JP2002246492A - Hermetically sealed package - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To stably secure a sealing surface, eliminate the influence of bubbles and cracks generated at the time of sealing, and improve airtightness and high reliability. SOLUTION: A base portion 1 on which a semiconductor element 13 is mounted.
5, a side wall 16 formed around the base portion 15, and a cap 19 sealed to an opening-side end face so as to seal the opening surrounded by the side wall 16.
The surface to be sealed to the opening-side end surface and the side surface of the surface to be sealed are metallized. As a result, the fusing material 20 used for metallization can be used not only for the sealing surfaces of the side wall 16 of the metal base portion 15 and the cap 19 but also for the cap 19.
Wraparound sealing area can be ensured by the surface tension up to the side surface.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device package in which a semiconductor element is housed in an envelope having a space. The present invention relates to a required hermetic sealing package for a high-frequency semiconductor device.

[0002]

2. Description of the Related Art FIG. 8 shows the structure of a hermetically sealed package in which a semiconductor element is housed in an envelope having a space. A metal base 3 on which the semiconductor element 1 and the ceramic substrates 2 and 2 'are mounted; a side wall 4 formed around the metal base 3; and an input terminal 5 and an output terminal 6 provided on a part of the side wall 4 And a cap 7 hermetically sealed on the upper surface of the side wall 4 of the metal base 3 to form a hermetically sealed package. Only the sealing surface of the side wall 4 of the metal base 3 and the sealing surface of the cap 7 are metallized, and they are sealed and sealed by a fusion material 12 such as AuSn foil.

[0003]

FIG. 9 shows a state in which the hermetically sealed package in FIG. 8 is hermetically sealed. FIG. 10 schematically shows the state of the sealing surface of the semiconductor device having the conventional configuration. FIG. 10 shows a cross section taken along line AA ′ of FIG. The cap 7 is sealed and fixed to the side wall 4 of the metal base portion 3 by the fusion material 12. In the conventional configuration, the metallized surface is
Since both the upper surface and the cap 7 are flat, the fusion material 1
2 is in a plane, the sealing surface is flat and the area is limited. For this reason, there is a problem that air bubbles and cracks of the fusion material 12 which are generated when the fusion material 12 is not melted well cannot be compensated, and airtightness inside the semiconductor device is lacking. In addition, in the conventional configuration, misalignment when the cap is sealed to the hermetically sealed package is also likely to occur, so that the sealing surface is shifted and the sealing area is reduced, and the bubbles and cracks cannot be compensated as described above. However, there is a problem that the airtightness inside the semiconductor device is lacking. In a semiconductor device used for a satellite communication device, a mobile phone base station, or the like, it is important how to secure airtightness and achieve high reliability.

[0004] Therefore, an object of the present invention is to provide a highly airtight structure that stably secures a sealing surface, eliminates the effects of bubbles and cracks generated during sealing, and ensures the positional accuracy of the cap during sealing. Another object of the present invention is to provide a hermetically sealed package for a semiconductor device with high reliability.

[0005]

In order to achieve the above object, a hermetically sealed package according to claim 1 of the present invention comprises:
A base portion on which the semiconductor element is mounted, a side wall formed around the base portion, and a cap sealed to an opening-side end surface to seal an opening surrounded by the side wall;
A surface sealed to the opening-side end surface of the side wall of the cap and a side surface of the sealed surface are metallized.

As described above, the surface to be sealed to the opening side end surface of the side wall of the cap and the side surface of the surface to be sealed are metallized, so that the fusion material used for metallizing is not formed between the side wall of the base portion and the cap. Not only the mutual sealing surfaces but also the side surfaces of the cap can be wrapped by the surface tension to secure a sealing area.

According to a second aspect of the present invention, in the hermetic sealing package according to the first aspect, the opening-side end surface of the side wall is a flat processed surface. As described above, since the opening-side end surface of the side wall is a flat processed surface, the sealing surface of the side wall and the cap is flat at the opening-side end surface of the side wall. The performance is improved.

According to a third aspect of the present invention, in the hermetic sealing package according to the first aspect, the end face on the opening side of the side wall is an uneven surface. In this manner, since the opening-side end surface of the side wall is an uneven surface, the positional accuracy and sealing area of the side wall and the cap at the time of sealing each other can be secured, and high airtightness is realized.

According to a fourth aspect of the present invention, in the hermetic sealing package according to the first aspect, the sealing surface of the cap is a flat processed surface. As described above, since the sealing surface of the cap is a flat processed surface, the sealing surfaces of the side wall and the cap at the sealing surface of the cap are flat, but the side surfaces of the cap are airtight because the side surfaces of the cap are metallized. The performance is improved.

According to a fifth aspect of the present invention, in the hermetic sealing package according to the first aspect, the sealing surface of the cap is an uneven surface. As described above, since the sealing surface of the cap is a textured surface, the positional accuracy and the sealing area of the side wall and the cap when sealing each other can be ensured, and high airtightness is realized.

According to a sixth aspect of the present invention, in the hermetic sealing package according to the first, second, third, fourth or fifth aspect, the side wall and the cap are electrically connected by sealing and sealing, and also electrically connected to the base. Have been. As described above, since the side wall and the cap are electrically connected to each other by sealing and sealing, and also electrically connected to the base, the entire semiconductor device is electrically shielded by grounding the base, and the external It is not affected by electromagnetic waves.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is an exploded perspective view showing a configuration of a hermetically sealed package according to a first embodiment of the present invention.

As shown in FIG. 1, the hermetically sealed package comprises a semiconductor element 13 and ceramic substrates 14, 14 '.
A metal base part 15 for mounting the
, An input terminal 17 and an output terminal 18 provided on a part of the side wall 16, and a cap sealed to an opening-side end face so as to seal the opening surrounded by the side wall 16. 19, the surface sealed to the opening end surface of the side wall 16 of the cap 19 and the side surface of the sealed surface are metallized. The base 15 may be made of a material other than metal. That is, any material can be used as long as the semiconductor element can be die-bonded and has good heat dissipation. For example, a ceramic plate having a surface plated with Au can be used.

FIG. 2 is a sectional view showing an assembled state of the hermetically sealed package according to the first embodiment of the present invention, and shows a section at the same position as the AA 'section of the hermetically sealed package of FIG. As shown in FIG. 2, the side wall 16 of the base portion 15 and the cap 19 are hermetically sealed. In this case, the opening-side end face which is the sealing face of the side wall 16 and the sealing face of the cap 19 are flat processed faces. The sealing surface of the side wall 16 of the base portion 15 and the sealing surface and the side surface of the cap 19 are metallized, and the side wall 1 is fused by a fusion material 20 such as AuSn foil.
6 and the cap 19 are sealed and sealed.

The hermetically sealed package of this embodiment is
Not only the sealing surface but also the side surface of the sealing surface is metallized, and the fusion material such as AuSn foil wraps around not only the mutual sealing surface but also the side surface by the surface tension to secure a larger sealing area, Supplies air bubbles and cracks in the fusion material to ensure high airtightness.

A second embodiment of the present invention will be described with reference to FIG. FIG. 3 is a cross-sectional view of the hermetically sealed package according to the second embodiment of the present invention, showing a cross section at the same position as the AA ′ cross section of the hermetically sealed package of FIG. As shown in FIG. 3, the side wall 24 of the base portion and the cap 25 are hermetically sealed. For easy understanding, the space between the side wall 24 of the base portion and the cap 25 is illustrated as being separated. In this embodiment, the opening-side end surface, which is the sealing surface of the side wall 24 of the base portion, and the sealing surface of the cap 25 are formed as a textured surface. In this case, a concave portion 26a is formed on the opening-side end surface of the side wall 24, and a convex portion 26b that fits into the concave portion 26a is formed on the cap 25. Further, similarly to the first embodiment, the sealing surface of the side wall 24 of the base portion, the sealing surface and the side surface of the cap 25 are metallized, and the sealing material 27 such as AuSn foil seals each other. Not only that, it also wraps around to the side due to surface tension, ensuring airtightness.

According to this embodiment, since the sealing surfaces of the side wall 24 of the base portion and the cap 25 are made uneven, the positional accuracy of the side wall 24 and the cap 25 at the time of sealing each other is ensured. A large sealing area is secured to achieve high airtightness.

A third embodiment of the present invention will be described with reference to FIG. FIG. 4 is a cross-sectional view of the hermetically sealed package according to the third embodiment of the present invention, and shows a cross section at the same position as the AA ′ cross section of the hermetically sealed package of FIG. As shown in FIG. 4, the side wall 36 of the base portion and the cap 37 are hermetically sealed. For clarity, the space between the side wall 36 of the base portion and the cap 37 is shown separately. In this embodiment, the opening-side end surface, which is the sealing surface of the side wall 36 of the base portion, and the sealing surface of the cap 37 are formed as a textured surface. In this case, a step 38a is formed in which the inner peripheral side of the opening-side end face of the side wall 36 is recessed, and a step 38b fitted to the step 38a is formed in the cap 37. Further, similarly to the first embodiment, the sealing surface of the side wall 36 of the base portion and the sealing surface and the side surface of the cap 37 are metallized, and the sealing material 39 such as AuSn foil is sealed to each other. Not only that, it also wraps around to the side due to surface tension, ensuring airtightness.

As shown in FIG. 5, a step portion 42a is formed by recessing the outer peripheral side of the opening end surface of the side wall 40, and a step portion 42b fitted to the step portion 42a is formed in the cap 41. Is also good. Also in this case, the sealing surface of the side wall 40 of the base portion and the sealing surface and side surface of the cap 41 are metallized, and the fusion material 43 such as AuSn foil is not only bonded to each other but also to the side surface by surface tension. It keeps round and airtight.

According to this embodiment, since the sealing surfaces of the side walls 36 and 40 of the base portion and the caps 37 and 41 are made uneven, the side walls 36 and 40 and the caps 37 and 41 are formed.
To secure a larger sealing area while ensuring the positional accuracy at the time of sealing with each other, and realize high airtightness.

A fourth embodiment of the present invention will be described with reference to FIG. FIG. 6 is a cross-sectional view of the hermetically sealed package according to the fourth embodiment of the present invention, and shows a cross section at the same position as the AA 'cross section of the hermetically sealed package of FIG. As shown in FIG. 6, the side wall 28 of the base portion and the cap 29 are hermetically sealed. For easy understanding, the space between the side wall 28 of the base portion and the cap 29 is shown as being separated. In this embodiment, the opening-side end surface, which is the sealing surface of the side wall 28 of the base portion, is a flat processing surface, and the sealing surface of the cap 29 is an uneven processing surface. In this case, a recess 30 is formed in the cap 29 so as to fit into the inner peripheral portion of the opening-side end face of the side wall 28. Further, similarly to the first embodiment, the sealing surface of the side wall 28 of the base portion, the sealing surface and the side surface of the cap 29 are metallized, and the sealing material 31 such as AuSn foil seals each other. Not only that, it also wraps around to the side due to surface tension, ensuring airtightness.

According to this embodiment, since the sealing surface of the cap 29 is made uneven, the side wall 28 and the cap 2
9 to secure a larger sealing area while ensuring the positional accuracy when sealing each other, thereby realizing high airtightness.

A fifth embodiment of the present invention will be described with reference to FIG. FIG. 7 is a cross-sectional view of a hermetically sealed package according to a fifth embodiment of the present invention, and shows a cross section at the same position as the AA 'cross section of the hermetically sealed package of FIG. As shown in FIG. 7, the side wall 32 of the base portion and the cap 33 are hermetically sealed. In order to make it easy to understand, the space between the side wall 32 of the base portion and the cap 33 is shown as being separated. In this embodiment, the opening-side end surface, which is the sealing surface of the side wall 32 of the base portion, is an uneven surface, and the sealing surface of the cap 33 is a flat processed surface. In this case, a concave portion 34 into which the peripheral portion of the cap 33 fits is formed on the opening-side end surface of the side wall 32. Further, similarly to the first embodiment, the sealing surface of the side wall 32 of the base portion, the sealing surface and the side surface of the cap 33 are metallized, and the sealing material 35 such as AuSn foil seals each other. Not only that, it also wraps around to the side due to surface tension, ensuring airtightness.

According to this embodiment, since the sealing surface of the side wall 32 is made uneven, a larger sealing area can be obtained while ensuring the positional accuracy of the side wall 32 and the cap 33 at the time of sealing each other. Secure high airtightness.

That is, by using the configuration of the embodiment of the present invention, high reliability can be realized in a semiconductor device used for a satellite communication device, a mobile phone base station, or the like.

As a material of the side wall and the cap, a material in which a surface of a ceramic is plated with Au can be cited as an example. Further, even if the side wall of the base portion and the cap itself are formed of a metal itself having a good adhesive property with a fusion bonding material such as AuSn, it is possible to secure the same airtightness as in the embodiment of the present invention and realize high reliability. Needless to say.
Further, the side wall and the cap may be electrically connected by sealing and sealing, and may also be electrically connected to the base portion.

[0027]

According to the hermetically sealed package according to the first aspect of the present invention, the surface to be sealed to the opening-side end surface of the side wall of the cap and the side surface of the surface to be sealed are metallized. The fusion material used for metallization can be secured not only to the sealing surface of the side wall of the base portion and the sealing surface of the cap but also to the side surface of the cap by surface tension to secure a sealing area.

For this reason, in a hermetically sealed package of a semiconductor device which is used for a satellite communication device or a cellular phone base station and requires high reliability, it is possible to secure the hermeticity which was insufficient with the conventional structure. And high reliability can be realized.

According to the second aspect, since the end face on the opening side of the side wall is a flat processing surface, the sealing face between the side wall and the cap is flat at the end face on the opening side of the side wall, but the side face of the cap is metallized. Airtightness is improved.

According to the third aspect, since the end face on the opening side of the side wall is a textured surface, the positional accuracy and the sealing area of the side wall and the cap at the time of sealing each other can be secured, and high airtightness is realized. I do.

According to the fourth aspect, since the sealing surface of the cap is a flat processed surface, the sealing surfaces of the side wall and the cap are flat at the sealing surface of the cap, but the side surfaces of the cap are metalized. Airtightness is improved.

According to the fifth aspect, since the sealing surface of the cap is an uneven surface, the positional accuracy and the sealing area of the side wall and the cap at the time of sealing each other can be secured, and high airtightness is realized. I do.

According to the sixth aspect, the side wall and the cap are electrically connected to each other by sealing and sealing, and are also electrically connected to the base. Therefore, by grounding the base, the entire semiconductor device is electrically connected. Shielded and not affected by extraneous electromagnetic waves.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing a configuration of a hermetically sealed package according to a first embodiment of the present invention.

FIG. 2 is a sectional view showing an assembled state of the hermetically sealed package according to the first embodiment of the present invention.

FIG. 3 is a sectional view of a hermetically sealed package according to a second embodiment of the present invention.

FIG. 4 is a sectional view of a hermetically sealed package according to a third embodiment of the present invention.

FIG. 5 is a sectional view showing another example of the hermetically sealed package according to the third embodiment of the present invention.

FIG. 6 is a sectional view of a hermetically sealed package according to a fourth embodiment of the present invention.

FIG. 7 is a sectional view of a hermetically sealed package according to a fifth embodiment of the present invention.

FIG. 8 is an exploded perspective view showing a configuration of a conventional hermetically sealed package.

FIG. 9 is a perspective view of the assembled state of FIG. 8;

FIG. 10 is a sectional view taken along line A-A ′ of FIG. 9;

DESCRIPTION OF SYMBOLS 1,13 Semiconductor element 2,14 Ceramic substrate 3,15 Base part of hermetic sealing package 4,16,24,28,32,36,40 Side wall of base part 5,17 Input terminal 6,18 Output terminal 7, 19, 25, 29, 33, 37, 41 Cap 12, 20, 27, 31, 35, 39, 43 Fusing material 26a, 26b, 30, 34, 38a, 38b, 42
a, 42b Uneven processing

Claims (6)

[Claims] 1. A base portion on which a semiconductor element is mounted, a side wall formed around the base portion, and a cap sealed to an opening-side end surface to seal an opening surrounded by the side wall. A hermetically sealed package, characterized in that a surface sealed to the opening-side end surface of the side wall of the cap and a side surface of the sealed surface are metallized. 2. The hermetically sealed package according to claim 1, wherein the opening-side end surface of the side wall is a flat processed surface. 3. The hermetically sealed package according to claim 1, wherein the opening-side end surface of the side wall is an uneven surface. 4. The hermetically sealed package according to claim 1, wherein the sealing surface of the cap is a flat processed surface. 5. The hermetically sealed package according to claim 1, wherein the sealing surface of the cap is a textured surface. 6. The hermetically sealed package according to claim 1, wherein the side wall and the cap are electrically connected by sealing and hermetically sealed, and are also electrically connected to the base portion.