JP2002181881A - Instrument and method for measuring electronic circuit device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make electric connection to an external connection terminal of a so-called leadless type electronic circuit device conducted surely, and enhance electrical reliability in a connection part to the external connection terminal. SOLUTION: This measuring instrument has a measuring substrate 31 provided with a measuring circuit for measuring an electric characteristic of an IC package as the electronic circuit device, and plural contact members 11 arrayed movably on the substrate 31 to allow contact to the second contact face of the external connection terminal exposed from a side face of the IC pakage and to bring electric continuity between the external connection terminal and the measuring circuit 31.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit device measuring device for measuring the electrical characteristics of an electronic circuit device.

[0002]

2. Description of the Related Art In recent years, IC packages have become smaller and thinner as electronic devices on which IC packages are mounted have become smaller.
Higher density is required. FIG. 21 is a perspective view showing an example of a conventional IC package. The IC package 101 shown in FIG. 21 has a package main body 102 in which an electronic circuit is built, and leads 103 protruding and arranged on opposite side surfaces of the package main body 102. The package body 102 is obtained by molding a sealing resin using a mold and an injection molding device, for example. The lead portion 103 is electrically connected to an electronic circuit sealed inside the package body 102. In the IC package 101 having the above configuration, the package body 10
Since the lead portion 103 is provided to protrude from 2,
There is a disadvantage that the outer shape of the IC package 101 is relatively large, and the mounting area when mounting the IC package 101 on an electronic device is large.

To reduce the mounting area, for example, FIG.
2 and FIG. 23, a so-called leadless type IC package 201 has been developed. FIG. 22 is a perspective view of a leadless type IC package 201, and FIG. 23 is a bottom view of the IC package 201. As shown in FIGS. 22 and 23, an IC package 201 is a package body 202 containing an electronic circuit.
And a lead member 203 provided integrally with the package body 202 and exposed from the bottom surface of the package body 202. Further, the IC package 201 further includes a ground terminal 204 whose front surface is integrally provided on the bottom surface of the package body 202 and whose back surface is exposed from the bottom surface of the package body 202. The package body 202 is formed of resin, and inside the package body 202,
For example, a semiconductor chip is built in, and this semiconductor chip is connected to each lead member 203 and the ground terminal 20.
4 is electrically connected. The lead member 203 is formed of, for example, a metal plate such as an Fe or Cu alloy. The front surface side is integrally fixed to the bottom surface of the package body 202, and the back surface is exposed from the bottom surface of the package body 202. The back surface of the lead member 203 is plated with solder. Further, the tip of the lead member 203 protrudes from each of the opposing side surfaces of the package body 202, and a part of the resin forming the package body 202 is interposed between the lead members 203. The connection between the IC package 201 and the electronic device is made on the back surface of the lead member 203 exposed from the bottom surface of the package body 202.
This is performed by connecting the connection terminals of the electronic device. That is, the lead member 203 and the connection terminals of the electronic device are electrically and mechanically connected by the solder plating applied to the back surface of the lead member 203. In the IC package 201 having the above-described configuration, the lead member 203 is integrally provided on the bottom surface of the package body 202, and the lead member 2 is provided.
Since the back surface for making the electrical connection 03 and the ground terminal 204 are exposed from the bottom surface of the package body 202, the mounting area can be reduced as compared with the IC package 101 described above. In addition, the thickness of the package body 202 can be reduced.

[0004]

After manufacturing the above IC package 201 and before shipping it as a product,
It is necessary to inspect the electrical characteristics of the C package 201 and sort out non-defective products and defective products. For example, as shown in FIG. 24 or FIG. 25, the electrical characteristics are measured on a measuring substrate 210 and a conductive member provided on the measuring substrate 210 so as to correspond to each lead member 203 of the IC package 201. Contact elements 2 composed of conductive members
12 is performed. As shown in FIG. 24, the contact element 212 is supported by an insulating support member 213 so as to be elastically deformable, and is electrically connected to a measurement circuit formed on the measurement substrate 210. The measurement device shown in FIG.
Two places are supported by the insulating support members 213 and 214. The measurement of the IC package 201 by the measuring device as described above is performed by pressing the back surface of the corresponding lead member 203 of the IC package 201 against the tip of the contact element 212, and the electronic device embedded in the IC package 201 via the contact element 212. This is performed by electrically connecting the circuit and the measurement substrate 210.

Incidentally, the leadless type IC package 201 as described above can be made thinner, but, for example, as shown in FIG. 26 or FIG.
The C package 201 is likely to warp with respect to a plane. In particular, as shown in FIG. 27, the case where the bottom surface of the IC package 201 is curved in a convex shape easily occurs. The magnitude of the warp is, for example, 10 to 50 μm in height from the center to the periphery of the bottom surface of the IC package 201.
It is about. If the IC package 201 is warped as described above, the warp is absorbed and the back surfaces of all the lead members 203 are brought into contact with the corresponding contact elements 21.
2 or the IC package 201 is pressed against the contact element 212 to make contact with FIG.
As shown in FIG. 5, the contact element 212 is deformed. When the contact element 212 is deformed, as shown in FIG. 24 or FIG. 25, the contact position between the contact element 212 and the back surface of the lead member 203 moves by the movement amount δ. That is, the tip of the contact element 212 slides on the back surface of the lead member 203.

[0006] When the tip of the contact element 212 slides on the back surface of the lead member 203, the back surface of the lead member 203 may be damaged. Lead member 2
If the back surface of the IC package 201 is scratched, it becomes difficult to determine whether the scratch is a foreign substance adhered to the back surface of the lead member 203 in the inspection process of the back surface of the IC package 201. Could not be. In addition, since the tip of the contact element 212 slides on the back surface of the lead member 203 on which the solder plating is performed, the solder easily adheres to the contact element 212. May increase the resistance value on the surface of the contact element 212, making it impossible to perform an appropriate measurement.
It was necessary to replace the contact element 212 with a relatively small number of uses.

On the other hand, instead of a measuring device having a contact element 212 as shown in FIG. 24 or FIG. 25, a contact with the back surface of a lead member 203 of an IC package 201 is formed on a measuring substrate by planar connection terminals. There is also a measuring device which performs the measurement by placing the contact sheet on which the measurement is performed. However, in such a sheet-type measurement device, if the IC package 201 has a warp, the IC package 20 is attached to the measurement substrate in order to absorb the warp.
1 must be pressed to deform the measurement substrate. I
When the C package 201 is pressed, the lead member 203 is pressed.
Is transferred to the connection terminals, the solder is easily deposited, and the life of the contact sheet is short. In addition, since the measurement substrate is repeatedly deformed, there is a disadvantage that chip components, printed wiring, and the like mounted on the measurement substrate are easily damaged, and the life of the measurement substrate is shortened.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and ensures that an electrical connection with an external connection terminal of a so-called leadless type electronic circuit device is ensured.
An object of the present invention is to provide a measuring device and a measuring method for an electronic circuit device having high electrical reliability of a connection portion with an external connection terminal.

[0009]

According to the present invention, there is provided a measuring apparatus for an electronic circuit device, comprising: a package body containing an electronic circuit; and a first contact provided integrally with the package body and exposed from a bottom surface of the package body. A measuring device for measuring electrical characteristics of an electronic circuit device having a plurality of external connection terminals electrically connected to the electronic circuit having a surface and a second contact surface exposed from opposite side surfaces of the package body. A measuring board provided with a measuring circuit for measuring electrical characteristics of the electronic circuit device; and an array on the measuring board so as to be able to contact a corresponding second contact surface of each of the external connection terminals. And a plurality of contact members that conduct the electrical connection between the external connection terminal and the measurement circuit and constitute a mounting portion of the electronic circuit device.

The contact surface of each of the contact members with the second contact surface rises from the mounting surface of the measurement substrate.

Each of the contact members is provided so as to be elastically displaceable with respect to a side surface of the package body.

The contact member is held by an elastic member.

[0013] A contact surface of the contact member with the second contact surface is an inclined surface or a curved surface formed so that the displacement of the contact member increases as the electronic circuit device moves in the mounting direction. It has become.

The contact surface of the contact member with the second contact surface slides at the edge where the first and second contact surfaces of the external connection terminal intersect when the electronic circuit device is mounted. Sliding surface.

[0015] Of the first and second contact surfaces of the external connection terminal, only the first contact surface is plated with solder.

The electronic circuit device has a second external connection terminal which is provided integrally with the package body and has a contact surface exposed from a bottom surface of the package body and is electrically connected to the electronic circuit. And a contact portion provided on the non-mounting surface side of the measurement substrate and protruding toward the mounting surface through an opening formed in the measurement substrate, the contact portion being capable of contacting the second external connection terminal. A second contact member electrically connected to the measurement circuit, wherein the second contact member is elastically displaceable when the contact portion comes into contact with the second external connection terminal. keeping.

The measuring device of the electronic circuit device according to the present invention further includes a buffer member on the non-mounting surface side of the measuring substrate for holding the second contact member in a displaceable manner.

Preferably, the buffer member is made of silicone rubber.

The second external connection terminal is a ground terminal.

According to the method for measuring an electronic circuit device of the present invention, a package body containing an electronic circuit, a first contact surface provided integrally with the package body and exposed from a bottom surface of the package body, and a side surface of the package body are provided. A measurement method for measuring an electrical characteristic of an electronic circuit device having a plurality of external connection terminals electrically connected to the electronic circuit having a second contact surface exposed from a substrate using a measurement substrate; The electronic circuit is electrically connected to the substrate for measurement, and a conductive contact member provided on the substrate for measurement is brought into contact with the second contact surface of each of the external connection terminals to electrically connect the substrate for measurement and the electronic circuit. Is connected to.

In the method for measuring an electronic circuit device according to the present invention, the plurality of contact members are arranged corresponding to each side surface of the package body, and the plurality of contact members and a second contact surface of each of the external connection terminals are arranged. The electronic circuit device is fixed on the substrate for measurement by making contact with the substrate.

In the method for measuring an electronic circuit device according to the present invention, when the electronic circuit device is fixed on the measurement substrate, the contact members and the external connection terminals are slid.

In the method for measuring an electronic circuit device according to the present invention, when the electronic circuit device is fixed on the measurement substrate, the contact members are brought into contact with the second contact surfaces of the external connection terminals. Is elastically displaced in accordance with.

[0024] Only the first contact surface of the first and second contact surfaces of the external connection terminal is plated with solder.

The electronic circuit device has a second external connection terminal which is provided integrally with the package body and has a contact surface exposed from the bottom surface of the package body and is electrically connected to the electronic circuit. And a contact portion provided on the non-mounting surface side of the measurement substrate and protruding toward the mounting surface through an opening formed in the measurement substrate, the contact portion being capable of contacting the second external connection terminal. There is further provided a second contact member electrically connected to the measuring circuit, and the contact portion is elastically displaced by contact with the second external connection terminal.

In the present invention, the electrical connection between the measuring circuit and the electronic circuit device is performed by bringing the contact member into contact with the second contact surface on the side surface of the external connection terminal exposed from the bottom surface of the package body. Therefore, the contact member does not contact the first contact surface of the external connection terminal used when the electronic circuit device is mounted on the electronic device.

[0027]

Embodiments of the present invention will be described below with reference to the drawings. 1 and 2 are exploded perspective views showing the configuration of a contact socket according to an embodiment of the measuring device for an electronic circuit device of the present invention. The contact socket according to the present embodiment includes a housing member 2 shown in FIG. 1A, a contact element 11 and an elastic supporting member 21 shown in FIG. 1B, and a measurement board 31 shown in FIG. , Ground (GND) shown in FIG.
It has a plate 41, a buffer member 51 shown in FIG. 2 (e), and a holder member 61 shown in FIG. 2 (f).

The holder member 61 has a housing recess 61a for housing and holding the buffer member 51. The buffer member 51
The outer shape is formed of a member having a rectangular shape, and is formed of, for example, silicon rubber. This buffer member 5
1 is housed and held in the housing recess 61 a of the holder member 61.

The GND plate 41 is held on the cushioning member 51 and is formed of, for example, a metal such as a copper alloy. The GND plate 41 has an arm portion 43 extending toward four corners of the accommodating concave portion 61a of the holder member 61, and a rectangular contact portion 42 formed at a central portion where the arm portions 43 are connected. The distal end of the arm portion 43 is formed in a shape that fits into each corner of the housing recess 61 a of the holder member 61. The contact portion 42 is formed so as to protrude from the surface of the arm portion 43.

On the surface of the measurement substrate 31, terminals 32 are formed on the surface of the substrate 31 to be in contact with the respective contact elements 11, and an opening into which the above-mentioned contact portion 42 of the GND plate 41 is inserted into the center surrounded by the terminals 32. A part 33 is formed. The area surrounded on all sides by the terminal portion 32 of the measurement substrate 31 is a mounting surface on which the IC package is placed. Various chip components constituting a circuit for measuring the electrical characteristics of the IC package as the electronic circuit device of the present invention are mounted on both sides of the measurement substrate 31, and printed wiring is formed on the both sides. A circuit for measuring the electrical characteristics of the IC package includes a terminal 32
Is electrically connected to The circuits formed on both surfaces of the measurement substrate 31 are electrically connected through through holes (not shown) formed in the measurement substrate 31.

The contact element 11 is movably provided on each terminal 32 formed on the surface of the measurement substrate 31 and is supported by the elastic support member 21.

The elastic support member 21 supports the contact element 11. The elastic support member 21 is formed of a rod-shaped member, and is formed of, for example, a material such as rubber or resin. Both ends of each elastic support member 21 are fitted with fitting portions (not shown) of the housing member 2, and are positioned with respect to the housing member 2.

The housing member 2 has an opening 2a for inserting an IC package, and each contact element 1
And an accommodation groove 2b for accommodating the same. The housing member 2 covers each contact element 11 and the elastic support member 21 from the outside, and is placed on the holder member 61 with the measurement substrate 31 interposed therebetween.

FIG. 3 is a view showing an example of the structure of an IC package mounted on the contact socket shown in FIGS. 1 and 2, and FIG. 3A is a perspective view showing a part of the IC package. FIG. 3B is a bottom view of a part of the IC package. As shown in FIG.
Reference numeral 1 denotes a package body 82 having a built-in electronic circuit, and a package body 8 provided integrally with the package body 82.
2 is provided with a lead member 83 and a ground terminal 84 exposed from the bottom surface. The lead member 83 is one embodiment of the external connection terminal of the present invention, and the ground terminal 84 is one embodiment of the second external connection terminal of the present invention. In addition,
The IC package 81 is a leadless type IC package similar to that described above.

The package body 82 is formed of a resin. The package body 82 contains, for example, a semiconductor chip. The semiconductor chip is electrically connected to the lead members 83 and the ground terminals 84. Have been. The lead member 83 is formed of, for example, a metal plate of Fe, Cu alloy, or the like. The front surface is integrally fixed to the bottom surface of the package body 82, and the back surface 83a is exposed from the bottom surface 82a of the package body 82. The back surface 83a of the lead member 83 is plated with solder,
The surface is connected to the connection terminal of the electronic device. This back surface 83a is an embodiment of the first contact surface of the present invention. Hereinafter, this back surface 83a is referred to as a first contact surface 83a.

The tip of the lead member 83 protrudes from the side surface of the package body 82, and a part of the resin forming the package body 82 is interposed between the lead members 83. The tip surface 83b of the lead member 83 is
It is exposed from the side surface 82b of the package body 82. The tip surface 83b is an embodiment of the second contact surface of the present invention. Hereinafter, this tip surface 83b is referred to as a second contact surface 83b. The second contact surface 83b
Is not used for connection to electronic equipment, and thus is not plated with solder.

The IC package 81 has a rectangular outer shape, and the lead members 83 are arranged on two or four sides facing each other. Although the contact elements 21 of the contact socket shown in FIGS. 1 and 2 are arranged in four directions, the number and arrangement of the contact elements 21 are determined according to the number and arrangement of the lead members 83 included in the IC package 81. You.

FIG. 4 is a perspective view showing a structural example of the contact element 11. As shown in FIG. 4, the contact element 11 has a substantially U-shaped side surface, and has a fitting portion 11 a with which the elastic support member 21 fits.
The contact element 11 is supported by the elastic support member 21 by fitting the elastic support member 21 into the fitting portion 11a. The contact element 11 is placed on a terminal portion 32 formed on the measurement substrate 31 so as to be electrically connected to the terminal portion 32. Since the contact element 11 and the terminal portion 32 are not mechanically connected, the contact element 11 can be moved in the direction of the arrow shown in FIG.

Measurement substrate 3 of contact element 11
The surface 11b that rises from the surface of the IC package 81 is the second contact surface 83b of each lead 83 of the IC package 81 described above.
The contact surface 11b is in contact with the contact surface 11b. This contact surface 11b
The inclined surface or the curved surface is inclined with respect to a plane perpendicular to the surface of the measurement substrate 31.

In FIG. 4, the fitting portion 11a of the contact element 11 may be detached from the elastic support member 21 only by fitting the elastic support member 21. For this reason, as shown in FIG. 5, it is also possible to adopt a configuration in which a claw portion 11c capable of engaging with the elastic support member 21 is formed integrally with the contact element 11 adjacent to the fitting portion 11a of the contact element 11. It is. With such a configuration, it is possible to prevent the contact element 11 from detaching from the elastic support member 21.

FIG. 6 is a perspective view showing the relationship between the contact element 11 and the IC package 81 when the IC package 81 is mounted on the contact socket shown in FIGS. In FIG. 6, for convenience of explanation, the IC package 81 shows that the lead members 83 are arranged only on two opposing sides, and the contact elements 11 are also provided corresponding to the two opposing sides of the IC package 81. Indicates the case where

In FIG. 6, the bottom surface of the IC package 81 is placed on the mounting surface 31a of the measurement substrate 31, and the lead member 83 of the IC package 81 is in contact with the corresponding contact element 11. As can be seen from FIG. 6, the IC packages 81 mounted on the mounting surface 31 a of the measurement substrate 31 have contact elements 11 arranged in two rows facing the side surfaces of the IC package 81.
, The mounting surface 31 of the measurement substrate 31
a is positioned and fixed. That is, by the contact elements 11 arranged in a plurality of rows, I
A mounting portion of the C package 81 is configured.

FIG. 7 shows an IC package 81 mounted on the contact socket shown in FIG. 1 and FIG.
FIG. 9 is a diagram for explaining a contact state between a lead portion 83 of a package 81 and a contact element 11. As shown in FIG.
When the IC package 81 is mounted through the opening 2a, the second contact surface 83b of the lead member 83 contacts the contact surface 11b of the contact element 11 and slides. Each contact element 11 includes an elastic supporting member 2
1 supported. Therefore, when the second contact surface 83b of the lead member 83 contacts the contact surface 11b, the contact element 11 moves in the direction of arrow B shown in FIG.

Contact surface 11b of contact element 11
Are formed such that the displacement of the contact element 11 increases as the IC package 81 moves in the mounting direction A. Therefore, the IC package 81
As the bottom surface of the device approaches the mounting surface 31a of the measurement substrate 31,
The displacement of the contact element 11 in the direction of arrow B increases. As the displacement of the contact element 11 in the direction of the arrow B increases, the amount of deformation of the elastic support member 21 also increases.

FIG. 8 shows a warped IC package 8.
FIG. 3 is a side view of the IC package 81 showing the relationship between the IC package 1 and the contact element 11 as viewed from the side. Note that, for convenience of explanation, the case where the number of lead members 83 of the IC package 81 is larger than the above (13) is shown. As described above, the leadless type IC package 81 is likely to be warped, and in particular, the bottom surface of the IC package 81 is likely to be convexly curved. When the IC package 81 is mounted on a contact socket in a state where the IC package 81 is warped, as shown in FIG.
The center of the package 81 is the mounting surface 3 of the measuring substrate 31.
Although it is located near 1a, a gap having a height of about 10 to 50 μm is generated from the center to the periphery of the bottom surface of the IC package 201.

FIG. 9 shows the lead member 8 located substantially at the center of the bottom surface of the IC package 81 in the state shown in FIG.
3 _6, the contact state between the contact surface 11b of the lead member 83 ₃ and the contact element 11 located between the lead member 83 ₁ and the lead member 83 ₆ and the lead member 83 ₁ located most near the bottom surface of the IC package 81 FIG. As shown in FIG.
Is movably supported by the elastic support member 21, so that the contact position between the lead member 83 and the contact surface 11 b of the contact element 11, that is, the measurement substrate 31
The contact element 11 is displaced according to the height from the mounting surface 31a. Therefore, as shown in FIG. 8, even if the IC package 81 has a warp,
The lead member 83 can be formed without deforming the package 81.
At a position corresponding to the height of the contact element 11.

FIG. 10 is a diagram for explaining the electrical line length between the lead member 83 of the IC package 81 and the measurement substrate 31. As shown in FIG. 10, the lead member 83 comes into contact with the lower part of the contact surface 11b of the contact element 11 rising from the mounting surface 31a of the measurement substrate 31, so that the lead member 83 of the IC package 81 and the measurement substrate 31 An electric path K connecting between them is formed locally below the contact element 11.

On the other hand, each lead member 20 of the IC package 201 is placed on the measurement substrate 210 shown in FIGS.
3, a measuring device including a plurality of contact elements 212 made of a conductive member provided corresponding to the contact member 2;
In the measuring device of the type in which the IC package 20 is brought into contact, for example, as shown in FIG.
An electrical path K connecting each of the lead members 203 and the measurement substrate 210 penetrates the inside of the contact element 212. Therefore, when FIG. 10 is compared with FIG. 11 and FIG. 12, in the present embodiment, the line length can be significantly reduced.

FIGS. 13 to 15 are views for explaining the action of removing the solder attached to the contact element 11 when the IC package 81 is mounted on the contact socket shown in FIGS. 1 and 2. FIG. As mentioned above,
The first contact surface 83a of the lead member 83 of the IC package 81 is plated with solder, and the second contact surface 83b is not plated with solder. On the other hand, the first contact surface 8 of the IC package 81
3a does not come into contact with the contact surface 11b of the contact element 11, so that the contact element 11
No solder adheres to the contact surface 11b.

However, solder may adhere to the contact surface 11b of the contact element 11 because the solder on the first contact surface 83a of the IC package 81 peels off for some reason. Foreign substances other than solder may adhere. For example, FIG.
As shown in FIG. 3, it is assumed that foreign matter H such as solder adheres to the contact surface 11b of the contact element 11 for some reason. As you mount the IC package 81,
As shown in FIG. 14, the edge where the first contact surface 83 a and the second contact surface 83 b of the lead member 83 intersect slides on the contact surface 11 b of the contact element 11 so that the foreign matter H is scraped off. Works.

As shown in FIG. 15, the IC package 81
When the bottom surface moves to the vicinity of the mounting surface 31a of the measurement substrate 31, almost all the foreign matter H attached to the contact surface 11b of the contact element 11 is scraped off, and almost no foreign matter remains on the contact surface 11b of the contact element 11.

FIGS. 16 and 17 are sectional views for explaining the operation of the GND plate 41 and the cushioning member 51 described above. 16 and 17, illustration of the housing member 2, the contact element 11, and the elastic support member 21 is omitted. As shown in FIG. 16, the buffer member 51 is provided with a housing recess 61 a of the holder member 61.
Is housed in The GND plate 41 is placed on the cushioning member 51, and the distal end of each arm 43 of the GND plate 41 is fitted into each corner of the housing recess 61 a of the holder member 61. Thereby, the GND plate 4
1 is restricted from moving in the surface direction. The measurement substrate 31 is placed on the holder member 61, and the GND plate 41 is sandwiched between the lower surface of the measurement substrate 31 and the buffer member 51.

The contact portion 42 formed at the center of the GND plate 41 is inserted into the opening 33 formed in the measurement substrate 31 and usually projects from the upper surface of the measurement substrate 31.

The GND plate 41 is electrically connected to a ground pattern (not shown) formed on the lower surface of the measurement substrate 31. On the other hand, ground patterns (not shown) are also formed on the upper surface of the measurement substrate 31, and these ground patterns formed on the upper and lower surfaces of the measurement substrate 31 are electrically connected through through holes penetrating the measurement substrate 31. Have been. The through holes formed in the measurement substrate 31 are preferably formed with high density from the viewpoint of lowering the impedance between the upper surface and the lower surface of the measurement substrate 31.

The state shown in FIG.
Has not been mounted yet, and GN
The contact portion 42 of the D plate 41 is in a protruding state. When the IC package 81 is mounted in this state, FIG.
As shown in (2), the back surface of the ground terminal 84 exposed on the bottom surface of the IC package 81 contacts the contact portion 42 of the GND plate 41.

When the back surface of the ground terminal 84 is pressed against the contact portion 42 of the GND plate 41, the pressing force causes the arm 43 of the GND plate 41 to bend. G
When the arm portion 43 of the ND plate 41 bends, the contact portion 4
2 moves in the direction of immersion from the upper surface of the measurement substrate 31.

On the other hand, for example, a cushioning member 51 made of silicone rubber is
Deforms according to the movement of. That is, the GND plate 4
The displacement of the first contact portion 42 is received. IC package 81
Even if is pressed against the measurement substrate 31 with a somewhat large pressing force, the buffer member 51 acts to relieve the pressing force, so that a large force is not applied to the measurement substrate 31. Can be.

In the state where the pressing force for pressing the IC package 81 against the measurement substrate 31 is applied, the contact state between the back surface of the ground terminal 84 and the contact portion 42 of the GND plate 41 is kept good. When the pressing force for pressing the substrate 81 onto the measurement substrate 31 is removed, or when the pressing force is small, the ground terminal 84
And the contact portion 42 of the GND plate 41 may not sufficiently contact. Thus, for example, FIG.
As shown in FIG. 8, it is possible to adopt a configuration in which the contact portion 42 of the GND plate 41 is divided into a plurality of contact portions 42a, and each contact portion 42a can move independently. FIG.
, Between the contact portions 42a, a cross-shaped notch 4
4 are formed, and each contact portion 42a is easily moved independently. By using the GND plate 41 having such a configuration, the contact between the back surface of the ground terminal 84 and the contact portion 42 of the GND plate 41 can be improved.

As described above, in this embodiment, the second contact surface 83b of the lead member 83 exposed on the side surface of the IC package 81 can be brought into contact with each side of the IC package 81 having a rectangular external shape. Contact element 1
1 is movably arranged on the measurement substrate 31,
First contact surface 8 of lead member 83 used to electrically connect IC package 81 to electronic equipment
No damage to 3a. Therefore, alignment and inspection of the first contact surface 83a by image recognition are facilitated. Further, it is possible to suppress the solder formed on the first contact surface 83a from adhering to the contact element 11.

Further, according to the present embodiment, the lead member 8
3 the first contact surface 83a and the second contact surface 8
3b is the contact element 11
Therefore, even if a foreign substance such as solder adheres to the contact surface 11b, the foreign matter such as solder is removed by the mounting operation of the IC package 81.
It becomes an electrically stable state. As a result, stable measurement of the electrical characteristics of the IC package 81 becomes possible. Further, the replacement frequency of the contact element 11 can be reduced.

Further, according to the present embodiment, the contact elements 11 are arranged in a plurality of rows corresponding to the respective sides of the IC package 81, and the contact elements 11 constitute a mounting portion of the IC package 81 on the measurement substrate 31. Therefore, a member for guiding the IC package 81 is not required. For example, as shown in FIG. 19 or FIG.
In the measurement device of the type that makes contact with the back surface of the lead member of the C package 201, a guide member is required when the IC package 201 is mounted on the measurement substrate 210.
Specifically, as shown in FIG.
A guide member 220 for guiding the entire periphery of the IC package 201 and a guide member 230 for guiding the four corners of the IC package 201 are required as shown in FIG. On the other hand, in the present embodiment, since the contact element 11 also functions as the guide member 220 and the guide member 230, the structure can be simplified.

According to the present embodiment, the lead member 8
3 is in contact with the lower part of the contact element 11,
The electrical connection path between the measurement substrate 31 and the lead member 83 can be shortened. For this reason, it is possible to provide a measuring apparatus particularly suitable for measuring a high-frequency IC.

According to the present embodiment, the GND plate 41 is formed of a flexible member, and the G plate is
Since the configuration is such that the force applied to the ND plate 41 is reduced, the force applied to the measurement substrate 31 can be reduced, and damage due to deformation of the measurement substrate 31 can be suppressed.

[0064]

According to the present invention, since the contact member provided to be displaceable is brought into contact with the second contact surface located on the side surface of the external connection terminal, the package body of the electronic circuit device is warped. Even so, electrical connection is possible without bending the measurement substrate. As a result, the life of the measurement substrate can be extended. Further, according to the present invention, the lower part of the contact surface of the contact member that rises from the mounting surface of the measurement substrate, that is, the external connection terminal is brought into contact with a position near the mounting surface of the measurement substrate. The line length of the electrical connection path between the connection terminal and the connection terminal can be reduced. As a result, a preferable measuring device for measuring the electrical specification of the high-frequency IC can be obtained. Further, according to the present invention, since the contact member is brought into contact with the second contact surface, no damage is caused on the first contact surface, and the inspection of the first contact surface by image processing becomes easy. Further, according to the present invention, since solder plating is not applied to the second contact surface, it is difficult for solder to adhere to the contact member. Further, even if the solder adheres to the contact member, it can be removed when the electronic circuit device is mounted on the mounting portion of the measuring device. Further, according to the present invention, since the mounting portion of the electronic circuit device is configured by the contact member, a member for guiding the electronic circuit device is not required, and the structure can be simplified.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing a configuration of a contact socket according to an embodiment of a measuring device for an electronic circuit device of the present invention.

FIG. 2 is an exploded perspective view following FIG. 1;

FIG. 3 is a diagram showing an example of a structure of an IC package mounted on the contact socket shown in FIGS. 1 and 2;

FIG. 4 is a perspective view showing a structural example of a contact element 11;

FIG. 5 is a perspective view showing another example of the structure of the contact element 11;

FIG. 6 is a perspective view illustrating a relationship between the contact element 11 and the IC package 81 when the IC package 81 is mounted on the contact socket illustrated in FIGS. 1 and 2;

7 shows an IC package 8 when the IC package 81 is mounted on the contact socket shown in FIGS. 1 and 2. FIG.
FIG. 4 is a diagram for explaining a contact state between a first lead portion 83 and a contact element 11.

FIG. 8 is a side view of the IC package 81 showing the relationship between the warped IC package 81 and the contact element 11 as viewed from the side.

FIG. 9 shows each lead member 83 and contact element 11;
FIG. 6 is a diagram showing a contact state with a contact surface 11b.

FIG. 10 is a diagram for explaining an electrical line length between a lead member 83 of an IC package 81 and a measurement substrate 31;

FIG. 11 is a diagram for explaining a line length of an electrical path connecting a lead member and a measurement substrate in a measuring device of a type in which a contact element is brought into contact with a back surface of a lead member.

FIG. 12 is a diagram for explaining a line length of an electrical path connecting a lead member and a measurement substrate in a measuring device of a type in which a contact element is brought into contact with a back surface of a lead member.

FIG. 13 is a view for explaining an action of removing solder attached to the contact element 11 when the IC package 81 is mounted on the contact socket shown in FIGS. 1 and 2.

FIG. 14 is a diagram illustrating a state following FIG. 13;

FIG. 15 is a diagram illustrating a state following FIG. 14;

FIG. 16 is a cross-sectional view for explaining the operation of the GND plate 41 and the buffer member 51, and shows a state where an IC package is not mounted.

FIG. 17 is a cross-sectional view for explaining the operation of the GND plate 41 and the buffer member 51, and shows a state in which an IC package is mounted.

FIG. 18 is a perspective view of a GND plate 41 having a structure in which a contact portion 42 is divided into a plurality of contact portions 42a.

FIG. 19 is a diagram showing an example of a conventional measuring device requiring a guide member.

FIG. 20 is a diagram showing another example of a conventional measuring device requiring a guide member.

FIG. 21 is a perspective view showing an example of a conventional IC package.

FIG. 22 is a perspective view showing an example of a leadless type IC package.

FIG. 23 is a bottom view of the IC package shown in FIG. 22;

FIG. 24 is a diagram showing an example of a measuring device including a plurality of contact elements provided corresponding to each lead member of an IC package.

FIG. 25 is a diagram showing another example of a measuring device including a plurality of contact elements provided corresponding to each lead member of an IC package.

FIG. 26 is a diagram illustrating a state in which warpage has occurred in a leadless type IC package.

FIG. 27 shows a leadless type IC package shown in FIG.
FIG. 7 is a diagram showing a state in which warpage in the opposite direction has occurred.

[Explanation of symbols]

2 ... housing member, 11 ... contact element, 1
1b: Contact surface, 21: Elastic support member, 31: Measurement board, 41: GND plate, 51: Buffer member, 61: Holder member, 81: IC package, 82: Package body, 83: Lead member, 83a: No. 1 contact surface,
83b ... second contact surface.

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01R 33/76 503 G01R 31/28 K // H01R 107: 00 H01R 23/02 EF term (reference) 2G003 AA07 AG01 AG08 AG12 AG16 AH05 2G011 AA10 AA15 AB01 AB06 AB07 AB08 AB09 AC02 AC06 AC14 AE22 AF02 AF07 2G032 AE04 AF03 AL03 5E023 AA04 AA22 BB17 BB22 CC23 CC26 DD22 EE04 FF01 HH08 HH22 HH24 5E024

Claims (17)

[Claims] 1. A package body incorporating an electronic circuit, a first contact surface provided integrally with the package body and exposed from a bottom surface of the package body and a second contact surface exposed from a side surface of the package body. A measuring device for measuring an electric characteristic of an electronic circuit device having a plurality of external connection terminals electrically connected to the electronic circuit, the measuring device for measuring an electric characteristic of the electronic circuit device. A measurement substrate including a circuit, and a plurality of contacts arranged on the measurement substrate so as to be able to contact the corresponding second contact surfaces of the external connection terminals, and for conducting the external connection terminals and the measurement circuit. A measuring device for an electronic circuit device having a member. 2. The electronic circuit device according to claim 1, wherein the plurality of contact members are provided on the measurement substrate corresponding to respective side surfaces of the package body, and constitute a mounting portion of the electronic circuit device. Electronic circuit device measuring device. 3. A contact surface of each of the contact members with the second contact surface rises from a mounting surface of the measurement substrate, and when the electronic circuit device is mounted, the external connection terminal is closed. The measuring device for an electronic circuit device according to claim 1, wherein the measuring device has a sliding surface that slides. 4. The measuring device for an electronic circuit device according to claim 1, wherein each of said contact members is provided so as to be elastically displaceable with respect to a side surface of said package body. 5. The measuring device for an electronic circuit device according to claim 4, wherein said contact member is held by an elastic member. 6. A contact surface of the contact member with the second contact surface, wherein an inclined surface or an inclined surface formed such that displacement of the contact member increases as the electronic circuit device moves in a mounting direction. The measuring device for an electronic circuit device according to claim 4, wherein the measuring device has a curved surface. 7. The measuring device for an electronic circuit device according to claim 1, wherein only the first contact surface of the first and second contact surfaces of the external connection terminal is plated with solder. 8. The electronic circuit device according to claim 1, further comprising a second external connection terminal provided integrally with said package body and having a contact surface exposed from a bottom surface of said package body and electrically connected to said electronic circuit. And a contact portion provided on the non-mounting surface side of the measurement substrate and protruding toward the mounting surface through an opening formed in the measurement substrate. ,
A second contact member electrically connected to the measurement circuit, wherein the second contact member is elastically displaceable when the contact portion contacts the second external connection terminal. The measuring device for an electronic circuit device according to claim 1, wherein the measuring device holds the measuring device. 9. The method according to claim 9, wherein the second substrate is provided on the non-mounting surface side of the measurement substrate.
9. The measuring device for an electronic circuit device according to claim 8, further comprising a buffer member for holding the contact member displaceably. 10. The measuring device for an electronic circuit device according to claim 8, wherein the second external connection terminal is a ground terminal. 11. A package body containing an electronic circuit,
A plurality of external units which are provided integrally with the package body and have a first contact surface exposed from a bottom surface of the package body and a second contact surface exposed from a side surface of the package body, electrically connected to the electronic circuit; A measurement method for measuring an electrical characteristic of an electronic circuit device having a connection terminal with a measurement substrate, wherein the conductive contact member is electrically connected to the measurement substrate and provided on the measurement substrate. A method for measuring an electronic circuit device, comprising: electrically connecting the measurement substrate to the electronic circuit by making contact with a second contact surface of each of the external connection terminals. 12. The electronic circuit by arranging the plurality of contact members so as to correspond to respective side surfaces of the package body, and bringing the plurality of contact members into contact with a second contact surface of each of the external connection terminals. The method for measuring an electronic circuit device according to claim 11, wherein the device is fixed on the measurement substrate. 13. The method for measuring an electronic circuit device according to claim 12, wherein when the electronic circuit device is fixed on the substrate for measurement, the contact members and the external connection terminals are slid. 14. When each of the electronic circuit devices is fixed on the measurement substrate, each of the contact members is elastically displaced in accordance with the contact of each of the external connection terminals with a second contact surface. Item 14. The method for measuring an electronic circuit device according to item 13. 15. The method according to claim 12, wherein only the first contact surface of the first and second contact surfaces of the external connection terminal is plated with solder. 16. The electronic circuit device according to claim 1, further comprising a second external connection terminal provided integrally with said package body and having a contact surface exposed from a bottom surface of said package body and electrically connected to said electronic circuit. And a contact portion provided on the non-mounting surface side of the measurement substrate and protruding toward the mounting surface through an opening formed in the measurement substrate. ,
The electronic circuit according to claim 12, further comprising a second contact member electrically connected to the measurement circuit, wherein the contact portion is elastically displaced by contact with the second external connection terminal. How to measure the device. 17. The method according to claim 16, wherein the second external connection terminal is a ground terminal.