JP2003067697A - Module loaded with ic chip and method for adjusting resonance frequency of the module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a module with an IC chip loaded thereon with high operation reliability capable of being manufactured at a cost lower than that of a conventional article, and a method for adjusting a resonance frequency of the module with the IC chip loaded thereon. SOLUTION: The module with the IC chip loaded thereon is provided with the IC chip 1 and a coil-like antenna circuit 2 and a bypass circuit 3 serially connected to the IC chip. The bypass circuit is formed of a successive conductor and is provided with a first connection end 4a connected to the side of the IC chip, a second connection end 4b connected to the side of the coil-like antenna circuit and an intermediate part 4c extended between the first and second connection ends.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC chip mounted module, which is also called a data carrier,
A non-contact type IC chip mounted module for exchanging data in a non-contact type, a combination type IC chip mounted module for exchanging data in both a non-contact type and a contact type, and a resonance frequency adjusting method for the IC chip mounted module. Is.

A module equipped with an IC chip is generally I
It is well known as a C card, but it is not always in the form of a card, but is in the form of a sheet that can be attached to an object, a tag enclosed in a container, or a wristwatch-type data carrier. Also means. Therefore, in the following description, the IC chip mounted module includes not only the IC card but also these data carriers having a form other than the form of the IC card.

Further, the core of the non-contact type IC card,
The inlet provided with the IC chip and the coiled antenna on the circuit board is not suitable for use by the end user as it is, and is unlikely to be a final product. However, since it may be distributed among manufacturers, the inlet is the IC of the present invention.
Included in chip-mounted module.

[0004]

2. Description of the Related Art In recent years, IC cards have become widespread as new information recording media used for personal security management, physical distribution management, ticket gate processing of transportation facilities and the like. I
The C card is roughly classified into two types, a contact type IC card and a non-contact type IC card.

The contact type IC card has a terminal for data exchange on the card surface, and data is exchanged with an external reader through this terminal. The non-contact type IC card is designed to exchange data with an external reader / writer using radio waves. For example, if a train ticket is converted into a non-contact type IC card, the ticket can be used when passing through a ticket gate. Data can be exchanged in a wallet or bag without taking it out, so that it is expected that the convenience will be greatly improved, and it is attracting attention as a recording medium to replace conventional magnetic cards.

Further, in the field of physical distribution, instead of physical distribution management using bar codes or magnetic recording, physical distribution management using RFID tags for exchanging data with goods by radio waves is becoming mainstream.

FIG. 12 shows a circuit of a conventional non-contact type IC card. As shown in FIG. 12, the non-contact type I
The C card includes an IC chip 30, a coiled antenna circuit 31 connected in series to the IC chip 30, and an external capacitor 32 connected in parallel to the coiled antenna circuit 31.
Composed of and. Then, in order to resonate the circuit of the non-contact IC card with the radio wave of a predetermined frequency transmitted from the reader / writer, the tuning operation by the external capacitor 32 is performed.

This tuning work is executed as follows. Generally, the resonance frequency f of the non-contact IC card is defined by f = (1 / 2π) × (C · L) ^−1/2 (1). Where C is the external capacitor 32
, L represents the inductance of the coil antenna circuit 31.

As can be seen from the equation (1), the resonance frequency f of the IC card can be adjusted by the inductance L of the coil antenna circuit 31 and the capacitance C of the external capacitor 32. Therefore, the tuning work for setting the resonance frequency of the circuit of the IC card to a predetermined value is performed by changing the number of turns of the coil antenna circuit 31 and the capacitance of the external capacitor 32.

However, according to such a conventional circuit configuration, the cost of parts is increased by mounting the resonance frequency adjusting capacitor in the circuit, and the number of work processes and quality control items are increased, thereby increasing the cost of the product. The problem is that the cost becomes high.

[0011]

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to manufacture an IC chip mounted module which can be manufactured at a lower cost than conventional ones and which has high operation reliability, and its IC.
An object of the present invention is to provide a method for adjusting the resonance frequency of a chip-mounted module.

[0012]

In order to solve the above-mentioned problems, according to the present invention, an IC chip, a coiled antenna circuit and a detour circuit connected in series to the IC chip, and the detour circuit is provided. A first connection end formed of a continuous conductor and connected to the IC chip side, a second connection end connected to the coil antenna circuit side, and the first and second connections An IC characterized in that it has an intermediate portion extending between the ends.
A chip-mounted module is provided.

According to a preferred embodiment of the present invention, the bypass circuit has a geometric shape such that electromagnetic interaction generated between the continuous conductors forming the bypass circuit is increased. According to another preferred embodiment of the present invention, the intermediate portion of the bypass circuit has at least one turning point, and the portions on both sides of the turning point are arranged so as to extend substantially in parallel. .

According to still another preferred embodiment of the present invention, the middle portion of the bypass circuit is twisted at least once on both sides of the folding point extending substantially in parallel. According to yet another preferred embodiment of the present invention, the middle part of the bypass circuit as a whole comprises the first
And extends spirally from the second connection end. According to yet another preferred embodiment of the present invention, the coiled antenna circuit and the bypass circuit are arranged such that electromagnetic interaction between them is large. According to yet another preferred embodiment of the present invention, the middle part of the bypass circuit has at least one bypass conductor path formed from another continuous conductor connected thereto.

In order to solve the above problems, according to the present invention, the bypass conduction is performed so that the circuit portions on the first and second connection end sides including the bypass conduction path in the bypass circuit are closed circuits. A path is provided, and the circuit portion on the side opposite to the first and second connection ends is demarcated by the first and second demarcation circuits in the detour circuit.
The resonance frequency adjusting method for an IC chip mounted module according to claim 7, wherein the resonance frequency is adjusted by disconnecting from the circuit portion on the connection end side.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a circuit diagram of an IC chip mounted module according to an embodiment of the present invention. In the embodiment of FIG. 1, the IC chip mounting module according to the present invention has the form of a non-contact type IC card.

As shown in FIG. 1, the IC chip mounting module of the present invention comprises an IC chip 1, a coiled antenna circuit 2 and a bypass circuit 3 connected in series to the IC chip 1. The detour circuit 3 is formed of a continuous conductor and has a first connection end 4a connected to the IC chip 1 side, a second connection end 4b connected to the coiled antenna circuit 2 side, and a first connection end 4b. And the second connection ends 4a, 4
and an intermediate portion 4c extending between b.

In this case, it is preferable that the detour circuit 3 has a geometric shape such that electromagnetic interaction generated between the continuous conductors forming the detour circuit 3 becomes large. It is considered that this is because the detour circuit 3 is formed of a conductor, and therefore a stray capacitor exists around the conductor, and thus functions as a capacitor. Then, if the adjacent conductors in the bypass circuit 3 are arranged more densely, the electromagnetic interaction becomes larger, so that it is presumed that the capacitance of the floating capacitor around the conductor is increased. In this way, since the capacitance of the bypass circuit 3 is increased, the frequency can be adjusted with a conductor having a short length without increasing the size of the bypass circuit 3 more than necessary, which is more convenient.

FIG. 2 is a diagram showing a modification of the bypass circuit shown in FIG. In the modification of FIG. 2, the detour circuit 5 is formed of a continuous conductor and has a first connection end 6a connected to the IC chip 1 side and a second connection end 6a connected to the coiled antenna circuit 2 side. It has a connection end 6b and an intermediate portion 6c extending between the first and second connection ends 6a, 6b. The intermediate portion 6c has at least one folding point 7a in this example, and the portions 7b and 7c on both sides of the folding point 7a are arranged so as to extend substantially in parallel.

FIG. 3 is a diagram showing a modification of the bypass circuit shown in FIG. In the modification of FIG. 3, the bypass circuit 8 is formed of a continuous conductor, and has a first connection end 9a connected to the IC chip 1 side and a second connection end 9a connected to the coiled antenna circuit 2 side. It has a connecting end 9b and an intermediate portion 9c extending between the first and second connecting ends 9a, 9b. The intermediate portion 9c is the intermediate portion 6 shown in FIG.
The portions 7b and 7c on both sides sandwiching the turning point 7a extending substantially in parallel in c are at least once, and in this example, 3
It consists of twisted pieces. Thus, by twisting the conductors arranged substantially in parallel, the electromagnetic interaction around the conductors becomes larger, the stray capacitance of the bypass circuit can be made larger, and the bypass circuit 3 is made larger than necessary. It is more convenient because the resonance frequency can be adjusted with a short length of the conductor.

FIG. 4 is a diagram showing another modification of the bypass circuit shown in FIG. In the modification of FIG. 4, the detour circuit 8 is formed of a continuous conductor and has a first connection end 9a connected to the IC chip 1 side and a coiled antenna circuit 2.
It has a second connecting end 9b connected to the side and an intermediate part 9c extending between the first and second connecting ends 9a, 9b. The intermediate portion 9c is the intermediate portion 6 shown in FIG.
The portions 7b and 7c on both sides sandwiching the folding point 7a extending substantially in parallel with each other in c are the first and second connecting ends 6.
It is composed of a spirally extending portion from a and 6b. Thus, by arranging the conductors arranged substantially in parallel in a spiral shape, further stray capacitor capacitance is generated around the conductors arranged substantially in parallel, and the capacitor capacitance in the bypass circuit can be increased. Further, the resonance frequency can be adjusted with a conductor having a shorter length, which is more convenient.

More preferably, by arranging the coiled antenna circuit 2 and the detour circuits 3, 5, 8 and 10 so that the electromagnetic interaction between them becomes large, the coiled antenna circuit and the detour circuit and its surroundings are arranged. The floating capacitor capacity can be increased.

According to the present invention, as shown in FIG. 5, at least one bypass conductive path 12 formed of another continuous conductor is provided in the middle portion of the bypass circuit 10 and the bypass circuit 10 is provided. The resonance frequency can be adjusted by making the circuit portion on the first and second connection ends 11a and 11b side including the bypass conductive path 12 a closed circuit. In this case, if the bypass circuit 10 is cut without providing the bypass conductive path 12 in the bypass circuit 10, the electrical continuity of the circuit of the IC chip mounted module is cut off, which makes communication impossible. By providing the bypass conductive path 12 in the detour circuit 10 as described above, the length of the detour circuit can be adjusted to a desired length while maintaining the electrical continuity of the entire circuit, so that the communication is possible. The resonance frequency can be easily adjusted with.

Next, the non-contact type IC according to the present invention described above.
A method of molding the card will be described. FIG. 6 is a sectional view of an example of the non-contact type IC card of the present invention, and FIG. 7 is a sectional view of another example of the non-contact type IC card of the present invention. 6 and 7, the non-contact type IC card of the present invention includes an inlet 13 in which an IC chip, a coil antenna circuit, and a bypass circuit are arranged on a circuit board.

When arranging the coiled antenna circuit and the bypass circuit on the circuit board when forming the inlet 13, not only the coiled antenna circuit and the bypass circuit are provided on the same side of the board, but also the surface on which the coiled antenna circuit is formed. It is also possible to form a detour circuit on the surface on the opposite side via a through hole. In this case, by arranging the conductors of the coiled antenna circuit and the conductors of the bypass circuit so as to overlap with each other, the electromagnetic action is further increased, which is convenient.

As the material for forming the circuit board, for example, polyolefin resin such as polyethylene, polypropylene, polybutene, polystyrene, polymethylpentene, ethylene / propylene copolymer, ethylene / butylene copolymer, propylene / butene copolymer, etc. Polymer, polyvinylidene fluoride, polytetrafluoroethylene, and other fluororesin polymers, polyurethane, phenolic polyether, cellulose acetate, acrylonitrile polymer, amide resin, polyester resin, glass epoxy resin, polycarbonate, acrylonitrile butadiene styrene , Polyethylene naphthalate, polyphenyl sulfide, paper and the like can be used alone or in a mixture. Moreover, you may use what mixed the inorganic substance with the above-mentioned substance.

As a method for providing a circuit for electrically connecting to an IC chip, a coil antenna circuit and a bypass circuit on a circuit board, for example, a winding method, an etching method, a paste screen printing method or the like is used. You can In this case, the coiled antenna and the detour circuit may be provided by different methods. For example, it is possible to use a method in which the coiled antenna is formed by an etching method and the detour circuit is formed by a winding method.

In the example of FIG. 6, the adhesive layer 15 is formed on both front and back surfaces of the inlet 13 obtained as described above.
A non-contact type IC card is obtained by sticking the insulating base materials 14a and 14b through a and 15b and punching them into a card mold. Further, in the example of FIG. 7, only on the surface of the inlet 13 where the IC chip is provided,
After the insulating base material 14c is attached via the adhesive layer 15c, the non-contact I
You can get a C card.

The adhesive layers 15a, 15b and 15c are, for example, generally used adhesives for dry lamination such as polyester, ABS, acrylic and polyurethane, hot melt resins, thermosetting resins, moisture absorption hardening resins, And a line curable resin or the like can be used. As the insulating base materials 14a, 14b, 14c, for example, polyethylene terephthalate resin, acrylonitrile butadiene styrene resin, polybutylene resin, polyvinyl chloride resin, polycarbonate resin, paper, synthetic paper or the like can be used.

In the following, the construction of the present invention will be described in more detail with reference to some actual manufacturing examples of the non-contact type IC card of the present invention. Manufacturing Example 1 As shown in FIG. 8, IC chip mounting portions 20a and 20b were formed on a 188 μm thick substrate (PET, Lumirror: manufactured by Toray) 19 by using an 18 μm copper foil by an etching method. One end of an enamel wire having a diameter of 120 μm was connected to the IC chip mounting portion 20a by soldering. The coiled antenna 17 having three turns was formed by an enamel wire. Next, a detour circuit 18 having a turn point of 3 turns with an enamel wire was formed so as to overlap the coiled antenna 17. Then, the other end of the enamel wire was connected to the IC chip mounting portion 20b by soldering. An anisotropic conductive film (flip tack: film thickness 30 μ, thermosetting resin containing gold-plated resin particles, manufactured by Hitachi Chemical Co., Ltd.) is temporarily attached to the IC chip mounting portion, and the IC chip (MifareLight: SLE44R31, thickness 1
80 μ, manufactured by Siemens) 16 was mounted to prepare an inlet. Further, as shown in FIG. 6, hot-melt adhesive layers 15a and 15b having a thickness of 100 μ and insulating substrates (PET, Lumirror: Toray made by Toray) having a thickness of 100 μ are provided on both front and back surfaces of the obtained inlet. ) 14a and 14b are respectively provided, and after lamination, punching is performed into a card mold to obtain a non-contact type IC card having a resonance frequency of 13.5 MHz.

Manufacturing Example 2 As shown in FIG. 9, IC chip mounting portions 22a, 22b are formed on a substrate (PET, Lumirror: made by Toray) 21 having a thickness of 188 μ by etching using a copper foil of 18 μ. 3-turn coiled antenna circuit 23 and through hole 24
A and 24b were formed on the surface of the substrate 21. As shown in FIG. 10, the coiled antenna circuit 23 on the substrate 21
A resonance frequency of 13.5 MHz is obtained by the same process as that of the first embodiment except that a detour circuit 25 having a turn point of 3 turns is formed through the through holes 24a and 24b on the opposite side. A contact type IC card was produced.

Manufacturing Example 3 In the inlet obtained in Manufacturing Example 1, as shown in FIG. 11, a bypass conductive path 26 is provided by solder in the bypass circuit 18, and the bypass conductive path 26 in the bypass circuit 18 is provided.
And a circuit portion 18a on the side of the first and second connection ends including a closed circuit, and a circuit portion on the side opposite to the first and second connection ends with the bypass conductive path 26 in the bypass circuit 18 as a boundary. After cutting 18b from the circuit portion 18a on the side of the first and second connection ends (see the cutting portion 27 of FIG. 11), the same process as in the case of Production Example 1 is used to obtain a resonance frequency of 15.6 MHz. A non-contact type IC card 3 was produced.

Thus, according to the IC chip mounting module of the present invention, the bypass circuit formed of the continuous conductor is connected in series with the IC chip together with the coil antenna circuit, and the bypass conductive path is provided in the middle of the bypass circuit. Since the resonance frequency of the circuit of the IC chip mounted module is adjusted by the above, the resonance frequency can be easily adjusted, and the IC chip mounted module having high operation reliability can be provided at low cost.

[0034]

As described above, according to the present invention, the resonance frequency of the circuit of the IC chip mounted module can be adjusted without using an external capacitor for adjusting the resonance frequency, and the number of mounted parts can be minimized. Therefore, the manufacturing cost of the IC chip mounted module can be reduced.

[Brief description of drawings]

FIG. 1 is a circuit diagram of a non-contact type IC card according to an embodiment of the present invention.

FIG. 2 is a diagram showing a modification of the bypass circuit shown in FIG.

FIG. 3 is a diagram showing a modified example of the detour circuit of FIG.

FIG. 4 is a diagram showing a modification of the bypass circuit shown in FIG.

5 is a diagram illustrating a method of adjusting the resonance frequency of the IC card shown in FIG.

FIG. 6 is a sectional view of an example of a non-contact type IC card of the present invention.

FIG. 7 is a cross-sectional view of another example of the non-contact type IC card of the present invention.

FIG. 8 is a diagram illustrating an example of a method for manufacturing a non-contact type IC card of the present invention.

FIG. 9 is a diagram illustrating another example of the method for manufacturing the non-contact type IC card of the present invention.

FIG. 10 is a diagram illustrating another example of the method for manufacturing the non-contact type IC card of the present invention.

FIG. 11 is a diagram illustrating a method of adjusting the resonance frequency of the circuit of the non-contact type IC card of the present invention.

FIG. 12 is a circuit diagram of a conventional non-contact type IC card.

[Explanation of symbols]

1 IC chip 2 coil antenna circuit 3 Detour circuit 4a First connection end 4b Second connection end 4c middle part

Claims (8)

[Claims] 1. An IC chip, and a coiled antenna circuit and a bypass circuit connected in series to the IC chip, wherein the bypass circuit is formed of a continuous conductor and is connected to the IC chip side. A first connection end, a second connection end connected to the coiled antenna circuit side, and an intermediate portion extending between the first and second connection ends. Characteristic IC chip mounted module. 2. The detour circuit according to claim 1, wherein the detour circuit has a geometric shape such that electromagnetic interaction generated between the continuous conductors forming the detour circuit is large. IC chip mounted module. 3. The intermediate portion of the detour circuit has at least one turnaround point, and the portions on both sides sandwiching the turnaround point are arranged so as to extend substantially in parallel. The IC chip mounting module according to claim 1 or claim 2. 4. The IC chip mounted module according to claim 3, wherein the intermediate portion of the bypass circuit is twisted at least once on both sides sandwiching the folding point extending substantially in parallel. . 5. The IC chip mounting module according to claim 3, wherein the intermediate portion of the bypass circuit extends spirally from the first and second connection ends as a whole. . 6. The coil-shaped antenna circuit and the detour circuit are arranged such that electromagnetic interaction between them is increased, according to any one of claims 2 to 5. IC chip mounted module. 7. The at least one intermediate portion of the bypass circuit is formed of another continuous conductor connected thereto.
7. The IC chip mounted module according to claim 1, further comprising a bypass conductive path of a book. 8. The bypass conductive path is provided so that the circuit portion on the first and second connection end sides including the bypass conductive path in the bypass circuit is a closed circuit, and the bypass conductive path in the bypass circuit is provided. The first above the border
8. The IC chip mounting according to claim 7, wherein the resonance frequency is adjusted by cutting the circuit portion on the side opposite to the second and second connection ends from the circuit portion on the side of the first and second connection ends. Module resonance frequency adjustment method.