as a whole (hereinafter, simply referred to as "protective tape peeling device"). The protective tape peeling device 10 is shown in FIG.
As shown in FIG. 2, the protective tape P is attached to the surface of the wafer W, and the ring frame R is attached to the outer periphery of the wafer W via the dicing tape T to form an integrated wafer transfer body F. It is used for peeling P.

Such a wafer transfer body F is located on the table portion 12 for peeling off the protective tape of the protective tape peeling device 10, and the dicing tape T side is located on the table portion 12 for peeling off the protective tape. The P side is placed so that it is located above. As shown in FIG. 1, the protective tape peeling device 10 includes a table portion 12, a tape feeding portion 14, a peeling head portion 16 as a moving means, and a heater cutter portion 18 as an adhering / cutting means. There is.

Table part 1 for peeling off the protective tape
2 includes a central suction table 20 that is movable in the front-rear direction, as shown by an arrow 4 in FIG. In the tape feeding section 14, as shown in FIGS. 5A to 5C, after the peeling tape S is fed and sandwiched between the pinch roller 22 and the guide roller 24, the peeling tape S is directed by the guide roller 24. The tape is converted, sent to the tape receiving plate 26, and held by the tape pressing plate 28 that can move up and down on the tape receiving plate 26. The tape feeding section 14 is configured to be vertically movable.

As the release tape S, a heat-resistant film such as a polyethylene terephthalate (PET) film provided with a heat-sensitive adhesive layer, or a release tape itself having a heat-sensitive release tape is used. it can. The peeling head portion 16 is, as shown in FIG.
It is provided with a holding portion 30 and is movable in the left-right direction.
Further, the holding section 30 is provided with a chuck 36 including an upper jaw 32 and a lower jaw 34, and can move up and down to open and close the chuck 36.

As shown in FIG. 5B, the heater cutter portion 18 has a heater member 38 having a heater that can move up and down.
Is provided. A tape pressing guide 40 is provided on the front and rear sides of the heater cutter portion 18, and a tape pressing member 4 is provided on the rear side of the heater cutter portion 18.
2 is provided, and a cutter blade 46 that moves laterally along the groove 44 of the tape retainer 42 is provided.

The protective tape peeling device 10 constructed as described above operates as shown in FIGS. The central suction table 20 is moved to below the tape feeding section 14. Then, the peeling head portion 16 is moved in a direction approaching the tape feeding portion 14. At this time, the chuck 36 is open.

The peeling head 16 presses the tape receiving plate 26, and after the tip of the peeling tape S is detected, the chuck 36 is closed. The peeling tape S is clamped.
As shown in FIG. 5A, the peeling head portion 16 is moved in a direction away from the tape feeding portion 14 and the peeling tape S is pulled out. After that, as shown in FIG. 5B, the heater cutter portion 18 is lowered, the peeling tape S is held by the tape press 42 and the tape press guide 40, and the heat of the heater causes the wafer W to pass through the heater member 38. The protective tape P on the surface is adhered by heat fusion.
Then, along the groove 44 of the tape holder 42, the cutter blade 46 is moved in the width direction of the tape to cut the peeling tape S into a predetermined length. The adhesion point is preferably located near the edge of the wafer W, for example, within a distance of 3 mm from the edge of the wafer W.

Then, as shown in FIG. 5C, after the tape feeding section 14 and the heater cutter section 18 are raised, the peeling head section 16 and the central suction table 20 are moved in directions away from each other. Thus, the protective tape P on the surface of the wafer W can be peeled off from the surface of the wafer W by the peeling tape S. Although not shown, the peeling tape S and the protective tape P thus peeled off are opened by opening the chuck 36 of the peeling head 16 and air blown from above so that the peeling tape S and the protective tape P are dropped and accommodated in a waste box (not shown). It has become.

By the way, recently, as the semiconductor wafer, a wafer W having an outer diameter of 6 inches to a wafer W having an outer diameter of 8 inches is becoming mainstream, but in recent years, a larger semiconductor wafer W having a large diameter of 12 inches has been put on the market. It is starting to appear. In order to be applicable to wafers W having different sizes, for example, 8 inches and 12 inches, in the protective tape peeling apparatus 10 of the present invention, the protective tape having the configuration shown in FIG. 3 is used. Table part 1 for peeling
Equipped with 2.

The table portion 12 is provided with a rectangular central suction table 20. This central suction table 20
Has a length in the peeling direction A that extends to the wafer portion W1 of the small-sized wafer transfer body F1 and the ring frame R2 of the large-sized wafer transfer body F2.
Further, the central suction table 20 has a width that extends to the wafer portion W1 of the small-sized wafer transfer body F1 in the direction B perpendicular to the peeling direction, that is, in the width direction.

As shown in FIG. 3, the central suction table 20 is provided with a small-diameter suction portion 23 for sucking the outer edge of the wafer portion W1 of the small-sized wafer transfer body F1 on the upstream side in the peeling direction. There is. This small diameter suction part 23
Is the wafer portion W1 of the small-sized wafer transfer body F1.
A plurality of suction holes 23a are formed at regular intervals along the outer edge of the.

Further, as shown in FIG. 3, the central suction table 20 has a large-diameter suction portion 25 for suctioning the outer edge of the wafer portion W2 of the large-sized wafer transfer member F2 on the upstream side in the peeling direction. Has been formed. The large-diameter suction portion 25 is composed of a plurality of suction holes 25a formed at regular intervals along the outer edge of the wafer portion W2 of the large-sized wafer transfer body F2.

The suction holes 23a and 25a are connected to a vacuum source such as a vacuum pump (not shown) so as to have a negative pressure, so that the dicing tape T side of the wafer transfer body F is suction-held and fixed. ing. As a result, the protective tape P is transferred from the wafer transfer body F via the peeling tape S.
The wafer transfer body F does not float from the table portion 12 when peeled off and warps during peeling, so that the chips of the wafer W are not damaged or damaged.

In FIG. 3, the suction holes 23a and 25a are respectively provided along the outer edge of the wafer portion W2 so as to have one line, but it is of course also possible to form a plurality of lines. It is possible. Further, support tables 50 are provided on both sides of the central suction table 20 on the outer side in the width direction. As shown in FIG. 3, the support table 50 has a shape corresponding to the wafer portion W3 of the large-sized wafer transfer body F2 that is not supported by the central suction table 20.

As shown in FIGS. 6 and 7, the support table 50 is constructed to be vertically movable by a cylinder 52. In the protective tape peeling device 10 configured as described above, when the wafer transfer body F having a small size, for example, the 8-inch wafer transfer body F1 is peeled, as shown in FIG. 50 moves down, and the wafer W1 of the wafer transfer body F1 having a small size is placed on the central suction table 20 and sucked to perform the peeling process.

That is, the central suction table 20, the wafer portion W1 of the wafer transfer body F1 of a small size and the ring frame portion R1 can be placed in the peeling direction, and are small in the width direction which is the direction perpendicular to the peeling direction. The wafer portion W1 of the wafer transfer body F1 having a size can be placed and adsorbed to perform the peeling process. During this peeling process, the small-diameter suction portion 23 sucks the outer edge of the wafer portion W1 of the small wafer transfer body F1 on the upstream side in the peeling direction, so that the protective tape P is peeled from the small wafer transfer body F1. In addition, the wafer is not lifted or displaced from the outer edge of the wafer portion on the upstream side in the peeling direction, so that no force is applied to the wafer in the bending direction, so that the wafer is not damaged or damaged.

On the other hand, when the wafer transfer body F2 having a larger size than the wafer transfer body F1 having a smaller size, for example, the wafer transfer body F2 having a size of 12 inches is peeled off, as shown in FIG. Of the wafer W2 of the wafer transfer body F2 by the central suction table 20.
Is placed, adsorbed and peeled off.

That is, by the central suction table 20,
In the peeling direction, the wafer portion W2 of the wafer transfer body F2 having a large size and the ring frame portion R2 can be placed, and the central suction table 20 and the support table 50 allow the wafer to be moved in the width direction perpendicular to the peeling direction. At least the wafer portion W2 of the transfer body F2 can be placed and adsorbed to perform the peeling process.

At the time of this peeling process, the outer edge of the wafer portion W2 of the large wafer transfer body F2 on the upstream side in the peeling direction is sucked by the large-diameter suction portion 25, so that the protective tape P is removed from the large wafer transfer body F2. At the time of peeling, the wafer floats or shifts from the outer edge of the wafer portion on the upstream side in the peeling direction, so that a force in the bending direction is not applied to the wafer and damage or damage is prevented.

Therefore, by selecting the central suction table 20 and the support table 50 for the wafer transfer bodies having different sizes as described above, at least the wafer portion of the wafer transfer body can be sucked and supported. The wafer is not lifted or displaced, no force is applied to the wafer in the bending direction, and the wafer is not damaged or damaged. What's more, different sizes such as 6 inch, 8 inch and 1
It can be applied to wafers of 2 inches or all of these sizes without exchanging the suction table as in the conventional case, and has a simple structure and is compact and excellent in versatility.

As described above, after the protective tape P is peeled off by the protective tape peeling apparatus 10 of the present invention, the wafer transfer body F is appropriately subjected to the next steps of cleaning, drying, die bonding and the like. It has become. In this embodiment, the central suction table 20 is provided with the small-diameter suction portion 23 and the large-diameter suction portion 25, but although not shown, the central suction table 20 is, for example, a suction member made of porous ceramic or steel plate. Alternatively, the dicing tape T side of the wafer transfer body F may be suction-held and fixed by connecting it to a vacuum source such as a vacuum pump (not shown) to make a negative pressure.

FIG. 8 is a plan view similar to FIG. 2 of the protective tape peeling table portion of the second embodiment of the wafer protective tape peeling device of the present invention. The protective tape peeling device 10 of this embodiment basically has the same configuration as the protective tape peeling device 10 of the first embodiment shown in FIGS. 1 to 4, and the same reference numerals are used for the same constituent members. Is attached and detailed description thereof is omitted.

In the protective tape peeling apparatus 10 of this embodiment, the central suction table 20 has a rectangular shape B in the direction perpendicular to the peeling direction, that is, the width direction is long and the peeling direction is short. That is, the central suction table 20 of this embodiment has a length in the direction B perpendicular to the peeling direction that extends over the wafer portion W1 of the small-sized wafer transfer body F1 and the ring frame R2 of the large-sized wafer transfer body F2. Have Further, the central suction table 20 has a width in the peeling direction A that extends to the wafer portion W1 of the wafer transfer body F1 having a small size.

On the other hand, in this embodiment, the support table 50 is used.
Are arranged on both outer sides of the central suction table 20 in the peeling direction A. In this embodiment, the support table 50 has a plurality of suction holes 54a formed at regular intervals along the outer edge of the wafer portion of the large wafer transfer member on the upstream side in the peeling direction. A large-diameter suction portion 54 for suctioning the outer edge of the wafer portion on the upstream side in the peeling direction of the wafer portion of the wafer transfer body is formed.

The protective tape peeling device 10 thus constructed basically operates in the same manner as the protective tape peeling device 10 of the first embodiment. That is, when the wafer transfer body F having a small size, for example, the 8-inch wafer transfer body F1 is peeled off, the support table 50 is used.
The wafer W of the small-sized wafer transfer body F1 is placed on the central suction table 20 and sucked to perform the peeling process.

On the other hand, when the wafer transfer body F2 having a larger size than the wafer transfer body F1 having a smaller size, for example, the wafer transfer body F2 having a size of 12 inches is peeled off, the support table 50 is lifted to move the central suction table. The wafer W2 of the wafer transfer body F2 is placed by 20 and sucked to perform a peeling process. However, in this peeling process, the outer edge of the wafer portion W2 of the large wafer transfer body F2 on the upstream side in the peeling direction is sucked onto the support table 50 by the large-diameter suction portion 54. This is different from the protective tape peeling device 10 of the example.

Incidentally, the protective tape peeling apparatus 1 of this embodiment
In 0, the support tables 50 are arranged on both sides of the central suction table 20 on the outside in the peeling direction A, but the support tables 50 may be arranged only on the upstream side in the peeling direction.
The present invention is not limited to the embodiment described above, and in this embodiment, the protective tape P is peeled off via the peeling tape S, but the peeling tape S is used as in the conventional case. Various modifications can be made without departing from the object of the present invention, such as being applicable when peeling without peeling.

[0049]

According to the protective tape peeling device of the present invention,
When a small-sized wafer transfer body, for example, an 8-inch wafer transfer body is peeled off, the support table descends and a wafer portion of the small-sized wafer transfer body is placed on the central suction table in the peeling direction. The ring frame portion can be placed, and the wafer portion of the wafer transfer body having a small size can be placed and sucked in the width direction that is a direction perpendicular to the peeling direction to perform the peeling process.

When a wafer transfer body having a larger size than a wafer transfer body having a smaller size, for example, a wafer transfer body having a size of 12 inches is peeled off, the support table is raised and the central suction table moves the peeling direction. In addition, the wafer portion of the large-sized wafer transfer body and the ring frame portion can be placed, and at least the wafer portion of the wafer transfer body is covered by the central suction table and the support table in the width direction that is a direction perpendicular to the peeling direction. It can be placed, adsorbed, and peeled off.

Further, according to the protective tape peeling apparatus of the present invention, when a small-sized wafer transfer body, for example, an 8-inch wafer transfer body is peeled off, the support table is lowered and the central suction table is placed. In addition, the wafer portion of the wafer transfer body of a small size and the ring frame portion can be placed in the width direction which is the direction perpendicular to the peeling direction, and the wafer portion is placed and sucked in the peeling direction to perform the peeling process. It can be performed.

When a wafer transfer body having a larger size than a wafer transfer body having a smaller size, for example, a 12-inch wafer transfer body is peeled off, the support table is raised and the central suction table moves the peeling direction. In the width direction, which is a direction perpendicular to, the wafer portion of the large-sized wafer transfer body and the ring frame portion can be placed, and in the peeling direction, at least the wafer portion of the wafer transfer body is held by the central suction table and the support table. It can be placed, adsorbed, and peeled off.

Therefore, the wafer can be sucked and supported by selecting the central suction table and the support table for the wafer transfer bodies having different sizes as described above.
The wafer does not float or shift during peeling, and the wafer is not damaged or damaged. Moreover, it can be applied to wafers of different sizes, for example, 6 inch, 8 inch and 12 inch, or all of these sizes without exchanging the suction table as in the conventional case, and it is simple and easy. It is an extremely excellent invention that has a number of unique and remarkable effects such as a compact structure and excellent versatility.

Further, the protective tape peeling device of the present invention is
Dicing to a predetermined depth in the wafer thickness direction from the surface on which the circuit of the wafer is formed, forming a groove with a bottom in the shape of a dice, attaching a protective tape on the front surface of the wafer, The same applies to the "first dicing method" in which the process of grinding up to the groove and dividing it into many chips, the process of attaching the wafer with the protective tape attached to the ring frame, and the process of peeling the protective tape are performed in this order. Can be used for.

[Brief description of drawings]

FIG. 1 is a front view of the entire apparatus of a first embodiment of a wafer protective tape peeling apparatus of the present invention.

FIG. 2 is a front cross-sectional view of a table portion for peeling off the protective tape of the protective tape peeling device for the wafer of FIG.

3 is a top plan view of FIG. 2. FIG.

FIG. 4 is a schematic cross-sectional view showing a state in which the protective tape of the wafer transfer body used in the present invention is peeled off.

FIG. 5 is a schematic view showing a state in which the protective tape of the wafer transfer body is peeled off by the wafer protective tape peeling apparatus of the present invention.

FIG. 6 is a schematic view showing a state in which a small-sized wafer transfer body is placed on the table of the wafer protection tape peeling apparatus of the present invention.

FIG. 7 is a schematic view showing a state in which a large-sized wafer transfer body is placed on the table of the wafer protection tape peeling apparatus of the present invention.

FIG. 8 is a top plan view similar to FIG. 2 of the protective tape peeling table portion of the device of the second embodiment of the wafer protective tape peeling device of the present invention.

[Explanation of symbols]

10 Protective tape peeling device 12 Table section 16 head 18 Heater cutter part 20 Central suction table 22 pinch rollers 23a Adsorption hole 23 Small diameter suction part 24 Guide roller 25a adsorption hole 25 Large diameter suction part 30 clamping part 36 chuck 38 heater member 40 guides 44 groove 46 cutter blade 50 support table 52 cylinders 54a adsorption hole 54 Large-diameter suction part A peeling direction B width direction F wafer transfer body F1 wafer transfer body F2 wafer transfer body P protection tape R ring frame R1 ring frame part R2 ring frame part S release tape T dicing tape W wafer W1 wafer part W2 wafer part W3 wafer part

Claims (8)

[Claims] 1. A wafer transfer body in which a wafer having a protective tape adhered to the surface thereof is adhered to a ring frame via a dicing tape to be integrated, and the wafer transfer body is integrated by using wafers of different sizes. From the above, there is provided a wafer protection tape peeling device for performing a peeling process for peeling a protection tape from a wafer, wherein a wafer transfer body of a smaller size is selected from wafer transfer bodies integrated by using wafers of different sizes. In order to perform the peeling process, the wafer part of the small size wafer transfer body has a length in the peeling direction and the ring frame of the large size wafer transfer body, and the small size wafer in the direction perpendicular to the peeling direction. A rectangular central suction table with a width that covers the wafer portion of the transfer body and a large-sized wafer transfer body are removed. To are arranged in the width direction outer side of the central suction table,
A wafer table of a large-sized wafer transfer member, which has a shape corresponding to a wafer portion that is not supported by the central suction table, and a vertically movable support table that supports the wafer portion; When performing a peeling process on a wafer transfer body of a large size, the supporting table is lowered, a wafer transfer body of a small size is placed on the central suction table, and the wafer transfer body of a large size is subjected to a peeling process. A wafer protective tape peeling apparatus, characterized in that, when the body is peeled off, the support table is raised to support a large-sized wafer transfer body. 2. The small-diameter suction portion for sucking the outer edge of the wafer portion on the upstream side in the peeling direction of the wafer portion of the small wafer transfer body is formed on the central suction table. Wafer protection tape peeling device. 3. The large-diameter suction portion for sucking the outer edge of the wafer portion on the upstream side in the peeling direction of the wafer portion of the large wafer transfer body is formed on the central suction table. Wafer protection tape peeling device. 4. A wafer transfer body in which a wafer having a protective tape adhered to the surface thereof is adhered to a ring frame via a dicing tape to be integrated, and the wafer transfer bodies are integrated by using wafers of different sizes. From the above, there is provided a wafer protection tape peeling device for performing a peeling process for peeling a protection tape from a wafer, wherein a wafer transfer body of a smaller size is selected from wafer transfer bodies integrated by using wafers of different sizes. In order to perform the peeling process, the wafer has a length that extends to the wafer portion of the small-sized wafer transfer body and the ring frame of the large-sized wafer transfer body in the direction perpendicular to the peeling direction, and the small-sized wafer in the peeling direction. A rectangular central suction table with a width that extends to the wafer part of the transfer body, and a peeling process for large size wafer transfer bodies. In order to ensure that the wafer transfer member is arranged on the outer side of the central suction table in the peeling direction and has a shape corresponding to a wafer portion of the large-sized wafer transfer body which is not supported by the central suction table, and supports the wafer portion. And a supporting table configured to be movable up and down. When the small-sized wafer transfer body is peeled off, the supporting table is lowered and the small-sized wafer transfer body is placed on the central suction table. And performing a peeling process by suction, and when performing the peeling process on the large-sized wafer transfer body, the supporting table is raised to support the large-sized wafer transfer body. Wafer protection tape peeling device. 5. The small-diameter suction section for sucking an outer edge of a wafer portion on the upstream side in the peeling direction of the wafer portion of the small wafer transfer body is formed on the central suction table. Wafer protection tape peeling device. 6. The large-diameter suction portion for sucking the outer edge of the wafer portion on the upstream side in the peeling direction of the wafer portion of the large wafer transfer body is formed on the support table. Wafer protection tape peeling device. 7. The wafer protective tape peeling device according to claim 4, wherein the support table is arranged on both sides of the central suction table on the outer side in the peeling direction. 8. The wafer protective tape peeling device according to claim 4, wherein the support table is arranged on the upstream side in the peeling direction outside the central suction table. .