JP2003092255A - Luminous exposure control method and apparatus, and scanning projection aligner using them - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a luminous exposure control apparatus and a luminous exposure control method that can accurately adjust luminous exposure for each shot and during exposure, at the same time, to reduce manufacturing costs, to achieve appropriate luminous exposure control such as quick stabilization of output, and to provide a scanning projection aligner. SOLUTION: An illumination optical system has at least one of a light source 1 for exposure for generating illumination light for exposure, a light-shielding means 10 for shielding the illumination light from the light source 1 for exposure, and an optical system 9 comprising a beam attenuation filter for reducing the illumination light from the light source 1 for exposure. An anti-glare means 10 and/or the optical system 9, and at least one of the scanning rates of a reticle 2 and a wafer 4 are adjusted so as to control luminous exposures as pulse lights.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for manufacturing a device such as a semiconductor element, and an exposure apparatus for exposing a pattern of an original plate such as a mask or reticle onto a substrate such as a wafer. In particular, an exposure amount control method and an exposure amount control device,
It also relates to a scanning type exposure apparatus using them.

[0002]

2. Description of the Related Art In recent years, when manufacturing a semiconductor device or the like, a reticle and a wafer are moved in synchronization with a projection optical system together with a collective exposure type projection exposure apparatus such as a stepper. A step-and-scan type projection exposure apparatus that exposes a reticle pattern image to each shot area above is being used. Even in the case of a scanning exposure type projection exposure apparatus (scanning type exposure apparatus) such as a step-and-scan method, like the batch exposure type,
An exposure amount control function for keeping the exposure amount (integrated exposure amount) for each point in each shot area on the wafer within the target exposure amount and minimizing the unevenness of illuminance is essential.

In this regard, as a conventional technique of scanning exposure using a pulse light source, the number of pulses to be exposed and the energy of each pulse are used as a method for controlling the integrated exposure amount on the photosensitive substrate to a predetermined value. And how to control
A method of controlling the interval of each pulse to be exposed in the scanning type exposure apparatus has been introduced.

For example, in Japanese Patent Laid-Open No. 4-69660, the exposure amount of the next one pulse is calculated from the remaining exposure amount obtained by subtracting the already exposed exposure amount from the total exposure amount for each pulse from the first one pulse. A method of calculating and controlling the exposure amount varying means has been proposed.

In Japanese Patent Laid-Open No. 5-62876, the average energy of the residual light amount per pulse is compared with the average 1-pulse exposure amount up to a plurality of times, and the next exposure amount is 1 pulse of the residual light amount. A method of changing the control parameter so as to match the average energy per unit has been proposed.

In Japanese Patent Application No. 7-74092, in a slit scanning type exposure apparatus, the exposure amount of each pulsed light is monitored while keeping the scanning speed constant, and the next pulsed light is emitted according to the intensity of the measured exposure amount. Has been proposed that temporally shifts the light emission timing of. At the same time, the intensity distribution of the slit light in the scanning direction is gently changed in the boundary area so that the above-mentioned definite error of the integrated exposure amount does not occur.

Further, as the exposure light, i of a super high pressure mercury lamp is used.
When continuous light such as a line (wavelength 365 nm) is used, the illuminance easily fluctuates due to arc fluctuations. Therefore, in order to accurately control the image surface illuminance, conventionally, a shutter and a fly-eye lens for uniform illuminance distribution are used. A beam splitter was placed in the optical path of the exposure light after that. Then, a part of the exposure light branched by the beam splitter is received by the photoelectric detector, and this detection signal is fed back to the power source of the mercury lamp. At this time, in the mercury lamp, since there is some linearity between the supplied power and the illuminance of the output light, the illuminance can be controlled by the power value.

Utilizing this, in order to set the illuminance of the exposure light to a desired value, the electric power supplied to the mercury lamp,
It is necessary to previously obtain the control characteristic corresponding to the illuminance on the image plane of the exposure light corresponding thereto. Therefore, conventionally, for example, at the time of idling (idling) of the projection exposure apparatus during the exposure operation, the mercury lamp is turned on with a predetermined power and the illuminance of the exposure light is indirectly detected via the integrator sensor. Seeking control characteristics.

Further, for example, when using a high-sensitivity resist, it is necessary to further reduce the illuminance below the minimum output of the mercury lamp. Therefore, in order to obtain a wider dynamic range (variable range of illuminance), not only illuminance adjustment by electric power to the mercury lamp but also dimming member such as ND filter is used so that illuminance can be switched in multiple stages. .

[0010]

The exposure amount control in a device such as a mercury lamp which uses continuous light as a light source is, in fact, poor in responsiveness to the power control of the mercury lamp.
It is often performed every time the wafer is exchanged, and it is difficult to perform highly accurate adjustment for each shot or during exposure.

With respect to the exposure amount control device, since the exposure amount control method differs depending on whether the light source is pulsed light or continuous light, it is necessary to separately prepare control-related devices and software. Further, there is a problem that the manufacturing cost of the exposure apparatus including the apparatus increases.

Further, in the scanning type exposure apparatus, the steps
Real-time stepless exposure control is required during and scan exposure, but when continuous light is used as the light source,
The problem is that it is difficult to manufacture a darkening member such as an ND filter that can continuously switch the illuminance, and the manufacturing cost is high. In the conventional power adjustment, it takes time to stabilize the output. There is a problem that it takes.

The present invention has been made in view of the above problems, and provides an exposure amount control method and an exposure amount control device capable of adjusting the exposure amount with high accuracy for each shot or during exposure. With the goal. Another object of the present invention is to provide an exposure amount control device and a scanning type exposure device equipped with the device, which can keep the manufacturing cost low and enable optimum exposure amount control such as stabilizing the output in a short time.

[0014]

In order to solve the above-mentioned problems, an exposure amount control method of the present invention is an illumination for illuminating a predetermined illumination area on an original plate on which a transfer pattern is formed with exposure illumination light. An optical system is provided, and the pattern of the original plate is sequentially exposed on the substrate by scanning the substrate with respect to the exposure region conjugate with the illumination region in synchronization with the scanning of the original plate with respect to the illumination region. In an exposure amount control method for controlling an exposure amount through the illumination optical system in an apparatus, the apparatus includes a light blocking unit capable of blocking illumination light from an exposure light source that generates exposure illumination light, Pulsed light by adjusting at least one of the light blocking means, the light reducing means, and the scanning speed of the original plate and the substrate, and a light reducing means for reducing the illumination light from the exposure light source. As the exposure And performing control. In the present invention, it is preferable that the illumination optical system has at least one of the group consisting of the light source for exposure, the light shielding unit, and the dimming unit. Further, in the exposure amount control method, the exposure amount control can be controlled by a pulse width modulation (PWM) method.

In order to solve the above problems, the exposure amount control apparatus of the present invention comprises an illumination optical system for illuminating a predetermined illumination area on the original plate on which the transfer pattern is formed with exposure illumination light. The illumination in the exposure unit that sequentially exposes the pattern of the original onto the substrate by scanning the substrate with respect to the exposure area conjugate with the illumination area in synchronization with the scanning of the original with respect to the illumination area. In an exposure amount control device for controlling an exposure amount through an optical system, the exposure unit includes a light blocking unit capable of blocking illumination light from an exposure light source that generates exposure illumination light, and an exposure light source. An exposure amount as pulsed light by adjusting at least one of the light shielding means, the light reducing means, and the scanning speed of the original plate and the substrate. The control of Characterized in that it has a means.

In order to solve the above-mentioned problems, a scanning type exposure apparatus of the present invention is a scanning type exposure apparatus for exposing a pattern of an original plate on a substrate, and is provided with the exposure amount control device as a device for controlling the exposure amount. It is characterized by

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION In a preferred embodiment of the present invention, continuous light as a light source, output energy control means of continuous light, dimming means capable of controlling exposure amount stepwise, and wafer surface are provided. A means for PWM (Pulse Width Modulation) control of the light amount, a means for monitoring the exposure light on the wafer surface, and an exposure amount control means in an optimum state based on the exposure amount obtained by the monitoring means. A means is provided and continuous exposure amount control is performed in real time by PWM control.

The exposure control method and / or the exposure amount control apparatus according to the present embodiment makes it possible to reduce the cost of control software and control the exposure light continuously and in real time.

[0019]

Embodiments of the present invention will now be described with reference to the drawings. (First Embodiment) FIG. 1 is a view showing the schematic arrangement of an exposure apparatus using an exposure amount control system according to an embodiment of the present invention. In the figure, 1 is a continuous light source, 2 is a reticle on which an integrated circuit pattern is formed, 3 is a projection optical system, 4 is a wafer, and the integrated circuit pattern formed on the reticle 2 is projected onto the projection optical system 3. Projection exposure is performed on the wafer 4 via the through. A half mirror 5 is arranged on the optical path from the light source 1, and a photosensor 6 is arranged on the optical path reflected by the half mirror 5. The output of the photo sensor 6 is converted into an exposure amount via the sensor amplifier 6. The CPU 8 calculates the next output value based on the exposure amount measured by the photo sensor 6, gives the output energy command value to the light source 1, and optimally controls the optical system 9 and the shutter 10. Here, the optical system 9 is a light reducing means such as an ND filter, and the light shielding means 10 is a shutter described later. Reference numeral 11 denotes a reticle stage capable of horizontally moving the reticle at a desired speed during scanning exposure, and reference numeral 12 denotes a wafer stage capable of horizontally moving the wafer 4 like the reticle stage 11.

FIG. 2 is a diagram showing exposure amount control of a scanning type exposure apparatus using conventional pulsed light according to a comparative example.
(A) shows the case where the number of pulses is 4, (b) shows the case where the number of pulses is 3, and (c) shows the case where the number of pulses is 2. Conventionally, the exposure amount control of a scanning type exposure apparatus using pulsed light is
As shown in FIG. 2, the exposure amount control is performed so that the oscillation interval of the pulsed light is controlled so that the integrated exposure amount per shot becomes constant. At this time, the oscillation pulse interval is I (pulse / sec), and the illuminance per pulse is D (J / puls
e), the scanning speed of scanning exposure is V (mm / sec), the exposure slit width of 1 shot is Y (mm), and the integrated exposure amount is T (J), the integrated exposure amount of pulsed light is expressed by the following formula. You can T = (Y / V) × I × D (1)

On the other hand, FIG. 3 is a diagram showing exposure amount control of a scanning type exposure apparatus using PWM control in one embodiment of the present invention, in which (a), (b) and (c) are pulsed respectively. The case where the widths are different is shown. As shown in FIG. 3, PWM
The integrated exposure amount in the control is the time when the exposure light is irradiated onto the wafer surface and the time when the exposure light is not irradiated, and the light-shielding time is C (se
c), irradiation time is O (sec), illuminance per irradiation is D (J / sec), scanning speed of scanning exposure is V (mm / sec),
1 shot exposure slit width Y (mm), total exposure amount T (J
), It can be expressed by the following equation. T = (Y / V) × (O / (C + O)) × D (2)

Here, the following mathematical formula is assumed. I = (O / (C + O)) (3)

The following equations are derived from the above equations (1), (2), and (3). T = (Y / V) × I × D

From the above, the equation expressing the integrated exposure amount by the PWM control method is synonymous with the equation expressing the integrated exposure amount by pulsed light. That is, it is possible to use all the exposure amount control methods performed with pulsed light by the PWM control method, and it is possible to unify the control methods.

For example, when the oscillation interval is controlled by pulsed light, the oscillation interval can be controlled by changing the transmission interval I in equation (1). In the present embodiment, the light blocking time C,
The exposure amount can be controlled by changing the irradiation time O.

Further, since the irradiation frequency of the exposure light irradiated by the equation (2) affects the unevenness of exposure in the scanning direction of the exposure area on the photosensitive substrate, the irradiation frequency is appropriate when determining the exposure conditions. Controlled by value.

As means for controlling the PWM method, it is possible to change the irradiation time interval and the light blocking time interval in real time by controlling the drive interval of the shutter 10 in FIG. In addition, when the light source has good responsiveness to the power change, the light blocking time interval and the irradiation time interval can be controlled by performing the power control.

FIG. 4 is a diagram for explaining the light shielding means that can be provided in the scanning type exposure apparatus in one embodiment of the present invention. As the shutter 10 shown in FIG. 1, a disk-shaped shutter as shown in FIG. 4 having wings inside is rotated at a high speed by a motor 40, and a light blocking portion 41 and an exposure light passing portion 42 block light from a light source. It is possible to create a portion 42 that passes through 41. The shape of the wing in the case of FIG. 4 is set so that the ratio of the areas of the light-shielding portion and the transmitting portion at an arbitrary radius from the disk center is always constant. When the number of rotations of the disk at this time is R (1 / sec), the number of wings is N, and the area ratio is A: B (= transmissive part: light-shielding part), the light-shielding time and irradiation time in the above formula (2) Can be expressed as the following formula. Shading time: C = B / (NR (A + B)) (4) Irradiation time: O = A / (NR (A + B)) (5)

From the equations (4) and (5), the above equation (2) is expressed by the following equation.

[0030]   T = (Y / V) × (O / (C + O)) × D = (Y / V) × (A / (NR (A + B))) / (B / (NR (A + B)) + A / (NR (A + B))) × D = (Y / V) × (A / (A + B)) × D (6)

From this fact, the number of rotations of the disk and the number of wings do not affect the integrated exposure amount, but when the number of rotations becomes slow, uneven exposure occurs in the scanning direction of the exposure area on the photosensitive substrate. The oscillation frequency 1 / NR that can be determined from the rotation speed R and the number of wings N is controlled with an appropriate value when determining the exposure condition. In FIG. 4, the area ratio of the above equation (4) is changed by changing the size of the wing while keeping the same area ratio of the light-shielding portion and the transmitting portion at an arbitrary radius.
A and B in the equation (4) change, and the integrated exposure amount can be controlled.

Further, as the shape of the shutter, a means for changing the area ratio of the light-shielding portion and the irradiation portion by overlapping two of the above-mentioned discs and changing the overlapping state of the wings is used, and the light-shielding time interval and the irradiation are changed. The time interval may be controlled.

FIG. 5 is a diagram showing an example of the relationship between the light shielding portion and the light transmitting portion of the light shielding means and the shape of the light shielding means in one embodiment of the present invention. The ratio to the light-shielding portion, the horizontal axis represents the shutter radius as a relation between the light-shielding portion and the light-transmitting portion, and FIG. By setting the shape of the wing in the disk so that the ratio of the transmission part to the light blocking part is as shown in FIG. 5, the distance between the exposure light and the center of the disk of the shutter can be controlled to perform PWM control.

FIG. 6 is a diagram for explaining an example of the light shielding means in one embodiment of the present invention. The exposure amount can be controlled by changing the shape of the wing in the disk by changing the ratio between the transmission portion and the light shielding portion in FIG.

FIG. 7 is a diagram showing the relationship between the light amount after passing through a plurality of types of ND filters and the light amount before passing through the ND filter in one embodiment of the present invention. The ND filter has a unit capable of controlling the exposure light amount stepwise by passing through a plurality of types of ND filters (three types of ND1 to ND3 in FIG. 7), for example. Alternatively, it may have a means capable of continuously changing the extinction ratio.

As means for controlling the exposure amount in real time, for example, the exposure energy per pulse is synchronized with the operation speed of the shutter 10 in FIG. 1 and re-monitored by the photo sensor 6 in FIG. The target exposure energy per pulse is set and compared. When the monitored exposure energy is smaller than the target energy, the shutter 10 is controlled so that the irradiation time becomes longer so that the exposure energy obtained by adding the difference to the target energy can be obtained.

Further, similarly from FIG. 1, when the exposure amount is small, the exposure amount can be increased by decreasing the scanning speed of the wafer stage 12 and the reticle stage 11. Further, if the neutral density filter installed in the optical system 9 is continuously variable, the exposure amount can be controlled by adjusting the neutral density filter in real time.

(Example of Semiconductor Production System) Next, a device such as a semiconductor (a semiconductor chip such as an IC or an LSI, a liquid crystal panel, a CCD, a thin film magnetic head, etc.) using an exposure apparatus including the above-described scanning type exposure apparatus. An example of a production system of a micromachine or the like) will be described. This is to carry out maintenance services such as troubleshooting of a manufacturing apparatus installed in a semiconductor manufacturing factory, periodic maintenance, or software provision using a computer network or the like outside the manufacturing factory.

FIG. 8 shows the whole system cut out from a certain angle. In the figure, 101 is a business office of a vendor (apparatus supplier) that provides a semiconductor device manufacturing apparatus. As an example of a manufacturing apparatus, a semiconductor manufacturing apparatus for various processes used in a semiconductor manufacturing factory, for example,
Pre-process equipment (lithography equipment such as exposure equipment, resist processing equipment, etching equipment, heat treatment equipment, film forming equipment,
Flattening equipment, etc.) and post-process equipment (assembling equipment, inspection equipment, etc.) are assumed. In the business office 101, a host management system 10 that provides a maintenance database for manufacturing equipment is provided.
8, a plurality of operation terminal computers 110, and a local area network (LAN) 109 that connects these to construct an intranet or the like. Host management system 1
08 is provided with a gateway for connecting the LAN 109 to the Internet 105, which is an external network of the office, and a security function for restricting access from the outside.

On the other hand, 102 to 104 are semiconductor manufacturers (semiconductor device manufacturers) as users of manufacturing equipment.
Manufacturing plant. The manufacturing factories 102 to 104 may be factories belonging to different makers or may be factories belonging to the same maker (for example, a pre-process factory, a post-process factory, etc.). In each of the factories 102 to 104, a plurality of manufacturing apparatuses 106, a local area network (LAN) 111 that connects them to construct an intranet, and a host as a monitoring apparatus that monitors the operating status of each manufacturing apparatus 106 are provided. A management system 107 is provided. The host management system 107 provided in each factory 102 to 104 includes a gateway for connecting the LAN 111 in each factory to the Internet 105 which is an external network of the factory. As a result, the host management system 108 on the vendor 101 side can be accessed from the LAN 111 of each factory via the Internet 105, and only the limited user is permitted to access by the security function of the host management system 108. Specifically, via the Internet 105,
The factory side notifies the vendor side of status information indicating the operating status of each manufacturing apparatus 106 (for example, a symptom of the manufacturing apparatus in which a trouble has occurred), and the response information corresponding to the notification (for example, an instruction for a troubleshooting method is given. Information to
It is possible to receive maintenance information such as countermeasure software and data), the latest software, and help information from the vendor side. A communication protocol (TCP / IP) generally used on the Internet is used for data communication between the factories 102 to 104 and the vendor 101 and data communication on the LAN 111 in each factory. In addition,
Instead of using the Internet as an external network outside the factory, it is also possible to use a leased line network (ISDN or the like) having high security without being accessed by a third party. Further, the host management system is not limited to one provided by a vendor, and a user may construct a database and place it on an external network to permit access from a plurality of factories of the user to the database.

Now, FIG. 9 is a conceptual diagram showing the entire system of this embodiment cut out from an angle different from that shown in FIG. In the above example, a plurality of user factories each provided with a manufacturing apparatus are connected to a management system of a vendor of the manufacturing apparatus via an external network, and production management of each factory or at least one unit is performed via the external network. Was used for data communication of information on the manufacturing equipment. On the other hand, in this example, a factory equipped with manufacturing equipment of a plurality of vendors and a management system of each vendor of the plurality of manufacturing equipments are connected by an external network outside the factory, and maintenance information of each manufacturing equipment is displayed. It is for data communication. In the figure, reference numeral 201 denotes a manufacturing plant of a manufacturing apparatus user (semiconductor device manufacturing maker), and a manufacturing apparatus for performing various processes is installed on a manufacturing line of the factory.
The film forming processing device 204 is introduced. Although only one manufacturing factory 201 is shown in FIG. 9, a plurality of factories are actually networked in the same manner. Each device in the factory is connected by a LAN 206 to form an intranet or the like, and the host management system 205 manages the operation of the manufacturing line. On the other hand, the exposure apparatus manufacturer 210, the resist processing apparatus manufacturer 220, the film deposition apparatus manufacturer 230, etc.
Each business site of the vendor (device supplier) is provided with host management systems 211, 221, 231 for performing remote maintenance of the supplied equipment, respectively, and these are provided with the maintenance database and the gateway of the external network as described above. . The host management system 205 that manages each device in the user's manufacturing factory and the vendor management system 211, 221, 231 of each device are the external network 20.
It is connected by the Internet or a leased line network which is 0. In this system, if a trouble occurs in any of the series of manufacturing equipment on the manufacturing line, the operation of the manufacturing line is suspended, but the vendor of the equipment in trouble receives remote maintenance via the Internet 200. This enables quick response and minimizes production line downtime.

Each manufacturing apparatus installed in the semiconductor manufacturing factory is provided with a display, a network interface, and a computer for executing the network access software and the apparatus operating software stored in the storage device. The storage device is a built-in memory, a hard disk, a network file server, or the like. The network access software includes a dedicated or general-purpose web browser, and provides a user interface having a screen as shown in FIG. 10 on the display. The operator who manages the manufacturing apparatus in each factory refers to the screen and the manufacturing apparatus model (401), serial number (402), trouble subject (403), date of occurrence (404), urgency (40).
5), symptom (406), coping method (407), progress (40)
8) Input information such as the above into the input items on the screen. The input information is transmitted to the maintenance database via the Internet, and the appropriate maintenance information as a result is returned from the maintenance database and presented on the display. Further, the user interface provided by the web browser is further provided with a hyperlink function (410, 411, 4) as shown in the figure.
12) is realized, the operator can access more detailed information of each item, pull out the latest version of software to be used for the manufacturing equipment from the software library provided by the vendor, and use it as a guide for the factory operator. Help information) can be retrieved. Here, the maintenance information provided by the maintenance database includes the information about the present invention described above, and the software library also provides the latest software for implementing the present invention.

Next, a semiconductor device manufacturing process using the above-described production system will be described. Figure 11
Shows a flow of the whole manufacturing process of the semiconductor device. In step 1 (circuit design), the circuit of the semiconductor device is designed. In step 2 (mask manufacturing), a mask having the designed circuit pattern is manufactured. On the other hand, in step 3 (wafer manufacturing), a wafer is manufactured using a material such as silicon. Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by the lithography technique using the mask and the wafer prepared above. The next step 5 (assembly) is called a post-process, which is a process of forming a semiconductor chip using the wafer manufactured in step 4, and an assembly process (dicing,
Assembling process such as bonding) and packaging process (chip encapsulation). In step 6 (inspection), the semiconductor device manufactured in step 5 undergoes inspections such as an operation confirmation test and a durability test. A semiconductor device is completed through these processes and shipped (step 7). The front-end process and the back-end process are performed in separate dedicated factories, and maintenance is performed for each of these factories by the remote maintenance system described above. Also, between the front-end factory and the back-end factory,
Information and the like for production management and equipment maintenance are data-communicated via the Internet or a leased line network.

FIG. 12 shows a detailed flow of the wafer process. In step 11 (oxidation), the surface of the wafer is oxidized. In step 12 (CVD), an insulating film is formed on the wafer surface. In step 13 (electrode formation), electrodes are formed on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted in the wafer. In step 15 (resist processing), a photosensitive agent is applied to the wafer.
In step 16 (exposure), the circuit pattern of the mask is printed on the wafer by exposure using an exposure apparatus including the scanning type exposure apparatus described above. In step 17 (development), the exposed wafer is developed. In step 18 (etching), parts other than the developed resist image are removed. Step 19
In (resist stripping), the unnecessary resist after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer. Since the manufacturing equipment used in each process is maintained by the remote maintenance system described above, troubles can be prevented in advance, and even if troubles occur, quick recovery is possible, and Productivity can be improved.

[0045]

As described above, according to the present invention,
Controlling the amount of exposure as pulsed light, for example PWM
The control of the exposure amount has the effect of enabling the optimum exposure amount control without increasing the manufacturing cost.

[Brief description of drawings]

FIG. 1 is a diagram showing a schematic configuration of an exposure apparatus using an exposure amount control system in an embodiment of the present invention.

FIG. 2 is a diagram showing exposure amount control of a conventional scanning type exposure apparatus using pulsed light according to a comparative example, where (a) is a case where the number of pulses is 4, and (b) is a case where the number of pulses is 3; , (C) show the case where the number of pulses is two, respectively.

FIG. 3 is a diagram showing exposure amount control of a scanning type exposure apparatus using PWM control according to an embodiment of the present invention,
(A), (b), and (c) show the cases where the pulse widths are different.

FIG. 4 is a diagram illustrating a light blocking unit that can be provided in the scanning exposure apparatus according to the embodiment of the present invention.

FIG. 5 is a diagram showing an example of the relationship between the light-shielding portion and the transmissive portion of the light-shielding means and an example of the shape of the light-shielding means in one embodiment of the present invention. The ratio and the horizontal axis represent the relationship between the light-shielding portion and the light-transmitting portion as the radius of the shutter, and (b) shows an example of the shape of the light-shielding means.

FIG. 6 is a diagram illustrating an example of a light shielding unit according to an embodiment of the present invention.

FIG. 7 is a diagram showing a relationship between a light amount after passing through a plurality of types of ND filters and a light amount before passing through an ND filter according to an embodiment of the present invention.

FIG. 8 is a conceptual view of a semiconductor device production system including an exposure apparatus according to an embodiment of the present invention viewed from a certain angle.

FIG. 9 is a conceptual diagram of a semiconductor device production system including an exposure apparatus according to an embodiment of the present invention as viewed from another angle.

FIG. 10 is a diagram showing a specific example of a user interface in a semiconductor device production system including an exposure apparatus according to an embodiment of the present invention.

FIG. 11 is a diagram illustrating a flow of a device manufacturing process by the exposure apparatus according to the embodiment of the present invention.

FIG. 12 is a diagram illustrating a wafer process by the exposure apparatus in the embodiment of the present invention.

[Explanation of symbols]

1, 50: light source, 2: reticle, 4: wafer, 5: half mirror, 6: photo sensor, 7: amplifier, 8: CP
U, 9: optical system, 10: light shielding means, 11: reticle stage, 12: wafer stage, 40, 60: motor, 4
1, 61: light-shielding portion, 42, 62: exposure light passage portion, 51:
Light-shielding portion, 52: exposure light passage portion, 63: light-shielding portion area.

Claims (12)

[Claims] 1. An illumination optical system for illuminating a predetermined illumination area on an original plate on which a transfer pattern is formed with an illumination light for exposure, wherein the illumination area is synchronized with scanning of the original plate. In the exposure amount control method for controlling the exposure amount through the illumination optical system in the device that sequentially exposes the pattern of the original plate on the substrate by scanning the substrate with respect to the exposure region conjugate with the illumination region, The apparatus includes a light blocking unit capable of blocking the illumination light from the exposure light source that generates the illumination light for exposure, and a light reduction unit that reduces the illumination light from the exposure light source. An exposure amount control method, wherein the exposure amount is controlled as pulsed light by adjusting at least one of the light reduction means and the scanning speed of the original plate and the substrate. 2. The exposure amount control method according to claim 1, wherein the illumination optical system includes at least one of the group consisting of the light source for exposure, the light shielding unit, and the dimming unit. . 3. The exposure amount control method according to claim 1, wherein the exposure amount control method controls the exposure amount by a pulse width modulation method. 4. An illumination optical system for illuminating a predetermined illumination area on an original plate on which a transfer pattern is formed with an illumination light for exposure, wherein the illumination area is synchronized with scanning of the original plate with respect to the illumination area. In an exposure amount control device for controlling an exposure amount through the illumination optical system in an exposure unit that sequentially exposes the pattern of the original onto the substrate by scanning the substrate with respect to an exposure region conjugate with an illumination region. The exposure unit includes a light blocking unit capable of blocking the illumination light from the exposure light source that generates the illumination light for exposure, and a dimming unit that dims the illumination light from the exposure light source, An exposure amount control device comprising: a light-shielding device, the dimming device, and a device for controlling an exposure amount as pulsed light by adjusting at least one of scanning speeds of the original plate and the substrate. . 5. A scanning type exposure apparatus for exposing a pattern of an original plate onto a substrate, comprising the exposure amount control apparatus according to claim 4 as an apparatus for controlling an exposure amount. 6. The scanning exposure apparatus according to claim 5, further comprising a display, a network interface,
A scanning exposure apparatus further comprising a computer that executes network software, and is capable of performing data communication of maintenance information of the scanning exposure apparatus via a computer network. 7. The network software is connected to an external network of a factory where the scanning exposure apparatus is installed, and has a user interface for accessing a maintenance database provided by a vendor or a user of the scanning exposure apparatus. 7. The scanning exposure apparatus according to claim 6, which is provided on a display and makes it possible to obtain information from the database via the external network. 8. A step of installing a manufacturing apparatus group for various processes including the scanning type exposure apparatus according to claim 5 in a semiconductor manufacturing factory, and a plurality of steps using the manufacturing apparatus group. And a step of manufacturing a semiconductor device by a process. 9. Data communication of information relating to at least one of said manufacturing apparatus group between the step of connecting said manufacturing apparatus group by a local area network and between said local area network and an external network outside said semiconductor manufacturing factory. The method for manufacturing a semiconductor device according to claim 8, further comprising: 10. A semiconductor provided by a vendor or a user of the scanning type exposure apparatus via the external network to obtain maintenance information of the manufacturing apparatus by data communication, or a semiconductor different from the semiconductor manufacturing factory. The semiconductor device manufacturing method according to claim 9, wherein production management is performed by performing data communication with a manufacturing factory via the external network. 11. A manufacturing apparatus group for various processes including the scanning exposure apparatus according to claim 5.
A local area network for connecting the manufacturing apparatus group, and a gateway that enables access from the local area network to an external network outside the factory,
A semiconductor manufacturing plant, which enables data communication of information relating to at least one of the manufacturing apparatus group. 12. The semiconductor device manufacturing plant according to claim 5,
A method for maintaining a scanning exposure apparatus according to any one of claims 1 to 7, wherein a vendor or a user of the scanning exposure apparatus provides a maintenance database connected to an external network of a semiconductor manufacturing factory. A step of permitting access to the maintenance database from the semiconductor manufacturing factory via the external network; and a step of transmitting the maintenance information accumulated in the maintenance database to the semiconductor manufacturing factory side via the external network. A method for maintaining a scanning exposure apparatus, which comprises: