JP2002343950A - Fixing method, image pickup module and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a fixing method capable of preventing a spacer which controls an interval between members from entering the other region when fixing members together. SOLUTION: A protecting member 3 is placed on an image pickup element 6 on which an adhesive 5 comprising epoxy resin is applied and semi-cured under irradiation of ultraviolet ray. Then the interval and tilt are adjusted, pressed and slightly heated, which is entirely cured to provide an image pickup element module 301. An adhesive 4 containing beads 41 is applied on a part (peripheral part) of an optical member 2 where no light-shielding layer 1 is present. The image pickup element module 301 is placed on it to cure the adhesive 4. Since a step caused by the thickness of the light-shielding layer 1 is present between the beads 41 and the light-shielding layer 1, no beads 41 enter the light-shielding layer 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a fixing method for fixing members using an adhesive mixed with a spacer for controlling the interval between members, a method for manufacturing an image pickup module, and an image pickup module. .

[0002]

2. Description of the Related Art Conventionally, a liquid crystal display device as disclosed in Japanese Patent Application Laid-Open No. 08-152642 is known as one for bonding members while accurately managing the gap between the members. Generally, in a liquid crystal display device, two transparent insulating substrates made of glass or the like are overlapped at a predetermined interval so that the surface on which a display transparent pixel electrode and an alignment film or the like are laminated faces each other. By bonding the two substrates together with a sealing material provided in a frame shape at the edge of, the liquid crystal is sealed and sealed inside the sealing material between the two substrates from the liquid crystal filling port provided in a part of the sealing material Manufactured.

[0005] This assembling procedure will be described with reference to FIG. FIG. 18 is a view showing an assembling procedure of a conventional liquid crystal display device.

First, as shown in FIG. 18A, a mask (MK) having a predetermined opening is placed on a transparent glass substrate (SUB).
2) placed on top and then, as shown in FIG.
While the mask (MK) is placed on the transparent glass substrate (SUB2), a number of small spacers (SP) are sprayed from the spray nozzle (NZ). Next, as shown in FIG. 18C, a transparent glass substrate (SUB2) and a mask (M
K) with the spacer (S
P) uniformly enter the opening of the mask (MK). Then, as shown in FIG. 18D, the mask (MK) is vertically lifted and removed so that the spacer (SP) arranged on the transparent glass substrate (SUB2) does not move. From above, as shown in FIG. 18 (e), a transparent glass substrate (SUB1) is overlaid and bonded with a sealing material (SL) provided around the edge between both substrates. Thereafter, the liquid crystal is sealed through a liquid crystal sealing opening (a cutout portion of the sealing material) in a part of the sealing material (SL), and the liquid crystal sealing opening is sealed with an epoxy resin or the like. By such a procedure, the transparent glass substrates (SUB1, SUB2) can be fixed with a predetermined gap.

[0005]

However, in the above-described conventional configuration, the spacer for managing the gap is disposed at a desired location, and in some cases, the spacer invades an optically necessary portion. It may cause problems such as vignetting.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a fixing method which can prevent a spacer for controlling a space between members from invading another region before fixing members. It is in.

Another object of the present invention is to prevent a spacer for controlling the interval between members from entering a region corresponding to the optically effective portion when the members having the optically effective portion are fixed to each other. An object of the present invention is to provide a fixing method that can be prevented beforehand and a method for manufacturing an imaging module.

[0008] Still another object of the present invention is to eliminate the inconvenience caused by the intrusion of the spacer for controlling the interval between members having optically effective portions into the area corresponding to the optically effective portions. It is an object of the present invention to provide an imaging module capable of performing the above.

[0009]

According to the first aspect of the present invention,
A fixing method for fixing a first member and a second member, wherein one of the first and second members is opposed to a surface of the other member opposite to the other member. By providing a low step portion and applying an adhesive mixed with a spacer for controlling a distance between the first member and the second member to the step portion, the first member and the second member 2
The first member and the second member are fixed to each other, and the step is formed so that a step from the other portion is 20% or more of the diameter of the spacer. It is characterized by.

According to a second aspect of the present invention, in the fixing method according to the first aspect, a third member is provided on a surface of the one member facing the other member, whereby the other member of the one member is provided. The step portion is formed on a surface facing the member.

According to a third aspect of the present invention, the first member and the second member having the optically effective portion are overlapped with each other, and the light shielding member is provided on the optically effective portion and the peripheral portion on the first member. A fixing method used for a structure provided on a surface facing the second member so as to cross over, wherein an adhesive mixed with a spacer for controlling a space between the first and second members is mixed. Is applied to one of the first and second members so that the spacer faces a portion of the first member where the light blocking member is not formed, thereby providing the first member. And fixing the second member to the second member.

According to a fourth aspect of the present invention, in the fixing method according to the third aspect, the light shielding member formed on the first member is formed in a layer shape.

According to a fifth aspect of the present invention, the first member and the second member having the optically effective portion are overlapped with each other, and the light shielding member is provided on the optically effective portion and the peripheral portion on the first member. A fixing method used for a structure provided on a surface facing the second member so as to cross over, wherein a surface of one of the first and second members facing the other member is provided. A spacer-free adhesive is applied to the portion corresponding to the optically effective portion and its peripheral portion, and the first and second portions are applied to the outer peripheral portion of the portion corresponding to the optically effective portion and its peripheral portion. The first member and the second member are fixed to each other by applying an adhesive mixed with a spacer for controlling the interval between the members.

According to a sixth aspect of the present invention, in the fixing method of the fifth aspect, the light shielding member formed on the first member is formed in a layered form by printing.

According to a seventh aspect of the present invention, there is provided an image pickup module having a structure in which an optical member, a protection member, and an image sensor are laminated, and a light shielding member is formed on a surface of the optical member facing the protection member. In a manufacturing method, an adhesive mixed with a spacer for controlling a distance between the optical member and the protective member is coated with an adhesive mixed with the light shielding member on a surface of the optical member facing the protective member. The optical member and the protection member are fixed by applying to one of the optical member and the protection member so as to face the non-formed portion.

The invention according to an eighth aspect of the present invention is directed to an image pickup module having a structure in which an optical member, a protection member and an image pickup element are laminated, and a light shielding member is formed on a surface of the optical member facing the protection member. The manufacturing method, wherein a spacer for managing an interval between the optical member and the protective member is arranged so that the spacer opposes a portion where the light shielding member is not formed on a surface of the optical member facing the protective member. By disposing an adhesive on one of the members and the protective member so as to include a spacer disposed on one of the members, the optical member and It is characterized in that the protection member is fixed to the protection member.

According to a ninth aspect of the present invention, an optical member having an optically effective portion, a protective member having an optically effective portion, and an image pickup element are laminated, and a light-shielding member is provided in the optical member and the protective member. A manufacturing method of an imaging module formed on an opposing surface of the optical member so as to extend over an optically effective portion of the optical member and a peripheral portion thereof, wherein the optical member and the protection member are one member of the other member. A spacer-free adhesive is applied to a portion corresponding to the optically effective portion and a peripheral portion thereof on a surface facing the same, and the spacer-free adhesive is applied on a surface of the one member facing the other member. By applying an adhesive mixed with a spacer for controlling the interval between the optical member and the protective member to the outer peripheral portion of the portion where is applied, the optical member and the protective member are Characterized in that it wears.

According to a tenth aspect of the present invention, there is provided an imaging module, which is manufactured by the imaging module manufacturing method according to the seventh aspect.

An eleventh aspect of the present invention is an imaging module, characterized by being manufactured by the imaging module manufacturing method of the eighth aspect.

According to a twelfth aspect of the present invention, there is provided an imaging module, which is manufactured by the imaging module manufacturing method according to the ninth aspect.

[0021]

Embodiments of the present invention will be described below with reference to the drawings.

In the present embodiment, a description will be given of a case where members are fixed to each other in an image pickup device using an adhesive mixed with a spacer for controlling the interval between the members.

First, in order to clarify the features of the image pickup device described in the present embodiment, a commonly used image pickup device will be described with reference to FIGS. 15 is a diagram schematically showing the configuration of a main part of the imaging device, FIG. 16 is a cross-sectional view showing a pixel of the imaging device 61 in FIG. 15, and FIG. 17 is a plan view showing a pixel array structure in the imaging device in FIG. .

In the image pickup apparatus, as shown in FIG.
An image can be obtained by forming an image on the upper side and capturing the image by the image sensor 61.

As shown in FIG. 16, the image pickup element 61 has a color filter 71 formed after a photoelectric conversion portion 64 and a wiring portion 63 are formed on a silicon wafer.

Here, the color filters 71 of the three colors RGB are used.
Can be formed by a method called a photoresist method using a photosensitive resin dyed to have a predetermined spectral characteristic. First, a red-colored photosensitive resin is applied thinly and uniformly, and a light beam is irradiated from above by masking a portion where a red filter is unnecessary. As a result, the part irradiated with the light beam is cured, and the masked part is not cured. Then, by removing the uncured portion by washing, a red filter can be formed at a predetermined position. Next, a transparent resin is applied and buried in a portion from which the red photosensitive resin has been removed. This is a process called flattening. Similarly, a green filter is formed on red and a blue filter is formed on green.

The micro lens 62 is formed on the color filter 71 formed by such a method by a photoresist method. In the imaging device 61 having such a configuration, since the color filter 71 exists between the microlens 62 and the photoelectric conversion unit 64, the photoelectric conversion unit 64 is located at a position very deep from the microlens 62. The outermost light beam incident on the photoelectric conversion unit 64 in this case is indicated by a broken line.

Further, as shown in FIG. 17, the image sensor 61 has an image pickup area in which pixels of red, green and blue are regularly arranged. In this imaging area, the first green pixel 61 mng and the blue pixel 6
1mnb, a red pixel 61mnr, and a second green pixel 61mng2 are provided, and these pixels are regularly arranged. Here, m indicates the array number of the pixel in the horizontal direction, and n indicates the array number of the pixel in the vertical direction. Such a pixel array is generally called a Bayer array. In this pixel array, the number of green pixels is twice as large as the number of blue and red pixels. Basically, if the same number of three colors is used, a color image can be created, but the image quality can be improved by increasing the number of green pixels having relatively high visibility. Therefore, an image pickup device having such a Bayer array is often used.

(First Embodiment) FIG. 1 is a longitudinal sectional view showing a configuration of an image pickup module to which a fixing method according to a first embodiment of the present invention is applied, and FIG. 2 is an optical member 2 in the image pickup module of FIG. FIG. 3 is a perspective view showing the appearance of a light shielding layer 1 formed on an optical member 2 in the imaging module of FIG.
FIG. 4 is a plan view showing a configuration of a filter formed on the protection member 3 in the imaging module of FIG. 1, and FIG. 5 is a cross-sectional view showing pixels of an imaging element 6 in the imaging module of FIG. 6, FIG. 6 is a plan view showing a pixel array structure of the image sensor 6 in the image pickup module of FIG. 1, and FIG. 7 schematically shows a state in which pixels of each color in the image sensor 6 of FIG. FIG. 8 is a diagram schematically showing a pixel array obtained by image synthesis in a state where each pixel is shifted by half a pixel.

As shown in FIG. 1, the imaging module according to the present embodiment protects the optical member 2 for focusing a light beam from a subject on a predetermined imaging plane and the surface of the imaging element 6. And a protection member 3. The optical member 2 and the protection member 3 are connected by an adhesive 4, and the protection member 3 and the imaging element 6 are connected by an adhesive 5.

The optical member 2 is made of glass, transparent resin or the like. When the optical member 2 is made of glass, the optical member 2 is made by a glass molding method, and when it is made of a resin, it is made by injection molding, compression molding, or the like. The optical member 2 may have a structure in which a resin lens portion is added to a flat glass substrate by a replica manufacturing method. In the present embodiment, the lens portion 202 is formed on the optical member 2. As shown in FIG. 2, the lens unit 202 includes four lens units 202a to 202d. Further, a light-shielding layer 1 having a stop aperture for restricting a light beam is formed on a surface of the optical member 2 facing the protection member 3. The light-shielding layer 1 is provided on a flat surface of the optical member 2 on a surface facing the protection member 3 and is formed by printing a light-shielding paint by offset printing or the like, or by a thin film having a light-shielding property by vapor deposition or plating. This is formed on the optical member 2 by using a technique such as forming. Since the thickness of the light-shielding layer 1 needs to have a sufficient light-shielding property, the target value is set to about 10 μm when printing a paint and about 1 μm for vapor deposition or plating. As shown in FIG. 3, the light-shielding layer 1 is provided for the purpose of forming the aperture openings 1a to 1d, which are optically necessary openings, and for shielding the periphery thereof from light. It is smaller than the outer shape of the optical member 2. Further, it has been confirmed that the effect is obtained if the thickness of the light shielding layer 1 is at least 20% of the diameter of the beads 41. However, in order to obtain a more sufficient effect, it is desirable to have a thickness of 50% or more with respect to the diameter of the beads 41.

The protection member 3 is made of glass, transparent resin, or the like, like the optical member 2. On the surface of the protection member 3 facing the image sensor 6, a color filter 7 for wavelength separation of a light beam from a subject is formed. As shown in FIG. 4, the color filters 7 are provided with RGB color filters. Specifically, the first green region 7g, the blue region 7b, the red region 7r, the second
Green region 7g2 is provided.

In the image sensor 6, as shown in FIG. 5, since the color filter 7 is formed on the protective member 3, it does not exist below the microlens 62. This is different from the above-described image sensor 61. Here, the outermost light flux incident on the photoelectric conversion unit 64 is represented by a solid line, and when the imaging device 6 and the imaging device 61 are compared, the area of the imaging device 6 where the microlens 62 condenses is smaller than that of the solid line portion. Is larger than the dotted line, so that the amount of light reaching the photoelectric conversion unit 64 is larger without a color filter.
That is, the sensitivity of the image sensor 6 is apparently increased. For this reason, a configuration in which the color filter 7 is disposed on the protection member 3 is employed.

As shown in FIG. 6, the image pickup device 6 is provided with four image pickup regions 60g, 60b, 60r, and 60g2. For example, a light beam from the lens portion 202a of the optical member 2 is supplied to the first portion of the color filter 7. Is formed on the imaging area 60g through the blue area 7g. Similarly, the lens unit 20
The luminous flux from 2b passes through the blue region 7b of the color filter 7 to the imaging region 60b, the luminous flux from the lens portion 202c passes through the red region 7r to 60r, and the lens portion 202d
Is focused on the imaging area 60g2 through the second green area 7g2.

By combining the four images thus obtained, one color image is obtained. At this time, the four lens units 202a, 202b, 202c, 2
By making the shape of 02d slightly different, the four images are images shifted by half a pixel each.

Specifically, as shown in FIG. 7, the pixels of each color are partially extracted and overlapped with the first pixel.
Considering the green pixel 6013g, the blue pixel 6012b is shifted to the right by 0.5 pixel, the red pixel 6012r is shifted to the lower side by 0.5 pixel, and the second green pixel 6012g2 is shifted to the right and to the lower side by 0.5 pixel each. Here, FIG.
The size of each pixel is shown differently to make it easier to understand, but the sizes and shapes are almost the same.

That is, by performing image synthesis in such a state that each pixel is shifted by half a pixel, the first green pixels 6012g and 6013g as shown in FIG.
g, a red pixel 6012r is inserted between the first green pixels 6013g and 6023g.
012b is inserted, and the first green pixel 60
The pixel array is such that the second green pixel 6012g2 is inserted at the contact points of 12g, 6022g, 6013g, and 6023g, whereby an image equivalent to the Bayer array image sensor as shown in FIG. 17 is obtained. Will be.

The optical member 2 and the protective member 3 and the protective member 3 and the image pickup device 6 are adhered with adhesives 4 and 5, respectively. Used. The thermo-ultraviolet curing type epoxy resin is cured by heating or irradiation of ultraviolet rays. Epoxy resins are suitable for this application because they cure slowly, have no unevenness in curing shrinkage, and relieve stress. Although there is a type of epoxy resin that cures by heating, the reason for selecting the thermo-ultraviolet curing type here is that sufficient heat is applied to the protective member 3 to cure the thermosetting epoxy resin. This is because the color filter 7, the resin portion of the optical member 2 (when the resin molded by the above-described method is present), the microlenses 62, and the printing paint of the light shielding layer 1 may be deteriorated.

The adhesive 4 contains beads 41 serving as a spacer for forming a predetermined gap between the optical member 2 and the protective member 3. Bead 4
Organic polymer and quartz can be selected as the material of (1),
In the case of quartz beads, there is a possibility that a protective film, an electrode, or a switching element formed on a semiconductor wafer may be destroyed in a pressing step for forming a gap, and an organic polymer that can be widely used under pressure conditions in the pressing step is selected. It is more desirable.

Next, a method of bonding the optical member 2 to the protection member 3 and the protection member 3 to the image pickup device 6 will be described with reference to FIGS.
This will be described with reference to FIG. FIG. 9 is a view schematically showing a first method for bonding the optical member 2 and the protection member 3 and the first method for bonding the protection member 3 and the imaging element 6, respectively. FIG. FIG. 9 is a diagram schematically illustrating a second method for bonding the imaging elements 6.

There are two bonding methods.
As a first method, as shown in FIG. 9, first, the protective member 3 is placed on the image sensor 6, an adhesive 5 made of an epoxy resin is applied, semi-cured by ultraviolet irradiation, and then the interval and the inclination are changed. The image sensor module 301 is adjusted, and is completely cured by a press and a slight heat treatment to produce the image sensor module 301. Next, the adhesive 4 mixed with the beads 41 is applied to a portion (peripheral portion) of the optical member 2 where the light shielding layer 1 does not exist.
The image sensor module 301 is placed on the adhesive and the adhesive 4
To cure. Between the beads 41 and the light shielding layer 1, the light shielding layer 1
The beads 41 do not enter the light shielding layer 1 because there is a step due to the thickness of the light shielding layer 1. Therefore, there is no problem that vignetting is caused by invading the optically effective portion.

As a second method, as shown in FIG. 10, an adhesive 4 mixed with beads 41 is first applied to the optical member 2.
The adhesive is applied to a portion (peripheral portion) where the light-shielding layer 1 does not exist, the protective member 3 is placed thereon, pressed so as to be at an interval between the beads 41, and the adhesive 4 is cured by ultraviolet irradiation and heating. Optical element module 101
Create Next, the adhesive 5 is applied to the imaging element 6, and the optical member 2 is placed thereon to adjust the position, and the adhesive 5 is cured.

Second Embodiment Next, a second embodiment of the present invention will be described with reference to FIGS. FIG. 11 is a diagram schematically showing a fixing method according to the second embodiment of the present invention, and FIG. 12 is a diagram showing an example in which the method of applying the adhesive is changed in the fixing method according to the second embodiment of the present invention. It is. In the figure, members performing the same functions as in the first embodiment described above are denoted by the same reference numerals, and description thereof will be omitted or simplified.

In this embodiment, first, FIG.
As shown in (a), the beads 41 are arranged on the optical member 2 on which the light shielding layer 1 is formed. Here, naturally, the beads 41 are arranged on a portion of the optical member 2 where the light shielding layer 1 is not formed (lower peripheral portion).

Next, as shown in FIG. 11B, the adhesive 4 is applied to almost the entire surface. Then, as shown in FIG. 11 (c), the protective member 3 is placed from above and pressed so as to be at an interval between the beads 41, and the adhesive 4 is completely cured by ultraviolet irradiation and heating.

As shown in FIG. 12, a method of applying the adhesive 4 while avoiding the beads 41 when applying the adhesive 4 is also conceivable. As a result, the adhesive 4
, The gap management can be performed with higher precision.

(Third Embodiment) Next, a third embodiment of the present invention will be described with reference to FIGS. FIG. 13 is a cross-sectional view showing a configuration of an imaging module to which the fixing method according to the third embodiment of the present invention is applied.
FIG. 4 is a plan view showing a state where an adhesive is applied to an optical member in the imaging module of FIG. In the figure, members performing the same functions as in the first embodiment described above are denoted by the same reference numerals, and description thereof will be omitted or simplified.

In this embodiment, an adhesive 4a containing beads 41 and an adhesive 5 containing beads 51 are prepared. First, as shown in FIGS. 13 and 14, an adhesive 4b in which the beads 41 are not mixed is applied to an optically effective area or more of the optical member 2 and semi-cured by ultraviolet irradiation. Then, the adhesive 4a mixed with the beads 41 is applied to the periphery. The protective member 3 is placed on the optical member 2 to which the adhesives 4a and 4b are applied, and the two are pressed and heated so that the distance between the two becomes the distance between the beads 41, and the adhesives 4a and 4b are completely removed. Let it cure. Since the adhesive 4b is already semi-cured, it is difficult to mix with the adhesive 4a mixed with the beads 41. Therefore, when pressed, the beads 41 do not enter the effective area of the light beam.

Next, an adhesive 5 mixed with beads 51 is applied to the periphery of the bottom surface of the optical element module or the top surface of the imaging element 6 thus prepared, and the subsequent element module is mounted on the imaging element 6. Then, the two are pressed so as to be at an interval between the beads 41, and the adhesive 5 is completely cured by irradiation with ultraviolet light and heating. At this time, position adjustment of the optical element module and the imaging element 6 in the planar direction and rotation adjustment about the optical axis are performed.

[0050]

As described above, according to the fixing method of the present invention, one of the first and second members has a lower step than the other part on the surface facing the other member. The first member and the second member are fixed to each other by applying an adhesive mixed with a spacer for controlling a distance between the first member and the second member to the step portion. At the same time, the step between the step and the other part is 20 mm in diameter of the spacer.
%, It is possible to prevent the spacer for controlling the interval between the members from invading another region when the members are fixed to each other.

Further, according to the fixing method of the present invention, the adhesive mixed with the spacer for controlling the interval between the first and second members is used for removing the light shielding member on the first member. By applying to one of the first and second members so as to face the formation site,
Since the first member and the second member are fixed to each other, when fixing the members having the optically effective portion to each other, a spacer for managing the interval between the members is provided in a region corresponding to the optically effective portion. Invasion can be prevented beforehand.

Further, according to the fixing method of the present invention, of the first and second members, an optically effective portion and a portion corresponding to a peripheral portion thereof on a surface of one of the members facing the other member. An adhesive in which a spacer-free adhesive is applied, and a spacer for controlling a distance between the first and second members is mixed in an outer peripheral portion of a portion corresponding to the optically effective portion and a peripheral portion thereof. Is applied, the first member and the second member are fixed to each other. When the members having the optically effective portion are fixed to each other, the spacer for controlling the interval between the members is optically effective. It can be prevented from invading the area corresponding to the part.

According to the method of manufacturing the image pickup module of the present invention, the adhesive mixed with the spacer for controlling the distance between the optical member and the protective member is applied to the surface of the optical member facing the protective member. The optical member and the protection member are fixed to each other by applying to one of the optical member and the protection member so as to face the portion where the light shielding member is not formed, so that the members having the optically effective portion are fixed to each other. In doing so, it is possible to prevent the spacer for managing the interval between the members from invading the region corresponding to the optically effective portion.

Further, according to the method of manufacturing the image pickup module of the present invention, the spacer for controlling the interval between the optical member and the protection member is provided at the portion where the light shielding member is not formed on the surface of the optical member facing the protection member. The optical member is disposed on one of the optical member and the protective member so as to face each other, and an adhesive is applied to the one member so as to include a spacer disposed on one of the members. Since the member and the protection member are fixed to each other, when fixing the members having the optically effective portion to each other, it is necessary to prevent the spacer for managing the interval between the members from entering the region corresponding to the optically effective portion. Can be prevented.

Further, according to the method of manufacturing the imaging module of the present invention, of the optical member and the protective member, the one corresponding to the optically effective portion and the peripheral portion thereof on the surface facing the other member. Apply the spacer-free adhesive to the part, and manage the distance between the optical member and the protection member on the outer peripheral part of the part where the spacer-free adhesive is applied on the surface of one member facing the other member Since the optical member and the protective member are fixed by applying an adhesive mixed with a spacer for mixing, when the members having the optically effective portion are fixed to each other, the distance between the members is controlled. Can be prevented from entering the region corresponding to the optically effective portion.

According to the imaging module of the present invention, since the imaging module is manufactured by the imaging module manufacturing method according to the seventh, eighth or ninth aspect, the spacer for controlling the interval between the members having the optically effective portions is provided with an optical element. It is possible to eliminate the inconvenience caused by entering the area corresponding to the effective portion.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view showing a configuration of an imaging module to which a fixing method according to a first embodiment of the present invention is applied.

FIG. 2 is a perspective view showing an appearance of an optical member 2 in the imaging module of FIG.

FIG. 3 is a plan view showing a configuration of a light shielding layer 1 formed on an optical member 2 in the imaging module of FIG.

FIG. 4 is a plan view showing a configuration of a filter formed on a protection member 3 in the imaging module of FIG.

FIG. 5 is a cross-sectional view showing pixels of an image sensor 6 in the image pickup module of FIG.

FIG. 6 is a plan view showing a pixel array structure of an image sensor 6 in the image pickup module of FIG.

7 is a diagram schematically illustrating a state in which pixels of each color in the image sensor 6 of FIG. 1 are partially extracted and overlapped.

FIG. 8 is a diagram schematically illustrating a pixel array obtained by image synthesis in a state where each pixel is shifted by a half pixel.

FIG. 9 is a view schematically showing a first method for bonding the optical member 2 and the protection member 3, and the protection member 3 and the image sensor 6, respectively.

FIG. 10 is a view schematically showing a second method for bonding the optical member 2 and the protection member 3, and the protection member 3 and the imaging element 6, respectively.

FIG. 11 is a view schematically showing a fixing method according to a second embodiment of the present invention.

FIG. 12 is a diagram showing an example in which the method of applying an adhesive is changed in the fixing method according to the second embodiment of the present invention.

FIG. 13 is a cross-sectional view illustrating a configuration of an imaging module to which a fixing method according to a third embodiment of the present invention is applied.

14 is a plan view showing a state where an adhesive is applied to an optical member in the imaging module of FIG. 13;

FIG. 15 is a diagram schematically illustrating a configuration of a main part of the imaging apparatus.

16 is a cross-sectional view showing a pixel of the image sensor 61 in FIG.

FIG. 17 is a plan view showing a pixel array structure in the imaging device of FIG. 16;

FIG. 18 is a view showing a procedure for assembling a conventional liquid crystal display device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Light-shielding layer 2 Optical member 3 Protective member 4,5 Adhesive 6 Image sensor 7 Color filter 41,51 Bead

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) G02B 7/00 H04N 5/335 V H04N 5/335 H01L 27/14 DF term (Reference) 2H043 AE02 AE23 2H048 BB02 BB08 BB37 BB46 4J040 EC001 JA12 JB07 KA03 KA43 MA02 MA05 NA21 4M118 AA10 AB01 GB01 GC08 GD02 HA11 HA20 HA23 HA24 5C024 CY47 CY48 EX23 EX52

Claims (12)

[Claims] 1. A fixing method for fixing a first member and a second member, wherein a surface of one of the first and second members opposing the other member. Is provided with a step portion lower than other portions, and an adhesive mixed with a spacer for controlling a space between the first member and the second member is applied to the step portion, whereby the first portion is formed. And fixing the member to the second member, and forming the step so that a step difference from the other portion is 20% or more of a diameter of the spacer. 2. The method according to claim 1, wherein a third member is provided on a surface of the one member facing the other member, so that the step is formed on a surface of the one member facing the other member. The fixing method according to claim 1, wherein: 3. A first member having an optically effective portion and a second member having an optically effective portion are overlapped with each other, and the light shielding member is provided on the first member.
A fixing method used for a structure provided on a surface facing the second member so as to extend over an optically effective portion and a peripheral portion of the member, wherein the first member and the second member are interposed between the first member and the second member. An adhesive mixed with a spacer for controlling an interval is applied to the first spacer by the spacer.
The first member and the second member are applied to one of the first and second members so as to face a portion where the light blocking member is not formed on the member. And a fixing method characterized by fixing. 4. The light shielding member formed on the first member is formed in a layer shape.
The fixing method as described above. 5. A first member having an optically effective portion and a second member having an optically effective portion are superimposed on each other, and the light shielding member is provided on the first member.
A fixing method used for a structure provided on a surface facing the second member so as to extend over an optically effective portion and a peripheral portion of the member, wherein the first and second members are A spacer-free adhesive is applied to a portion corresponding to the optically effective portion and its peripheral portion on the surface of one of the members facing the other member, and corresponds to the optically effective portion and its peripheral portion. The first member and the second member are fixed to each other by applying an adhesive mixed with a spacer for controlling a distance between the first and second members to an outer peripheral portion of the portion. A fixing method, characterized in that: 6. The fixing method according to claim 5, wherein the light shielding member formed on the first member is formed in a layered form by printing. 7. A method for manufacturing an imaging module, comprising: a structure in which an optical member, a protection member, and an imaging element are stacked, wherein a light-shielding member is formed on a surface of the optical member facing the protection member. An adhesive mixed with a spacer for controlling the interval between the optical member and the protective member is applied to the adhesive, where the spacer faces a portion where the light shielding member is not formed on a surface of the optical member facing the protective member. A method of manufacturing an imaging module, wherein the optical member and the protection member are fixed by applying to one of the optical member and the protection member as described above. 8. A method for manufacturing an imaging module, comprising: a structure in which an optical member, a protection member, and an imaging element are stacked, wherein a light-shielding member is formed on a surface of the optical member facing the protection member. A spacer for managing a distance between the optical member and the protection member is provided on the optical member and the protection member such that the spacer opposes a portion where the light shielding member is not formed on a surface of the optical member facing the protection member. The optical member and the protective member are fixed to each other by disposing the adhesive on one of the members and applying an adhesive to one of the members so as to include the spacer arranged on the one member. A method for manufacturing an imaging module. 9. An optical member having an optically effective portion, a protective member having an optically effective portion, and an image pickup element are laminated, and a light-shielding member is provided on a surface of the optical member facing the protective member. A method of manufacturing an imaging module formed so as to extend over an optically effective portion of a member and a peripheral portion thereof, wherein the optical member and the protection member are arranged on a surface of one member facing the other member. A portion corresponding to the optically effective portion and its peripheral portion is coated with a spacer-free adhesive, and a portion of the portion where the spacer-free adhesive is applied on a surface of the one member facing the other member. The optical member and the protection member are fixed to each other by applying an adhesive mixed with a spacer for controlling a distance between the optical member and the protection member to an outer peripheral portion. Manufacturing method of the imaging module that. 10. An imaging module manufactured by the method for manufacturing an imaging module according to claim 7. 11. An imaging module manufactured by the method for manufacturing an imaging module according to claim 8. 12. An image pickup module manufactured by the method for manufacturing an image pickup module according to claim 9.