JP2003154652A - Ink jet head and its manufacturing method, ink jet recorder and its manufacturing method, apparatus for manufacturing color filter and manufacturing method therefor, and apparatus for manufacturing electroluminescence substrate and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an ink jet head which has the small number of parts, is simple in the structure and made small and light-weight. SOLUTION: The ink jet head is provided with a plurality of nozzle holes 4, independent discharge chambers communicating with each of nozzle holes 4, and energy generating elements for applying a discharge energy to ink within discharge chambers. There are provided a line-shaped nozzle plate 3 having a plurality of nozzle holes 4 formed thereto, and a plurality of chips 100 having discharge chambers and energy generating elements formed thereto. The plurality of chips 100 are set into a line to the nozzle plate 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inkjet head having a plurality of nozzles in a printing direction, a method for manufacturing the same, an inkjet recording apparatus and a method for manufacturing the same, a manufacturing apparatus for a color filter and a method for manufacturing the same, and an electroluminescent substrate. The present invention relates to a manufacturing device and a manufacturing method thereof.

[0002]

2. Description of the Related Art In recent years, recording devices have been required to print at high speed. However, in the conventional method of scanning the head in the print line direction, when the number of recording elements is large, the mass of the head also increases, so the load on the head scanning mechanism also increases, and there is a limit to increasing the number of recording elements. . Therefore, a so-called line type inkjet head has been devised in which a large number of recording elements are arranged in the print row direction at the same intervals as the printing resolution and printing is performed by a fixed head.

As an example of such a line type ink jet, there is an ink jet recording head disclosed in JP-A-11-20168. In the ink jet head of the publication, a grooved member having a groove forming an ejection port and an ink flow path is joined to an element substrate provided with an energy generating element. From the viewpoint of the yield of the element substrates, the element substrates are not integrally manufactured, but a plurality of small element substrates are formed and the element substrates are arranged and fixed on the base.

When a plurality of element substrates are fixed side by side, it is difficult to surely fix the adjacent element substrates in close contact with each other, and a gap is generated between the element substrates. for that reason,
At the boundary between the element substrates, if the grooved member is not joined so that the wall between the grooves of the grooved member straddles the two element substrates, ink will leak from between the element substrates. Therefore, in this publication, the wall between the grooves of the grooved member is arranged so as to straddle two adjacent element substrates, and in order to minimize the adverse effect of this gap, the groove wall corresponding to the gap is not It is set longer than the groove wall.

[0005]

However, the above-mentioned conventional ink jet head requires a base body for assembling them side by side in addition to the nozzle actuators constituting the ink jet head. For this reason,
There are problems that the number of parts increases, the structure becomes complicated, and the head becomes heavy.

Further, since it is necessary to dispose the wall between the grooves of the grooved member so as to straddle two adjacent element substrates,
There is a problem that precision is required during assembly and assembly is difficult.

The present invention has been made to solve the above problems, and an object of the present invention is to provide an ink jet head having a small number of parts, a simple structure, and a compact and lightweight head. Moreover, it aims at providing the manufacturing method of this inkjet head. Further, another object is to obtain a recording apparatus using the ink jet head and a manufacturing method thereof, a color filter manufacturing apparatus and a manufacturing method thereof, and an electroluminescent substrate manufacturing apparatus and a manufacturing method thereof.

[0008]

(1) An inkjet head according to one aspect of the present invention includes a plurality of nozzle holes,
A line-shaped nozzle plate in which the plurality of nozzle holes are formed, comprising an independent ejection chamber communicating with each of the nozzle holes, and an energy generating element for giving ejection energy to ink in the ejection chamber. A plurality of chips on which the discharge chamber and the energy generating element are formed, and the plurality of chips are arranged in a line on the nozzle plate. In the present invention, the line-shaped nozzle plate is a component of the actuator of the inkjet head and also has the function of the substrate as a structure. Therefore, a separate substrate as a structure is not required. It should be noted that examples of the energy generating element include, in addition to the pressure generating element described later, a heater board for heating the ink in the ejection chamber.

(2) An inkjet head according to another aspect of the present invention is the inkjet head of the above (1), in which the nozzle plate is formed of a silicon substrate. In the present invention, by forming the nozzle plate from the silicon substrate, the nozzle holes can be collectively formed by the photolithography process, and the positional accuracy of the nozzle holes can be extremely increased.

(3) An inkjet head according to another aspect of the present invention is the inkjet head of the above (1), in which the nozzle plate is formed of a stainless substrate.

(4) In an ink jet head according to another aspect of the present invention, a plurality of nozzle holes, an independent ejection chamber communicating with each of the nozzle holes, and energy generation for giving ejection energy to ink in the ejection chamber. A plurality of chips in which the plurality of nozzle holes and the ejection chamber are formed, and a line-shaped substrate on which an energy generating element that gives ejection energy to ink in the ejection chamber is formed. And a plurality of chips arranged in a line on the substrate. In the present invention, the linear substrate is a component of the actuator of the inkjet head and also has the function of the substrate as a structure. Therefore, a separate substrate as a structure is not required.

(5) An ink jet head according to another aspect of the present invention is the ink jet head according to any one of the above (1) to (4), in which the energy generating element is used to generate a pressure that causes a pressure change that causes an ink droplet to fly to the ejection chamber. It is an element. Examples of the pressure generating element include one using a later-described electrostatic force and one using a piezoelectric element.

(6) An ink jet head according to another aspect of the present invention is the same as the ink jet head of the above (5), wherein the pressure generating element is a diaphragm formed on at least one wall of the discharge chamber, and a drive voltage It is configured to include an electrode that deforms the vibration plate by an electrostatic force when applied.

(7) An ink jet head according to another aspect of the present invention is the ink jet head according to any one of the above (1) to (6), which is a face type ink jet head for ejecting ink droplets from the surface of the substrate. It is what

(8) An inkjet head according to another aspect of the present invention is the inkjet head of the above (7), in which the nozzle plate has an ink reservoir.

(9) An ink jet head according to another aspect of the present invention is the ink jet head of the above (1) to (6), which is an edge type ink jet head for ejecting ink droplets from the end portion of the substrate. It is a feature.

(10) In a method for manufacturing an ink jet head according to one aspect of the present invention, a plurality of nozzle holes, an independent ejection chamber communicating with each of the nozzle holes, and ejection energy to the ink in the ejection chamber are applied. In a method of manufacturing an inkjet head including an energy generating element for giving, a step of forming a linear nozzle plate in which the plurality of nozzle holes are formed, and a plurality of discharging chambers and a plurality of energy generating elements formed It comprises a step of forming chips and a step of linearly installing the plurality of chips on the nozzle plate.

(11) An inkjet head manufacturing method according to another aspect of the present invention is the same as the inkjet head manufacturing method of (10) above, wherein a silicon substrate is used for the nozzle plate, and the silicon substrate is processed by photolithography. It is characterized in that the plurality of nozzle holes are formed. In the present invention, the nozzle holes can be collectively formed on the silicon substrate by photolithography, and the positional accuracy of the nozzle holes can be made extremely high.

(12) In a method of manufacturing an ink jet head according to another aspect of the present invention, a plurality of nozzle holes, an independent ejection chamber communicating with each of the nozzle holes, and ejection energy to the ink in the ejection chamber. In a method of manufacturing an inkjet head including an energy generating element that provides energy, a step of forming a plurality of chips in which the plurality of nozzle holes and the ejection chamber are formed, and energy generation that imparts ejection energy to ink in the ejection chamber It comprises a step of forming a line-shaped substrate on which elements are formed, and a step of installing the plurality of chips on the substrate in a line shape.

(13) An ink jet head manufacturing method according to another aspect of the present invention is the ink jet head manufacturing method according to the above (12), wherein a glass substrate is used as the substrate, and the glass substrate is subjected to photolithography. It is characterized in that an energy generating element forming portion is formed.

(14) An ink jet recording apparatus according to one aspect of the present invention is equipped with the ink jet head according to any one of the above (1) to (9). In the present invention, printing can be performed by merely feeding the recording paper without moving the inkjet head in the width direction of the recording paper, so that the printing speed can be extremely increased.

(15) The method for manufacturing an ink jet recording apparatus according to one aspect of the present invention is the above (10) to (1).
An inkjet head is manufactured by any one of the inkjet head manufacturing methods of 3), and the inkjet head is mounted.

(16) An apparatus for manufacturing a color filter according to one aspect of the present invention is equipped with any one of the ink jet heads (1) to (9).

(17) In a method of manufacturing a color filter manufacturing apparatus according to one aspect of the present invention, an inkjet head is manufactured by the inkjet head manufacturing method according to any one of (10) to (13) above, and the inkjet head is manufactured. It is equipped with a head.

(18) An electroluminescent substrate manufacturing apparatus according to one aspect of the present invention is equipped with any one of the inkjet heads (1) to (9).

(19) The method for manufacturing an electroluminescent substrate manufacturing apparatus according to one aspect of the present invention, comprises the steps (10) to (1) above.
An inkjet head is manufactured by any one of the methods 3) for manufacturing an inkjet head, and the inkjet head is mounted.

[0027]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiment 1. (Regarding Configuration) FIG. 1 is an explanatory diagram of the overall configuration of the first embodiment of the present invention. The present embodiment relates to an electrostatic drive type inkjet head. As shown in FIG. 1, a first third substrate (nozzle plate) having nozzle holes 4 is used to form an inkjet actuator. A head chip 100 composed of a substrate 1 and a second substrate is arranged in a line and joined.

More specifically, the standard resolution of a commercial printer is 360 dpi (dot per inc).
In (h), six head chips 100 each having 256 protruding chambers per chip are arranged in parallel to form a line head unit having 1536 nozzles and 4.3 inches. This line inkjet head is mounted in, for example, a line printer for ticket printing.

Each head chip 100 has an FPC (Flexible Printed) having a driving driver 102.
Wiring is implemented by a circuit board 103.

FIG. 2 is an exploded perspective view showing a part of the line head unit of the first embodiment in section. In this embodiment, an example of a face inkjet type in which ink droplets are ejected from nozzle holes provided on the surface of the substrate will be described. FIG. 3 is a cross-sectional side view of the assembled whole device, and FIG.
FIG. 4 is a view taken along the line AA of FIG.

The ink jet head of this embodiment is bonded to a first substrate having an ink flow path, a second substrate having electrodes to be bonded to the lower side of the first substrate, and an upper side of the first substrate. It is configured by joining three substrates, that is, a long third substrate having nozzle holes formed therein. The configuration of each substrate will be described below.

The first substrate 1 is made of a silicon substrate having a crystal plane orientation (110), and the silicon substrate has a recess 12 which constitutes a discharge chamber 6 having a diaphragm 5 as a bottom wall.
A narrow groove 1 provided at the rear of the recess 12 for inflowing ink
3 and a recess 14 which constitutes a common ink reservoir 8 for supplying ink to each ejection chamber 6.

Second substrate 2 bonded to the lower surface of first substrate 1
Is made of Pyrex (registered trademark) glass, and the electrode 2
A recess 25 for mounting 1 is formed. By providing the recess 25, a gap G (see FIG. 3) is formed between the first substrate and the diaphragm 5 when the first substrate is bonded. An electrode 21, a lead portion 22 and a terminal portion 23 are mounted inside the recess 25.

The electrode 21 is made of ITO 0.1 μm in the recess 25.
m is sputtered to form an ITO pattern, and gold is sputtered only on the terminal portion 23 for bonding.

A long third member bonded to the upper surface of the first substrate 1.
A silicon substrate is used as the substrate 3, and nozzle holes 4 are provided on the surface of the third substrate 3 so as to communicate with the respective recesses 12 of the first substrate 1.

Next, an outline of the operation of the ink jet head configured as described above will be described (see FIG. 3). When a pulse voltage is applied to the electrode 21 by the drive circuit 102 and the surface of the electrode 21 is positively charged, the lower surface of the corresponding diaphragm 5 is negatively charged. Therefore, the diaphragm 5 is bent toward the electrode 21 by the electrostatic attraction.

Next, when the electrode 21 is turned off, the diaphragm 5
Restore. Therefore, the pressure in the ejection chamber 6 rapidly rises, and the ink droplets 104 are ejected from the nozzle holes 4 toward the recording paper 105. Next, the vibration plate 5 bends downward again, so that the ink 106 is replenished from the ink reservoir 8 into the ejection chamber 6 through the narrow groove 13. Thus, the vibrating plate 5 and the electrode 21 function as a pressure generating element that gives a pressure change that causes ink droplets to fly to the ejection chamber 6, and more generally, as an energy generating element that gives ejection energy to the ink in the ejection chamber. It is functioning.

In the ink jet head constructed as described above, the third substrate 3 also serves as a substrate as a structure, so that a separate substrate as a structure is not required. Therefore, the number of parts is small, the structure is extremely simple, and the size and weight are reduced.

(Regarding Manufacturing Method) Next, a method of manufacturing the ink jet head having the above-described structure will be described. As described above, the inkjet head is manufactured by joining the three substrates that compose the inkjet head. Therefore, first, a method for manufacturing each substrate will be described.

FIG. 5 is an explanatory view of the method for manufacturing the first substrate 1. A thermal oxide film 33 is formed by wet oxidation on a substrate 31 made of a single crystal silicon wafer having a plane orientation (110) and a thickness of 140 μm (FIG. 5A), and both surfaces of the substrate are thermally oxidized with a hydrofluoric acid aqueous solution by photolithography. The film 33 is etched to form the ejection chamber 6, the ink reservoir 8, and the narrow groove 13.
Pattern each shape. (FIG.5 (b)).

When this substrate 31 is etched with a 35% aqueous potassium hydroxide solution at 80 ° C., the partition walls are vertically etched due to the anisotropy of the etching of the silicon single crystal, and the discharge chamber 6, the ink reservoir 8 and the narrow groove 13 are etched. Is formed. (FIG.5 (c)).

After the etching is completed, a thermal oxide film 33 having a thickness of 0.1 μm is formed by dry oxidation. Since the thermal oxide film 33 formed on the flow path surface is hydrophilic, it serves to improve the filling property of the ink into the flow path. (Fig. 5
(D)).

Next, a method of manufacturing the second substrate 2 will be described with reference to FIG. Chromium and gold are deposited on the glass substrate 35 by sputtering to serve as an etching mask. Then, it is etched with hydrofluoric acid to form a recess 25 which becomes a gap (FIG. 6).
(A)). Next, ITO is sputtered in the recess 25 by 0.1 μm to form an ITO pattern to form the electrode 21, and gold is sputtered only on the terminal portion 23 for bonding (FIG. 6B).

Finally, a method of manufacturing the third substrate will be described with reference to FIG. A thermal oxide film 39 is formed by wet oxidation on a substrate 37 made of a single crystal silicon wafer (see FIG. 7).
(A)), the thermal oxide film 39 is etched on both surfaces of the substrate by photolithography with an aqueous solution of hydrofluoric acid to form the discharge holes 4
And the ink supply port 27 is patterned (FIG. 7).
(B)).

The ejection holes 4 are formed by anisotropically etching this substrate. (FIG.7 (c)). After the ejection holes 4 are formed, the line size is diced.

Next, a method of assembling the line head unit will be described with reference to FIG. The first substrate 1 and the second substrate 2 are 3
It is heated to 80 ° C., silicon (first substrate 1) is connected to an anode, a glass substrate (second substrate 2) is connected to a cathode, and an electrode of 800 V is added to perform anodic bonding (FIG. 8A).

A good quality head chip 100 in which the first substrate 1 and the second substrate 2 are bonded is placed side by side on the line-shaped third substrate. At this time, positioning is performed while performing optical measurement. In this positioning, if the nozzle holes 4 of the third substrate 3 are arranged so as to communicate with the ejection chambers 6, then at least problems such as ink leakage will not occur. That is, there is no need for delicate positioning such that the wall between the grooves of the grooved member is arranged so as to straddle two adjacent element substrates, as shown in the conventional example. When the positioning of all head chips 100 is completed,
The head chip 100 and the third substrate 3 are bonded (see FIG. 8).
(B)).

After the ink jet head is assembled as described above, the drive circuit 102 is connected between the first substrate 1 and the terminal portion 23 of the second substrate 2 by the wiring 101, respectively, and the ink jet recording apparatus (to be described later) ( Alternatively, a color filter manufacturing apparatus, an electroluminescent substrate manufacturing apparatus) is configured.

As described above, according to the present embodiment, the positional relationship between each head chip 100 and the third substrate 3 (nozzle plate) does not require delicate positioning as in the conventional case, and the manufacturing is easy. Become. Moreover, since the third substrate 3 is composed of a long single substrate and the nozzle holes 4 are collectively formed by a photolithography process, the positional accuracy of the nozzle holes 4 is extremely high and the error is about several microns. Yes,
Almost no pitch deviation between nozzle holes.

Embodiment 2. (Regarding Configuration) FIG. 9 is an explanatory diagram of the overall configuration of the electrostatic drive type line head unit according to the second embodiment.
The same or corresponding parts as those in FIGS. 1 to 8 showing the first embodiment are designated by the same reference numerals. In the present embodiment, in the edge type inkjet head, the linear nozzle plate 41 is used as a substrate as a structure. That is, the line head unit is configured by arranging the head chips 100 composed of the three substrates 1, 2 and 3 in parallel with the line-shaped nozzle plate 41 and joining them.

FIG. 10 is an exploded perspective view of the head chip 100 alone, and FIG. 11 is an explanatory view of the structure and driving principle of the electrostatic drive type ink jet head. In the present embodiment, as in the first embodiment, six head chips 100 having 256 nozzles per head are provided at a standard resolution of 360 dpi (dot per inch) for commercial printers. By arranging them in parallel, a 1536 nozzle, 4.3-inch line head unit is configured.

As shown in FIGS. 10 and 11, each head chip 100 has a flow channel substrate 1 made of silicon single crystal (corresponding to the first substrate 1 of the first embodiment) and an electrode glass made of borosilicate glass. Substrate 2 (second substrate 2 of the first embodiment
And a cover glass 3 (corresponding to the third substrate 3 of the first embodiment) are laminated. In the flow path substrate 1,
The ejection chamber 6, the vibration plate 5, and the ink reservoir 8 are formed, and each ejection chamber 6 is separated by a partition wall 42. Then, by covering the upper surface of the flow path substrate 1 with the cover glass 3 in which the nozzles 44 and the orifices 46 are formed, a flow path is formed.

A gap G and an individual electrode 21 are formed on the electrode glass substrate 2, and a seal 43 is provided to prevent foreign matter from entering the gap G. further,
An ink supply hole 27 is provided at a position avoiding the individual electrode 21, and the ink 106 is supplied from the ink supply hole 27 to the ink-ink reservoir 8.

A plurality of head chips 100 configured as described above are arranged in a line as shown in FIG.
The line head unit is configured by being joined to the nozzle plate 41 which also serves as a substrate as a structure.

The operation of the line head unit configured as above will be described. At the time of driving, a voltage is applied to the common electrode 45 and the individual electrode 21 provided on the flow path substrate 1 to generate an electrostatic attractive force between the vibrating plate 5 and the individual electrode 21 to attract the vibrating plate 5 to the individual electrode 21. The ink 106 is filled into the ejection chamber 6 from the ink reservoir 8 (see FIG. 11).
(B)). At the time of ejection, the voltage is removed, and the spring force of the vibration plate 5 ejects the ink 106 from the nozzle hole 4 via the nozzle 44 (FIG. 11C).

(Regarding Manufacturing Method) FIGS.
FIG. 6 is an explanatory diagram of a manufacturing process of each head chip 100.
First, a manufacturing method of the flow path substrate 1 through which the ink passes is described with reference to FIG.
It will be described based on 2. Surface orientation (110), thickness 140
A high concentration of boron (about 5 × 10 ¹⁹ c) is formed on the lower surface of the substrate 47 made of a single-crystal silicon wafer having a thickness of 0.8 μm.
m ⁻³ or more) diffuses to form a boron layer 49 (FIG. 12A)
After that, the thermal oxide film 51 is formed by wet oxidation, and the both surfaces of the substrate are etched by photolithography with a hydrofluoric acid aqueous solution to pattern the ejection chamber shape, the reservoir shape, and the ink supply hole shape. (Fig. 1
2 (b)).

When this substrate 47 is etched with a 35% aqueous potassium hydroxide solution at 80 ° C., the partition walls are vertically etched to form the ejection chamber 6 due to the anisotropy of the etching of the silicon single crystal, and at the same time, the ink reservoir 8 is formed.
Is also formed. When the etched surface reaches the high-concentration boron layer 49, the solubility in the potassium hydroxide aqueous solution changes, the etching rate decreases, and the diaphragm 5 having a uniform thickness is formed. Since the boron layer 49 in the ink supply hole 27 portion is etched from the beginning, it penetrates the ink reservoir 8 (FIG. 12C).

After the etching is completed, a thermal oxide film 51 having a thickness of 0.1 μm is formed by dry oxidation to form an insulating film on the lower surface of the diaphragm. Since the oxide film formed on the flow path surface is hydrophilic, it functions to improve the filling property of the ink into the flow path. After forming the thermal oxide film 51, a part of the thermal oxide film 51 is removed by dry etching, and platinum is sputtered to form the common electrode 45 (FIG. 12).
(D)).

Next, a method of manufacturing the electrode glass substrate 2 will be described with reference to FIG. Chromium and gold are sputtered onto a borosilicate glass substrate to form an etching mask. 3000
The borosilicate glass substrate is etched with hydrofluoric acid to a depth of angstrom to form a step 25 that serves as a gap (FIG. 13A). The ITO film, which is a transparent electrode, is sputtered to a thickness of 0.1 μm, and then patterned into the shape of the individual electrode 21. After patterning, the ink supply hole 27 is opened with a diamond drill (FIG. 13B).

Next, a method of manufacturing the cover glass 3 will be described with reference to FIG. Chromium and gold are deposited on the borosilicate glass substrate to be the cover glass 3 by sputtering, the pattern of the nozzles 44 and the orifices 46 is patterned, and then anisotropic dry etching is performed vertically to form the nozzles 44 at a depth of 20 μm. The orifice 46 is formed.

The manufacturing method of the nozzle plate 41 is similar to that of the first embodiment.

When the four substrates forming the line head are formed as described above, these are joined to form the line head. First, the three substrates 1, 2, and 3 are stacked and anodically bonded, and the bonded body is cut by dicing to form the head chip 100.

After the head chips 100 are formed, they are arranged in a line and joined to the nozzle plate 41 to form a line head. At this time, as shown in FIG. 15, since the opening of the nozzle 44 is set larger than the nozzle hole 4 of the nozzle plate 41, the nozzle plate 4
When the 1 and the head chip 100 are arranged, it is only necessary that the nozzle holes 4 of the nozzle plate 41 fit within the openings of the nozzles 44, and it is not necessary to perform advanced alignment.

Finally, as shown in FIG. 16, an ink supply mount 53 having an ink supply path 52 is joined. Line head 1 is mounted on a stainless steel mount 53.
10 is arranged and fixed to the mount 53 and seals the periphery of the ink supply hole 27.
The seal groove 57 is filled with a silicone-based sealant from the bottom through the seal hole 55. The silicone-based sealant is used here to prevent cracking of the head chip 100 due to thermal stress or the like generated between the stainless mount 53 and the glass head chip 100. After the fixing of the line head unit 110 is completed, the FPC mounting is performed.

In the above first and second embodiments,
An example in which a silicon substrate is used as the nozzle plate has been shown, but the present invention is not limited to this, and a stainless substrate may be used, for example.

Third Embodiment FIG. 17 is an explanatory diagram of the overall configuration of an electrostatic drive type line head unit according to a third embodiment of the present invention, and the same or corresponding parts as those in the first and second embodiments are designated by the same reference numerals. . In the present embodiment, the glass electrode substrate 2 forming the inkjet actuator is formed in a line shape, and the glass electrode substrate 2 is formed.
Is also functioned as a substrate as a structure.
That is, a plurality of head chips 1 formed by stacking the flow path substrate 1 and the cover glass 3 on the linear glass electrode substrate 2
00 is lined up and joined to form a line head unit.

The mount 53 shown in FIG. 17 constitutes an ink flow path similarly to the second embodiment, and instead of this, an ink supply pipe is provided for each head chip 100 as in the first embodiment. You may make it connect.

The structure and manufacturing method of the ink jet head are the same as those of the first embodiment for the face type and the same as those of the second embodiment for the edge type, and therefore the description thereof is omitted here.

Fourth Embodiment (Embodiment of Printing Apparatus) FIG. 18 is an external perspective view of a printing apparatus which is Embodiment 4 of the present invention. Further, FIG. 19 shows a schematic configuration of main components of the printing apparatus shown in FIG. The printing apparatus 150 is equipped with the line inkjet head 151 described in the first to third embodiments.

The configuration of the printing device 150 will be described. The printing device 150 includes a line inkjet head 151 arranged so as to include a recording range, and the recording paper 6 via a recording position by the line inkjet head 151.
4, a feed mechanism 155 including a paper pressing roller 153 that presses the recording paper 64, and an ink supply mechanism 157 including an ink pipe 156 that supplies ink to the line inkjet head 151. (Mainly refer to FIG. 19).

The ink supply mechanism 157 includes an ink tank for storing the ink, an ink circulation pump mechanism for collecting the ink at the same time as sending it to the line ink jet head 151, an ink tank, and the ink circulation pump mechanism and the line ink jet head 151. And an ink pipe 156 connected to the ink supply mechanism 15
It is housed in the housing part 158 (see FIG. 18) of No. 7.

The printing apparatus 150 has a configuration including a control circuit portion in addition to the above configuration. The control circuit portion drives and controls the line inkjet head 151, the transport mechanism 155, and the ink supply mechanism 157, and also controls the scanner and
Receives and transmits data with host devices such as networks.

In the printing apparatus 150 configured as described above, ink droplets are ejected from the line ink jet head 155 at appropriate times according to the conveying speed of the recording paper 64 to print characters or images on the recording paper 64. . That is, the transport mechanism 15
The rotation angle and speed of the feed roller 154 are detected by a detection mechanism (not shown) attached to the ink jet printer 5, and the control unit controls the drive timing of the head in accordance with the detected transport speed, and the ink is fed from the line inkjet head. Is discharged to perform printing. As a result, clear printing can be performed at high speed.

According to the present embodiment, printing can be performed only by feeding the recording paper 64 without moving the ink jet head in the recording paper width direction, so that the printing speed can be extremely increased. Moreover, the structure of the apparatus can be simplified, the manufacturing can be simplified, and high-speed printing can be realized without complicating the drive circuit.

Embodiment 5. As a fifth embodiment of the present invention, a color filter manufacturing apparatus equipped with the inkjet heads of the above-described first to third embodiments will be described.

When the inkjet heads of Embodiments 1 to 3 described above are applied to a color filter manufacturing apparatus, in order to match the resolution of the inkjet head and the pixel pitch of the color filter, the inkjet head is mounted on the color filter substrate. Are arranged diagonally and are used with matching pixel pitches, which will be described with reference to FIG.

FIG. 20 is a view of the state in which the pixels of the color filter are colored by the ink jet head, as seen from above, and for the ink jet head, only the positions of the nozzle rows are shown. In addition, a state in which a portion to be colored red in the determined pattern is colored is shown. It should be noted that R, which is drawn in each pixel in FIG.
The letters G and B indicate that each pixel is colored red (R), green (G), and blue (B).

The nozzle row 310 is formed in the ink jet head, and ink is ejected from this to form ink dots on the substrate. The pixel (filter element) 311 of the color filter is a portion where ink dots are formed on the substrate.

In the example of FIG. 20, since the pixel pitch P1 of the color filter and the nozzle pitch P2 of the ink jet head do not match, the heads are tilted by the angle θ, and the heads of the same color are arranged every three in the Y direction. By aligning the position of the pixel with the position of the ink ejected from every five nozzles and forming an ink dot in the pixel 311 while moving the inkjet head relatively in the X direction in the drawing, Color it. This is performed by an inkjet head that ejects red, green, and blue inks to manufacture a color filter. Therefore, in the inkjet head for coloring the red pixels shown in this figure, the second, seventh, and twelfth nozzles counting from the lower right discharge.
Do not eject other nozzles.

In this example, a general inkjet head having a nozzle pitch of 360 dpi (70.5 μm) is used as the inkjet head. In addition, as the color filter, an interval of 100 μm between pixels is shown.

When the color filter is used as an optical element for full-color display, R, G, and B are 3
One pixel is formed by using the color filter element as one unit, and the filter element array includes, for example, the trip array shown in FIG.
The mosaic arrangement shown in FIG. 1 (b) and the delta arrangement shown in FIG. 21 (c) are known. The stripe array is
This is a color scheme in which all columns of the matrix have the same color. The mosaic array is a color arrangement in which any three filter elements arranged in a vertical and horizontal straight line have three colors of R, G, and B. In the delta arrangement, the filter elements are arranged in different stages so that any three adjacent filter elements have R,
It is a color combination of three colors G and B.

FIG. 22 is a diagram showing an outline of an apparatus for manufacturing a color filter equipped with the ink jet head of the above embodiment. The calculation unit 400 generates and outputs a drawing image (arrangement pattern of pixels of the color filter) 401 and a nozzle switching signal 402. The drawn image (color filter pixel array pattern) 401 is printed on the substrate 50.
It is data showing the relative positional relationship of each ink dot to be formed on 0. The nozzle switching signal 402 instructs switching of the nozzle corresponding to each point of the pixel of the color filter. It should be noted that a specific method of switching the nozzle group is shown in FIG.
Describing with 0, first, 2, 7, counting from the right
Supposing that the 12th nozzle group is used, the next is the 3, 8 and 13th nozzle groups, and the next is the 4, 9 and
It is easy to set the 14th nozzle group to the forward feed,
Other methods are also acceptable.

Further, the switching of the nozzle group is to be sequentially performed when the life of the nozzle currently used is over.
The life of the nozzle is determined, for example, based on the usage time of one nozzle group, and when the usage time of one nozzle group reaches a predetermined time, it is determined that the life has expired.

The drawing data generator 403 associates each pixel on the substrate with the nozzle in accordance with the nozzle switching signal 402 to generate drawing data which is data of the absolute position of each ink dot on the substrate. At this time, when the nozzles are switched, the change in the positions of the nozzles before and after the switching is calculated from the known data regarding the nozzle arrangement, and the position of the stage 408 at the time of forming each ink dot before and after the nozzle switching is correspondingly changed. Change.

The driver 404 follows the drawing data
Inkjet head 405, feeding devices 406 and 407
Are driven to form ink dots on the substrate 500 according to the drawing data. Inkjet head 405
Includes a red head 405a for ejecting red ink, a green head 405b for ejecting green ink, and a blue head 405c for ejecting blue ink. The feeding devices 406 and 407 move the position of the stage 408 in the X direction and the Y direction, respectively, in response to a signal from the driver 404. The stage 408 holds the substrate 500 to be colored. With the above configuration, the drawing image 40 is formed on the substrate 500.
A drawing pattern corresponding to 1 is generated.

In this embodiment, the change in the positional relationship between the substrate and the drawing head, which corresponds to the nozzle position shift amount due to the nozzle switching, is estimated from the known data regarding the nozzle arrangement of the nozzles. And so on
The positional relationship of the ink dots formed by each nozzle may be actually measured.

FIG. 23 is a diagram schematically showing the process of manufacturing a color filter by the color filter manufacturing apparatus of the above-described Embodiment 4 in process order.

(A) First, as shown in FIG. 23A, the partition walls 506 are formed on the surface of the mother substrate 512 by a resin material having no light-transmitting property in a grid pattern as viewed in the direction of arrow B. The lattice hole portion 507 of the lattice pattern is a region where the filter element 503 is formed, that is, a filter element region. The planar dimension of each filter element region 507 formed by the partition wall 506 when viewed in the direction of arrow C is, for example, 30 μm × 1.
It is formed to have a thickness of about 00 μm.

The partition wall 506 is formed in the filter element region 5
It also has the function of blocking the flow of the filter element material supplied to No. 07 and the function of the black matrix. Further, the partition wall 506 is formed by an arbitrary patterning method, for example, a photolithography method, and further heated by a heater and fired if necessary.

(B) After forming the partition wall 506, FIG.
As shown in FIG.
Each filter element region 507 is filled with the filter element material 513 by supplying 8 to each filter element region 507. In FIG. 23 (b), reference numeral 513R indicates a filter element material having an R (red) color, reference numeral 513G indicates a filter element material having a G (green) color, and reference numeral 513B indicates a B element.
Figure 3 shows a filter element material with a (blue) color.

(C) When each filter element region 507 is filled with a predetermined amount of filter element material, the heater heats the mother substrate 512 to, for example, about 70 ° C. to evaporate the solvent of the filter element material. Due to this evaporation, the volume of the filter element material 513 is reduced and flattened as shown in FIG. When the volume is drastically reduced, the supply of droplets of the filter element material and the heating of the droplets are repeated until a sufficient film thickness is obtained for the color filter. By the above processing, only the solid content of the filter element material remains and is finally formed into a film, whereby each desired color filter element 503 is formed.

(D) With the above, the filter element 5
After 03 is formed, a heating process is performed at a predetermined temperature for a predetermined time in order to completely dry the filaments 503. After that, a protective film 504 is formed as shown in FIG. 23D by using an appropriate method such as a spin coating method, a roll coating method, a ripping method, or an inkjet method. This protective film 504 is
It is formed to protect the filter element 503 and the like and to planarize the surface of the color filter 501.

As described above, according to the fifth embodiment, it is possible to apply the color filter materials of the three additive primary colors at one time in the process, and the color filter material is discharged directly to the filter element, which is wasteful. It does not consume to. Therefore, the yield can be improved, and a color filter manufacturing apparatus with good cost performance can be obtained. In particular, since it can be produced at a cost much lower than that of the conventional method, it is possible to obtain a color filter having good cost performance in consideration of the cost of the inkjet head. Further, the color filter material is not wasted, which is good for the environment.

Embodiment 6. In the sixth embodiment, an organic EL device using the inkjet head of the above-described embodiment
A procedure for producing an organic EL substrate by the substrate manufacturing apparatus will be described. The organic EL substrate manufacturing apparatus in this case is the color filter manufacturing apparatus described in the fifth embodiment (see FIG. 2).
Since most of the configuration of 2) can be applied, the illustration of the configuration is omitted.

FIG. 24 is a diagram showing the main steps of the method for manufacturing an EL device according to the sixth embodiment and the main sectional structure of the EL device finally obtained. The EL device 601 is shown in FIG.
As shown in (d), the pixel electrodes 602 are formed on the transparent substrate 604, and the banks 605 are provided between the pixel electrodes 602.
Are formed in a grid shape when viewed from the direction of arrow G, and the hole injection layer 620 is formed in these grid-shaped recesses, and R color light emission is performed so that a predetermined array such as a stripe array is viewed when viewed from the direction of arrow G. A layer 603R, a G-color light emitting layer 603G, and a B-color light emitting layer 603B are formed in each lattice-shaped recess, and a counter electrode 613 is further formed thereon.

When the pixel electrode 602 is driven by a two-terminal type active element such as a TFD (thin film diode) element, the counter electrode 613 is formed in a stripe shape when viewed from the direction of arrow G. When the pixel electrode 602 is driven by a three-terminal active element such as a TFT (thin film transistor), the counter electrode 613 is formed as a single surface electrode.

The region sandwiched by each pixel electrode 602 and each counter electrode 613 becomes one pixel pixel, and R,
G and B pixel pixels of three colors become one unit 1
Form two pixels. By controlling the current flowing through each picture element pixel, a desired one of the plurality of picture element pixels is selectively caused to emit light, whereby a desired full-color image can be displayed in the arrow H direction.

The EL device 601 described above is manufactured, for example, as follows. (A) As shown in FIG. 24 (a), the transparent substrate 604
An active element such as a TFD element or a TFT element is formed on the surface of, and a pixel electrode 602 is further formed. As a forming method, for example, a photolithography method, a vacuum deposition method, a sprinkling method, a pyrosol method or the like can be used. As a material for the pixel electrode, ITO (Indium Tin O
xide), tin oxide, a composite oxide of indium oxide and zinc oxide, or the like can be used.

Next, a partition wall or bank 605 is formed by using a well-known patterning method, for example, a photolithography method, and each transparent electrode 60 is formed by this bank 605.
Fill the space between 2. As a result, it is possible to improve the contrast, prevent color mixture of the light emitting material, and prevent light leakage between pixels. The material of the bank 605 is not particularly limited as long as it has durability against the solvent of the EL material, but can be made into Teflon (registered trademark) by fluorocarbon gas plasma treatment, for example,
Organic materials such as acrylic resin, epoxy resin, and photosensitive polyimide are preferable.

Immediately before the ink for the hole injection layer is applied, the substrate 604 is subjected to continuous plasma treatment with oxygen gas and fluorocarbon gas plasma. As a result, the polyimide surface is rendered water repellent and the ITO surface is rendered hydrophilic, and the wettability on the substrate side for fine patterning of inkjet droplets can be controlled. As an apparatus for generating plasma, an apparatus for generating plasma in vacuum or an apparatus for generating plasma in the atmosphere can be used as well.

Next, the hole injection layer ink is ejected from the ink jet head to perform patterning coating on each pixel electrode 602. Then, the hole injection layer 620 which is incompatible with the light emitting layer ink is formed by heat treatment in the air at 20 ° C. (on a hot plate) for 10 minutes. The film thickness is 4
It is about 0 nm.

(B) Next, as shown in FIG. 24 (b), the ink for the R light emitting layer and the ink for the G light emitting layer are formed on the hole injecting layer 620 in each filter element region by an ink jet method. Apply. Here again, the thickness of each light emitting layer ink can be changed by changing the solid content concentration and the discharge amount of the ink composition discharged from the inkjet head.

After applying the ink for the light emitting layer, a vacuum (1 torr)
In R), the solvent is removed under the conditions of room temperature, 20 minutes, etc. (process P58), and subsequently, heat treatment is performed in a nitrogen atmosphere at 150 ° C. for 4 hours to conjugate the R color emitting layer 603R and the G color emitting layer 603G. To form. The film thickness is about 50 nm. The luminescent layer conjugated by heat treatment is insoluble in the solvent. Here, the R color light emitting layer 603R has, for example, PPV (polyparaphenylene vinylene) doped with rhodamine B.
Xylene solution is used. In addition, the G color light emitting layer 603
For G, for example, a xylene solution of MEH · PPV is used. For the B-color light emitting layer 603B, for example, a coumarin-doped PPV xylene solution is used.

The hole injection layer 6 is formed before the light emitting layer is formed.
20 may be subjected to continuous plasma treatment with oxygen gas and fluorocarbon gas plasma. Thereby, the hole injection layer 6
A fluorinated layer is formed on 20 to increase the ionization potential, so that the hole injection efficiency is increased, and an organic EL device having high luminous efficiency can be provided.

(C) Next, as shown in FIG. 24C, the B-color light emitting layer 603B is formed into the R-color light emitting layer 603R, the G color light emitting layer 603G and the hole injection layer 620 in each pixel pixel.
Overlaid on top of. As a result, not only the three primary colors of R, G, and B can be formed, but also the level difference between the R color light emitting layer 603R and the G color light emitting layer 603G and the bank 605 can be filled and planarized. As a result, it is possible to reliably prevent a short circuit between the upper and lower electrodes. By adjusting the film thickness of the B-color light emitting layer 603B, the B-color light emitting layer 603B becomes the R-color light emitting layer 6
In the laminated structure with the 03R and G color light emitting layers 603G,
It acts as an electron injecting and transporting layer and does not emit B color.

As a method of forming the B color light emitting layer 603B as described above, for example, a general spin coating method as a wet method can be adopted, or the R color light emitting layer 6 can be used.
An inkjet method similar to the method of forming the 03R and G color light emitting layers 603G can also be adopted.

(D) After that, as shown in FIG. 24 (d), the counter electrode 613 is formed to manufacture the target EL device 601. When the counter electrode 613 is a surface electrode, for example, Mg, Ag, Al, L
It can be formed using a film forming method such as a vapor deposition method or a sputtering method using i or the like as a material. In the case where the counter electrode 613 is a stripe electrode, the formed electrode layer can be formed by a patterning method such as a photolithography method.

In the manufacturing method of the EL device described above, as a method of controlling the ink jet head,
The hole injection layer 620 and the R, G, B color emitting layers 603R, 603G, 603B in each pixel shown in FIG.
In addition, the hole injection layer and / or the light emitting layer of each color in one pixel pixel is overlapped n times, for example, 4 times by a plurality of nozzles, instead of being formed by one main scan X of the inkjet head. A predetermined film thickness may be formed by receiving ink ejection. By doing so, even if there is a variation in the ink ejection amount between the plurality of nozzles, it is possible to prevent the variation in the film thickness between the plurality of pixel pixels, and therefore, the light emitting surface of the EL device. It is possible to make the light emission distribution characteristics of 2) uniform in a plane. This means that in the EL device 601 of FIG. 24D, a clear color display without color unevenness can be obtained.

As described above, according to the manufacturing method of the EL device of the present embodiment, since the R, G, and B color pixel pixels are formed by the ink discharge using the ink jet head, the photolithography method is used. There is no need to go through a complicated process like that, and no material is wasted.

Further, as a method of forming a light emitting layer or the like in an EL device, a method of depositing a metal dye or the like on the light emitting layer has been conventionally used, but when an organic EL substrate is manufactured by an ink jet method, Application and patterning of a high molecular weight organic compound to be an electroluminescent device can be performed at once. Moreover, since the liquid is directly discharged to the target position, it is only necessary to discharge the minimum necessary amount without wasting the organic compound that becomes the electroluminescent element.

Further, the R, G, and B color emitting layers 603R, 6
There are various kinds of organic compounds and solutions used for 03G and 603B, and thus the organic compounds and the solutions may not be those shown above. Further, a material that develops an intermediate color may be used. However, since the weight, viscosity, etc. vary depending on the respective materials, it is necessary to adjust the ink weight and the ink speed according to the material to be ejected.

[0112]

As described above, according to the present invention, the substrate on which the energy generating element that gives the ejection energy to the ink in the nozzle plate or the ejection chamber is formed is formed in a line shape, and the line-shaped nozzle plate or the substrate is formed. Since a plurality of head chips are arranged side by side in a line, the line-shaped nozzle plate or the substrate is a component of the actuator of the inkjet head and also has the function of the substrate as a structure. Therefore, a substrate as a structural body is not required separately, the number of parts is small, the structure is simple, and the head can be downsized and lightened.

[Brief description of drawings]

FIG. 1 is an explanatory diagram of an overall configuration of a first embodiment of the present invention.

FIG. 2 is an exploded perspective view of the inkjet head according to the first embodiment of the present invention.

3 is a cross-sectional side view of the inkjet head of FIG.

FIG. 4 is a view taken along the line AA of FIG.

5 is an explanatory diagram of a method of manufacturing a head chip substrate (first substrate) that constitutes the inkjet head of FIG. 1. FIG.

FIG. 6 is an explanatory diagram of a method of manufacturing a head chip substrate (second substrate) that constitutes the inkjet head of FIG. 1.

FIG. 7 is an explanatory diagram of a method of manufacturing a head chip substrate (third substrate) that constitutes the inkjet head of FIG. 1.

FIG. 8 is an explanatory diagram of an assembly process of the inkjet head of FIG.

FIG. 9 is an explanatory diagram of an overall configuration of a second embodiment of the present invention.

FIG. 10 is an exploded perspective view of an inkjet head according to a second embodiment of the present invention.

11 is a sectional side view of the inkjet head of FIG.

FIG. 12 is an explanatory diagram of a method of manufacturing a head chip substrate (flow path substrate) that constitutes the inkjet head of FIG. 9.

13 is an explanatory diagram of a method of manufacturing a head chip substrate (glass electrode substrate) that constitutes the inkjet head of FIG.

14 is an explanatory diagram of a method of manufacturing a head chip substrate (cover glass) that constitutes the inkjet head of FIG.

15 is a partial plan cross-sectional view of the inkjet head of FIG.

16 is an explanatory diagram of an assembly process of the inkjet head of FIG. 9.

FIG. 17 is an explanatory diagram of an overall configuration of a third embodiment of the present invention.

FIG. 18 is an external perspective view of the printing apparatus according to the fourth embodiment of the present invention.

19 is an explanatory diagram of a configuration of main components of the printing apparatus shown in FIG.

FIG. 20 is a diagram showing a state in which pixels of a color filter are colored by an inkjet head, as viewed from above.

FIG. 21 is an explanatory diagram showing an arrangement example of filter elements of a color filter.

FIG. 22 is a diagram showing an outline of a color filter manufacturing apparatus according to a fourth embodiment of the present invention.

23 is a diagram schematically showing the process of manufacturing a color filter by the color filter manufacturing device in FIG. 22 in the order of steps.

FIG. 24 is a diagram showing main steps of a method for manufacturing an EL device according to a fifth embodiment of the present invention and a main cross-sectional structure of an EL device finally obtained.

[Explanation of symbols]

1 First substrate, flow channel substrate 2 Second substrate, glass electrode substrate 3 Third substrate, cover glass 4 nozzle holes 5 diaphragm 6 discharge chamber 8 ink reservoir 21 electrodes 41 nozzle plate 100 head chips 150 printing devices

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Katsuji Arakawa             Seiko, 3-3-3 Yamato, Suwa City, Nagano Prefecture             -In Epson Corporation F term (reference) 2C056 EA23 FA02 FA13 FB01 HA16                       HA17                 2C057 AF93 AG16 AN05 AP02 AP28                       AP32 AP34 AP52 AP56 AQ01                       AQ02 AQ06 BA03 BA15                 2H048 BA02 BA64 BB02 BB24 BB28                       BB37

Claims (19)

[Claims] 1. An ink jet head comprising a plurality of nozzle holes, an independent ejection chamber communicating with each of the nozzle holes, and an energy generating element for giving ejection energy to ink in the ejection chamber. A line-shaped nozzle plate having nozzle holes formed therein and a plurality of chips in which the discharge chamber and the energy generating element are formed are provided, and the plurality of chips are installed in line in the nozzle plate. An inkjet head characterized in that. 2. The ink jet head according to claim 1, wherein the nozzle plate is formed of a silicon substrate. 3. The ink jet head according to claim 1, wherein the nozzle plate is formed of a stainless substrate. 4. An inkjet head comprising a plurality of nozzle holes, an independent ejection chamber communicating with each of the nozzle holes, and an energy generating element for giving ejection energy to ink in the ejection chamber. A plurality of chips in which nozzle holes and the discharge chamber are formed; and a line-shaped substrate on which an energy generating element that gives discharge energy to ink in the discharge chamber is formed. The plurality of chips are arranged in a line on the substrate. An inkjet head characterized in that it is installed and configured. 5. The ink jet head according to claim 1, wherein the energy generating element is a pressure generating element that gives a pressure change that causes an ink droplet to fly to the ejection chamber. 6. The pressure generating element comprises a vibrating plate formed on at least one wall of the discharge chamber, and an electrode that deforms the vibrating plate by an electrostatic force when a driving voltage is applied. The inkjet head according to claim 5. 7. The ink jet head according to claim 1, wherein the ink jet head is a face type ink jet head that ejects ink droplets from a surface portion of a substrate. 8. The ink jet head according to claim 7, wherein the nozzle plate includes an ink reservoir. 9. The ink jet head according to claim 1, wherein the ink jet head is an edge type ink jet head that ejects ink droplets from an end portion of a substrate. 10. A method of manufacturing an ink jet head, comprising a plurality of nozzle holes, an independent ejection chamber communicating with each of the nozzle holes, and an energy generating element for imparting ejection energy to ink in the ejection chamber, A step of forming a linear nozzle plate in which the plurality of nozzle holes are formed, and a step of forming a plurality of chips in which the discharge chamber and the energy generating element are formed,
And a step of installing the plurality of chips on the nozzle plate in a line shape. 11. The silicon substrate is used for the nozzle plate, and the plurality of nozzle holes are formed in the silicon substrate by photolithography.
A method for manufacturing the inkjet head described. 12. A method of manufacturing an ink jet head, comprising: a plurality of nozzle holes; an independent ejection chamber communicating with each of the nozzle holes; and an energy generating element for imparting ejection energy to ink in the ejection chamber. Forming a plurality of chips in which the plurality of nozzle holes and the ejection chamber are formed; forming a line-shaped substrate on which an energy generating element that gives ejection energy to ink in the ejection chamber is formed; And a step of installing a plurality of chips on the substrate in a line shape. 13. The method of manufacturing an inkjet head according to claim 12, wherein a glass substrate is used as the substrate, and the energy generating element forming portion is formed on the glass substrate by photolithography. 14. An inkjet recording apparatus comprising the inkjet head according to claim 1. 15. A method for manufacturing an inkjet recording apparatus, comprising manufacturing an inkjet head by the inkjet head manufacturing method according to claim 10, and mounting the inkjet head. 16. A color filter manufacturing apparatus comprising the inkjet head according to claim 1. 17. A method of manufacturing an apparatus for manufacturing a color filter, which comprises manufacturing an inkjet head by the method of manufacturing an inkjet head according to claim 10 and mounting the inkjet head. 18. An electroluminescent substrate manufacturing apparatus comprising the inkjet head according to claim 1. 19. A method of manufacturing an electroluminescent substrate manufacturing apparatus, comprising manufacturing an inkjet head by the method of manufacturing an inkjet head according to claim 10, and mounting the inkjet head.