JP2002117706A - Method for manufacturing lighting system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a lighting system capable of reducing the man-hour in assembly and also reducing stress acting to a light emitting device. SOLUTION: A flexible printed circuit board 4 having through holes is held in a developed state, leads 8a, 8b of the light emitting device are inserted into all through holes 6a, 6b except for vacant through holes 6a, 6b at the other end part 4B of the printed circuit board, one lead of the light emitting device and a conductive land of the printed circuit board are soldered (9), both end parts of the printed circuit board are piled up so that the lead inserted into the through hole at one end is inserted into vacant through holes at the other end, the lead of the light emitting device inserted into the vacant through hole and the conductive land is soldered, and the other lead of the light emitting device and the conductive land is soldered.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001] 1. Field of the Invention [0002] The present invention relates to a method of manufacturing a lighting device, and more particularly to a system / device which performs surface inspection and positioning of a product by processing image data from a CCD (charge coupled device). The present invention relates to an improvement in a method for manufacturing a lighting device.

2. Description of the Related Art Generally, when performing surface inspection of a product or positioning of an assembly part in a manufacturing process, etc.,
2. Description of the Related Art Illumination devices are used to capture image information from products, assembled parts, and the like. For example, when performing a surface inspection of a product, the product to be inspected is irradiated with light from a lighting device, the product to be inspected is imaged by a CCD, and the image data is compared with reference data to obtain a surface condition of the product to be inspected. (Scratch, deformation, etc.) are inspected. As a lighting device applied to such an application, for example, a lighting device A having a structure shown in FIG. 11 has been proposed (Japanese Patent No. 297).
No. 5893). This lighting device A includes a case body 1
0, a lighting part C having a ring-shaped cover 20
Is arranged. The lighting unit C
A plurality of light emitters, for example, light emitting diodes (LEDs) 40 are arranged on a bendable printed wiring board 30,
Lead and the printed wiring board 30 corresponding to the lead
Of the printed wiring board 30 are joined or held close to each other such that the LED 40 is positioned on the truncated conical concave surface. A power supply line 50 for supplying power to the printed wiring board 30 is drawn out from a side surface of the cover 20. In this lighting device A,
The illuminating section C arranges the plurality of LEDs 40 on the printed circuit board 30 in the unfolded state, and solders all the leads of the LEDs 40 and the conductive lands of the printed circuit board 30 corresponding to the leads. Substrate 3
It is manufactured by joining or holding the two ends of the “0” such that the LED 40 is located on the concave surface of the truncated cone.
For this reason, the assemblability of the lighting device A can be improved. By the way, in this lighting device A, the bonding of both ends of the printed wiring board 30 is performed by, for example,
As disclosed in Japanese Unexamined Patent Application Publication No. 5 (1999) -2005,
This can be performed by a pair of locking pieces attached to both ends of the “0”, and is recommended because the assembling is easy. However, attaching a pair of locking pieces to both ends of the printed wiring board 30 makes it difficult to arrange the LEDs 40 at both ends of the printed wiring board 30.
There is a problem that the mounting density of the D40 becomes non-uniform, the illuminance distribution on the product to be inspected becomes non-uniform, and a highly reliable surface inspection cannot be expected.

Therefore, conventionally, in order to solve such a problem, for example, a method of joining both ends of the printed wiring board 30 as shown in FIGS. 12 and 13 has been tried. . In the bonding method shown in FIG. 12, first, as shown in FIG. 12A, the through holes 31a and 31
The leads 40a and 40b of the LED 40 are inserted into the "b", and the leads 40a and 40b of the plurality of LEDs 40 and the corresponding conductive lands (not shown) of the printed wiring board 30 are soldered (50). The LEDs 40 are not inserted into through holes (empty through holes) 32a and 32b formed at the ends 30A and 30B of the printed wiring board 30, respectively. Then, both ends 30A and 30B of the printed wiring board 30 are brought close to and held. Next, as shown in FIG. 3B, the empty through holes 3 at both ends 30A and 30B of the printed wiring board 30 are formed.
The leads 40a, 40b of the LED 40 are inserted into the 2a, 32b and soldered (50) as shown in FIG. According to this joining method, both ends 30A, 30B of the printed wiring board 30
Since the LEDs 40 can also be arranged, the mounting density of the LEDs 40 on the printed wiring board 30 can be made uniform, the illuminance distribution on the product to be inspected becomes uniform, and a highly reliable surface inspection can be expected. However, in this bonding method, both ends 3 of the printed wiring board 30
Empty through holes 32a, 32b at 0A, 30B
When inserting the leads 40a and 40b of the LED 40 into
One worker operates both ends 30A, 3 of the printed wiring board 30.
0B in the proximity state, and another worker
Since the 0 leads 40a and 40b and the corresponding conductive lands of the printed wiring board 30 must be soldered, there is a problem that many work steps are required. In the joined state, both ends 30A of the printed wiring board 30 are connected.
In relation to 30B, a force acting to separate from each other acts,
Stress also acts on the leads 40a, 40b of the LED 40 soldered to the conductive lands of the empty through holes 32a, 32b. For this reason, the leads 40a,
There is also a problem that the performance of the LED 40 is likely to be impaired due to the formation of cracks in the lead-out portion of the LED 40b. In the joining method shown in FIG. 13, first, as shown in FIG. 13A, the leads of the plurality of LEDs 40 are inserted into the through holes of the printed wiring board 30 in the unfolded state,
The leads of the plurality of LEDs 40 and the corresponding conductive lands of the printed wiring board 30 are soldered. In addition, conductive lands 33, 33, 33 for bonding are formed in advance on the respective ends 30A, 30B of the printed wiring board 30. And both ends 30A, 30 of the printed wiring board 30
B is made to approach and hold. Next, as shown in FIG. 2B, a wire 60 is attached to each of the conductive lands 33, 33, 33 at both ends 30A, 30B of the printed wiring board 30.
The assembly (joining) is completed by arranging 60 and 60 so as to bridge and soldering. According to this joining method, the LEDs 40 can be arranged at both ends 30A and 30B of the printed wiring board 30 similarly to the joining method shown in FIG.
This makes it possible to make the mounting density uniform, the illumination distribution for the product to be inspected becomes uniform, and a highly reliable surface inspection can be expected. However, in this joining method, the wires 60, 60, 6 are attached to the joining conductive lands 33, 33, 33 at both ends 30A, 30B of the printed wiring board 30.
When soldering 0, one worker holds both ends 30A, 30B of the printed wiring board 30 in a close state, and another worker connects the conductive lands 33, 33, 33 for joining.
Therefore, there is a problem that many work steps are required because the wires 60, 60, 60 must be soldered.
In addition, since the conductive lands 33, 33, 33 for bonding must be formed on both ends 30A, 30B of the printed wiring board 30, the size of the printed wiring board 30 becomes larger than necessary, and the lighting device A (particularly, In addition, there is a problem that it is difficult to cope with a case where the illumination unit C) needs to be downsized. Therefore, an object of the present invention is to provide a method of manufacturing a lighting device capable of reducing the number of working steps during assembly and also reducing the stress acting on a light emitting body.

SUMMARY OF THE INVENTION Accordingly, in order to achieve the above-mentioned object, the present invention provides a printed wiring board having a bent printed wiring board having a plurality of through holes in a main part in an expanded state. Inserting a plurality of luminous body leads into all through holes except through holes (empty through holes) at the other end of the board; and connecting the conductive lands of the printed wiring board to the desired leads of the luminous body. Soldering one end and the other end of the printed wiring board so that the lead inserted into the through hole at one end is inserted into an empty through hole at the other end. A step of overlapping and forming a substantially ring shape, and soldering the lead of the luminous body inserted into the vacant through hole at the other end and the corresponding conductive land of the printed wiring board. Together, if there is non-soldered portion between the printed circuit board and the light emitting element of the lead is characterized in that it comprises the step of soldering also the part.
According to a second aspect of the present invention, a bendable printed wiring board having a plurality of through holes in a main portion is held in an expanded state, and then a through hole (an empty through hole) is formed at the other end of the printed wiring board. A) inserting the leads of the plurality of luminous bodies into all through holes except for), soldering one of the leads of the plurality of luminous bodies to the corresponding conductive land of the printed wiring board, and one of the printed wiring boards. Forming an end and the other end into a substantially ring shape by overlapping so that the lead inserted into the through hole at one end is inserted into the empty through hole at the other end, Solder the lead of the luminous body inserted into the empty through hole at the other end and the corresponding conductive land of the printed wiring board, and simultaneously use the other lead of the plurality of luminous bodies. Characterized in that it comprises the step of soldering a conductive lands of the corresponding printed circuit board and. Further, a third invention of the present invention is directed to the present invention, wherein a plurality of light-emitting leads are provided in the through-holes of the printed wiring board, and all the through-holes except empty through-holes corresponding to a row of light-emitting leads are provided at the other end. After being inserted into the hole, one end of the printed wiring board and the other end,
According to a fourth aspect of the present invention, the light emitting element is a light emitting diode (LED), wherein the lead of the light emitting element disposed at one end is overlapped so as to be inserted into a vacant through hole at the other end. According to a fifth aspect of the present invention, the ring shape of the printed wiring board is substantially any one of a truncated cone and a substantially cylindrical shape.

Next, a first embodiment of a lighting device according to the present invention will be described with reference to FIGS.
In the drawing, reference numeral A denotes a lighting device, which is configured by incorporating a lighting unit C into a lighting case B, for example. The lighting case B has, for example, an opening 1a in the center, and the opening 1a.
A substantially annular case body 1 having a step-shaped locking portion 1b at an inner portion of a peripheral portion thereof, and a step-shaped locking portion 2a at an inner portion of an outer surface portion, and a power supply line 3 at a desired portion of the outer surface portion. And a substantially cylindrical cover 2 having a draw-out hole 2b for pulling out the cover 2. The cover 2 is joined to the peripheral portion of the case body 1. The illuminating section C mainly includes a bendable printed wiring board 4 and a plurality of light emitters, for example, light emitting diodes (LEDs) 7. The printed wiring board 4 is formed, for example, in an annular shape having a notch in an unfolded state, and a plurality of through holes 5a and 5b are provided at a portion other than the other end 4B at the other end 4B. Empty through holes 6a and 6b are formed.
A desired wiring pattern is formed on the printed wiring board 4, and this wiring pattern is appropriately connected to conductive lands (not shown) formed in the through holes 5a and 5b and the empty through holes 6a and 6b. Is electrically connected to The power supply line 3 is led out of this wiring pattern. In particular, the lighting unit C is in a completed state,
One end 4A and the other end 4B of the printed wiring board 4
Are overlapped so that the through holes 5a, 5b at one end 4A and the empty through holes 6a, 6b at the other end 4B communicate with each other, and are formed in a truncated cone shape. Moreover, the leads 8a, 8 of the plurality of LEDs 7 are respectively provided in the through holes 5a, 5b and the empty through holes 6a, 6b.
b is inserted and soldered (9) to the corresponding conductive land. Next, a method of manufacturing the lighting device A will be described with reference to FIGS. First, as shown in FIG. 5, a plurality of LEDs 7 are mounted on the printed circuit board 4 in an unfolded state.
To the empty through holes 6a, 6a at the other end 4B.
The leads 7a and 8b of the LED 7 are arranged by inserting the leads 8a and 8b into all the through holes 5a and 5b except b. Next, as shown in FIG. 6, a plurality of rows of LEs arranged on
One of the leads 8a and 8b in D7
a is soldered (9) to the corresponding conductive land. In other words, the soldering is performed so that the printed wiring board 4 is jumped in a bending direction to be described later. Next, FIG.
As shown in (a), one end 4A of the printed wiring board 4 is connected to the other end 4B, and the LE at the one end 4A.
The leads 8a and 8b of D7 are overlapped so as to be inserted into the empty through holes 6a and 6b at the other end 4B. This operation is performed by one worker.
Next, as shown in FIG.
Are soldered (9) to the corresponding conductive lands. Next, as shown in FIG. 7C, the leads 8a of the LEDs 7 inserted into the empty through holes 6a and the corresponding conductive lands are soldered (9). Next, as shown in FIG. 7D, soldering (9) the 8b of all the LEDs 7 except for the LEDs 7 located at the ends 4A and 4B of the printed wiring board 4 and the corresponding conductive lands. Thus, the lighting unit C is assembled. Thereafter, the lighting device A is manufactured by incorporating the lighting unit C into a lighting case B including the case main body 1 and the cover 2. According to this embodiment, the printed wiring board 4
The one end 4A and the other end 4B are joined by connecting the one end 4A and the other end 4B with the leads 8a and 8b of the LED 7 arranged at the one end 4A. Since the leads 8a, 8b of the LED 7 and the conductive lands of the empty through holes 6a, 6b are soldered (9) after being overlapped so as to be inserted into the empty through holes 6a, 6b in the portion 4B, printing is performed. Even if a force that develops on each end 4A, 4B of the wiring board 4 acts, the through hole 5 at each end 4A, 4B
The leads 8a, 8b of the LED 7 inserted into the a, 5b and the empty through holes 6a, 6b exhibit a stopper function against such a force, and the leads 8a, 8b are soldered to the conductive lands of the corresponding through holes. Therefore, an effective stopper action against such a force is exhibited. Therefore, the stress acting on the LED 7 in the assembled state can be effectively reduced.
The joining work of these ends 4A and 4B can be performed by one worker, and the number of work steps required for manufacturing can be reduced as compared with the conventional lighting device. In the closed state of the printed wiring board 4, the soldering of the leads 8a, 8b of the LED 7 inserted into the empty through holes 6a, 6b with the conductive lands (9) is performed after the leads 8b and the conductive lands are soldered. Soldering the leads 8a and the conductive lands is recommended to reduce the stress on the LED 7 during assembly, but the order can be reversed. In particular, as shown in FIG. 6, a plurality of LEDs 7 arranged on the printed wiring board 4
Since only a is soldered to the corresponding conductive land (9), the bending and deformation of the printed wiring board 4 can be easily performed when the ends 4A and 4B of the printed wiring board 4 are overlapped. In addition, the effect of stress on the printed wiring board 4 at the time of bending can be reduced, and the reliability of the product can be increased. FIG. 8 shows a second embodiment of the method of manufacturing a lighting device according to the present invention, and the basic configuration is almost the same as the embodiment shown in FIGS. First, the plurality of LEDs 7 are mounted on the printed wiring board 4 in the unfolded state, and all the through holes 5a and 5b except the empty through hole 6a at the other end 4B are provided.
The leads 8a and 8b of the LED 7 are inserted and arranged on the printed wiring board 4, and one of the leads 8a and 8b of the plurality of rows of the LEDs 7 arranged on the printed wiring board 4 toward the substantially center of its annular shape. Are soldered (9) to the corresponding conductive lands. Then, as shown in FIG. 8A, one end 4A of the printed wiring board 4 is provided with the other end 4B, and the lead 8a of the LED 7 at one end 4A is provided with an empty through hole at the other end 4B. 6
a so as to be inserted into a. This operation is performed by one worker. Next, as shown in FIG. 8B, the LED 7 inserted in the empty through hole 6a
Soldering the lead 8a and the corresponding conductive land (9)
I do. Next, as shown in FIG.
The lighting unit C is assembled by soldering (9) the 8b of 7 and the corresponding conductive land. Thereafter, the illuminating unit C is, for example, as shown in FIG.
The lighting device A is manufactured by incorporating the lighting device A into the lighting case B including the cover 2 and the cover 2. According to this embodiment, one end 4A and the other end 4B of the printed wiring board 4 are joined by disposing the one end 4A and the other end 4B at the one end 4A. Since the lead 8a of the LED 7 is overlapped so as to be inserted into the empty through hole 6a at the other end 4B, the lead 8a of the LED 7 and the conductive land of the empty through hole 6a are soldered (9). The respective ends 4A, 4A of the printed wiring board 4
Even if a force such as to develop on B acts, the leads 8a of the LEDs 7 inserted into the through holes 5a and the empty through holes 6a at the respective end portions 4A and 4B exhibit a stopper function against such force, and Since the leads 8a are soldered to the corresponding conductive lands of the through holes, the leads 8a exhibit a stopper function against such a force. Therefore, the stress acting on the LED 7 in the assembled state can be reduced, and the joining work of the ends 4A, 4B can be performed by one worker, and the number of man-hours required for manufacturing can be reduced as compared with the conventional lighting device. . In particular, as shown in FIG.
The plurality of LEDs 7 arranged on the printed wiring board 4 are soldered (9) to the corresponding conductive lands only on one of the leads 8a.
When the end portions 4A and 4B are overlapped, not only can the printed wiring board 4 bend and deform easily, but also the action of stress on the printed wiring board 4 at the time of bending can be reduced, and the reliability of the product can be reduced. Can be enhanced. FIG. 9 shows a third embodiment of the method for manufacturing a lighting device according to the present invention, and the basic configuration is almost the same as the embodiment shown in FIGS. The difference is that in the lighting section C, a plurality of LEDs 7 are arranged on the outer surface side of the printed wiring board 4 bent into a truncated cone. Note that the structure of the first embodiment shown in FIGS. 1 to 7 or the second embodiment shown in FIG. 8 is applied to the closing / joining structure at both ends of the printed wiring board 4.
FIG. 10 shows a fourth embodiment of a method for manufacturing a lighting device according to the present invention, and the basic configuration is almost the same as the embodiment shown in FIGS. The difference is that in the lighting section C, the printed wiring board 4 is bent into a cylindrical shape (cylindrical shape in the illustrated example) such as a cylindrical shape, an elliptical cylindrical shape, and a rectangular cylindrical shape, and a plurality of LEDs 7 are arranged on the outer surface thereof. That is being done. Note that, depending on the application, the LED 7 can be arranged on the inner surface side of the tubular portion. Further, the LED 7 is arranged at a substantially right angle (perpendicular) to the printed wiring board 4, but may be arranged to have an inclination angle depending on the use. Furthermore, the structure of either the first embodiment shown in FIGS. 1 to 7 or the second embodiment shown in FIG. 8 is applied to the closing / joining structure at both ends of the printed wiring board 4. In addition, the present invention is not limited to the above-described embodiment only. For example, the lighting unit in the lighting device can be appropriately changed in form according to the application, and the lighting case accommodating the lighting unit is also in the form of the lighting unit. It is changed appropriately according to the situation. A light emitting diode (LED) is preferably used as a light emitting body applied to the lighting unit, but a miniaturized xenon lamp, a light bulb, and the like can also be used. Also, prior to bending of the printed wiring board,
It is recommended to solder one lead of the light emitter and the conductive land, but it is also possible to solder all leads and the conductive land. Further, the luminous body may be disposed on the printed wiring board so that the bottom surface of the luminous body is in close contact with the printed wiring board, or may have an appropriate gap.

As described above, according to the present invention, one end and the other end of the printed wiring board are joined by joining one end and the other end to one end. After overlapping so that the desired lead of the arranged light emitter is inserted into the empty through hole at the other end, the lead of the light emitter and the conductive land of the empty through hole are soldered, Even if a force that develops at each end of the printed wiring board acts, the lead of the luminous body inserted into the through hole and the empty through hole at each end exhibits a stopper action against such a force, Moreover, since the leads are soldered to the corresponding conductive lands of the through holes, an effective stopper action against such a force is exhibited. Therefore,
In addition to effectively reducing the stress acting on the illuminant in the assembled state, the work of joining these ends can be performed by fewer workers, and the number of man-hours required for manufacturing can be reduced as compared with the conventional lighting device.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a first embodiment of a lighting device according to the present invention.

FIG. 2 is a bottom view of a lighting unit in the lighting device shown in FIG. 1;

FIG. 3 is a plan view of FIG. 2;

FIG. 4 is a cross-sectional view of a main part of a bonding portion of a printed wiring board in the illumination unit shown in FIG.

FIG. 5 is a plan view of a printed circuit board in an unfolded state in the illumination unit shown in FIG. 3;

FIG. 6 is a plan view showing a state in which some leads of a light emitting body arranged on a printed wiring board are soldered to conductive lands.

7A and 7B are views showing a method of assembling the printed wiring board shown in FIG. 6, wherein FIG. 7A is a cross-sectional view of a main part showing a state where both ends of the printed wiring board are overlapped, and FIG.
Is a sectional view of a main part showing a state in which one of the leads inserted into the empty through hole at the other end of the printed wiring board and the conductive land are soldered, and FIG. FIG. 3D is a cross-sectional view of a main part showing a state in which the other of the lead and the conductive land are soldered, and FIG. 4D is a cross-sectional view of the main part showing a state in which the lead and the conductive land in an unsoldered state are soldered.

FIG. 8 is a second diagram illustrating a method of manufacturing a lighting device according to the present invention.
(A) is a sectional view of a main part showing a state where both ends of a printed wiring board are overlapped, and FIG. (B) shows an empty through hole at the other end of the printed wiring board. FIG. 3C is a cross-sectional view of a main part showing a state where the inserted lead and the conductive land are soldered, and FIG. 4C is a cross-sectional view of the main part showing a state where the lead and the conductive land in an unsoldered state are soldered.

FIG. 9 is a sectional view showing a third embodiment of the lighting device according to the present invention.

FIG. 10 is a sectional view showing a fourth embodiment of the lighting device according to the present invention.

FIG. 11 is a cross-sectional view showing a conventional lighting device.

FIG. 12 is a view showing a method of connecting a printed wiring board in a conventional lighting device, and FIG. 12 (a) shows a case where a plurality of light emitters are arranged on a printed wiring board and all leads and conductive lands are soldered. FIG. 2B is a sectional view of a main part showing a state in which both ends of the printed wiring board are arranged close to each other, and leads of the luminous body are inserted and arranged in empty through holes at both ends. FIG. 3C is a cross-sectional view of a main part showing a state in which the lead inserted into the empty through hole and the corresponding conductive land are soldered.

13A and 13B are diagrams showing different bonding methods of a printed wiring board in a conventional lighting device, and FIG. 13A shows a state in which a light emitting body is arranged on a printed wiring board having conductive lands for bonding at both ends. FIG. 2B is a plan view showing a state in which both ends of the printed wiring board are in contact with each other and a wire is soldered to the corresponding conductive land for joining.

[Explanation of symbols]

 Reference Signs List A Lighting device B Lighting case C Lighting unit 1 Case body 2 Cover 3 Power line 4 Printed wiring board 4A One end 4B The other end 5a, 5b Through hole 6a, 6b Empty through hole 7 Light emitting body (LED) 8a, 8b Lead 9 Solder

Claims (5)

[Claims] 1. A printed wiring board having a plurality of through holes in a main part is held in an expanded state, and all through holes (empty through holes) at the other end of the printed wiring board are removed. Inserting the leads of the plurality of light emitters into the holes; soldering the desired leads of the light emitters to the corresponding conductive lands of the printed wiring board; one end and the other end of the printed wiring board And forming a substantially ring-shaped portion by overlapping the lead inserted into the through hole at one end so as to be inserted into the empty through hole at the other end; and forming an empty through hole at the other end. Solder the lead of the luminous body inserted into the hole and the corresponding conductive land of the printed wiring board, and also unsoldered parts between the printed wiring board and the lead of the luminous body. And, if there is a part, soldering the same part. 2. A printed wiring board having a plurality of through-holes in a main portion thereof held in a developed state, and all the through-holes at the other end of the printed-wiring board except through-holes (empty through-holes) are provided. Inserting the leads of the plurality of light emitters into the holes, soldering one of the leads of the plurality of light emitters and the corresponding conductive land of the printed wiring board, and connecting one end of the printed wiring board to the other end. Forming a substantially ring shape by overlapping the ends so that the lead inserted into the through hole at one end is inserted into the empty through hole at the other end; Solder the lead of the light emitter inserted into the through hole and the corresponding conductive land of the printed wiring board, and also connect the lead corresponding to the other lead of the plurality of light emitters. Soldering the conductive land of the lint wiring board to the lighting device. 3. Inserting leads of a plurality of light emitters into through holes of the printed wiring board into all through holes except for empty through holes corresponding to leads of a row of light emitters at the other end. One end and the other end of the printed wiring board are overlapped so that the lead of the luminous body arranged at one end is inserted into an empty through hole at the other end. The method for manufacturing a lighting device according to claim 1. 4. The light-emitting device according to claim 1, wherein the light-emitting body is a light-emitting diode (LED).
The method for manufacturing a lighting device according to claim 1, wherein: 5. The method of manufacturing a lighting device according to claim 1, wherein the ring shape of the printed wiring board is substantially any one of a truncated cone and a substantially cylindrical shape.