JP2002237253A - Method for forming partition wall of thin display device - Google Patents
Method for forming partition wall of thin display deviceInfo
- Publication number
- JP2002237253A JP2002237253A JP2001031508A JP2001031508A JP2002237253A JP 2002237253 A JP2002237253 A JP 2002237253A JP 2001031508 A JP2001031508 A JP 2001031508A JP 2001031508 A JP2001031508 A JP 2001031508A JP 2002237253 A JP2002237253 A JP 2002237253A
- Authority
- JP
- Japan
- Prior art keywords
- partition
- panel substrate
- transfer intaglio
- transfer
- partition wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Abstract
(57)【要約】
【課題】 薄型表示装置の隔壁を転写法で形成する場
合、アスペクト比の高い隔壁が形成出来ないという課題
がある。
【解決手段】 転写凹版13の溝内に充填した、隔壁材
料14をパネル基板11上に転写して隔壁16をパネル
基板上に形成する方法において、パネル基板上の所定の
位置に転写凹版に形成された溝の開口幅以下でかつ溝の
深さよりも高さの低い突起物12をあらかじめ形成し、
隔壁材料の充填された転写凹版の溝を当該基板上の突起
物に位置合わせし、この状態でパネル基板と転写凹版を
重ね合わせ、この後転写凹版をパネル基板から離すこと
により、突起物を芯材(土台)とした隔壁をパネル基板
上に形成する。
(57) [Problem] When a partition of a thin display device is formed by a transfer method, there is a problem that a partition having a high aspect ratio cannot be formed. SOLUTION: In a method of forming a partition 16 on a panel substrate by transferring a partition material 14 filled in a groove of a transfer intaglio 13 onto a panel substrate 11, the transfer intaglio is formed at a predetermined position on the panel substrate. A protrusion 12 having a height equal to or less than the opening width of the groove and lower than the depth of the groove is formed in advance,
The grooves of the transfer intaglio filled with the partition wall material are aligned with the protrusions on the substrate. In this state, the transfer intaglio is overlapped with the panel substrate. A partition (material) is formed on the panel substrate.
Description
【0001】[0001]
【発明の属する技術分野】本発明は、薄型表示装置の隔
壁形成方法に関し、さらに詳しくは、フィールドエミッ
ションディスプレイ(FED)やプラズマディスプレイ
パネル(PDP)の様な薄型表示装置における隔壁を転
写法により形成する方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of forming a partition of a thin display device, and more particularly, to a method of forming a partition in a thin display device such as a field emission display (FED) or a plasma display panel (PDP) by a transfer method. On how to do.
【0002】[0002]
【従来の技術】薄型表示装置の隔壁は、背面基板と前面
基板の間隔を維持し、両基板間を絶縁したり、表示部を
画定するために形成される。すなわち、フィールドエミ
ッションディスプレイ(FED)は、背面基板上に複数
の電子放出素子(エミッタ)を配列し、隔壁を介して、
アノードと蛍光体面の形成された前面基板を対向させ、
両基板の周囲をシール材により封着し、内部を真空にし
た表示デバイスで、エミッタから放出された電子が、ア
ノードに印加された正極性の電圧によって加速され、蛍
光体面に衝突し、蛍光体を励起発光させ表示するもので
ある。このデバイスでは、内部が真空であるため、背面
・前面基板には大気圧がかかっており、隔壁は、両基板
間の間隔を維持する働きがある。さらに、エミッタから
放出された電子を加速するために、両基板間には数百ボ
ルトから数キロボルトの電位がかかっており、隔壁は、
両基板間の絶縁を保つ働きも兼ね備えている。2. Description of the Related Art Partition walls of a thin display device are formed to maintain a distance between a rear substrate and a front substrate, to insulate between the two substrates, and to define a display portion. That is, a field emission display (FED) has a plurality of electron-emitting devices (emitters) arranged on a rear substrate,
The anode and the front substrate on which the phosphor surface is formed are opposed to each other,
In a display device in which the peripheries of both substrates are sealed with a sealing material and the inside is evacuated, electrons emitted from the emitter are accelerated by the positive voltage applied to the anode, collide with the phosphor surface, and Is excited to emit light for display. In this device, since the inside is in a vacuum, atmospheric pressure is applied to the back and front substrates, and the partition walls have a function of maintaining the interval between the two substrates. Furthermore, in order to accelerate electrons emitted from the emitter, a potential of several hundred volts to several kilovolts is applied between the two substrates.
It also has the function of maintaining insulation between both substrates.
【0003】また、プラズマディスプレイ(PDP)は
前面基板と背面基板との間に形成された放電ガス空間を
隔壁によりセル毎に区画し、かつセル内に蛍光体を設
け、放電によって発生した紫外線によって、蛍光体を励
起発光させ表示するデバイスである。このデバイスにお
ける隔壁は、放電を分離し、放電と放電で発生した紫外
線、蛍光体発光の可視光を所望のセル内に閉じ込める働
きをする。In a plasma display (PDP), a discharge gas space formed between a front substrate and a rear substrate is divided into cells by partitions, and a phosphor is provided in the cells. Is a device that excites and emits a phosphor to display. The partition in the device functions to separate the discharge and confine the discharge and ultraviolet light generated by the discharge and visible light of phosphor emission in a desired cell.
【0004】前記FEDの隔壁は、隔壁のアスペクト比
が1:20程度と隔壁の幅に対して、高さが非常に高い
ものが求められる。そのため、量産に十分なり得る実用
的な方法が開発されておらず、実際のFEDでは、厚さ
50μm程度の薄膜状のガラスを短冊状に切断したもの
を接着する方法が用いられている。The partition wall of the FED is required to have an aspect ratio of the partition wall of about 1:20, which is very high with respect to the width of the partition wall. For this reason, a practical method capable of being sufficient for mass production has not been developed, and in the actual FED, a method in which a thin film of glass having a thickness of about 50 μm is cut into strips and bonded is used.
【0005】前記PDPの隔壁の形成方法は、様々な方
法が提案されており、代表的な方法として、積層印刷
法、サンドブラスト法、埋め込み法、フォトリソ法、転
写法などがあげられ、その中でも、転写法は、大規模量
産において、低製造コスト化が可能な方法として期待さ
れている。Various methods have been proposed for forming the partition walls of the PDP, and typical methods include a lamination printing method, a sand blast method, an embedding method, a photolithography method, and a transfer method. The transfer method is expected as a method capable of reducing the manufacturing cost in large-scale mass production.
【0006】図4の(a)〜(f)は従来の転写法によ
る隔壁の形成方法を工程順に示す説明図である。この隔
壁の形成にあたっては、まず、(a)に示すようなガラ
ス等で形成された基板41(図では表記されていない
が、隔壁形成面側に電極、もしくは電極とそれを被覆す
る誘電体層とが形成されている)と、(b)に示すよう
なゴム、樹脂もしくは金属に所定パターンの溝を形成し
た転写凹版42とが用意される。そして、先ず(c)に
示すように転写凹版42の溝内に隔壁材料43が充填さ
れる。隔壁材料43を転写凹版42に充填する際には、
転写凹版42の溝部分だけでなく、図示のように転写凹
版42上にも隔壁材料43が存在するように充填してお
けば、基板41と隔壁材料43の密着性が上がり、転写
性能が向上する。次に、(d)に示すように基板41と
隔壁材料43が充填された転写凹版42の位置合わせを
行う。位置が合った状態で、(e)に示すように基板4
1と転写凹版42を密着させる。その際に、転写凹版4
2の上面から、ロールやプレスを用いて力を加えるのが
望ましい。次いで、(f)に示すように、基板41上に
密着した隔壁材料から転写凹版42を離した後隔壁材料
を焼成し、これによって隔壁44が基板41上に形成さ
れる。FIGS. 4A to 4F are explanatory views showing a method of forming a partition by a conventional transfer method in the order of steps. In forming the partition, first, a substrate 41 made of glass or the like as shown in (a) (not shown in the figure, but an electrode or an electrode and a dielectric layer covering the electrode are provided on the partition forming surface side). Is formed), and a transfer intaglio 42 in which grooves of a predetermined pattern are formed in rubber, resin or metal as shown in FIG. Then, first, as shown in (c), the groove of the transfer intaglio 42 is filled with the partition wall material 43. When filling the partition material 43 into the transfer intaglio 42,
Filling the transfer intaglio 42 so that the partition material 43 exists not only in the grooves of the transfer intaglio 42 but also on the transfer intaglio 42 as shown in the figure increases the adhesion between the substrate 41 and the partition material 43 and improves transfer performance. I do. Next, as shown in (d), the substrate 41 and the transfer intaglio 42 filled with the partition wall material 43 are aligned. In the state where the positions are matched, as shown in FIG.
1 and the transfer intaglio 42 are brought into close contact with each other. At that time, the transfer intaglio 4
It is desirable to apply a force from the upper surface of 2 using a roll or a press. Next, as shown in (f), the transfer intaglio plate 42 is separated from the partition wall material adhered on the substrate 41, and then the partition wall material is baked, whereby the partition walls 44 are formed on the substrate 41.
【0007】[0007]
【発明が解決しようとする課題】上述したように、転写
法による隔壁の形成においては、隔壁材料を基板上に転
写し、密着させた後の転写凹版との離型作業が必要なた
め、隔壁材料と基板間の密着力よりも隔壁材料と転写凹
版の摩擦力が大きな場合では、隔壁材料を基板に転写す
ることが出来ない。特に、アスペクト比(隔壁の高さと
隔壁の幅の比)が大きくなるに従って、隔壁材料と基板
との密着力は変わらないのに対し、隔壁材料と転写凹版
との摩擦力が大きくなり、転写凹版の剥離も難しくなる
ことから隔壁を基板に転写しづらくなる。隔壁材料と転
写凹版との摩擦力を小さくするために、隔壁材料を転写
凹版に充填する前に、転写凹版に離型剤を塗布する方法
や、転写凹版上の隔壁材料の厚さを厚くする方法、基板
上に粘着性を有する材料を予め塗布する方法等が試みら
れているが、十分な効果が得られず、隔壁材料が転写さ
れずに転写凹版に残るという問題があった。As described above, in the formation of the partition wall by the transfer method, since the partition wall material needs to be transferred onto the substrate and separated from the transfer intaglio after the partition wall material is brought into close contact with the substrate, the partition wall material is required. When the frictional force between the partition wall material and the transfer intaglio is larger than the adhesive force between the material and the substrate, the partition wall material cannot be transferred to the substrate. In particular, as the aspect ratio (the ratio of the height of the barrier ribs to the width of the barrier ribs) increases, the adhesive force between the barrier rib material and the substrate does not change, but the frictional force between the barrier rib material and the transfer intaglio increases. Also, it becomes difficult to transfer the partition walls to the substrate since the separation of the partition walls becomes difficult. In order to reduce the frictional force between the partition wall material and the transfer intaglio, a method of applying a release agent to the transfer intaglio before filling the partition intaglio into the transfer intaglio, or increasing the thickness of the partition wall material on the transfer intaglio. Although a method and a method of applying a tacky material on a substrate in advance have been tried, there was a problem that a sufficient effect was not obtained, and the partition wall material was not transferred and remained on the transferred intaglio.
【0008】特に、FEDの場合、隔壁間に蛍光体を塗
布し、蛍光体を通して、発光を見る方式を取っているた
め、隔壁間は光を透過する特性が必要であること、エミ
ッタから放出された電子を吸収するために、隔壁間にア
ノードを露出させることが必要であり、転写凹版の上に
隔壁材料を置くことが出来ないため、アスペクト比の大
きい隔壁の形成を困難にしており、アスペクト比の大き
い隔壁を容易に作製する方法が望まれていた。In particular, in the case of the FED, a phosphor is applied between the partition walls, and light emission is observed through the phosphor. Therefore, a property of transmitting light between the partition walls is required. In order to absorb the electrons, it is necessary to expose the anode between the partition walls, and the partition material cannot be placed on the transfer intaglio, making it difficult to form a partition having a large aspect ratio. There has been a demand for a method for easily producing a partition having a high ratio.
【0009】本発明は、このような従来の状況から、ア
スペクト比の大きい隔壁を容易に形成することを目的と
する。An object of the present invention is to easily form a partition having a large aspect ratio from such a conventional situation.
【0010】[0010]
【課題を解決するための手段】本発明の発明者らは、ア
スペクト比の大きな隔壁を安定して形成するための方法
として、転写凹版に形成された凹溝の開口幅以下でかつ
凹溝の深さより低い突起物を予め被転写の基板上に形成
し、該突起物による結合力で隔壁材料の付着力を高める
ことにより、前述の問題を容易に解決できることを見出
した。As a method for stably forming a partition wall having a large aspect ratio, the inventors of the present invention have proposed a method in which the width of the groove is smaller than the opening width of the groove formed in the transfer intaglio. It has been found that the above-mentioned problem can be easily solved by forming a projection lower than the depth on the substrate to be transferred in advance and increasing the adhesion of the partition wall material by the bonding force of the projection.
【0011】請求項1の発明では、転写凹版の溝内に充
填した、隔壁材料をパネル基板上に転写して隔壁をパネ
ル基板上に形成する方法において、パネル基板上の所定
の位置に転写凹版に形成された溝の開口幅以下でかつ溝
の深さよりも高さの低い突起物をあらかじめ形成し、隔
壁材料の充填された転写凹版の溝を当該基板上の突起物
に位置合わせし、この状態でパネル基板と転写凹版を重
ね合わせ、この後転写凹版をパネル基板から離すことに
より、突起物を芯材(土台)とした隔壁をパネル基板上
に形成することを特徴とするものである。According to the first aspect of the present invention, there is provided a method of forming a partition on a panel substrate by transferring a partition material filled in a groove of the transfer intaglio onto the panel substrate. A protrusion having a width equal to or less than the opening width of the groove formed in the lower portion and having a height lower than the depth of the groove is formed in advance, and the groove of the transfer intaglio filled with the partition material is aligned with the protrusion on the substrate. In this state, the panel substrate and the transfer intaglio are overlapped, and thereafter, the transfer intaglio is separated from the panel substrate to form a partition having the projection as a core material (base) on the panel substrate.
【0012】請求項2の発明では、パネル基板及び転写
凹版が透光性の材料から形成され、かつ隔壁材料が光硬
化性の材料を含んでなり、隔壁材料を表示パネル基板上
に転写した後、表示パネル基板の突起物の形成されてい
ない面、転写凹版の溝の形成されていない面のいずれ
か、もしくは両方から、光硬化性材料が硬化する波長の
光を照射して光硬化性隔壁材料を硬化させ、突起物に光
硬化性隔壁材料を接着することを特徴とするものであ
る。According to the second aspect of the present invention, the panel substrate and the transfer intaglio are formed of a translucent material, and the partition material includes a photocurable material, and after the partition material is transferred onto the display panel substrate. Irradiating light of a wavelength at which the photocurable material is cured from one or both of the surface of the display panel substrate where the protrusions are not formed, the surface of the transfer intaglio where the grooves are not formed, and the photocurable partition walls The method is characterized in that the material is cured and a photocurable partition wall material is adhered to the protrusion.
【0013】請求項3の発明では、前記突起物が暗色で
あることを特徴とするものである。According to a third aspect of the present invention, the projection is dark.
【0014】[0014]
【発明の実施の形態】以下、PDPの隔壁を例にした本
発明の実施形態を説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described using a partition wall of a PDP as an example.
【0015】図1の(a)〜(h)は本発明の第1実施
形態に係る隔壁形成方法を工程順に示す説明図である。
まず、(a)に示したようにPDPのパネル基板11
(図では表記されていないが、隔壁形成面側に電極、も
しくは電極とそれを被覆する誘電体層が形成されていて
も構わない)の隔壁形成面上の所定位置に、(b)に示
すような平面視が、ストライプ状または格子状パターン
の突起物を形成する。この突起物には隔壁に対応したも
のであるが、(c)に示すような隔壁パターンに対応し
た凹溝を形成した例えばシリコーンゴム製の転写凹版1
3の凹溝の開口幅以下でかつ凹溝の深さ寸法よりも低く
形成されている。突起物12の形成方法は、アスペクト
比が低いため、一般的な隔壁形成方法、すなわち、積層
印刷法、サンドブラスト法、埋め込み法、フォトリソ
法、転写法等から、選択して使用すれば良いが、隔壁材
料を転写する際に変形しない強度を持たせることが必要
である。そのために、突起物12の材料として、ガラス
ペーストに熱によって硬化する熱硬化樹脂を混合し、形
成後、加熱処理を行うか、ガラスペーストに光硬化性の
感光剤を混合し、形成後、感光剤が硬化する波長に光を
照射することにより、強度を増すことが出来る。なお、
突起物12のパターンは、転写凹版13の凹溝パターン
と同じであれば、連続したパターンでなくとも、ドット
状に配置しても構わない。また、突起物12は、ガラス
ペーストにフィラを多く混合したポーラスな材料を用い
たり、サンドブラスト等の物理的もしくは化学的なエッ
チングを行い、表面に凹凸を設け、表面積を大きくする
方が隔壁材料14との密着性をより高めるためには、よ
り好ましい。FIGS. 1A to 1H are explanatory views showing a partition forming method according to a first embodiment of the present invention in the order of steps.
First, as shown in FIG.
(Although not shown in the figure, an electrode or an electrode and a dielectric layer covering the electrode may be formed on the partition wall forming surface side) at a predetermined position on the partition wall forming surface, as shown in FIG. Such a plan view forms a stripe-shaped or lattice-shaped projection. The projection corresponds to a partition, but a transfer intaglio 1 made of, for example, silicone rubber, having a groove corresponding to a partition pattern as shown in FIG.
3 is formed to be smaller than the opening width of the concave groove and smaller than the depth dimension of the concave groove. Since the aspect ratio is low, the method for forming the protrusions 12 may be selected and used from general partition wall forming methods, that is, a lamination printing method, a sand blast method, an embedding method, a photolithography method, a transfer method, and the like. It is necessary to have a strength that does not deform the transfer of the partition wall material. For this purpose, as a material for the projections 12, a glass paste is mixed with a thermosetting resin that is cured by heat, and after formation, a heat treatment is performed, or a photocurable photosensitive agent is mixed with the glass paste, and after formation, the photosensitive material is exposed to light. By irradiating light to a wavelength at which the agent cures, the strength can be increased. In addition,
As long as the pattern of the projections 12 is the same as the groove pattern of the transfer intaglio 13, it may be arranged in a dot shape without being a continuous pattern. The projections 12 may be made of a porous material obtained by mixing a glass paste with a large amount of filler, or may be subjected to physical or chemical etching such as sand blasting to form irregularities on the surface and increase the surface area. It is more preferable to further enhance the adhesiveness with the adhesive.
【0016】工程(d)においては、転写凹版13の凹
溝内に隔壁材料14を充填する。充填方法によっては溝
の周囲にも隔壁材料14が残るが、本発明ではこの凹溝
以外に付着した隔壁材料14を従来例のように基板との
密着力強化に利用することを必要としないので、(e)
に示すようにブレード15等を用いて除去する工程を入
れる。隔壁材料14は、焼成後、透光性もしくは反射率
の高い白色になるものを使用する方が、発光輝度を高め
るためには、より好ましい。そのために、透光性の隔壁
の場合には、ガラスペースト中のガラス粉末と屈折率の
近い材料を混合する。白色の隔壁では、ガラスペースト
中に、アルミナ、酸化チタン等の白色顔料を混合する。In the step (d), the groove material of the transfer intaglio 13 is filled with the partition wall material 14. Depending on the filling method, the partition wall material 14 remains around the groove. However, in the present invention, it is not necessary to use the partition wall material 14 attached to other than the concave groove to enhance the adhesion to the substrate as in the conventional example. , (E)
As shown in (1), a step of removing using a blade 15 or the like is provided. It is more preferable to use the partition wall material 14 that becomes white with high translucency or high reflectance after firing in order to increase the emission luminance. Therefore, in the case of a light-transmitting partition, a material having a refractive index close to that of the glass powder in the glass paste is mixed. In the white partition, a white pigment such as alumina or titanium oxide is mixed into the glass paste.
【0017】次の工程(f)では、パネル基板11の突
起物と隔壁材料14が充填された転写凹版13の凹溝と
の位置合わせを行う。なお、突起物上に構造物を転写す
る場合は、転写凹版が下の突起物の位置に沿おうとする
特性があるため、平面上に転写する従来例よりも、位置
合わせ精度が悪くても位置ずれを起こし難く、位置合わ
せ作業が容易である。次の工程(g)では、転写凹版1
3をパネル基板11に密着させる。その際に、転写凹版
13の上面から、ロールやプレスを用いた圧力を加える
ことがある。In the next step (f), the projections of the panel substrate 11 and the grooves of the transfer intaglio 13 filled with the partition wall material 14 are aligned. When a structure is transferred onto a projection, the transfer intaglio tends to follow the position of the lower projection. Displacement is unlikely to occur, and positioning work is easy. In the next step (g), the transfer intaglio 1
3 is brought into close contact with the panel substrate 11. At this time, pressure using a roll or a press may be applied from the upper surface of the transfer intaglio 13.
【0018】次の工程(h)では、パネル基板11から
転写凹版13を離す作業が行われるが、このときパネル
基板上に転写された隔壁材料はパネル基板上の突起物1
2と結合状態になるため、その結合力でパネル基板11
との密着力が強化され、従って転写凹版13とともに剥
離されることがほとんどない。かくしてアスペクト比の
高い隔壁16がパネル基板11上に形成される。この
後、隔壁の形成されたパネル基板11は、所定の温度で
焼成されて、隔壁が完成する。In the next step (h), an operation of separating the transfer intaglio 13 from the panel substrate 11 is performed. At this time, the partition material transferred onto the panel substrate is replaced by the protrusions 1 on the panel substrate.
2 is connected to the panel substrate 11 by the bonding force.
Therefore, the adhesion with the transfer intaglio 13 is hardly peeled off. Thus, the partition 16 having a high aspect ratio is formed on the panel substrate 11. Thereafter, the panel substrate 11 on which the partition walls are formed is fired at a predetermined temperature to complete the partition walls.
【0019】図2の(a)〜(e)は本発明の第2実施
形態に係る隔壁形成方法を工程順に示す説明図である。
この第2実施形態においても、(a)に示したようにパ
ネル基板21上にあらかじめ突起物22を形成するが、
パネル基板21は透光性の材料により形成する。また、
転写凹版も透光性の材料で形成し、隔壁材料には光硬化
性の感光剤を含ませる。図2(b)は透光性の転写凹版
24の凹溝内に光硬化性感光剤を混入した隔壁材料(以
下、感光性隔壁材料と記す)が充填された工程を示す。
この後、(c)に示すように、パネル基板21上の突起
物22と転写凹版24の凹溝との位置合わせを行い、さ
らに(d)に示すようにパネル基板21を転写凹版24
に密着させる。個々までの転写凹版へ隔壁材料を充填す
る作業、転写凹版をパネル基板に位置合わせし密着させ
る作業は、前記第1実施形態のそれら作業と何ら変わり
ないが、この第2実施形態では、パネル基板21を転写
凹版24に密着させた後で、転写凹版24側、パネル基
板21側の両側もしくは一方から感光性隔壁材料23に
含有された光硬化性の感光剤が硬化する波長の光を主に
照射し、感光性隔壁材料23を硬化させる。この硬化に
よって感光性隔壁材料は、パネル基板上の突起物22に
接着され、パネル基板との密着力が強化される。この
後、(e)に示すように、転写凹版をパネル基板から離
せば、パネル基板上に突起物を芯材にした隔壁25がパ
ネル基板21上に形成される。この後、焼成が施されて
隔壁が完成する。FIGS. 2A to 2E are explanatory views showing a partition forming method according to a second embodiment of the present invention in the order of steps.
Also in the second embodiment, the projections 22 are previously formed on the panel substrate 21 as shown in FIG.
The panel substrate 21 is formed of a translucent material. Also,
The transfer intaglio is also formed of a translucent material, and the partition wall material contains a photocurable photosensitive agent. FIG. 2B shows a process in which the groove of the translucent transfer intaglio 24 is filled with a partition material containing a photocurable photosensitive agent (hereinafter referred to as a photosensitive partition material).
Thereafter, as shown in (c), the projection 22 on the panel substrate 21 is aligned with the concave groove of the transfer intaglio 24, and as shown in (d), the panel substrate 21 is transferred to the transfer intaglio 24.
In close contact. The operation of filling the partition intaglio material into the individual transfer intaglio and the operation of positioning and intimately attaching the transfer intaglio to the panel substrate are not different from those of the first embodiment, but in the second embodiment, After the 21 is brought into close contact with the transfer intaglio 24, light having a wavelength at which the photocurable photosensitive agent contained in the photosensitive partition wall material 23 is cured mainly from the transfer intaglio 24 side or both sides or one of the panel substrate 21 side. Irradiation cures the photosensitive partition wall material 23. Due to this curing, the photosensitive partition wall material is adhered to the projection 22 on the panel substrate, and the adhesion to the panel substrate is strengthened. Thereafter, as shown in (e), when the transfer intaglio is separated from the panel substrate, a partition wall 25 having a projection as a core material is formed on the panel substrate 21 on the panel substrate. Thereafter, baking is performed to complete the partition.
【0020】図3の(a)〜(e)は本発明の第3実施
形態における隔壁形成方法を工程順に示す説明図であ
る。この第3実施形態の特徴は、パネル基板上の突起物
32を暗色の材料で形成したことであり、これ以外の各
工程は前記第1、第2実施形態と何ら変わりが無く、従
ってそれらの工程は説明を省略する。突起物32の暗色
は、パネルのコントラストの面から反射率の低い黒色で
あることが好ましい。黒色にするために、突起物を形成
するガラスペースト中に鉄、ニッケル、コバルト、マン
ガン等の酸化物の内の一種もしくは複数の黒色顔料を混
合する。この暗色の突起物によって、FEDのように、
視認面側の基板の内面に隔壁を形成する場合に、コント
ラストを上げるのに有効である。隔壁材料33は、透光
性もしくは白色であることが輝度を向上させる面から好
ましく、突起物32と隔壁材料33をより強固に接着さ
せたい場合には感光性隔壁材料を用いる。FIGS. 3A to 3E are explanatory views showing a method of forming a partition wall according to a third embodiment of the present invention in the order of steps. The feature of the third embodiment is that the projections 32 on the panel substrate are formed of a dark material, and the other steps are the same as those of the first and second embodiments, and therefore, those steps are the same. Description of the steps is omitted. The dark color of the projection 32 is preferably black having a low reflectance from the viewpoint of the contrast of the panel. In order to make the glass black, one or more black pigments of oxides such as iron, nickel, cobalt and manganese are mixed into the glass paste forming the projections. By this dark projection, like FED,
This is effective for increasing the contrast when a partition is formed on the inner surface of the substrate on the viewing surface side. The partition wall material 33 is preferably translucent or white from the viewpoint of improving luminance, and a photosensitive partition wall material is used when the projections 32 and the partition wall material 33 are to be more firmly bonded.
【0021】以上の説明においては、本発明の適用を主
として転写凹版に隔壁材料を充填し、転写する方法につ
いて説明したが、突起物の形成された基板に隔壁材料を
塗布し、上から予め所定のパターンの溝を形成した凹版
を押しつける方式にも、幅広く適用することが出来る。In the above description, the application of the present invention has been mainly described with respect to the method of filling the transfer intaglio with the partition wall material and transferring the same. However, the partition wall material is applied to the substrate on which the protrusions are formed, and a predetermined predetermined amount is applied from above. The method can also be widely applied to a method of pressing an intaglio having grooves formed in the pattern.
【0022】[0022]
【発明の効果】請求項1乃至請求項3の発明によれば、
表示装置用のアスペクト比の大きい隔壁を転写法を用い
て容易に作製することが可能になる。According to the first to third aspects of the present invention,
A partition having a large aspect ratio for a display device can be easily manufactured by using a transfer method.
【図1】第1実施形態に係る隔壁形成方法を工程順に示
す説明図である。FIG. 1 is an explanatory view showing a partition forming method according to a first embodiment in the order of steps.
【図2】第2実施形態に係る隔壁形成方法を工程順に示
す説明図である。FIG. 2 is an explanatory view showing a partition forming method according to a second embodiment in the order of steps.
【図3】第3実施形態に係る隔壁形成方法を工程順に示
す説明図である。FIG. 3 is an explanatory view showing a partition forming method according to a third embodiment in the order of steps.
【図4】従来の転写法による隔壁形成方法を工程順に示
す説明図である。FIG. 4 is an explanatory diagram showing a partition forming method by a conventional transfer method in the order of steps.
11 パネル基板 12 突起物 13 転写凹版 14 隔壁材料 15 ブレード 23 感光性隔壁材料 DESCRIPTION OF SYMBOLS 11 Panel board 12 Projection 13 Transfer intaglio 14 Partition material 15 Blade 23 Photosensitive partition material
フロントページの続き Fターム(参考) 5C027 AA09 5C040 GF13 GF18 GF19 JA19 KA16 KB19 MA23 MA24 Continuation of the front page F term (reference) 5C027 AA09 5C040 GF13 GF18 GF19 JA19 KA16 KB19 MA23 MA24
Claims (3)
内に隔壁材料を充填した後、該転写凹版の隔壁材料を表
示パネル基板上に転写し、当該表示パネル基板上に隔壁
を形成する薄型表示装置の隔壁形成方法において、 前記表示パネル基板上の所定位置に、前記転写凹版に形
成された溝の開口幅よりも小さい幅でかつ溝の深さ寸法
よりも小さい寸法の突起物をあらかじめ形成し、前記表
示パネル基板上の当該突起物に前記転写凹版の溝を位置
合わせした状態で転写凹版の溝内に充填されている隔壁
材料を表示パネル基板上に転写した後、前記転写凹版を
表示パネル基板から離して、突起物を芯材にした隔壁を
パネル基板上に形成することを特徴とする薄型表示装置
の隔壁形成方法。After filling a partition material into a groove of a transfer intaglio having a groove of a predetermined pattern, the partition material of the transfer intaglio is transferred onto a display panel substrate, and a partition is formed on the display panel substrate. In the method of forming a partition of a thin display device, a protrusion having a width smaller than an opening width of a groove formed in the transfer intaglio and smaller than a depth dimension of the groove is previously formed at a predetermined position on the display panel substrate. After forming and transferring the partition material filled in the grooves of the transfer intaglio onto the display panel substrate in a state where the grooves of the transfer intaglio are aligned with the protrusions on the display panel substrate, the transfer intaglio is removed. A method for forming a partition of a thin display device, comprising forming a partition having a projection as a core material on the panel substrate, away from the display panel substrate.
の材料から形成され、かつ前記隔壁材料が光硬化性の材
料を含んでなり、当該隔壁材料を表示パネル基板上に転
写した後、前記表示パネル基板の前記突起物の形成され
ていない面、前記転写凹版の溝の形成されていない面の
いずれか、もしくは両方から、前記光硬化性材料が硬化
する波長の光を照射して当該光硬化性隔壁材料を硬化さ
せ、前記突起物に前記光硬化性隔壁材料を接着すること
を特徴とする請求項1記載の薄型表示装置の隔壁形成方
法。2. The method according to claim 2, wherein the panel substrate and the transfer intaglio are formed of a light-transmissive material, and the partition material includes a photo-curable material, and after transferring the partition material onto a display panel substrate, By irradiating light having a wavelength at which the photocurable material is cured, the surface of the display panel substrate on which the protrusions are not formed, the surface of the transfer intaglio where the grooves are not formed, or both. 2. The method according to claim 1, wherein the photo-curable partition wall material is cured, and the photo-curable partition wall material is adhered to the protrusion.
請求項1または請求項2記載の薄型表示装置の隔壁形成
方法。3. The method according to claim 1, wherein the protrusion is dark.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2001031508A JP2002237253A (en) | 2001-02-07 | 2001-02-07 | Method for forming partition wall of thin display device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001031508A JP2002237253A (en) | 2001-02-07 | 2001-02-07 | Method for forming partition wall of thin display device |
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Publication Number | Publication Date |
---|---|
JP2002237253A true JP2002237253A (en) | 2002-08-23 |
Family
ID=18895583
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Application Number | Title | Priority Date | Filing Date |
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JP2001031508A Pending JP2002237253A (en) | 2001-02-07 | 2001-02-07 | Method for forming partition wall of thin display device |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100981996B1 (en) | 2004-02-05 | 2010-09-13 | 삼성에스디아이 주식회사 | Field Emission Backlight Device |
-
2001
- 2001-02-07 JP JP2001031508A patent/JP2002237253A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100981996B1 (en) | 2004-02-05 | 2010-09-13 | 삼성에스디아이 주식회사 | Field Emission Backlight Device |
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