JP2003089832A - Copper alloy foil having excellent thermal peeling resistance of plating - Google Patents
Copper alloy foil having excellent thermal peeling resistance of platingInfo
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- JP2003089832A JP2003089832A JP2001282875A JP2001282875A JP2003089832A JP 2003089832 A JP2003089832 A JP 2003089832A JP 2001282875 A JP2001282875 A JP 2001282875A JP 2001282875 A JP2001282875 A JP 2001282875A JP 2003089832 A JP2003089832 A JP 2003089832A
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- copper
- copper alloy
- alloy foil
- plating
- foil
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、フレキシブルプリ
ント配線基板、半導体パッケージ基板、電池電極板の集
電体等の用途において用いるのに好適な銅合金箔に関す
る。一層詳細には、本発明は、強度、電気伝導性に優れ
ていると共に、Ｓｎめっき等の耐熱剥離性（めっきを施
した材料が熱等の作用に対して剥離耐性を有する性質）
にも優れた銅合金箔に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a copper alloy foil suitable for use in applications such as flexible printed wiring boards, semiconductor package boards, and current collectors for battery electrode plates. More specifically, the present invention has excellent strength and electrical conductivity, and also has heat-resistant peeling property such as Sn plating (the property that the plated material has peeling resistance against the action of heat).
It also relates to an excellent copper alloy foil.
【０００２】[0002]
【従来の技術】近年、携帯電話、パソコン、電池等の高
機能電子機器は、ますます小型化され、軽量化される傾
向にある。このような傾向に伴い、高機能電子機器に使
用されるフレキシブルプリント配線基板、半導体パッケ
ージ基板であるＴＣＰ（テープキャリヤーパッケージ）
あるいはＣＯＦ（チップ−オン−フレキ）、電池電極板
の集電体等の電子部品についても更に小型化、軽量化さ
れることが求められている。また、それらの配線、集電
体等の導体材料としては主として銅箔が使用されてい
る。しかし、高い電気伝導性を求めるために純銅箔を用
いた場合には、材料強度が低いために、部品を加工した
り又は組み立てる工程で変形を生じたり、切断するとい
った問題が生じる。更に、電子部品について小型化され
ることは、必然的に高密度化されることを伴う。高機能
電子機器が小型化、高密度化されるに伴い、フレキシブ
ルプリント配線基板等では、配線等が狭ピッチになり、
そのために引張応力がかかると破断を生じて生産性を下
げてしまうという不具合が生じる。また、配線等が狭ピ
ッチになる為に回路の断面積が小さくなり導体抵抗値が
上がる等の不具合が起こる。2. Description of the Related Art In recent years, high-performance electronic devices such as mobile phones, personal computers, and batteries tend to be smaller and lighter. Along with this tendency, TCP (tape carrier package), which is a flexible printed wiring board and a semiconductor package board used in high-performance electronic devices.
Alternatively, electronic parts such as COF (chip-on-flex) and current collectors of battery electrode plates are required to be further downsized and lightened. Moreover, copper foil is mainly used as a conductor material for the wiring and the current collector. However, when a pure copper foil is used in order to obtain high electric conductivity, the material strength is low, and therefore, problems such as deformation and cutting occur in the process of processing or assembling the parts. Further, miniaturization of electronic components is necessarily accompanied by high density. With the miniaturization and high density of high-performance electronic devices, the wiring pitch of flexible printed wiring boards, etc. has become narrower,
Therefore, when tensile stress is applied, breakage occurs and productivity is reduced. In addition, since the wiring or the like has a narrow pitch, the cross-sectional area of the circuit becomes small and the conductor resistance value increases, which causes a problem.
【０００３】上述した問題を解決するために、銅箔等の
導体材料には、他の元素が加えられて、銅合金箔の形態
で使用されるのが普通である。しかし、銅合金を用いる
と言うだけでは必ずしも十分な強度は得られず、加えて
元素の添加により基板の他の必要特性である電気伝導度
が低下するといった問題が生じる。銅箔等の導体材料に
おいて、電気伝導度を大きく低下させずに強度を与える
ために他の元素を加えることを提案するものとして、特
開平11-264037号公報、同11-264038号公報及び同11-264
040号公報がある。また、最近では、電子機器銅合金の
ような高い強度と電気伝導性が要求される用途では、析
出硬化法によって製造された銅合金が使用されるケース
が多くなってきている。これは、析出硬化法によって、
電気伝導性を低下させずに強くて硬い銅合金が得られか
らである。In order to solve the above-mentioned problems, a conductor material such as a copper foil is usually added with other elements and used in the form of a copper alloy foil. However, just using a copper alloy does not necessarily provide sufficient strength, and the addition of an element causes a problem that electrical conductivity, which is another necessary characteristic of the substrate, decreases. In a conductor material such as copper foil, as a proposal to add other elements in order to give strength without significantly lowering the electrical conductivity, JP-A 11-264037, JP 11-264038 and the same 11-264
There is a 040 publication. In addition, recently, in applications such as electronic equipment copper alloys that require high strength and electrical conductivity, copper alloys produced by the precipitation hardening method are often used. This is a precipitation hardening method
This is because a strong and hard copper alloy can be obtained without lowering the electrical conductivity.
【０００４】一方、導体用銅箔は、それ単体で使用され
ることはなく、銅箔が導体回路としてポリイミド樹脂等
の有機物と積層され、実装される部品と半田付けが行わ
れたりする。この場合、銅箔上にSnめっき等の表面処理
が施される。従来の銅箔は純銅で加工されており、Snめ
っき等の表面処理に対しても熱剥離等の問題は生じなか
った。しかし、銅箔が、高強度かつ高導電率の特性を得
るために、純銅に少量の元素が複数添加された銅合金の
場合には、めっき等の表面処理時に熱剥離の問題が起
き、ひいてはコストの増大を招き得る。On the other hand, the copper foil for a conductor is not used alone, but the copper foil is laminated as a conductor circuit with an organic substance such as a polyimide resin and soldered to a component to be mounted. In this case, surface treatment such as Sn plating is performed on the copper foil. Since the conventional copper foil is processed with pure copper, there is no problem such as heat peeling even with surface treatment such as Sn plating. However, the copper foil is a copper alloy in which a small number of elements are added to pure copper in order to obtain high-strength and high-conductivity characteristics, and a problem of thermal delamination occurs during surface treatment such as plating, and eventually This may increase costs.
【０００５】特に析出硬化型銅合金においては、一般に
銅合金とSnとの反応が活発になり、脆い金属間化合物が
形成され易い、あるいは銅合金とSnとの界面にボイドが
形成され易い等の現象によりSnめっき層が銅材より剥離
し易い。Particularly in a precipitation hardening type copper alloy, the reaction between the copper alloy and Sn is generally active and brittle intermetallic compounds are easily formed, or voids are easily formed at the interface between the copper alloy and Sn. Due to the phenomenon, the Sn plating layer is easier to peel off than the copper material.
【０００６】添加される元素の中で、Znが銅合金のめっ
き耐熱剥離性を改良する成分であることは、例えば特公
平８−９５７号公報により知られている。しかし、Zn
は、銅合金の強度の向上に寄与せず、また、その添加量
を多くすると、銅合金の電気伝導性が低下する。It is known, for example, from Japanese Examined Patent Publication No. 8-957, that Zn is a component that improves the heat resistant peeling resistance of a copper alloy among the added elements. But Zn
Does not contribute to the improvement of the strength of the copper alloy, and if the addition amount is increased, the electrical conductivity of the copper alloy decreases.
【０００７】[0007]
【発明が解決しようとする課題】本発明は、上述した従
来技術の問題を克服し、銅の高い電気伝導性を持ちなが
ら高い強度を有し、なお且つSnめっき等の表面処理に対
しても良好な耐熱剥離性を有し、さらには生産性も良好
な銅合金箔を提供するものである。The present invention overcomes the above-mentioned problems of the prior art, has high strength while having high electric conductivity of copper, and can be applied to surface treatment such as Sn plating. It is intended to provide a copper alloy foil having good heat-resistant peelability and also having good productivity.
【０００８】[0008]
【課題を解決するための手段】本発明者等は，上記課題
を開発すべく鋭意研究を重ねたところ、銅にZnとZr又は
Crとを加え、必要に応じて更にTi、Ni、Fe、Sn、Si、M
n、P、Mg、Co、Al、B、In及びAgの内の一種以上を加え
ることにより、目的とする銅合金箔を提供することがで
きることを見出した。本発明は、かかる知見を基にして
完成したものであり、銅合金箔において、重量割合で、
Zn0.01％〜0.3％及びZr0.01％〜0.25％又はCr0.02％〜
0.4％を含有し、更に好ましくはTi、Ni、Fe、Sn、Si、M
n、P、Mg、Co、Al、B、In及びAgの内の一種以上を総量
で0.005％〜1.0％含有し、残部が銅及び不可避不純物で
ある銅合金箔である。[Means for Solving the Problems] The inventors of the present invention have conducted extensive studies to develop the above-mentioned problems and found that Zn and Zr or
Add Cr and, if necessary, Ti, Ni, Fe, Sn, Si, M
It has been found that the target copper alloy foil can be provided by adding one or more of n, P, Mg, Co, Al, B, In and Ag. The present invention has been completed based on such findings, and in the copper alloy foil, in a weight ratio,
Zn0.01% -0.3% and Zr0.01% -0.25% or Cr0.02%-
Contains 0.4%, more preferably Ti, Ni, Fe, Sn, Si, M
A copper alloy foil containing at least one of n, P, Mg, Co, Al, B, In and Ag in a total amount of 0.005% to 1.0% with the balance being copper and inevitable impurities.
【０００９】[0009]
【発明の実施の形態】次に、本発明において銅合金箔の
成分を前記の如くに限定した理由をその作用とともに以
下に説明する。BEST MODE FOR CARRYING OUT THE INVENTION Next, the reason why the components of the copper alloy foil are limited as described above in the present invention will be explained below together with their action.
【００１０】（Zr）Zrには、合金を温度８００℃以上で
溶体化処理した後に時効処理を行うことによりCuと化合
物を形成して母材中に析出しこれを強化する作用がある
が、Zrの含有量が0.01％未満ではこの作用による所望の
効果が得られない。一方、Zr含有量が増加すると粗大な
未固溶Zrが母材料中に残留するようになって圧延中材料
表面に露出し表面欠陥を生成する。これらの表面欠陥部
にめっきを行うと、正常に電着が行われず、剥離等のめ
っき異常が発生する。そのため、Zr含有量は、銅合金箔
中0.25％以下であるのが好ましく、0.15％以下であるの
が一層好ましい。なお、溶体化処理は、８００℃以上の
温度で熱間圧延を行うことによっても兼ねられる。(Zr) Zr has a function of forming a compound with Cu and precipitating it in the base metal by subjecting the alloy to solution treatment at a temperature of 800 ° C. or higher and then aging treatment, and strengthening it. If the Zr content is less than 0.01%, the desired effect due to this action cannot be obtained. On the other hand, when the Zr content increases, coarse undissolved Zr remains in the base material and is exposed on the surface of the material during rolling to generate surface defects. When plating is performed on these surface defects, electrodeposition is not normally performed and plating abnormalities such as peeling occur. Therefore, the Zr content in the copper alloy foil is preferably 0.25% or less, and more preferably 0.15% or less. The solution treatment may also be performed by hot rolling at a temperature of 800 ° C. or higher.
【００１１】（Cr）Crは、合金を温度８００℃以上で溶
体化処理した後に、時効処理を行うことにより母相中に
析出して強度を向上させる作用をするため必要に応じて
添加されるが、Crの含有量が0.02％未満ではこの作用に
よる所望の効果が得られず、一方、Crの含有量が増加す
ると粗大なCrが母相中に残留し、圧延中材料表面に露出
し表面欠陥を生成する。これらの表面欠陥部にめっきを
行うと、正常に電着が行われず、剥離等のめっき異常が
発生する。そのため、Crの含有量は、銅合金箔中0.4％
以下であるのが好ましく、0.25％以下であるのが一層好
ましい。なお、溶体化処理は、８００℃以上の温度で熱
間圧延を行うことによっても兼ねられる。(Cr) Cr is added as needed because it has the function of improving strength by precipitating in the matrix by subjecting the alloy to solution treatment at a temperature of 800 ° C. or higher and then subjecting it to aging treatment. However, if the Cr content is less than 0.02%, the desired effect due to this action cannot be obtained, while if the Cr content increases, coarse Cr remains in the matrix and is exposed on the material surface during rolling. Generate a defect. When plating is performed on these surface defects, electrodeposition is not normally performed and plating abnormalities such as peeling occur. Therefore, the content of Cr is 0.4% in the copper alloy foil.
It is preferably at most 0.25%, more preferably at most 0.25%. The solution treatment may also be performed by hot rolling at a temperature of 800 ° C. or higher.
【００１２】（Zn）Znは、Cu中に固溶し、銅箔上にめっ
きを施す際には、銅箔上にめっきされたSnと母材である
Cuとの間の固相反応に影響を与え、特に脆い金属間化合
物であるε相の生成を抑制し、なお且つCuとSnとの拡散
能の差異に起因してその界面で生成されるボイドの発生
を抑制させる効果がある。Znは、その含有量が0.01％未
満ではこの作用による所望の効果が得られず、一方含有
量が増加し0.3％を越えても上述したボイドの発生を抑
制させる効果も上昇せず、むしろ銅合金箔中の導電率を
逆に下げることが分かった。そのためZnの含有量は、0.
01〜0.3％であるのが好ましい。(Zn) Zn is a solid solution in Cu and is a base material and Sn plated on the copper foil when the copper foil is plated.
A void that affects the solid-state reaction with Cu, suppresses the formation of the ε phase, which is a particularly brittle intermetallic compound, and is formed at the interface due to the difference in diffusivity between Cu and Sn. Has the effect of suppressing the occurrence of. Zn, if the content is less than 0.01%, the desired effect due to this action cannot be obtained, while on the other hand, even if the content increases and exceeds 0.3%, the effect of suppressing the above-mentioned generation of voids does not increase, but rather copper. It has been found that the conductivity in the alloy foil is reduced. Therefore, the content of Zn is 0.
It is preferably from 01 to 0.3%.
【００１３】（Ti、Ni、Fe、Sn、Si、Mn、P、Mg、Co、A
l、B、In又はAg）Ti、Ni、Fe、Sn、Si、Mn、P、Mg、C
o、Al、B、In又はAgは、銅合金箔において以下のように
作用する。これらの成分は、いずれも合金の導電性を大
きく低下させずに主として固溶強化により強度を向上さ
せる作用を有しており、したがって必要に応じて一種ま
たは二種以上の添加がなされるが、その含有量が総量で
0.005％未満であると前記作用による所望の効果が得ら
れず，一方，総量で1.0％を超える場合には合金の導電
率が著しく低下する。このため、単独添加または二種以
上の複合添加がなされるTi、Ni、Fe、Sn、Si、Mn、P、M
g、Co、Al、B、In又はAgの含有量は、銅合金箔中総量で
0.005％〜1.0％であり、0.01〜1.0％であるのが好まし
い。(Ti, Ni, Fe, Sn, Si, Mn, P, Mg, Co, A
l, B, In or Ag) Ti, Ni, Fe, Sn, Si, Mn, P, Mg, C
o, Al, B, In or Ag acts as follows in the copper alloy foil. Each of these components has the effect of mainly improving the strength by solid solution strengthening without greatly reducing the conductivity of the alloy, and therefore, one or more kinds are added as necessary, The total content is
If it is less than 0.005%, the desired effect due to the above-mentioned action cannot be obtained, while if it exceeds 1.0% in total, the conductivity of the alloy is remarkably reduced. Therefore, Ti, Ni, Fe, Sn, Si, Mn, P, M, which are added alone or in combination of two or more,
The content of g, Co, Al, B, In or Ag is the total amount in the copper alloy foil.
It is 0.005% to 1.0%, preferably 0.01 to 1.0%.
【００１４】次に、この銅合金箔を得るための製造工程
について説明する。所望の強度及び電気伝導性を得るた
めには、素材の調質状態は時効処理状態である必要があ
る。この時効処理は、強度及び電気伝導性を向上させる
ために必要である。すなわち、時効処理に先だって、銅
合金を固溶体の溶解度曲線よりも高い温度に加熱し、溶
質原子の均一な分布を確保してから、低温に急冷する溶
体化処理を行う。次いで、時効処理を行うが、時効処理
温度は300°〜700℃にする必要がある。時効処理温度が
300℃よりも低いと、時効処理の時間を長くしなければ
ならず、経済的でない。他方、時効処理温度が700℃を
超えると、CrやZrが固溶していまい、時効処理による強
度及び電気伝導性の向上が生じない。次いで、合金に冷
間圧延を施して所望の板厚みに仕上げる。冷間圧延後の
箔の厚さは、100μm（0.1mm）以下にするのが望まし
い。Next, a manufacturing process for obtaining this copper alloy foil will be described. In order to obtain the desired strength and electrical conductivity, the tempering condition of the material needs to be the aging treatment condition. This aging treatment is necessary to improve strength and electric conductivity. That is, prior to the aging treatment, the copper alloy is heated to a temperature higher than the solubility curve of the solid solution to ensure a uniform distribution of solute atoms, and then a solution treatment of quenching to a low temperature is performed. Next, the aging treatment is performed, but the aging treatment temperature needs to be 300 ° to 700 ° C. The aging temperature is
If it is lower than 300 ° C, the aging treatment time must be lengthened, which is not economical. On the other hand, when the aging treatment temperature exceeds 700 ° C., Cr and Zr are dissolved in solid solution, and the aging treatment does not improve the strength and electrical conductivity. Then, the alloy is cold-rolled to a desired plate thickness. The thickness of the foil after cold rolling is preferably 100 μm (0.1 mm) or less.
【００１５】[0015]
【実施例】以下に、実施例及び比較例によって本発明を
更に詳しく説明する。実施例
まず、電気銅(Cu)あるいは無酸素銅(Cu)を主原料とし、
かつ銅クロム母合金、銅ジルコニウム母合金、亜鉛、チ
タン、軟鋼、ニッケル、スズ、インジウム、マンガン、
マグネシウム、シリコン、銅リン母合金、アルミニウ
ム、コバルト、ホウ素、銀を副原料として使用し、高周
波溶解炉にて表１に示す各種成分組成の銅合金を真空中
またはAr雰囲気中で溶製し、厚さ30mmのインゴットに鋳
造した。次に、得られた各インゴットを温度800°〜950
℃で厚さ8mmまで熱間圧延を行い、表面のスケール除去
のため面削を施した後、温度800°〜900℃で10分間溶体
化処理を行った後、厚さ0.5mmまで冷間圧延した。次い
で、更に温度400°〜600℃で５時間の時効処理を行った
後、冷間圧延、歪取焼鈍を順に行って厚さ0.035mmの箔
とした。EXAMPLES The present invention will be described in more detail below with reference to examples and comparative examples. Example First, electrolytic copper (Cu) or oxygen-free copper (Cu) as the main raw material,
And copper chromium master alloy, copper zirconium master alloy, zinc, titanium, mild steel, nickel, tin, indium, manganese,
Magnesium, silicon, copper-phosphorus master alloy, aluminum, cobalt, boron, and silver are used as auxiliary materials, and copper alloys having various component compositions shown in Table 1 are melted in a high-frequency melting furnace in a vacuum or Ar atmosphere. It was cast into an ingot with a thickness of 30 mm. Next, each of the obtained ingots is heated to a temperature of 800 ° to 950.
After hot rolling to a thickness of 8 mm at ℃, surface cutting to remove scale on the surface, solution heat treatment at a temperature of 800 ° to 900 ° C for 10 minutes, then cold rolling to a thickness of 0.5 mm did. Then, after further aging treatment at a temperature of 400 ° to 600 ° C. for 5 hours, cold rolling and strain relief annealing were sequentially performed to obtain a foil having a thickness of 0.035 mm.
【００１６】[0016]
【表１】 [Table 1]
【００１７】このようにして得られた各銅合金箔につき
諸特性の評価を行った。その結果を表2に示す。表中、
「強度」については引張試験機において引張強さを測定
した。「電気伝導性」については導電率（％IACS）によ
って示した。「めっき耐熱剥離性」については、各銅合
金箔上にSnめっきを施し、その後150℃にて500時間加熱
した後に、サンプルを曲げ半径＝0の条件にて片側90度
曲げを往復１回行い、曲げ部を観察することにより剥離
の有無を確認することによって評価した。剥離が確認出
来なかったものを○、剥離が確認されたものをXと判定
した。なお、Snめっきは、Sn：30g/l、硫酸：30g/l、ノ
ニオン系界面活性剤：2g/lを含有する浴中で、電流密度
２A/dm２で行った。「表面欠陥」については、サンプル
（長さ10ｍ、幅60ｍｍ）を目視観察することで表面欠陥
中、10μｍ以上の粗大なCr、Zr粒子が確認される欠陥の
数を測定することによって評価した。この結果欠陥数が
5個未満だったものを○、5個以上だったものを×と判定
した。Various properties of each of the copper alloy foils thus obtained were evaluated. The results are shown in Table 2. In the table,
Regarding "strength", the tensile strength was measured with a tensile tester. “Electrical conductivity” is indicated by conductivity (% IACS). Regarding "heat resistant peeling resistance of plating", after Sn plating was applied on each copper alloy foil and after heating at 150 ° C for 500 hours, the sample was bent 90 degrees on one side once under a condition of bending radius = 0. The evaluation was performed by observing the bent portion and confirming the presence or absence of peeling. The case where peeling could not be confirmed was judged as ◯, and the case where peeling was confirmed was judged as X. In addition, Sn plating was performed at a current density of 2 A / dm 2 in a bath containing Sn: 30 g / l, sulfuric acid: 30 g / l, and nonionic surfactant: 2 g / l. “Surface defects” were evaluated by visually observing a sample (length 10 m, width 60 mm) and measuring the number of defects in which coarse Cr and Zr particles of 10 μm or more were confirmed in the surface defects. As a result, the number of defects
Those with less than 5 were evaluated as ○, and those with 5 or more were evaluated as ×.
【００１８】[0018]
【表２】 [Table 2]
【００１９】比較例
実施例に記載する通りの手順に従って表3に示す各種成
分組成の銅合金を真空中またはAr雰囲気中で溶製し、厚
さ30mmのインゴットに鋳造した。 Comparative Example Copper alloys having various component compositions shown in Table 3 were melted in a vacuum or in an Ar atmosphere and cast into an ingot having a thickness of 30 mm according to the procedure as described in the examples.
【００２０】[0020]
【表３】 [Table 3]
【００２１】このようにして得られた各銅合金箔につき
諸特性の評価を実施例に記載する通りの手順に従って行
った。その結果を表4に示す。The properties of each of the copper alloy foils thus obtained were evaluated according to the procedures described in the examples. The results are shown in Table 4.
【００２２】[0022]
【表４】 [Table 4]
【００２３】上記から明らかな通りに、本実施例では、
強度、電気伝導性、耐熱剥離性及び表面欠陥のすべてに
おいて良好な銅合金箔が得られた。これに対し、比較例
19、25は、それぞれZr、Cr成分が本発明の範囲よりも少
ないために強度が劣ることを示す例である。比較例19、
20、21、25、26、27は、Zn成分が本発明の範囲よりも少
ないか又はZn成分を含有していないために耐熱剥離性が
劣ることを示す例である。比較例20、22、26は、Zr又は
Cr成分が本発明の範囲よりも多いために、表面欠陥が多
く見られることを示す例である。比較例23、24、27、2
8、29は、それぞれFe＋Si＋P、Al、Sn、Fe＋Ni＋P、Si
成分が本発明の範囲を超えているために、導電性が劣る
ことを示す例である．As is apparent from the above, in this embodiment,
A good copper alloy foil was obtained in terms of strength, electrical conductivity, heat release resistance and surface defects. On the other hand, a comparative example
Nos. 19 and 25 are examples showing that the strength is inferior because the Zr and Cr components are less than the range of the present invention, respectively. Comparative Example 19,
20, 21, 25, 26, and 27 are examples showing that the Zn component is less than the range of the present invention or does not contain the Zn component, and thus the heat-resistant peeling property is inferior. Comparative Examples 20, 22, and 26 are Zr or
This is an example showing that many surface defects are observed because the Cr content is larger than the range of the present invention. Comparative Examples 23, 24, 27, 2
8 and 29 are Fe + Si + P, Al, Sn, Fe + Ni + P, Si respectively
This is an example showing that the conductivity is inferior because the component exceeds the range of the present invention.
【００２４】[0024]
【発明の効果】以上説明した通りに、本発明の銅合金箔
は、銅の高い電気伝導性を持ちながら高い強度を有し、
なお且つSnめっき等の表面処理に対しても良好な耐熱剥
離性を有する。本発明の銅合金箔は、プリント配線基板
用、半導体パッケージ基板、電池電極板分野の用途にお
いて信頼性の高い銅合金箔材料として用いるのに好適で
ある。As described above, the copper alloy foil of the present invention has high strength while having high electric conductivity of copper,
Further, it has good heat-resistant peeling property even for surface treatment such as Sn plating. The copper alloy foil of the present invention is suitable for use as a highly reliable copper alloy foil material for applications in the fields of printed wiring boards, semiconductor package substrates, and battery electrode plates.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｃ２２Ｃ 9/06 Ｃ２２Ｃ 9/06 9/10 9/10 Ｈ０１Ｌ 21/60 ３１１ Ｈ０１Ｌ 21/60 ３１１Ｗ // Ｈ０１Ｌ 23/12 23/12 Ｌ ─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 7 Identification code FI theme code (reference) C22C 9/06 C22C 9/06 9/10 9/10 H01L 21/60 311 H01L 21/60 311W // H01L 23/12 23/12 L
Claims (4)
01％〜0.3％を含有し、残部が銅及び不可避不純物であ
るめっき耐熱剥離性に優れた銅合金箔。1. Zr 0.01% to 0.25% and Zn0.
Copper alloy foil containing 01% to 0.3% with the balance being copper and unavoidable impurities and having excellent heat-resistant peeling resistance.
01％〜0.3％を含有し、更にTi、Ni、Fe、Sn、Si、Mn、
P、Mg、Co、Al、B、In及びAgの内の一種以上を総量で0.
005％〜1.0％含有し、残部が銅及び不可避不純物である
めっき耐熱剥離性に優れた銅合金箔。2. Zr 0.01% to 0.25% and Zn0.
01% to 0.3%, and Ti, Ni, Fe, Sn, Si, Mn,
The total amount of one or more of P, Mg, Co, Al, B, In and Ag is 0.
Copper alloy foil containing 005% to 1.0% with the balance being copper and unavoidable impurities and having excellent heat-resistant peeling resistance.
1％〜0.3％を含有し、残部が銅及び不可避不純物である
めっき耐熱剥離性に優れた銅合金箔。3. By weight, Cr0.02% to 0.4% and Zn0.0
A copper alloy foil containing 1% to 0.3% with the balance being copper and unavoidable impurities and having excellent heat resistance peeling resistance.
1％〜0.3％を含有し、更にTi、Ni、Fe、Sn、Si、Mn、
P、Mg、Co、Al、B、In及びAgの内の一種以上を総量で0.
005％〜1.0％含有し、残部が銅及び不可避不純物である
めっき耐熱剥離性に優れた銅合金箔。4. Cr 0.02% to 0.4% and Zn 0.0 by weight.
It contains 1% -0.3%, Ti, Ni, Fe, Sn, Si, Mn,
The total amount of one or more of P, Mg, Co, Al, B, In and Ag is 0.
Copper alloy foil containing 005% to 1.0% with the balance being copper and unavoidable impurities and having excellent heat-resistant peeling resistance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001282875A JP2003089832A (en) | 2001-09-18 | 2001-09-18 | Copper alloy foil having excellent thermal peeling resistance of plating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001282875A JP2003089832A (en) | 2001-09-18 | 2001-09-18 | Copper alloy foil having excellent thermal peeling resistance of plating |
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| Publication Number | Publication Date |
|---|---|
| JP2003089832A true JP2003089832A (en) | 2003-03-28 |
Family
ID=19106461
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001282875A Pending JP2003089832A (en) | 2001-09-18 | 2001-09-18 | Copper alloy foil having excellent thermal peeling resistance of plating |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007004645A1 (en) * | 2005-07-05 | 2007-01-11 | The Furukawa Electric Co., Ltd. | Copper alloy for electronic equipment and process for producing the same |
| WO2008041777A1 (en) * | 2006-10-04 | 2008-04-10 | Sumitomo Light Metal Industries, Ltd. | Copper alloy for seamless pipes |
| WO2011105686A2 (en) | 2010-02-24 | 2011-09-01 | 주식회사 풍산 | High-strength and highly conductive copper alloy, and method for manufacturing same |
| JP2013028856A (en) * | 2011-07-29 | 2013-02-07 | Hitachi Cable Ltd | Rolled copper foil, manufacturing method for the same, and lithium ion secondary battery negative electrode using the same |
| JP2013241663A (en) * | 2012-05-22 | 2013-12-05 | Furukawa Electric Co Ltd:The | Rolled copper foil for collector of secondary battery and method for producing the same |
| JP2014060092A (en) * | 2012-09-19 | 2014-04-03 | Sh Copper Products Corp | Method for manufacturing negative electrode collector copper foil, negative electrode collector copper foil, negative electrode for lithium ion secondary battery, and lithium ion secondary battery |
| CN110157942A (en) * | 2018-01-25 | 2019-08-23 | 安徽华晶微电子材料科技有限公司 | A kind of formula of circuit board use high-thermal conductive metal material |
| US10392680B2 (en) * | 2013-08-12 | 2019-08-27 | Mitsubishi Materials Corporation | Copper alloy for electric and electronic devices, copper alloy sheet for electric and electronic devices, component for electric and electronic devices, terminal, and bus bar |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US7946022B2 (en) | 2005-07-05 | 2011-05-24 | The Furukawa Electric Co., Ltd. | Copper alloy for electronic machinery and tools and method of producing the same |
| TWI408241B (en) * | 2005-07-05 | 2013-09-11 | Furukawa Electric Co Ltd | Copper alloy for electronic machinery and tools and method of producing the same |
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| JP2013028856A (en) * | 2011-07-29 | 2013-02-07 | Hitachi Cable Ltd | Rolled copper foil, manufacturing method for the same, and lithium ion secondary battery negative electrode using the same |
| JP2013241663A (en) * | 2012-05-22 | 2013-12-05 | Furukawa Electric Co Ltd:The | Rolled copper foil for collector of secondary battery and method for producing the same |
| JP2014060092A (en) * | 2012-09-19 | 2014-04-03 | Sh Copper Products Corp | Method for manufacturing negative electrode collector copper foil, negative electrode collector copper foil, negative electrode for lithium ion secondary battery, and lithium ion secondary battery |
| US10392680B2 (en) * | 2013-08-12 | 2019-08-27 | Mitsubishi Materials Corporation | Copper alloy for electric and electronic devices, copper alloy sheet for electric and electronic devices, component for electric and electronic devices, terminal, and bus bar |
| CN110157942A (en) * | 2018-01-25 | 2019-08-23 | 安徽华晶微电子材料科技有限公司 | A kind of formula of circuit board use high-thermal conductive metal material |
| KR20190100986A (en) * | 2018-02-21 | 2019-08-30 | 삼성디스플레이 주식회사 | Display device |
| US11515497B2 (en) | 2018-02-21 | 2022-11-29 | Samsung Display Co., Ltd. | Display device |
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