JP2002246130A - Socket - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a socket, capable of further reducing inductance, as compared with the conventional socket. SOLUTION: This socket for inserting a pin of the counterpart is provided with a socket body and a contact mounted on the socket body. The socket body is provided with a contact storing hole penetrating one end face and the other end face. The contact is provided with a base end fixed to the socket body, a contact part coming into contact with the pin of the counterpart, and a solder ball bearing part disposed between the base end part and the contact part. The base end part, the contact part and the solder ball bearing part are positioned in the contact storing hole, and the solder ball bearing part bears a solder ball, in a state of being exposed from the contact storing hole.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a socket for inserting a mating pin, and more particularly to a socket for inserting a plurality of pin grids provided in a semiconductor package.

[0002]

2. Description of the Related Art Conventionally, as a socket into which a mating pin is inserted, for example, a socket shown in FIG. 6 is known. The socket shown in FIG. 2 is a socket 400 into which a mating pin 300 is inserted, and includes a socket body 401 and a contact 402 mounted on the socket body 401.

A socket body 401 has one end surface 401 thereof.
a and a contact receiving hole 403 penetrating the other end surface 401b (upper and lower surfaces). The contact 402 includes a base portion 402a fixed to the socket body 401, a contact portion 402b that comes into contact with the mating pin 300, and a solder ball holding portion 402c. One end of the contact 402 is bifurcated, and the contact portion 402b is provided on one of the bifurcated portions.
2c is provided on the other side.

In the socket 400 having the above structure, the contact portion 4
Since the route from 02b to the solder ball holding portion 402c is bypassed, there is a problem that it is difficult to reduce the inductance.

[0005] The solder ball holding portion 402c is formed at the tip of a relatively thin arm 402d of one of the forked portions, and the solder ball holding portion 402c is easily deformed in the height direction. For this reason, there is a problem that it is difficult to handle at the time of assembly and to maintain the height accuracy of the solder ball 404.

Further, since the contact portion 402b is formed at the tip of the other relatively thin arm 402e of the forked portion, the force for returning to the original shape when the contact portion 402b is deformed in the lateral direction. Relatively weak. For this reason, it is difficult to make the contact portion 402b stably contact the partner pin 300, and there is a problem that it is difficult to reduce the contact resistance between the contact portion 402b and the partner pin 300.

Further, in order to suppress the deformation in the height direction of the solder ball holding portion 402c and to reduce the contact resistance between the contact portion 402b and the mating pin 300, the arm 4
It is necessary to increase both the width of 02c and the width of the arm 402e, and there is a problem that the design burden is large.

In this case, it is conceivable to prevent the deformation of the solder ball supporting portion 402c in the height direction by forming a conical solder ball support portion on the socket body 401, but the socket shape becomes complicated and the socket shape becomes complicated. There is a problem that the production cost increases.

[0009]

SUMMARY OF THE INVENTION A first object of the present invention is to provide a socket whose inductance can be reduced as compared with a conventional socket.

A second object of the present invention is to provide a socket which can relatively easily suppress the deformation in the height direction of the solder ball carrying portion and can reduce the contact resistance between the contact portion and the mating pin. Is to do.

[0011]

In order to solve the above-mentioned problems, a socket according to the present invention is a socket into which a mating pin is inserted, and comprises a socket body and a contact mounted on the socket body. The socket body is provided with a contact receiving hole that penetrates the one end face and the other end face, the contact is a base end portion fixed to the socket body, and a contact portion that contacts the mating pin,
A solder ball holding portion disposed between the base end portion and the contact portion, wherein the base end portion, the contact portion, and the solder ball holding portion are located inside the contact receiving hole, and The supporting portion is configured to support the solder ball in a state of being exposed from the contact receiving hole.

According to the socket according to the present invention, since the solder ball carrying portion is disposed between the base end portion and the contact portion, the path from the solder ball carrying portion to the contact portion becomes substantially straight,
The inductance can be reduced as compared with the conventional socket.

The contact is formed in a substantially U-shape with one end facing the other end by turning the conductive metal plate at least twice, and the base end is connected to the one end. Is provided on the metal plate portion between the end of the first and the first folded portion, the solder ball carrying portion,
The contact portion is provided on a metal plate portion between the first folded portion and the second folded portion, and the contact portion is provided on a metal plate portion between the other end portion and the second folded portion. Is desirable.

According to this configuration, since the solder ball carrying portion is disposed between the base end portion and the contact portion, the path from the solder ball carrying portion to the contact portion becomes substantially straight, which is smaller than a conventional socket. Inductance can be reduced.
In addition, since the path from the solder ball holding portion to the contact portion is substantially straight, the contact width can be increased simply by increasing the contact width without increasing the width of both arms as in the related art. Can be suppressed, and the contact resistance between the contact portion and the mating pin can be reduced.

The contact may be formed in a substantially U-shape with one end facing the other end by turning the conductive metal plate at least twice, or three times, or It may be folded more times.

The metal plate portion between the first folded portion and the second folded portion is provided with a through hole having a diameter smaller than the diameter of the solder ball. It is desirable to carry the solder ball with its surface in line contact with the edge of the through hole.

This makes it possible to relatively easily determine the solder ball holding position. Further, even if an oxide film is formed on the surface of the solder ball, good contact can be expected because the edge of the through hole can break the oxide film by line contact with the surface of the solder ball.

A concave portion is provided in the metal plate portion between the first folded portion and the second folded portion, and the solder ball carrying portion has a surface of the solder ball in surface contact with the concave portion. It is desirable to carry it in a state. This makes it possible to relatively easily determine the solder ball holding position.

The contact is formed in a substantially U-shape (or V-shape) with one end facing the other end by turning the substantially central portion of the conductive metal plate once. The base end is provided on a metal plate portion between the one end and the folded portion, and the solder ball supporting portion is provided on a folded portion of the metal plate,
The contact portion may be provided on a metal plate portion between the other end and the folded portion.

According to this configuration, since the solder ball holding portion is disposed between the base end portion and the contact portion, the path from the solder ball holding portion to the contact portion becomes substantially straight, and the solder ball holding portion is compared with the conventional socket. Inductance can be reduced.
In addition, since the path from the solder ball holding portion to the contact portion is substantially straight, the contact width can be increased simply by increasing the contact width without increasing the width of both arms as in the related art. Can be suppressed, and the contact resistance between the contact portion and the mating pin can be reduced. Further, since the number of times of folding is small, the process of manufacturing the contact can be simplified.

The folded portion of the metal plate is provided with a through-hole having a diameter smaller than the diameter of the solder ball. It is desirable to carry in contact.

This makes it possible to relatively easily determine the position at which the solder balls are held. Further, even if an oxide film is formed on the surface of the solder ball, good contact can be expected because the edge of the through hole can break the oxide film by line contact with the surface of the solder ball.

It is preferable that a concave portion is provided in the folded portion of the metal plate, and the solder ball supporting portion supports the solder ball in a state where the surface thereof is in surface contact with the concave portion. This makes it possible to relatively easily determine the solder ball holding position.

[0024] The metal plate portion at the other end extends in a direction substantially perpendicular to the axial direction of the contact, and the contact portion is desirably provided on the extended metal plate portion. . This makes it possible to lower the contact resistance between the contact portion and the mating pin.

[0025]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A socket according to an embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of an interposer having a socket according to the present invention and a plurality of pins (pin grids) inserted into the socket. FIG. 2 is a partial perspective view of a contact provided in the socket according to the present invention and a contact receiving hole thereof.

FIG. 3 is an exploded perspective view for explaining a mounted state of a contact provided in the socket according to the present invention. FIG. 4 is a developed plan view of a contact provided in the socket according to the present invention.

As shown in FIG. 1, the socket 10 is a socket into which a plurality of mating pins (pin grids) 31... Of the interposer 30 on which the semiconductor package is mounted are inserted. And a contact 12 provided on the socket body 11. The socket body 11 is formed in a thin card shape, and is provided with a plurality of contact receiving holes 13 penetrating through one end surface 11a and the other end surface 11b.

As shown in FIG. 2, the contact receiving hole 13 is formed as a substantially rectangular through hole, and a pair of contact insertion grooves 13a is formed at one end in the axial direction. The contact insertion groove 13a has one end face 11
a to the other end surface 11b. The other end of the contact housing hole 13 in the axial direction is formed as a wider through hole 13b extending in a direction perpendicular to the axial direction.

As shown in FIG. 2, the contact 12 has a base end portion 12a fixed to the socket body 11, a contact portion 12b contacting the mating pin 31, and a contact portion 12b between the base end portion 12a and the contact portion 12b. And a solder ball holding portion 12c disposed therein.

As shown in FIG. 3, the contact 12 has contact insertion grooves 13a, 13a on both sides of the base end 12a.
Is inserted into the contact receiving hole 13 and fixed. In this fixed state, the base end portion 12a, the contact portion 12b, and the solder ball carrying portion 12c are located inside the contact receiving hole 13. In this fixed state, the distance from the lower surface of the solder ball holding portion 12c to the other end surface 11b of the socket body 11 is shorter than the diameter of the solder ball B. Therefore, the solder ball holding portion 12c holds the solder ball B in a state of being exposed from the contact receiving hole 13.

The contact 12 is formed by bending a press-punched conductive metal plate. FIG. 4 shows a contact 1 in a press-punched state.
2 is shown. The contact 12 is formed in a substantially U-shape with one end 12d facing the other end 12e by turning the conductive metal plate at least twice (see FIG. 2).

The base end 12a is connected to one end 12d and the first end 12d.
Is provided on the metal plate portion between the folded portions 12f. The solder ball carrier 12c is provided on a metal plate portion between the first folded portion 12f and the second folded portion 12g. The contact portion 12b is connected to the other end 12e.
And the second folded portion 12g is provided on the metal plate portion.

A through hole H having a diameter smaller than the diameter of the solder ball B is provided in the metal plate portion between the first folded portion 12f and the second folded portion 12g. In this case, the solder ball B is carried in a state where its surface is in line contact with the edge of the through hole H. The solder ball B is reflowed so that the solder ball holding portion 1
2c.

Instead of the through hole H, a concave portion may be provided in a metal plate portion between the first folded portion 12f and the second folded portion 12g. In this case, solder ball B
Is carried in a state where its surface is in surface contact with the concave portion.

The metal plate portion at the other end 12 e extends in a direction substantially perpendicular to the axial direction of the contact 12.
The contact portion 12b is desirably provided on the extended metal plate portion 12h.

FIG. 5 is a cross-sectional view for explaining a state in which the mating pin 31 is inserted into the socket 10 having the above configuration.
As shown in FIG. 1, the mating pin 31 is provided with a wide through hole 1 forming the contact accommodation hole 13 from above the socket 10.
3b. The distance between the inner wall of the wide through hole 13b and the contact portion 12b is smaller than the diameter of the mating pin 31. Therefore, when the mating pin 31 is inserted between the inner wall of the through hole 13b and the contact portion 12b, the contact portion 1
2b comes into contact with the mating pin 31 by a force that attempts to return from the solid line position (the position after the displacement) to the broken line position (the position before the mating pin 31 is inserted).

In the above example, the contact has been described as being formed by turning the conductive metal plate at least twice, but may be formed by turning the conductive metal plate once. FIG. 7 shows an example of a contact formed by turning a conductive metal plate once.

The contact 14 is formed by bending a press-punched conductive metal plate. FIG. 8 shows a contact 1 in a press-punched state.
4 is shown. The contact 14 is formed by turning the substantially central portion of the conductive metal plate once, thereby forming one end 14d.
Is substantially U-shaped (or V-shaped) facing the other end 14e.
(See FIG. 7).

The base end 14a is provided on a metal plate portion between one end 14d and the folded portion 14f.
The solder ball supporting portion 14c is provided at the folded portion 14 of the metal plate.
f. The contact portion 14b is connected to the other end 14
It is provided on the metal plate portion between the e and the folded portion 14f.

A through hole H having a diameter smaller than the diameter of the solder ball B is provided in the folded portion 14f of the metal plate. In this case, the solder ball B is carried in a state where its surface is in line contact with the edge of the through hole H.
The solder ball B is carried by the solder ball carrying portion 14c by reflow.

In place of the through hole H, a concave portion may be provided in the folded portion 14f of the metal plate. In this case, the solder ball B is carried in a state where its surface is in surface contact with the concave portion.

The metal plate portion at the other end 14e extends in a direction substantially perpendicular to the axial direction of the contact 14,
The contact portion 14b is desirably provided on the extended metal plate portion 14h.

[0043]

As described above, according to the socket according to the present invention, since the path from the contact portion to the solder ball carrying portion is not detoured as in the conventional socket but is substantially straight, the socket according to the present invention has It is possible to provide a socket whose inductance can be reduced in comparison.

Further, it is possible to provide a socket which can relatively easily suppress the deformation of the solder ball carrying portion in the height direction and reduce the contact resistance between the contact portion and the mating pin.

[Brief description of the drawings]

FIG. 1 is a perspective view of a socket according to the present invention and an interposer having a plurality of pins (pin grids) inserted into the socket.

FIG. 2 is a partial perspective view of a socket body of the socket according to the present invention and contacts provided on the socket body.

FIG. 3 is an exploded perspective view for explaining a mounting state of a contact mounted on the socket according to the present invention.

FIG. 4 is a developed plan view of a contact provided in the socket according to the present invention.

FIG. 5 is a cross-sectional view illustrating a state where a mating pin is inserted into the socket according to the present invention.

FIG. 6 is a view for explaining a conventional example of a socket according to the present invention.

FIG. 7 is a perspective view of a contact provided in the socket according to the present invention.

FIG. 8 is a developed plan view of a contact provided in the socket according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Socket 11 Socket main body 11a One end surface 11b Other end surface 12 Contact 12a Base end portion 12b Contact portion 12c Solder ball carrying portion 12f First folded portion 12g Second folded portion 13 Contact accommodation hole 13a Contact insertion groove 13b Through hole 31 partner Pin H Through hole B Solder ball

Claims (8)

[Claims] 1. A socket into which a mating pin is inserted, comprising: a socket main body; and a contact mounted on the socket main body, wherein the socket main body has a contact receiving hole passing through one end surface and the other end surface thereof. The contact is provided with a base end fixed to the socket body, a contact part that contacts the counterpart pin, and a solder ball holding part disposed between the base end and the contact part. The base end, the contact portion, and the solder ball holding portion are located inside the contact receiving hole, and the solder ball holding portion holds the solder ball in a state exposed from the contact receiving hole, socket. 2. The contact is formed in a substantially U-shape with one end facing the other end by turning the conductive metal plate at least twice. The solder ball supporting portion is provided on a metal plate portion between the one end portion and the first folded portion, and the solder ball supporting portion is provided on a metal plate portion between the first folded portion and the second folded portion. The socket according to claim 1, wherein the contact portion is provided on a metal plate portion between the other end portion and a second folded portion. 3. A solder ball supporting portion, wherein a through hole having a diameter smaller than a diameter of a solder ball is provided in a metal plate portion between the first folded portion and the second folded portion. 3. The socket according to claim 2, wherein the socket carries a solder ball in a state where its surface is in line contact with an edge of the through hole. 4. 4. A concave portion is provided in a metal plate portion between the first folded portion and the second folded portion, and the solder ball holding portion has a surface of the solder ball facing the concave portion. 3. The socket according to claim 2, wherein the socket is carried in contact. 5. The contact is formed in a substantially U-shape with one end facing the other end by turning a substantially central portion of the conductive metal plate once. The portion is provided on a metal plate portion between the one end and the folded portion. The solder ball supporting portion is provided on a folded portion of the metal plate. The contact portion is The socket according to claim 1, wherein the socket is provided on a metal plate portion between the end portion and the folded portion. 6. A folded-back portion of the metal plate is provided with a through hole having a diameter smaller than a diameter of a solder ball. The socket according to claim 5, which is carried in a state of being in line contact with the socket. 7. The solder ball supporting portion according to claim 5, wherein a concave portion is provided in the folded portion of the metal plate, and the solder ball supporting portion supports the solder ball in a state where the surface thereof is in surface contact with the concave portion. socket. 8. The metal plate portion at the other end extends in a direction substantially perpendicular to the axial direction of the contact, and the contact portion is provided on the extended metal plate portion. The socket according to claim 1.