JP2003154485A - Composition for high-temperature cream solder - Google Patents
Composition for high-temperature cream solderInfo
- Publication number
- JP2003154485A JP2003154485A JP2001355313A JP2001355313A JP2003154485A JP 2003154485 A JP2003154485 A JP 2003154485A JP 2001355313 A JP2001355313 A JP 2001355313A JP 2001355313 A JP2001355313 A JP 2001355313A JP 2003154485 A JP2003154485 A JP 2003154485A
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- Prior art keywords
- metal component
- solder
- composition
- cream solder
- mass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、Ｐｂを含まない高
温クリームはんだ用組成物に係り、特にリフロー前に予
めはんだ付けされ、リフロー時に溶け出さないような組
成を有する高温クリームはんだ用組成物に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a Pb-free high-temperature cream solder composition, and more particularly to a high-temperature cream solder composition having a composition which is pre-soldered before reflow and does not melt during reflow. .
【０００２】[0002]
【従来の技術】プリント基板等に搭載される電子部品に
は、その内部においてはんだが用いられているものがあ
る。例えば図１（Ａ）、（Ｂ）に示すような線状のコイ
ル１を有するインダクタにおいては、予めドラムコア４
に巻かれたコイル１の端末と端子２とを、ドラムコア４
の端部のフランジ６において高温はんだ３により固着し
ておき、このインダクタを、低温はんだであるクリーム
はんだを塗布したプリント基板上に搭載し、これをリフ
ロー炉に通してプリント基板と端子２とを他の部品と共
に同時に低温はんだによりはんだ付けすることが行われ
る。2. Description of the Related Art Some electronic components mounted on a printed circuit board or the like use solder inside. For example, in an inductor having a linear coil 1 as shown in FIGS.
The coil core 1 and the terminal 2 wound around the drum core 4
The flange 6 at the end of the is fixed by the high temperature solder 3, the inductor is mounted on the printed circuit board coated with the cream solder which is the low temperature solder, and this is passed through the reflow furnace to connect the printed circuit board and the terminal 2. Simultaneous soldering with low temperature solder is performed along with other components.
【０００３】従来、リフローで使用するはんだとして、
一般的には融点が１８３℃程度のＳｎ−３７Ｐｂ（Ｐｂ
が３７質量％含まれるＳｎとの合金）からなる共晶はん
だ（クリームはんだ）を使用し、また、電子部品の内部
に使用するはんだとしては、高温はんだとして、固相線
と液相線の範囲が２７０〜３０５℃（溶け始めが２７０
℃で３０５℃では液状となることを意味する）程度のＳ
ｎ−９０Ｐｂが使用されてきた。Conventionally, as solder used in reflow,
Generally, Sn-37Pb (Pb having a melting point of about 183 ° C.
Eutectic solder (cream solder) composed of 37% by mass of Sn), and as the solder to be used inside the electronic parts, as high temperature solder, solidus line and liquidus line range 270-305 ° C (melting starts 270
S means that it becomes liquid at 305 ° C).
n-90Pb has been used.
【０００４】しかしながらＰｂは有毒であることから、
環境汚染を防止する意味において、使用を避けることが
推奨されている。このような意味において、現在、プリ
ント基板に電子部品を搭載してはんだ付けするため、一
般的にはリフロー用として融点が約２２０℃程度のＳｎ
−３．５Ａｇ−０．７５Ｃｕからなるはんだが使用さ
れ、リフロー炉として２４０〜２６０℃位の温度範囲の
ものが使用されている。However, since Pb is toxic,
Avoiding use is recommended in the sense of preventing environmental pollution. In this sense, since electronic components are currently mounted and soldered on a printed circuit board, Sn having a melting point of about 220 ° C. is generally used for reflow.
Solder composed of -3.5Ag-0.75Cu is used, and a reflow furnace having a temperature range of 240 to 260 ° C is used.
【０００５】これに対し、電子部品の内部に使用される
高温はんだとしては、Ｓｎ−Ｃｕ系合金を使用し、Ｃｕ
の含有率を増加させると融点が上がることから、Ｃｕの
含有率を上げることが検討されている。例えば、Ｃｕの
含有率を１１質量％とした場合、２２７℃位から一部溶
融し、３８０℃位では完全に液状になる。On the other hand, as the high temperature solder used inside the electronic parts, Sn--Cu type alloy is used and Cu
Since the melting point increases as the content of Cu increases, it has been considered to increase the content of Cu. For example, when the Cu content is 11% by mass, it partially melts from around 227 ° C and becomes completely liquid at around 380 ° C.
【０００６】[0006]
【発明が解決しようとする課題】図１のインダクタの場
合、ドラムコア４はコイル１が巻かれて筒状のスリーブ
コア５内に挿入され、ドラムコア４のフランジ６の端面
凹部において、端子２とコイル１の端末との継線部分で
あるはんだ付け部にクリームはんだである高温はんだ３
を塗布しておき、このはんだ付け部にレーザを照射し
て、コイル１の端末の被膜を溶かすと同時にはんだ付け
している。また、この高温はんだ３によるはんだ付け部
は、コイル１の端末と端子２とのはんだ付け後に塗布さ
れて硬化される樹脂７により密封される。この樹脂７は
端子２やドラムコア４の固定の役目とはんだ付け部の保
護の役目を果たす。In the case of the inductor shown in FIG. 1, the drum core 4 is wound around the coil 1 and inserted into the cylindrical sleeve core 5, and the terminal 2 and the coil are inserted in the end face concave portion of the flange 6 of the drum core 4. High temperature solder 3 which is cream solder in the soldering part which is the connection part with the end of 1
Is applied, and the soldering portion is irradiated with a laser to melt the coating on the end of the coil 1 and simultaneously solder. Further, the soldered portion of the high-temperature solder 3 is sealed by a resin 7 which is applied and hardened after the terminal of the coil 1 and the terminal 2 are soldered. The resin 7 plays a role of fixing the terminal 2 and the drum core 4 and a role of protecting the soldered portion.
【０００７】このようなインダクタにおいて、前記高温
はんだ３として前記Ｓｎ−１１Ｃｕの組成のものを使用
したこのインダクタをプリント基板に搭載してはんだ付
けするために、２４０〜２６０℃位の温度範囲のリフロ
ー炉に通すと、はんだ３の一部が図１の３ａのように溶
け出し、端子２の表面部分に溶出して固化してしまう。
このようなはんだ３の溶出は、端子２のコイル１の端末
とのはんだ付け部の信頼性を損ない、かつ電子部品の熱
の上昇によって再度高温はんだ３が溶融する虞も生じる
上、外観も悪くするという問題があった。In such an inductor, in order to mount and solder the high temperature solder 3 having the composition of Sn-11Cu on a printed circuit board, reflow in a temperature range of about 240 to 260 ° C. When it is passed through a furnace, a part of the solder 3 is melted out as shown by 3a in FIG. 1 and is eluted on the surface portion of the terminal 2 to be solidified.
Such elution of the solder 3 impairs the reliability of the soldered portion of the terminal 2 with the end of the coil 1 and may cause the high temperature solder 3 to be melted again due to an increase in heat of the electronic component, and also has a poor appearance. There was a problem of doing.
【０００８】本発明は、このような従来技術の問題点に
鑑み、Ｐｂを含まない高温はんだを使用した電子部品を
プリント基板にはんだ付けする場合、リフロー時に電子
部品内部のはんだが溶出する虞のない組成の高温クリー
ムはんだ用組成物を提供することを目的とする。In view of the above problems of the prior art, the present invention may cause the solder inside the electronic component to elute during reflow when the electronic component using high temperature solder containing no Pb is soldered to the printed circuit board. It is an object of the present invention to provide a composition for high temperature cream solder having no composition.
【０００９】[0009]
【課題を解決するための手段】請求項１の高温クリーム
はんだ用組成物は、粉末状をなす第１金属成分と第２金
属成分とからなり、第１金属成分はＳｎ−Ｃｕ系合金、
Ｓｎ−Ｃｕ−Ｓｂ系合金のいずれか、もしくはこれらの
うちのいずれかにＡｇ、Ｉｎ、Ｂｉ、ＺｎまたはＮｉの
うちの一種以上を添加して第１金属成分単独の融点を２
６１℃〜６００℃の範囲内にしたものであり、第２金属
成分はＣｕ、Ｓｎ、Ｓｂ、Ａｇ、Ｚｎ、Ｎｉのうちの一
種以上の金属もしくはこれらの金属のうちの２種以上の
ものの合金でなり、加熱により第１金属成分中に第２金
属成分が拡散して融点が２６１℃〜１１００℃となるこ
とを特徴とする。The composition for high temperature cream solder according to claim 1 comprises a powdery first metal component and a second metal component, the first metal component being a Sn-Cu based alloy,
The melting point of the first metal component alone is set to 2 by adding one or more of Ag, In, Bi, Zn, or Ni to any one of the Sn-Cu-Sb alloys.
The second metal component is in the range of 61 ° C. to 600 ° C., and the second metal component is one or more metals of Cu, Sn, Sb, Ag, Zn and Ni, or an alloy of two or more of these metals. The second metal component is diffused into the first metal component by heating and the melting point is 261 ° C. to 1100 ° C.
【００１０】請求項２の高温クリームはんだ用組成物
は、請求項１に記載された高温クリームはんだ用組成物
において、前記第１金属成分はＳｎ−Ｃｕ系合金でな
り、そのＣｕの含有率は１．５〜６０質量％の範囲内で
あることを特徴とする。A high temperature cream solder composition according to a second aspect of the present invention is the high temperature cream solder composition according to the first aspect, wherein the first metal component is a Sn-Cu based alloy, and the Cu content is the same. It is characterized by being in the range of 1.5 to 60 mass%.
【００１１】請求項３の高温クリームはんだ用組成物
は、請求項１に記載された高温クリームはんだ用組成物
において、前記第１金属成分はＳｎ−Ｃｕ−Ｓｂ系合金
でなり、そのＣｕの含有率は１〜２０質量％、Ｓｂの含
有率は１０〜４０質量％の範囲内であることを特徴とす
る。A high temperature cream solder composition according to a third aspect of the present invention is the high temperature cream solder composition according to the first aspect, wherein the first metal component is an Sn-Cu-Sb alloy and the content of Cu is contained. The ratio is 1 to 20% by mass, and the Sb content is 10 to 40% by mass.
【００１２】請求項４の高温クリームはんだ用組成物
は、請求項１ないし３のいずれかに記載された高温はん
だ用組成物において、前記第１金属成分に対する第２金
属成分の添加量は、質量比で第１金属成分１に対し第２
金属成分が０．２〜４．０の範囲内であることを特徴と
する。The composition for high temperature cream solder according to claim 4 is the composition for high temperature solder according to any one of claims 1 to 3, wherein the addition amount of the second metal component to the first metal component is mass. Second to first metal component 1 in ratio
The metal component is in the range of 0.2 to 4.0.
【００１３】本発明において、Ｓｎ−Ｃｕ系合金を第１
金属成分に用いた場合、Ｃｕの含有率を１．５質量％以
上に設定することにより、融点（液状態となる温度）を
２６１℃以上とすることができる。第１金属成分は、加
熱により流動状態となる部分であり、第２金属成分は融
点が高いことにより、第１金属成分が流動性を帯びたと
きにその流動性を阻む骨材としての作用をなすことによ
り、リフロー時における溶出を阻むものである。In the present invention, the Sn--Cu alloy is used as the first alloy.
When used as a metal component, the melting point (the temperature at which the liquid state) is 261 ° C. or higher can be obtained by setting the Cu content to 1.5% by mass or more. The first metal component is a portion that becomes fluid when heated, and the second metal component has a high melting point, so that when the first metal component has fluidity, it acts as an aggregate that prevents the fluidity. This prevents the elution during reflow.
【００１４】ただし、第２金属成分としては第１金属成
分と相溶性があるものが用いられ、第２金属成分の一部
も第１金属成分と溶融するため、この高温はんだを溶融
させた際に、第２金属成分が第１金属成分に拡散して一
部溶融し、再度リフローにより加熱した状態では融点が
前記の範囲に上昇するために、リフロー時における高温
はんだの溶出を阻む作用も果たす。However, as the second metal component, one that is compatible with the first metal component is used, and part of the second metal component also melts with the first metal component. In addition, the second metal component diffuses into the first metal component and is partially melted, and when heated again by reflow, the melting point rises to the above range, so that it also acts to prevent elution of high temperature solder during reflow. .
【００１５】Ｓｎ−Ｃｕ系合金を第１金属成分に用いた
場合、Ｃｕの含有率を６０質量％以下とすることによ
り、融点を６００℃程度以下に抑えることができる。こ
の６００℃は、この合金を粉末として製造する場合、製
造可能な上限温度と把握される温度である。また、Ｓｎ
−Ｃｕ−Ｓｂ系合金を第１金属成分に用いる場合、融点
を前記範囲内に抑えるには、前述のように、Ｃｕの含有
率は１〜２０質量％、Ｓｂの含有率は１０〜４０質量％
の範囲内とする。When the Sn-Cu alloy is used as the first metal component, the melting point can be suppressed to about 600 ° C. or less by setting the Cu content to 60% by mass or less. This 600 ° C. is a temperature that is grasped as the upper limit temperature that can be produced when this alloy is produced as powder. Also, Sn
When using a -Cu-Sb-based alloy as the first metal component, in order to suppress the melting point within the above range, the Cu content is 1 to 20 mass% and the Sb content is 10 to 40 mass as described above. %
Within the range of.
【００１６】ここで第１金属成分の融点を２６１℃とす
る理由は、近年におけるリフロー時のＰｂフリーのリフ
ローの温度が最高で２６０℃程度に設定されるためであ
る。The reason why the melting point of the first metal component is 261 ° C. is that the Pb-free reflow temperature at the time of reflow in recent years is set to a maximum of about 260 ° C.
【００１７】はんだ粉末の粒径は、通常、６３μｍ以下
であり、第２金属成分の粒径も６３μｍ以下とすること
が好ましい。第２金属成分の平均粒径は１０〜２０μｍ
であることがさらに好ましい。平均粒径が１０μｍ未満
であると、第１金属成分が流動性を持った際にその流動
性を阻む作用が低下する。また、２０μｍを超えると、
はんだ付け後においてはんだ層に粒子状に残留する第２
金属成分の粒径が大きいために、第１金属成分への拡散
性が低下することになる。また、両者の拡散性を良好に
するには、粒子を球形とすることが好ましい。The particle size of the solder powder is usually 63 μm or less, and the particle size of the second metal component is also preferably 63 μm or less. The average particle size of the second metal component is 10 to 20 μm.
Is more preferable. When the average particle diameter is less than 10 μm, the action of obstructing the fluidity of the first metal component is reduced when the first metal component has fluidity. If it exceeds 20 μm,
Second particles remaining in the solder layer after soldering
Since the particle size of the metal component is large, the diffusibility into the first metal component is reduced. Further, in order to improve the diffusibility of both, it is preferable that the particles have a spherical shape.
【００１８】また、前記第２金属成分が骨材として流動
性を低下させる役目を果たすためには、第１金属成分に
対する第２金属成分の添加比は、１：０．２以上である
ことが好ましく、また、融点を前記温度以下に抑えるに
は、前記比は１：４．０以下であることが好ましい。Further, in order that the second metal component functions as an aggregate to reduce the fluidity, the addition ratio of the second metal component to the first metal component is 1: 0.2 or more. Further, in order to keep the melting point below the temperature, the ratio is preferably 1: 4.0 or less.
【００１９】本発明により実現される高温はんだは、前
記第１金属成分と第２金属成分の各粉末にロジン、溶剤
等を加えて混合することによりクリームはんだとして構
成され、はんだごてやレーザ照射等による加熱によって
溶融される。The high-temperature solder realized by the present invention is formed as a cream solder by adding rosin, a solvent and the like to the powders of the first metal component and the second metal component and mixing them, and a soldering iron or laser irradiation is used. It is melted by heating by etc.
【００２０】[0020]
【発明の実施の形態】本発明において、使用する第１金
属成分のはんだ粉末として例えば表１に示すものが使用
できる。BEST MODE FOR CARRYING OUT THE INVENTION In the present invention, as the solder powder of the first metal component used, for example, those shown in Table 1 can be used.
【００２１】[0021]
【表１】 [Table 1]
【００２２】（実施例１）第１金属成分として平均粒径
が１０〜２０μｍ程度のＳｎ−１１Ｃｕ、第２金属成分
として平均粒径が２０μｍ程度のＣｕを用い、第１金属
成分に対し第２金属成分を質量比で１：０．４になるよ
うに加え、さらにロジン、溶剤を加えて混合することに
よりクリームはんだとした。このクリームはんだを図１
に示した高温はんだ３として用い、レーザ照射によって
溶融固化させ、熱硬化併用型ＵＶ樹脂７ではんだ３によ
るコイル１の端末と端子２とのはんだ付け部を覆い、紫
外線照射により樹脂７の表面を硬化させ、その後、１３
０℃の加熱炉により樹脂７を内部まで硬化させた。Example 1 Sn-11Cu having an average particle size of about 10 to 20 μm was used as the first metal component, and Cu having an average particle size of about 20 μm was used as the second metal component. A metal component was added at a mass ratio of 1: 0.4, and rosin and a solvent were further added and mixed to obtain a cream solder. This cream solder is shown in Figure 1.
Used as the high-temperature solder 3 shown in FIG. 2 and melted and solidified by laser irradiation, the thermosetting combined UV resin 7 covers the soldered portion of the end of the coil 1 and the terminal 2 with the solder 3, and the surface of the resin 7 is irradiated with ultraviolet rays. Cured, then 13
The resin 7 was cured to the inside by a heating furnace at 0 ° C.
【００２３】（実施例２）第１金属成分として平均粒径
が１０〜２０μｍ程度のＳｎ−１１Ｃｕ、第２金属成分
として平均粒径が２０μｍ程度のＳｎ−７０Ｃｕを用
い、第１金属成分に対し第２金属成分を質量比で１：
０．４になるように加え、さらにロジン、溶剤を加えて
混合することによりクリームはんだとした。このクリー
ムはんだを前記と同様にレーザ照射によって溶融固化さ
せ、熱硬化併用型ＵＶ樹脂７ではんだ付け部を覆った。Example 2 Sn-11Cu having an average particle size of about 10 to 20 μm was used as the first metal component, and Sn-70Cu having an average particle size of about 20 μm was used as the second metal component. Mass ratio of the second metal component is 1:
A cream solder was obtained by adding rosin and a solvent and mixing them so as to obtain 0.4. This cream solder was melted and solidified by laser irradiation in the same manner as described above, and the soldering portion was covered with the UV resin 7 used in combination with thermosetting.
【００２４】このようにして作成したインダクタをプリ
ント基板にはんだ付けするため、クリームはんだを塗布
したプリント基板上に搭載し、２６０℃のリフロー炉に
通した。その結果を表２に示す。表２において、サンプ
ル５、１１がそれぞれ前記実施例１、２に相当する。こ
れらの実施例においては、図１に示した溶出はんだ３ａ
は生じなかった。In order to solder the inductor thus produced to a printed circuit board, the inductor was mounted on a printed circuit board coated with cream solder and passed through a reflow oven at 260 ° C. The results are shown in Table 2. In Table 2, Samples 5 and 11 correspond to Examples 1 and 2, respectively. In these examples, the elution solder 3a shown in FIG.
Did not occur.
【００２５】また、表２に示すように、第２金属成分を
含まない場合（サンプル１３〜１５）や第２金属成分の
添加量を種々に変えたものについてサンプルを作成し
た。その結果、第２金属成分を含まない場合にはリフロ
ー時のはんだの溶出量は大となった。また、第２金属成
分の添加量が１０％（第１金属成分１００質量％に対す
る第２金属成分の質量％）の場合には、リフロー時のは
んだの溶出が大であったが、第２金属成分の質量％が２
０％質量ないし４００質量％においてはリフロー時の溶
出を小さく抑えるかあるいは溶出を無くすることができ
た。また、第１金属成分がＳｎ−Ｃｕ−Ｓｂの合金の場
合にも、リフロー時における溶出量を小さく抑えること
ができた。Further, as shown in Table 2, samples were prepared when the second metal component was not included (Samples 13 to 15) and when the addition amount of the second metal component was variously changed. As a result, when the second metal component was not included, the amount of solder eluted during reflow was large. Further, when the addition amount of the second metal component was 10% (mass% of the second metal component with respect to 100% by mass of the first metal component), the elution of the solder during reflow was large, but the second metal The mass% of the component is 2
At 0% to 400% by mass, the elution during reflow could be suppressed to a small level or could be eliminated. Further, even when the first metal component is an Sn—Cu—Sb alloy, the elution amount during reflow could be suppressed to be small.
【００２６】本発明は、リフロー前にはんだ付けするイ
ンダクタ以外の種々の電子部品の高温はんだ付け部に使
用することができる。The present invention can be used for high temperature soldering parts of various electronic parts other than inductors which are soldered before reflow.
【００２７】[0027]
【表２】 [Table 2]
【００２８】[0028]
【発明の効果】本発明によれば、はんだの主母材である
合金の使用温度をほとんど上昇させることなく、継線部
分等のはんだ付けができ、かつ２４０〜２６０℃のリフ
ロー炉使用の場合においても、高温はんだの再溶融によ
る溶出を阻止することができるから、電子部品における
継線部分等の高温はんだ付け部分のはんだ付けにとって
きわめて有効である。EFFECTS OF THE INVENTION According to the present invention, in the case of using a reflow furnace at 240 to 260 ° C., soldering of a connecting wire portion can be carried out with almost no increase in operating temperature of an alloy which is a main base material of solder. Also in this case, since elution due to remelting of the high temperature solder can be prevented, it is extremely effective for soldering the high temperature soldering portion such as a wire connection portion of an electronic component.
【図１】（Ａ）は本発明によるはんだを適用するインダ
クタの部分断面側面図、（Ｂ）はその端面図である。1A is a partial cross-sectional side view of an inductor to which a solder according to the present invention is applied, and FIG. 1B is an end view thereof.
１：コイル、２：端子、３：はんだ、３ａ：溶出部、
４：ドラムコア、５：スリーブコア、６：フランジ、
７：樹脂1: coil, 2: terminal, 3: solder, 3a: elution part,
4: drum core, 5: sleeve core, 6: flange,
7: Resin
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｃ２２Ｃ 12/00 Ｃ２２Ｃ 12/00 13/00 13/00 13/02 13/02 18/00 18/00 18/02 18/02 19/03 19/03 Ｚ Ｈ０５Ｋ 3/34 ５１２ Ｈ０５Ｋ 3/34 ５１２Ｃ ─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 7 Identification code FI theme code (reference) C22C 12/00 C22C 12/00 13/00 13/00 13/02 13/02 18/00 18/00 18 / 02 18/02 19/03 19/03 Z H05K 3/34 512 H05K 3/34 512C
Claims (4)
とからなり、 第１金属成分はＳｎ−Ｃｕ系合金、Ｓｎ−Ｃｕ−Ｓｂ系
合金のいずれか、もしくはこれらのうちのいずれかにＡ
ｇ、Ｉｎ、Ｂｉ、ＺｎまたはＮｉのうちの一種以上を添
加して第１金属成分単独の融点を２６１℃〜６００℃の
範囲内にしたものであり、 第２金属成分はＣｕ、Ｓｎ、Ｓｂ、Ａｇ、Ｚｎ、Ｎｉの
うちの一種以上の金属もしくはこれらの金属のうちの２
種以上のものの合金でなり、 加熱により第１金属成分中に第２金属成分が拡散して融
点が２６１℃〜１１００℃となることを特徴とする高温
クリームはんだ用組成物。1. A powdery first metal component and a second metal component, wherein the first metal component is any one of Sn—Cu based alloys and Sn—Cu—Sb based alloys, or any of these. Crab A
One or more of g, In, Bi, Zn or Ni is added so that the melting point of the first metal component alone is in the range of 261 ° C. to 600 ° C., and the second metal component is Cu, Sn, Sb. , One or more metals selected from Ag, Zn, and Ni or two of these metals
A composition for high-temperature cream solder, comprising an alloy of one or more kinds, and having a melting point of 261 ° C to 1100 ° C due to the diffusion of the second metal component into the first metal component by heating.
用組成物において、 前記第１金属成分はＳｎ−Ｃｕ系合金でなり、そのＣｕ
の含有率は１．５〜６０質量％の範囲内であることを特
徴とする高温クリームはんだ用組成物。2. The composition for high temperature cream solder according to claim 1, wherein the first metal component is a Sn—Cu alloy and Cu
The composition for high-temperature cream solder is characterized in that the content is in the range of 1.5 to 60% by mass.
用組成物において、 前記第１金属成分はＳｎ−Ｃｕ−Ｓｂ系合金でなり、そ
のＣｕの含有率は１〜２０質量％、Ｓｂの含有率は１０
〜４０質量％の範囲内であることを特徴とする高温クリ
ームはんだ用組成物。3. The composition for high-temperature cream solder according to claim 1, wherein the first metal component is a Sn—Cu—Sb alloy and the Cu content is 1 to 20% by mass. Content rate is 10
The composition for high temperature cream solder is characterized by being in the range of from 40 to 40% by mass.
高温クリームはんだ用組成物において、 前記第１金属成分に対する第２金属成分の添加量は、質
量比で第１金属成分１に対し第２金属成分が０．２〜
４．０の範囲内であることを特徴とする高温クリームは
んだ用組成物。4. The composition for high temperature cream solder according to claim 1, wherein the addition amount of the second metal component to the first metal component is 1 mass% of the first metal component. The second metal component is 0.2 to
A composition for high-temperature cream solder, which is in the range of 4.0.
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|---|---|---|---|
| JP2001355313A JP3736797B2 (en) | 2001-11-20 | 2001-11-20 | High temperature cream solder composition and inductor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001355313A JP3736797B2 (en) | 2001-11-20 | 2001-11-20 | High temperature cream solder composition and inductor |
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| JP3736797B2 JP3736797B2 (en) | 2006-01-18 |
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|---|---|---|---|
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| JP2007152385A (en) * | 2005-12-05 | 2007-06-21 | Hitachi Ltd | High temperature solder, high temperature solder paste material and power semiconductor equipment using the same |
| JP2007181851A (en) * | 2006-01-06 | 2007-07-19 | Fuji Electric Holdings Co Ltd | Cream solder and soldering method using the same |
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| JP2007152385A (en) * | 2005-12-05 | 2007-06-21 | Hitachi Ltd | High temperature solder, high temperature solder paste material and power semiconductor equipment using the same |
| JP4609296B2 (en) * | 2005-12-05 | 2011-01-12 | 株式会社日立製作所 | High temperature solder, high temperature solder paste material, and power semiconductor device using the same |
| JP2007181851A (en) * | 2006-01-06 | 2007-07-19 | Fuji Electric Holdings Co Ltd | Cream solder and soldering method using the same |
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| JP2007301570A (en) * | 2006-05-08 | 2007-11-22 | Honda Motor Co Ltd | Solder alloy |
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| WO2014024715A1 (en) * | 2012-08-10 | 2014-02-13 | 千住金属工業株式会社 | High-temperature lead-free solder alloy |
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