JP2002284961A - Epoxy-based resin composition and semiconductor device using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in crack resistance and adhesiveness. SOLUTION: This semiconductor-sealing material consists of (A) an epoxy resin containing a 2-functional epoxy compound having the following (I) and/or (II) structures (wherein, R1 to R10 are each H or methyl), (B) a curing agent containing a phenolic curing agent having the following (III) or (IV) structures (wherein, R11, R12 are each any of H, methyl or phenyl; R13 to R16 are each H or a 1-5C hydrocarbon group; and R17 to R20 are each H or a 1-5 hydrocarbon group), (C) a filler and further (D) a silane coupling agent, and the semiconductor device using the same is also provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition which is excellent in moldability and reliability and is particularly suitable for semiconductor encapsulation.

[0002]

2. Description of the Related Art Epoxy resins are excellent in heat resistance, moisture resistance, electrical properties, adhesiveness, etc., and can be added with various properties by blending and prescription, so that they are used as industrial materials such as paints, adhesives, and electrical insulating materials. Have been.

For example, as a method of sealing an electronic circuit component such as a semiconductor device, a hermetic seal made of metal or ceramic and a resin seal made of phenol resin, silicone resin, epoxy resin or the like have been conventionally proposed. The resin used for such sealing is called a sealing resin. Among them, resin sealing with an epoxy resin is most actively performed in terms of balance between economy, productivity and physical properties. The sealing method using an epoxy resin is generally performed by using a composition in which a curing agent, a filler, and the like are added to an epoxy resin, setting the semiconductor element in a mold, and sealing by a transfer molding method or the like. Have been done. The characteristics required of the epoxy resin composition for semiconductor encapsulation include reliability and moldability, and the reliability includes solder heat resistance, high-temperature reliability, heat resistance, moisture resistance, and the like. Are fluidity, hardness when heated, burrs and the like.

Recently, high density and automation of mounting a semiconductor device package on a printed circuit board have been promoted, and the semiconductor device package is mounted on the surface of the substrate instead of the conventional "insertion mounting method" in which lead pins are inserted into holes of the substrate. "Surface mounting method" for soldering has become popular. Along with this, the semiconductor device package has been changed from the conventional DIP (dual in-line package) to a thin FPP (flat plastic package) suitable for high-density mounting and surface mounting.
Package). Among them, recently,
With the advance of fine processing technology, TSO with a thickness of 2mm or less
P, TQFP and LQFP are becoming mainstream. Therefore, it becomes more susceptible to external influences such as humidity and temperature, and reliability such as solder heat resistance, high temperature reliability, and heat resistance becomes more and more important in the future.

In surface mounting, mounting is usually performed by solder reflow. In this method, a semiconductor device package is placed on a substrate, and the semiconductor device package is exposed to a high temperature of 200 ° C. or more, and the solder previously applied to the substrate is melted to adhere the semiconductor device package to the substrate surface. In such a mounting method, the entire semiconductor device package is exposed to a high temperature. At this time, stress such as thermal stress is applied between the sealing resin and each member such as a lead frame and a semiconductor chip inside the package. At this time, if the adhesiveness of the sealing resin is poor, peeling occurs between the sealing material and members in the package.
When peeling occurs, cracks are generated from the peeling as a starting point, or moisture is precipitated at the peeled portion, which lowers the reliability of the semiconductor. Therefore, the adhesiveness between the sealing resin for semiconductor and the member is very important.

Further, in recent years, lead-free solder containing no lead has been used from the viewpoint of environmental protection. Lead-free solder has a high melting point, which increases the reflow temperature, and is required to have higher adhesion than before.

[0007]

SUMMARY OF THE INVENTION An object of the present invention is to provide a resin composition having high adhesion to a semiconductor package member and excellent reliability such as crack resistance during reflow, thereby achieving higher temperature. An object of the present invention is to enable a resin-sealed semiconductor corresponding to a reflow temperature.

[0008]

In order to solve the above problems, the present invention mainly has the following constitution. That is,
"An epoxy resin composition comprising an epoxy resin (A), a curing agent (B), a filler (C), and a silane coupling agent (D), wherein the epoxy resin (A) and the curing agent (B) are Also contains a bifunctional compound in an amount of 5% by weight or more based on the amounts of the epoxy resin (A) and the curing agent (B),
The proportion of the bifunctional compound is 40% by weight or more and 80% by weight or less based on the total amount of the epoxy resin (A) and the curing agent (B), and the amount of the filler (C) is 80 to 80%.
An epoxy resin composition characterized by being 96% by weight. ".

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The configuration of the present invention will be described below in detail.

[0010] The epoxy resin composition of the present invention contains an epoxy resin (A), a curing agent (B), a filler (C), and a silane coupling agent (D).

In the present invention, the epoxy resin (A) and the curing agent (B) each contain a bifunctional compound in an amount of 5% by weight or more based on the amount of the epoxy resin (A) and the curing agent (B), respectively. In addition, it is essential that the proportion of the bifunctional compound is 40% by weight or more and 80% by weight or less based on the total amount of the epoxy resin (A) and the curing agent (B). When the bifunctional compound is present in an amount of 40% by weight or more based on the total amount of the epoxy resin (A) and the curing agent (B), the elastic modulus at 260 ° C. of the cured product of the composition decreases, Is improved. Further, by controlling the amount of the bifunctional compound to 80% by weight or less, the strength at 260 ° C. is maintained, and both the crack resistance and the adhesion can be achieved.

The epoxy resin (A) contains at least 5% by weight of a bifunctional epoxy compound. The bifunctional epoxy compound preferably has a molecular weight of 500 or less, and particularly a biphenyl type epoxy resin represented by the following chemical formula (I).

[0013]

Embedded image (R1 to R4 are a hydrogen atom or a methyl group) or a bisphenol-type epoxy resin represented by the following chemical formula (II)

[0014]

Embedded image (R5 to R10 are a hydrogen atom or a methyl group) and the like are particularly preferable in terms of improving the fluidity and decreasing the elastic modulus.

Depending on the use, two or more bifunctional epoxy compounds may be used in combination. Further, an epoxy resin having two or more epoxy groups can be used together with a bifunctional epoxy compound. Examples of the epoxy resin having two or more epoxy groups include cresol novolak type epoxy resin, phenol novolak type epoxy resin, phenol aralkyl type epoxy resin, naphthol aralkyl type epoxy resin, oligomer of bisphenol A type epoxy resin, bisphenol F type epoxy resin And an oligomer of a tetramethylbisphenol F-type epoxy resin. The amount of the epoxy resin (A) used is usually 2.0 to 10% by weight based on the resin composition.

The curing agent (B) contains at least 5% by weight of a bifunctional curing agent. As the bifunctional curing agent, a compound having two phenolic hydroxyl groups is preferable, and in particular, a bifunctional phenol curing agent represented by the following chemical formula (III)

[0017]

Embedded image (R11 and R12 are any of a hydrogen atom, a methyl group and a phenyl group, and R13 to R16 are a hydrocarbon group having 1 to 5 carbon atoms.) Or a bifunctional phenol cured by the following chemical formula (IV) Agent

[0018]

Embedded image (R17 to R20 are a hydrogen atom or a hydrocarbon group having 1 to 5 carbon atoms.) From the viewpoint of lowering the elastic modulus, maintaining the strength, and improving the fluidity, these are preferred. By using a bifunctional curing agent, the elasticity of the cured product of the composition at 260 ° C. is reduced, and the adhesion is greatly improved.

Examples of the bifunctional phenol curing agent represented by the chemical formula (III) include bisphenol F, 4,4'-ethylidene-bisphenol (bisphenol E),
4 '-(1-methylethylidene) bis (2-methylphenol) (bisphenol C), 4,4'-(1-α-
Methyl-benzylidene) bisphenol (bisphenol AP), tetramethylbisphenol F and the like are preferred.

The total amount of the bifunctional epoxy compound and the bifunctional curing agent is from 40% by weight to 80% by weight based on the total amount of the epoxy resin (A) and the curing agent (B). It is necessary to be. By setting the total amount of the bifunctional epoxy compound and the bifunctional curing agent in this range, the high-temperature flexural modulus and the high-temperature flexural strength of the resin composition can be in specified ranges. The compounding ratio of the bifunctional epoxy compound and the bifunctional curing agent can be arbitrarily determined as long as the numerical range of the high-temperature bending elastic modulus and the high-temperature bending strength is satisfied.

Depending on the application, two or more kinds of bifunctional curing agents may be used in combination. Further, a curing agent other than a bifunctional curing agent may be used in combination, and the type thereof is not particularly limited as long as it reacts with the epoxy resin (A) and cures. Specific examples thereof include, for example, novolak resins such as phenol novolak and cresol novolak,
Examples include bisphenol compounds such as bisphenol A, acid anhydrides such as maleic anhydride, phthalic anhydride, and pyromellitic anhydride, and aromatic amines such as metaphenylenediamine, diaminodiphenylmethane, and diaminodiphenylsulfone. Above all, a curing agent having a phenolic hydroxyl group is preferable for sealing a semiconductor device from the viewpoint of excellent heat resistance, moisture resistance and storage stability. Specific examples of the curing agent having a phenolic hydroxyl group include a phenol novolak resin, a cresol novolak resin,
Novolak resins such as naphthol novolak resin, tris (hydroxyphenyl) methane, 1,1,2-tris (hydroxyphenyl) ethane, 1,1,3-tris (hydroxyphenyl) propane, condensed compounds of terpene and phenol, dicyclo Pentadiene skeleton-containing phenolic resin, phenol aralkyl resin, phenol aralkyl resin containing a biphenyl skeleton, naphthol aralkyl resin, etc. can be mentioned, but from the viewpoint of heat resistance, adhesion, etc. Phenol aralkyl resins are preferred.

The content of the curing agent (B) relative to the total epoxy resin composition is usually 2.5 to 10% by weight, and the mixing ratio of the epoxy resin (A) and the curing agent (B) is usually 1. 5 to 0.5.

In the present invention, the epoxy resin (A)
A curing catalyst may be used to accelerate the curing reaction between the curing agent and the curing agent (B). The curing catalyst is not particularly limited as long as it promotes the curing reaction. For example, 2-methylimidazole,
Imidazole compounds such as 2,4-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-heptadecylimidazole, triethylamine, benzyldimethylamine, α-methylbenzyl Methylamine, 2- (dimethylaminomethyl) phenol,
Tertiary amine compounds such as 2,4,6-tris (dimethylaminomethyl) phenol, 1,8-diazabicyclo (5,4,0) undecene-7 and salts thereof, zirconium tetramethoxide, zirconium tetrapropoxide, Organometallic compounds such as tetrakis (acetylacetonato) zirconium and tri (acetylacetonato) aluminum, and triphenylphosphine, trimethylphosphine, triethylphosphine, tributylphosphine, tri (p-methylphenyl) phosphine, tri (nonylphenyl) phosphine, etc. Organic phosphine compounds and salts thereof.

Depending on the application, two or more of these curing catalysts may be used in combination, and the amount added is preferably in the range of 0.1 to 10 parts by weight based on 100 parts by weight of the epoxy resin (A).

The proportion of the filler (C) in the present invention must be 80 to 96% by weight in the whole resin composition. If the content of the filler (C) is less than 80% by weight, the water absorption of the resin composition tends to increase, and good solder heat resistance cannot be obtained. On the other hand, if it exceeds 96% by weight, the adhesive property and the package filling property will be reduced. Furthermore, since it is possible to cope with “lead-free solder” in which the temperature of the solder reflow becomes 260 ° C., the ratio of the filler (C) is 8%.
It is more preferable that the content be 8% by weight or more and 96% by weight or less. Further, since the proportion of the inorganic substance in the entire resin composition material is high, the flame retardancy is increased, and the flame retardancy can be maintained without using a conventionally used flame retardant. This eliminates the need to add a halogen component conventionally used as a flame retardant to the resin composition, which is preferable in terms of environmental protection.

The type of the filler is preferably spherical silica (c), and its ratio is preferably at least 80% by weight based on the whole filler. Generally, as the proportion of the filler (C) increases, moldability such as fluidity deteriorates. However, the use of spherical silica (c) can further suppress the deterioration of fluidity. As for the particle diameter of the filler, the average particle diameter (median diameter) is preferably 20 μm or less.

Depending on the application, two or more fillers can be used in combination. As the filler to be used in combination, an inorganic filler is preferable. Specifically, fused silica, crystalline silica,
Examples include calcium carbonate, magnesium carbonate, alumina, magnesia, clay, talc, calcium silicate, titanium oxide, asbestos, and glass fibers. The shape and average particle size of the filler used in combination are not particularly limited, but are preferably spherical in view of fluidity and moldability, and the average particle size is preferably 20 μm or less.

In the present invention, it is preferable to add a silane coupling agent (D) for the purpose of improving reliability. As the silane coupling agent (D), a known silane coupling agent can be used. Specific examples thereof are γ-glycidoxypropyltrimethoxysilane,
γ-glycidoxypropylmethyldiethoxysilane, N
-Β (aminoethyl) γ-aminopropyltrimethoxysilane, N-β (aminoethyl) γ-aminopropylmethyldimethoxysilane, γ-aminopropyltriethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, γ -Mercaptopropyltrimethoxysilane, γ-ureidopropyltriethoxysilane and the like, and depending on the application, two or more kinds may be added.

The amount of the silane coupling agent (D) added is
From the viewpoint of moldability and reliability, usually 0.1 to 5 parts by weight, preferably 0.2 to 3 parts by weight, based on 100 parts by weight of the filler,
Particularly preferably, it is 0.3 to 1.5 parts by weight. The silane coupling agent (D) can be added by mixing with other components, but in the present invention, the filler (C) is preliminarily surface-treated with the silane coupling agent (D). It is preferable in terms of improving reliability, adhesiveness, and fluidity.

The epoxy resin composition of the present invention contains a coloring agent such as carbon black and iron oxide, silicone rubber,
Styrene block copolymers, olefin polymers, modified nitrile rubber, modified polybutadiene rubber and other elastomers, thermoplastic resins such as polystyrene, coupling agents such as titanate coupling agents, long chain fatty acids, metal salts of long chain fatty acids A releasing agent such as an ester of a long-chain fatty acid, an amide of a long-chain fatty acid, or paraffin wax, and a crosslinking agent such as an organic peroxide can be optionally added.

The epoxy resin composition of the present invention has a cured product having a flexural modulus at 260 ° C. of 0.9 GPa or less,
In addition, it is necessary that the bending strength at 260 ° C. is 5.0 MPa or more. By lowering the high-temperature elastic modulus in a state where the high-temperature bending strength is high, it becomes possible to increase the adhesion without causing cracks in the package. Even if the high temperature bending elastic modulus is 0.9 GPa or less, the high temperature bending strength is 5.0.
If it is smaller than MPa, many cracks are generated at the time of reflow of the package, and even if the bending strength is 5.0 MPa or more, if the high-temperature bending elastic modulus is more than 0.9 GPa, the adhesion is insufficient, and the package peels off at the time of reflow. Often occur. The high-temperature flexural modulus is more preferably 0.7 GPa or less, and the high-temperature strength is more preferably 7.0 MPa.

The epoxy resin composition of the present invention preferably has a cured product having a linear expansion coefficient α at 260 ° C. of 40 ppm or less. By lowering the linear expansion coefficient at a high temperature, the adhesion is further improved.

The resin composition satisfying the above conditions can be achieved by appropriately selecting the raw material components. As described above, the bifunctional resin used as the epoxy resin (A) and the curing agent (B) is used. It is preferable that the compound of formula (I) or (I) be contained in a specific range.
A bifunctional epoxy compound represented by the formula (I);
It is more preferable to use a bifunctional phenol curing agent represented by II) or formula (IV).

The epoxy resin composition of the present invention is preferably produced by melt-kneading. Specifically, the raw materials are mixed to some extent with a mixer or the like, and the mixed raw materials are mixed at a temperature of 60 to 140 ° C. using a known kneading method such as a Banbury mixer, a kneader, a roll, a single or twin screw extruder and a co-kneader. It is manufactured by melt-kneading in the temperature range of This epoxy resin composition is usually provided in a semiconductor form by molding from a powder or tablet state. As a method for sealing the semiconductor element, a low-pressure transfer molding method is generally used, but an injection molding method or a compression molding method is also possible. As the molding conditions, for example, the epoxy resin composition is molded at a molding temperature of 15
0 ° C to 200 ° C, molding pressure 5 to 15 MPa, molding time 3
A semiconductor device is manufactured by molding in 0 to 300 seconds to obtain a cured product of the epoxy resin composition. Further, if necessary, the above-mentioned molded product is additionally heated at 100 to 200 ° C. for 2 to 15 hours.

[0035]

The present invention will be described below in detail with reference to examples.

Examples 1 to 16 and Comparative Examples 1 to 9 The raw materials used in the present invention are as follows. <Epoxy resin I> Bisphenol F type epoxy resin represented by the following chemical formula (V) (epoxy equivalent 192)

Embedded image

<Epoxy resin II>4,4'-bis (2,
3-epoxypropoxy) -3,3 ', 5,5'-tetramethylbiphenyl (epoxy equivalent 193) <Epoxy resin III> o-cresol novolak type epoxy resin (epoxy equivalent 194) <Curing agent I> The following chemical formula Bifunctional phenol compound represented by (VI) (bisphenol Z, hydroxyl equivalent 134)

Embedded image

<Curing agent II> 4,4 '-(1-methylethylidene) bis (2-methylphenol) (bisphenol C, hydroxyl equivalent: 128) <Curing agent III> Phenol represented by the following chemical formula (VII) Aralkyl resin (hydroxyl equivalent 175)

Embedded image

(Includes about 90% by weight of a component in which n is 1 to 3.) <Inorganic filler> Amorphous spherical fused silica having an average particle size of about 10 μm <Silane coupling agent> N-phenylaminopropyltrimethyl Methoxysilane (the blending amount is the same and 0.5% by weight based on the resin composition) (The silane coupling agent was previously mixed with the inorganic filler.) <Curing accelerator> Triphenylphosphine <Colorant> Carbon Black (the blending amount is the same and 0.2% by weight based on the resin composition) <Release agent> Carnauba wax (the blending amount is the same and 0.3% by weight based on the resin composition)

Each component is represented by the composition ratio shown in Tables 1 to 3,
Dry blending was performed with a mixer. This was heated and kneaded for 5 minutes using a mixing roll having a roll surface temperature of 90 ° C., then cooled and pulverized to produce an epoxy resin composition for semiconductor encapsulation. The amounts of the silane coupling agent, carbon black, and carnauba wax added to the composition are uniform, and are therefore omitted from the table. The numbers in the table represent% by weight.

Next, Examples 1 to 16 and Comparative Examples 1 to 9
The flexural strength and flexural modulus at 260 ° C. of the cured product of the resin composition obtained in were measured according to JIS K 6911 5.17. The measured values are shown in Tables 1 to 3. The molding conditions for the cured product were a molding temperature of 175 ° C., a cure time of 90 seconds, and a post cure of 175 ° C. for 4 hours.

The linear expansion coefficient α of these resin compositions at 260 ° C. was determined by TA Instruments (TA).
(TMA 2940) thermomechanical analyzer. The measured values are shown in Tables 1 to 3.

Further, using this resin composition, a low pressure transfer molding method was used at 175.degree.
208 pinLQ with a chip size of 10 × 10 mm, mounted with a simulated element whose surface has been treated with a nitride film under the conditions of seconds.
FP (outer size: 28 x 28 x 1.4 mm, frame material:
Copper, lead frame part: silver plating)
After post-curing at 4 ° C. for 4 hours, the physical properties of each resin composition were evaluated by the following physical property measuring methods. The molding conditions were 175 ° C. and a cure time of 90 seconds, and the post cure was 175 ° C. for 4 hours.

Crack resistance: 208 pin LQFP was added to 2
After molding 0 pieces, post-curing, humidifying at 85 ° C./60% RH for 168 hours, heat-treating for 2 minutes in an IR reflow furnace at a maximum temperature of 260 ° C., and visually inspecting the number of packages having external cracks. Adhesion: After molding 20 pieces of 208 pin LQFP, post-curing, humidifying at 85 ° C./60% RH for 168 hours,
After heat treatment for 2 minutes in an IR reflow furnace at a maximum temperature of 260 ° C., the peeling state of the chip surface of the lead frame was measured by an ultrasonic flaw detector (“mi-scope 1” manufactured by Hitachi Construction Machinery Co., Ltd.).
0 "), and the number of packages where peeling occurred was examined. Tables 1 to 3 show the evaluation results.

[0045]

[Table 1]

[0046]

[Table 2]

[0047]

[Table 3]

As shown in Tables 1 to 3, the epoxy resin composition of the present invention has excellent crack resistance and adhesion.

On the other hand, the ratio of the bifunctional curing agent is 5
Less than 5% by weight of Comparative Examples 1 and 2
In Comparative Example 2 where the amount is less than the weight%, the adhesion is inferior. Comparative Examples 2, 3, and 4 in which the proportion of the bifunctional compound is less than 40% by weight
In Comparative Examples 5, 6 and 7, which are higher than 80% by weight, crack resistance is inferior. Comparative Example 8 in which the ratio of the filler is low is inferior in adhesion and crack resistance, and Comparative Example 9 in which the ratio of the filler is high.
Inferior in adhesion and crack resistance.

Thus, it can be seen that sufficient performance is exhibited only when the proportion of the bifunctional compound, the proportion of the filler, and the strength and elastic modulus of the cured product at 260 ° C. are satisfied.

[0051]

An epoxy resin composition comprising an epoxy resin (A), a curing agent (B), a filler (C) and a silane coupling agent (D), wherein the epoxy resin (A) and the curing agent ( B) each contains a bifunctional compound in an amount of 5% by weight or more based on the amount of the epoxy resin (A) and the curing agent (B) used, respectively, and the proportion of the bifunctional compound in the epoxy resin (A) And the curing agent (B) is 40% by weight or more and 80% by weight or less, and the amount of the filler (C) is 80 to 96% by weight. Rate is 0.9 GPa or less and bending strength is 5.
By setting the pressure to 0 MPa or more, an epoxy sealing material having excellent crack resistance and adhesion can be obtained.

Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (Reference) H01L 23/29 H01L 23/30 R 23/31 F-term (Reference) 4J002 CD032 CD051 CD062 CD071 DE077 DE137 DE147 DE237 DJ007 DJ017 DJ027 DJ037 DJ047 DL007 EJ036 EX068 EX078 EX088 FA047 FD017 FD146 GQ05 4J036 AD07 AD08 DB05 DB10 DC05 DC06 DC12 DC40 DC46 DD07 FA03 FA05 GA07 GA08 GA28 JA07 4M109 AA01 EA03 EB03 EB06 EB13 EC03

Claims (10)

[Claims] An epoxy resin composition comprising an epoxy resin (A), a curing agent (B) and a filler (C), wherein both the epoxy resin (A) and the curing agent (B) are bifunctional. Is contained in an amount of 5% by weight or more based on the amounts of the epoxy resin (A) and the curing agent (B), and the proportion of the bifunctional compound is the sum of the epoxy resin (A) and the curing agent (B). 40% by weight or more and 80% by weight or less based on the amount,
And the amount of the filler (C) is 80 to 96% by weight, and the cured product has a flexural modulus at 260 ° C. of 0.9 GPa or less and a flexural strength of 5.0 MPa or more. Epoxy resin composition. 2. The amount of the filler (C) is 88 to 96% by weight, and the cured product has a linear expansion coefficient α at 260 ° C. of 40 pp.
m. The epoxy resin composition according to claim 1, wherein m is equal to or less than m. 3. The epoxy resin composition according to claim 1, further comprising a silane coupling agent (D). 4. The method according to claim 1, wherein the molecular weight of the bifunctional compound in the epoxy resin (A) is 500 or less.
3. The epoxy resin composition according to any one of 3. 5. The filler (C) contains spherical silica in an amount of 80% by weight.
The epoxy resin composition according to any one of claims 1 to 4, wherein the epoxy resin composition contains the above. 6. The epoxy resin composition according to claim 1, wherein the bifunctional epoxy compound contains an epoxy compound represented by the following chemical formula (I). Embedded image (R1 to R4 are a hydrogen atom or a methyl group) 7. A bifunctional epoxy compound represented by the following chemical formula (I)
The epoxy resin composition according to any one of claims 1 to 6, further comprising an epoxy compound represented by (I). Embedded image (R5 to R10 are a hydrogen atom or a methyl group) 8. The method according to claim 1, wherein the bifunctional curing agent is a phenolic curing agent represented by the following chemical formula (III).
The epoxy resin composition according to any one of the above. Embedded image (R11 and R12 are any of a hydrogen atom, a methyl group and a phenyl group, and R13 to R16 are a hydrogen atom or a carbon atom
To 5 hydrocarbon groups. ) 9. The epoxy resin composition according to claim 1, wherein the bifunctional curing agent is a phenolic curing agent represented by the following chemical formula (IV). Embedded image (R17 to R20 are a hydrogen atom or a hydrocarbon group having 1 to 5 carbon atoms.) 10. A semiconductor device sealed with a cured product of the epoxy resin composition according to claim 1.