JP2002217342A - Phase change type heat radiating member, its manufacturing method and application - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat radiation section that can be fitted without causing positional deviation between heat generation electronic components and a radiating fin and is fluidized by heating, and to provide a radiating fin integrating heat generation electronic component incorporating the heat radiation member. SOLUTION: In the heat radiation member that is subjected to phase change by heating adhesive sections are scattered at least on one surface in the phase- change-type heat radiation member. A method is used to manufacture the phase- change-type heat radiation member. The structure of the cooling fin integrating heat generation electronic component incorporates the phase-change-type heat radiation member.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a phase change type heat radiating member, a method of manufacturing the same, and a use thereof.

[0002]

2. Description of the Related Art In recent years, the demand for higher heat conductivity of heat dissipating members has been increasing with the increase in density of heat-generating electronic components.
In addition, electronic devices such as portable personal computers are becoming smaller, thinner, and lighter. Accordingly, heat dissipating members used in these electronic devices are required to have high thermal conductivity.

Conventionally, as a method for improving the thermal conductivity of a heat dissipating member, a heat dissipating grease containing a high thermal conductive filler, or particles having high thermal conductivity are dispersed in a flexible and resilient matrix such as silicone rubber. What has been done is the mainstream.

However, heat radiation grease tends to be avoided due to problems such as poor workability in a coating process and contamination of peripheral parts. In addition, since the thickness of the flexible member in which particles having high thermal conductivity are dispersed becomes relatively thick when used,
When mounted between the heat-generating electronic component and the radiation fins, it has been difficult to extremely reduce the thermal resistance, which is a heat transfer index based on mounting, even if the heat radiation member itself has high thermal conductivity.

That is, the thermal conductivity of the heat dissipating member itself is increased, and the heat dissipating member microscopically follows and closely adheres to the joint surface between the heat-generating electronic component and the heat dissipating fin, thereby reducing the thermal contact resistance. Ideally, the thickness of the member during use should be as small as possible.

On the other hand, as the high thermal conductive filler, there are aluminum nitride, boron nitride, silicon nitride, alumina, silicon carbide, graphite, diamond, metal or a mixture thereof. Among them, aluminum nitride is particularly suitable. Many heat dissipating members have been proposed (JP-A-2-133450, JP-A-3-1487).
No. 3, JP-A-4-174910 and JP-A-6-174910.
164174, JP-A-6-209057, etc.). However, even if these high thermal conductive fillers are dispersed in the heat dissipating member as described above, it is difficult to drastically reduce the thermal resistance, although the thermal conductivity of the heat dissipating member itself can be improved.

On the other hand, JP-A-10-67910 discloses a thermally stable wax comprising a methylsiloxane host and a polyorganosiloxane graft polymer of a linear hydrocarbon having an unsaturated bond at a single terminal, alumina, An interface material comprising a thermally conductive particulate solid viscosity stabilizer selected from the group consisting of boron nitride, graphite, silicon carbide, diamond, metal powder or mixtures thereof has been disclosed. Since the siloxane graft polymer is expensive and has a relatively high melt viscosity, the amount of the high heat conductive filler to be filled is extremely limited in order to express desired fluidity.

Japanese Patent Application Laid-Open No. 06-13508 discloses a thermal interface characterized by including a metal mesh filled with a thermally conductive semi-fluid material that exhibits a viscous flow when heated. Conductivity is 2.3 ~
It is described as 2.7 W / mK. But,
Since the reinforcing material is a metal mesh and has conductivity, its use is limited, and at the same time, when the joining surface has a complicated shape, it is difficult to follow the shape.

Further, in Japanese Patent No. 3032505, a phase change is generated in which a heat conductive filler is dispersed and a phase change is caused by external heating, so that the phase change can be brought into contact with the electronic component and connect the electronic component and the heat sink. A member is disclosed.
By causing a phase change easily by heating, it can be brought into contact with the electronic component, but when the phase change member is fixed to the heat sink, it must be attached using an adhesive, which saves the trouble of applying the adhesive. In addition, there is a concern that the adhesive becomes a heat resistance layer after the mounting of the phase change member and hinders heat radiation from the heat-generating electronic component.

[0010]

SUMMARY OF THE INVENTION The present invention has been made in view of the above, and an object of the present invention is to provide a heat-dissipating member which undergoes a phase change by heating to impart tackiness to at least one surface thereof. An object of the present invention is to provide a phase-change-type heat radiating member in which positioning and position correction can be easily performed in a mounting operation between a heat-generating electronic component and a heat radiating fin to improve workability.

[0011] Further, even when integrated with a mesh-shaped insulator, it is much easier to handle without a significant decrease in high thermal conductivity.
An object of the present invention is to provide a heat dissipating member that can be processed into a desired shape by cutting or the like, and a heat dissipating fin integrated heat generating component structure using the heat dissipating member.

[0012]

That is, the present invention is as follows. (Claim 1) A phase-change-type heat radiating member, wherein an adhesive portion is interspersed on at least one surface of the heat radiating member that changes phase by heating. (2) The heat-dissipating member according to (1), wherein the heat-dissipating member that changes its phase by heating contains wax and / or paraffin and a high thermal conductive filler. (Claim 3) The phase change type heat radiating member according to claim 2, further comprising a thermoplastic resin. (4) The phase-change-type heat radiating member according to any one of (1) to (3), which is reinforced with a mesh-shaped insulator. (Claim 5) The planar shape of the adhesive portion is a circle, an elliptical shape having a ratio of major axis to minor axis of 2 or less, or a shape similar thereto, and the center-to-center distance between adjacent adhesive portions is the average circle equivalent diameter of the adhesive portion. The phase-change type heat radiation according to any one of claims 1 to 4, wherein the heat radiation rate is 3 to 10 times, and the formation ratio of the adhesive portion is 0.8 to 20% of the area of the surface on which the adhesive portion is formed. Element. (6) A structure of a heat-radiating fin-integrated heat-generating electronic component, wherein the heat-generating electronic component and the heat-radiating fin are bonded using the heat-radiating member according to any one of (1) to (5). (Claim 7) A heat-dissipating member that changes phase by heating is prepared, a film having holes scattered on at least a surface on which an adhesive portion is formed is arranged, and an adhesive is applied from the upper surface of the film. A method for manufacturing a phase-change-type heat radiating member, comprising removing an adhesive portion corresponding to a hole. (Claim 8) The method for manufacturing a phase-change-type heat radiating member according to claim 7, wherein the heat radiating member that changes phase by heating contains wax and / or paraffin and a high heat conductive filler. (Claim 9) The method for producing a phase-change-type heat radiation member according to claim 8, further comprising a thermoplastic resin. (Claim 10) The method of manufacturing a phase-change-type heat radiating member according to any one of claims 7 to 9, wherein the method is reinforced with a mesh-shaped insulator.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in more detail. A major feature of the present invention is that a highly thermally conductive composition that is solid at room temperature but undergoes a phase change upon heating, that is, has good fluidity at a required temperature, and has a reduced thickness. By dispersing the adhesive portions on at least one surface of the molded body, a mounting member between the heat-generating electronic component and the heat-radiating fin can be provided with a heat-radiating member that can be easily positioned and corrected. Further, by reinforcing this molded body with a mesh-shaped insulator, a heat-dissipating member having excellent handleability and good workability can be obtained.

As an example of the high heat conductive composition constituting the phase change type heat radiating member of the present invention and having good fluidity at a required temperature, a composition obtained by filling a matrix with a high heat conductive filler is cited. Can be. As the matrix, a resin or the like which is solid at room temperature and becomes a low-viscosity liquid by heating is used.
Waxes and / or paraffins in the range of 100 ° C. are excellent.

When the heat-generating electronic component and the heat-radiating fin are joined by heating and pressing using a heat-dissipating member having a matrix of wax and / or paraffin, the fluidity is good. Closely following and closely
By sufficiently filling the gap, the thermal contact resistance can be reduced, and the generated heat can be smoothly transmitted in the direction of the radiation fins. Further, both can be brought as close as possible, and the heat radiation efficiency is improved.

If the melting point of the wax or paraffin used in the present invention is less than 40 ° C., when used as a molded article, there is a concern that the composition may be liquefied in a high temperature period such as summer and the shape cannot be maintained. On the other hand, if the melting point exceeds 100 ° C., the temperature of the electronic component becomes high when it is heated and melted and bonded to the heat-generating electronic component, which is not preferable.

Examples of the type of wax include microcrystalline wax, montanic acid wax, montanic acid ester wax, and the like, but are not limited to these as long as the melting point satisfies the above conditions. Paraffin includes paraffin wax, and paraffin that is solid at room temperature with respect to liquid paraffin is particularly referred to as paraffin wax. Specific examples of these are "Paraffin Wax Series" and "Microcrystalline Wax Hi-Mic" manufactured by Nippon Seiwa.
・ Series ”and the like. These waxes and paraffins may be used alone or in combination of two or more.

The thermoplastic resin used in the present invention, which softens at 40 to 100 ° C., exhibits an effect of improving creep properties and brittleness when it is mixed with wax or paraffin to form a molded article. For example, ethylene-based resins, propylene-based resins, ethylene-α-olefin copolymers, ethylene-vinyl acetate copolymers and the like can be cited, but those that exhibit the above effects are not limited thereto. Absent. When the wax or paraffin is heated and melted at a temperature equal to or higher than the melting point and mixed, it is preferable that the wax or paraffin be uniformly mixed. Specific examples thereof include "HIWAX 110P", "HIWAX NP055" and "TAFMER P-0180" manufactured by Mitsui Chemicals, Inc., and "Evaflex 150" manufactured by Dupont Mitsui Polychemicals.

Since the above-mentioned thermoplastic resin has a relatively higher thermal conductivity than wax or paraffin, it can be expected to have an effect of improving the heat radiation characteristics of the heat radiation member. The thermoplastic resin has a content of 4 to wax and / or paraffin.
It can be mixed at 0% by volume or less. If the mixing exceeds 40% by volume, when heated and pressed as a heat dissipating member, the fluidity becomes poor, and the adhesion between the heat-generating electronic component and the heat dissipating fins becomes poor, so that the gap between them is sufficiently reduced. It becomes difficult to fill in. Further, it is necessary to increase the pressure in order to increase the adhesion, which is not preferable for the reliability of the electronic component.

The high thermal conductive filler used in the present invention is, for example, aluminum nitride, silicon nitride, boron nitride, alumina, silicon carbide, graphite, diamond, metal, or a mixture thereof. Aluminum nitride is particularly suitable. . The aluminum nitride filler is formed, for example, by adding about 0.5 to 10% of a sintering aid such as yttrium oxide to the raw material aluminum nitride powder, and then molding the mixture under a non-oxidizing atmosphere such as nitrogen or argon at a temperature of 1600-2.
An aluminum nitride sintered body sintered at about 000 ° C. can be obtained by grinding.

The larger the particle size of the high thermal conductive filler, the larger the size of the thermal conductive path and the more easily the heat can be transferred. However, if the particle diameter is too large, the unevenness of the particle surface becomes large, an air layer serving as heat transfer resistance is easily formed, and furthermore, it comes into contact with the heat-generating electronic components and the radiation fins in close proximity to each other. It is preferable that the powder has an average particle diameter of 10 to 50 μm because there is a concern that the approach may be hindered.

The content of the high thermal conductive filler is preferably from 45 to 55% by volume, particularly preferably from 47 to 50% by volume, based on the total composition. 45% by volume
If it is less than 50%, the required thermal conductivity is hardly obtained, and if it exceeds 55% by volume, the fluidity of the matrix at the melting temperature becomes poor.

In the present invention, the above-mentioned high thermal conductive filler is preferably used in combination with a good thermal conductive fine powder having an average particle diameter of 10 μm or less. Because the average particle size is 10
In the case of powder of only 50 μm, the packing density is limited due to its relatively large average particle size, and there is a limit to the improvement in thermal conductivity. However, the packing density can be increased by using fine powder having good thermal conductivity in combination. This is because an effect of improving thermal conductivity can be expected.

Examples of the fine powder having good thermal conductivity include non-conductive fine powders such as aluminum nitride, silicon nitride, boron nitride, silicon carbide, alumina and zinc oxide. Among them, aluminum nitride and alumina are preferred,
It is not limited to these as long as the average particle size is 10 μm or less. The good heat conductive fine powder is used alone or in combination of two or more.

The total content of the mixed powder composed of the high thermal conductive filler having an average particle diameter of 10 to 50 μm and the finely heat conductive fine powder having an average particle diameter of 10 μm or less is 7 to the total composition.
It is preferably 5% by volume or less, particularly preferably 50 to 70% by volume. If it exceeds 75% by volume, the fluidity of the matrix at the melting temperature becomes poor.

In order to improve the wettability of the mixed powder comprising the high thermal conductive filler and the fine powder having good thermal conductivity to the matrix and to enhance the dispersibility, the powder is subjected to a surface modification treatment before mixing the two. You can also do it. The surface treatment can be performed by mixing a general surfactant or a coupling agent. By surface treatment,
A thin film layer is formed on the powder surface, and the wettability to the matrix is improved. In particular, when aluminum nitride fine powder is used as the good heat conductive fine powder having an average particle diameter of 10 μm or less, the water resistance is significantly improved.

In the present invention, in addition to the above-mentioned materials, a hydrocarbon-based synthetic oil, a softener such as an α-olefin oligomer, a halogen-based , Phosphate ester and other flame retardants,
Powder surface modifiers such as silane-based and titanate-based coupling agents, oxidation-resistant agents such as bisphenol-based and hindered phenol-based, antibacterial agents such as pyridine-based and triazine-based, and colorants such as benga and cobalt aluminate Can also be contained.

The heat dissipating member of the present invention is a wax and / or wax which is solid at room temperature and becomes a low-viscosity liquid upon heating.
Or, a matrix material such as paraffin, a thermally conductive filler, a thermoplastic resin and a finely thermally conductive powder are mixed using a blender, a mixer, or the like at a temperature equal to or higher than the melting point of the matrix material, and molded into a desired shape. It can be manufactured by interspersing adhesive portions on at least one surface of the body.

In the heat dissipating member of the present invention, if the adhesive portion is formed in a plane instead of being scattered, the adhesive portion becomes a heat resistance layer when the heat dissipating member is mounted, and the heat radiation characteristics are degraded. In order not to lower the heat radiation characteristics, the planar shape of the adhesive portions to be dotted is a circle, an elliptical shape having a ratio of major axis to minor axis of 2 or less, or a similar shape, and the center-to-center distance between adjacent adhesive portions is 3 to 10 times the average circle equivalent diameter of the adhesive portion, and the formation rate of the adhesive portion is 0.8 to 20 times the area of the adhesive portion forming surface.
% Is particularly preferred.

When the distance between the centers of the adjacent adhesive portions is less than three times the average equivalent circle diameter of the adhesive portions, when the formation ratio of the adhesive portions exceeds 20% of the entire area, or when the center of the adjacent adhesive portions is Even if the distance is 3 to 10 times the average equivalent circle diameter of the adhesive portion and the formation ratio of the adhesive portion is 0.8 to 20% of the area of the adhesive portion forming surface, the surface of the adhesive portion to be dotted. When the shape is an elliptical shape having a ratio of the major axis to the minor axis exceeding 2 or a shape similar thereto, the adhesive portion may become a heat resistance layer when the heat radiating member is mounted, and the heat radiating property may be deteriorated. On the other hand, the center-to-center distance between the adjacent adhesive portions is one of the average circle equivalent diameter of the adhesive portions.
When the ratio is more than 0 times or the formation ratio of the adhesive portion is less than 0.8% of the area of the surface on which the adhesive portion is formed, the adhesive force is insufficient, so that the displacement is likely to occur when the heat radiating member is mounted.

The method for forming the adhesive portion is to arrange a film in which holes are scattered on at least the surface of the molded article where the adhesive portion is to be formed, apply the adhesive from the upper surface of the film, and then remove the film. Is preferred. This makes it possible to easily disperse the adhesive portions corresponding to the holes of the film. As the adhesive, a synthetic rubber adhesive such as acrylic rubber is used. Specifically, "Spray glue 55" manufactured by Sumitomo 3M Limited can be exemplified.

The heat radiation member of the present invention is preferably reinforced with a mesh insulator. Examples of the mesh insulator include a glass cloth and a polyester cloth. Specific examples include "Text Glass Scrim Cloth KS Series" manufactured by Kanebo and "MON" manufactured by NBC Industries.
OFILAMENT POLYESTER TNo. 6
0, type 55 "and the like.

As the network structure, a structure formed by weaving a fibrous material can be exemplified. In the present invention, the mesh-like insulator having a smaller thickness is better, and preferably has a thickness of 150 μm or less, particularly preferably 120 μm or less. Further, the larger the aperture, the larger the aperture ratio is preferable, but if it is too large, the effect of reinforcing details is lost. In consideration of these, the aperture is desirably 200 to 1000 μm, and more desirably 350 to 800 μm.

When the heat radiating member of the present invention has a structure integrated with a reinforcing material, for example, a mixture comprising a matrix material such as wax and / or paraffin, a thermoplastic resin, a high thermal conductive filler, etc. While maintaining the temperature at a temperature equal to or higher than the melting point of the matrix material, molding by a casting method, an extrusion method or a doctor blade method into a mold, a mesh-like insulator is arranged at an arbitrary position of the molded body and pressed. Methods can be mentioned.

The heat dissipating member of the present invention can be formed into a shape according to the application, but is preferably a sheet in consideration of mass productivity and mountability. Furthermore, even if it is integrated with the mesh insulator, processing such as cutting is easy. For example, continuous cutting can be easily performed with a normal punching blade. It is also possible to mount a block-shaped one depending on the application.

The heat radiation member of the present invention has a thermal conductivity of 2.0 W /
Desirably, it is not less than mK. More preferably 2.5
W / mK or more.

The heat radiating member of the present invention is used, for example, mounted between a heat-generating electronic component and a heat radiating fin. At this time, since adhesive portions are interspersed on at least one surface, the positioning and correction of the heat radiating member can be easily performed without deteriorating the heat radiating characteristics in actual use, and workability is remarkably improved. I do. After attaching the heat dissipation member,
By applying pressure while heating, the heat dissipating member melts and spreads in the gap between them, and adheres microscopically to the respective joining surfaces of the heat-generating electronic component and the heat-radiating fins, and at the same time, the heat-generating electronic component and the heat-radiating fins Bonding can be performed in a state of being close to each other.

The heating conditions at this time need only be higher than the melting point of the matrix material to be used and higher than the softening temperature of the thermoplastic resin. In order not to damage the components, the pressure is preferably in the range of 0.05 to 1.0 MPa.

[0039]

The present invention will be further described below with reference to examples and comparative examples.

Example 1 Paraffin Wax 115 (melting point 47, manufactured by Nippon Seiro Co., Ltd.)
° C) ", a powder having an average particle size of 45 µm obtained by pulverizing an aluminum nitride sintered body as a high thermal conductive filler, and an aluminum nitride powder" H grade (average particle size 1) manufactured by Tokuyama Corporation as a fine thermal conductive fine powder. .6 μm) ”at 85 ° C. in the proportions shown in Table 1 to obtain a slurry. The slurry was vacuum-defoamed at 85 ° C., poured into a mold having a PET film treated with a release agent, and pressed into a sheet at room temperature. After pressing,
The sample was taken out together with the PET film, and the molded product cured at room temperature was peeled off from the PET film to obtain a sheet-shaped phase change member having a thickness of 0.32 mm.

One surface of the sheet-shaped phase-change member is covered with a PET film having a hole of a predetermined shape shown in Table 1, and from above, a “spray paste 55” manufactured by Sumitomo 3M Ltd. is applied as an adhesive from about 20 to 50 μm. Then, the PET film was removed and the adhesive portions having a shape corresponding to the holes were scattered to produce a heat dissipating member.

Example 2 An ethylene-vinyl acetate copolymer ("Evaflex 150" manufactured by DuPont-Mitsui Polychemicals) was used as a thermoplastic resin while "Paraffin Wax 115" manufactured by Nippon Seirowa Co., Ltd. was heated and melted at 85 ° C. Were heat-mixed at the ratios shown in Table 1, the planar shape of the adhesive portion was rectangular, and the sheet thickness was 0.18 mm, to produce a heat dissipation member according to Example 1.

Example 3 A slurry was obtained in the same manner as in Example 2,
PE degassed in vacuum while keeping the pressure in the mold
T film was poured into the set, and a polyester mesh ("MONOFIL" manufactured by NBC Industries, Ltd.) was placed thereon.
AMENT POLYESTER TNo. 60, type 55 ", mesh opening 370 μm, thickness 90 μm)
A heat radiation member was manufactured in the same manner as in Example 2 except that the sheet was press-formed at room temperature and the planar shape of the adhesive portion was square.

Examples 4-5 A heat radiation member was manufactured according to Example 3, using spherical alumina powder or boron nitride powder as the high thermal conductive filler and alumina powder or zinc oxide powder as the fine thermal conductive powder.

Comparative Example 1 A heat radiating member was manufactured in the same manner as in Example 1 except that no adhesive portions were scattered.

Comparative Example 2 A heat radiating member was manufactured in the same manner as in Example 1 except that the adhesive portion was formed on the entire surface of the heat radiating member.

Regarding the obtained heat radiating member,
(1) Thermal resistance, (2) thermal conductivity, and (3) handleability were evaluated. Tables 1 and 2 show the results.

(1) Thermal resistance After the heat dissipating member was screwed so that a pressure of 0.35 MPa was applied between the TO-3 type copper heater case and the copper plate,
Heat the heater case and the copper plate to 60 ° C. and then cool to room temperature. Next, when a power of 15 W was applied to the heater case and the temperature was maintained for 4 minutes, the temperature difference between the copper heater case and the copper plate was measured and calculated by the equation (1). Thermal resistance (° C / W) = temperature difference (° C) / applied power (W) (1)

(2) Thermal conductivity Calculated by equation (2). Here, the sample thickness is the thickness at the time of thermal resistance measurement (the sample thickness when the sample is screwed so that a pressure of 0.35 MPa is applied to the sample, the heater case and the copper plate are heated to 60 ° C., and then cooled to room temperature). did. Also,
The heat transfer area was a TO-3 type heat transfer area of 0.0006 m ² . Thermal conductivity (W / mK) = [sample thickness (m)] / [thermal resistance (° C./W)×heat transfer area (m ² )] (2)

(3) Handleability The heat radiation member is punched into a shape of 12 × 12 mm and 10 mm
The adhesive portion was arranged on the upper surface of the heat-generating electronic component of 10 mm so that the adhesive portion was in contact with the electronic component. Note that the heat radiating member of Comparative Example 1 having no adhesive portion was arranged such that an arbitrary surface was in contact with the electronic component. Next, a heat radiating fin having a size of 50 × 50 mm and a height of 30 mm was covered from the upper surface, and fixed with a leaf spring.
Thereafter, the leaf spring was removed and disassembled, and it was visually confirmed whether or not the heat dissipating member was displaced from the upper surface of the heat-generating electronic component. When viewed from directly above after disassembly, the case where the upper surface of the heat-generating electronic component was viewed from the end without the heat-radiating member completely covering the upper surface of the heat-generating electronic component was regarded as having a position shift. The same operation was performed 100 times for one kind of heat radiating member, and the number of times that no displacement occurred was measured.

[0051]

[Table 1]

[0052]

[Table 2]

Next, the heat radiating member obtained in the embodiment of the present invention is sandwiched between the heat-generating electronic component and the heat radiating fin,
And a pressure of 0.35 MPa was applied to produce a heat-generating electronic component integrated with a radiation fin. In each case, it was confirmed that the heat dissipation member had a structure that microscopically followed and closely adhered to the joint surface between the heat-generating electronic component and the heat dissipation fin without causing displacement, and sufficiently filled the gap between the two. .

[0054]

According to the present invention, there is provided a heat dissipating member which can be mounted between a heat-generating electronic component and a heat dissipating fin without causing a displacement and which is fluidized by heating.

According to the present invention, a heat-radiating fin-integrated heat-generating electronic component structure having excellent heat-radiating characteristics is provided.

According to the manufacturing method of the present invention, a heat-dissipating member that can be mounted between a heat-generating electronic component and a heat-dissipating fin without causing a positional shift and that is fluidized by heating can be easily manufactured.

Claims (10)

[Claims] 1. A phase-change type heat radiating member, wherein an adhesive portion is scattered on at least one surface of the heat radiating member which changes phase by heating. 2. The heat-dissipating member according to claim 1, wherein the heat-dissipating member that changes its phase by heating contains wax and / or paraffin and a high thermal conductive filler. 3. The phase-change-type heat radiating member according to claim 2, further comprising a thermoplastic resin. 4. The phase-change radiating member according to claim 1, wherein the member is reinforced with a mesh-like insulator. 5. The flat shape of the adhesive portion is circular, and the major / minor diameter ratio is 2.
The following oval or similar shapes,
The center-to-center distance between adjacent adhesive portions is 3 to 10 times the average equivalent circle diameter of the adhesive portion, and the formation ratio of the adhesive portion is 0.8 to 20% of the area of the adhesive portion forming surface. The phase-change-type heat radiating member according to claim 1, wherein: 6. A heat-radiating fin-integrated heat-generating electronic component structure comprising a heat-radiating member and a heat-radiating fin bonded to each other using the heat-radiating member according to claim 1. 7. A heat dissipating member which changes its phase by heating is prepared, a film having holes scattered on at least a surface on which an adhesive portion is formed is arranged, and an adhesive is applied from the film upper surface. A method for manufacturing a phase-change-type heat radiating member, comprising removing an adhesive portion corresponding to a hole. 8. The method according to claim 7, wherein the heat-dissipating member that changes its phase by heating contains wax and / or paraffin and a high thermal conductive filler. 9. The method according to claim 8, further comprising a thermoplastic resin. 10. The method for manufacturing a phase-change heat radiating member according to claim 7, wherein the member is reinforced with a mesh-like insulator.