JP2002344106A - Board with built-in circuit components and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a board that is provided with built-in circuit components, has a large circuit constant and a thin thickness, and is suitable for a laminated structure. SOLUTION: A coil pattern 102, capacitor electrodes 103, and a wiring pattern 104 are formed on at least one surface of a dielectric layer 101 by arranging conductive materials in prescribed patterns. In addition, a magnetic material 105 is arranged in the dielectric layer 101 in the vicinity of the coil pattern 102. Since the coil pattern 102 is formed on the surface of the layer 101 and the magnetic material 105 is arranged in the vicinity of the pattern 102, inductance L can be improved. In addition, a large-capacitance capacitor can be formed by constituting the layer 101 of a material having a high dielectric constant. Consequently, such a thin board with built-in circuit components that a highly functional inductor and capacitor are formed on the common surface of a dielectric layer can be obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit component built-in substrate in which circuit components are arranged inside a dielectric layer, and a method of manufacturing the same.

[0002]

2. Description of the Related Art In recent years, with the trend toward higher performance and smaller size of electronic equipment, higher density and higher function of circuit parts are more demanded. However, due to the high density of components mounted in the field of power electronics and high frequency equipment,
The problem of EMI (electromagnetic interference) has arisen. E
As a countermeasure against MI, there is a method using a noise countermeasure component such as an EMI filter configured by a capacitor and an inductor.

As a method of mounting circuit components at high density, many proposals have been made to form circuit components inside an electric insulating layer, and by laminating a magnetic layer or a dielectric layer,
They form inductors and capacitors.

[0004]

SUMMARY OF THE INVENTION However, EMI
In order to form a circuit component such as a filter, it is necessary to increase circuit constants such as capacitance and inductance. Therefore, a magnetic layer is used for forming the inductor,
It is necessary to use a dielectric layer for forming a capacitor. However, when these are integrated and manufactured, there are problems such as destruction and warpage due to lamination of different kinds of materials, and a thick substrate.

An object of the present invention is to provide a circuit component built-in substrate having a large circuit constant, a small thickness, and suitable for a laminated structure, and a method for manufacturing the same.

[0006]

The present invention has the following configuration to achieve the above object.

According to a first aspect of the present invention, there is provided a circuit component built-in substrate, comprising a dielectric layer and a conductive material arranged in a predetermined pattern on at least one surface of the dielectric layer so as to form at least a coil pattern and a capacitor electrode. And near the coil pattern formed by the conductive material,
A magnetic material disposed in the dielectric layer. Form a coil pattern on the surface of the dielectric layer,
By arranging the magnetic material in the dielectric layer near it,
The L value (inductance) of the inductor can be improved. In addition, a large-capacity capacitor can be formed by forming the dielectric layer with a material having a high dielectric constant. Thus, it is possible to provide a high-performance and thin circuit-component-embedded substrate in which a high-performance inductor and a capacitor are formed on the surface of a common dielectric layer without laminating different materials.

In the above-mentioned first circuit component built-in substrate,
It is preferable that the conductive material is disposed on both surfaces of the dielectric layer, and further includes a via for electrically connecting the conductive material on the both surfaces. Thereby, the number of turns of the coil can be increased, and the L value can be improved. Further, formation of a complicated wiring pattern becomes easy, and it is possible to cope with high density.

A second circuit component built-in substrate according to the present invention is characterized in that a dielectric layer and a conductive material arranged in a predetermined pattern on at least one surface of the dielectric layer so that at least a coil pattern and a capacitor electrode are formed. And near the coil pattern formed by the conductive material,
A magnetic body disposed in the dielectric layer, an insulating layer laminated on at least one side of the dielectric layer, a wiring pattern formed on at least one side of the insulating layer, and the conductive layer on the dielectric layer. A via formed in the dielectric layer and / or the insulating layer so as to electrically connect the conductive material and the wiring pattern on the insulating layer. Accordingly, a high-performance inductor and capacitor can be added to the existing wiring board without laminating different kinds of materials, and a high-performance and thin circuit component built-in substrate can be provided.

[0010] In the circuit component built-in board of the present invention,
A first layer in which two or more layers of the dielectric layer are continuously stacked with the conductive material interposed therebetween, and a plurality of coil patterns of the conductive material sandwiching the dielectric layer are electrically connected; It is preferable to further include a via and a second via electrically connecting the plurality of capacitor electrodes made of the conductive material with the dielectric layer interposed therebetween. With the first via, the coil can be multilayered, the number of turns of the coil can be increased, and the L value of the inductor can be increased. In addition, the second via allows the capacitor to be multilayered, and can increase the capacitance value of the capacitor. As a result, it is possible to provide a circuit component built-in substrate having improved characteristics of the inductor and the capacitor.

In the circuit component built-in board of the present invention,
The conductive material may be further arranged to form a wiring pattern. Thereby, the desired circuit can be
It can be formed simultaneously with the formation of the coil pattern and the capacitor electrode.

Further, in the circuit component built-in board of the present invention, the magnetic body can be arranged inside the coil pattern. By arranging the magnetic material inside the coil through which the magnetic flux passes, the characteristics of the inductor can be efficiently improved.

Alternatively, the magnetic material can be arranged inside and outside the coil pattern. As a result, the magnetic circuit formed by the magnetic material becomes a substantially closed circuit, and the characteristics of the inductor can be efficiently improved.

In the circuit component built-in board of the present invention,
Preferably, the magnetic body is a solid magnetic body arranged by being embedded in the dielectric layer. Thereby, a solid magnetic material having a high magnetic permeability can be used, and the L value of the inductor can be improved.

Alternatively, the magnetic material may be composed of a mixture of a magnetic material powder and a resin. By appropriately selecting the magnetic powder, the DC superimposition characteristics and high frequency characteristics of the inductor can be changed, and the optimum design of the inductor according to the application can be facilitated.

In this case, it is preferable that the magnetic substance powder is a soft magnetic substance. This makes it possible to form a magnetic body that is hardly magnetized even when a magnetic field is applied.

In the circuit component built-in board of the present invention,
The dielectric layer is preferably made of at least one of a resin, a ceramic, and a mixture containing a filler and a resin. When a ceramic having a high dielectric constant and Q is used as the dielectric layer material, a high-performance capacitor can be formed. When resin is used, molding and processing become easy. When a mixture of a filler and a resin is used, both the characteristics of a ceramic having a high dielectric constant and Q and the characteristics of a resin having good moldability and workability can be used.

In this case, the resin is an epoxy resin, a phenol resin, a fluororesin, a cyanate resin,
PPO resin (polyphenylene oxide) and PPE
It is preferable to include at least one resin selected from resins (polyphenylene ether). Thereby, heat resistance, electrical insulation, high frequency characteristics, and the like can be improved.

Preferably, the filler contains a lead-based ceramic or a barium titanate-based ceramic. Thereby, the high dielectric constant and Q of the lead-based ceramic and the barium titanate-based ceramic can be used, and a high-performance capacitor can be manufactured.

In the circuit component built-in board of the present invention,
It is preferable that the conductive material comprises at least one of a metal foil, a lead frame, and a conductive resin composition. This makes it possible to easily form a desired pattern with fine and low electrical resistance.

In the circuit component built-in board of the present invention,
The insulating layer is preferably made of at least one of a resin, a ceramic, and a mixture containing a filler and a resin. When a ceramic having a high dielectric constant and Q is used as the insulating layer material, a high-performance capacitor can be formed. When resin is used, molding and processing become easy.
When a mixture of filler and resin is used, high dielectric constant and Q
Both characteristics of a ceramic having the above characteristics and characteristics of a resin having good moldability and workability can be utilized.

In this case, the resin is an epoxy resin, a phenol resin, a fluororesin, a cyanate resin,
It is preferable to include at least one resin selected from a PPO resin and a PPE resin. Due to this, heat resistance,
Electrical insulation, high frequency characteristics, and the like can be improved.

It is preferable that the filler contains at least one selected from alumina, magnesia, boron nitride, aluminum nitride, silicon nitride, fluororesin, and silica. Thereby, an insulating layer (electrically insulating substrate) having excellent heat dissipation properties can be obtained. Also, when alumina is used as the filler, cost reduction can be achieved. When magnesia is used as the filler, the coefficient of linear expansion of the insulating layer can be increased. When boron nitride, aluminum nitride, or silicon nitride is used as the filler, the coefficient of linear expansion of the insulating layer can be reduced. When silica or a fluorine-based resin (for example, “Teflon” (registered trademark)) is used as the filler, the dielectric constant of the insulating layer can be reduced.

Next, in a first method of manufacturing a circuit component built-in board according to the present invention, a conductive material is arranged on at least one surface of a dielectric layer in a predetermined pattern such that at least a coil pattern and a capacitor electrode are formed. A step of arranging a magnetic body in the dielectric layer and near the coil pattern, and a step of molding the dielectric layer. Thereby, the first of the present invention is achieved.
Can be manufactured.

A second method of manufacturing a circuit component built-in substrate according to the present invention includes a step of arranging a conductive material on at least one surface of a dielectric layer in a predetermined pattern so that at least a coil pattern and a capacitor electrode are formed; A step of disposing a magnetic substance in the dielectric layer and near the coil pattern, and a step of laminating two or more dielectric layers,
Forming the stacked dielectric layers. Thereby, the circuit component built-in substrate of the present invention, in which two or more dielectric layers are continuously stacked, can be manufactured.

It is preferable that the first and second manufacturing methods further include a step of forming a through hole in the dielectric layer and a step of filling the through hole with a conductive substance. Thus, the circuit component-embedded substrate of the present invention having vias can be manufactured.

In the first and second manufacturing methods, a step of forming a wiring pattern on at least one surface of the insulating layer; a step of forming a through hole in the insulating layer; It is preferable that the method further includes a step of filling, a step of laminating the insulating layer and the dielectric layer, and a step of forming the insulating layer. Thereby, the circuit component built-in substrate of the present invention, which is laminated on the existing wiring board, can be manufactured.

In the step of disposing the conductive material,
Further, it is preferable to dispose the conductive material so that a wiring pattern is formed. Thereby, a desired circuit can be formed simultaneously with the formation of the coil pattern and the capacitor electrode.

Further, the step of disposing the conductive material comprises:
Preferably, the method includes at least one step of bonding a metal foil, embedding a lead frame, and printing a conductive resin composition. As a result, a circuit component built-in substrate suitable for miniaturization and large current can be manufactured.

It is preferable that the step of disposing the magnetic material includes at least one of embedding a solid magnetic material and filling a mixture of a magnetic powder and a resin. Thereby, the magnetic body can be easily arranged in the dielectric layer.

Preferably, the step of forming the dielectric layer and the insulating layer includes at least one step of sintering a ceramic, curing a resin, and curing a mixture containing a filler and a resin. Thereby, the dielectric layer and / or
Alternatively, the insulating layers can be easily stacked in multiple layers.

[0032]

Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment 1) FIG. 1 is a perspective view of a circuit component built-in board according to Embodiment 1 of the present invention. The circuit component built-in substrate according to the first embodiment includes a dielectric layer 101 and a coil pattern 10 formed by disposing a conductive material on at least one surface of the dielectric layer 101 in a predetermined pattern.
2. Capacitor electrode 103 and wiring pattern 104
And a magnetic body 105 built in the dielectric layer 101.

The dielectric layer 101 is made of, for example, ceramic,
Resin or a mixture of a filler and a resin can be used.

When ceramic is used, a high-performance capacitor can be formed by utilizing the high dielectric constant and Q of ceramic.

When a resin is used, molding and processing become easy.

When a mixture of a filler and an insulating resin is used, both the characteristics of a ceramic having a high dielectric constant and Q and the characteristics of a resin having good moldability and workability can be used. By using, for example, a lead-based ceramic or a barium titanate-based ceramic used as a capacitor material as the filler material, the capacitance value of the capacitor can be increased. As the insulating resin, a thermosetting resin or a photocurable resin can be used. For example, by using an epoxy resin, a phenol resin, or a cyanate resin having high heat resistance, the dielectric layer 10
1 can be improved in heat resistance. In addition, by using a resin containing a low dielectric loss tangent such as a fluorine resin, a PTFE resin (polytetrafluoroethylene), a PPO resin, a resin containing a PPE resin, or a resin obtained by modifying the resin, the high-frequency characteristics of the dielectric layer 101 are improved. I do. It may further contain a dispersant, a colorant, a coupling agent or a release agent. The filler in the insulating resin can be uniformly dispersed by the dispersant. Depending on the colorant,
Since the dielectric layer can be colored, the heat dissipation of the circuit component built-in substrate can be improved. By the coupling agent, the adhesive strength between the insulating resin and the filler can be increased, so that the insulating property of the dielectric layer can be improved. In addition, since the release agent can improve the releasability of the mold and the mixture, the productivity can be improved.

Coil pattern 102, capacitor electrode 1
03 and the wiring pattern 104 are formed by disposing a conductive material in a predetermined pattern on at least one surface of the dielectric layer 101.

As the conductive material, for example, metal foil,
Plating, a conductive resin composition, a lead frame obtained by processing a metal plate, or the like can be used.

When a metal foil or a lead frame is used, a fine pattern can be easily formed by etching or the like. When a metal foil is used, the metal foil is laminated on a release film (transfer carrier), the metal foil is formed in a predetermined pattern by etching or the like, and then the metal foil is transferred onto a dielectric layer. preferable. Forming a fine pattern on the release film facilitates handling of the patterned metal foil. As the metal foil, a copper foil is preferable because it is inexpensive and has high electric conductivity.

When a conductive resin composition is used as the conductive material, a desired pattern can be easily formed by screen printing or the like. In addition, the conductive resin composition can be reduced in resistance by heating after application to eliminate the resin component. As a conductive component in the conductive resin composition,
By using a metal powder such as gold, silver, copper, nickel or the like or a carbon powder, a pattern having a low electric resistance can be obtained. Further, when the resin component contains at least one thermosetting resin selected from an epoxy resin, a phenol resin and a cyanate resin, the heat resistance can be improved.

When a lead frame is used as the conductive material, a thick metal having low electric resistance can be used. A fine pattern can be formed by etching the lead frame. Alternatively, a predetermined pattern can be formed on the lead frame by a simple manufacturing method such as punching. By forming the predetermined patterns so that they are connected at the outer peripheral portion of the lead frame, a plurality of patterns can be handled integrally.

By plating the surfaces of the formed coil pattern 102, capacitor electrode 103, and wiring pattern 104, corrosion resistance and electric conductivity can be improved. In addition, by roughening the contact surface with the dielectric layer 101, the adhesiveness can be improved.

The above conductive material is formed on the surface of the dielectric layer 101 by the coil pattern 102 and the capacitor electrode 10.
3 and the wiring pattern 104 are arranged in a predetermined pattern.

The coil pattern 102 functions as an inductor. The capacitor electrode 103 functions as a conductor. Therefore, the capacitor electrode 103 is connected to the dielectric layer 10
1 are formed to face each other. Wiring pattern 104
Has a function of appropriately connecting the coil pattern 102 on the dielectric layer 101, the capacitor electrode 103, and furthermore, the mounted components and the like (not shown).

The magnetic body 105 is arranged near the coil pattern 102 so as to be embedded in the dielectric layer 101. By arranging it near the coil pattern 102, the characteristics of the inductor are improved. Also, the dielectric layer 10
1, the capacitor portion and the inductor portion are formed of the same material (dielectric layer 101).
High inductor characteristics can be obtained. As the magnetic material 105, a solid magnetic material or a mixture of a magnetic powder and a resin can be used. As the magnetic material 105, a soft magnetic material is preferable because it is not magnetized. When a magnetic material having a high saturation magnetic flux density, for example, an iron-based magnetic material is used as the magnetic material 105, a large current can easily flow and the number of turns of the coil can be easily increased. When a magnetic material having a high magnetic permeability is used, a high inductance can be obtained even with a small number of turns. When a magnetic material having good high-frequency characteristics such as a YIG system is used, the high-frequency characteristics of the inductor are improved.

As described above, according to the circuit component built-in substrate of the present embodiment, the coil pattern 102 is formed on the surface of the dielectric layer 101, and the magnetic material 10 is formed in the dielectric layer near the coil pattern 102.
By disposing 5, the L value of the inductor can be improved. In addition, a large-capacity capacitor can be formed by forming the dielectric layer 101 with a material having a high dielectric constant. Thus, it is possible to provide a high-performance and thin circuit-component-embedded substrate in which a high-performance inductor and a capacitor are formed on the surface of a common dielectric layer without laminating different materials.

(Embodiment 2) In Embodiment 2, an embodiment of a method of manufacturing the circuit component built-in substrate shown in FIG. 1 will be described. The materials used in the second embodiment are the same as those described in the first embodiment.

FIGS. 2A to 2D are cross-sectional views sequentially showing the steps of manufacturing the circuit component built-in substrate according to the second embodiment.

First, as shown in FIG. 2A, a conductive material is arranged on a transfer carrier 206 in a desired pattern, and a coil pattern 202, a capacitor electrode 203,
And a wiring pattern 204 are formed.

As the transfer carrier 206, besides a resin film such as PET (polyethylene terephthalate) or PPS (polyphenylene sulphite), a metal foil such as a copper foil or an aluminum foil can be used. Further, a metal foil can be used as the conductive material. By using the transfer carrier 206, the coil pattern 202,
Handling of the capacitor electrode 203 and the wiring pattern 204 becomes easy. Further, on the surface of the transfer carrier 206,
There may be an adhesive layer for holding the coil pattern 202, the capacitor electrode 203, and the wiring pattern 204.
Further, on the surface of the transfer carrier 206, there may be provided a peeling layer for facilitating the peeling of the coil pattern 202, the capacitor electrode 203, and the wiring pattern 204.

After a conductive material is formed in a predetermined pattern on the transfer carrier 206, the conductive material is transferred to the dielectric layer 201, so that the coil pattern 20 is formed on the dielectric layer 201.
2. The capacitor electrode 203 and the wiring pattern 204 can be formed.

In addition to the formation by transfer, a method such as etching, printing and plating may be used. In particular, in the formation by etching and plating, a method of forming a fine pattern such as a photolithography method can be used. Further, after printing the conductive resin, the resistance can be reduced by heating and eliminating the resin component.

Next, as shown in FIG. 2B, a coil pattern 202 and a capacitor electrode 20 are formed using a conductive material.
3. a carrier 206 on which a wiring pattern 204 is formed;
The dielectric layer 201, the magnetic body 205, and the carrier 206 on which the capacitor electrode 203 is formed using a conductive material are aligned and laminated. By laminating the dielectric layers 201 in a flexible state, the magnetic substance 205 can be arranged inside the dielectric layers 201. As a flexible dielectric, green sheet ceramic, resin before curing,
In addition, a mixture of a filler and a resin can be used. As a method for obtaining the sheet-like dielectric layer 201, there is a method of producing a paste-like dielectric and processing it on a film by a doctor blade method or the like. A solvent may be added to the paste-like dielectric to adjust the viscosity.
Moreover, the adhesiveness of the dielectric layer 201 can be reduced by heating and drying at a temperature lower than the sintering temperature or the curing temperature. This heat treatment lowers the adhesiveness of the dielectric, thereby facilitating peeling from the film and improving the handleability.

As a method of embedding the solid magnetic material 204 in the dielectric layer 201, in addition to the embedding, the dielectric layer 2
No. 01, a through-hole is formed and a magnetic substance 204 is inserted therein, or a mixture of a magnetic powder and a resin is used instead of a solid magnetic substance to form a through-hole. A method of filling the inside may be used.

After the lamination, pressure is applied to integrate and form as shown in FIG. 2 (C). Pressing or laminating can be used as a method for applying pressure. When ceramic is used as the material of the dielectric layer 201, it can be molded by sintering, and when a resin or a mixture of a resin and a filler is used, it can be molded by curing. By performing the sintering or curing while applying pressure, the mechanical strength of the circuit component built-in substrate can be improved.

After the molding, the transfer carrier 206 is peeled off as shown in FIG. Thus, a circuit component built-in substrate similar to that described in the first embodiment is obtained.

(Third Embodiment) A third embodiment of the present invention will be described with reference to the drawings. FIG. 3 shows the third embodiment.
FIG. 3 is a cross-sectional view of the circuit component built-in substrate in FIG. Materials used in the third embodiment are the same as those described in the first and second embodiments unless otherwise specified.

The substrate with a built-in circuit component according to the third embodiment includes a dielectric layer 301, a coil pattern 302, a capacitor electrode 303, a wiring pattern 304, and a magnetic material 305.
And a via 307.

The coil pattern 302, the capacitor electrode 303, and the wiring pattern 304 are formed in a predetermined pattern on both planes of the dielectric layer 301 using a conductive material.

The coil pattern 302 is formed of the dielectric layer 301
And functions as an inductor. The coil patterns 302 on both surfaces are connected by vias 307 having electrical conductivity, so that the number of turns can be increased. By increasing the number of turns, L
Value can be increased.

Similarly, the wiring patterns 304 on both surfaces of the dielectric layer 301 are connected by vias 307. Thereby, a complicated wiring circuit can be formed, and high-density mounting can be realized.

The via 307 has electrical conductivity and has a function of connecting the coil pattern 302, the capacitor electrode 303, and the wiring pattern 304 to each other between the front and back of the dielectric layer 301 as necessary. The via 307 is made of, for example, a thermosetting conductive material. As the thermosetting conductive substance, for example, a conductive resin composition obtained by mixing metal particles and a thermosetting resin can be used. As the metal particles, gold, silver, copper, nickel, or the like can be used. Gold, silver, copper or nickel is preferable because of high conductivity, and copper is particularly preferable because of high conductivity and low migration. When using metal particles coated with copper with silver,
The characteristics of both low migration and high conductivity can be satisfied. As the thermosetting resin, for example, an epoxy resin, a phenol resin or a cyanate resin can be used. Epoxy resins are particularly preferred because of their high heat resistance. Alternatively, a via 307 having a similar electric connection function can be obtained by plating or baking a metal instead of a thermosetting conductive substance.

Circuit-Component-Containing Substrate 300 of Third Embodiment
According to the present invention, a high-performance inductor having a high L value and a capacitor can be formed on the same dielectric, and a circuit board suitable for thinning and high-density mounting can be provided.

(Embodiment 4) In Embodiment 4, an embodiment of a method of manufacturing the circuit component built-in substrate shown in FIG. 3 will be described with reference to the drawings.

The method of manufacturing a circuit component built-in substrate according to the fourth embodiment is directed to a method of manufacturing a via 40 for connecting front and back conductive materials.
Except for forming No. 7, it is the same as the manufacturing method of the second embodiment described above. Therefore, in the present embodiment, components that are not particularly described are the same as those in Embodiments 1 to 3, and the components and manufacturing methods having the same names have the same functions unless otherwise described.

FIGS. 4A to 4D are sectional views sequentially showing the steps of manufacturing the circuit component built-in substrate according to the fourth embodiment.

First, as shown in FIG. 4A, through holes (holes) 408 are formed at predetermined positions of the dielectric layer 401. The through hole 408 can be formed by, for example, laser processing, drill processing, punching processing, or the like. Laser processing is desirable because the through holes 408 can be formed at a fine pitch and no shavings are generated. In the case of laser processing, a carbon dioxide laser, a YAG laser, an excimer laser, or the like can be used. In the case of drilling and punching, the through-hole 408 can be easily formed by using existing versatile equipment.
In the present embodiment, at the time of forming the through hole 408 for a via,
A through hole 408 for embedding the magnetic material is also processed.

In order to form a via for electrically connecting the front and back of the dielectric layer 401, it is necessary to impart electric conductivity to the through hole 408. As a method for this, as shown in FIG. 4B, there is a method of filling a via paste 407 into the through hole 408. As the via paste 407, a mixture of a conductive powder and a resin can be used. Here, as the conductive powder, for example, metal powder such as gold, silver, copper, nickel or the like or carbon powder can be used. The use of copper is desirable because of its high conductivity and little migratory ash. Alternatively, conductive powder obtained by coating powder with copper may be used. As the resin, a thermosetting resin or a photocurable resin can be used. As the thermosetting resin, for example, epoxy resin, phenol resin, cyanate resin, polyphenylene ether and the like can be used.
Epoxy resins are particularly desirable because of their high heat resistance. Through hole 40
As a method for filling the via paste into 8, a method by printing or injection can be used. Particularly in the case of printing, formation of a wiring pattern can also be performed.

In this embodiment, the solid magnetic material 405 is embedded in the through hole.

Next, as shown in FIG. 4C, a coil pattern 4 is formed on both surfaces of the dielectric layer 401 using a conductive material.
02, a capacitor electrode 403, and a wiring pattern 404 are formed in a predetermined pattern. In the present embodiment, the conductive resin is formed by printing.

Finally, the dielectric layer 401 is formed. In the present embodiment, ceramic is used as the material of the dielectric layer 401, and the via paste 407 filled in the through hole 408 and the conductive material printed on the front and back of the dielectric layer 401 when the ceramic clean sheet is sintered. Are cured together.

Thus, a circuit component built-in substrate similar to that shown in the third embodiment can be formed.

The use of the via 407 allows the dielectric layer 40
1, the coil pattern 402 on the front and back, the capacitor electrode 40
Third, the wiring patterns 404 can be appropriately connected.

In the above example, the number of wiring layers is two, but the number of layers is not limited. For example, the dielectric layer 401 shown in FIG. 4B is laminated on at least one surface of the dielectric layer 401 shown in FIG. 4C, and a coil pattern, a capacitor electrode, The wiring pattern can be formed in a predetermined pattern. Further, this operation may be repeated as necessary. By doing so, the wiring layer in which the dielectric layer is made of a conductive material (the layer on which the coil pattern, the capacitor electrode, and the wiring pattern are formed)
, A multi-layer circuit component built-in substrate that is continuously laminated by a predetermined number of layers can be obtained.

As a method of forming the via 407, a method of obtaining electrical connection by plating the inside of the through hole 408 can be used in addition to a method of filling the via hole 408 with a via paste.

Embodiment 5 Hereinafter, a circuit component built-in substrate according to Embodiment 5 of the present invention and a method for manufacturing the same will be described with reference to the drawings. The substrate with a built-in circuit component of the fifth embodiment is the same as the first to fourth embodiments except that the insulating layer 510 is laminated on the dielectric layer 501. Therefore, in the present embodiment, components that are not particularly described are the same as those in Embodiments 1 to 4, and components and manufacturing methods having the same names have the same functions unless otherwise described.

FIGS. 5A to 5E are sectional views sequentially showing the steps of manufacturing the circuit component built-in substrate according to the fifth embodiment.

First, as shown in FIG. 5A, a copper foil 511 is laminated on both main planes of the electric insulating layer 510. Insulating layer 5
As 10, the same one as the flexible dielectric layer 201 described in FIG. 2B of Embodiment 2 can be used. Then, by laminating and compressing the copper foil 511 on both surfaces of the insulating layer 510, the insulating layer 510 is formed and the insulating layer 510 and the copper foil 511 are integrated. The method for forming the insulating layer 510 can be the same as the method for forming the dielectric layer 201 described in Embodiment 2, depending on the material of the insulating layer.

The method of forming the copper foil 511 is, in addition to the method described above, using the transfer carrier described in the second embodiment, forming by printing, forming by plating, and bonding the copper foil with an adhesive. There is a method. Further, the insulating layer itself may have adhesiveness.

When a mixture containing a filler and a resin is used as the material of the insulating layer 510, unlike the dielectric layer, the filler may be alumina, magnesia,
At least one selected from boron nitride, aluminum nitride, silicon nitride, a fluorine-based resin, and silica can be used. By appropriately selecting the filler type, the heat dissipation, the coefficient of linear expansion, the dielectric constant, the cost, and the like of the insulating layer 510 can be optimally designed according to the application.

Next, as shown in FIG.
A through hole 518 is formed in the copper foil 10 and the copper foil 511. The method of forming the through hole 518 can be the same as the method of forming the through hole 408 in Embodiment 4.

After forming the through hole 518, plating is performed to form a via 517 in the through hole 518. Thereafter, the copper foils 511 on both sides are etched into a predetermined pattern to form a coil pattern 502 and a capacitor electrode 503 on one side, and a wiring pattern 514 on the other side (FIG. 5C).

The method of forming the via 517 is not limited to the plating method described above, and the via 517 described in the third embodiment may be used.
7 can be applied. Further, the method of forming the coil pattern 502, the capacitor electrode 503, and the wiring pattern 514 is not limited to the above, and the second embodiment is also applicable.
The method for forming the coil pattern, the capacitor electrode, and the wiring pattern described in (1) can be applied. In that case, the same effect as that described in the second embodiment can be obtained.

Next, as shown in FIG. 5D, on the surface of the insulating layer 510 obtained as described above on which the coil pattern 502 and the capacitor electrode 503 are formed, a magnetic body 505 is disposed inside, and a via hole is formed. Dielectric layer 50 on which 507 is formed
1 and a coil pattern 502 using a conductive material on one side.
Carrier 50 on which capacitor electrode 503 is formed
6 and are laminated.

After lamination, the dielectric layer 501 is formed, and the transfer carrier 506 is peeled off (FIG. 5D). Thus, the circuit component built-in substrate according to the present embodiment is obtained.

According to the present embodiment, a high-performance inductor and capacitor can be added to an existing insulating layer (electrically insulating substrate) having a wiring pattern, and a circuit board suitable for thinning can be provided.

Embodiment 6 Hereinafter, a circuit component built-in substrate according to Embodiment 6 of the present invention will be described with reference to the drawings. The circuit component-embedded substrate according to the sixth embodiment includes a dielectric layer 6
The fifth embodiment is the same as the fifth embodiment except that the first layer and the insulating layer 610 are multilayered. Therefore, in the present embodiment, components that are not particularly described are the same as those in Embodiments 1 to 5, and components having the same names have the same functions unless otherwise described.

In the circuit component built-in substrate according to the embodiment of the present invention, two or more dielectric layers 601 (five layers in FIG. 6) are continuously laminated. A coil pattern 602 and a capacitor electrode 603 are formed between the dielectric layers 601 by disposing a conductive material in a predetermined pattern. A magnetic body 605 is arranged near the coil pattern 602. Further, a via 607 is provided in each dielectric layer 601.
Is formed, and the coil pattern 6 sandwiching the dielectric layer 601 is formed.
02 and the capacitor electrodes 603 are appropriately connected. Thus, the dielectric layer 6 with the via 607
By continuously laminating 01, the coil pattern 602 and the capacitor electrode 603 formed on the dielectric 601 of each layer can also be multilayered. By increasing the number of inductors, the number of turns can be increased, and the L value can be increased. The capacitance value can be increased by forming a multilayered capacitor. Although not shown in FIG. 6, a wiring pattern may be further formed between the dielectric layers 601.

In the circuit component built-in board according to the present embodiment, two or more insulating layers 610 (two layers in FIG. 6) are continuously laminated. By arranging a conductive material in a predetermined pattern between the insulating layers 610, the wiring pattern 6 is formed.
14 are formed. A via 617 is provided in each insulating layer 610.
Is formed, and a wiring pattern 614 sandwiching the insulating layer 610 is formed.
Are connected as appropriate. In addition, the via 617 formed in the insulating layer 610 adjacent to the dielectric layer 601 is
1 and are appropriately connected to the coil pattern 602 and the capacitor electrode 603 formed on the surface. As described above, by forming the insulating layer 610 into multiple layers, the wiring pattern 614 is formed.
Can be multi-layered, and it is possible to cope with complicated wiring patterns.

The method for manufacturing the multilayered circuit component-embedded substrate of the present embodiment is not particularly limited. For example, the circuit board-embedded substrate (FIG. 5E) described in the fifth embodiment may be provided with a dielectric layer. And / or a process of laminating and / or compressing and molding an insulating layer and repeating the process.

[0092]

As described above, according to the circuit component built-in substrate of the present invention, the coil pattern is formed on the surface of the dielectric layer, and the magnetic substance is disposed in the dielectric layer near the coil pattern. The L value of the inductor can be improved. In addition, a large-capacity capacitor can be formed by forming the dielectric layer with a material having a high dielectric constant. Thus, it is possible to provide a high-performance and thin circuit-component-embedded substrate in which a high-performance inductor and a capacitor are formed on the surface of a common dielectric layer without laminating different materials.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a schematic configuration of a circuit component built-in substrate according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view illustrating a method for manufacturing a circuit component embedded substrate according to a second embodiment of the present invention in the order of steps.

FIG. 3 is a sectional view of a circuit component built-in substrate according to a third embodiment of the present invention.

FIG. 4 is a sectional view illustrating a method of manufacturing a circuit component embedded substrate according to a fourth embodiment of the present invention in the order of steps.

FIG. 5 is a sectional view illustrating a method of manufacturing a circuit component embedded substrate according to a fifth embodiment of the present invention in the order of steps.

FIG. 6 is a sectional view of a circuit component built-in substrate according to a sixth embodiment of the present invention.

[Explanation of symbols]

101, 201, 301, 401, 501, 601
Dielectric layer 102, 202, 302, 402, 502, 602
Coil pattern 103, 203, 303, 403, 503, 603
Capacitor electrodes 104, 204, 304, 404, 514, 614
Wiring pattern 105, 205, 305, 405, 505, 605
Magnetic material 206, 506 Transfer carrier 307, 407, 507, 517, 607, 617
Via 408, 518 Through hole (hole) 510, 610 Insulating layer 511 Copper foil

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 3/46 H01F 15/00 D H01G 4/06 101 (72) Inventor Shingo Komatsu Kadoma, Osaka Pref. 1006, Kadoma Matsushita Electric Industrial Co., Ltd. F term (reference) 4E351 AA02 AA03 AA04 AA05 AA07 BB01 BB03 BB11 BB13 BB24 BB26 BB30 BB31 BB35 BB49 CC05 CC11 CC18 DD01 DD50 GG06 5E062 DD01 5E070 AA01 AB01 BA11 CB01 CB17 5E08A 03 EB17 A03 A03 EA AA23 AA33 AA36 AA43 CC08 CC09 CC13 CC14 CC16 CC21 DD01 DD07 DD31 FF18 GG15 GG19 HH01 HH24

Claims (26)

[Claims] 1. A dielectric layer, a conductive material disposed in a predetermined pattern on at least one surface of the dielectric layer such that at least a coil pattern and a capacitor electrode are formed, and a conductive material formed by the conductive material. A circuit component built-in substrate, comprising: a magnetic body disposed in the dielectric layer, in the vicinity of the coil pattern. 2. The circuit component built-in substrate according to claim 1, wherein the conductive material is disposed on both surfaces of the dielectric layer, and further includes a via for electrically connecting the conductive materials on the both surfaces. . 3. A dielectric layer, a conductive material disposed in a predetermined pattern on at least one surface of the dielectric layer so that at least a coil pattern and a capacitor electrode are formed, and a conductive material formed of the conductive material. In the vicinity of the coil pattern, a magnetic material disposed in the dielectric layer, an insulating layer laminated on at least one surface of the dielectric layer, a wiring pattern formed on at least one surface of the insulating layer, Having a via formed in the dielectric layer and / or the insulating layer so as to electrically connect between the conductive material on the dielectric layer and the wiring pattern on the insulating layer. A circuit component built-in substrate characterized by the following. 4. The method according to claim 1, wherein two or more of the dielectric layers are continuously stacked with the conductive material interposed therebetween, and a plurality of coil patterns of the conductive material sandwiching the dielectric layer are electrically connected. The circuit component according to claim 1, further comprising: a first via to be connected; and a second via to electrically connect the plurality of capacitor electrodes made of the conductive material sandwiching the dielectric layer. Built-in board. 5. The circuit component built-in substrate according to claim 1, wherein said conductive material is further arranged to form a wiring pattern. 6. The circuit component built-in substrate according to claim 1, wherein said magnetic body is disposed inside said coil pattern. 7. The circuit component built-in substrate according to claim 1, wherein said magnetic material is disposed inside and outside said coil pattern. 8. The magnetic material according to claim 1, wherein the magnetic material is a solid magnetic material arranged by being embedded in the dielectric layer.
The circuit component built-in substrate according to any one of the above. 9. The circuit component built-in substrate according to claim 1, wherein said magnetic material is made of a mixture of a magnetic material powder and a resin. 10. The circuit component built-in substrate according to claim 9, wherein the magnetic substance powder is a soft magnetic substance. 11. The dielectric layer is made of resin, ceramic,
The circuit component built-in substrate according to any one of claims 1 to 5, comprising at least one of a mixture containing a filler and a resin. 12. The circuit component built-in board according to claim 11, wherein the resin includes at least one resin selected from an epoxy resin, a phenol resin, a fluorine resin, a cyanate resin, a PPO resin, and a PPE resin. 13. The circuit component built-in substrate according to claim 11, wherein the filler includes a lead-based ceramic or a barium titanate-based ceramic. 14. The circuit component built-in substrate according to claim 1, wherein said conductive material comprises at least one of a metal foil, a lead frame, and a conductive resin composition. 15. The circuit component built-in substrate according to claim 3, wherein the insulating layer is made of at least one of a resin, a ceramic, and a mixture containing a filler and a resin. 16. The circuit component built-in board according to claim 15, wherein the resin includes at least one resin selected from an epoxy resin, a phenol resin, a fluorine resin, a cyanate resin, a PPO resin, and a PPE resin. 17. The circuit component built-in substrate according to claim 15, wherein the filler includes at least one selected from alumina, magnesia, boron nitride, aluminum nitride, silicon nitride, a fluororesin, and silica. 18. A step of disposing a conductive material in a predetermined pattern on at least one surface of a dielectric layer so that at least a coil pattern and a capacitor electrode are formed; A method for manufacturing a circuit component built-in board, comprising: a step of disposing a magnetic body in the vicinity; and a step of forming the dielectric layer. 19. A step of arranging a conductive material in a predetermined pattern on at least one surface of a dielectric layer so that at least a coil pattern and a capacitor electrode are formed; and A method for manufacturing a circuit component built-in board, comprising: a step of disposing a magnetic material in the vicinity; a step of laminating two or more dielectric layers; and a step of molding the laminated dielectric layer. 20. The method according to claim 18, further comprising: forming a through hole in the dielectric layer; and filling the through hole with a conductive material. 21. A step of forming a wiring pattern on at least one surface of the insulating layer; a step of forming a through hole in the insulating layer; a step of filling the through hole with a conductive substance; 21. A step of laminating the dielectric layer and a step of forming the insulating layer.
The method for producing a circuit component built-in substrate according to any one of the above. 22. The method according to claim 18, wherein in the step of disposing the conductive material, the conductive material is disposed such that a wiring pattern is further formed. 23. The method according to claim 18, wherein the step of disposing the conductive material includes at least one of bonding a metal foil, embedding a lead frame, and printing a conductive resin composition.
23. The method for manufacturing a circuit component built-in substrate according to any one of 22. 24. The method according to claim 18, wherein the step of disposing the magnetic material includes at least one of embedding a solid magnetic material and filling a mixture of a magnetic material powder and a resin. Manufacturing method for circuit board with built-in circuit components. 25. The step of forming the dielectric layer includes at least one of sintering a ceramic, curing a resin, and curing a mixture containing a filler and a resin.
23. The method for manufacturing a circuit component embedded substrate according to any one of 8 to 22. 26. The step of forming the insulating layer includes at least one of sintering a ceramic, curing a resin, and curing a mixture containing a filler and a resin.
3. The method for manufacturing a circuit component built-in substrate according to claim 1.