[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

JP2002313850A - Tape carrier package and its manufacturing method - Google Patents

Tape carrier package and its manufacturing method

Info

Publication number
JP2002313850A
JP2002313850A JP2001114397A JP2001114397A JP2002313850A JP 2002313850 A JP2002313850 A JP 2002313850A JP 2001114397 A JP2001114397 A JP 2001114397A JP 2001114397 A JP2001114397 A JP 2001114397A JP 2002313850 A JP2002313850 A JP 2002313850A
Authority
JP
Japan
Prior art keywords
terminal
wiring
inspection
terminal portion
discharge electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001114397A
Other languages
Japanese (ja)
Other versions
JP3670979B2 (en
Inventor
Yoshio Nakamura
芳夫 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Original Assignee
Tokyo Sanyo Electric Co Ltd
Tottori Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Sanyo Electric Co Ltd, Tottori Sanyo Electric Co Ltd, Sanyo Electric Co Ltd filed Critical Tokyo Sanyo Electric Co Ltd
Priority to JP2001114397A priority Critical patent/JP3670979B2/en
Publication of JP2002313850A publication Critical patent/JP2002313850A/en
Application granted granted Critical
Publication of JP3670979B2 publication Critical patent/JP3670979B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Liquid Crystal (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Wire Bonding (AREA)

Abstract

PROBLEM TO BE SOLVED: To propose a tape carrier package(TCP) by which anti-electrostatic measures during manufacturing can be sufficiently taken and continuity test can be performed. SOLUTION: The TCP is provided with input terminals 3 which are placed on a base film 2 carrying a driving LSI 8 and along the direction of the length of the driving LSI 8, output terminals 4 which are placed on the opposite side of the input terminals 3 across the driving LSI 8 and have a smaller width than that of the input terminals 3, first wiring 5 for connecting between the input terminals 3 and the driving LSI 8, second wiring 6 for connecting the output terminals 4 and the driving LSI 8, third wiring 7 for directly connecting between the input terminals 3 and the output terminal 4, discharge electrodes 10 and 11 which are formed on the periphery of the base film 2 and short- circuiting sections 13 for electrically connecting the third wiring 7 to the discharge electrodes 10 and 11.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は例えば液晶表示装置
等に使用される駆動用LSI等の半導体素子を搭載した
テープキャリアパッケージに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape carrier package on which a semiconductor element such as a driving LSI used for a liquid crystal display device is mounted.

【0002】[0002]

【従来の技術】一般に液晶表示装置は小型・薄型化が可
能であるため、携帯端末からテレビに至るまで幅広く用
いられている。これらの液晶表示装置には狭額縁化が要
求され、液晶パネルは柔軟性を有するTCP(tape car
rier package)によって駆動回路と接続している。従来
のTCP50を図10に基づいて説明する。図10は製
造途中のTCP50を示し、図10の点線(切断ライ
ン)に沿って切断して個々に分離される。51は柔軟性
を有するポリイミド系のベースフィルムであり、ベース
フィルム51上に接着剤を介して銅箔を積層し、この銅
箔をパターンニングして端子部53、54や各配線5
5、56、57を形成している。53は制御回路を有す
るPWB(printed wiring board)基板と接続する入力
端子部、54は液晶パネルに接続する出力端子部、55
は駆動用LSI58の入力端子と入力端子部53を接続
する配線、56は駆動用LSI58の出力端子と出力端
子部54を接続する配線、57は駆動用LSI58を介
さずに入力端子部53と出力端子部54を直接接続する
配線である。このTCP50を液晶パネルに接続したと
き、PWB基板からの制御信号やデータ信号は配線55
を介して駆動用LSI58に入力され、駆動用LSI5
8で信号処理した後に配線56を介して液晶パネルに出
力される。また配線57を介してPWB基板から液晶パ
ネルに駆動用LSI8での信号処理を必要としない信号
や電源などが供給される。この従来例ではTCP50の
両側に駆動用LSI8に接続しない配線57をそれぞれ
3本設け、外側から順に配線57a、配線57b、配線
57cとする。
2. Description of the Related Art In general, a liquid crystal display device can be reduced in size and thickness, and thus is widely used from portable terminals to televisions. These liquid crystal display devices are required to have a narrower frame, and the liquid crystal panel is a flexible TCP (tape car).
(Driver package). A conventional TCP 50 will be described with reference to FIG. FIG. 10 shows the TCP 50 in the course of manufacture, which is cut along the dotted line (cutting line) in FIG. 10 and separated individually. Reference numeral 51 denotes a flexible polyimide-based base film. A copper foil is laminated on the base film 51 via an adhesive, and the copper foil is patterned to form the terminal portions 53 and 54 and each wiring 5.
5, 56 and 57 are formed. 53 is an input terminal connected to a PWB (printed wiring board) substrate having a control circuit, 54 is an output terminal connected to a liquid crystal panel, 55
Is a wiring connecting the input terminal of the driving LSI 58 to the input terminal 53, 56 is a wiring connecting the output terminal of the driving LSI 58 to the output terminal 54, and 57 is an output from the input terminal 53 without the intervention of the driving LSI 58. This is a wiring for directly connecting the terminal portion 54. When this TCP 50 is connected to a liquid crystal panel, control signals and data signals from the PWB substrate are
Is input to the driving LSI 58 through the
After the signal processing in step 8, the signal is output to the liquid crystal panel via the wiring 56. In addition, signals and power supplies that do not require signal processing in the driving LSI 8 are supplied from the PWB substrate to the liquid crystal panel via the wiring 57. In this conventional example, three wires 57 not connected to the driving LSI 8 are provided on both sides of the TCP 50, and the wires 57a, 57b, and 57c are sequentially provided from the outside.

【0003】図11は図10の領域Aの拡大図であり、
配線57に接続する入力端子部53の先端部分の要部拡
大図である。配線55、57に接続する入力端子部53
の先端部分には検査用プローバが当接できる検査端子6
0が設けられ、各検査端子53は一直線上に並んで配置
されている。検査端子60aは入力端子部53aを通じ
て配線57aに、検査端子60bは入力端子部53bを
通じて配線57bに、検査端子60cは入力端子部53
cを通じて配線57cに接続され、検査端子60dは入
力端子部53dを通じてそれぞれ対応する配線55に接
続されている。各入力端子部53及び検査端子60はそ
れぞれ他の端子60、53と電気的に短絡しないように
離れて形成され、各々独立している。
FIG. 11 is an enlarged view of a region A in FIG.
FIG. 6 is an enlarged view of a main part of a tip end portion of an input terminal unit 53 connected to a wiring 57. Input terminal section 53 connected to wirings 55 and 57
Inspection terminals 6 to which the prober for inspection can contact
0 is provided, and the inspection terminals 53 are arranged in a straight line. The inspection terminal 60a is connected to the wiring 57a through the input terminal 53a, the inspection terminal 60b is connected to the wiring 57b through the input terminal 53b, and the inspection terminal 60c is connected to the input terminal 53.
The test terminal 60d is connected to the corresponding wiring 55 through the input terminal portion 53d. The input terminals 53 and the inspection terminals 60 are formed separately from each other so as not to be electrically short-circuited with the other terminals 60 and 53, and are independent from each other.

【0004】図12は図10の領域Bの拡大図であり、
配線57に接続する出力端子部54の先端部分の要部拡
大図である。出力端子部54の先端部分にも検査端子6
1が設けられているが、液晶表示装置に用いるTCP5
0の場合は入力端子部53より出力端子部54の方が多
数になるため、出力端子部側の検査端子61は一直線上
に横並びではなく複数個づつを密集して配置する。配線
57は分岐してそれぞれ2つの出力端子部54に接続
し、配線57aとつながる出力端子部54aは検査端子
61aと、配線57bとつながる出力端子部54bは検
査端子61bと、配線57cとつながる出力端子部54
cは検査端子61cとそれぞれ接続している。また駆動
用LSI8につながる配線56はそれぞれ対応する1つ
の出力端子部54d、検査端子61dと接続する。そし
て配線57a、57bにつながる3個の検査端子61
a、61bは出力端子部54の延長方向に沿って配列さ
れ、配線56につながる検査端子61dも所定の3個を
一組として出力端子部54の延長方向に並んで配置され
ている。そして検査端子61a、61bと検査端子61
dが間隔αで隣接して配置され、出力端子部57bと出
力端子部57dの間に配線57cの検査端子61cが配
置されている。そして各配線55、56、57の導通検
査のときは、全ての検査端子60、61に同時にプロー
バを当てた状態で検査を行い、配線の断線の有無を確認
する。
FIG. 12 is an enlarged view of a region B in FIG.
FIG. 5 is an enlarged view of a main part of a tip end portion of an output terminal portion connected to a wiring. The inspection terminal 6 is also provided at the tip of the output terminal portion 54.
1 is provided, but TCP5 used for the liquid crystal display device is provided.
In the case of 0, the number of the output terminal portions 54 is larger than that of the input terminal portions 53. Therefore, the inspection terminals 61 on the output terminal portion side are not arranged side by side on a straight line, but are arranged in a dense manner. The wiring 57 is branched and connected to the two output terminals 54, respectively. The output terminal 54a connected to the wiring 57a is an inspection terminal 61a, and the output terminal 54b connected to the wiring 57b is an output connected to the inspection terminal 61b and the wiring 57c. Terminal 54
c is connected to each of the inspection terminals 61c. The wiring 56 connected to the driving LSI 8 is connected to the corresponding one of the output terminals 54d and the inspection terminal 61d. Then, three inspection terminals 61 connected to the wirings 57a and 57b
The test terminals 61a and 61b are arranged along the extension direction of the output terminal portion 54, and the inspection terminals 61d connected to the wiring 56 are also arranged side by side in the extension direction of the output terminal portion 54 as a set of three predetermined terminals. Then, the inspection terminals 61a and 61b and the inspection terminal 61
d are arranged adjacently at an interval α, and the inspection terminal 61c of the wiring 57c is arranged between the output terminal portion 57b and the output terminal portion 57d. When conducting the continuity inspection of the wirings 55, 56, and 57, the inspection is performed with the prober applied to all the inspection terminals 60 and 61 at the same time, and it is checked whether the wiring is disconnected.

【0005】52はベースフィルム51の両端に沿って
形成されたスプロケットホール、59はスプロケットホ
ール52を含むベースフィルム51の両端部に形成され
た放電用電極であり、放電用電極59は配線55、5
6、57や端子部53、54と同じ材質で形成されてい
る。ベースフィルム51には静電気が帯電しやすく、T
CP50の製造工程で発生した静電気が配線55、56
を通じて駆動用LSI58に印加され、駆動用LSI5
8がよく破壊されていた。そこでスプロケットホール5
9の周辺に放電用電極59を設けることで製造工程中に
放電用電極59と搬送装置の駆動用スプロケットが接触
し、スプロケットを通じてベースフィルム51に帯電し
た静電気を除去する。このような放電用電極59を設け
る構造は例えば特開平2−25047号公報、特開平3
−79053号公報に記載されている。また静電気対策
として駆動用LSI58と接続する端子部を放電用電極
59と電気的に接続し、駆動用LSI58に過大な電圧
が印加しない構成にしたものがある。これは例えば特開
平5−90333号公報、特開平3−129746号公
報、特開平9−283572号公報に記載されている。
[0005] 52 is a sprocket hole formed along both ends of the base film 51, 59 is a discharge electrode formed at both ends of the base film 51 including the sprocket hole 52, the discharge electrode 59 is a wiring 55, 5
6 and 57 and the terminal portions 53 and 54 are formed of the same material. The base film 51 is easily charged with static electricity.
The static electricity generated in the manufacturing process of the CP 50 is
Is applied to the driving LSI 58 through the
8 was well destroyed. So sprocket hole 5
By providing the discharge electrode 59 around 9, the discharge electrode 59 and the driving sprocket of the transfer device come into contact during the manufacturing process, and the static electricity charged on the base film 51 through the sprocket is removed. The structure in which such a discharge electrode 59 is provided is described in, for example, JP-A-2-25047 and JP-A-3-25047.
-79053. In addition, as a countermeasure against static electricity, there is a configuration in which a terminal connected to the driving LSI 58 is electrically connected to the discharging electrode 59 so that an excessive voltage is not applied to the driving LSI 58. This is described in, for example, JP-A-5-90333, JP-A-3-129746, and JP-A-9-283572.

【0006】[0006]

【発明が解決しようとする課題】しかしながらベールフ
ィルム51の両端に放電用電極59を設けるだけでは静
電気対策が不十分であり、製造工程中に駆動用LSI5
8が破壊されるケースが多く発生していた。また駆動用
LSI58と接続する端子部53、54を放電用電極5
9に接続する場合、その端子部53、54の配線55、
56が放電用電極59を通じて短絡されるためその配線
55、56の導通検査できなかった。またそれらの配線
55、56の導通検査をするために放電用電極59との
接続を開放すると、その後の製造工程における静電気対
策ができなかった。
However, merely providing the discharge electrodes 59 at both ends of the bale film 51 does not provide sufficient countermeasures against static electricity.
8 was destroyed in many cases. Also, the terminal portions 53 and 54 connected to the driving LSI 58 are connected to the discharge electrodes 5.
9, the wiring 55 of the terminal portions 53 and 54,
Since the wiring 56 was short-circuited through the discharge electrode 59, the continuity of the wirings 55 and 56 could not be inspected. In addition, when the connection with the discharge electrode 59 is released in order to inspect the continuity of the wirings 55 and 56, no countermeasure against static electricity can be taken in the subsequent manufacturing process.

【0007】本出願人は静電気により破壊された駆動用
LSI58の状況を詳細に分析したところ、配線57の
検査端子61a、61b、61cと近接した検査端子6
1dの配線56に接続する部分の破壊が多いことが分か
った。これは他の配線55、56よりも面積の大きい配
線57が静電気を拾い易く、出力端子部54の検査端子
61a、61b、61cと検査端子61dが近接してい
るために配線57に流れた静電気が検査端子61を介し
て配線56に流れて駆動用LSI58が破壊されるため
である。複数の配線57の内でも特に最も外側に配置さ
れた配線57aが静電気を拾い易く、駆動用LSI58
の故障のうち、配線57aの検査端子61aと近接した
検査端子61dの配線56に接続する部分の故障が6割
以上を占めていた。
The applicant of the present invention has analyzed the state of the driving LSI 58 destroyed by static electricity in detail, and has found that the inspection terminals 6a, 61b, 61c of the wiring 57 are close to the inspection terminals 61a, 61b, 61c.
It was found that the portion connected to the 1d wiring 56 was frequently destroyed. This is because the wiring 57 having a larger area than the other wirings 55 and 56 easily picks up static electricity, and the inspection terminals 61a, 61b and 61c of the output terminal portion 54 and the inspection terminal 61d are close to each other, so that the static electricity flowing to the wiring 57 is reduced. Is flowing to the wiring 56 via the inspection terminal 61 and the driving LSI 58 is destroyed. Of the plurality of wirings 57, the outermost wiring 57a particularly easily picks up static electricity, and the driving LSI 58
Of the failures described above, 60% or more of the failures occurred at the portion connected to the wiring 56 of the inspection terminal 61d adjacent to the inspection terminal 61a of the wiring 57a.

【0008】そこで本発明は、静電気対策が十分に行
え、導通検査が可能なTCPを提案することを目的とす
る。
Accordingly, an object of the present invention is to propose a TCP capable of sufficiently performing a countermeasure against static electricity and enabling a continuity test.

【0009】[0009]

【課題を解決するための手段】上記課題を解決するため
に本発明は、絶縁性のフィルムと、フィルム上に搭載さ
れたほぼ長方形の半導体素子と、半導体素子の長手方向
に沿って配置された複数の第1端子部と、半導体素子を
挟んで第1端子部の反対側に配置されると共に第1端子
部よりも端子幅の小さい複数の第2端子部と、内側に位
置する第1端子部と半導体素子を電気的に接続する第1
配線と、内側に位置する第2端子部と半導体素子を電気
的に接続する第2配線と、外側に位置する第1端子部と
外側に位置する第2端子部とを半導体素子を介さずに直
接接続する第3配線と、フィルムの周辺部の形成された
導電性の放電用電極と、第3配線と放電用電極を電気的
に接続する短絡部とを備えたことを特徴とする。
SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides an insulating film, a substantially rectangular semiconductor device mounted on the film, and a semiconductor device arranged along the longitudinal direction of the semiconductor device. A plurality of first terminal portions, a plurality of second terminal portions arranged on the opposite side of the first terminal portion across the semiconductor element and having a smaller terminal width than the first terminal portions, and a first terminal located inside First part for electrically connecting the part and the semiconductor element
The wiring, the second wiring electrically connecting the second terminal portion located inside and the semiconductor element, and the first terminal portion located outside and the second terminal portion located outside without the semiconductor element interposed therebetween It is characterized by comprising a third wiring for direct connection, a conductive discharge electrode formed on the periphery of the film, and a short-circuit portion for electrically connecting the third wiring to the discharge electrode.

【0010】よってTCPの製造中にフィルムに帯電し
た静電気が第3配線に流れても放電用電極を通じて除去
できるため、半導体素子に静電気が流れる恐れがなく、
半導体素子の破壊を防ぐことができる。さらに半導体素
子につながる各配線は放電用電極から分離して独立して
いるため、製造中に各配線の導通検査ができる。
Therefore, even if static electricity charged on the film flows through the third wiring during the manufacture of TCP, the static electricity can be removed through the discharge electrode, so that static electricity does not flow into the semiconductor element.
Destruction of the semiconductor element can be prevented. Further, since each wiring connected to the semiconductor element is separated and independent from the discharge electrode, a continuity test of each wiring can be performed during manufacturing.

【0011】また本発明は、第1端子部及び第2端子部
の先端に検査端子を形成し、第3配線に接続する第1端
子部又は第2端子部のどちらか一方の検査端子に放電用
電極と接続する短絡部を設けたことを特徴とする。よっ
て第3配線を放電用電極と短絡した状態で第3配線の導
通検査ができ、さらに導通検査後の静電気対策もでき
る。
Further, according to the present invention, an inspection terminal is formed at the tip of the first terminal portion and the second terminal portion, and discharge is performed to either the first terminal portion or the second terminal portion connected to the third wiring. And a short-circuit portion connected to the application electrode is provided. Therefore, the continuity inspection of the third wiring can be performed in a state where the third wiring is short-circuited with the discharge electrode, and further, a countermeasure against static electricity after the continuity inspection can be performed.

【0012】また本発明は、第2端子部の端子幅よりも
大きな検査端子を第2端子部の先端に形成し、この検査
端子を複数個毎に密集して配置し、第3配線の検査端子
が第2配線の検査端子と隣接して配置されるテープキャ
リアパッケージにおいて、最も外側に位置する第3配線
の検査端子とその検査端子に隣接する第2配線の検査端
子との間隔を他の第3配線の検査端子とその検査端子に
隣接する第2配線の検査端子との間隔よりも広くしたこ
とを特徴とする。
Further, according to the present invention, an inspection terminal larger than the terminal width of the second terminal portion is formed at the tip of the second terminal portion, and the inspection terminals are densely arranged for each of a plurality of inspection terminals to inspect the third wiring. In the tape carrier package in which the terminals are arranged adjacent to the inspection terminal of the second wiring, the distance between the inspection terminal of the third wiring located at the outermost position and the inspection terminal of the second wiring adjacent to the inspection terminal is changed to another. The distance between the inspection terminal of the third wiring and the inspection terminal of the second wiring adjacent to the inspection terminal is wider.

【0013】よって最も静電気を拾い易い第3配線から
第2端子部の検査端子を通じて第2配線に静電気が流れ
ることを防止でき、製造中の半導体素子の破壊を防ぐこ
とができる。
Accordingly, it is possible to prevent static electricity from flowing from the third wiring, which is most liable to pick up static electricity, to the second wiring through the inspection terminal of the second terminal portion, and to prevent destruction of the semiconductor element during manufacture.

【0014】また本発明は、絶縁性のフィルム上に形成
される導電性のパターンとして、複数の第1端子部と、
第1端子部よりも端子幅の小さい複数の第2端子部と、
内側に位置する第1端子部と半導体素子を電気的に接続
する第1配線と、内側に位置する第2端子部と半導体素
子を電気的に接続する第2配線と、外側に位置する第1
端子部と外側に位置する第2端子部とを直接接続する第
3配線と、フィルムの周辺部の形成された導電性の放電
用電極と、第3配線と放電用電極を電気的に接続する短
絡部とを同一工程で形成したことを特徴とする。従って
放電用電極や短絡部の形成を特別に工程を増やすことな
く容易に行え、また放電用電極や短絡部を第3配線や各
端子部と同一の材料で形成でき、第3配線と放電用電極
の導通を確実に取ることができる。
According to the present invention, a plurality of first terminals are provided as a conductive pattern formed on an insulating film.
A plurality of second terminal portions having a terminal width smaller than the first terminal portion;
A first wiring electrically connecting the first terminal portion located inside and the semiconductor element; a second wiring electrically connecting the second terminal portion located inside and the semiconductor element; and a first wiring lying outside.
A third wiring for directly connecting the terminal to the second terminal located outside, a conductive discharge electrode formed on the periphery of the film, and an electrical connection between the third wiring and the discharge electrode; The short-circuit portion and the short-circuit portion are formed in the same step. Accordingly, the discharge electrode and the short-circuit portion can be easily formed without increasing the number of steps, and the discharge electrode and the short-circuit portion can be formed of the same material as the third wiring and each terminal portion. Electrode conduction can be ensured.

【0015】[0015]

【発明の実施の形態】以下、本発明の実施形態を図に基
づいて説明する。図1は第1の実施形態であるTCP1
の上面図である。なお、図1は製造途中の状態を示し、
最終工程で図1中の点線に沿って切断して複数のTCP
1に分離している。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows a TCP 1 according to the first embodiment.
FIG. FIG. 1 shows a state in the course of manufacture,
In the final step, cut along the dotted line in FIG.
1

【0016】2は柔軟性を有するベースフィルムであ
り、ポリイミドやポリエステルなどを幅35mm、厚み
75μmのフィルム状にしたものである。ベースフィル
ム2上に接着剤を塗布してから銅箔をラミネートし、そ
の銅箔をエッチングなどでパターニングして任意の端子
部3、4や配線5、6、7を形成する。なお配線には銅
以外の材質を用いても良く、また銅箔上にアルミニウム
やスズなどをメッキしてもよい。3は外部制御回路を備
えたPWB基板18、19と接続する第1端子部である
入力端子部、4は液晶パネル15上の入力端子21、2
2と異方性導電接着剤等によって電気的に接続する第2
端子部である出力端子部、5は内側に位置する入力端子
部3と駆動用LSI8とを接続する第1配線、6は内側
に位置する出力端子部4と駆動用LSI8を接続する第
2配線、7は駆動用LSI8を介さずに外側の入力端子
部3と外側の出力端子部4を接続する第3配線である。
この実施形態では入力端子部3と出力端子部4を直接接
続する第3配線7をTCP1の両側にそれぞれ3本設
け、それぞれ外側から7a、7b、7cとする。配線
5、6には駆動用LSI8と接続する部分に金バンプが
設けられ、金バンプを介して駆動用LSI8の接続端子
と電気的に接続する。配線5、6、7はソルダレジスト
で被覆され、駆動用LSI8と配線5、6との接続部分
は封止樹脂で覆われる。なお、TCP1を折り曲げ易く
するために、ベースフィルム2の適所に複数の横長のス
リットを形成してもよい。
Reference numeral 2 denotes a flexible base film, which is formed of a film of polyimide, polyester, or the like having a width of 35 mm and a thickness of 75 μm. An adhesive is applied on the base film 2 and then a copper foil is laminated. The copper foil is patterned by etching or the like to form arbitrary terminal portions 3 and 4 and wirings 5, 6 and 7. The wiring may be made of a material other than copper, or may be plated with aluminum or tin on a copper foil. Reference numeral 3 denotes an input terminal which is a first terminal connected to PWB boards 18 and 19 provided with an external control circuit, and 4 denotes input terminals 21 and 2 on the liquid crystal panel 15.
2 electrically connected to the second by an anisotropic conductive adhesive or the like.
An output terminal unit 5 serving as a terminal unit is a first wiring connecting the input terminal unit 3 located inside and the driving LSI 8, and a second wiring 6 connecting the output terminal unit 4 located inside and the driving LSI 8. Reference numerals 7 denote third wirings for connecting the outer input terminal 3 and the outer output terminal 4 without using the driving LSI 8.
In this embodiment, three third wires 7 for directly connecting the input terminal portion 3 and the output terminal portion 4 are provided on both sides of the TCP 1, respectively, and are referred to as 7a, 7b, and 7c from the outside. The wirings 5 and 6 are provided with gold bumps at portions connected to the driving LSI 8, and are electrically connected to connection terminals of the driving LSI 8 via the gold bumps. The wirings 5, 6, 7 are covered with a solder resist, and the connection between the driving LSI 8 and the wirings 5, 6 is covered with a sealing resin. Note that a plurality of horizontally long slits may be formed at appropriate positions on the base film 2 in order to easily bend the TCP 1.

【0017】ベースフィルム2の両側部には複数のスプ
ロケットホール9が設けられ、スプロケットホール9の
周囲を含むベースフィルム1の両側端部に帯状の第1放
電用電極10が形成されている。そして第1放電用電極
10と電気的に接続する第2放電用電極11がTCP1
の入力端子部3と所定間隔をおいて配置されている。放
電用電極10、11は銅箔をエッチングして一連の電極
として形成され、端子部3、4や配線5、6、7と同時
に形成される。そしてTCP1の製造中に搬送装置のス
プロケットが第1放電用電極10と接触し、ベースフィ
ルム2に帯電した静電気が第1放電用電極10、スプロ
ケットを通じて放電される。なお、この第1放電用電極
10はスプロケットに接触できる形状であればスプロケ
ットホール9の周囲の全てに存在しなくてもよく、例え
ばスプロケットホール9と切断ライン(図1の点線)の
間に帯状に形成してもよい。
A plurality of sprocket holes 9 are provided on both sides of the base film 2, and strip-shaped first discharge electrodes 10 are formed on both side ends of the base film 1 including the periphery of the sprocket holes 9. The second discharge electrode 11 electrically connected to the first discharge electrode 10 is a TCP1.
Are arranged at a predetermined distance from the input terminal unit 3. The discharge electrodes 10 and 11 are formed as a series of electrodes by etching a copper foil, and are formed simultaneously with the terminal portions 3 and 4 and the wirings 5, 6 and 7. Then, the sprocket of the transfer device comes into contact with the first discharge electrode 10 during the manufacture of the TCP 1, and the static electricity charged on the base film 2 is discharged through the first discharge electrode 10 and the sprocket. Note that the first discharge electrode 10 need not be present all around the sprocket hole 9 as long as it can come into contact with the sprocket. For example, a belt-like shape is formed between the sprocket hole 9 and the cutting line (dotted line in FIG. 1). May be formed.

【0018】図2は図1の領域Aの拡大図であり、第3
配線7と接続する入力端子部3の先端部分の拡大図であ
る。各入力端子部3の先端部分に入力端子部3よりも若
干幅広な検査端子12が形成され、それぞれ単独で検査
用プローバが当接可能になっている。切断される部分も
含めた入力端子部3の長さはほぼ同一になっているた
め、検査端子12は入力端子部3の延在方向と直交方向
に一列に並んで配置されている。なお、入力端子部3の
端子幅や各端子の間隔には制限があるため、その限られ
た領域内で出来るだけ検査端子12を大きくするために
検査端子部をジグザグに配置しても構わない。この実施
形態の場合、入力端子部3aは第3配線7aに、入力端
子部3bは第3配線7bに、入力端子部3cは第3配線
7cにつながり、入力端子部3dはそれぞれ第1配線5
につながっている。第3配線7につながる入力端子部3
a、3b、3cには第2放電用電極11に連通する短絡
部13が形成され、第1配線5につながる入力端子部3
dはそれぞれ第2放電用電極と離れてそれぞれ独立して
いる。本発明では第3配線7を放電用電極10、11と
電気的に接続することが重要であり、例えば第3配線7
や入力端子部3aと第1放電用電極10の間に短絡部を
形成してもよいが、後述する第3配線7の導通検査に配
慮すれば検査端子12aと放電用電極10、11との間
に短絡部13を形成する方が望ましい。
FIG. 2 is an enlarged view of the area A in FIG.
FIG. 4 is an enlarged view of a tip portion of an input terminal unit 3 connected to a wiring 7. An inspection terminal 12 which is slightly wider than the input terminal portion 3 is formed at a tip portion of each input terminal portion 3, and an inspection prober can abut on each of them independently. Since the lengths of the input terminals 3 including the part to be cut are substantially the same, the inspection terminals 12 are arranged in a line in a direction orthogonal to the direction in which the input terminals 3 extend. Since the terminal width of the input terminal portion 3 and the interval between the terminals are limited, the inspection terminal portions may be arranged in a zigzag manner in order to make the inspection terminal 12 as large as possible within the limited area. . In this embodiment, the input terminal 3a is connected to the third wiring 7a, the input terminal 3b is connected to the third wiring 7b, the input terminal 3c is connected to the third wiring 7c, and the input terminal 3d is connected to the first wiring 5a.
Is connected to Input terminal section 3 connected to third wiring 7
a, 3b, 3c, a short-circuit portion 13 communicating with the second discharge electrode 11 is formed, and the input terminal portion 3 connected to the first wiring 5 is formed.
d is independent from the second discharge electrode. In the present invention, it is important that the third wiring 7 is electrically connected to the discharge electrodes 10 and 11.
Alternatively, a short-circuit portion may be formed between the input terminal portion 3a and the first discharge electrode 10, but if a continuity test of the third wiring 7 described later is considered, the connection between the test terminal 12a and the discharge electrodes 10 and 11 may be made. It is desirable to form a short-circuit portion 13 between them.

【0019】図3は図1の領域Bの拡大図であり、第3
配線7と接続する出力端子部4の先端部分の拡大図であ
る。各出力端子部4の先端には出力端子部4の端子幅よ
りもかなり大きな検査端子14が形成され、それぞれ検
査用プローバが当接可能になっている。一般に液晶表示
装置に用いるTCP1では入力端子部3よりも出力端子
部4の方が多数になり、それだけ端子幅も狭くなる。し
かし検査端子14には検査用プローバがそれぞれ単独で
当接できるだけの大きさが必要となるため、出力端子部
4側の検査端子14は入力端子部3側のように一直線上
に配置されるのではなく、出力端子部4の延長方向に数
個づつ密集して配置される。この実施形態では8個の検
査端子14を一組とし、中央の2個の検査端子14を出
力端子部4の延長方向に並べて配置し、その2個の検査
端子14の外側に位置する6個の検査端子14を中央の
検査端子14の先端側に配置する。この6個の検査端子
14のうち出力端子部4が隣接する3個の検査端子14
を出力端子部4の延長方向に並べて配置する。そして8
個の検査端子14のうち最も外側に位置する検査端子1
4同士が対向して近接し、同様に外側から2番目の検査
端子14同士、外側から3番目の検査端子14同士が対
向して近接する。
FIG. 3 is an enlarged view of the area B in FIG.
FIG. 3 is an enlarged view of a tip portion of an output terminal unit 4 connected to a wiring 7. An inspection terminal 14 which is considerably larger than the terminal width of the output terminal portion 4 is formed at the tip of each output terminal portion 4, and each of the inspection terminals 14 can be brought into contact with an inspection prober. Generally, in the TCP 1 used for the liquid crystal display device, the number of the output terminal portions 4 is larger than that of the input terminal portion 3, and the terminal width is correspondingly narrow. However, since the inspection terminals 14 need to be large enough to allow the inspection probers to individually contact each other, the inspection terminals 14 on the output terminal portion 4 side are arranged in a straight line like the input terminal portion 3 side. Instead, they are densely arranged several by one in the extension direction of the output terminal unit 4. In this embodiment, eight test terminals 14 are set as one set, and two test terminals 14 at the center are arranged side by side in the direction of extension of the output terminal portion 4, and six test terminals 14 located outside the two test terminals 14 are arranged. The inspection terminal 14 is disposed on the tip side of the inspection terminal 14 at the center. Of the six test terminals 14, three test terminals 14 to which the output terminal portion 4 is adjacent
Are arranged side by side in the direction in which the output terminal section 4 extends. And 8
Test terminal 1 located at the outermost position among the test terminals 14
4 are opposed to each other, and similarly, the second inspection terminals 14 from the outside and the third inspection terminals 14 from the outside are opposed to each other and approach each other.

【0020】第1配線5はそれぞれ対応する1つの出力
端子部4に接続されるが、第3配線7はそれぞれ2つに
分岐し、2つの出力端子部4に接続される。そして検査
端子14aは出力端子部4aを介して第3配線7aに、
検査端子14bは出力端子部4bを介して第3配線7b
に、検査端子14cは出力端子部4cを介して第3配線
7cにつながり、検査端子14dはそれぞれ対応する出
力端子4dを介して第2配線6へつながっている。そし
て第3配線7a、7bにつながる検査端子14a、14
bは第2配線6につながる検査端子14dに隣接し、最
も外側に位置する第3配線7aの検査端子14aと検査
端子14dの間隔が第3配線7bの検査端子14bと検
査端子14dの間隔よりも広くなるように設定してい
る。この実施形態では検査端子14bと検査端子14d
の間隔をαとしたとき、検査端子14aと検査端子14
dの間隔を2α以上にすると効果的である。第3配線7
の検査端子14a、14bと第2配線6の検査端子14
dの間隔が狭い場合、第3配線7を流れる静電気が隣接
する検査端子部分を通じて第2配線6に流れてしまう。
そのため駆動用LSI8の破壊に最も関与する第3配線
7aの検査端子14aを駆動用LSI8に接続する第2
配線6の検査端子14dと離すことで効果的に静電気対
策が行える。なお、静電気対策のためには検査端子14
aと検査端子14dはできるだけ離した方がよいが、既
存の導通検査装置では検査用プローバの配置が予め決ま
っているため、検査端子14のレイアウトを大きく変え
てしまうと導通検査時にプローバが検査端子14に当た
らなくなる。従って既存の導通検査装置のプローバが当
たる範囲内で検査端子14の配置を変更する方が良い。
The first wirings 5 are connected to the corresponding one of the output terminals 4, respectively, while the third wirings 7 are each branched into two and connected to the two output terminals 4. The inspection terminal 14a is connected to the third wiring 7a via the output terminal 4a.
The inspection terminal 14b is connected to the third wiring 7b via the output terminal 4b.
Further, the inspection terminal 14c is connected to the third wiring 7c via the output terminal portion 4c, and the inspection terminal 14d is connected to the second wiring 6 via the corresponding output terminal 4d. Then, the inspection terminals 14a, 14 connected to the third wirings 7a, 7b
b is adjacent to the inspection terminal 14d connected to the second wiring 6, and the distance between the inspection terminal 14a and the inspection terminal 14d of the third wiring 7a located on the outermost side is larger than the distance between the inspection terminal 14b and the inspection terminal 14d of the third wiring 7b. Is also set to be wide. In this embodiment, the inspection terminals 14b and 14d
Is the interval between the test terminals 14a and 14a.
It is effective to set the interval of d to 2α or more. Third wiring 7
Inspection terminals 14a, 14b and the inspection terminals 14 of the second wiring 6
If the distance d is small, the static electricity flowing through the third wiring 7 flows to the second wiring 6 through the adjacent inspection terminal portion.
Therefore, the second inspection terminal 14a of the third wiring 7a which is most involved in the destruction of the driving LSI 8 is connected to the driving LSI 8.
By separating the wiring 6 from the inspection terminal 14d, a countermeasure against static electricity can be effectively performed. Note that the inspection terminal 14 is used to prevent static electricity.
a and the inspection terminal 14d should be separated as much as possible. However, since the arrangement of the inspection prober is predetermined in the existing continuity inspection device, if the layout of the inspection terminal 14 is largely changed, the prober may You won't hit 14. Therefore, it is better to change the arrangement of the inspection terminals 14 within a range where the prober of the existing continuity inspection device hits.

【0021】TCP1の導通検査をする場合、全ての検
査端子12、14に検査用プローバを当て検査する。こ
のとき駆動用LSI8に接続した配線5、6の端子部
3、4は放電用電極10、11に接続することなくそれ
ぞれ独立しているため、各配線5、6の導通検査が可能
になる。また第3配線7の導通検査をする場合、例えば
第3配線7aの導通検査するときは入力端子部3aにつ
ながる検査端子12aに接触したプローバと出力端子部
4aにつながる検査端子部14aに接触したプローバと
の間に電流を流し、第3配線7aの断線の有無を確認す
る。第3配線7は入力端子部3側の検査端子12に形成
した短絡部13だけで放電用電極11と接続しているた
め、短絡部13を切断しなくても第3配線7の導通検査
ができる。なお入力端子部3側ではなく出力端子部4側
の検査端子14に放電用電極11と接続する短絡部を設
けてもよいが出力端子部4側の検査端子14は密集して
配置されているため、放電用電極11への短絡部は入力
端子部3側に設けた方が各端子のレイアウトが簡単にな
る。
When the continuity test of the TCP 1 is performed, a test prober is applied to all the test terminals 12 and 14 for the test. At this time, since the terminal portions 3 and 4 of the wirings 5 and 6 connected to the driving LSI 8 are independent from each other without being connected to the discharge electrodes 10 and 11, the continuity inspection of the wirings 5 and 6 becomes possible. Further, when conducting continuity inspection of the third wiring 7, for example, when conducting continuity inspection of the third wiring 7 a, the prober contacted with the inspection terminal 12 a connected to the input terminal 3 a and the test terminal 14 a connected with the output terminal 4 a. An electric current is passed between the probe and the prober to check whether the third wiring 7a is disconnected. Since the third wiring 7 is connected to the discharge electrode 11 only at the short-circuit portion 13 formed on the inspection terminal 12 on the input terminal portion 3 side, the continuity test of the third wiring 7 can be performed without cutting the short-circuit portion 13. it can. The test terminals 14 on the output terminal portion 4 side instead of the input terminal portion 3 side may be provided with a short-circuit portion to be connected to the discharge electrode 11, but the test terminals 14 on the output terminal portion 4 side are densely arranged. Therefore, the layout of each terminal is simplified when the short-circuit portion to the discharge electrode 11 is provided on the input terminal portion 3 side.

【0022】図4はTCP1を液晶パネル15に接続し
たとき状態を示す。液晶パネルは2枚のガラス基板1
6、17を貼り合わせ、ガラス基板16、17間に液晶
を封入している。一方のガラス基板16には複数の走査
線と複数の信号線がマトリクス状に配線され、各線の交
差部にスイッチング素子であるTFTが設けられ、各線
で囲まれる画素内にTFTと接続する画素電極が設けら
れている。他方のガラス基板17の全面には対向電極が
形成され、画素電極と対向電極の間の電界によって液晶
の配列状態を変化させる。ガラス基板16の長辺部分に
は信号線の入力端子21が、短辺部分には走査線の入力
端子22がそれぞれ設けられ、各入力端子21、22は
複数のTCP1を介してPWB基板18、19と接続す
る。そしてPWB基板18から画像データ信号をTCP
1の入力端子部3、第1配線5を介して駆動用LSI8
に入力し、駆動用LSI8で信号処理した後に第2配線
6、出力端子部4を介して液晶パネル15の信号線に出
力し、PWB基板19からの走査信号をTCP1の第1
配線5、駆動用LSI8、第2配線6を通じて液晶パネ
ル15の走査線に出力する。また、液晶パネル15に一
列に並んで接続するTCP1のうち最も外側に位置する
TCP1の第3配線7を通じて液晶パネル15の対向電
極に任意の電圧が供給される。TCP1の第3配線7は
主に電源や駆動用LSI8で信号処理しない信号などを
PWB基板18、19から液晶パネル15に直接供給す
るために利用される。なお、液晶パネル15に接続した
全てのTCP1の第3配線7を利用する必要はなく、一
部のTCP1の第3配線7のみを利用する形態でもよ
い。
FIG. 4 shows a state when the TCP 1 is connected to the liquid crystal panel 15. The liquid crystal panel is composed of two glass substrates 1
6 and 17 are bonded together, and liquid crystal is sealed between the glass substrates 16 and 17. On one glass substrate 16, a plurality of scanning lines and a plurality of signal lines are wired in a matrix, and a TFT which is a switching element is provided at an intersection of each line, and a pixel electrode connected to the TFT is provided in a pixel surrounded by each line. Is provided. A counter electrode is formed on the entire surface of the other glass substrate 17, and the arrangement state of the liquid crystal is changed by an electric field between the pixel electrode and the counter electrode. An input terminal 21 of a signal line is provided on a long side portion of the glass substrate 16, and an input terminal 22 of a scanning line is provided on a short side portion. Each of the input terminals 21 and 22 is connected to the PWB substrate 18 via a plurality of TCPs 1. Connect to 19. Then, the image data signal is transmitted from the PWB substrate 18 to the TCP.
1 driving terminal 8 via the first input terminal 3 and the first wiring 5
After the signal is processed by the driving LSI 8, the signal is output to the signal line of the liquid crystal panel 15 via the second wiring 6 and the output terminal unit 4, and the scanning signal from the PWB substrate 19 is sent to the first of the TCP 1.
The signal is output to the scanning line of the liquid crystal panel 15 through the wiring 5, the driving LSI 8, and the second wiring 6. Further, an arbitrary voltage is supplied to the opposing electrode of the liquid crystal panel 15 through the third wiring 7 of the outermost TCP 1 among the TCPs 1 connected in a line to the liquid crystal panel 15. The third wiring 7 of the TCP 1 is mainly used for directly supplying a power supply, a signal not subjected to signal processing by the driving LSI 8 and the like from the PWB substrates 18 and 19 to the liquid crystal panel 15. Note that it is not necessary to use the third wires 7 of all the TCPs 1 connected to the liquid crystal panel 15, and a mode in which only some of the third wires 7 of the TCP 1 are used may be used.

【0023】この実施形態では、第3配線7につながる
入力端子部3の検査端子12に放電用電極11と接続す
る短絡部13を設けると共に、最も外側に位置する第3
配線7aの出力端子部4aの検査端子14aを第2配線
6につながる出力端子部4dの検査端子14dとできる
だけ離して配置した場合を説明したが、出力端子部4の
検査端子14の配置は従来と同じ形態でも入力端子部3
a、3b、3cの検査端子12a、12b、12cと放
電用電極11を短絡するだけで十分な効果が得られる。
入力端子部3a、3b、3cの検査端子12a、12
b、12cを放電用電極11に短絡したTCP1の場
合、製造中に静電気による駆動用LSI8の破壊がなく
なり、歩留まりが大幅に向上した。また、この実施形態
では駆動用LSI8に接続しない第3配線7の全てを放
電用電極11に短絡したが、最も外側に位置する第3配
線7aのみ放電用電極11に短絡しても本発明の効果が
得られる。これは最も外側の第3配線7aが最も静電気
を拾い易く、駆動用LSI8の破壊の原因に深く関係す
るため、この第3配線7aを短絡することでかなり駆動
用LSI8の破壊を防ぐことができる。また、この実施
形態ではTCP1を液晶パネル15に接続したときに、
第3配線7を信号などの供給用として活用するため、T
CP1の製造中に第3配線7の導通検査が必要となる。
従って入力端子部3a、3b、3cの検査端子12a、
12b、12cのみに放電用電極11と接続する短絡部
13を設けることで、駆動用LSI8の静電気対策を施
しながら第3配線7の導通検査も可能であるTCP1を
実現することができる。
In this embodiment, the inspection terminal 12 of the input terminal portion 3 connected to the third wiring 7 is provided with the short-circuit portion 13 connected to the discharge electrode 11, and the third outermost portion is connected to the third terminal 7.
The case where the inspection terminal 14a of the output terminal portion 4a of the wiring 7a is arranged as far as possible from the inspection terminal 14d of the output terminal portion 4d connected to the second wiring 6 has been described. Input terminal part 3 in the same form as
A sufficient effect can be obtained only by short-circuiting the inspection terminals 12a, 12b, and 12c of a, 3b, and 3c and the discharge electrode 11.
Inspection terminals 12a, 12 of input terminal portions 3a, 3b, 3c
In the case of TCP1 in which b and 12c were short-circuited to the discharge electrode 11, the driving LSI 8 was not destroyed by static electricity during manufacturing, and the yield was greatly improved. Further, in this embodiment, all of the third wirings 7 not connected to the driving LSI 8 are short-circuited to the discharge electrode 11, but even if only the outermost third wiring 7a is short-circuited to the discharge electrode 11, the present invention can be applied. The effect is obtained. This is because the outermost third wiring 7a most easily picks up static electricity and is deeply related to the cause of the destruction of the driving LSI 8, so that short-circuiting of the third wiring 7a can considerably prevent the destruction of the driving LSI 8. . In this embodiment, when the TCP 1 is connected to the liquid crystal panel 15,
In order to utilize the third wiring 7 for supplying signals and the like, T
A continuity inspection of the third wiring 7 is required during the manufacture of CP1.
Therefore, the inspection terminals 12a of the input terminal portions 3a, 3b, 3c,
By providing the short-circuit portion 13 connected to the discharge electrode 11 only in 12b and 12c, it is possible to realize the TCP 1 that can perform the continuity test of the third wiring 7 while taking the countermeasures against static electricity of the driving LSI 8.

【0024】次に第2の実施形態を図5に基づいて説明
する。第2の実施形態は第1の実施形態と第1放電用電
極の形態が異なるがその他の構成は同じであり、同一部
分には第1の実施形態と同一の符号を付す。図5は第2
の実施形態の平面図である。この実施形態ではベースフ
ィルム2の一方の側部に帯状の第1放電用電極10Aが
設けられ、他方の側部には第1放電用電極10Aが存在
しない。この第1放電用電極10Aはスプロケットホー
ル9部分に存在しないが、製造工程では搬送装置のスプ
ロケットと接触してベースフィルム2に帯電した静電気
を除去できる。この実施形態はベースフィルム2の幅の
制約より第1放電用電極10Aが両側に設けることがで
きない場合に有効な形態である。各TCP1の間には第
1放電用電極10Aから分岐した第2放電用電極11A
が形成され、この第2放電用電極11Aには第3配線7
の入力端子部3a、3b、3cの検査端子12が短絡部
13によって接続している。第3配線7はTCP1の両
側に存在するため、第2放電用電極11Aは入力端子部
3の先端側にその全幅に亘って存在し、両側の第3配線
7が第2放電用電極11Aに共通して短絡する。この実
施形態の放電用電極10A、11Aも第1の実施形態と
同様にベースフィルム2上の配線5、6、7や端子部
3、4と同一工程で形成される。そして製造中にベース
フィルム2に帯電した静電気が第3配線7に流れたと
き、その静電気は短絡部13を介して第2放電用電極1
1A、第1放電用電極10Aへ流れ、駆動用LSI8に
流れることを防止する。
Next, a second embodiment will be described with reference to FIG. The second embodiment differs from the first embodiment in the form of the first discharge electrode, but has the same other configuration, and the same parts are denoted by the same reference numerals as in the first embodiment. FIG. 5 shows the second
It is a top view of an embodiment. In this embodiment, a band-shaped first discharge electrode 10A is provided on one side of the base film 2, and the first discharge electrode 10A does not exist on the other side. Although the first discharge electrode 10A does not exist in the sprocket hole 9, the static electricity charged on the base film 2 by contact with the sprocket of the transfer device can be removed in the manufacturing process. This embodiment is effective when the first discharge electrode 10A cannot be provided on both sides due to the restriction of the width of the base film 2. Between each TCP1, a second discharge electrode 11A branched from the first discharge electrode 10A
Is formed, and the third wiring 7 is provided on the second discharge electrode 11A.
The inspection terminals 12 of the input terminal portions 3a, 3b, and 3c are connected by a short-circuit portion 13. Since the third wiring 7 is present on both sides of the TCP 1, the second discharge electrode 11A is present over the entire width of the input terminal portion 3 on the tip side thereof, and the third wiring 7 on both sides is provided on the second discharge electrode 11A. Short circuit in common. The discharge electrodes 10A and 11A of this embodiment are also formed in the same process as the wirings 5, 6, and 7 and the terminal portions 3 and 4 on the base film 2 as in the first embodiment. When static electricity charged on the base film 2 flows to the third wiring 7 during manufacturing, the static electricity is transferred to the second discharge electrode 1 through the short-circuit portion 13.
1A, which flows to the first discharge electrode 10A and is prevented from flowing to the driving LSI 8.

【0025】次に第3の実施形態を図6に基づいて説明
する。第3の実施形態は第1の実施形態と第2放電用電
極の形態が異なるがその他の構成は同じであり、同一部
分には第1の実施形態と同一の符号を付す。図6は第3
の実施形態の平面図である。この第2放電用電極11B
はベースフィルム2の両端の第1放電用電極10Bから
第3配線7の入力端子部3a、3b、3cの先端付近ま
で延在し、入力端子部3a、3b、3cの検査端子12
a、12b、12cと短絡部13を介して接続されてい
る。従って製造工程でベースフィルム2に帯電した静電
気が第3配線7を流れたときに、静電気が検査端子12
a、12b、12cの短絡部13を介して第2放電用電
極11B、第1放電用電極10Bに流れて除去できる。
この実施形態では駆動用LSI8と接続する配線5、6
の端子部3、4の先端に第2放電用電極11Bが存在し
ないため、配線5、6、7等の形成時の不十分なエッチ
ングにより第2放電用電極11Bと端子部5、6が短絡
する恐れがなく、各配線3、4の導通検査が確実に行え
る。またベースフィルム2上の第2放電用電極11Bが
存在する領域が少なくなるため、製造中にベースフィル
ム2を折り曲げるときに第2放電用電極11Bが邪魔に
ならない。
Next, a third embodiment will be described with reference to FIG. The third embodiment differs from the first embodiment in the form of the second discharge electrode, but has the same other configuration, and the same parts are denoted by the same reference numerals as in the first embodiment. FIG. 6 shows the third
It is a top view of an embodiment. This second discharge electrode 11B
Extend from the first discharge electrodes 10B at both ends of the base film 2 to the vicinity of the tips of the input terminals 3a, 3b, 3c of the third wiring 7, and the inspection terminals 12 of the input terminals 3a, 3b, 3c.
a, 12b, and 12c via a short-circuit portion 13. Therefore, when static electricity charged on the base film 2 flows through the third wiring 7 in the manufacturing process, the static electricity is discharged to the inspection terminal 12.
It can be removed by flowing to the second discharge electrode 11B and the first discharge electrode 10B via the short-circuit portion 13 of a, 12b, and 12c.
In this embodiment, the wirings 5 and 6 connected to the driving LSI 8 are used.
Since the second discharge electrode 11B does not exist at the tip of the terminal portions 3 and 4, the second discharge electrode 11B and the terminal portions 5 and 6 are short-circuited due to insufficient etching when forming the wirings 5, 6, 7 and the like. The continuity inspection of each of the wirings 3 and 4 can be reliably performed without fear of occurrence. Further, since the region where the second discharge electrode 11B is present on the base film 2 is reduced, the second discharge electrode 11B does not become an obstacle when the base film 2 is bent during manufacturing.

【0026】次に第4の実施形態を図7に基づいて説明
する。第4の実施形態は第1の実施形態と第3配線7の
検査端子14a、14b、14cの配置と第2放電用電
極11の形態が異なるがその他の構成は同じであり、同
一部分には第1の実施形態と同一の符号を付す。図7は
第3の実施形態の平面図であり、図8は図7の領域Bで
示す第3配線7につながる出力端子部4a、4b、4c
の先端部分の拡大図でる。この実施形態も第1の実施形
態と同様に駆動用LSI8に接続しない3本の第3配線
7を設け、各第3配線7の出力側が分岐して2つの出力
端子部4a、4b、4cにつながっている。そして検査
端子14aは出力端子部4aを介して第3配線7aに、
検査端子14bは出力端子部4bを介して第3配線7b
に、検査端子14cは出力端子部4cを介して第3配線
7cにそれぞれ接続される。第3配線7a、7bにつな
がる検査端子14a、14bと第2配線6につながる検
査端子14dの間には第2放電用電極11Cから分岐し
て伸びた第3放電用電極20が配置される。このとき検
査端子14a、14bと検査端子14dの間隔を既存の
導通検査装置のプローバが当たる範囲内にすることで、
導通検査装置のプローバの配置を変更する必要がなくな
る。
Next, a fourth embodiment will be described with reference to FIG. The fourth embodiment differs from the first embodiment in the arrangement of the inspection terminals 14a, 14b, and 14c of the third wiring 7 and the form of the second discharge electrode 11, but the other configurations are the same. The same reference numerals as in the first embodiment are used. FIG. 7 is a plan view of the third embodiment, and FIG. 8 is an output terminal portion 4a, 4b, 4c connected to the third wiring 7 indicated by a region B in FIG.
It is an enlarged view of the tip part of. In this embodiment, similarly to the first embodiment, three third wirings 7 which are not connected to the driving LSI 8 are provided, and the output side of each third wiring 7 branches to two output terminal portions 4a, 4b, 4c. linked. The inspection terminal 14a is connected to the third wiring 7a via the output terminal 4a.
The inspection terminal 14b is connected to the third wiring 7b via the output terminal 4b.
The inspection terminals 14c are connected to the third wirings 7c via the output terminal portions 4c. Between the inspection terminals 14a and 14b connected to the third wirings 7a and 7b and the inspection terminal 14d connected to the second wiring 6, a third discharge electrode 20 branched and extended from the second discharge electrode 11C is arranged. At this time, by setting the interval between the inspection terminals 14a, 14b and the inspection terminal 14d within a range where the prober of the existing continuity inspection device hits,
It is not necessary to change the arrangement of the prober of the continuity inspection device.

【0027】そしてベースフィルム2に帯電した静電気
が第3配線7に流れた場合、第3配線7の入力端子部3
側の検査端子12と第2放電用電極11Cが短絡部13
で接続しているので、第3配線7の静電気が放電用電極
10C、11Cを通じて搬送装置のスプロケットへ放電
する。更に、静電気が第3配線7aの出力端子部4aの
検査端子14aに流れても、静電気は第3放電用電極2
0を通じて第2放電用電極11Cへ放電するため、検査
端子14dから配線4dへ静電気が流れて駆動用LSI
8が破壊される不具合を防止できる。
When the static electricity charged on the base film 2 flows to the third wiring 7, the input terminal 3 of the third wiring 7
Test terminal 12 and second discharge electrode 11C are short-circuited 13
, The static electricity of the third wiring 7 is discharged to the sprocket of the transfer device through the discharge electrodes 10C and 11C. Further, even if the static electricity flows to the inspection terminal 14a of the output terminal portion 4a of the third wiring 7a, the static electricity does not flow to the third discharge electrode 2a.
0 to the second discharging electrode 11C, static electricity flows from the inspection terminal 14d to the wiring 4d, and the driving LSI
8 can be prevented from being broken.

【0028】次に第5の実施形態を図9に基づいて説明
する。第5の実施形態は第1の実施形態と第3配線7に
つながる検査端子12、14の形態が異なるが、その他
の構成は同じであり、同一部分には第1の実施形態と同
一の符号を付す。図9は第3配線7につながる検査端子
12、14部分の拡大図である。この実施形態では第3
配線7a、7bの出力端子部4a、4b側の検査端子1
4a、14bと第2放電用電極11が短絡部23を介し
て電気的に接続され、第3配線7cの入力端子部3cの
検査端子12cのみに第2放電用電極11と接続する短
絡部13が形成されている。製造中に第3配線7aを流
れる静電気は出力端子部4aの検査端子14aから近接
する検査端子14dに移り易く、その検査端子14dを
通じて静電気が第2配線6に流れるが、仮に第3配線4
aの出力端子部4a側で静電気が発生したとき、入力端
子部3aの検査端子12aに短絡部13を形成した場合
は静電気の発生箇所と短絡部13との間の線間インピー
ダンスが大きくなるが、出力端子部4aの検査端子14
aに短絡部23を形成した場合は静電気の発生箇所と短
絡部23との間の線間インピーダンスが小さくなるため
静電気が第2放電用電極11に流れやすく、第2配線6
に静電気が流れることを防止できる。また、検査端子1
4a、14bを第2放電用電極11に短絡すれば、検査
端子14aを第2配線6の検査端子14dから離して配
置しなくてもよくなり、従来の導通検査装置の検査プロ
ーバを確実に検査端子14a、14bへ接触させること
ができる。
Next, a fifth embodiment will be described with reference to FIG. The fifth embodiment is different from the first embodiment in the form of the inspection terminals 12 and 14 connected to the third wiring 7, but the other configurations are the same, and the same parts are denoted by the same reference numerals as those in the first embodiment. Is attached. FIG. 9 is an enlarged view of the inspection terminals 12 and 14 connected to the third wiring 7. In this embodiment, the third
Inspection terminal 1 on output terminal portions 4a, 4b side of wires 7a, 7b
4a, 14b and the second discharge electrode 11 are electrically connected via the short-circuit part 23, and the short-circuit part 13 connected to the second discharge electrode 11 only to the inspection terminal 12c of the input terminal part 3c of the third wiring 7c. Are formed. The static electricity flowing through the third wiring 7a during manufacturing is easily transferred from the inspection terminal 14a of the output terminal portion 4a to the adjacent inspection terminal 14d, and the static electricity flows to the second wiring 6 through the inspection terminal 14d.
When static electricity is generated on the output terminal section 4a side of a, when a short-circuit section 13 is formed on the inspection terminal 12a of the input terminal section 3a, the line impedance between the place where the static electricity is generated and the short-circuit section 13 increases. Inspection terminal 14 of output terminal portion 4a
In the case where the short-circuit portion 23 is formed, the line impedance between the location where the static electricity is generated and the short-circuit portion 23 becomes small, so that the static electricity easily flows to the second discharge electrode 11 and the second wiring 6
Static electricity can be prevented from flowing through. In addition, inspection terminal 1
If the electrodes 4a and 14b are short-circuited to the second discharge electrode 11, the inspection terminal 14a does not have to be arranged apart from the inspection terminal 14d of the second wiring 6, and the inspection prober of the conventional continuity inspection device is surely inspected. The terminals can be brought into contact with the terminals 14a and 14b.

【0029】なおこの実施形態では第3配線7a、7b
の検査端子14a、14bを第2放電用電極11に短絡
したが、第3配線7aの検査端子14aのみを第2放電
用電極11に短絡する形態や、全ての第3配線7a、7
b、7cの検査端子14a、14b、14cを第2放電
用電極に短絡した形態でも良い。このとき出力端子部4
の検査端子14を短絡した第3配線7については入力端
子部3の検査端子12に短絡部13を形成せずに第2放
電用電極11と分離することで、各第3配線7の導通検
査が可能になる。また、最も外側に位置する検査端子1
4aを第2放電用電極11に短絡する形態であれば、出
力端子部4側の検査端子14が密集して配置されている
場合でも、検査端子14aや短絡部23のレイアウトが
簡単になる。
In this embodiment, the third wirings 7a, 7b
Are short-circuited to the second discharge electrode 11, but only the test terminal 14a of the third wiring 7a is short-circuited to the second discharge electrode 11, or all the third wirings 7a, 7b
The inspection terminals 14a, 14b, 14c of b, 7c may be short-circuited to the second discharge electrode. At this time, the output terminal section 4
The third wiring 7 in which the inspection terminal 14 is short-circuited is separated from the second discharge electrode 11 without forming the short-circuit portion 13 in the inspection terminal 12 of the input terminal portion 3, thereby checking the continuity of each third wiring 7. Becomes possible. In addition, the outermost inspection terminal 1
If the 4a is short-circuited to the second discharge electrode 11, the layout of the inspection terminals 14a and the short-circuit portion 23 becomes simple even when the inspection terminals 14 on the output terminal portion 4 side are densely arranged.

【0030】また第3配線7cについては出力端子部4
cの検査端子14c側で第2放電用電極11に短絡し、
第3配線7a、7bについては入力端子部3a、3bの
検査端子12a、12b側で第2放電用電極11に短絡
する形態でも良い。この場合、第4実施形態の第2放電
用電極11cから分岐した第3放電用電極20を検査端
子14cまで延在させ、第3配線7cの入力端子部3c
の検査端子12cを第2放電用電極11cから分離す
る。そして第3配線7aを流れる静電気が仮に検査端子
14aから飛び移ったとしても第3放電用電極20に流
れるため、第2配線6に静電気が流れることを防止でき
る。
The third wiring 7c has the output terminal 4
c is short-circuited to the second discharge electrode 11 on the inspection terminal 14c side,
The third wires 7a, 7b may be short-circuited to the second discharge electrode 11 on the inspection terminals 12a, 12b side of the input terminal portions 3a, 3b. In this case, the third discharge electrode 20 branched from the second discharge electrode 11c of the fourth embodiment is extended to the inspection terminal 14c, and the input terminal portion 3c of the third wiring 7c is formed.
Is separated from the second discharge electrode 11c. Even if the static electricity flowing through the third wiring 7a jumps from the inspection terminal 14a, it flows to the third discharge electrode 20, so that the static electricity can be prevented from flowing to the second wiring 6.

【0031】以上のように本発明は、駆動用LSIと接
続しない配線を放電用電極と短絡することで製造中に静
電気によって駆動用LSIが破壊されることを防止でき
る。
As described above, the present invention can prevent the drive LSI from being destroyed by static electricity during manufacturing by short-circuiting the wiring not connected to the drive LSI with the discharge electrode.

【0032】なお、本発明の要旨を逸脱しない範囲であ
れば上記実施形態以外の形態も可能である。例えば、T
CPの第3配線を利用するものであれば、このTCPを
液晶表示装置以外のものに使用することができる。
It should be noted that embodiments other than the above-described embodiment are possible without departing from the gist of the present invention. For example, T
As long as the third wiring of the CP is used, this TCP can be used for a device other than the liquid crystal display device.

【0033】[0033]

【発明の効果】本発明によれば、半導体素子である駆動
用LSIと接続しない第3配線を放電用電極に短絡して
いるため、製造中にフィルムに帯電した静電気が第3配
線に流れても放電用電極を通じて除去して半導体素子に
静電気が流れることを防止でき、半導体素子の破壊を防
ぐことができる。また半導体素子につながる各配線は放
電用電極から分離して独立し、第3配線も検査端子の短
絡部のみで放電用電極と接続しているため、製造中に各
配線の導通検査ができると共に導通検査後の静電気対策
も十分行えて歩留まりが向上する。
According to the present invention, since the third wiring which is not connected to the driving LSI which is a semiconductor element is short-circuited to the discharge electrode, static electricity charged on the film during manufacturing flows to the third wiring. Can also be removed through the discharge electrode to prevent static electricity from flowing to the semiconductor element, thereby preventing damage to the semiconductor element. In addition, each wiring connected to the semiconductor element is separated and independent from the discharge electrode, and the third wiring is connected to the discharge electrode only at the short-circuit portion of the inspection terminal. The countermeasures against static electricity after the continuity test can be sufficiently performed, and the yield is improved.

【0034】また本発明は、最も外側に位置する第3配
線の第2端子部の検査端子とその検査端子に隣接する第
2配線の第2端子部の検査端子との間隔を他の第2端子
部の検査端子間よりも大きくしたので、最も静電気を拾
い易い第3配線から第2端子部の検査端子を通じて第2
配線に静電気が流れることを防止でき、製造中の半導体
素子の破壊を防ぐことができる。
Further, according to the present invention, the distance between the inspection terminal of the second terminal portion of the third wiring located on the outermost side and the inspection terminal of the second terminal portion of the second wiring adjacent to the inspection terminal is changed to another second terminal. Since it is larger than the distance between the inspection terminals in the terminal portion, the second wiring is easily connected through the inspection terminal in the second terminal portion from the third wiring, where the static electricity is most easily picked up.
Static electricity can be prevented from flowing through the wiring, and destruction of the semiconductor element during manufacturing can be prevented.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の第1の実施形態であるTCPの平面図
である。
FIG. 1 is a plan view of a TCP according to a first embodiment of the present invention.

【図2】図1の領域Aの拡大図である。FIG. 2 is an enlarged view of a region A in FIG.

【図3】図1の領域Bの拡大図である。FIG. 3 is an enlarged view of a region B in FIG. 1;

【図4】本発明のTCPを液晶パネルに接続したときの
平面図である。
FIG. 4 is a plan view when the TCP of the present invention is connected to a liquid crystal panel.

【図5】本発明の第2の実施形態であるTCPの平面図
である。
FIG. 5 is a plan view of a TCP according to a second embodiment of the present invention.

【図6】本発明の第3の実施形態であるTCPの平面図
である。
FIG. 6 is a plan view of a TCP according to a third embodiment of the present invention.

【図7】本発明の第4の実施形態であるTCPの平面図
である。
FIG. 7 is a plan view of a TCP according to a fourth embodiment of the present invention.

【図8】図7の領域Bの拡大図である。FIG. 8 is an enlarged view of a region B in FIG. 7;

【図9】本発明の第5の実施形態であるTCPの検査端
子の拡大図である。
FIG. 9 is an enlarged view of a test terminal of a TCP according to a fifth embodiment of the present invention.

【図10】従来のTCPの平面図である。FIG. 10 is a plan view of a conventional TCP.

【図11】図9の領域Aの拡大図である。FIG. 11 is an enlarged view of a region A in FIG. 9;

【図12】図9の領域Bの拡大図である。FIG. 12 is an enlarged view of a region B in FIG. 9;

【符号の説明】[Explanation of symbols]

1 TCP 2 ベースフィルム 3 入力端子部 4 出力端子部 5 第1配線 6 第2配線 7 第3配線 8 駆動用LSI 10、11 放電用電極 12 検査端子 13 短絡部 14 検査端子 DESCRIPTION OF SYMBOLS 1 TCP 2 Base film 3 Input terminal part 4 Output terminal part 5 1st wiring 6 2nd wiring 7 3rd wiring 8 Driving LSI 10, 11 Discharge electrode 12 Inspection terminal 13 Short circuit part 14 Inspection terminal

フロントページの続き Fターム(参考) 2G014 AA02 AB21 AB59 AC09 2H088 FA11 FA18 HA02 MA20 2H092 GA50 HA19 MA57 NA14 NA15 NA29 NA30 5F044 MM03 MM07 MM31 MM38 MM40 MM43 Continued on front page F term (reference) 2G014 AA02 AB21 AB59 AC09 2H088 FA11 FA18 HA02 MA20 2H092 GA50 HA19 MA57 NA14 NA15 NA29 NA30 5F044 MM03 MM07 MM31 MM38 MM40 MM43

Claims (12)

【特許請求の範囲】[Claims] 【請求項1】 絶縁性のフィルムと、前記フィルム上に
搭載されたほぼ長方形の半導体素子と、前記半導体素子
の長手方向に沿って配置された複数の第1端子部と、前
記半導体素子を挟んで前記第1端子部の反対側に配置さ
れると共に第1端子部よりも端子幅の小さい複数の第2
端子部と、内側に位置する前記第1端子部と前記半導体
素子を電気的に接続する第1配線と、内側に位置する前
記第2端子部と前記半導体素子を電気的に接続する第2
配線と、外側に位置する前記第1端子部と外側に位置す
る前記第2端子部とを前記半導体素子を介さずに直接接
続する第3配線と、前記フィルムの周辺部の形成された
導電性の放電用電極と、前記第3配線と前記放電用電極
を電気的に接続する短絡部とを備えたことを特徴とする
テープキャリアパッケージ。
1. An insulating film, a substantially rectangular semiconductor element mounted on the film, a plurality of first terminals arranged along a longitudinal direction of the semiconductor element, and a semiconductor element interposed therebetween. A plurality of second terminals arranged on the opposite side of the first terminal portion and having a smaller terminal width than the first terminal portion.
A terminal portion, a first wiring electrically connecting the first terminal portion located inside and the semiconductor element, and a second wiring electrically connecting the second terminal portion located inside and the semiconductor element.
A third wiring for directly connecting a wiring, the first terminal portion located outside and the second terminal portion located outside without the semiconductor element, and a conductive material formed on a peripheral portion of the film; And a short-circuit portion for electrically connecting the third wiring and the discharge electrode.
【請求項2】 前記第1端子部の先端に検査端子を形成
し、前記第3配線に接続する第1端子部の前記検査端子
に前記放電用電極と接続する短絡部を設けたことを特徴
とする請求項1記載のテープキャリアパッケージ。
2. A test terminal is formed at a tip of the first terminal portion, and a short-circuit portion connected to the discharge electrode is provided at the test terminal of the first terminal portion connected to the third wiring. The tape carrier package according to claim 1, wherein
【請求項3】 前記第2端子部の先端に検査端子を形成
し、前記第3配線に接続する第2端子部の前記検査端子
に前記放電用電極と接続する短絡部を設けたことを特徴
とする請求項1記載のテープキャリアパッケージ。
3. A test terminal is formed at a tip of the second terminal portion, and a short-circuit portion connected to the discharge electrode is provided at the test terminal of the second terminal portion connected to the third wiring. The tape carrier package according to claim 1, wherein
【請求項4】 複数の第3配線を形成すると共に少なく
とも最も外側に位置する第3配線を前記放電用電極に短
絡したことを特徴とする請求項1乃至請求項3記載のテ
ープキャリアパッケージ。
4. The tape carrier package according to claim 1, wherein a plurality of third wirings are formed, and at least an outermost third wiring is short-circuited to the discharge electrode.
【請求項5】 複数の第3配線を設け、前記第1端子部
及び前記第2端子部の先端に検査端子を形成したテープ
キャリアパッケージにおいて、各第3配線はそれぞれ接
続する第1端子部又は第2端子部のどちらか一方の前記
検査端子に前記放電用電極と接続する短絡部を設けたこ
とを特徴とする請求項1記載のテープキャリアパッケー
ジ。
5. A tape carrier package in which a plurality of third wirings are provided and an inspection terminal is formed at an end of each of the first terminal portion and the second terminal portion. 2. The tape carrier package according to claim 1, wherein a short-circuit portion connected to the discharge electrode is provided at one of the inspection terminals of the second terminal portion.
【請求項6】 前記第2端子部の端子幅よりも大きな検
査端子を前記第2端子部の先端に形成し、この検査端子
を複数個毎に密集して配置し、複数の第3配線の検査端
子を前記第2配線の検査端子に隣接して配置するテープ
キャリアパッケージにおいて、最も外側に位置する第3
配線の前記検査端子とその検査端子に隣接する第2配線
の前記検査端子との間隔を他の第3配線の前記検査端子
とその検査端子と隣接する第2配線の前記検査端子との
間隔よりも広くしたことを特徴とする請求項1乃至請求
項5記載のテープキャリアパッケージ。
6. A test terminal larger than a terminal width of the second terminal portion is formed at a tip of the second terminal portion, and the test terminals are densely arranged for each of a plurality of third terminals. In the tape carrier package in which the inspection terminal is arranged adjacent to the inspection terminal of the second wiring, the third outermost position is located.
The distance between the inspection terminal of the wiring and the inspection terminal of the second wiring adjacent to the inspection terminal is determined by the distance between the inspection terminal of another third wiring and the inspection terminal of the second wiring adjacent to the inspection terminal. 6. The tape carrier package according to claim 1, wherein said tape carrier package is also widened.
【請求項7】 最も外側に位置する第3配線の第2端子
部側の前記検査端子とその検査端子に隣接する第2配線
の第2端子部側の前記検査端子との間隔をその他の第3
配線の第2端子部側の前記検査端子とその検査端子に隣
接する第2配線の第2端子部の前記検査端子との間隔よ
りも2倍以上広くしたことを特徴とする請求項6記載の
テープキャリアパッケージ。
7. The distance between the inspection terminal on the second terminal portion side of the outermost third wiring and the inspection terminal on the second terminal portion side of the second wiring adjacent to the inspection terminal is set to the other 3
7. The wiring according to claim 6, wherein the distance between the inspection terminal on the second terminal portion side of the wiring and the inspection terminal of the second terminal portion of the second wiring adjacent to the inspection terminal is at least twice as large. Tape carrier package.
【請求項8】 前記第2端子部の端子幅よりも大きな検
査端子を前記第2端子部の先端に形成し、この検査端子
を複数個毎に密集して配置し、複数の第3配線の検査端
子を前記第2配線の検査端子の付近に配置するテープキ
ャリアパッケージにおいて、最も外側に位置する前記第
3配線の前記検査端子とその検査端子に最も近接する前
記第2配線の前記検査端子との間に前記放電用電極と電
気的に接続した電極が存在することを特徴とする請求項
1乃至請求項5記載のテープキャリアパッケージ。
8. An inspection terminal larger than a terminal width of the second terminal portion is formed at a tip of the second terminal portion, and the inspection terminals are densely arranged for each of a plurality of the plurality of third wirings. In a tape carrier package in which an inspection terminal is arranged near an inspection terminal of the second wiring, the inspection terminal of the third wiring located on the outermost side and the inspection terminal of the second wiring closest to the inspection terminal are connected to the inspection terminal of the third wiring. 6. The tape carrier package according to claim 1, further comprising an electrode electrically connected to the discharge electrode between the electrodes.
【請求項9】 前記フィルムの両端に形成された複数の
スプロケットホールと、前記スプロケットホールに沿っ
て形成された帯状の放電用電極と、前記放電用電極から
分岐して前記第1端子部の検査端子の先端に沿って配置
された第2放電用電極と、前記第2放電用電極と前記第
3配線の前記第1端子部の前記検査端子を接続する短絡
部とを備えたことを特徴とする請求項1乃至請求項8記
載のテープキャリアパッケージ。
9. A plurality of sprocket holes formed at both ends of the film, a strip-shaped discharge electrode formed along the sprocket hole, and an inspection of the first terminal portion branched from the discharge electrode. A second discharge electrode arranged along the tip of the terminal; and a short-circuit portion connecting the second discharge electrode and the inspection terminal of the first terminal portion of the third wiring. 9. The tape carrier package according to claim 1, wherein
【請求項10】 絶縁性のフィルムと、前記フィルム上
に搭載されたほぼ長方形の半導体素子と、前記半導体素
子の長手方向に沿って配置された複数の第1端子部と、
前記半導体素子を挟んで前記第1端子部の反対側に配置
されると共に前記第1端子部よりも端子幅の小さい複数
の第2端子部と、内側に位置する前記第1端子部と前記
半導体素子を電気的に接続する第1配線と、内側に位置
する前記第2端子部と前記半導体素子を電気的に接続す
る第2配線と、外側に位置する前記第1端子部と外側に
位置する前記第2端子部とを前記半導体素子を介さずに
直接接続する複数の第3配線とを備え、前記第2端子部
の端子幅よりも大きな検査端子を前記第2端子部の先端
に形成し、この検査端子を複数個毎に密集して配置し、
第3配線の検査端子を前記第2配線の検査端子に隣接し
て配置するテープキャリアパッケージにおいて、最も外
側に位置する第3配線の前記検査端子とその検査端子に
隣接する第2配線の前記検査端子との間隔を他の第3配
線の前記検査端子とその検査端子と隣接する第2配線の
前記検査端子との間隔よりも広くしたことを特徴とする
テープキャリアパッケージ。
10. An insulating film, a substantially rectangular semiconductor element mounted on the film, and a plurality of first terminals arranged along a longitudinal direction of the semiconductor element;
A plurality of second terminal portions arranged on the opposite side of the first terminal portion with the semiconductor element interposed therebetween and having a smaller terminal width than the first terminal portion, and the first terminal portion located inside and the semiconductor; A first wiring for electrically connecting elements; a second wiring for electrically connecting the second terminal portion located inside and the semiconductor element; and a first wiring located outside for the first terminal portion located outside. A plurality of third wirings for directly connecting the second terminal portion without the semiconductor element therebetween, and an inspection terminal larger than a terminal width of the second terminal portion is formed at a tip of the second terminal portion. , The test terminals are densely arranged for every plural number,
In the tape carrier package in which the inspection terminal of the third wiring is arranged adjacent to the inspection terminal of the second wiring, the inspection of the inspection terminal of the third wiring located on the outermost side and the second wiring adjacent to the inspection terminal is performed. A tape carrier package, wherein the distance between the terminal and the inspection terminal of another third wiring is wider than the distance between the inspection terminal of the other third wiring and the inspection terminal of an adjacent second wiring.
【請求項11】 最も外側に位置する第3配線の第2端
子部側の前記検査端子とその検査端子に隣接する第2配
線の第2端子部側の前記検査端子との間隔をその他の第
3配線の第2端子部側の前記検査端子とその検査端子に
隣接する第2配線の第2端子部の前記検査端子との間隔
よりも2倍以上広くしたことを特徴とする請求項10記
載のテープキャリアパッケージ。
11. The distance between the inspection terminal on the second terminal portion side of the outermost third wiring and the inspection terminal on the second terminal portion side of the second wiring adjacent to the inspection terminal is set to the other The distance between the inspection terminal on the second terminal portion side of the three wirings and the inspection terminal of the second terminal portion of the second wiring adjacent to the inspection terminal is at least twice as large. Tape carrier package.
【請求項12】 請求項1乃至請求項9記載のテープキ
ャリアパッケージの製造方法において、絶縁性の前記フ
ィルム上に形成される導電性のパターンとして、半導体
素子の長手方向に沿って配置された複数の第1端子部
と、前記半導体素子を挟んで前記第1端子部の反対側に
配置されると共に第1端子部よりも端子幅の小さい複数
の第2端子部と、内側に位置する前記第1端子部と前記
半導体素子を電気的に接続する第1配線と、内側に位置
する前記第2端子部と前記半導体素子を電気的に接続す
る第2配線と、外側に位置する前記第1端子部と外側に
位置する前記第2端子部とを前記半導体素子を介さずに
直接接続する第3配線と、前記フィルムの周辺部の形成
された導電性の放電用電極と、前記第3配線と前記放電
用電極を電気的に接続する短絡部とを同一工程で形成し
たことを特徴とするテープキャリアパッケージの製造方
法。
12. The method for manufacturing a tape carrier package according to claim 1, wherein a plurality of conductive patterns formed on the insulating film are arranged along a longitudinal direction of the semiconductor element. A first terminal portion, a plurality of second terminal portions disposed on the opposite side of the first terminal portion with the semiconductor element interposed therebetween and having a smaller terminal width than the first terminal portion; A first wire for electrically connecting one terminal portion to the semiconductor element; a second wire for electrically connecting the second terminal portion located inside and the semiconductor element; and the first terminal located outside. A third wiring for directly connecting a portion and the outer second terminal portion without interposing the semiconductor element, a conductive discharge electrode formed in a peripheral portion of the film, and the third wiring. Electrically connect the discharge electrodes And a short-circuit portion to be formed in the same step.
JP2001114397A 2001-04-12 2001-04-12 Tape carrier package and manufacturing method thereof Expired - Fee Related JP3670979B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001114397A JP3670979B2 (en) 2001-04-12 2001-04-12 Tape carrier package and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001114397A JP3670979B2 (en) 2001-04-12 2001-04-12 Tape carrier package and manufacturing method thereof

Publications (2)

Publication Number Publication Date
JP2002313850A true JP2002313850A (en) 2002-10-25
JP3670979B2 JP3670979B2 (en) 2005-07-13

Family

ID=18965481

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001114397A Expired - Fee Related JP3670979B2 (en) 2001-04-12 2001-04-12 Tape carrier package and manufacturing method thereof

Country Status (1)

Country Link
JP (1) JP3670979B2 (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004287059A (en) * 2003-03-20 2004-10-14 Fujitsu Display Technologies Corp Liquid crystal display
JP2007005773A (en) * 2005-05-24 2007-01-11 Nec Electronics Corp Carrier tape
CN1302315C (en) * 2003-11-05 2007-02-28 友达光电股份有限公司 Liquid crystal display assembly
KR100793068B1 (en) * 2005-03-07 2008-01-10 엘지전자 주식회사 Manufacture Method for TCP with Dummy Pattern Design and Film Thereof
KR100924494B1 (en) 2003-06-26 2009-11-03 엘지디스플레이 주식회사 TCP structure for output test on PCB
US7959425B2 (en) 2009-02-06 2011-06-14 Kabushiki Kaisha Toshiba Injection molding machine having an electrical discharge system
CN102508371A (en) * 2011-12-01 2012-06-20 深圳市华星光电技术有限公司 Tape winding substrate with flexible chip-on-board structures of liquid crystal panel
KR20190075751A (en) * 2017-12-21 2019-07-01 엘지디스플레이 주식회사 Chip on film and display device comprising the same
CN114093262A (en) * 2021-11-18 2022-02-25 合肥维信诺科技有限公司 Display panel and display device
CN114255683A (en) * 2021-12-21 2022-03-29 武汉华星光电技术有限公司 Display panel

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004287059A (en) * 2003-03-20 2004-10-14 Fujitsu Display Technologies Corp Liquid crystal display
KR100924494B1 (en) 2003-06-26 2009-11-03 엘지디스플레이 주식회사 TCP structure for output test on PCB
CN1302315C (en) * 2003-11-05 2007-02-28 友达光电股份有限公司 Liquid crystal display assembly
KR100793068B1 (en) * 2005-03-07 2008-01-10 엘지전자 주식회사 Manufacture Method for TCP with Dummy Pattern Design and Film Thereof
JP2007005773A (en) * 2005-05-24 2007-01-11 Nec Electronics Corp Carrier tape
US7959425B2 (en) 2009-02-06 2011-06-14 Kabushiki Kaisha Toshiba Injection molding machine having an electrical discharge system
CN102508371A (en) * 2011-12-01 2012-06-20 深圳市华星光电技术有限公司 Tape winding substrate with flexible chip-on-board structures of liquid crystal panel
WO2013078674A1 (en) * 2011-12-01 2013-06-06 深圳市华星光电技术有限公司 Tape substrate of chip-on-film structure of liquid crystal panel, and liquid crystal panel using the tape substrate
CN102508371B (en) * 2011-12-01 2014-05-21 深圳市华星光电技术有限公司 Tape winding substrate with flexible chip-on-board structures of liquid crystal panel
KR20190075751A (en) * 2017-12-21 2019-07-01 엘지디스플레이 주식회사 Chip on film and display device comprising the same
KR102505341B1 (en) * 2017-12-21 2023-02-28 엘지디스플레이 주식회사 Chip on film and display device comprising the same
CN114093262A (en) * 2021-11-18 2022-02-25 合肥维信诺科技有限公司 Display panel and display device
CN114093262B (en) * 2021-11-18 2023-12-15 合肥维信诺科技有限公司 Display panel and display device
CN114255683A (en) * 2021-12-21 2022-03-29 武汉华星光电技术有限公司 Display panel
CN114255683B (en) * 2021-12-21 2024-03-22 武汉华星光电技术有限公司 Display panel

Also Published As

Publication number Publication date
JP3670979B2 (en) 2005-07-13

Similar Documents

Publication Publication Date Title
JP7177594B2 (en) Chip-on-film package, display panel, and display device
US5717556A (en) Printed-wiring board having plural parallel-connected interconnections
KR100321883B1 (en) Structure and method of mounting semiconductor device and liquid crystal display device
US7458819B2 (en) Tape carrier package
JP4381498B2 (en) Liquid crystal display device with COG structure
JPH07288371A (en) Flexible printed wiring, connecting device therefor and electric circuit device thereof
JPH0954333A (en) Display device and ic chip used for the same
JPWO2002021199A1 (en) Liquid crystal display
US6300998B1 (en) Probe for inspecting liquid crystal display panel, and apparatus and method for inspecting liquid crystal display panel
JP3670979B2 (en) Tape carrier package and manufacturing method thereof
JP5535707B2 (en) Display device and display device connection status inspection method
JPH0793485B2 (en) How to connect IC unit
JP2007298938A (en) Display device module and method for manufacturing same
JP3645172B2 (en) Semiconductor integrated circuit device mounting substrate
JP2004184839A (en) Display device
JP2007298939A (en) Display device module and its manufacturing method
JP2001156417A (en) Pattern for inspecting connection between circuit boards
JP3025764B2 (en) Liquid crystal display
JPH10282516A (en) Liquid crystal display device
JP2948466B2 (en) Liquid crystal display device
JPH08293656A (en) Wiring connection structure
JPH11145373A (en) Tape carrier package, and liquid crystal display using the tape carrier package
KR19990006197A (en) How to arrange input leads of LCD module
JPH10125732A (en) Soldering of tape carrier package and printed circuit board
JP3608514B2 (en) Semiconductor element mounting structure and electronic device

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20040621

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20050322

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20050329

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20050415

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

R360 Written notification for declining of transfer of rights

Free format text: JAPANESE INTERMEDIATE CODE: R360

R371 Transfer withdrawn

Free format text: JAPANESE INTERMEDIATE CODE: R371

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080422

Year of fee payment: 3

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080422

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090422

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090422

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100422

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110422

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110422

Year of fee payment: 6

LAPS Cancellation because of no payment of annual fees