JP2003072087A - Recording element unit and its producing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance productivity in sealant coating process. SOLUTION: The recording element unit comprises a bonded laminate of an electrical wiring tape H1300 being connected electrically with a recording element board (not shown) provided with a plurality of recording elements ejecting recording liquid, a second plate H1400, i.e., a supporting plate for holding the electrical wiring tape H1300 fixedly, and a first plate H1200, i.e., a supporting member for holding the recording element board fixedly. A resist layer H1305 is provided on the surface of the electrical wiring tape H1300 being bonded to the second plate H1400. On a set of first and second intersecting sides of the recording element unit, three faces are defined by the resist layer H1305, the first plate H1200 and the second plate H1400 by locating the outer edge of the resist layer H1305 on the inside of the outer edges of both plates H1200 and H1400 and channels 1-3 opening to the atmosphere on one side and having a substantially rectangular cross-section are provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a recording element unit that constitutes a liquid jet recording head that ejects recording liquid as droplets from a fine ejection port to perform recording on a recording medium, and a manufacturing method thereof.

[0002]

2. Description of the Related Art FIGS. 10 and 11 show a bubble jet (registered trademark) method in which recording is performed using an electrothermal converter that generates thermal energy for causing film boiling in ink in response to an electric signal. 10 is a view showing a side-shooter type recording head, FIG. 10 is an exploded perspective view showing the ink supply unit and the recording element unit in a disassembled state, and FIG. 11 is a state in which the ink supply unit and the recording element unit are assembled. It is an exploded perspective view shown by.

The recording head H1001 comprises a recording element unit H1002, an ink supply unit H1003, and a tank holder H2000. Figure 10
As shown in FIG. 11, the printing element unit H1002 includes a first printing element substrate H1100 and a second printing element substrate H110.
1, first plate H1200, electrical wiring tape H13
00, an electric contact substrate H2200, and a second plate H1400, and the ink supply unit H1003 is composed of an ink supply member H1500, a flow path forming member H1600, a joint rubber H2300, a filter H1700, and a seal rubber H1800. Has been done.

Next, the recording element unit H1002 will be described in more detail.

Each of the recording element substrates H1100 and H1101 has a well-known structure as a substrate used in a side shooter type bubble jet recording head, and is a Si substrate (not shown) having a thickness of 0.5 to 1 mm. , An ink supply port (not shown) consisting of a long groove-shaped through hole as an ink flow path
And heaters (not shown), which are ejection means arranged in a zigzag, one row on each side of the ink supply port, and electrode portions (not shown) connected to the heaters by electric wiring and arranged on both outer sides of the substrate. Shown). Bumps (not shown) such as Au are formed on the electrode portions.

The first plate H1200 is made of, for example, an alumina (Al ₂ O ₃ ) material having a thickness of 0.5 to 10 mm. The first plate H1200 has an ink supply port H1201a for supplying black ink to the first recording element substrate H1100, and cyan, magenta, and yellow ink for supplying second ink to the second recording element substrate H1101. An ink supply port H1201b is formed, the ink supply port (not shown) of the first recording element substrate H1100 corresponds to the ink supply port H1201a of the first plate H1200, and the second recording element substrate H1101.
The ink supply port (not shown) of the first plate H1200
Corresponds to the ink supply port H1201b. First recording element substrate H1100 and second recording element substrate H11
01 is bonded and fixed to the first plate H1200 with high positional accuracy.

The electric wiring tape H1300 applies an electric signal for ejecting ink to the first recording element substrate H1100 and the second recording element substrate H1101. The electric wiring tape H1300 includes a plurality of openings for incorporating the respective recording element substrates H1100 and H1101, electrode terminals H1302 corresponding to the electrode portions of the respective recording element substrates, and a main body located at the end of the wiring tape. It has an electrode terminal portion H1303 for electrical connection with an electrical contact substrate H2200 having an external signal input terminal H1301 (see FIG. 11) for receiving an electrical signal from the device. The electrode terminal H1302 and the electrode terminal portion 1303 are connected by a continuous copper foil wiring pattern H1304 (see FIG. 12).

The electric wiring tape H1300, the first recording element substrate 1100 and the second recording element substrate H1101 are
Each is electrically connected. For example, the electrode portions (not shown) of the recording element substrates H1100 and H1101 and the electrode terminals H1302 of the electric wiring tape H1300 are electrically joined by the thermosonic bonding method.

The second plate H1400 has a thickness of 0.5.
It is composed of a plate-shaped member of 1 mm to 1 mm, and is made of ceramic such as alumina (Al ₂ O ₃ ). Then, the first printing element substrate H1100 and the second printing element substrate H1 which are adhesively fixed to the first plate H1200.
It has two openings larger than the respective outer dimensions of 101. This second plate H1400 is
Printing element substrate H1100 and second printing element substrate H
1101 and the electric wiring tape H1300 are adhered to the first plate H1200 so that they can be electrically connected in a plane. One side of the second plate H1400 projects more than the first plate H1200, and the projecting portion roughly positions the recording element unit H1002 and the ink supply unit H1003.

FIG. 12 is a view showing a sectional structure of the electric wiring tape shown in FIG.

The electric wiring tape H1300 has a thickness of 50.
A wiring pattern H13 made of copper foil having a thickness of 35 μm on the base film 1300a made of polyimide of μm
04 is attached via an adhesive layer H1304a having a thickness of 20 μm,
Further, the wiring pattern H1304 is formed by sealing with a solder resist H1305 having a thickness of 20 μm.
It is a so-called TAB (Tape Auto Bonding) film. The wiring pattern H1304 is the base film H.
It is electrically connected to the electrode terminal H1302 provided on the 1300a.

The electric wiring tape H1300 has a second plate H140 on the back surface (on the side of the solder resist H1305).
The second plate H1400 adhered and fixed to the surface of 0 through an adhesive layer made of an epoxy resin and further to which the electric wiring tape H1300 is adhered is the first plate H12.
00 is adhered and fixed to the surface of 00 through an adhesive layer made of an epoxy resin.

The solder resist H1302 is patterned on the edge of the base film H1300a or inside the base film H1300a, and the electric wiring tape H1300 and the second plate H14 are formed.
After bonding with 00, a part of the surface of the second plate H1400 and the base film H1300a are partially exposed, for example, several tens of μm at the end of the electric wiring tape H1300.
Clearance is formed.

The electric connection portions between the first recording element substrate H1100 and the second recording element substrate H1101 and the electric wiring tape H1300 are the first sealant H1307 and the second sealant H1308 (see FIG. 11 for both). ) Sealed by
Protects electrical connections from ink corrosion and external shock. The first sealant H1307 mainly seals the back side of the connecting portion between the electrode terminal H1302 of the electric wiring tape and the electrode portion (not shown) of the recording element substrate and the outer peripheral portion of the recording element substrate. The sealing agent H1308 seals the front side of this connection portion.

FIG. 13 is a perspective plan view showing a joined body of the first plate, the second plate, and the electric wiring tape shown in FIG. 12 and the like, and FIG. 14 shows each cross-sectional portion shown in FIG. FIG.

The electric wiring tape H1300 is larger in size than the second plate H1400, and is a corner portion (D portion in FIG. 13) where the first side and the second side of the recording element unit intersect.
In the periphery, the electric wiring tape H1300 covers the second plate H1400 when viewed from the face side of the recording head (electric wiring tape H1300 side) as shown in FIG. As a result, as shown in FIG. 14, an AA cross section including the first side facing the first plate H1200, and a B including the corner portion (D portion) of the electric wiring tape H1300.
At the locations of the −B cross section and the B′−B ′ cross section, and the CC cross section that includes the second side orthogonal to the first side, the electric wiring tape H1300 is the first as shown in FIG.
And, it overhangs in an eaves-like shape with respect to the second plates H1200 and H1400. In particular, the solder resist H1305 protrudes from the end of the second plate H1400 at three cross-sections except the C-C cross-section.

Thus, the reliability of the recording head is improved by setting the base film H1300a (see FIG. 12) of the electric wiring tape H1300 made of polyimide having excellent ink resistance on the face side of the recording head. In addition, the smooth base film surface can be used to form a good face cap surface.
The face cap surface is defined by a suction cap (not shown) that forcibly sucks the liquid from the liquid discharge port of the recording head to recover the discharge state as necessary and prevents the liquid from drying during the period of non-use. The surface to be covered.

In the above structure, the electric wiring tape H130 is used.
The end surface of the solder resist H1305 is exposed between 0 and the second plate H1400, but the solder resist H1305 and the adhesive of the copper foil wiring are corroded by the components in the ink and the electrical wiring tape H1300 is destroyed. To prevent this, the electrical wiring tape H1300 and the second plate H
A third sealant H1309 (see FIG. 13) is filled in a gap d (see FIG. 14B) of several tens of μm with respect to 1400, and the solder resist H1305, the adhesive, and the like are exposed to the outside. Is prevented. As the third sealant H1309 that fills such a narrow gap, a sealant having a property of increasing fluidity when stirred and returning to an original state when left still (so-called thixotropic property) is preferably used. To be In this conventional example, the same material is used for the first sealant H1307 and the third sealant H1309.

[0019]

DISCLOSURE OF THE INVENTION Electric wiring tape H13
For sealing the side surface portion of 00, a liquid sealing agent is supplied to the side surface portion, and the electric wiring tape H1300 and the second plate H are
This is done by injecting the sealant into the gap with 1400 by a capillary phenomenon to fill the gap, and then curing the sealant.

FIG. 15 shows a first conventional recording element unit.
It is a figure which shows a mode that the side surface part in the side of is sealed.

The side surface of the recording element unit on the first side can be easily sealed by scanning a sealant coating needle along the first side as shown in FIG. The applied sealant forms a meniscus inside the eaves and flows in. On the other hand, in the second side, since the second side projects from the first plate H1200, the sealant cannot be supplied from the electric wiring tape H1300 side as in the case of the first side. Although some sealant applied to the first side may flow to the second side, the flow of the sealant from the first side to the second side 2 is unstable. The sealant supplied to the first side may not sufficiently cover the end of the solder resist H1305 on the second side, which may deteriorate the reliability of the recording element unit.

Therefore, generally, each sealant coating step is required for the first side and the second side, but in this case, the productivity is low. It is preferable that the two sides can be simultaneously sealed by one step of applying the sealant to the first side or the second side, but no specific means for this has been proposed so far.

Therefore, an object of the present invention is to provide a recording element unit capable of improving the productivity in the step of applying a sealant and a method for manufacturing the recording element unit.

[0024]

In order to achieve the above object, a recording element unit of the present invention comprises a recording element substrate having a plurality of recording elements for ejecting a recording liquid, and an opening portion in which the recording element substrate is incorporated. And an electric wiring tape electrically connected to the recording element substrate to apply electric energy for ejecting the recording liquid to the recording element substrate, and the recording element substrate is held and fixed. A supporting member, and an opening through which the recording element substrate is formed, and a supporting plate for holding and fixing the electric wiring tape interposed between the electric wiring tape and the supporting member,
A resist layer covering the wiring provided on the electric wiring tape is provided on one surface of the electric wiring tape, and the surface of the electric wiring tape provided with the resist layer is bonded to the support plate. In this recording element unit, the outer edge of the resist layer is provided inside the outer edges of the support member and the support plate on a pair of the first side and the second side that intersect each other of the recording element unit. The resist layer, the supporting member, and the supporting plate are defined by three surfaces, and one surface is provided with a sealant channel having a substantially rectangular cross-sectional shape open to the atmosphere. Is characterized by.

According to the recording element unit of the present invention, when the sealant is applied to the channel provided on the first side, the sealant flows due to the capillary force generated in the channel. Then, it flows from the flow path of the first side to the flow path of the second side. Therefore, it is possible to seal not only the resist layer and the electrical wiring on the first side but also the resist layer and the like on the second side by one step of applying the sealant to the first side. The productivity in the sealant coating step can be improved. Also, from the flow path on the first side to the second
Since the sealant stably flows into the flow path on the side of, the resist layer and the electric wiring can be reliably sealed, and the reliability of the recording element unit can be improved.

Further, when the flow channel width of the flow channel provided on the first side is W1 and the flow channel width of the flow channel provided on the second side is W3, W1> W3 It is preferable that the structure has the relationship of According to this, since the cross-sectional area of the flow path on the second side is smaller than the cross-sectional area of the flow path on the first side, the capillary force generated in the flow path on the second side is the first side. Is larger than the capillary force generated in the flow path at. Therefore, it becomes possible to more smoothly supply the sealant applied to the flow path on the first side to the flow path on the second side.

The resist layer may have a chamfered shape at the corner where the first side and the second side intersect. In the case where the sealant has a thixotropic property, the fluidity is deteriorated when the flow path is suddenly expanded or bent. Therefore, the first side and the second
By forming a chamfered shape in the resist layer at the corner where the side of the first side and the side of the second side flow, the flow path of the first side and the flow path of the second side can be connected relatively smoothly, and Even if it has a thixotropy property, the flow path from the first side to the second
It becomes possible to smoothly flow the sealant into the flow path on the side of.

In addition, at the corner where the first side and the second side intersect, the support plate and / or the electric wiring tape may also have a chamfered shape.

Further, the flow channel width of the flow channel provided on the first side is W1, the flow channel width at the corner is W2, and the flow channel provided on the second side is W2. When the flow path width of the path is W3, the relationship of W1> W3 is satisfied, and further, the relationship of W1 ≧ W2 or W2 ≧ W3 is satisfied. It is possible to smooth the flow of the sealant through the flow path toward the flow path on the second side.

Further, the outer edge of the first side may be provided inside the outer edge of the supporting member.

The method of manufacturing a recording element unit of the present invention is the method of manufacturing a recording element unit of the present invention, wherein a sealant is applied onto the supporting member so as to contact the first side. Thus, the method further comprises the step of supplying the sealant from the flow channel provided on the first side to the flow channel provided on the second side intersecting with the first side. And

According to the manufacturing method of the present invention, not only the resist layer and the like on the first side but also the resist layer and the like on the second side can be obtained by one step of applying the sealant to the first side. Both can be sealed, and the productivity in the sealant applying step can be improved.

Further, the sealant may have a thixotropic property.

[0034]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the drawings.

(First Embodiment) FIGS. 1 to 3 are views showing a first embodiment of a recording element unit according to the present invention, and FIG. 1 shows a first embodiment of the recording element unit according to the present invention. 1 is a perspective plan view, FIG. 2 is a view showing a state where the end portion of the recording element unit shown in FIG. 1 is filled with a sealant, and FIG.
FIG. 3 is a cross-sectional view showing each cross-sectional portion of the recording element unit shown in FIG.

The recording element unit of this embodiment is also shown in FIG.
Similar to the related art shown in the above, an electric wiring tape H1300 electrically connected to a recording element substrate (not shown) having a plurality of recording elements for ejecting a recording liquid, and a support for holding and fixing the electric wiring tape H1300. A second plate H1400 as a plate and a first plate H1200 as a supporting member for holding and fixing a printing element substrate (not shown) are laminated and joined. The thickness of these members is similar to that of the conventional technique shown in FIG. The second plate H1400 as a support plate is an electric wiring tape H.
The electric wiring tape H1300 is held and fixed by being interposed between 1300 and the first plate H1200. The end of the solder resist H1305 on the electric wiring tape H1300 is close to the (outermost) wiring pattern H1304 provided closest to the end of the electric wiring tape H1300 so as to cover the wiring pattern H1304.

In this embodiment, the electric wiring tape H
When the 1300 and the second plate H1400 are overlapped and bonded to each other, the clearance d between the electric wiring tape H1300 and the second plate H1400 (see FIG. 3A).
(See etc.), three flow paths 1, 2, 3 having a height corresponding to the above are formed. Each of the flow paths has a resist H13.
The outer edge of 05 is provided inside the outer edges of the first plate H1200 and the second plate H1400, and the electrical wiring tape H1300, the second plate H1400, and the solder resist H1305 are combined.
It has a substantially rectangular cross section that defines a surface and is open to the atmosphere in one surface direction. These flow paths 1, 2 and 3 form a smooth continuous set of flow paths of substantially the same height without a portion where the cross-sectional area suddenly expands or a portion where the flow passage suddenly bends.
The widths W1, W2 and W3 of the respective flow passages are the flow passage cross-sectional area from the upstream side to the downstream side in order to further stabilize the flow of the sealant from the first side to the second side of the recording element unit. Are formed such that W1>W2> W3. The relationship between the widths W1, W2 and W3 of the flow paths is
Not only the relationship of W1>W2> W3, but at least W1> W
It is only necessary to have the relationship of 3 and further have the relationship of W1 ≧ W2 or W2 ≧ W3.

The flow passage width is defined in a portion of the respective flow passages 1, 2 and 3 where the capillary force for propelling the flow of the sealant is relatively large. For example, the flow path width W1 on the first side of the present embodiment is a portion having the smallest clearance height in the clearance between the flow path width wiring tape H1300 and the second plate H1400, that is, the exposed solder resist H1.
It is the width between the end of 305 and the end of the second plate H1400 (see FIG. 3A).

2 and 3 show the flow and filling state of the sealant at the end of the recording element unit shown in FIG. 1, and are taken along the line AA, the line BB and the line C in FIG.
The -C cross section shows the filling state of the sealant in the cross sections of the flow paths 1, 2, and 3, respectively. The height of each flow path is determined by the layer structure of the electric wiring tape H1300 and the second plate H14.
00 and the thickness of the epoxy adhesive layer between 0 and 00. In this embodiment, the height of each flow path is about 75 μm. The widths W1, W2, W3 of the respective flow paths are 1.5 mm, 1.
It is 0 mm and 0.6 mm.

Next, the step of applying the sealant to the end face of the recording element unit will be described.

First, in order to improve the fluidity of the applied sealant, the recording element unit is heated to about 80 ° C., and the third sealant (in the vicinity of the first side on the first plate H1200). NR-200C (trade name: Nippon Lec Co., Ltd.) H13
Apply 09. The applied sealant H1309 is the first
Flow into the channel 1 and further flow into the second channel 2 by the capillary force of the meniscus 91 formed at the tip of the sealant H1309. The first channel 1 and the second channel 2 have the same channel height, but the second channel 2 has a channel width narrower than that of the first channel 1, so The cross-sectional area of the flow channel 2 is smaller than the cross-sectional area of the first flow channel 1. Therefore, the second flow path 2
In this case, a stronger capillary force acts than in the first flow channel 1, and thus the sealing agent H1309 smoothly flows into the second flow channel 2 from the first flow channel 1 by the capillary force. Second flow path 2 to third
With respect to the flow to the channel 3, the sealant H1309 smoothly flows by the same mechanism. The encapsulant H1309 that has reached the third flow path 3 through the second flow path 2 forms the meniscus 93 and further advances, and the end portion of the solder resist H1305 that is the sealed portion on the second side. Completely covered.

In the second flow path 2 connecting the first flow path 1 and the third flow path 3, the corner portions of the solder resist H1305 are linearly chamfered at an angle of 45 ° as shown in FIG. It has a shape (C chamfered shape). Therefore, the sealant H1
The flow 309 smoothly flows from the first flow path 1 to the second flow path 2 and further from the second flow path 2 to the third flow path 3 without sudden bending of the flow. If the first flow path 1 and the third flow path 3 are directly connected and the flow path is bent at 90 °, the supply of the sealant H1309 to the third flow path 3 is not performed. Experiments have confirmed that it is less stable than the embodiment. In particular, in the case of a sealant having a thixotropic property, it is preferable to avoid sudden bending of the flow path of the sealant.

In this embodiment, the solder resist H130 is used.
The corners of 5 are formed in a C-chamfered shape, the second flow channel 2 has an inclination of 45 ° with respect to the first flow channel 1, and the third flow channel 3 has the second flow channel. It has an inclination of 45 ° with respect to the path 2, but unlike this, the solder resist H13
The corner of 05 may be formed into an R chamfered shape made of a circular curve, and the second flow path 2 may be gradually and smoothly bent between the first flow path 1 and the third flow path 3.

As described above, according to the recording element unit of this embodiment, the sealant H13 is applied to the first side.
By applying 09, the sealing agent H1309 flows into the sealed portion of the second side by the capillary force, and the sealed portion of the second side is also sealed with the sealing agent H1309. You can

When the sealant has a thixotropic property,
Although a phenomenon in which the flow is obstructed when the flow path is suddenly bent is observed, in the present embodiment, since the second plate H1400 and the solder resist H1305 each have a C chamfered shape at the corner D, Compared to the shape in which the first flow path 1 and the third flow path 3 are directly connected, the bending of the flow path is gentler, and the first flow path 1 and the second flow path 2 are passed through the third flow path 2. The flow of the sealant to the channel 3 is smooth.

<Comparative Example> FIGS. 4 and 5 are views showing a comparative example of the recording element unit according to the present embodiment, and the structure thereof is the same as that of the conventional recording element unit shown in FIGS. 13 and 14.

In this comparative example, as in the case of FIG. 2, the sealant H1309 applied in the vicinity of the first side and filled in the first channel 1 is the capillary in the first channel 1. A meniscus 71 is formed by the force and flows into the second flow path 2, and a part of the meniscus 71 reaches the third flow path 3. In the third flow path 3,
As shown in FIG. 5D, a meniscus of the sealant H1309 is applied to a corner H1310 formed by the lower surface of the solder resist H1305 protruding from the edge of the second plate H1400 and the side end surface of the second plate H1400. Is formed.

When the sealant H1309 flows from the flow channel 1 having a rectangular cross section to the flow channel 3 of the corner portion H1310, the cross-sectional area of the meniscus is increased, and the same effect as the cross-sectional area of the flow channel is widened. The thixotropic sealant that flows due to the capillary force has an unstable flow in the direction in which the cross-sectional area of the flow channel expands, so that the thixotropic sealant from the first flow channel 1 to the third flow channel 3 is sealed. The flow of the stopper becomes unstable. In addition, due to the so-called bottleneck phenomenon due to the first flow path 1 which is the supply source of the sealant being narrower than the third flow path 3 which is the supply target portion,
The inflow of the sealant from the first flow path 1 to the third flow path 3 is restricted.

At the corner D, the solder resist H13
Since 05 protrudes beyond the edge of the second plate H1400, in some experimental examples, the first flow passages 1 to 3
It was observed that the flow of the sealant H1309 flowing to the channel 3 was blocked, the meniscus 72 was formed, and the flow of the sealant H1309 was stopped.

On the other hand, in other experimental examples, the sealing agent H13 was used.
In some cases, the flow of 09 reaches the third flow path 3. However, even in this case, the sealing agent H1309 reaching the third flow path 3
Flows into the corners of the first plate H1200 and the second plate H1400 as seen in the CC cross section of FIG. 5D, so that the solder resist H1305 on the second side is stably sealed. I won't stop. Therefore, in this comparative example, the solder resist H13 is formed on the second side.
There was a case where the unsealed part of 05 was generated. Therefore, in order to reliably seal the unsealed portion in this comparative example, the front and back surfaces of the recording element unit are inverted by 180 °, and the sealing agent is placed on the unsealed portion of the solder resist H1305 on the second side. It requires an additional step of direct application.

As described above, according to the recording element unit of the present embodiment shown in FIG. 1 and the like, the sealed portion of the second side is simultaneously formed by one step of applying the sealant in the vicinity of the first side. Therefore, both the reliability and the productivity of the recording element unit can be improved as compared with the comparative example shown in FIG. 4 and the like.

The outermost wiring of the electric wiring tape H1300 in the recording element unit shown in FIG. 1 may be a dummy wiring which is not used for discharging liquid. When the solder resist H1305 has a thickness equal to or more than the sum of the thickness of the wiring H1304 and the thickness of the adhesive layer (not shown), it is possible to form one surface of the flow path only with the layer of the solder resist H1305. is there.

(Second Embodiment) FIG. 6 is a diagram showing a second embodiment of a recording element unit according to the present invention.

In the present embodiment, unlike the first embodiment shown in FIG. 1 etc., the solder resist H1305 and the second plate H1 at the corner D of the recording element unit are used.
No chamfer is formed in 400, and the second flow path in the first embodiment does not exist. That is, the present embodiment has a configuration in which the first flow path 1 and the third flow path 3 in the first embodiment are directly connected.

In this embodiment, since the flow paths 1 and 3 of the sealant H1309 are sharply bent at 90 °, the flow of the sealant H1309 from the flow path 1 to the flow path 3 is different from that in the first embodiment. Stability is reduced. However, since the solder resist H1305 is still provided inside the edge of the second plate H1400, the solder resist H1305
Regarding the point of sealing the end face of 1305, it is clear that it still has an advantage over the conventional technique shown in FIG.

(Third Embodiment) FIG. 7 is a view showing a third embodiment of the recording element unit according to the present invention.

In this embodiment, the wiring pattern H1304 on the first side and the solder resist H1305 covering the wiring pattern H1304 have a bent shape, and at a position away from the corner D, the corner is close to the corner D. The edge of the solder resist H1305 is provided closer to the edge of the electric wiring tape H1300 than the portion, and the first flow path 1
A portion having a width W1 and a portion having a width W4 are formed. Thereby, the convex portion H1320 is formed in the first flow path 1.

The flow passage in the width W4 portion is narrower than that in the width W1 portion. The second flow passage 2 is narrower than the width W1 portion of the first flow passage 1, and the third flow passage 3 is narrower than the second flow passage.

By the sealant application procedure described with reference to FIG. 15, the sealant H1309 is applied to each portion of the widths W1 and W4 of the first flow channel 1 from the outside of the flow channel 1 (right side in FIG. 7). When the sealant H1309 is supplied, the sealing agent H1309 flows to the second channel 2 by the meniscus 111 formed in the width W1 portion of the channel 1 and further to the third channel 3. At this time, the convex portion H1320 formed in the first channel 1
Acts as a supply source of the sealant H1309 to the flow paths 2 and 3.

On the other hand, in the first flow passage 1, the width W4 of the portion extending to the side opposite to the second flow passage 2 is smaller than the width W1 of the portion connected to the second flow passage 2. Therefore, the sealing agent H1309 is restricted from flowing out in the direction away from the flow path 2.
As a result, the sealant H1309 is sufficiently supplied to the flow paths 2 and 3 via the flow path 1.

(Fourth Embodiment) FIG. 8 is a diagram showing a fourth embodiment of a recording element unit according to the present invention.

In this embodiment, the solder resist H13 is used.
No. 05 and the second plate H1400, the chamfers are also provided at the corners of the electric wiring tape H1300, and the electric wiring tape H130 is further provided.
0 has a convex portion H1 on the side of the first side adjacent to the chamfered portion.
321 is formed. The convex portion H1321 is composed only of the base film of the electric wiring tape H1300.

As a result, a sealant pool is formed between the base film of the electric wiring tape H1300 and the first plate H1200 by a capillary force, and the sealant pool is filled with the sealant for the channels 2 and 3. It can be used as a source of H1309.

In the recording element unit of FIG. 8, the first
The distance W1 between the end of the solder resist H1305 and the end of the second plate H1400 in the flow path 1 is such that the end of the solder resist H1305 and the electric wiring tape H13.
Although it is configured to be larger than the distance W4 from the end portion of 00, the distances W1 and W4 may be equal to each other.

(Fifth Embodiment) FIG. 9 is a diagram showing a fifth embodiment of a recording element unit according to the present invention.

The present embodiment has a structure in which the end of the second plate H1400 extends outside the end of the electrical wiring tape H1300 on the second side. Therefore, the third flow path 3 in which the sealant H1309 is held by the capillary force is configured by the side end surface of the solder resist H1305 and the lower surface of the electric wiring tape H1300.

In this embodiment, the widths W1, W2, W of the respective flow paths are
3 has a relationship of W2>W1> W3. However, the channel 2 having the width W2 functions as a sealant reservoir supplied to the third channel 3 similarly to the convex portion H1320 in FIG. 7, and the third flow in which the sealant H1309 flows. Road 3
The first flow path 1 having a wider width than that is connected. Therefore, as in the first embodiment, the sealant H1309 applied near the first side flows from the first flow path 1 through the second flow path 2 into the third flow path 3, Solder resist H130
The end of 5 can be reliably sealed.

[0068]

As described above, according to the present invention, the outer edge of the resist layer is located inside the outer edges of the supporting member and the supporting plate on the pair of first and second sides of the recording element unit which intersect with each other. Since three surfaces are defined by the resist layer, the supporting member, and the supporting plate, and one surface is provided with a sealant flow path having a substantially rectangular cross section open to the atmosphere, It is possible to seal not only the resist layer and the electrical wiring on the first side but also the resist layer and the like on the second side by one step of applying the sealant to the first side. It is possible to improve the productivity in the step of applying the stopping agent. Also, from the flow path on the first side to the second
Since the sealant stably flows into the flow path on the side of, the resist layer and the electric wiring can be reliably sealed, and the reliability of the recording element unit can be improved.

[Brief description of drawings]

FIG. 1 is a perspective plan view of a first embodiment of a recording element unit according to the present invention.

FIG. 2 is a diagram showing a state where an end portion of the recording element unit shown in FIG. 1 is filled with a sealant.

FIG. 3 is a cross-sectional view showing each cross-sectional portion of the recording element unit shown in FIG.

FIG. 4 is a diagram showing a comparative example of the recording element unit according to the first embodiment.

FIG. 5 is a diagram showing a comparative example of the recording element unit according to the first embodiment.

FIG. 6 is a diagram showing a second embodiment of a recording element unit according to the present invention.

FIG. 7 is a diagram showing a third embodiment of a recording element unit according to the present invention.

FIG. 8 is a diagram showing a fourth embodiment of a recording element unit according to the present invention.

FIG. 9 is a diagram showing a fifth embodiment of a recording element unit according to the present invention.

FIG. 10 is an exploded perspective view showing a conventional recording head with an ink supply unit and a recording element unit disassembled.

FIG. 11 is an exploded perspective view showing a conventional recording head in a state where an ink supply unit and a recording element unit are assembled.

12 is a diagram showing a sectional structure of the electric wiring tape or the like shown in FIG.

FIG. 13 is a perspective plan view showing a bonded body of the first plate, the second plate, and the electric wiring tape shown in FIG. 12 and the like.

FIG. 14 is a cross-sectional view showing each cross-sectional portion shown in FIG.

FIG. 15 is a diagram showing a state in which the side surface portion on the first side of the conventional recording element unit is sealed.

[Explanation of symbols]

1st flow path 2 Second channel 3 third channel 91,92,93,111 Meniscus H1200 first plate H1300 electric wiring tape H1304 wiring pattern H1305 Solder resist H1309 Sealant H1310 corner H1320 convex part H1321 convex shape part H1400 Second plate

Claims (8)

[Claims] 1. A recording element substrate having a plurality of recording elements for ejecting a recording liquid, and an opening into which the recording element substrate is incorporated are formed, and the recording liquid is ejected onto the recording element substrate. An electrical wiring tape electrically connected to the recording element substrate for applying electrical energy;
A supporting member for holding and fixing the recording element substrate and an opening for passing the recording element substrate are formed, and a supporting plate for holding and fixing the electric wiring tape interposed between the electric wiring tape and the supporting member. And a resist layer covering the wiring provided on the electric wiring tape is provided on one surface of the electric wiring tape, and the surface of the electric wiring tape on which the resist layer is provided is In a recording element unit joined to the support plate, an outer edge of the resist layer is provided on a pair of first and second sides of the recording element unit that intersect with each other. A sealant channel having a substantially rectangular cross-sectional shape in which three surfaces are defined by the resist layer, the support member, and the support plate, and one surface is open to the atmosphere. Recording element unit, characterized in that are provided. 2. When the flow channel width of the flow channel provided on the first side is W1 and the flow channel width of the flow channel provided on the second side is W3, W1> W3 Have a relationship of
The recording element unit according to claim 1. 3. The resist layer has a chamfered shape at a corner where the first side and the second side intersect.
The recording element unit according to claim 1. 4. The recording according to claim 3, wherein at the corner where the first side and the second side intersect, the support plate and / or the electric wiring tape also has a chamfered shape. Element unit. 5. The flow path width of the flow path provided on the first side is W1, and the width of the flow path at the corner is W2.
And the channel width of the channel provided on the second side is W
3 has a relationship of W1> W3, and further, W1
The recording element unit according to claim 3, having a relationship of ≧ W2 or W2 ≧ W3. 6. The recording element unit according to claim 1, wherein an outer edge of the first side is provided inside an outer edge of the support member. 7. The method of manufacturing a recording element unit according to claim 6, wherein a sealant is applied onto the support member so as to contact the first side, and thereby the first side is applied. A method of manufacturing a recording element unit, comprising the step of supplying the sealant from the provided flow path to the flow path provided on the second side that intersects with the first side. 8. The method of manufacturing a recording element unit according to claim 7, wherein the sealant has a thixotropic property.