JP2003156851A - Exposure device and exposure method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an exposure device capable of correcting magnification. SOLUTION: In the exposure device for exposing a pattern formed on a mask on a substrate by scanning the mask with light emitted from a light source, size information on the size of the mask and the size of the substrate in at least two different directions is obtained, then, the direction and distance for the relative movement of the mask and the substrate at exposure and the scanning direction and distance of the light source at exposure are defined based on the size information, then, the mask is scanned with the light emitted from the light source in accordance with the defined scanning direction and distance, and also, the mask and the substrate are relatively moved in synchronism with optical scanning and in accordance with the defined direction and distance with reference to the relative movement.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exposure apparatus that exposes a pattern drawn on a mask onto a substrate, and more particularly to an exposure apparatus that exposes a substrate while correcting the magnification of the pattern drawn on the mask.

[0002]

2. Description of the Related Art Conventionally, an exposure apparatus has been widely known which exposes a circuit pattern on a resist film of a substrate arranged under the mask by irradiating the mask on which the circuit pattern is drawn with light. Such an exposure apparatus is characterized in that the pattern drawn on the mask can be transferred onto the substrate with an accuracy of sub-micron order or less.

By the way, when the circuit pattern is exposed on the substrate with high accuracy as described above, a change in the size of the mask or the substrate due to thermal expansion or the like becomes a factor that hinders the exposure accuracy. Therefore, some exposure apparatuses perform so-called magnification correction at the time of exposure so that the mask pattern can be transferred onto the substrate in an appropriate size even if the size of the mask or the substrate changes due to thermal expansion or the like. is there. Generally, in such an exposure apparatus, an optical system for magnification correction is arranged between the mask and the substrate, and the mask pattern is projected on the substrate while enlarging or reducing the mask pattern to achieve the magnification correction of the mask pattern. There is.

[0004]

However, in so-called proximity exposure in which a mask is arranged in the very vicinity of the substrate, there is no space for arranging the optical system between the mask and the substrate, so that the above magnification The correction method cannot be applied.

In view of the above problems, it is an object of the present invention to provide a method and apparatus capable of correcting the magnification of a pattern exposed on a substrate from a mask without using an optical system for magnification correction.

[0006]

In order to solve the above-mentioned problems, the present invention scans the light from a light source on a mask, and relatively moves the mask and the substrate,
Provided is an exposure apparatus that exposes a pattern drawn on a mask onto a substrate while correcting the magnification.

This exposure apparatus comprises a size information acquisition means, a mask / substrate relative movement control means, a scanning control means, a mask
Substrate relative drive means and light source drive means are provided. The size information acquisition means acquires size information regarding the sizes of the mask and the substrate in at least two different directions.
Further, based on the size information acquired by the size information acquisition means, the mask / substrate relative movement control means determines the relative movement direction and distance of the mask and the substrate during exposure, and the scanning control means determines the scanning direction of the light source during exposure. Determine the distance respectively. Here, the mask / substrate relative movement control means can set magnification corrections of different magnifications in the vertical and horizontal directions of the mask by determining the relative movement directions of the mask and the substrate during exposure.

The scanning direction and the distance determined by the scanning control means are sent to the light source driving means, and the light source driving means scans the light from the light source on the mask according to the information. on the other hand,
The relative movement direction and distance determined by the mask / substrate relative movement control means are sent to the mask / substrate relative drive means, and the mask / substrate relative drive means synchronizes with the light scanning by the light source drive means according to the information. Then, the mask and the substrate are moved relative to each other. As a result, the mask pattern whose magnification is corrected by the magnification set by the mask / substrate relative movement control means is exposed on the substrate.

The light source preferably has a plurality of light emitting elements, each of which emits light to the substrate. Then, in this case, the exposure apparatus further comprises a light source control means for controlling the turning on and off of the light source, and the light source control means, based on the scanning direction determined by the scanning control means, causes the substrate to have a uniform exposure amount. It is preferable to selectively turn on the plurality of light emitting elements so as to be exposed.

The size information acquisition means acquires size information from the board image obtained by photographing the board and the mask image obtained by photographing the mask, and in particular, a reference for alignment in the board image and the mask image. It is preferable to acquire the size information based on the position of the mark.

In the above exposure apparatus, the direction in which the light source scans the mask and the substrate varies depending on the size information of the substrate and the mask and is not constant. For this reason, in order to properly expose the entire surface of the mask and the substrate regardless of which direction the light source is scanned, the light sources are arranged such that the areas where the mask is irradiated with light overlap each other at one end, and the longitudinal direction. It is preferably configured to consist of two squares arranged so that their axes intersect each other. Further, the light source is preferably configured such that the longitudinal axes of the two rectangular portions are substantially parallel to the sides of the substrate so that the distortion of the mask pattern transferred to the substrate is reduced. . Further, the light source is configured such that the lengths of the two rectangular portions in the longitudinal direction are equal to or longer than the lengths of the corresponding sides of the substrate so that the entire surface of the substrate can be exposed by one scanning. preferable.

The light source is preferably a surface light source which can be relatively moved in parallel with the mask near the mask. With such a light source, it is possible to provide a compact exposure apparatus in which the distance between the light source and the mask is short.

In addition to the above exposure apparatus, according to the present invention, by scanning the light from the light source onto the mask,
An exposure method for exposing a pattern drawn on a mask onto a substrate, wherein size information regarding the sizes of the mask and the substrate is acquired in at least two different directions, and the relative size of the mask and the substrate at the time of exposure based on the size information. The movement direction and distance, and the scanning direction and distance of the light source during exposure are determined, and the light from the light source is scanned on the mask according to the determined scanning direction and distance, and is determined in synchronization with the light scanning. An exposure method is provided which is characterized in that a mask and a substrate are moved relative to each other in accordance with the direction and distance of the relative movement.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of an exposure apparatus 100 according to the present invention will be described below with reference to the drawings. The exposure apparatus 100 according to the present embodiment scans the light from the light source on the mask and relatively moves the mask and the substrate to expose the substrate while correcting the magnification of the pattern drawn on the mask.

FIG. 1 is a diagram for explaining the concept of a magnification correction method in the exposure apparatus 100 of this embodiment. In FIG. 1, the mask 20 is arranged in parallel in the vicinity of the substrate 10, and the light source 30 is further arranged thereon. The distance between the substrate 10 and the mask 20 is preferably several microns to several tens of microns. Further, the mask 20 is provided with two light transmitting portions P ₁ and P ₂ at an interval L.

[0016] In this embodiment, respectively moving at a relative speed _{V L} and _{V m} the light source 30 and the mask 20 to the substrate 10 during the exposure. As a result, after the start of exposure, the light transmitting portion P ₁ is _first transferred to the resist layer 12 of the substrate 10 to become the exposed portion R ₁ (FIG. 1A), and then the light transmitting portion P ₂ is transferred to expose the portion R 1. ₂ (FIG. 1 (b)). Since the mask 20 moves relative to the substrate 10 during the exposure, the light transmitting portion P ₂ is δl (= Vm.multidot.l) after the exposure portion R ₁ is exposed and before the exposure portion R ₂ is exposed. δT and δT are moved by the time from the exposure of the exposed portion R ₁ to the exposure of the exposed portion R ₂ ). For this reason, the distance between the exposed portions R ₁ and R ₂ is δl from the distance L between the light transmitting portions P ₁ and P _2.
However, the length becomes (L + δl). That is, the pattern drawn on the mask 20 is enlarged at a magnification of (1 + δl / L) and transferred to the substrate 10. Although not shown, when the mask 20 is moved in the direction opposite to the direction in which the light source 30 moves during exposure, the mask pattern is changed to (1-δl).
/ L).

The exposure apparatus 100 of the present embodiment uses the principle of magnification correction explained in FIG.
Simulate dimensional magnification correction. FIG. 2 is a diagram for explaining the two-dimensional magnification correction of the mask pattern by the exposure apparatus 100 of this embodiment. FIG. 2 shows the top surfaces of the substrate 10 and the mask 20 which are both rectangular. Also,
In FIG. 2, the shape of the area irradiated with light from the light source 30 is shown as a light irradiation area 40. 2A and 2B show the substrate 1 at the start and end of exposure, respectively.
0, the mask 20, and the light irradiation area 40 are shown in a positional relationship. In the following description, the direction parallel to the lower side of the substrate 10 in the drawing is the x direction, and the direction parallel to the left side is the y direction.

In FIG. 2, the substrate 10 has an X-direction length of X and a Y-direction length of Y. On the other hand, the mask 20 is the substrate 1
The length is shorter than 0 by δx in the x direction and δy in the y direction. Therefore, when the pattern drawn on the mask 20 is exposed on the substrate 10, the pattern is x
It is preferable to expand (magnification correction) by δx / X in the direction and δy / Y in the y direction for exposure.

In order to expose the mask pattern while correcting the magnification in the x direction by δx / X according to the principle described with reference to FIG. 1, the mask 20 is moved relative to the substrate 10 by δx in the x direction during exposure, and the light source is used. Light from 30 must be scanned onto the substrate 10 along the x direction. At this time, the region of the light emitted from the light source 30 to the mask and the substrate is such that the longitudinal axis 42a is parallel to the y direction, as indicated by the phantom line region 42 in FIG. It is preferably a rectangle having the same length as the direction width. When the light irradiation area is a rectangle whose longitudinal axis 42a is parallel to the y direction, the mask pattern exposed on the substrate 10 is not distorted in a direction other than the x direction, and the width of the substrate 10 in the y direction is small. This is because the entire substrate 10 can be exposed by a single scan of the light source 30 if the length exceeds.

In the same manner as described above, in order to expose the mask pattern by magnifying (magnification correction) by δy / Y in the y direction according to the principle explained in FIG. 1, the mask 20 and the substrate 10 are δy in the y direction during exposure. Only with relative movement,
The light from the light source 30 must be scanned along the y-direction of the substrate 10. Further, the region of the light emitted from the light source 30 to the mask 20 and the substrate 10 has a longitudinal axis 44a parallel to the x direction as indicated by an imaginary line region 44, and is at least equal to the width of the substrate 10 in the x direction. It is preferably rectangular with a length.

In consideration of the above, the exposure apparatus 100 of the present embodiment moves the mask 20 relative to the substrate 10 at the same time by δx and δy in the x direction and the y direction at the time of exposure, that is, the arrow A in FIG. It was decided to move relative to the direction indicated by. As a result, the exposure apparatus 100 of the present embodiment performs the magnification correction of the mask pattern by x,
It can be achieved with magnifications of δx / X and δy / Y in both y directions.

The light irradiation area 40 is a virtual line area 42.
And a virtual line region 44 are formed. Specifically, the light irradiation region 40 has a longitudinal axis (40
a and 40 b) are arranged so that each of them is substantially parallel to the side of the substrate 10, and two rectangles are formed so as to overlap each other at one end. The lengths of the two rectangles along the longitudinal axis are set to be at least not less than the lengths of the corresponding sides of the substrate 10. Then, the light irradiation area 4
0 is scanned on the mask 20 and the substrate 10 from one end to the other end of the diagonal of the substrate 10 in synchronization with the relative movement of the substrate 10 and the mask 20 during exposure (arrow B in the figure).
reference). As described above, it becomes possible to expose the substrate 10 while correcting the magnification of the pattern drawn on the mask 20 in both the x and y directions.

In FIG. 2, the substrate 10 is shown for convenience of explanation.
The size differences δx and δy between the mask 20 and the mask 20 are drawn extremely large. However, for example, the magnification correction of the mask pattern actually required on the printed circuit board is 20 at the maximum.
It is about 00 ppm. Therefore, in practice, δx, δ
y is extremely small. When the substrate is exposed by the method of the present invention, a part of the substrate indicated by the widths δx and δy in FIG. 2 is directly exposed by the light source without being protected by the mask. The area is extremely narrow. On the other hand, the circuit pattern drawn on the mask is usually drawn a considerable distance inside the end portion of the mask. Therefore, the area of the substrate that is directly exposed by the light source described above overlaps the area where the circuit pattern is exposed, and does not affect the circuit pattern.

FIG. 3 is a view showing the arrangement of the exposure apparatus 100 of this embodiment. The exposure apparatus 100 includes a substrate table 102 that holds the substrate 10 and a substrate table drive unit 104 that moves the substrate table 102 in the x direction in the drawing. The substrate table driving unit 104 includes the substrate table 102.
Is moved to convey and position the substrate 10 to the exposure position.

The exposure apparatus 100 further includes a mask table 106 that holds the mask 20 parallel to the substrate 10, and a mask table drive unit 108 that moves the mask table 106 in a plane parallel to the upper surface of the substrate 10. Have. In this embodiment, the mask table drive unit 108
The distance at which the mask table 106 should be driven is about several microns at the maximum. Therefore, as the mask table driving unit 108, for example, a mechanism that uses a piezoelectric element to move the mask table in the plane can be used.

The exposure apparatus 100 also has an L-shaped surface light source 110 as a light source for exposing the pattern drawn on the mask 20 onto the upper surface of the substrate 10. In the case of the present embodiment, the surface of the surface light source 110 that emits light (the lower surface in FIG. 3) has the light irradiation region 40 described in FIG.
Are configured to have substantially the same shape as Further, the surface light source 110 is arranged near the mask 20 so as to be substantially parallel to the upper surface of the mask 20.
As a result, the area on the mask 20 and the substrate 10 to which the light from the surface light source 110 is irradiated has substantially the same shape as the light irradiation area 40 described in FIG.

In the case of this embodiment, the surface light source 110 includes a plurality of light emitting elements 130 (for example, light emitting diodes that emit ultraviolet rays) and a diffusion plate 134. FIG. 4 shows a surface light source 1.
FIG. 3 is a perspective view schematically showing a part of a light emitting element 130 and a diffusion plate 134 included in 10; The light emitting element 130 is arranged within the surface light source 110, preferably in a plane substantially parallel to the substrate 10.
It is arranged dimensionally. Particularly in this embodiment, the light emitting elements 130 are arranged in a so-called hexagonal close-packed manner. The light 132 emitted from each of the light emitting elements 130 is
As a result of scanning the light irradiation region 40 on the substrate 10 by the diffusion plate 134 disposed between the substrate 30 and the substrate 10, the substrate 10 is diffused so as to be uniformly exposed.

Returning to FIG. 3, the exposure apparatus 100 further has a light source scanning section 112 that holds the surface light source 110 and scans the surface light source 110 in a plane parallel to the upper surface of the substrate 10. In the case of the present embodiment, the light source scanning unit 112 includes a y-direction driving unit 112a that drives the surface light source in the y-direction, and the y-direction driving unit 112a.
By driving the direction driving unit 112a in the x direction, y
The direction driving unit 112 and an x-direction driving unit 112b that drives the surface light source 110 in the x-direction are configured.

The exposure apparatus 100 also has a lighting control section 114 for controlling lighting / non-lighting of the surface light source 110. The lighting control unit 114 lights / lights each light emitting element 130 included in the surface light source 110 according to a command from the control unit 120 described later.
Independently control lights off. Further, the exposure apparatus 100 has a camera 116 that photographs the alignment reference marks provided on the substrate 10 and the mask 20. In the case of the present embodiment, the reference mark for alignment is the substrate 10
And the mask 20 is provided at each of the four corners. Therefore, four cameras 116 are also provided so that the four corners of the substrate 10 and the mask 20 can be photographed respectively.

FIG. 5 is a view for explaining the relationship between the position of the reference mark for alignment provided on the substrate 10 and the mask 20 and the area photographed by the camera 116. In particular, FIG. 5A is a plan view showing a portion where the substrate 10 and the mask 20 are overlapped from the mask side.
(B) is a perspective view of the substrate 10 and the mask 20.

As shown in the figure, the substrate 10 is provided with cross-shaped reference marks 14 at its four corners. In addition, the mask 20 has a circular reference mark 24 at its 4th position.
It is provided at the corner. As shown in FIG. 5A, the reference marks 14 and 24 are such that the cross-shaped reference mark 14 appears in the circular reference mark 24 when the substrate 10 and the mask 20 are vertically stacked. Formed in each position. Each of the cameras 116 captures a circular portion 122 indicated by a broken line, that is, an area including the reference marks 14 and 24.

Returning to FIG. 3, the exposure apparatus 100 further analyzes the image captured by the camera 116 to generate position information indicating the positions of the reference marks on the substrate 10 and the mask 20. Have. In the case of the present embodiment, the position information generating unit 118 determines each of the four reference marks 14 included in the substrate 10 and the four reference marks 24 included in the mask 20 based on the images captured by the four cameras 116. Find the center position.

Further, in the exposure apparatus 100, the substrate table driving section 104, the mask table driving section 108, the light source scanning section 112, the lighting control section 114, and the position information generating section 11 are included.
8 is provided with a control unit 120 for transmitting commands for controlling their operations or for processing information transmitted from them.

Next, the operation of the exposure apparatus 100 having the above structure will be described. FIG. 6 shows the exposure apparatus 10.
It is a flow chart which shows operation of 0. Exposure apparatus 100
Then, when the substrate 10 and the mask 20 are mounted on the substrate table 102 and the mask table 106, respectively, first, the substrate table drive unit 104 and the mask table drive unit 108 respectively follow the commands transmitted from the control unit 120. And the mask table 106 is moved to the initial position (S102). here,
The initial position means a position where the substrate 10 and the mask 20 overlap each other such that the cross-shaped reference mark 14 is located in each of the circular reference marks 24, as shown in FIG. 5A. .

Next, the four cameras 116 capture images in the vicinity of different corners of the substrate 10 and the mask 20, and send the data to the position information generator 118 (S).
104). Next, the position information generation unit 118 specifies the position of the alignment reference mark provided on each of the substrate 10 and the mask 20 from the transmitted image data (S106). In the case of this embodiment, the positions of the reference marks at the four corners of the substrate 10 and the mask 20 are specified, and as a result, eight pieces of position information are obtained. The distances between the four reference marks are the substrate 10 and the mask 20, respectively.
Can be used as a standard for representing the vertical and horizontal sizes of the. Therefore, the obtained eight position information is also information indicating the sizes of the substrate 10 and the mask 20 in the vertical and horizontal directions.

The position information generated by the position information generation unit 118 is transmitted to the control unit 120. The control unit 120 determines the direction, distance, and speed at which the mask 20 should be moved relative to the substrate 10 during exposure, based on the transmitted position information (S108). Specifically, the control unit 120
Is the difference (δx) in length between the substrate 10 and the mask 20 in the x direction from the (eight) position information generated by the position information generation unit 118.
And y-direction length difference δy. Δx and δy obtained as described in FIG. 2 correspond to the distances in which the mask 20 should be moved relative to the substrate 10 in the x direction and the y direction during exposure, and the directions in which the mask 20 should be moved relative to each other. Is shown. The control unit 120 further sets δ
By dividing x and δy by the exposure time δt, the x-direction speed and the y-direction speed at which the mask 20 should be moved relative to the substrate 10 during the exposure are obtained.

Next, the control unit 120 determines the direction, distance, and speed at which the surface light source 110 should be moved relative to the substrate 10 during exposure (S110). Specifically, the control unit 120 controls the substrate 1 generated by the position information generation unit 118.
From the (four) position information regarding the reference mark provided at 0, the length X of the substrate 10 in the x direction and the length Y of the substrate 10 are obtained. X and Y are surface light sources 110 during exposure, respectively.
Corresponds to the distance to be scanned with respect to the substrate 10 in the x direction and the y direction, and also shows the direction to be scanned. Further, the control unit 120 divides X and Y by the exposure time δt to obtain the x-direction speed and the y-direction speed at which the surface light source 110 should be moved relative to the substrate 10 during the exposure.

Next, the control unit 120 determines which of the light emitting elements 130 included in the surface light source 110 should be turned on during scanning (S112). FIG. 7 shows S112.
FIG. 6 is a diagram for explaining a method of determining the light emitting element 130 to be turned on in FIG. In FIG. 7, the upper surface of the surface light source 110 and three straight lines 140, 142, 144 parallel to the scanning direction of the surface light source 110 determined in S108 are drawn. Lines 140 and 144 of the three straight lines are the surface light source 11
In 0, it passes through a portion that extends vertically in the y direction and a portion that extends vertically in the x direction.

In order to uniformly expose the substrate, the exposure time at each place on the substrate must be the same. However, in this embodiment, since the L-shaped surface light source 110 is used, the lengths δw ₁₄₀ and δw that cross the surface light source 110 are straight lines 140 and 144 depending on the scanning direction of the surface light source 110. ₁₄₄ are different, and therefore, when the entire surface light source 110 is turned on, the exposure time becomes a straight line 1.
The location on 40 and the location on the straight line 144 are different.

Therefore, in the present embodiment, only part of the surface light source is turned on in accordance with the scanning direction so that the substrate can be exposed uniformly regardless of the location. The area to be lit is defined as follows. First, a position e where a straight line 142 passing through the central corner f of the L-shaped surface light source and parallel to the scanning direction crosses one side of the surface light source 110 is obtained. When the position e is on the side of the surface light source 110 parallel to the y direction, a line passing through the position e and parallel to the x direction (indicated by a wavy line 146 in the figure).
The light emitting element 130 located in front of the scanning direction is defined as the light emitting element 130 to be turned on. That is, in FIG. 7, the light emitting element 130 to be turned on is determined so that the area of the surface light source 110 excluding the hatched portion 148 emits light. This allows
Length δ on a straight line 140 that crosses the light emitting area of the surface light source 110
and w _140, equal in length .delta.w ^* ₁₄₄ on the line 144, the exposure time becomes equal. The position e is the surface light source 1.
10 is on the side parallel to the x direction, the light emitting element 130 to be turned on is based on a line parallel to the y direction from the position e.
Is determined.

Returning to FIG. 6, the controller 120 then aligns the substrate 10 and the mask 20 (S11).
4). Specifically, the control unit 120 controls the position information generation unit 1
Based on the position information generated by 18, the direction and distance in which the mask 20 should be moved in order to align the positions of the predetermined corners (or reference marks) of the substrate 10 and the mask 20 are obtained. Then, the control unit 120 transmits to the mask table drive unit 108 a command to move the mask table 106 in the obtained direction and distance. As a result, the mask table drive unit 108 causes the mask table 1
Drive 06 to achieve alignment.

Next, the light source scanning unit 112 moves the surface light source 110 to the exposure start position (S116). Further, the control unit 120 sends a command to the lighting control unit 114 to the effect that the surface light source 110 should be turned on. As a result, the lighting control unit 1
14 supplies the surface light source 110 with necessary power, and the surface light source 11
0 turns on the light emitting element 130 (S11
8). The light emitting element 130 to be turned on by the lighting control unit 114 at this time is the light emitting element 130 determined to be turned on in S112.

Next, the light source scanning unit 112 scans the surface light source 110, and in synchronization with the scanning of the surface light source 110, the mask table driving unit 108 moves the mask 20 relative to the substrate 10 to perform exposure. Is performed (S120).
Specifically, the control unit 120 transmits to the light source scanning unit 112 a command to scan the surface light source 110 and to the mask table driving unit 108 to send a command to move the mask table 106. For the command to scan the surface light source 110, the surface light source 11 obtained in S110 is used.
The distance and the speed at which 0 should be moved in each of the x and y directions are included.
Surface light source 11 according to the distance and speed specified by the command
Move 0. Similarly, the command to move the mask table 106 includes the distance and the speed to move the mask 20 in each of the x and y directions obtained in S108.
8 moves the mask table 106 according to the distance and speed designated by the command during exposure.

FIG. 8 is a diagram for explaining relative movement of the surface light source 110 and the mask 20 with respect to the substrate 10 in S118. As shown in FIG. 8A, first, the surface light source 11
0 is arranged such that the corner of the L shape is located on the extension of the diagonal line 16 of the substrate 10, and the two vertically long rectangular portions of the L shape are parallel to the corresponding sides of the substrate. Has been done. Further, the surface light source 110 usually requires a certain approach section to accelerate from the stationary state to the speed obtained in S110. Therefore, the surface light source 110 is arranged at a position separated from the substrate 10 by a distance corresponding to the approach section.

In step S118 described above, the surface light source 110
Starts scanning from the position shown in FIG. On the other hand, the mask 20 has the substrate 1 immediately after the surface light source 110 starts scanning.
Maintain a stationary state with respect to 0 (above, FIG. 8 (b))
reference). The mask 20 has the surface light source 110 shown in FIG.
When the position shown in (c) is reached, relative movement with respect to the substrate 10 is started. Here, the position shown in FIG. 8C means the position of the substrate 10 on the side where the surface light source 110 enters.
This is the position where the surface light source 110 (light irradiation region 40) has passed through one side.

After that, the surface light source 110 and the mask 20 continue scanning and relative movement at the speeds obtained in S110 and S108, respectively. Then, the mask 20 is S10.
When the mask 20 has finished moving the distance defined by 8, the relative movement of the mask 20 ends. On the other hand, the surface light source 110 includes the substrate 10
The scanning is continued at the speed determined in S110 until the object has completely passed the upper side (FIG. 8D), and then stopped.

Returning to FIG. 6, as explained above, S
When the scanning of the light source and the mask are moved by a predetermined distance at 118, the light source scanning unit 112 stops the scanning of the surface light source 110, and the mask table driving unit 108 also stops the driving of the mask table. Further, the lighting controller 114 controls the surface light source 11
0 is extinguished (above, S122). As a result, a series of exposure operations by the exposure apparatus 100 of this embodiment is completed.

Although one embodiment of the present invention has been described above, the exposure apparatus according to the present invention is not limited to the above embodiment, and various modifications can be made to the above embodiment within the scope of the technical idea of the present invention. It is possible to add.

For example, in the above-mentioned embodiment, the case where the surface light source 110 arranged near the mask 20 is used as the light source for exposure has been described, but other means can be used as the light source. For example, while irradiating the substrate 10 and the mask 20 with a light beam from a mercury lamp, a continuous wave or pulse wave laser light source, or an X-ray source through the L-shaped slit, of the slit, the substrate 10, and the mask 20. The technical idea according to the present invention can be implemented by moving any two. In this case, for example, by providing the slit with a sliding type shielding plate, the exposure surface described with reference to FIG. 7 can be adjusted.

Further, in the above embodiment, the exposure apparatus 100.
Includes a camera 116 and a position information generation unit 118, and the control unit 120 controls the position of the mask 20 and the surface light source 110 based on the position information acquired from the position information generation unit 118. The position information generating unit 118 is not provided, and the control unit 120 acquires information corresponding to the position information generated by the position information generating unit 118 from the outside of the exposure apparatus 100 by communication, and based on the information, the mask 20 and the surface light source. The position control of 110 may be performed.

As described above, according to the present invention,
It is possible to provide an exposure apparatus and an exposure method that can correct the magnification of a pattern exposed from a mask on a substrate without using an optical system for magnification correction.

[Brief description of drawings]

FIG. 1 is a diagram illustrating a concept of a magnification correction method in an exposure apparatus according to the present invention.

FIG. 2 is a diagram illustrating two-dimensional magnification correction of a mask pattern by the exposure apparatus according to the present invention.

FIG. 3 is a diagram showing a configuration of an exposure apparatus according to an embodiment of the present invention.

FIG. 4 is a perspective view schematically showing a part of a light emitting element and a diffusion plate included in a surface light source of an exposure apparatus according to an embodiment of the present invention.

FIG. 5 is a diagram illustrating a relationship between positions of alignment reference marks provided on a substrate and a mask and a region captured by a camera.

FIG. 6 is a flowchart showing an operation of the exposure apparatus according to the position embodiment of the present invention.

FIG. 7 is a diagram for explaining a method of determining a light emitting element to be turned on at the time of exposure.

FIG. 8 is a diagram illustrating relative movement of a surface light source and a mask with respect to a substrate in S118.

[Explanation of symbols]

10 substrates 20 masks 30 light sources 100 exposure equipment 102 substrate table 104 substrate table drive unit 106 mask table 108 mask table drive unit 110 surface light source 112 light source scanning unit 116 camera 118 Position Information Generation Unit 118 120 control unit

Continued front page    (72) Inventor Yoshinori Kobayashi             2-36 Maeno-cho, Itabashi-ku, Tokyo Asahikou             Gaku Kogyo Co., Ltd. F-term (reference) 2H097 CA03 CA05 GA45 KA03 KA12

Claims (9)

[Claims] 1. An exposure apparatus that exposes a pattern drawn on the mask onto a substrate by scanning light from a light source onto the mask, wherein size information regarding the sizes of the mask and the substrate in at least two different directions. And a scanning control unit that determines a scanning direction and a distance of the light source at the time of exposure based on the size information, and a relative size of the mask and the substrate at the time of exposure based on the size information. A mask / substrate relative movement control means for determining a moving direction and a distance; a light source driving means for scanning light from the light source onto the mask according to a scanning direction and a distance determined by the scanning control means; and a light source driving means. In synchronization with the scanning of light, the mask / substrate relative movement control means determines the relative movement direction and distance according to the relative movement. Exposure apparatus, characterized in that it comprises a mask substrate relative movement means for relatively moving disk and the said substrate. 2. The light source is configured such that a region where the mask is irradiated with light is composed of two rectangular portions arranged so that one end thereof overlaps each other and longitudinal axes intersect with each other. Claim 1 characterized by the above.
The exposure apparatus according to. 3. The exposure according to claim 2, wherein the light source is configured such that the longitudinal axes of the two rectangular portions are substantially parallel to the sides of the substrate. apparatus. 4. The light source according to claim 3, wherein the lengths of the two rectangular portions in the longitudinal direction are equal to or longer than the lengths of the corresponding sides of the substrate. Exposure equipment. 5. The exposure apparatus according to claim 1, wherein the light source driving means is a surface light source which is relatively moved in parallel with the mask near the mask. 6. A light source control means for controlling turning on and off of the light source is further provided, wherein the light source has a plurality of light emitting elements each for irradiating a substrate with light, and the light source control means is the scanning control means. The exposure apparatus according to claim 1, wherein the plurality of light emitting elements are selectively turned on so that the substrate is exposed with a uniform exposure amount based on the scanning direction defined by. 7. The size information acquiring means acquires the size information from a board image obtained by photographing the board and a mask image obtained by photographing the mask. 1. The exposure apparatus according to 1. 8. The exposure apparatus according to claim 7, wherein the size information acquisition unit acquires the size information based on positions of alignment reference marks in the substrate image and the mask image. 9. An exposure method for exposing a pattern drawn on the mask onto a substrate by scanning light from a light source onto the mask, the size information regarding the sizes of the mask and the substrate in at least two different directions. Obtaining, based on the size information, determine the direction and distance of relative movement of the mask and the substrate during exposure, and the scanning direction and distance of the light source during exposure, according to the determined scanning direction and distance An exposure characterized by scanning the mask with light from the light source and, in synchronization with the scanning of the light, moving the mask and the substrate relative to each other in accordance with the determined relative movement direction and distance. Method.