JP2003037054A - Interlocking device and aligner - Google Patents

Abstract

PROBLEM TO BE SOLVED: To readily stop the operation of an apparatus surrounded by a chamber with sureness by checking an accessed state of the device and then conducting an interlocking operation. SOLUTION: An interlocking device is provided with a microdifferential manometer 19 for monitoring a difference in pressure inside and outside a thermostatic chamber 9 surrounding an aligner. The chamber 9 is provided with a door 10 for maintenance which can be opened and closed, a door 11 for carrying in a reticle and a door 13 for carrying in a wafer. The state of the chamber 9 is detected by monitoring changes in a difference in pressure inside and outside the chamber 9 according to an opening condition of each door of the chamber 9. When it is determined from the opening state of the door 10 for maintenance that a part of the door 10 which can be opened and closed is in an opened state or the blowing of a temperature control air is weakened, the oscillation of a laser light source 3 is stopped, the transfer of a reticle 4 as an original plate or a wafer 7 as a substrate is stopped, operations of an original plate stage 5 and a substrate stage 8 are stopped, exposure is stopped, or the like.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention detects the state of a chamber by monitoring the pressure difference between the inside and the outside of the chamber, which is surrounded by the chamber and to be interlocked. The present invention relates to an interlock device that limits the operation of a target device in order to prevent generation of non-defective products, and is suitable for an exposure device surrounded by a constant temperature chamber. Further, the present invention uses an exposure apparatus, which monitors a pressure difference between the inside and the outside of a chamber and a switch provided in an opening / closing opening to detect an abnormality of the apparatus, thereby causing an accident or a defective product. It also relates to a system that limits the exposure operation to prevent the occurrence of

[0002]

2. Description of the Related Art In a semiconductor exposure apparatus surrounded by a constant temperature chamber, when a reticle as an original plate or an automatic transfer device for a wafer as a substrate is not provided, the reticle or wafer is set to a position where a human can transfer it. Usually, a switch is provided at the opening of such a chamber, and during the exposure operation, the output of the switch is detected to stop the laser oscillation or the transfer operation to prevent a safety problem. There is. However, regardless of the operation of the target device to which the interlock is applied, it may be desired to replace the reticle or wafer during exposure or during transportation.
In that case, it is not efficient to stop the target device every time the wafer or reticle is replaced. Therefore, the switch state is not detected in an operating state where there is no expected safety problem, and there is a safety problem. If there is a door, the door is locked to prevent the chamber opening from opening.

[0003]

However, in the prior art, there is a troublesome operation such as unlocking the door. When installing a pod type transport device,
There is a case where there is no switch in the opening, and even if the opening exists, the situation is unknown to the target device side.

Further, if the opening is present, contaminants may enter into the target device from the outside of the target device, resulting in fogging of the lens and deterioration of the resist.

An object of the present invention is to provide an interlock device and an exposure apparatus which can easily and surely stop the operation of the target device according to the state of a chamber surrounding the target device. Another object of the present invention is to make it possible to easily and safely access the inside of the device from the outside.

[0006]

In order to solve the above problems, the present invention provides an interlock device for restricting the operation of a target device according to the state of a chamber surrounding the target device to be interlocked. In the above, a differential pressure gauge for monitoring the pressure difference between the inside and the outside of the chamber is provided, and the function of detecting the state of the chamber by monitoring the change in the pressure difference between the inside and the outside of the chamber. In the present invention, the chamber has an openable / closable portion, and it is desirable to limit the operation of the target device by detecting the open state of the openable / closable portion. The openable / closable portion includes a door or a panel.

Further, the present invention has a switch in the chamber for detecting an open state of an openable / closable portion for accessing the inside of the target device, and the change in pressure difference between inside and outside of the chamber is changed by the differential pressure gauge. It is desirable to have a function of monitoring and detecting the open state of the openable / closable portion with the switch, and the target is determined by the change in the pressure difference between the inside and outside of the chamber and the open state of the openable / closable portion detected by the switch. It is possible to detect an abnormality of the apparatus, and the abnormality of the target apparatus is detected by the change in the pressure difference between the inside and outside of the chamber and the open state of the openable / closable portion detected by the switch, and the operation is stopped. It is preferable to have an interlock function.

It is preferable that the laser oscillation of the target device is stopped by detecting the state of the chamber surrounding the target device by the change in the pressure difference between the inside and the outside of the chamber.

Further, the present invention may be characterized in that the target apparatus is an exposure apparatus, and the conveyance of the original plate or the substrate is stopped by detecting the state of the chamber by the change in the pressure difference between the inside and the outside of the chamber. The operation of the original stage and the substrate stage may be stopped by detecting the state of the chamber by the change of the pressure difference between the inside and the outside of the chamber, and the state of the chamber may be changed by the change of the pressure difference between the inside and the outside of the chamber. The exposure operation may be stopped by detecting it, and the exposure sequence may be stopped by checking the pressure difference between the inside and the outside of the chamber by starting the exposure operation by detecting the state of the chamber.

The present invention is also applicable to an exposure apparatus including any one of the above interlock devices, in which the apparatus main body is arranged in a chamber including an openable / closable portion, and a pressure difference between the inside and outside of the chamber is set. Has a differential pressure gauge to monitor
The exposure apparatus may have a function of detecting an open state of the openable / closable portion by monitoring a change in pressure difference between the inside and outside of the chamber with the differential pressure gauge, and an openable / closable portion for accessing the inside of the apparatus main body. Even if the exposure apparatus has a switch for detecting the open state of the chamber and has a function of monitoring the change in the pressure difference between the inside and the outside of the chamber with the differential pressure gauge and detecting the open state of the openable / closable portion with the switch. The abnormality of the apparatus may be detected based on the change in the pressure difference between the inside and outside of the chamber and the open state of the openable / closable portion detected by the switch.

Further, according to the present invention, a step of installing a manufacturing apparatus group for various processes including any one of the above-described exposure apparatuses in a semiconductor manufacturing factory, and a semiconductor device is manufactured by a plurality of processes using the manufacturing apparatus group. It is also applicable to a semiconductor device manufacturing method having a process. The method further includes the steps of connecting the manufacturing apparatus group with a local area network, and performing data communication between the local area network and an external network outside the semiconductor manufacturing factory for information regarding at least one of the manufacturing apparatus group. It is desirable to have a database provided by a vendor or a user of the exposure apparatus via the external network to obtain maintenance information of the manufacturing apparatus by data communication, or a semiconductor manufacturing factory different from the semiconductor manufacturing factory. It is preferable that data is communicated with the product via the external network for production management.

Further, according to the present invention, a group of manufacturing apparatuses for various processes including the exposure apparatus, a local area network for connecting the group of manufacturing apparatuses, and an external network outside the factory can be accessed from the local area network. The present invention is also applied to a semiconductor manufacturing factory having a gateway and capable of performing data communication of information regarding at least one of the manufacturing apparatus group.

Further, the present invention is a method of maintaining an exposure apparatus installed in a semiconductor manufacturing factory, wherein a vendor or a user of the exposure apparatus provides a maintenance database connected to an external network of the semiconductor manufacturing factory. And a step of permitting access to the maintenance database from within the semiconductor manufacturing plant via the external network,
And transmitting the maintenance information accumulated in the maintenance database to the semiconductor manufacturing factory side via the external network.

The present invention also provides the above-mentioned exposure apparatus,
It may be characterized in that it further includes a display, a network interface, and a computer that executes software for the network, and allows maintenance information of the exposure apparatus to be data-communicated via a computer network. The network software is
A user interface for accessing a maintenance database provided by a vendor or a user of the exposure apparatus, which is connected to an external network of a factory in which the exposure apparatus is installed, is provided on the display, and from the database via the external network. It is preferable to be able to obtain information.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION (First Embodiment) An embodiment of the present invention will be described by taking an interlock device of a semiconductor exposure apparatus surrounded by a constant temperature chamber as an example.

FIG. 1 is a block diagram showing the outline of a semiconductor exposure apparatus equipped with an interlock device according to an embodiment of the present invention, and FIG. 2 is an external view of an exposure apparatus equipped with a pod type reticle transfer system and an automatic wafer loading apparatus. It is a perspective view shown.

In the figure, 1 is a console for operating a semiconductor exposure apparatus, 2 is an illumination optical system, 3 is a laser light source, and 4 is a reticle as an original plate which is a basis of an exposure pattern.
Reference numeral 5 denotes a reticle stage that moves the reticle 4 to fix or scan it in a correct position. 6 is an exposure optical system, and 7 is a wafer as a substrate to be exposed. A wafer stage 8 moves the wafer 7 to an exposure position or performs a scanning operation in synchronization with the reticle 4. The exposure apparatus main body includes an illumination optical system 2, a laser light source 3, a reticle stage 5, an exposure optical system 6 and a wafer stage 8.

Reference numeral 9 denotes a constant temperature chamber which surrounds the main body of the exposure apparatus and in which a precise temperature control of the entire inside is performed. Reference numeral 10 is a maintenance door. 11 is a reticle carry-in door, 12
Is a reticle transfer system, and 13 is a wafer loading door. Each door 1
Each of 0, 11, and 13 is an openable / closable portion in the present embodiment. Reference numeral 14 is a wafer transfer system, 15 is a pod type reticle transfer device, and 16 is a wafer loading device. Reference numeral 17 shown in FIG. 3 is a reticle transport elevator. Reference numeral 18 is a reticle transfer pod, and 19 is a fine differential pressure gauge for measuring the pressure difference between the inside and outside of the constant temperature chamber 9. In the case of the present embodiment, the constant temperature chamber 9 surrounds the illumination optical system 2, the reticle stage 5, the exposure optical system 6, the wafer stage 8, the reticle transfer system 12, the wafer transfer system 14, etc. of the exposure apparatus.

Next, the interlock operation will be described. The operator operates the semiconductor exposure apparatus using the console 1. Light of a single wavelength emitted from the laser light source 3 is shaped, passes through the illumination optical system 2, and forms an image of the exposure pattern of the reticle 4 on the wafer 7 through the exposure optical system 6. At this time, the exposure apparatus performs ultra-precision positioning between the reticle stage 5 and the wafer stage 8 to repeatedly perform batch exposure on the wafer 7. The overlay accuracy is 1 μm or less. In a device called a scanning stepper, in addition to the above stepper operation, the reticle stage 5 and the wafer stage 8 perform a scanning operation for one shot in synchronization.

The light of the laser light source 3 used for semiconductor exposure has a large energy of 2 kJ or more in order to increase the exposure efficiency, and has a very short wavelength in the ultraviolet range, so that it has a great influence on the human body. It is necessary to avoid jumping directly into the eyes even with the scattered light. Further, if an unexpected impurity is present in the apparatus, it is ionized by being exposed to the exposure light and adheres to the lens surface of the illumination optical system 2 or the exposure optical system 6 to reduce the light transmittance. Normally, the inside of the exposure device
It is surrounded by a constant temperature chamber 9 and kept clean by an air circulation function including a temperature controlled air blowing fan 20, a chemical filter 21 and the like. Further, the inside of the constant temperature chamber 9 is set to have a higher atmospheric pressure than the outside, and is controlled to be always positive pressure. Therefore, the constant temperature chamber 9 is equipped with a fine differential pressure gauge 19 for measuring the pressure difference between the inside and the outside.

In the semiconductor exposure apparatus used in the production line, the wafer 7 is introduced into the wafer transfer system 14 from the outside by the automatic transfer by the wafer transfer device 16 without human intervention. However, when it is used in a research facility or the like, the wafer 7 is used as the illumination optical system 2 to 10.
A wafer carrier that holds about one wafer is used to carry in and collect the wafers 7 into and from the wafer carry-in door 13 by a human hand.
When the wafer loading door 13 is opened, the atmospheric pressure inside and outside the constant temperature chamber 9 changes.
Detect with. The control unit of the apparatus always confirms the signal of the fine differential pressure gauge 19, and when an opening is generated in the constant temperature chamber 9, the oscillation of the laser light source 3 is immediately stopped, the wafer stage 8 and the reticle stage 5 are stopped, and the exposure is performed. Moves to the standby state and displays an error. When the pressure difference returns to the normal value, exposure is automatically restarted.

When the reticle 4 is replaced, the reticle carry-in door 11 is opened and the reticle 4 is replaced. When the reticle carry-in door 11 is opened, the pressure difference between the inside and outside of the constant temperature chamber 9 becomes small. The differential pressure state detected by the slight differential pressure gauge 19 is judged by the controller of the apparatus, and the operation of the reticle transport system 12 is stopped to shift to the safe state. When the reticle carry-in door 11 is closed and the pressure difference returns to the normal value, the reticle transport system 12 is shifted from the safe state to the normal state to prepare for reticle exchange.

(Second Embodiment) As shown in FIGS. 2 and 3, when reticle transport is performed using a carrier called a reticle transport pod 18, when the reticle transport elevator 17 is lowered. Even when the pod 18 is removed, the opening opens at the bottom of the pod 18 and the fine differential pressure gauge 1
9 detects the fluctuation of the pressure difference and performs the above operation.

(Third Embodiment) The fine differential pressure gauge 19 is checked at the beginning of the exposure sequence, and if the pressure difference exceeds a certain level, the exposure sequence is promptly executed. If the pressure difference is less than a certain value, it is determined that the opening of the constant temperature chamber 9 is in the open state or the temperature control air is weakly blown, and the exposure sequence is stopped to notify the operator of the abnormality. I do.

(Fourth Embodiment) In the case of a system in which the safety to the human body is maintained only by opening the wafer loading door 13 and the reticle loading door 11 during exposure, depending on the value of the pressure difference confirmed by the fine differential pressure gauge 19. If the value is larger than a certain value, it is determined that the open state of the opening of the constant temperature chamber 9 is due to the opening of the wafer loading door 13 or the reticle loading door 11, and the normal exposure sequence is executed. If the pressure difference is less than a certain value, the device is abnormal because the opening of the device is due to the opening of the maintenance door 10 as an openable / closable part or the temperature control air is weakly blown. Then, the exposure sequence is stopped and the operator is notified of the abnormality.

(Fifth Embodiment) FIG. 4 is a block diagram showing the outline of a semiconductor exposure apparatus according to the fifth embodiment of the present invention. In the figure, reference numeral 1 is a console for operating the semiconductor exposure apparatus, and an operator operates the apparatus. Reference numeral 2 is an illumination optical system. 3 is a laser light source. Reference numeral 4 is a reticle as an original plate on which an exposure pattern is drawn. Reference numeral 5 denotes a reticle stage that moves the reticle 4 to fix or scan it in a correct position. Reference numeral 6 is an exposure optical system.
Reference numeral 7 is a wafer as a substrate to be exposed. A wafer stage 8 moves the wafer 7 to an exposure position or performs a scanning operation in synchronization with the reticle 4.

Reference numeral 9 is a thermostatic chamber in which the precise temperature control of the whole is performed. Reference numeral 10 is a maintenance door. Reference numeral 11 is a reticle carry-in door. Reference numeral 12 is a reticle transport system.
Reference numeral 13 is a wafer loading door. Reference numeral 14 is a wafer transfer system. Reference numeral 19 is a fine differential pressure gauge for measuring the pressure difference (pressure difference) inside and outside the constant temperature chamber 9. Reference numeral 20 is a temperature control air blowing fan. A chemical filter 21 removes harmful chemical substances from the device. 26 is a door open / close detection switch,
This is a maintenance door 10, a reticle carry-in door 11 and a wafer carry-in door 1 as the openable / closable portion of the constant temperature chamber 9.
Each of the three is individually provided and detects the open / closed state of the corresponding door or panel. Reference numeral 27 is an apparatus control unit.

Next, the interlock operation of the semiconductor exposure apparatus according to this embodiment will be described with reference to FIG. The operator operates the semiconductor exposure apparatus using the console 1. Light of a single wavelength emitted from the laser light source 3 passes through the illumination optical system 2, is shaped, and is projected onto the reticle 4. The drawing pattern on the reticle 4 is imaged on the wafer 7 by the projection light through the exposure optical system 6. At this time, ultra-precision positioning is performed between the reticle stage 5 and the wafer stage 8, and the wafer 7 is repeatedly subjected to batch exposure. Superposition accuracy is 1μ
Achieve m or less. In an apparatus called a scanning stepper, the reticle stage 5 and the wafer stage 8 perform a scanning operation in synchronization with one shot in addition to the above stepper operation.

The light from the laser light source 3 for semiconductor exposure has a large energy of 2 kJ or more in order to improve the exposure efficiency.
Since it has an ultra-short wavelength in the ultraviolet range, it has a great impact on the human body.
Even if it is the scattered light, you should avoid jumping into your eyes immediately after that. Further, if an unexpected impurity is present in the apparatus, it is ionized by contact with the exposure light and adheres to the lens surfaces of the illumination optical system 2 and the exposure optical system 6 to reduce the light transmittance. For various reasons as described above, the inside of the device is usually surrounded by a constant temperature chamber 9,
It is kept clean by the air circulation function and the chemical filter 21 and the like. Furthermore, in order to prevent the entry of substances from the outside inside the constant temperature chamber 9, the atmospheric pressure is set higher than the outside,
It is controlled so that the pressure is always positive. For that reason,
A fine differential pressure gauge 19 for measuring the pressure difference between inside and outside is provided.

In the semiconductor exposure apparatus used in the production line, the wafer 7 is introduced into the wafer transfer system 14 from the outside by the automatic transfer by the automatic wafer transfer device without human intervention. However, when it is used in a research facility or the like, an operator carries in and collects the wafers 7 into and from the wafer carry-in door 13 by using a wafer carrier in which about 2 to 10 wafers 7 are loaded. Similarly reticle 4
Also, the operator opens the reticle carry-in door 11 and replaces the reticle 4. Further, at the time of maintenance, the worker opens the maintenance door 10 to perform the work. Each door 1
Door open / close detection switches 26 are installed at 0, 11, and 13.

When the wafer carry-in door 13, the reticle carry-in door 11 or the maintenance door 10 is opened, the door open / close detection switch 26 installed in each door operates, and the change in the open / closed state is sent to the apparatus controller 27. . At the same time, the differential pressure gauge 19 detects the value of the change in the atmospheric pressure inside and outside the device. The device control unit 27 always checks the signals of the door opening / closing detection switch 26 and the differential pressure gauge 19 of each part, and when any one of the doors is in an open state and an opening is formed in the constant temperature chamber 9, Immediately stops the oscillation of the laser light source 3, stops the wafer stage 8 and the reticle stage 5, shifts to the exposure standby state, and displays an error. It is confirmed from the information of the door opening / closing detection switch 26 that the opening is closed, and when the atmospheric pressure difference returns to the normal value, the exposure is automatically restarted.

At this time, if the signal from the fine differential pressure gauge 19 does not return to the normal value even after a certain period of time, it is determined that there is an abnormality in the device, and error information is displayed on the operation console 1.
Prompt the operator to check by sounding a buzzer.

During operation of the apparatus, the signal of the differential pressure gauge 19 is confirmed, and even if an opening is formed in the apparatus, even if there is no signal input from the door opening / closing detection switch 26, the apparatus still operates. It is judged that there is an abnormality, error information is displayed on the operation console 1, and a buzzer sound is emitted to prompt the operator for inspection.

(Sixth Embodiment) Even if the wafer carry-in door 13 or the reticle carry-in door 11 is opened during exposure, it has a mechanical structure that is surely kept safe for the operator who opened those doors. In the device, changes in the differential pressure condition only affect the accuracy of the device. In such an apparatus, when the differential pressure state detected by the fine differential pressure gauge 19 is such that there is no problem in the exposure accuracy of the apparatus, the following three types of operation are performed by the information of the door opening / closing detection switch 26. The control unit 27 determines and selects. As the first operation, if the openable / closable portion is a portion such as the wafer carry-in door 13 or the reticle carry-in door 11 in which work is considered to occur during the normal exposure operation, the normal exposure operation is continued. As the second operation, when the opening / closing part for the opening is the maintenance door 10, the exposure operation is stopped so that the maintenance work can be performed safely.
As the third operation, when all the openable / closable parts are closed and there is no opening, the exposure operation continues, but it is displayed on the operation console 1 that the differential pressure state has changed due to some factor. Warn the operator by sounding a buzzer.

Next, when the differential pressure state detected by the fine differential pressure gauge 19 is a value which is considered to affect the exposure accuracy of the apparatus, the exposure operation is stopped by the apparatus control unit 27 and the operation console 1 is displayed. The operator is informed that the device has stopped by displaying a buzzer sound.

(Embodiment of Semiconductor Production System) Next,
An example of a production system of semiconductor devices (semiconductor chips such as IC and LSI, liquid crystal panels, CCDs, thin film magnetic heads, micromachines, etc.) using an apparatus including the interlock device according to the present invention will be described. This is to perform maintenance services such as troubleshooting of a manufacturing apparatus installed in a semiconductor manufacturing factory, periodic maintenance, or software provision using a computer network outside the manufacturing factory.

FIG. 5 shows the entire system cut out from a certain angle. In the figure, 101 is a business office of a vendor (apparatus supplier) that provides a semiconductor device manufacturing apparatus. As an example of the manufacturing apparatus, a semiconductor manufacturing apparatus for various processes used in a semiconductor manufacturing factory, for example,
Pre-process equipment (lithography equipment such as exposure equipment, resist processing equipment, etching equipment, heat treatment equipment, film forming equipment,
Flattening equipment, etc.) and post-process equipment (assembling equipment, inspection equipment, etc.) are assumed. In the business office 101, a host management system 10 that provides a maintenance database for manufacturing equipment is provided.
8, a plurality of operation terminal computers 110, and a local area network (LAN) 109 that connects these to construct an intranet or the like. Host management system 1
08 is provided with a gateway for connecting the LAN 109 to the Internet 105, which is an external network of the office, and a security function for restricting access from the outside.

On the other hand, 102 to 104 are manufacturing factories of semiconductor manufacturers as users of manufacturing apparatuses. The manufacturing factories 102 to 104 may be factories belonging to different manufacturers or may be factories belonging to the same manufacturer (for example, a factory for pre-process, a factory for post-process, etc.). In each of the factories 102 to 104, a plurality of manufacturing apparatuses 106, a local area network (LAN) 111 that connects them to construct an intranet, and a host as a monitoring apparatus that monitors the operating status of each manufacturing apparatus 106 are provided. A management system 107 is provided. Each factory 1
02-104 host management system 107
Is provided with a gateway for connecting the LAN 111 in each factory to the Internet 105 which is an external network of the factory. As a result, the host management system 108 on the vendor 101 side can be accessed from the LAN 111 of each factory via the Internet 105, and the security function of the host management system 108 allows access to only limited users. In particular,
Via the Internet 105, the factory side notifies the vendor side of status information indicating the operating status of each manufacturing apparatus 106 (for example, a symptom of a manufacturing apparatus in which a trouble has occurred), and response information corresponding to the notification (for example, It is possible to receive maintenance information such as information instructing how to deal with troubles, software and data for dealing with troubles, the latest software, and help information from the vendor side. For data communication between the factories 102 to 104 and the vendor 101 and data communication on the LAN 111 in each factory, a communication protocol (T
CP / IP) is used. Instead of using the Internet as an external network outside the factory, it is also possible to use a leased line network (ISDN or the like) which is highly secure without being accessed by a third party. Further, the host management system is not limited to one provided by a vendor, and a user may construct a database and place it on an external network to permit access from a plurality of factories of the user to the database.

Now, FIG. 6 is a conceptual diagram showing the entire system of this embodiment cut out from an angle different from that shown in FIG. In the above example, a plurality of user factories each equipped with a manufacturing apparatus and a management system of a vendor of the manufacturing apparatus are connected by an external network, and production management of each factory or at least one unit is performed via the external network. The information of the manufacturing apparatus was data-communicated. On the other hand, in this example, a factory equipped with manufacturing equipment of a plurality of vendors and a management system of each vendor of the plurality of manufacturing equipments are connected by an external network outside the factory, and maintenance information of each manufacturing equipment is displayed. It is for data communication. In the figure, reference numeral 201 denotes a manufacturing plant of a manufacturing apparatus user (semiconductor device manufacturing maker), and a manufacturing apparatus for performing various processes is installed on a manufacturing line of the factory.
The film forming processing device 204 is introduced. Although only one manufacturing factory 201 is shown in FIG. 6, a plurality of factories are actually networked in the same manner. Each device in the factory is connected by LAN 206 to form an intranet,
The host management system 205 manages the operation of the manufacturing line.

On the other hand, the host management system 21 for remote maintenance of the supplied equipment is provided at each business office of the vendor (equipment supply manufacturer) such as the exposure equipment manufacturer 210, the resist processing equipment manufacturer 220, the film deposition equipment manufacturer 230.
1, 221, 231, which are provided with the maintenance database and the gateway of the external network as described above. A host management system 205 that manages each device in the user's manufacturing plant, and a vendor management system 2 for each device
11, 221, and 231 are connected to each other via the external network 200 such as the Internet or a dedicated line network. In this system, when trouble occurs in any of the series of production equipment on the production line,
Although the operation of the manufacturing line is suspended, it is possible to quickly respond by receiving remote maintenance via the Internet 200 from the vendor of the device in which the trouble has occurred, and the suspension of the manufacturing line can be minimized. .

Each manufacturing apparatus installed in the semiconductor manufacturing factory has a display, a network interface, and a computer for executing the network access software and the apparatus operation software stored in the storage device. The storage device is a built-in memory, a hard disk, or a network file server. The network access software includes a dedicated or general-purpose web browser, and provides a user interface with a screen as shown in FIG. 7 on the display. The operator who manages the manufacturing equipment at each factory refers to the screen and refers to the manufacturing equipment model 401, serial number 402, and subject 40 of the trouble.
3. Input information such as date of occurrence 404, urgency 405, symptom 406, coping method 407, and progress 408 in input items on the screen. The input information is transmitted to the maintenance database via the Internet, and the appropriate maintenance information as a result is returned from the maintenance database and presented on the display. In addition, the user interface provided by the web browser further has hyperlink functions 410 to 4 as shown in the figure.
12 enables operators to access more detailed information on each item, pull out the latest version of software used for manufacturing equipment from the software library provided by the vendor, and use the operation guide (help Information) can be withdrawn. Here, the maintenance information provided by the maintenance database includes the information about the present invention described above, and the software library also provides the latest software for implementing the present invention.

Next, a semiconductor device manufacturing process using the above-described production system will be described. FIG. 8 shows a flow of the whole manufacturing process of the semiconductor device. In step 1 (circuit design), the circuit of the semiconductor device is designed. In step 2 (mask manufacturing), a mask having the designed circuit pattern is manufactured. On the other hand, step 3
In (wafer manufacture), a wafer is manufactured using a material such as silicon. Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by the lithography technique using the mask and the wafer prepared above. The next step 5 (assembly) is called a post-process, which is a process of forming a semiconductor chip using the wafer manufactured in step 4, and includes an assembly process (dicing, bonding), a packaging process (chip encapsulation), and the like. Including steps. In step 6 (inspection), the semiconductor device manufactured in step 5 undergoes inspections such as an operation confirmation test and a durability test. A semiconductor device is completed through these processes and shipped (step 7). The front-end process and the back-end process are performed in separate dedicated factories, and maintenance is performed for each of these factories by the remote maintenance system described above. Information for production management and device maintenance is also data-communicated between the front-end factory and the back-end factory via the Internet or the leased line network.

FIG. 9 shows the detailed flow of the wafer process. In step 11 (oxidation), the surface of the wafer is oxidized. In step 12 (CVD), an insulating film is formed on the wafer surface. In step 13 (electrode formation), electrodes are formed on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted in the wafer. Step 15
In (resist processing), a photosensitive agent is applied to the wafer. In step 16 (exposure), the circuit pattern of the mask is printed and exposed on the wafer by the exposure apparatus described above. In step 17 (development), the exposed wafer is developed. In step 18 (etching), parts other than the developed resist image are removed. In step 19 (resist stripping), the resist that is no longer needed after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer. Since the manufacturing equipment used in each process is maintained by the remote maintenance system described above, troubles can be prevented in advance, and even if troubles occur, quick recovery is possible, and semiconductor devices can be compared to conventional devices. Productivity can be improved.

[0044]

As described above, according to the present invention,
The operation of the target device can be stopped easily and surely according to the state of the chamber surrounding the target device, the access situation to the device from the outside can be easily detected, and the inside of the device from the outside can be easily detected. Easy access and always safe work.

[Brief description of drawings]

FIG. 1 is a configuration diagram showing an outline of a semiconductor exposure apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view showing an outline of an exposure apparatus equipped with a pod type reticle transport system.

FIG. 3 is a partially enlarged view showing a part of FIG. 2 in a cutaway manner.

FIG. 4 is a configuration diagram showing an outline of a semiconductor exposure apparatus according to another embodiment of the present invention.

FIG. 5 is a conceptual view of a semiconductor device production system using the apparatus according to the present invention viewed from an angle.

FIG. 6 is a conceptual view of a semiconductor device production system using the apparatus according to the present invention viewed from another angle.

FIG. 7 is a specific example of a user interface.

FIG. 8 is a diagram illustrating a flow of a device manufacturing process.

FIG. 9 is a diagram illustrating a wafer process.

[Explanation of symbols]

1: Console, 2: Illumination optical system, 3: Laser light source,
4: reticle, 5: reticle stage, 6: exposure optical system, 7: wafer, 8: wafer stage, 9: constant temperature chamber, 10: maintenance door (openable / closable portion), 11: reticle carry-in door (openable / closable portion) , 12: Reticle transport system,
13: Wafer carry-in door (openable / closable part), 14: Wafer carrying system, 15: Pod type reticle carrying device, 16: Wafer carrying-in device, 17: Reticle carrying elevator, 18: Reticle carrying pod, 19: Fine differential pressure gauge, 20: Temperature control air blowing fan, 21: Chemical filter, 26: Door opening / closing detection switch, 27: Device control unit, 101: Vendor's office, 102, 103, 104: Manufacturing factory, 105: Internet, 106: Manufacturing Equipment, 107: Factory host management system, 108: Vendor side host management system, 109: Vendor side local area network (LAN), 110: Operating terminal computer, 111:
Factory Local Area Network (LAN), 20
0: external network, 201: manufacturing equipment user manufacturing factory, 202: exposure equipment, 203: resist processing equipment,
204: film forming apparatus, 205: factory host management system, 206: factory local area network (L
AN), 210: exposure apparatus maker, 211: host management system of business of exposure apparatus maker, 220: resist processing apparatus maker, 221: host management system of business of resist processing apparatus maker, 230: film deposition apparatus maker,
231: Host management system of business office of film forming apparatus manufacturer, 401: Model of manufacturing apparatus, 402: Serial number, 403: Subject of trouble, 404: Date of occurrence, 40
5: Urgency, 406: Symptoms, 407: Remedies, 408:
Progress, 410, 411, 412: Hyperlink function.

Claims (21)

[Claims] 1. An interlock device for limiting an operation of a target device according to a state of a chamber surrounding the target device to be interlocked, comprising a differential pressure gauge for monitoring a pressure difference between the inside and the outside of the chamber. An interlock device having a function of detecting a state of the chamber by monitoring a change in pressure difference between the inside and the outside of the chamber. 2. The interlock device according to claim 1, wherein the chamber has an openable / closable portion, and limits an operation of the target device by detecting an open state of the openable / closable portion. . 3. The chamber has a switch for detecting an open state of an openable / closable portion for accessing the inside of the target device, the change in pressure difference between inside and outside of the chamber is monitored by the differential pressure gauge, and The interlock device according to claim 1, further comprising a function of detecting an open state of the openable / closable portion with a switch. 4. The interface according to claim 3, wherein an abnormality of the target device is detected based on a change in a pressure difference between the inside and the outside of the chamber and an open state of the openable / closable portion detected by the switch. Locking device. 5. An interlock function for detecting an abnormality of the target device and stopping its operation based on a change in pressure difference between the inside and outside of the chamber and an open state of the openable / closable portion detected by the switch. The interlock device according to claim 4, characterized in that 6. The laser oscillation of the target device is stopped by detecting a state of a chamber surrounding the target device by a change in a pressure difference between the inside and the outside of the chamber. The interlock device described in 1. 7. The target apparatus is an exposure apparatus, and the conveyance of either the original plate or the substrate is stopped by detecting the state of the chamber by the change in the pressure difference between the inside and the outside of the chamber. The interlock device according to any one of 1 to 5. 8. The target apparatus is an exposure apparatus, and the operation of the original stage and the substrate stage is stopped by detecting the state of the chamber by the change in the pressure difference between the inside and the outside of the chamber. 6. The interlock device according to any one of to 5. 9. The apparatus according to claim 1, wherein the target apparatus is an exposure apparatus, and the exposure operation is stopped by detecting a state of the chamber by a change in a pressure difference between the inside and the outside of the chamber. An interlock device according to claim 1. 10. The target device is an exposure device, and by detecting the state of the chamber, the pressure difference between the inside and outside of the chamber is confirmed before the exposure operation is started, and the exposure sequence is stopped. Item 7. The interlock device according to any one of Items 1 to 5. 11. An exposure apparatus comprising the interlock device according to any one of claims 1 to 10. 12. The apparatus main body is arranged in a chamber having an openable / closable portion, and has a differential pressure gauge for monitoring a pressure difference between the inside and outside of the chamber, and a change in the pressure difference between inside and outside of the chamber is transmitted to the differential pressure gauge. An exposure apparatus having a function of detecting the open state of the openable / closable portion by monitoring the open state. 13. A switch for detecting an open state of an openable / closable portion for accessing the inside of the apparatus main body, wherein a change in pressure difference between the inside and outside of the chamber is monitored by the differential pressure gauge and the switch can be opened / closed. 13. The exposure apparatus according to claim 12, which has a function of detecting an open state of a section. 14. A change in pressure difference between the inside and the outside of the chamber,
The abnormality of the device is detected based on the open state of the openable / closable portion detected by the switch.
The exposure apparatus according to. 15. A step of installing a manufacturing apparatus group for various processes including the exposure apparatus according to claim 11 in a semiconductor manufacturing factory, and a semiconductor device by a plurality of processes using the manufacturing apparatus group. And a step of manufacturing the semiconductor device. 16. Data communication of information relating to at least one of the manufacturing apparatus group between the step of connecting the manufacturing apparatus group by a local area network and the local network and an external network outside the semiconductor manufacturing factory. 16. The method for manufacturing a semiconductor device according to claim 15, further comprising: 17. A database provided by a vendor or a user of the exposure apparatus is accessed through the external network to obtain maintenance information of the manufacturing apparatus by data communication, or a semiconductor manufacturing factory different from the semiconductor manufacturing factory. 17. The production management is performed by performing data communication with the other via the external network.
A method for manufacturing a semiconductor device according to. 18. A manufacturing apparatus group for various processes including the exposure apparatus according to claim 11, a local area network connecting the manufacturing apparatus group, and an external unit outside the factory from the local area network. A semiconductor manufacturing factory, comprising a gateway that enables access to a network, and enabling data communication of information regarding at least one of the manufacturing apparatus group. 19. The semiconductor device according to claim 1, which is installed in a semiconductor manufacturing factory.
The maintenance method for an exposure apparatus according to any one of 1 to 14, wherein a vendor or a user of the exposure apparatus provides a maintenance database connected to an external network of the semiconductor manufacturing factory, and the inside of the semiconductor manufacturing factory. From the above to permit access to the maintenance database via the external network, and to transmit the maintenance information accumulated in the maintenance database to the semiconductor manufacturing factory side via the external network. Method for maintaining exposure equipment. 20. The exposure apparatus according to claim 11, further comprising a display, a network interface, and a computer that executes network software, and the exposure apparatus maintenance information is transmitted via a computer network. The exposure apparatus is characterized in that it is possible to perform data communication by using it. 21. The network software comprises:
A user interface for accessing a maintenance database provided by a vendor or a user of the exposure apparatus, which is connected to an external network of a factory in which the exposure apparatus is installed, is provided on the display, and from the database via the external network. 21. The exposure apparatus according to claim 20, which makes it possible to obtain information.