JP2003020332A - Optical disk substrate - Google Patents
Optical disk substrateInfo
- Publication number
- JP2003020332A JP2003020332A JP2001204375A JP2001204375A JP2003020332A JP 2003020332 A JP2003020332 A JP 2003020332A JP 2001204375 A JP2001204375 A JP 2001204375A JP 2001204375 A JP2001204375 A JP 2001204375A JP 2003020332 A JP2003020332 A JP 2003020332A
- Authority
- JP
- Japan
- Prior art keywords
- optical disk
- disk substrate
- substrate
- bis
- polycarbonate resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 50
- 230000003287 optical effect Effects 0.000 title claims abstract description 44
- 229920005668 polycarbonate resin Polymers 0.000 claims abstract description 29
- 239000004431 polycarbonate resin Substances 0.000 claims abstract description 29
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 23
- 125000003118 aryl group Chemical group 0.000 claims abstract description 8
- 238000001746 injection moulding Methods 0.000 claims description 15
- 229920005989 resin Polymers 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- 238000000465 moulding Methods 0.000 abstract description 19
- VHLLJTHDWPAQEM-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)-4-methylpentan-2-yl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)(CC(C)C)C1=CC=C(O)C=C1 VHLLJTHDWPAQEM-UHFFFAOYSA-N 0.000 abstract description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 18
- 238000000034 method Methods 0.000 description 14
- 150000002989 phenols Chemical class 0.000 description 14
- -1 4,4'-dihydroxydiphenyl ester Chemical class 0.000 description 13
- 238000006243 chemical reaction Methods 0.000 description 11
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 238000006116 polymerization reaction Methods 0.000 description 6
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 5
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N dimethylmethane Natural products CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 5
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 description 5
- 239000000155 melt Substances 0.000 description 5
- 239000012778 molding material Substances 0.000 description 5
- 239000001294 propane Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 239000004417 polycarbonate Substances 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000002685 polymerization catalyst Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 150000001340 alkali metals Chemical class 0.000 description 2
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 2
- 150000001342 alkaline earth metals Chemical class 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- MUCRFDZUHPMASM-UHFFFAOYSA-N bis(2-chlorophenyl) carbonate Chemical compound ClC1=CC=CC=C1OC(=O)OC1=CC=CC=C1Cl MUCRFDZUHPMASM-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- ZIRIVHVGOAIFRG-UHFFFAOYSA-N methyl 2-(2-carboxyoxyphenyl)benzoate Chemical compound COC(=O)C1=CC=CC=C1C1=CC=CC=C1OC(O)=O ZIRIVHVGOAIFRG-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 230000035484 reaction time Effects 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- 238000005809 transesterification reaction Methods 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- 150000003755 zirconium compounds Chemical class 0.000 description 2
- GEPJYVPWXSKFIT-UHFFFAOYSA-N (2-chlorophenyl) phenyl carbonate Chemical compound ClC1=CC=CC=C1OC(=O)OC1=CC=CC=C1 GEPJYVPWXSKFIT-UHFFFAOYSA-N 0.000 description 1
- LKKLDKBWCWESPV-UHFFFAOYSA-N (2-phenylphenyl) hydrogen carbonate Chemical compound OC(=O)OC1=CC=CC=C1C1=CC=CC=C1 LKKLDKBWCWESPV-UHFFFAOYSA-N 0.000 description 1
- OBMAJDVACJRVJY-UHFFFAOYSA-N (3-bromo-2-phenylphenyl) hydrogen carbonate Chemical compound OC(=O)OC1=CC=CC(Br)=C1C1=CC=CC=C1 OBMAJDVACJRVJY-UHFFFAOYSA-N 0.000 description 1
- GPFJHNSSBHPYJK-UHFFFAOYSA-N (3-methylphenyl) hydrogen carbonate Chemical compound CC1=CC=CC(OC(O)=O)=C1 GPFJHNSSBHPYJK-UHFFFAOYSA-N 0.000 description 1
- JOSARTKEJSZAIX-UHFFFAOYSA-N (3-nitro-2-phenylphenyl) hydrogen carbonate Chemical compound OC(=O)OC1=CC=CC([N+]([O-])=O)=C1C1=CC=CC=C1 JOSARTKEJSZAIX-UHFFFAOYSA-N 0.000 description 1
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 description 1
- NFAOATPOYUWEHM-UHFFFAOYSA-N 2-(6-methylheptyl)phenol Chemical compound CC(C)CCCCCC1=CC=CC=C1O NFAOATPOYUWEHM-UHFFFAOYSA-N 0.000 description 1
- FDIPWBUDOCPIMH-UHFFFAOYSA-N 2-decylphenol Chemical compound CCCCCCCCCCC1=CC=CC=C1O FDIPWBUDOCPIMH-UHFFFAOYSA-N 0.000 description 1
- CYEJMVLDXAUOPN-UHFFFAOYSA-N 2-dodecylphenol Chemical compound CCCCCCCCCCCCC1=CC=CC=C1O CYEJMVLDXAUOPN-UHFFFAOYSA-N 0.000 description 1
- HMWIHOZPGQRZLR-UHFFFAOYSA-N 2-hexadecylphenol Chemical compound CCCCCCCCCCCCCCCCC1=CC=CC=C1O HMWIHOZPGQRZLR-UHFFFAOYSA-N 0.000 description 1
- QEMHBAGGYKJNSS-UHFFFAOYSA-N 2-icosylphenol Chemical compound CCCCCCCCCCCCCCCCCCCCC1=CC=CC=C1O QEMHBAGGYKJNSS-UHFFFAOYSA-N 0.000 description 1
- WCRKLZYTQVZTMM-UHFFFAOYSA-N 2-octadecylphenol Chemical compound CCCCCCCCCCCCCCCCCCC1=CC=CC=C1O WCRKLZYTQVZTMM-UHFFFAOYSA-N 0.000 description 1
- JOONSONEBWTBLT-UHFFFAOYSA-N 2-tetradecylphenol Chemical compound CCCCCCCCCCCCCCC1=CC=CC=C1O JOONSONEBWTBLT-UHFFFAOYSA-N 0.000 description 1
- OREKREJVUNVFJP-UHFFFAOYSA-N 2-triacontylphenol Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCCCCC1=CC=CC=C1O OREKREJVUNVFJP-UHFFFAOYSA-N 0.000 description 1
- RXNYJUSEXLAVNQ-UHFFFAOYSA-N 4,4'-Dihydroxybenzophenone Chemical compound C1=CC(O)=CC=C1C(=O)C1=CC=C(O)C=C1 RXNYJUSEXLAVNQ-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- VWGKEVWFBOUAND-UHFFFAOYSA-N 4,4'-thiodiphenol Chemical compound C1=CC(O)=CC=C1SC1=CC=C(O)C=C1 VWGKEVWFBOUAND-UHFFFAOYSA-N 0.000 description 1
- NZGQHKSLKRFZFL-UHFFFAOYSA-N 4-(4-hydroxyphenoxy)phenol Chemical compound C1=CC(O)=CC=C1OC1=CC=C(O)C=C1 NZGQHKSLKRFZFL-UHFFFAOYSA-N 0.000 description 1
- RQCACQIALULDSK-UHFFFAOYSA-N 4-(4-hydroxyphenyl)sulfinylphenol Chemical compound C1=CC(O)=CC=C1S(=O)C1=CC=C(O)C=C1 RQCACQIALULDSK-UHFFFAOYSA-N 0.000 description 1
- UMPGNGRIGSEMTC-UHFFFAOYSA-N 4-[1-(4-hydroxyphenyl)-3,3,5-trimethylcyclohexyl]phenol Chemical compound C1C(C)CC(C)(C)CC1(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 UMPGNGRIGSEMTC-UHFFFAOYSA-N 0.000 description 1
- UJCYBTZHUJWCMB-UHFFFAOYSA-N 4-[1-(4-hydroxyphenyl)-4-propan-2-ylcyclohexyl]phenol Chemical compound C1CC(C(C)C)CCC1(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 UJCYBTZHUJWCMB-UHFFFAOYSA-N 0.000 description 1
- VGFSOACUVJLBAA-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)-3,3-dimethylbutan-2-yl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)(C(C)(C)C)C1=CC=C(O)C=C1 VGFSOACUVJLBAA-UHFFFAOYSA-N 0.000 description 1
- KANXFMWQMYCHHH-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)-3-methylbutan-2-yl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)(C(C)C)C1=CC=C(O)C=C1 KANXFMWQMYCHHH-UHFFFAOYSA-N 0.000 description 1
- WCUDAIJOADOKAW-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)pentan-2-yl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)(CCC)C1=CC=C(O)C=C1 WCUDAIJOADOKAW-UHFFFAOYSA-N 0.000 description 1
- KSYGTCNPCHQRKM-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KSYGTCNPCHQRKM-UHFFFAOYSA-N 0.000 description 1
- NIRYBKWMEWFDPM-UHFFFAOYSA-N 4-[3-(4-hydroxyphenyl)-3-methylbutyl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)(C)CCC1=CC=C(O)C=C1 NIRYBKWMEWFDPM-UHFFFAOYSA-N 0.000 description 1
- ZJNKCNFBTBFNMO-UHFFFAOYSA-N 4-[3-(4-hydroxyphenyl)-5,7-dimethyl-1-adamantyl]phenol Chemical compound C1C(C)(C2)CC(C3)(C)CC1(C=1C=CC(O)=CC=1)CC23C1=CC=C(O)C=C1 ZJNKCNFBTBFNMO-UHFFFAOYSA-N 0.000 description 1
- YWFPGFJLYRKYJZ-UHFFFAOYSA-N 9,9-bis(4-hydroxyphenyl)fluorene Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C2=CC=CC=C21 YWFPGFJLYRKYJZ-UHFFFAOYSA-N 0.000 description 1
- VOWWYDCFAISREI-UHFFFAOYSA-N Bisphenol AP Chemical compound C=1C=C(O)C=CC=1C(C=1C=CC(O)=CC=1)(C)C1=CC=CC=C1 VOWWYDCFAISREI-UHFFFAOYSA-N 0.000 description 1
- HTVITOHKHWFJKO-UHFFFAOYSA-N Bisphenol B Chemical compound C=1C=C(O)C=CC=1C(C)(CC)C1=CC=C(O)C=C1 HTVITOHKHWFJKO-UHFFFAOYSA-N 0.000 description 1
- SDDLEVPIDBLVHC-UHFFFAOYSA-N Bisphenol Z Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCCC1 SDDLEVPIDBLVHC-UHFFFAOYSA-N 0.000 description 1
- VPDXTKDFJKXNII-UHFFFAOYSA-N C(C)[N+](CC)(CC)CC.NO Chemical compound C(C)[N+](CC)(CC)CC.NO VPDXTKDFJKXNII-UHFFFAOYSA-N 0.000 description 1
- VASHFXYQYXZKJA-UHFFFAOYSA-N C=1C=CC(C(C)C)(C=2C=CC(O)=CC=2)CC=1C(C)(C)C1=CC=C(O)C=C1 Chemical compound C=1C=CC(C(C)C)(C=2C=CC(O)=CC=2)CC=1C(C)(C)C1=CC=C(O)C=C1 VASHFXYQYXZKJA-UHFFFAOYSA-N 0.000 description 1
- OIFBSDVPJOWBCH-UHFFFAOYSA-N Diethyl carbonate Chemical compound CCOC(=O)OCC OIFBSDVPJOWBCH-UHFFFAOYSA-N 0.000 description 1
- IXMXZHOLMWENMD-UHFFFAOYSA-N OC1=CC=C(C=C1)C1(C(C=CC=C1)C(C)(C)C1=CC=C(C=C1)O)C(C)C Chemical compound OC1=CC=C(C=C1)C1(C(C=CC=C1)C(C)(C)C1=CC=C(C=C1)O)C(C)C IXMXZHOLMWENMD-UHFFFAOYSA-N 0.000 description 1
- ZMBUHRQOZGBLKH-UHFFFAOYSA-N OC1=CC=C(C=C1)C1(CC=C(C=C1)C(C)(C)C1=CC=C(C=C1)O)C(C)C Chemical compound OC1=CC=C(C=C1)C1(CC=C(C=C1)C(C)(C)C1=CC=C(C=C1)O)C(C)C ZMBUHRQOZGBLKH-UHFFFAOYSA-N 0.000 description 1
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- YZCKVEUIGOORGS-IGMARMGPSA-N Protium Chemical compound [1H] YZCKVEUIGOORGS-IGMARMGPSA-N 0.000 description 1
- 150000001218 Thorium Chemical class 0.000 description 1
- DXIBCWGFAPSVRU-UHFFFAOYSA-N [2-(2-chlorophenyl)phenyl] hydrogen carbonate Chemical compound OC(=O)OC1=CC=CC=C1C1=CC=CC=C1Cl DXIBCWGFAPSVRU-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229920003232 aliphatic polyester Chemical group 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 150000001341 alkaline earth metal compounds Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229940058905 antimony compound for treatment of leishmaniasis and trypanosomiasis Drugs 0.000 description 1
- 150000001463 antimony compounds Chemical class 0.000 description 1
- 239000008346 aqueous phase Substances 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- RQPZNWPYLFFXCP-UHFFFAOYSA-L barium dihydroxide Chemical compound [OH-].[OH-].[Ba+2] RQPZNWPYLFFXCP-UHFFFAOYSA-L 0.000 description 1
- 229910001863 barium hydroxide Inorganic materials 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- PASDCCFISLVPSO-UHFFFAOYSA-N benzoyl chloride Chemical class ClC(=O)C1=CC=CC=C1 PASDCCFISLVPSO-UHFFFAOYSA-N 0.000 description 1
- VBICKXHEKHSIBG-UHFFFAOYSA-N beta-monoglyceryl stearate Natural products CCCCCCCCCCCCCCCCCC(=O)OCC(O)CO VBICKXHEKHSIBG-UHFFFAOYSA-N 0.000 description 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
- LUQQDEDMRRRWGN-UHFFFAOYSA-N bis(2-bromophenyl) carbonate Chemical compound BrC1=CC=CC=C1OC(=O)OC1=CC=CC=C1Br LUQQDEDMRRRWGN-UHFFFAOYSA-N 0.000 description 1
- DQPSUGZZTADITQ-UHFFFAOYSA-N bis(2-nitrophenyl) carbonate Chemical compound [O-][N+](=O)C1=CC=CC=C1OC(=O)OC1=CC=CC=C1[N+]([O-])=O DQPSUGZZTADITQ-UHFFFAOYSA-N 0.000 description 1
- LGXDMAUHWFVPKO-UHFFFAOYSA-N bis(2-phenylphenyl) carbonate Chemical compound C=1C=CC=C(C=2C=CC=CC=2)C=1OC(=O)OC1=CC=CC=C1C1=CC=CC=C1 LGXDMAUHWFVPKO-UHFFFAOYSA-N 0.000 description 1
- 229940106691 bisphenol a Drugs 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 150000001639 boron compounds Chemical class 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- DEFZNQKDYOBMGU-UHFFFAOYSA-N decyl 2-hydroxybenzoate Chemical compound CCCCCCCCCCOC(=O)C1=CC=CC=C1O DEFZNQKDYOBMGU-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- QLVWOKQMDLQXNN-UHFFFAOYSA-N dibutyl carbonate Chemical compound CCCCOC(=O)OCCCC QLVWOKQMDLQXNN-UHFFFAOYSA-N 0.000 description 1
- IEJIGPNLZYLLBP-UHFFFAOYSA-N dimethyl carbonate Chemical compound COC(=O)OC IEJIGPNLZYLLBP-UHFFFAOYSA-N 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- GRWZHXKQBITJKP-UHFFFAOYSA-L dithionite(2-) Chemical compound [O-]S(=O)S([O-])=O GRWZHXKQBITJKP-UHFFFAOYSA-L 0.000 description 1
- ZOMIMPCSKRRCJI-UHFFFAOYSA-N docosyl 2-hydroxybenzoate Chemical compound CCCCCCCCCCCCCCCCCCCCCCOC(=O)C1=CC=CC=C1O ZOMIMPCSKRRCJI-UHFFFAOYSA-N 0.000 description 1
- CJYBKFFVXWWBMY-UHFFFAOYSA-N dodecyl 2-hydroxybenzoate Chemical compound CCCCCCCCCCCCOC(=O)C1=CC=CC=C1O CJYBKFFVXWWBMY-UHFFFAOYSA-N 0.000 description 1
- 238000004945 emulsification Methods 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- TWNBPYIMMRIFEF-UHFFFAOYSA-N ethyl 2-(2-carboxyoxyphenyl)benzoate Chemical compound CCOC(=O)C1=CC=CC=C1C1=CC=CC=C1OC(O)=O TWNBPYIMMRIFEF-UHFFFAOYSA-N 0.000 description 1
- ZQKQZBGDCHBTMC-UHFFFAOYSA-N ethyl 3-carboxyoxy-2-phenylbenzoate Chemical compound CCOC(=O)C1=CC=CC(OC(O)=O)=C1C1=CC=CC=C1 ZQKQZBGDCHBTMC-UHFFFAOYSA-N 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 150000002291 germanium compounds Chemical class 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- NHLHASWXBVULGU-UHFFFAOYSA-N hexadecyl 2-hydroxybenzoate Chemical compound CCCCCCCCCCCCCCCCOC(=O)C1=CC=CC=C1O NHLHASWXBVULGU-UHFFFAOYSA-N 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 150000002611 lead compounds Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 150000002697 manganese compounds Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Natural products C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- OMUKHBXIWYKOGL-UHFFFAOYSA-N methyl 3-carboxyoxy-2-phenylbenzoate Chemical compound COC(=O)C1=CC=CC(OC(O)=O)=C1C1=CC=CC=C1 OMUKHBXIWYKOGL-UHFFFAOYSA-N 0.000 description 1
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N o-biphenylenemethane Natural products C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 1
- 150000002908 osmium compounds Chemical class 0.000 description 1
- QBDSZLJBMIMQRS-UHFFFAOYSA-N p-Cumylphenol Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=CC=C1 QBDSZLJBMIMQRS-UHFFFAOYSA-N 0.000 description 1
- NKTOLZVEWDHZMU-UHFFFAOYSA-N p-cumyl phenol Natural products CC1=CC=C(C)C(O)=C1 NKTOLZVEWDHZMU-UHFFFAOYSA-N 0.000 description 1
- 238000005453 pelletization Methods 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 150000003856 quaternary ammonium compounds Chemical class 0.000 description 1
- 150000004023 quaternary phosphonium compounds Chemical class 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
- 229910001948 sodium oxide Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 125000003107 substituted aryl group Chemical group 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- JRMUNVKIHCOMHV-UHFFFAOYSA-M tetrabutylammonium bromide Chemical compound [Br-].CCCC[N+](CCCC)(CCCC)CCCC JRMUNVKIHCOMHV-UHFFFAOYSA-M 0.000 description 1
- RKHXQBLJXBGEKF-UHFFFAOYSA-M tetrabutylphosphanium;bromide Chemical compound [Br-].CCCC[P+](CCCC)(CCCC)CCCC RKHXQBLJXBGEKF-UHFFFAOYSA-M 0.000 description 1
- IFYFNVDTVZKNBZ-UHFFFAOYSA-N tetradecyl 2-hydroxybenzoate Chemical compound CCCCCCCCCCCCCCOC(=O)C1=CC=CC=C1O IFYFNVDTVZKNBZ-UHFFFAOYSA-N 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 229920006352 transparent thermoplastic Polymers 0.000 description 1
- HTCCWYQPPPBLQT-UHFFFAOYSA-N triacontyl 2-hydroxybenzoate Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCCCCOC(=O)C1=CC=CC=C1O HTCCWYQPPPBLQT-UHFFFAOYSA-N 0.000 description 1
- 238000004260 weight control Methods 0.000 description 1
- 150000003752 zinc compounds Chemical class 0.000 description 1
Landscapes
- Polyesters Or Polycarbonates (AREA)
- Optical Record Carriers And Manufacture Thereof (AREA)
- Manufacturing Optical Record Carriers (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、特定の芳香族ポリ
カーボネート樹脂を成形してなる光記録媒体、とりわけ
高密度記録媒体に関して、スタンパー形状に対する精密
転写性に優れたポリカーボネート樹脂より成形された光
ディスク基板および光学記録媒体に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical recording medium formed by molding a specific aromatic polycarbonate resin, and more particularly to a high-density recording medium, which is an optical disk substrate molded from a polycarbonate resin excellent in precision transferability to a stamper shape. And an optical recording medium.
【0002】[0002]
【従来の技術】従来、ポリカーボネート樹脂は、透明
性、耐熱性、機械的特性および寸法安定性等が優れてい
ることから、エンジニアリングプラスチックとして多く
の分野に広く使用されている。特にビスフェノールAを
二価フェノール成分として得られたポリカーボネート樹
脂は、透明性に優れることから光学材料、なかでも光デ
ィスク基板の材料として好適に使用されている。しか
し、近年、光ディスクは、高記録密度、薄肉化が急激に
進行しており、高記録密度化の手法としては、グルーブ
もしくはピットの間隔、すなわちトラックピッチを狭め
てトラック方向の記録密度を高めるものである。具体的
にはコンパクトディスク(CD)からデジタル・バーサ
タイル・ディスク(DVD)への高記録密度化にあって
はトラックピッチを1.6μmから0.74μmへと狭め
ることによりトラック方向の記録密度を約2倍に高めて
いる。一方、その成形においても高速サイクル化されて
いることもあいまって、高記録密度化された光ディスク
では従来のポリカーボネート樹脂はその成形性、なかで
も転写精度について必ずしも充分満足すべきものではな
かった。2. Description of the Related Art Conventionally, polycarbonate resins have been widely used in many fields as engineering plastics because of their excellent transparency, heat resistance, mechanical properties and dimensional stability. In particular, a polycarbonate resin obtained by using bisphenol A as a dihydric phenol component is excellent in transparency and is therefore suitably used as an optical material, especially as a material for an optical disk substrate. However, in recent years, optical discs have been rapidly increased in recording density and thinning. As a method of increasing the recording density, an interval between grooves or pits, that is, a track pitch is narrowed to increase the recording density in the track direction. Is. Specifically, in order to increase the recording density from a compact disc (CD) to a digital versatile disc (DVD), the recording pitch in the track direction is reduced by narrowing the track pitch from 1.6 μm to 0.74 μm. It's doubled. On the other hand, because of the fact that the molding is performed at a high speed cycle, the conventional polycarbonate resin has not always been sufficiently satisfactory in terms of moldability, especially transfer accuracy, in the optical disc having a high recording density.
【0003】そこで、転写精度を向上させるため、成形
機のシリンダー温度を380℃程度、金型温度を130
℃程度まで高くする必要があった。しかしながら、成形
温度を高くし、かつ成形サイクルを高速化すると金型か
ら取り出す際、離型不良が生じ、ピットやグルーブの形
状の変形が生じ、転写精度が低下するという問題が発生
する。Therefore, in order to improve the transfer accuracy, the cylinder temperature of the molding machine is about 380 ° C. and the mold temperature is 130.
It was necessary to raise it to about ℃. However, if the molding temperature is increased and the molding cycle is accelerated, there is a problem that when the mold is taken out of the mold, a mold release defect occurs, the shape of pits and grooves is deformed, and the transfer accuracy is lowered.
【0004】また、高流動性を付与するためにポリカー
ボネート樹脂中に低分子量体を多く含有させる方法(特
開平9−208684号公報、特開平11−1551号
公報など)、あるいは特定の長鎖アルキルフェノールを
末端停止剤として使用する方法(特開平11−2692
60号公報など)が提案されている。しかし、この低分
子量体の含有量を増加する方法、あるいは、長鎖アルキ
ルフェノールによる末端基の改変方法は、一般に熱安定
性の低下が大きく、したがって、成形時に熱分解を促進
する結果、ディスク基板の機械的強度が著しく低下し
て、金型からの突出し力により基板の割れを生じたり、
また光ディスク基板の取り扱い時にも基板の破損が起こ
ることになる。Further, a method of adding a large amount of a low molecular weight substance to a polycarbonate resin in order to impart high fluidity (JP-A-9-208684, JP-A-11-1551, etc.) or a specific long-chain alkylphenol Is used as a terminal stopper (JP-A-11-2692).
No. 60 bulletin) has been proposed. However, the method of increasing the content of this low molecular weight product or the method of modifying the end group with a long-chain alkylphenol generally causes a large decrease in thermal stability, and therefore accelerates thermal decomposition at the time of molding, resulting in disc substrate The mechanical strength is remarkably reduced, and the substrate may crack due to the protruding force from the mold.
Also, the substrate will be damaged during handling of the optical disc substrate.
【0005】また、下記式[I]の二価フェノールからな
るポリカーボネート樹脂は、その優れた光学特性、低吸
湿性を利用して光ディスク基板用途への適用も提案され
ている(国際公開番号 WO07/22649)。その
実施例によれば、ピット深さ112nmのスタンパーを
用い、厚さ1.2mm、直径120mmの基板を成形し
た際、ピットやグルーブを正確に転写することが可能と
開示されている。Further, a polycarbonate resin composed of a dihydric phenol represented by the following formula [I] is proposed to be applied to an optical disk substrate by utilizing its excellent optical characteristics and low hygroscopicity (International Publication No. WO07 /). 22649). According to the example, it is disclosed that when a stamper having a pit depth of 112 nm is used to mold a substrate having a thickness of 1.2 mm and a diameter of 120 mm, pits and grooves can be accurately transferred.
【0006】しかしながら、このポリカーボネート樹脂
に上記公報に記載されている射出成形条件を採用し、ピ
ット深さ145nm、間隔0.5μm、幅0.2μmのス
タンパーを用い、厚さ0.6mm、直径120mmの基
板を成形すると、基板厚さが薄くなることによる流動抵
抗の増大や、ピット深さが深いことにより、ピットやグ
ルーブを正確に転写できない、すなわち転写率が低いと
いう問題があり、良好な光ディスク基板が得られなかっ
た。However, the injection molding conditions described in the above publication were adopted for this polycarbonate resin, a stamper having a pit depth of 145 nm, an interval of 0.5 μm and a width of 0.2 μm was used, and the thickness was 0.6 mm and the diameter was 120 mm. When the substrate of No. 1 is molded, there is a problem that pits and grooves cannot be accurately transferred, that is, the transfer rate is low due to the increase in flow resistance due to the thin substrate thickness and the deep pit depth. No substrate was obtained.
【0007】[0007]
【発明が解決しようとする課題】本発明の目的は、光記
録媒体、とりわけ高密度記録媒体の成形において、スタ
ンパー形状を正確に転写した、すなわち高転写率の光デ
ィスク基板を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide an optical disk substrate having a stamper shape accurately transferred, that is, a high transfer rate, in molding an optical recording medium, especially a high density recording medium.
【0008】本発明者らは、上記目的を達成せんと鋭意
研究を重ねた結果、射出成形法等により光ディスクの基
板を成形しようとするときに、スタンパー形状を正確に
転写する為には、保圧および、射出圧縮成形時の型締め
圧力により樹脂がスタンパー形状に変形しやすいことが
必要であること、即ち、弾性率の温度依存性カーブにお
いて、保圧および型締め圧力が加わる際の樹脂表面温度
と考えられる、転移〜ガラス域の弾性率が低い材料が高
精密転写性に優れることを見出した。即ち、下記式で表
される化合物を二価フェノール成分として得られた芳香
族ポリカーボネート樹脂(PC−MIBK)を用い、特定
の射出成形条件を採用することにより、はじめて上記目
的を達成できることを見出し、本発明に到達した。As a result of intensive studies aimed at achieving the above object, the present inventors have found that in order to accurately transfer the stamper shape when an optical disk substrate is to be molded by an injection molding method, etc. It is necessary that the resin easily deforms into a stamper shape due to pressure and mold clamping pressure during injection compression molding, that is, the resin surface when holding pressure and mold clamping pressure are applied in the temperature dependence curve of elastic modulus. It was found that a material having a low elastic modulus in the transition to glass region, which is considered to be temperature, is excellent in high precision transferability. That is, it was found that the above objects can be achieved for the first time by using an aromatic polycarbonate resin (PC-MIBK) obtained by using a compound represented by the following formula as a dihydric phenol component and employing specific injection molding conditions. The present invention has been reached.
【0009】[0009]
【課題を解決するための手段】本発明によれば、二価フ
ェノール成分が、下記式 (I)According to the present invention, a dihydric phenol component is represented by the following formula (I)
【0010】[0010]
【化2】 [Chemical 2]
【0011】である芳香族ポリカーボネート樹脂(PC
−MIBK)から成形された光ディスク基板であり、グ
ルーブ列もしくはピット列の間隔が0.1μm〜0.8
μmでありかつグルーブもしくはピットの光学的深さ
が、記録再生に使用されるレーザー光の波長λと基板の
屈折率nに対してλ/8n〜λ/2nの範囲であること
を特徴とする光ディスク基板が提供される。かかる本発
明によれば、スタンパー形状に対する高精密転写が達成
された光ディスク基板、特に転写率が95%以上の光デ
ィスク基板が提供される。Aromatic polycarbonate resin (PC
-MIBK), which is an optical disk substrate molded with a groove row or pit row spacing of 0.1 μm to 0.8
The optical depth of the groove or pit is in the range of λ / 8n to λ / 2n with respect to the wavelength λ of the laser light used for recording and reproduction and the refractive index n of the substrate. An optical disk substrate is provided. According to the present invention, there is provided an optical disc substrate which achieves high precision transfer to a stamper shape, and particularly an optical disc substrate having a transfer rate of 95% or more.
【0012】本発明における「高精密転写」とは、透明
熱可塑性樹脂成形材料を用いて射出成形により光ディス
ク基板を製造した場合に、スタンパーに刻印された微細
な凹凸形状を忠実に転写することができる性質のことで
ある。本発明において、ポリカーボネートを構成する二
価フェノール成分として下記式 (I)The term "high precision transfer" in the present invention means that when an optical disk substrate is manufactured by injection molding using a transparent thermoplastic resin molding material, the fine uneven shape stamped on the stamper is faithfully transferred. It is a property that can be done. In the present invention, the following formula (I) is used as the dihydric phenol component constituting the polycarbonate.
【0013】[0013]
【化3】 [Chemical 3]
【0014】で表される化合物が使用される。この二価
フェノールの他に、他の二価フェノールを目的および特
性を損なわない割合で、例えば10モル%以下、好まし
くは5モル%以下の割合で共重合させてもよい。The compound represented by In addition to this dihydric phenol, another dihydric phenol may be copolymerized at a ratio that does not impair the purpose and properties, for example, 10 mol% or less, preferably 5 mol% or less.
【0015】ここで、他の二価フェノールの代表的な例
としては、ハイドロキノン、レゾルシノール、4,4'−
ジヒドロキシジフェニル、ビス(4−ヒドロキシフェニ
ル)メタン、ビス{(4−ヒドロキシ−3,5−ジメチ
ル)フェニル}メタン、1,1−ビス(4−ヒドロキシ
フェニル)エタン、1,1−ビス(4−ヒドロキシフェ
ニル)−1−フェニルエタン、2,2−ビス(4−ヒド
ロキシフェニル)プロパン(ビスフェノール−A)、
2,2−ビス{(4−ヒドロキシ−3−メチル)フェニ
ル}プロパン、2,2−ビス{(4−ヒドロキシ−3,5
−ジメチル)フェニル}プロパン、2,2−ビス{(3,
5−ジブロモ−4−ヒドロキシ)フェニル}プロパン、
2,2−ビス{(3−イソプロピル−4−ヒドロキシ)
フェニル}プロパン、2,2−ビス{(4−ヒドロキシ
−3−フェニル)フェニル}プロパン、2,2−ビス
(4−ヒドロキシフェニル)ブタン、2,2−ビス(4
−ヒドロキシフェニル)−3−メチルブタン、2,2−
ビス(4−ヒドロキシフェニル)−3,3−ジメチルブ
タン、2,4−ビス(4−ヒドロキシフェニル)−2−
メチルブタン、2,2−ビス(4−ヒドロキシフェニ
ル)ペンタン、1,1−ビス(4−ヒドロキシフェニ
ル)シクロヘキサン、1,1−ビス(4−ヒドロキシフ
ェニル)−4−イソプロピルシクロヘキサン、1,1−
ビス(4−ヒドロキシフェニル)−3,3,5−トリメチ
ルシクロヘキサン、9,9−ビス(4−ヒドロキシフェ
ニル)フルオレン、9,9−ビス{(4−ヒドロキシ−
3−メチル)フェニル}フルオレン、1,1'−ビス−
(4−ヒドロキシフェニル)−オルト−ジイソプロピル
ベンゼン、1,1'−ビス−(4−ヒドロキシフェニル)
−メタ−ジイソプロピルベンゼン、1,1'−ビス−(4
−ヒドロキシフェニル)−パラ−ジイソプロピルベンゼ
ン、1,3−ビス(4−ヒドロキシフェニル)−5,7−
ジメチルアダマンタン、4,4'−ジヒドロキシジフェニ
ルスルホン、4,4'−ジヒドロキシジフェニルスルホキ
シド、4,4'−ジヒドロキシジフェニルスルフィド、
4,4'−ジヒドロキシジフェニルケトン、4,4'−ジヒ
ドロキシジフェニルエーテルおよび4,4'−ジヒドロキ
シジフェニルエステル等が挙げられる。Here, as typical examples of other dihydric phenols, hydroquinone, resorcinol, 4,4'-
Dihydroxydiphenyl, bis (4-hydroxyphenyl) methane, bis {(4-hydroxy-3,5-dimethyl) phenyl} methane, 1,1-bis (4-hydroxyphenyl) ethane, 1,1-bis (4- Hydroxyphenyl) -1-phenylethane, 2,2-bis (4-hydroxyphenyl) propane (bisphenol-A),
2,2-bis {(4-hydroxy-3-methyl) phenyl} propane, 2,2-bis {(4-hydroxy-3,5
-Dimethyl) phenyl} propane, 2,2-bis {(3,
5-dibromo-4-hydroxy) phenyl} propane,
2,2-bis {(3-isopropyl-4-hydroxy)
Phenyl} propane, 2,2-bis {(4-hydroxy-3-phenyl) phenyl} propane, 2,2-bis (4-hydroxyphenyl) butane, 2,2-bis (4
-Hydroxyphenyl) -3-methylbutane, 2,2-
Bis (4-hydroxyphenyl) -3,3-dimethylbutane, 2,4-bis (4-hydroxyphenyl) -2-
Methyl butane, 2,2-bis (4-hydroxyphenyl) pentane, 1,1-bis (4-hydroxyphenyl) cyclohexane, 1,1-bis (4-hydroxyphenyl) -4-isopropylcyclohexane, 1,1-
Bis (4-hydroxyphenyl) -3,3,5-trimethylcyclohexane, 9,9-bis (4-hydroxyphenyl) fluorene, 9,9-bis {(4-hydroxy-
3-Methyl) phenyl} fluorene, 1,1′-bis-
(4-Hydroxyphenyl) -ortho-diisopropylbenzene, 1,1'-bis- (4-hydroxyphenyl)
-Meta-diisopropylbenzene, 1,1'-bis- (4
-Hydroxyphenyl) -para-diisopropylbenzene, 1,3-bis (4-hydroxyphenyl) -5,7-
Dimethyl adamantane, 4,4'-dihydroxydiphenyl sulfone, 4,4'-dihydroxydiphenyl sulfoxide, 4,4'-dihydroxydiphenyl sulfide,
4,4'-dihydroxydiphenyl ketone, 4,4'-dihydroxydiphenyl ether, 4,4'-dihydroxydiphenyl ester and the like can be mentioned.
【0016】前記二価フェノールを使用してポリカーボ
ネートを製造する際に使用されるカーボネート前駆体と
してはカルボニルハライド、カーボネートエステルまた
はハロホルメート等が挙げられ、具体的にはホスゲン、
ジフェニルカーボネートまたは二価フェノールのジハロ
ホルメート等が挙げられるが、ホスゲンまたはジフェニ
ルカーボネートが好ましい。上記二価フェノールとカー
ボネート前駆体を例えば溶液重合法または溶融重合法等
によって反応させてポリカーボネート樹脂を製造するに
当っては、必要に応じて触媒、末端停止剤、二価フェノ
ールの酸化防止剤等を使用してもよい。Examples of the carbonate precursor used in producing a polycarbonate using the above dihydric phenol include carbonyl halide, carbonate ester, haloformate, and the like. Specifically, phosgene,
Examples thereof include diphenyl carbonate or dihaloformate of dihydric phenol, and phosgene or diphenyl carbonate is preferable. In the case of producing a polycarbonate resin by reacting the above dihydric phenol with a carbonate precursor by, for example, a solution polymerization method or a melt polymerization method, a catalyst, a terminal stopper, an antioxidant of a dihydric phenol, etc. May be used.
【0017】溶液重合法による反応は、通常二価フェノ
ールとホスゲンとの反応であり、酸結合剤および有機溶
媒の存在下に反応させる。酸結合剤としては、例えば水
酸化ナトリウム、水酸化カリウム等のアルカリ金属水酸
化物またはピリジン等のアミン化合物が用いられる。有
機溶媒としては、例えば塩化メチレン、クロロベンゼン
等のハロゲン化炭化水素が用いられる。また、反応促進
のために例えばトリエチルアミン、テトラ−n−ブチル
アンモニウムブロマイド、テトラ−n−ブチルホスホニ
ウムブロマイド等の第三級アミン、第四級アンモニウム
化合物、第四級ホスホニウム化合物等の触媒を用いるこ
ともできる。その際、反応温度は通常0〜40℃、反応
時間は10分〜5時間程度、反応中のpHは9以上に保
つのが好ましい。The reaction by the solution polymerization method is usually a reaction between a dihydric phenol and phosgene, which is carried out in the presence of an acid binder and an organic solvent. As the acid binder, for example, an alkali metal hydroxide such as sodium hydroxide or potassium hydroxide or an amine compound such as pyridine is used. As the organic solvent, halogenated hydrocarbons such as methylene chloride and chlorobenzene are used. It is also possible to use a catalyst such as a tertiary amine such as triethylamine, tetra-n-butylammonium bromide, or tetra-n-butylphosphonium bromide, a quaternary ammonium compound, or a quaternary phosphonium compound for accelerating the reaction. it can. At that time, the reaction temperature is usually 0 to 40 ° C., the reaction time is preferably 10 minutes to 5 hours, and the pH during the reaction is preferably 9 or more.
【0018】また、かかる重合反応において、通常末端
停止剤が使用される。かかる末端停止剤として単官能フ
ェノール類を使用することができる。単官能フェノール
類は末端停止剤として分子量調節のために一般的に使用
され、また得られたポリカーボネート樹脂は、末端が単
官能フェノール類に基づく基によって封鎖されているの
で、そうでないものと比べて熱安定性に優れている。か
かる単官能フェノール類としては、一般にはフェノール
または低級アルキル置換フェノールであって、下記式
[II]Further, in such a polymerization reaction, a terminal stopper is usually used. Monofunctional phenols can be used as such an end terminator. Monofunctional phenols are commonly used as molecular terminating agents for molecular weight control, and the resulting polycarbonate resins are compared to those that do not because the ends are blocked by groups based on monofunctional phenols. Excellent thermal stability. Such monofunctional phenols are generally phenols or lower alkyl-substituted phenols represented by the following formula [II]
【0019】[0019]
【化4】 [Chemical 4]
【0020】[式中、Aは水素原子または炭素数1〜9
の直鎖または分岐のアルキル基あるいはフェニル置換ア
ルキル基であり、rは1〜5、好ましくは1〜3の整数
である。]で表される単官能フェノール類を示すことが
できる。[In the formula, A is a hydrogen atom or 1 to 9 carbon atoms.
Is a linear or branched alkyl group or a phenyl-substituted alkyl group, and r is an integer of 1 to 5, preferably 1 to 3. ] Monofunctional phenols represented by can be shown.
【0021】上記単官能フェノール類の具体例として
は、例えばフェノール、p−tert−ブチルフェノー
ル、p−クミルフェノールおよびイソオクチルフェノー
ルが挙げられる。Specific examples of the monofunctional phenols include phenol, p-tert-butylphenol, p-cumylphenol and isooctylphenol.
【0022】また、他の単官能フェノール類としては、
長鎖のアルキル基あるいは脂肪族ポリエステル基を置換
基として有するフェノール類または安息香酸クロライド
類、もしくは長鎖のアルキルカルボン酸クロライド類を
使用することができ、これらを用いてポリカーボネート
重合体の末端を封鎖すると、これらは末端停止剤または
分子量調節剤として機能するのみならず、樹脂の溶融流
動性が改良され、成形加工が容易になるばかりでなく、
基板としての物性、特に樹脂の吸水率を低くする効果が
あり、また基板の複屈折率が低減される効果もあり、好
ましく使用される。なかでも、下記式[III]および[I
V]As other monofunctional phenols,
Phenols or benzoic acid chlorides having a long-chain alkyl group or aliphatic polyester group as a substituent, or long-chain alkylcarboxylic acid chlorides can be used, and the end of the polycarbonate polymer is blocked with these. Then, these not only function as a terminal terminating agent or a molecular weight modifier, but not only the melt fluidity of the resin is improved and the molding process is facilitated,
It is preferably used because it has the effect of lowering the physical properties of the substrate, especially the water absorption of the resin, and the effect of reducing the birefringence of the substrate. Among them, the following formulas [III] and [I
V]
【0023】[0023]
【化5】 [Chemical 5]
【0024】[0024]
【化6】 [Chemical 6]
【0025】[式中、Xは−R−CO−O−または−R
−O−CO−である、ここでRは単結合または炭素数1
〜10、好ましくは1〜5の二価の脂肪族炭化水素基を
示し、nは10〜50の整数を示す。]で表される長鎖
のアルキル基を置換基として有するフェノール類が好ま
しく使用される。[Wherein, X is -R-CO-O- or -R
-O-CO-, where R is a single bond or 1 carbon atom
-10, preferably 1-5 divalent aliphatic hydrocarbon group is shown, and n shows the integer of 10-50. ] Phenols having a long-chain alkyl group represented by the formula as a substituent are preferably used.
【0026】前記式(III)の置換フェノール類として
はnが10〜30、特に10〜26のものが好ましく、
その具体例としては例えばデシルフェノール、ドデシル
フェノール、テトラデシルフェノール、ヘキサデシルフ
ェノール、オクタデシルフェノール、エイコシルフェノ
ール、ドコシルフェノールおよびトリアコンチルフェノ
ール等を挙げることができる。The substituted phenols of the formula (III) are preferably those in which n is 10 to 30, particularly 10 to 26,
Specific examples thereof include decylphenol, dodecylphenol, tetradecylphenol, hexadecylphenol, octadecylphenol, eicosylphenol, docosylphenol and triacontylphenol.
【0027】また、前記式(IV)の置換フェノール類と
してはXが−R−CO−O−であり、Rが単結合である
化合物が適当であり、nが10〜30、特に10〜26
のものが好適であって、その具体例としては例えばヒド
ロキシ安息香酸デシル、ヒドロキシ安息香酸ドデシル、
ヒドロキシ安息香酸テトラデシル、ヒドロキシ安息香酸
ヘキサデシル、ヒドロキシ安息香酸エイコシル、ヒドロ
キシ安息香酸ドコシルおよびヒドロキシ安息香酸トリア
コンチルが挙げられる。これらの末端停止剤は、得られ
たポリカーボネート樹脂の全末端に対して少くとも5モ
ル%、好ましくは少くとも10モル%末端に導入される
ことが望ましく、また、末端停止剤は単独でまたは2種
以上混合して使用してもよい。Suitable substituted phenols of the above formula (IV) are compounds in which X is --R--CO--O-- and R is a single bond, and n is 10 to 30, particularly 10 to 26.
Are preferred, and specific examples thereof include decyl hydroxybenzoate, dodecyl hydroxybenzoate,
Mention may be made of tetradecyl hydroxybenzoate, hexadecyl hydroxybenzoate, eicosyl hydroxybenzoate, docosyl hydroxybenzoate and triacontyl hydroxybenzoate. It is desirable that these terminal terminators are introduced into at least 5 mol%, preferably at least 10 mol% of the terminals of the obtained polycarbonate resin, and the terminator may be used alone or You may use it in mixture of 2 or more types.
【0028】溶融重合法による反応は、通常二価フェノ
ールとカーボネートエステルとのエステル交換反応が代
表的であり、不活性ガスの存在下に二価フェノールとカ
ーボネートエステルとを加熱しながら混合して、生成す
るアルコールまたはフェノールを留出させる方法により
行われる。反応温度は生成するアルコールまたはフェノ
ールの沸点等により異なるが、通常120〜350℃の
範囲である。反応後期には反応系を10〜0.1Tor
r(1.3〜0.13×103Pa)程度に減圧して生成
するアルコールまたはフェノールの留出を容易にさせ
る。反応時間は通常1〜4時間程度である。The reaction by the melt polymerization method is typically a transesterification reaction between a dihydric phenol and a carbonate ester, and the dihydric phenol and the carbonate ester are mixed while heating in the presence of an inert gas, It is carried out by a method of distilling the produced alcohol or phenol. The reaction temperature varies depending on the boiling point of the alcohol or phenol to be produced, but is usually in the range of 120 to 350 ° C. In the latter half of the reaction, the reaction system is 10-0.1 Tor
The pressure is reduced to about r (1.3 to 0.13 × 103 Pa) to facilitate the distillation of the alcohol or phenol produced. The reaction time is usually about 1 to 4 hours.
【0029】カーボネートエステルとしては、置換基を
有していてもよい炭素数6〜10のアリール基、アラル
キル基あるいは炭素数1〜4のアルキル基などのエステ
ルが挙げられる。具体的にはジフェニルカーボネート、
ジトリルカーボネート、ビス(クロロフェニル)カーボ
ネート、m―クレジルカーボネート、ジナフチルカーボ
ネート、ビス(ジフェニル)カーボネート、ジメチルカ
ーボネート、ジエチルカーボネート、ジブチルカーボネ
ートなどが挙げられ、なかでもジフェニルカーボネート
が好ましい。Examples of the carbonate ester include an optionally substituted aryl group having 6 to 10 carbon atoms, an aralkyl group, an alkyl group having 1 to 4 carbon atoms, and the like. Specifically, diphenyl carbonate,
Examples thereof include ditolyl carbonate, bis (chlorophenyl) carbonate, m-cresyl carbonate, dinaphthyl carbonate, bis (diphenyl) carbonate, dimethyl carbonate, diethyl carbonate, dibutyl carbonate, and among them, diphenyl carbonate is preferable.
【0030】また、重合速度を高めるために重合触媒を
用いることができ、かかる重合触媒としては、例えば水
酸化ナトリウム、水酸化カリウム、二価フェノールのナ
トリウム塩、カリウム塩等のアルカリ金属化合物;水酸
化カルシウム、水酸化バリウム、水酸化マグネシウム等
のアルカリ土類金属化合物;テトラメチルアンモニウム
ヒドロキシド、テトラエチルアンモニウムヒドロキシ
ド、トリメチルアミン、トリエチルアミン等の含窒素塩
基性化合物;アルカリ金属やアルカリ土類金属のアルコ
キシド類;アルカリ金属やアルカリ土類金属の有機酸塩
類;その他に亜鉛化合物類、ホウ素化合物類、アルミニ
ウム化合物類、珪素化合物類、ゲルマニウム化合物類、
有機スズ化合物類、鉛化合物類、オスミウム化合物類、
アンチモン化合物類、マンガン化合物類、チタン化合物
類、ジルコニウム化合物類などの通常エステル化反応、
エステル交換反応に使用される触媒を用いることができ
る。触媒は単独で使用してもよいし、2種以上組み合わ
せ使用してもよい。これらの重合触媒の使用量は、原料
の二価フェノール1モルに対し、好ましくは1×10 -8
〜1×10-3当量、より好ましくは1×10-7〜5×1
0-4当量の範囲で選ばれる。Further, a polymerization catalyst is used to increase the polymerization rate.
As the polymerization catalyst, for example, water can be used.
Sodium oxide, potassium hydroxide, dihydric phenol
Alkali metal compounds such as thorium salt and potassium salt;
Calcium oxide, barium hydroxide, magnesium hydroxide, etc.
Alkaline earth metal compounds of tetramethylammonium
Hydroxide, tetraethylammonium hydroxy
Nitrogen-containing salts such as sodium chloride, trimethylamine and triethylamine
Basic compound; Alcohol of alkali metal or alkaline earth metal
Xides; organic acid salts of alkali metals and alkaline earth metals
Kinds; In addition, zinc compounds, boron compounds, aluminum
Um compounds, silicon compounds, germanium compounds,
Organotin compounds, lead compounds, osmium compounds,
Antimony compounds, manganese compounds, titanium compounds
Esterification reaction of zirconium compounds, zirconium compounds, etc.,
The catalyst used in the transesterification reaction can be used
It The catalysts may be used alone or in combination of two or more.
You may use it. The amount of these polymerization catalysts used depends on the raw materials.
1 mol per 1 mol of the dihydric phenol -8
~ 1 x 10-3Equivalent, more preferably 1 × 10-7~ 5 x 1
0-FourIt is selected within the equivalent range.
【0031】また、かかる重合反応において、フェノー
ル性の末端基を減少するために、重縮反応の後期あるい
は終了後に、例えばビス(クロロフェニル)カーボネー
ト、ビス(ブロモフェニル)カーボネート、ビス(ニト
ロフェニル)カーボネート、ビス(フェニルフェニル)
カーボネート、クロロフェニルフェニルカーボネート、
ブロモフェニルフェニルカーボネート、ニトロフェニル
フェニルカーボネート、フェニルフェニルカーボネー
ト、メトキシカルボニルフェニルフェニルカーボネート
およびエトキシカルボニルフェニルフェニルカーボネー
ト等の化合物を加えることが好ましい。なかでも2−ク
ロロフェニルフェニルカーボネート、2−メトキシカル
ボニルフェニルフェニルカーボネートおよび2−エトキ
シカルボニルフェニルフェニルカーボネートが好まし
く、特に2−メトキシカルボニルフェニルフェニルカー
ボネートが好ましく使用される。Further, in the polymerization reaction, in order to reduce the phenolic terminal group, for example, bis (chlorophenyl) carbonate, bis (bromophenyl) carbonate, bis (nitrophenyl) carbonate, at a later stage or after the completion of the polycondensation reaction. , Bis (phenylphenyl)
Carbonate, chlorophenyl phenyl carbonate,
It is preferable to add compounds such as bromophenylphenyl carbonate, nitrophenylphenyl carbonate, phenylphenyl carbonate, methoxycarbonylphenylphenyl carbonate and ethoxycarbonylphenylphenyl carbonate. Of these, 2-chlorophenylphenyl carbonate, 2-methoxycarbonylphenylphenyl carbonate and 2-ethoxycarbonylphenylphenyl carbonate are preferable, and 2-methoxycarbonylphenylphenyl carbonate is particularly preferable.
【0032】本発明では、芳香族ポリカーボネート樹脂
光学用成形材料の粘度平均分子量に関しては、特に制限
されないが、過剰に低い分子量では、成形後の基板とし
ての強度に問題が生じ、また逆に過剰に高いと成形時の
溶融流動性が悪く、基板に好ましくない光学歪みが増大
する。このことを考え合わせると粘度平均分子量は1
1,000〜20,000の範囲が好ましく、12,00
0〜18,000が特に好ましい。かかる粘度平均分子
量を有するポリカーボネート樹脂光学用成形材料は、光
学用材料として十分な強度が得られ、また、成形時の溶
融流動性も良好であり成形歪みが発生せず好ましい。In the present invention, the viscosity average molecular weight of the aromatic polycarbonate resin optical molding material is not particularly limited, but if the molecular weight is excessively low, the strength of the substrate after molding will be problematic, and conversely, it will be excessive. When it is high, the melt fluidity at the time of molding is poor and the optical distortion unfavorable to the substrate increases. Considering this fact, the viscosity average molecular weight is 1
The range of 1,000 to 20,000 is preferable, and 12,000
0 to 18,000 is particularly preferable. A polycarbonate resin optical molding material having such a viscosity average molecular weight is preferable because sufficient strength as an optical material can be obtained and the melt fluidity at the time of molding is good and molding distortion does not occur.
【0033】原料ポリカーボネート樹脂は、従来公知の
常法(溶液重合法、溶融重合法など)により製造した
後、溶液状態において濾過処理を行ない未反応成分等の
不純物や異物を除去することが好ましい。さらに射出成
形に供するためのペレット状ポリカーボネート樹脂を得
る押出工程(ペレット化工程)では溶融状態の時に濾過
精度10μmの焼結金属フィルターを通すなどして異物
を除去することが好ましい。必要により、例えばリン系
等の酸化防止剤などの添加剤を加えることも好ましい。
いずれにしても射出成形前の原料樹脂は異物、不純物、
溶媒などの含有量を極力低くしておくことが必要であ
る。The raw material polycarbonate resin is preferably produced by a conventionally known conventional method (solution polymerization method, melt polymerization method, etc.) and then filtered in a solution state to remove impurities such as unreacted components and foreign substances. Further, in the extrusion step (pelletizing step) of obtaining a pellet-shaped polycarbonate resin for injection molding, it is preferable to remove foreign matters by passing through a sintered metal filter having a filtration accuracy of 10 μm in a molten state. If necessary, it is also preferable to add an additive such as a phosphorus-based antioxidant.
In any case, the raw material resin before injection molding is foreign matter, impurities,
It is necessary to keep the content of the solvent and the like as low as possible.
【0034】上記ポリカーボネート樹脂光学用成形材料
より光ディスク基板を製造する場合には射出成形機(射
出圧縮成形機を含む)を用いる。この射出成形機として
は一般的に使用されているものでよいが、炭化物の発生
を抑制しディスク基板の信頼性を高める観点からシリン
ダーやスクリューと樹脂との付着性が低く、かつ耐食
性、耐摩耗性を示す材料を使用してなるものを用いるの
が好ましい。射出成形の条件としては樹脂温度即ちシリ
ンダー設定温度を325〜355℃にし、且つ金型温度
即ち金型温調設定温度を106〜120℃にするのが好
ましい。かかる条件を採用することにより、転写率95
%以上、好ましくは100%の光ディスク基板が得られ
る。An injection molding machine (including an injection compression molding machine) is used when an optical disk substrate is manufactured from the above polycarbonate resin optical molding material. This injection molding machine may be one that is generally used, but from the viewpoint of suppressing the generation of carbides and increasing the reliability of the disk substrate, the adhesion between the cylinder and screw and the resin is low, and the corrosion resistance and wear resistance are low. It is preferable to use a material formed of a material exhibiting properties. As conditions for injection molding, it is preferable that the resin temperature, that is, the cylinder set temperature is 325 to 355 ° C., and the mold temperature, that is, the mold temperature control set temperature is 106 to 120 ° C. By adopting such conditions, the transfer rate is 95
% Or more, preferably 100% of the optical disk substrate is obtained.
【0035】樹脂温度を325℃、より低くあるいは金
型温度を106℃より低温にすると、スタンパー形状へ
の転写時の、樹脂表面温度が低くなり、ピット、グルー
ブの深さが低下し、また樹脂の流動抵抗が大きくなり、
得られる基板の斜め入射複屈折位相差が大きくなる。ま
た、樹脂温度を355℃より高くするか、あるいは金型
温度を120℃より高くすると、得られる基板の冷却に
時間がかかるばかりでなく、離型時に基板が充分に固ま
らず、基板に反りが生じるようになる。成形工程での環
境は、本発明の目的から考えて、可能な限りクリーンで
あることが好ましい。また、成形に供する材料を十分乾
燥して水分を除去することや、溶融樹脂の分解を招くよ
うな滞留を起こさないように配慮することも重要とな
る。When the resin temperature is lower than 325 ° C. or the mold temperature is lower than 106 ° C., the surface temperature of the resin at the time of transfer to the stamper shape becomes low, the depth of pits and grooves decreases, and the resin temperature decreases. The flow resistance of
The oblique incidence birefringence phase difference of the obtained substrate becomes large. Further, if the resin temperature is higher than 355 ° C. or the mold temperature is higher than 120 ° C., not only it takes time to cool the obtained substrate, but also the substrate does not solidify sufficiently at the time of mold release, and the substrate warps. Will occur. The environment in the molding process is preferably as clean as possible in view of the purpose of the present invention. In addition, it is important to sufficiently dry the material to be molded to remove water, and to take measures so as not to cause retention that would cause decomposition of the molten resin.
【0036】このように成形された光ディスク基板は、
コンパクトディスク(以下、CDと称することがあ
る)、CD−R、MO、MD−MO等や、さらにはデジ
タルバーサタイルディスク(以下 DVDと称する)、
DVD−ROM、DVD−video、DVD−R、D
VD−RAM、DVR−Blue、HD−DVD−RA
M等で代表される高密度光ディスク用基板として、使用
される。The optical disk substrate molded in this way is
Compact discs (hereinafter sometimes referred to as CDs), CD-Rs, MOs, MD-MOs, etc., as well as digital versatile discs (hereinafter referred to as DVDs),
DVD-ROM, DVD-video, DVD-R, D
VD-RAM, DVR-Blue, HD-DVD-RA
It is used as a substrate for a high density optical disc represented by M and the like.
【0037】本発明のポリカーボネート樹脂光学用成形
材料は、高精密転写性に優れているので、グルーブ列も
しくはビット列の間隔が0.1μm〜0.8μm、好まし
くは0.1〜0.5μm、さらに好ましくは0.1〜0.3
5μmである光ディスク基板を成形によって容易に得る
ことが可能となる。またグルーブもしくはビットの光学
的深さが、記録再生に使用されるレーザ光の波長λと基
板の屈折率nに対してλ/8n〜λ/2n、好ましくは
λ/6n〜λ/2n、さらに好ましくはλ/4n〜λ/
2nの範囲にある光ディスク基板を得ることができる。
かくして記録密度が10Gbit/inch2以上であ
る高密度光学ディスク記録媒体の基材を容易に提供する
ことができる。Since the polycarbonate resin optical molding material of the present invention is excellent in high precision transferability, the gap between groove rows or bit rows is 0.1 μm to 0.8 μm, preferably 0.1 to 0.5 μm, and further Preferably 0.1-0.3
It is possible to easily obtain an optical disk substrate having a thickness of 5 μm by molding. The optical depth of the groove or bit is λ / 8n to λ / 2n, preferably λ / 6n to λ / 2n, with respect to the wavelength λ of the laser light used for recording and reproduction and the refractive index n of the substrate, and further, Preferably λ / 4n to λ /
An optical disk substrate in the range of 2n can be obtained.
Thus, it is possible to easily provide a base material for a high density optical disc recording medium having a recording density of 10 Gbit / inch 2 or more.
【0038】[0038]
【実施例】以下、実施例を挙げて詳細に説明するが、本
発明は何らこれに限定されるものではない。実施例中
「部」は重量部である。なお評価は下記の方法に従っ
た。
(1)粘度平均分子量
すべてのポリマー種について、塩化メチレン100mL
にポリカーボネート樹脂0.7gを溶解した20℃溶液
を用いて求めた比粘度(ηsp)を次式に挿入して求め
た。
ηsp/c=[η]+0.45×[η]2c(但し[η]
は極限粘度)
[η]=1.23×10-4M0.83
c=0.7
(2)転写性
射出成形により射出成形機(名機製作所 M35B−D
−DM)とキャビティ厚0.6mmt直径120mmの
金型および深さ145nm、間隔0.5μm、幅0.2μ
mの溝が刻まれたスタンパーを用いて、ディスク基板を
成形した。次に原子間力顕微鏡(セイコー電子工業 S
PI3700)にてr=55mmにおけるディスク基板
の溝部の深さを測定し、溝形状の再現率(=100×デ
ィスクの溝深さ/スタンパーの溝深さ(%))を求め
た。EXAMPLES The present invention will now be described in detail with reference to examples, but the present invention is not limited thereto. In the examples, "parts" are parts by weight. The evaluation was according to the following method. (1) Viscosity average molecular weight 100 mL of methylene chloride for all polymer species
The specific viscosity (ηsp) obtained by using a 20 ° C. solution in which 0.7 g of a polycarbonate resin was dissolved was obtained by inserting it into the following equation. ηsp / c = [η] + 0.45 × [η] 2 c (however, [η]
Is the intrinsic viscosity) [η] = 1.23 × 10 −4 M 0.83 c = 0.7 (2) Transfer injection molding machine (M35B-D manufactured by injection molding machine)
-DM) and cavity thickness 0.6 mmt, mold with diameter 120 mm and depth 145 nm, interval 0.5 μm, width 0.2 μm.
A disk substrate was molded using a stamper having m grooves. Next, atomic force microscope (Seiko Denshi Kogyo S
PI3700), the depth of the groove portion of the disk substrate at r = 55 mm was measured to obtain the groove shape reproduction ratio (= 100 × disk groove depth / stamper groove depth (%)).
【0039】実施例1
前記式(I)で表される2,2−ビス(4−ヒドロキシフ
ェニル)−4−メチルペンタンを二価フェノール成分と
して得られる芳香族ポリカーボネート樹脂の製造;温度
計、撹拌機および還流冷却器付き反応器に48%水酸化
ナトリウム水溶液68.6部および、イオン交換水34
8部、を仕込み、これに2,2−ビス(4−ヒドロキシ
フェニル)−4−メチルペンタン74部およびハイドロ
サルファイト0.140.35部を溶解した後、塩化メチ
レン233.3部を加え、撹拌下15〜25℃でホスゲ
ン34.8部を40分要して吹込んだ。ホスゲン吹き込
み終了後、48%水酸化ナトリウム水溶液7.6部およ
びp−tert−ブチルフェノール2.47部を加え、
撹拌を始め、乳化後トリエチルアミン0.15部を加
え、さらに28〜33℃で1時間撹拌して反応を終了し
た。反応終了後生成物を塩化メチレンで希釈して水洗し
た後塩酸酸性にして水洗し、水相の導電率がイオン交換
水と殆ど同じになるまで水洗を繰り返して、粘度平均分
子量15,200であるポリカーボネート樹脂の塩化メ
チレン溶液を得た。Example 1 Production of aromatic polycarbonate resin obtained by using 2,2-bis (4-hydroxyphenyl) -4-methylpentane represented by the above formula (I) as a dihydric phenol component; thermometer, stirring 68.6 parts of 48% sodium hydroxide aqueous solution and 34 parts of ion-exchanged water in a reactor equipped with a heating machine and a reflux condenser.
8 parts, were charged, and after dissolving 74 parts of 2,2-bis (4-hydroxyphenyl) -4-methylpentane and 0.140.35 parts of hydrosulfite therein, 233.3 parts of methylene chloride was added, 34.8 parts of phosgene was blown in under stirring at 15 to 25 ° C. over 40 minutes. After the completion of blowing phosgene, 7.6 parts of 48% sodium hydroxide aqueous solution and 2.47 parts of p-tert-butylphenol were added,
After stirring and emulsification, 0.15 part of triethylamine was added, and the mixture was further stirred at 28 to 33 ° C. for 1 hour to complete the reaction. After completion of the reaction, the product was diluted with methylene chloride, washed with water, acidified with hydrochloric acid, washed with water, and repeatedly washed with water until the conductivity of the aqueous phase was almost the same as that of ion-exchanged water. The viscosity-average molecular weight was 15,200. A methylene chloride solution of polycarbonate resin was obtained.
【0040】製造したポリマーの塩化メチレン溶液を目
開き0.3μmのフィルターを通過させた後、軸受け部
に異物取出口を有する隔離室を設けたニーダー中の温水
にポリカーボネート樹脂溶液を滴下し、塩化メチレンを
留去しながらポリカーボネート樹脂をフレーク化した。
次にこの含液ポリカーボネート樹脂を粉砕、乾燥してパ
ウダーを得た。このパウダーにトリス(2,4−di−
tert−ブチルフェニル)ホスファイトを0.002
5重量%、ステアリン酸モノグリセリドを0.05重量
%加えた。次に、かかるパウダーをベント式二軸押出機
[神戸製鋼(株)製KTX−46]によりシリンダー温
度240℃で脱気しながら溶融混練し、粘度平均分子量
15,100のペレットを得た。このペレットを、射出
成形機(名機製作所 M35B−D−DM)とキャビテ
ィ厚0.6mmt直径120mmの金型および深さ14
5nm、間隔0.5μm、幅0.2μmの溝が刻まれたス
タンパーを用いて、シリンダー設定温度330℃、金型
温度108℃、充填時間0.2秒、冷却時間15秒、型
締力35トンでディスク基板を成形した。この時の成形
評価結果を、表1に掲載した。The methylene chloride solution of the polymer produced was passed through a filter having an opening of 0.3 μm, and then the polycarbonate resin solution was added dropwise to warm water in a kneader provided with an isolation chamber having a foreign matter outlet at the bearing portion, and chlorinated. The polycarbonate resin was made into flakes while distilling off methylene.
Next, the liquid polycarbonate resin was pulverized and dried to obtain a powder. Tris (2,4-di-
tert-butylphenyl) phosphite to 0.002
5% by weight and 0.05% by weight of stearic acid monoglyceride were added. Next, the powder was melt-kneaded with a vent type twin-screw extruder [KTX-46 manufactured by Kobe Steel, Ltd.] at a cylinder temperature of 240 ° C. while being melted and kneaded to obtain pellets having a viscosity average molecular weight of 15,100. These pellets were injected into an injection molding machine (M35B-D-DM manufactured by Meiki Seisakusho) with a mold having a cavity thickness of 0.6 mm and a diameter of 120 mm and a depth of 14.
Using a stamper with grooves of 5 nm, 0.5 μm spacing, and 0.2 μm width, cylinder set temperature 330 ° C., mold temperature 108 ° C., filling time 0.2 sec, cooling time 15 sec, mold clamping force 35 The disk substrate was molded in tons. The molding evaluation results at this time are shown in Table 1.
【0041】比較例1
射出成形時のシリンダー設定温度320℃、金型設定温
度を90℃とする以外は、実施例1と同様に成形評価を
実施した。この時の成形評価結果を、表1に掲載した。Comparative Example 1 Molding evaluation was carried out in the same manner as in Example 1 except that the cylinder set temperature during injection molding was 320 ° C. and the mold set temperature was 90 ° C. The molding evaluation results at this time are shown in Table 1.
【0042】[0042]
【表1】 [Table 1]
【0043】[0043]
【発明の効果】本発明によれば、特定のポリカーボネー
ト樹脂を成形してなる光記録媒体、とりわけ高密度記録
媒体としての、スタンパー形状を高精密に転写した光デ
ィスク基板の提供が可能になり、その奏する効果は格別
なものである。According to the present invention, it is possible to provide an optical disk substrate having a stamper shape transferred with high precision as an optical recording medium formed by molding a specific polycarbonate resin, particularly a high density recording medium. The effect produced is exceptional.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 林 邦維 東京都千代田区内幸町1丁目2番2号 帝 人化成株式会社内 (72)発明者 藤丸 滋樹 東京都千代田区内幸町1丁目2番2号 帝 人化成株式会社内 Fターム(参考) 4J029 AA09 AB07 AC01 AE05 BB12A 5D029 KA07 KB03 WB11 WB17 WC01 WC04 WC05 WD10 5D121 AA02 DD05 ─────────────────────────────────────────────────── ─── Continued front page (72) Inventor, Kuniwei Hayashi 1-2-2 Uchisaiwaicho, Chiyoda-ku, Tokyo Human Kasei Co., Ltd. (72) Inventor Shigeki Fujimaru 1-2-2 Uchisaiwaicho, Chiyoda-ku, Tokyo Human Kasei Co., Ltd. F-term (reference) 4J029 AA09 AB07 AC01 AE05 BB12A 5D029 KA07 KB03 WB11 WB17 WC01 WC04 WC05 WD10 5D121 AA02 DD05
Claims (4)
から成形された光ディスク基板であり、グルーブ列もし
くはピット列の間隔が0.1μm〜0.8μmであり、か
つグルーブもしくはピットの光学的深さが、記録再生に
使われるレーザー光の波長λと基板の屈折率nに対して
λ/8n〜λ/2nの範囲であることを特徴とする光デ
ィスク基板。1. A dihydric phenol component is represented by the following formula [I]: Aromatic polycarbonate resin (PC-MIBK)
An optical disk substrate molded from, wherein the spacing between the groove rows or pit rows is 0.1 μm to 0.8 μm, and the optical depth of the grooves or pits is the wavelength λ of the laser beam used for recording / reproduction and the substrate. An optical disk substrate having a refractive index n of λ / 8n to λ / 2n.
55℃として成形されたる請求項1記載の光ディスク基
板。2. The resin temperature during injection molding is 325 ° C. to 3 ° C.
The optical disk substrate according to claim 1, which is molded at 55 ° C.
20℃として成形された請求項1記載の光ディスク基
板。3. The mold temperature at the time of injection molding is 106 ° C. to 1 ° C.
The optical disk substrate according to claim 1, which is molded at 20 ° C.
3記載のいずれかの光ディスク基板。4. A transfer rate of 95% or more, 1 to
3. The optical disc substrate according to any one of 3 above.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001204375A JP2003020332A (en) | 2001-07-05 | 2001-07-05 | Optical disk substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001204375A JP2003020332A (en) | 2001-07-05 | 2001-07-05 | Optical disk substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2003020332A true JP2003020332A (en) | 2003-01-24 |
Family
ID=19040855
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001204375A Pending JP2003020332A (en) | 2001-07-05 | 2001-07-05 | Optical disk substrate |
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Country | Link |
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JP (1) | JP2003020332A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017031245A (en) * | 2015-07-29 | 2017-02-09 | 三菱化学株式会社 | Polycarbonate resin for optical material and molded body |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997022649A1 (en) * | 1995-12-15 | 1997-06-26 | Teijin Chemicals, Ltd. | Optical disk substrate |
JPH11166113A (en) * | 1997-12-03 | 1999-06-22 | Mitsubishi Eng Plast Corp | Polycarbonate material for optical disk substrate |
JPH11269260A (en) * | 1998-01-19 | 1999-10-05 | Mitsubishi Chemical Corp | Polycarbonate resin, substrate prepared therefor for optical information recording medium, and optical information recording medium |
-
2001
- 2001-07-05 JP JP2001204375A patent/JP2003020332A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997022649A1 (en) * | 1995-12-15 | 1997-06-26 | Teijin Chemicals, Ltd. | Optical disk substrate |
JPH11166113A (en) * | 1997-12-03 | 1999-06-22 | Mitsubishi Eng Plast Corp | Polycarbonate material for optical disk substrate |
JPH11269260A (en) * | 1998-01-19 | 1999-10-05 | Mitsubishi Chemical Corp | Polycarbonate resin, substrate prepared therefor for optical information recording medium, and optical information recording medium |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017031245A (en) * | 2015-07-29 | 2017-02-09 | 三菱化学株式会社 | Polycarbonate resin for optical material and molded body |
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