JP2002121520A - Adhesive tape for electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an adhesive tape for electronic parts which can adhere and cure at a relatively low temperature, excels in adhesive power, heat resistance, and moisture absorption resistance, can reduce the amount of a gas to be generated on curing, and is suited in bonding electronic parts to one another, particularly semiconductor parts to one another. SOLUTION: The adhesive tape for electronic parts is obtained by coating an adhesive composition comprising an acrylic resin having one or more functional groups to be selected from a carboxyl group, a hydroxyl group, a sulfone group, a glycidyl group, and an amino group and a weight average molecular weight of 100,000-2,000,000; a bisphenol A epoxy resin and a phenolic novolak epoxy resin or a cresol novolak epoxy resin; a maleimide compound having two or more maleimide groups in the molecule; an aromatic diamine compound; and a liquid silicone resin having an epoxy group on at least one surface of a heat-resistant film.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component adhesive tape which can be used for bonding components around a lead frame constituting a semiconductor device such as a lead, a die pad, a heat sink, a semiconductor chip, and the like.

[0002]

2. Description of the Related Art Adhesive tapes used for existing resin package type semiconductor devices include an adhesive tape for fixing a lead frame, a tape for attaching a heat sink, a TAB carrier tape, and the like. The adhesive tape for fixing a lead frame is an adhesive tape used for fixing a lead to a lead frame, and is used for improving the efficiency of assembling the lead frame itself and the semiconductor device and increasing the productivity. A general method of assembling a semiconductor using an adhesive tape is to attach the adhesive tape to a lead frame, mount a semiconductor chip on the frame via the adhesive tape, and package with a resin. Therefore, the lead frame fixing adhesive tape is excellent in workability at the time of taping, adhesive strength after taping, etc., as well as sufficient heat resistance to withstand heating in a semiconductor device assembly process, as a semiconductor device. Reliability is required.

[0003] As an existing adhesive tape used for such an application, for example, a polyacrylonitrile as an adhesive layer on a heat-resistant support film such as a polyimide film,
There are those in which a resin composition mainly containing polyacrylate or acrylonitrile-butadiene copolymer or the like is applied, or a resin composition in which a thermosetting resin is mixed with these is applied.

However, in recent years, the package structure has become more and more complicated, for example, the number of pins inside the semiconductor device has been increased and a heat radiating plate has been attached to dissipate the heat generated inside the device. The required ease of handling and electrical, physical and thermal properties have become stricter, and conventional adhesive tapes cannot satisfy these requirements. In particular, there is a possibility that a metal material such as a lead frame is deformed or damaged in a step of bonding the heat sink to the lead pins or a step of bonding the semiconductor chip and the lead pins with an insulating tape.

In order to solve such problems, USP
No. 5,494,757 and US Pat. No. 5,500,294, an adhesive composition containing a butadiene-acrylonitrile copolymer having a piperazinylethylaminocarbonyl group, a compound containing at least two maleimide groups, and a diamine-containing polysiloxane compound A tape using an object as an adhesive layer has been proposed. The adhesive tape is capable of bonding and curing at a relatively low temperature, and is also excellent in heat resistance and electrical properties, but generates a large amount of organic gas when the adhesive layer is completely cured in an apparatus assembling process. There's a problem. Such volatiles from the adhesive layer not only adversely affect the characteristics of the semiconductor in the device, but also corrode and damage peripheral device components and shorten the life of the electronic components.
Furthermore, there is a problem that the moisture absorption resistance cannot be secured.

[0006]

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and is capable of bonding and curing at a relatively low temperature, and has heat resistance, electrical insulation and resistance to heat. An object of the present invention is to provide an adhesive tape which is excellent in hygroscopicity and further suppresses gas generation during curing, and is particularly useful for bonding between semiconductor components.

[0007]

The above-mentioned electronic component adhesive tape of the present invention comprises at least one functional group selected from the group consisting of component A: carboxyl group, hydroxyl group, sulfone group, glycidyl group and amino group. Acrylic resin having a group and a weight average molecular weight of 100,000 to 2,000,000, B component: bisphenol A epoxy resin, and phenol novolak epoxy resin or cresol novolak epoxy resin, C component: 1 molecule An adhesive composition containing a maleimide compound having two or more maleimide groups therein, a D component: an aromatic diamine compound, and an E component: a liquid silicone resin having an epoxy group is applied to at least one surface of a heat-resistant film. The point is to obtain it.

[0008] The adhesive composition is characterized in that the component A comprises 10 to 60% by mass of acrylonitrile, 20 to 80% by mass of an alkyl acrylate having an alkyl group having 2 to 12 carbon atoms, and a carboxyl group, a hydroxyl group, a sulfone group, It is preferably obtained by copolymerizing 0.1 to 20% by mass of a monomer having at least one functional group selected from the group consisting of a glycidyl group and an amino group and a double bond, and The C component has the following chemical formula (1)
Alternatively, the compound represented by (2) is preferable.

[0009]

Embedded image

In the adhesive composition, the bisphenol A-based epoxy resin is 20 to 500 parts by mass, and the phenol novolak type epoxy resin or cresol novolac type epoxy resin is 10 to 200 parts by mass with respect to 100 parts by mass of the component A. Parts, and preferably 10 to 200 parts by mass of the C component, and more preferably 1 to 100 parts by mass of the D component with respect to 100 parts by mass of the B component and the C component. It is preferable that 0.1 to 20 parts by mass of the component E be contained with respect to 100 parts by mass of the component B.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION The adhesive tape for electronic parts of the present invention comprises:
The adhesive composition applied to the heat-resistant film serving as the substrate,
It is characterized by containing an acrylic resin (component A), an epoxy mixed resin (component B), a maleimide compound (component C), an aromatic diamine compound (component D), and a liquid silicone resin having an epoxy group (component E). Have. Hereinafter, each component will be described in order.

(1) The acrylic resin as the component A has an effect of increasing weather resistance and elasticity after curing. The acrylic resin is selected from the group consisting of carboxyl, hydroxyl, sulfone, glycidyl, and amino groups in the polymer. It has at least one functional group selected and has a weight average molecular weight of 100,0
Use those having a value of 00 to 2,000,000. If the weight average molecular weight is less than 100,000, the adhesive strength of the adhesive layer after curing is not sufficient, and sufficient heat resistance cannot be ensured, and is preferably 200,000 or more. On the other hand, when the weight average molecular weight is more than 2,000,000, solubility in a solvent is reduced, and the viscosity of the composition becomes too high, which causes a decrease in workability in a coating step and the like, and is preferable. 1,200,00
0 or less.

The component A is acrylonitrile 1
0 to 60% by mass, 20 to 80% by mass of an alkyl acrylate having an alkyl group having 2 to 12 carbon atoms, and at least one selected from the group consisting of a carboxyl group, a hydroxyl group, a sulfone group, a glycidyl group, and an amino group Is preferably obtained by copolymerizing 0.1 to 20% by mass of a monomer having a functional group and a double bond. In particular, when the content of the monomer having the functional group and the double bond is less than 0.1% by mass, the adhesive strength and heat resistance are reduced. This is because the property decreases, more preferably 1% by mass.
Not less than 10% by mass.

(2) The epoxy mixed resin as the component B is a mixture of a bisphenol A epoxy resin and a phenol novolak type epoxy resin or a cresol novolak type epoxy resin. The bisphenol A type epoxy resin is a condensation polymerization product of bisphenol A and an epoxy compound such as epichlorohydrin, and the phenol novolak type epoxy resin or cresol novolak type epoxy resin is a phenol or cresol type epoxy resin instead of bisphenol A. An epoxy resin obtained using a phenolic compound.

These epoxy resins react with components C and D described below to contribute to an improvement in adhesive strength, and upon curing, there is no generation of water or other volatile substances, so that volume shrinkage is small. Furthermore, the cured product has excellent heat resistance and electrical properties.

The content of each of the above epoxy resins is preferably from 20 parts by mass to 500 parts by mass of the bisphenol A epoxy resin based on 100 parts by mass of the component A. When the content of the bisphenol A-based epoxy resin is less than 20 parts by mass, the adhesive strength is reduced, and more preferably 80 parts by mass or more. on the other hand,
If the amount exceeds 500 parts by mass, heat resistance is reduced.
It is more preferably at most 200 parts by mass.

The content of the phenol novolak type epoxy resin or cresol novolak type epoxy resin is preferably from 10 parts by mass to 200 parts by mass with respect to 100 parts by mass of the component A. If the amount of the phenol novolak type epoxy resin or the cresol novolak type epoxy resin is less than 10 parts by mass, the heat resistance deteriorates, and more preferably 40 parts by mass or more. On the other hand, if it exceeds 200 parts by mass, the adhesive strength is reduced, and it is more preferably 100 parts by mass or less.

(3) The maleimide compound as the component C is 1
Any compound containing two or more maleimide groups in the molecule may be used, but a compound represented by the following chemical formula (1) or (2) is preferably used. The maleimide compound is
It reacts with the epoxy resin of the component B and an epoxy group of the component E described later, and acts as a curing agent for the bonding composition.

The amount of the component C is 100
It is preferable that the amount is not less than 10 parts by mass and not more than 200 parts by mass with respect to parts by mass. If the amount is less than 10 parts by mass, the heat resistance, the elastic modulus after curing and the mechanical strength decrease, and the amount is more preferably 20 parts by mass or more. Meanwhile, 2
If the amount is more than 00 parts by mass, the adhesive strength is reduced, and it is more preferably 150 parts by mass or less.

Incidentally, as the maleimide compound, N,
N '-(4,4-diphenylmethane) bismaleimide and the like can be used.

[0021]

Embedded image

(4) As in the case of the component C, the aromatic diamine compound as the component D reacts with the epoxy resin of the component B and an epoxy group of the component E described later, and has a role of a curing agent. Therefore, the content of the component D is desirably not less than 1 part by mass and not more than 100 parts by mass based on 100 parts by mass of the total amount of the epoxy mixed resin as the component B and the maleimide compound as the component C. If the amount is less than 1 part by mass, the curing of the epoxy resin is insufficient, and it becomes difficult to secure the solvent resistance, heat resistance, and electric resistance of the cured product.
It is at least part by mass. On the other hand, if it exceeds 100 parts by mass, it is difficult to ensure solvent resistance and electrical resistance,
It is more preferably at most 80 parts by mass.

In the present invention, excellent electrical properties, heat resistance,
It is preferable to use an aromatic diamine which contributes to ensuring chemical resistance, and for example, diaminodiphenylmethane, oxydianiline, dimethyldiaminobiphenyl and the like can be used.

(5) The liquid silicone resin having an epoxy group, which is the E component, is cured while the epoxy group in the molecule is chemically bonded to another resin, so that the heat resistance of the adhesive layer is improved.
It has a function of improving vibration absorption and electrical insulation, and enhancing durability and reliability of the semiconductor device. The content of the E component is
0.1 parts by mass or more based on 100 parts by mass of the B component
It is preferably 0 parts by mass or less. If the amount is less than 0.1 part by mass, the above effects (electrical insulation, heat resistance, etc.) of the E component are not sufficiently exhibited, and the amount is more preferably 1 part by mass or more. On the other hand, if it exceeds 20 parts by mass, the adhesive strength is reduced, and it is more preferably 10 parts by mass or less.

(6) The adhesive composition of the present invention may be obtained by curing the above components A, B, C, D, and E, as well as imidazole, dibenzylmethylamine and the like in order to accelerate the curing reaction. An accelerator may be included. In addition, in order to adjust the balance between the adhesive strength and the strength of the cured product, particles of an inorganic component or an organic component may be contained as a filler.

As the inorganic filler, zinc oxide, silica,
Alumina or silicon powder or the like can be used, and as the organic filler, a powdery acrylic resin, polyamide resin, silicone resin, or the like can be used. The content of the filler is 1 to 100 parts by mass of the component A.
It is preferable that the amount be from 50 parts by mass to 50 parts by mass. 1
If the amount is less than parts by mass, the adhesiveness is too large, the workability is reduced, and the elastic modulus is also reduced. If the amount is more than 50 parts by mass, the adhesive force is reduced.

The adhesive composition of the present invention is prepared by mixing the above components in a predetermined amount, dissolving the mixture in a solvent, and having a viscosity of 100 mP.
It is desirable to use it after adjusting it to be not less than a · s and not more than 2,000 mPa · s. The viscosity is more preferably 300 mPa · s or more and 1,000 mPa · s or less.

The solvent used in the present invention is not particularly limited. For example, an organic solvent such as acetone, xylene, methyl ethyl ketone, toluene or the like may be used alone or as a solvent.
A mixture of more than one species can be used.

(7) The adhesive tape for electronic parts of the present invention is obtained by applying the above-mentioned adhesive composition dissolved in a solvent to at least one surface of a heat-resistant film and drying it to form an adhesive layer. As the film, for example, a heat-resistant resin film such as polyimide, polyphenylene sulfide, polyethylene terephthalate, or polyethylene naphthalate can be used. Further, the thickness of the heat resistant film is preferably about 10 to 200 μm, more preferably 25 to 150 μm.

The adhesive composition has a thickness of 10 after drying.
It is preferable to apply so that the thickness is about 50 μm.
As a manufacturing condition such as drying, a conventionally known method can be used. For example, after the adhesive composition is applied to a heat-resistant film, dried at 80 to 120 ° C. for 1 to 20 minutes, and then a peelable film is attached. And then 5-3 at 80-120 ° C
A method of heating for 0 minutes to perform semi-curing may be used. In this case, as the peelable film, a polypropylene film, a fluororesin film, a polyethylene film,
Polyethylene terephthalate film, paper, and optionally a silicone resin mixed with the resin to give a releasability can be used.

[0031]

EXAMPLES Hereinafter, the present invention will be described in more detail with reference to examples. However, the present invention is not limited to the following examples, and the present invention is not limited thereto. Modifications can be made and implemented, all of which are included in the technical scope of the present invention.

Example 1 A weight-average molecular weight of 1 obtained by copolymerizing a monomer mixture composed of 32% by mass of acrylonitrile, 63% by mass of butyl acrylate and 5% by mass of methacrylic acid in the presence of a polymerization initiator. , 000,000
0 acryl resin (100 parts by mass), 100 parts by mass of a bisphenol A-based epoxy resin (epoxy equivalent: 400), and a cresol novolac type epoxy resin (epoxy equivalent: 20)
0) 50 parts by mass, 25 parts by mass of N, N '-(4,4-diphenylmethane) bismaleimide, 25 parts by mass of diaminodiphenylmethane, 2 parts by mass of a liquid silicone resin having an epoxy group, and an average particle size of 2.0 μm. Zinc oxide 6
Parts by weight and mixed, and the viscosity of the solution was adjusted to 800 to 1,000 mPa with a mixed solvent of methyl ethyl ketone and toluene.
・ Adjusted to s.

The adhesive composition thus obtained was applied to a polyimide film (trade name: KAPTO) having a thickness of 50 μm.
N, manufactured by DUPONT) having a thickness of 20 μm after drying.
After drying at 120 ° C. for 5 minutes, a polyethylene terephthalate film having a thickness of 38 μm was laminated to obtain an adhesive tape.

Example 2 A monomer mixture composed of 30% by mass of acrylonitrile, 65% by mass of butyl acrylate and 5% by mass of glycidyl acrylate was copolymerized in the presence of a polymerization initiator to obtain a weight average molecular weight of 1, 20
200 parts by mass of a bisphenol A-based epoxy resin (epoxy equivalent: 400), 100 parts by mass of a cresol novolak type epoxy resin (epoxy equivalent: 200), 100 parts by mass of N, N '-(4,4-diphenylmethane) ) 50 parts by mass of bismaleimide, 50 parts by mass of diaminodiphenylmethane, 2 parts by mass of a liquid silicone resin having an epoxy group, and 6 parts by mass of zinc oxide having an average particle size of 2.0 μm were added and mixed, and methyl ethyl ketone and toluene were mixed. Add a solvent to increase the viscosity of the solution to 800-
It was adjusted to 1,000 mPa · s. An adhesive tape was produced in the same manner as in Example 1 using the adhesive composition thus prepared.

Example 3 A monomer mixture comprising 40% by mass of acrylonitrile, 52% by mass of butyl acrylate, 3% by mass of hydroxyethyl methacrylate and 5% by mass of glycidyl acrylate was copolymerized in the presence of a polymerization initiator. Weight average molecular weight 900,000 obtained
100 parts by mass of an acrylic resin, 200 parts by mass of a bisphenol A-based epoxy resin (epoxy equivalent: 400) and a cresol novolac type epoxy resin (epoxy equivalent: 20)
0) 100 parts by mass, 50 parts by mass of N, N '-(4,4-diphenylmethane) bismaleimide, 50 parts by mass of diaminodiphenylmethane, 2 parts by mass of a liquid silicone resin having an epoxy group, and an average particle size of 2.0 μm. 6 parts by mass of zinc oxide are added and mixed, and the viscosity of the solution is adjusted to 800 to 1,000 mP with a mixed solvent of methyl ethyl ketone and toluene.
adjusted to a · s. An adhesive tape was produced in the same manner as in Example 1 using the adhesive composition thus prepared.

Comparative Example 1 A weight-average molecular weight of 1 obtained by copolymerizing a monomer mixture comprising 30% by mass of acrylonitrile, 65% by mass of butyl acrylate and 5% by mass of methacrylic acid in the presence of a polymerization initiator. , 200,00
100 parts by mass of an acrylic resin of No. 0, 300 parts by mass of a bisphenol A-based epoxy resin (epoxy equivalent: 400), 50 parts by mass of diaminodiphenylmethane, 2 parts by mass of a liquid silicone resin having an epoxy group, and an average particle size of 2.
6 parts by mass of 0 μm zinc oxide were added and mixed, and the viscosity of the solution was adjusted to 800 with a mixed solvent of methyl ethyl ketone and toluene.
It was adjusted to １，1,000 mPa · s. An adhesive tape was produced in the same manner as in Example 1 using the adhesive composition thus prepared.

Comparative Example 2 A weight-average molecular weight of 1 obtained by copolymerizing a monomer mixture comprising 30% by mass of acrylonitrile, 60% by mass of butyl acrylate and 5% by mass of methacrylic acid in the presence of a polymerization initiator. , 200,00
0 acryl resin (100 parts by mass), bisphenol A-based epoxy resin (epoxy equivalent 400) 200 parts by mass, cresol novolak type epoxy resin (epoxy equivalent 20
0) 100 parts by mass, 50 parts by mass of N, N '-(4,4-diphenylmethane) bismaleimide, 50 parts by mass of diaminodiphenylmethane, and 6 parts by mass of zinc oxide having an average particle size of 2.0 μm were added and mixed. , With a mixed solvent of methyl ethyl ketone and toluene to increase the viscosity of the solution to 800 to 1,000.
It was adjusted to mPa · s. An adhesive tape was produced in the same manner as in Example 1 using the adhesive composition thus prepared.

Comparative Example 3 40% by mass of acrylonitrile
And a monomer mixture consisting of 60% by mass of butyl acrylate and 100 parts by mass of an acrylic resin having a weight average molecular weight of 1,000,000 obtained by copolymerizing in the presence of a polymerization initiator. Equivalent 400) 50 parts by mass, cresol novolak type epoxy resin (epoxy equivalent 200) 200 parts by mass, N, N'-
(4,4-diphenylmethane) 50 parts by mass of bismaleimide, 50 parts by mass of diaminodiphenylmethane, 2 parts by mass of a liquid silicone resin having an epoxy group, and 6 parts by mass of zinc oxide having an average particle size of 2.0 μm are added and mixed. The viscosity of the solution was adjusted to 800 to 1,000 mPa · s with a mixed solvent of methyl ethyl ketone and toluene. An adhesive tape was produced in the same manner as in Example 1 using the adhesive composition thus prepared.

The properties (adhesive strength, thermal decomposition temperature, gas generation amount, moisture absorption rate, elastic modulus) of the adhesive tape manufactured as described above
Was measured based on the following evaluation method. Table 1 shows the results.
Shown in

Adhesive force A copper foil was placed on a hot plate heated to 150 ° C., the produced adhesive tape was placed thereon, and a pressure of 0.49 MPa was applied for 0.5 seconds, followed by pressure bonding at 175 ° C. It was cured by heating in a hot air oven for one hour. After curing, use the tensile strength tester to remove the adhesive tape (T-PEEL
Strength) was measured.

Thermal decomposition temperature Measured by TGA (DUPONT V4.1C 2200 model), the temperature at which the mass decreased by 5% was defined as the thermal decomposition temperature.

Gas Generation Amount was stored in a dryer at 170 ° C. for 1 hour, and the mass before and after storage was measured. The ratio (%) of the mass reduction (corresponding to the amount of generated gas) to the mass of the adhesive layer before storage was determined.

Moisture absorption After immersion in water at 23 ° C. for 24 hours, the change in mass before and after immersion was measured. The amount of mass increase (corresponding to the amount of moisture absorption) with respect to the mass of the adhesive layer before immersion was defined as the moisture absorption rate (%).

After maintaining the elastic modulus at 170 ° C. for 5 hours, the elastic modulus was measured by a tensile strength tester.

[0045]

[Table 1]

As can be seen from Table 1, in Examples using the A component, B component, C component, D component and E component specified in the present invention as an adhesive composition, excellent adhesion, heat resistance and moisture absorption resistance were obtained. At the same time, it was possible to obtain an adhesive tape with less gas generation. In contrast, in Comparative Examples lacking any of the components specified in the present invention as an adhesive composition,
The properties of the obtained adhesive tape were unfavorable. That is, in Comparative Example 1, the elastic modulus was low and the heat resistance was poor. Comparative Example 2 had poor moisture absorption resistance, and Comparative Example 3 had poor adhesion.

[0047]

The present invention is constituted as described above. In the production of an adhesive tape, by using the components specified in the present invention in an adhesive composition, physical properties such as adhesive strength, heat resistance and moisture absorption resistance are obtained. It is possible to obtain an adhesive tape which is excellent in heat resistance and suppresses generation of gas at the time of curing, and can provide an adhesive tape useful for manufacturing a semiconductor device which requires strict characteristics.

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) C09J 163/00 C09J 163/00 183/06 183/06 (72) Inventor Chang Kyung-ho Korea, Seoul, Kumchin- K, Kasang-Don, 153-3 (72) Inventor Kyung-Kyodo, Yong-in-Shi, Kifung-Ep Shin-Miju Apartment, 101-705 F-term (reference) 4J004 AA10 AA11 AA13 AB05 BA02 EA06 FA05 4J040 DF041 DF042 DF071 DF072 EC061 EC062 EC071 EC072 GA05 GA07 GA11 GA14 GA22 GA25 HC08 HC20 JA09 JB01 KA16 LA07 LA08 LA09 MA10 MB05 NA20 PA30

Claims (7)

[Claims] 1. A component: having at least one functional group selected from the group consisting of a carboxyl group, a hydroxyl group, a sulfone group, a glycidyl group, and an amino group, and having a weight average molecular weight of 100,000 to 2,000. A component: B component: bisphenol A epoxy resin and phenol novolak type epoxy resin or cresol novolak type epoxy resin; C component: a maleimide compound having two or more maleimide groups in one molecule; D component: aroma An electronic component adhesive tape obtained by applying an adhesive composition containing a group III diamine compound; E component: a liquid silicone resin having an epoxy group to at least one surface of a heat-resistant film. 2. The composition according to claim 1, wherein the component A is acrylonitrile 10
60% by mass, 20 to 80% by mass of an alkyl acrylate having an alkyl group having 2 to 12 carbon atoms, and at least one functional group selected from the group consisting of a carboxyl group, a hydroxyl group, a sulfone group, a glycidyl group, and an amino group The electronic component adhesive tape according to claim 1, which is obtained by copolymerizing 0.1 to 20% by mass of a monomer having a double bond. 3. The electronic component adhesive tape according to claim 1, wherein the C component is a compound represented by the following chemical formula (1) or (2). Embedded image 4. The adhesive composition according to claim 1, wherein the A component 100
20 parts to 500 parts by mass of the bisphenol A-based epoxy resin and 10 to 200 parts by mass of the phenol novolak type epoxy resin or cresol novolak type epoxy resin with respect to parts by mass.
3. The electronic component adhesive tape according to any one of 3. 5. The adhesive composition according to claim 1, wherein the A component is 100.
The electronic component adhesive tape according to any one of claims 1 to 4, wherein the C component is contained in an amount of 10 to 200 parts by mass with respect to parts by mass. 6. The adhesive composition according to claim 1, wherein the D component is contained in an amount of 1 to 100 parts by mass based on a total content of the B component and the C component of 100 parts by mass. Electronic component adhesive tape according to any one of the above. 7. The adhesive composition according to claim 1, wherein the B component is 100%.
The electronic component adhesive tape according to any one of claims 1 to 6, wherein the E component is contained in an amount of 0.1 to 20 parts by mass with respect to parts by mass.