JP2002176184A - Infrared data communication module and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an infrared data communication module which can improve adhesion between a substrate and a mold body. SOLUTION: The module has a light emitting element 4; a light emitting element 5 and an integrated circuit element 6 mounted on a surface 3a of a substrate 3; a protection body 7 formed to cover each of elements 4, 5, 6 respectively; and a mold body 8 formed integrally of mold resin to cover the protection body 7. A recessed part 16 for raising adhesion between it and the mold body 8 is formed in the surface 3a of the substrate 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to IrDA (Infr.
The present invention relates to an infrared data communication module used for performing infrared data communication according to the ared data association) system.

[0002]

2. Description of the Related Art Conventionally, in portable information devices, notebook personal computers, and the like, infrared data communication by IrDA has been performed between the devices or peripheral devices such as a printer.

In such infrared data communication,
An infrared data communication module (hereinafter, simply referred to as a “module”) having a light emitting element and a light receiving element for infrared light provided therein is used. In this module 1, as shown in FIGS. 1 and 2, a light emitting element 4, a light receiving element 5, and an integrated circuit element 6 are mounted on a substrate 3 on which a conductor pattern 2 is formed. Each of the above elements 4, 5,
Numeral 6 is connected to the conductor pattern 2 via a wire W, and a protective body 7 is formed around each of the elements 4, 5, and 6 to alleviate the stress caused by a mold resin (described later). I have.

[0004] A mold body 8 made of a mold resin is formed on the front surface 3 a of the substrate 3 so as to integrally cover each protective body 7. On the upper surface 8a of the molded body 8, a light emitting lens portion 11 corresponding to the light emitting element 4 is provided.
The light receiving lens portions 12 are respectively formed corresponding to. On the back surface 3b of the substrate 3, there is formed a connection terminal portion 13 which is soldered and joined to an external circuit substrate (not shown). The connection terminal portion 13 is provided on the side surface 3 of the substrate 3.
The conductor pattern 2 is connected to the conductor pattern 2 formed on the front surface 3a of the substrate 3 via the groove 14 formed in the substrate c.

[0005]

In the above configuration, the protective body 7 for protecting the light emitting element 4, the light receiving element 5 and the integrated circuit element 6 must be formed in a minimum necessary volume. That is, the protective body 7 is made of a thermosetting resin such as a gelled silicone resin or the like.
6 is formed by coating and solidifying. However, among the above elements 4, 5, and 6, the light emitting element 4 in particular has a substantially rectangular shape of about 0.35 mm square, for example.
Since the size is relatively small, if the amount of the applied silicone resin is too large, the silicone resin may spread on the substrate 3 and around the light emitting element 4.

After the protection body 7 is formed, a mold body 8 made of a mold resin such as an epoxy resin is formed on the substrate 3. In this case, if the silicone resin spreads around the light emitting element 4 on the substrate 3, the contact area between the substrate 3 and the mold body 8 is limited and narrowed. As a result, the adhesion between the two 3 and 8 is hindered, peeling occurs at the interface between the two 3 and 8, and the wire W
Of the conductor pattern 2 and peeling of the conductor pattern 2 may be caused.

[0007]

DISCLOSURE OF THE INVENTION The present invention was conceived in view of the above circumstances, and provides an infrared data communication module that can further improve the adhesion between a substrate and a mold. The subject.

In order to solve the above problems, the present invention takes the following technical measures.

The infrared data communication module provided by the first aspect of the present invention includes a light emitting element, a light receiving element, and an integrated circuit element mounted on a surface of a substrate, and protective bodies respectively formed to cover the elements. And a molded body integrally formed of a mold resin so as to cover the protective body, wherein a concave portion is formed on the surface of the substrate to enhance the adhesion between the molded body and the molded body. Is formed.

According to this configuration, when the molded body is formed so as to cover each protective body on the surface of the substrate, for example, a flowing mold resin flows into a cavity formed by a predetermined mold. At this time, since the concave portion is formed on the surface of the substrate, the mold resin flows into the concave portion. Then, the mold resin that has entered the mold and into the recesses is then solidified, thereby integrally forming a mold body. Therefore, the mold body formed in the concave portion exerts a so-called anchor effect, whereby the mechanical strength in joining the substrate and the mold body can be improved.

Further, by forming the concave portion on the surface of the substrate, the surface area of the substrate is increased, that is, if the mold resin flows into the concave portion and solidifies, the contact area between the substrate and the mold resin is substantially reduced. Will be spread out. Therefore, since the adhesion between the substrate and the mold body can be further improved, peeling at the interface between the two can be prevented, and for example, wire breakage and peeling of die bonding due to the peeling can be suppressed or prevented. Can be. Therefore, a highly reliable infrared data communication module can be provided.

According to a preferred embodiment of the present invention,
The concave portions are formed at a plurality of locations on the surface of the substrate except for a region where a protective body covering each element is formed. In this way, if the location where the concave portion is formed is limited to the region excluding the region where the protective body covering each element is formed, it is possible to prevent, for example, the silicone resin as the protective body from entering the concave portion, and the mold resin as the mold body Surely flows into the recess,
Can be solidified.

According to another preferred embodiment, the concave portion may be substantially cylindrical. According to this configuration,
For example, as compared with the case where the concave portion is formed in a polygonal column shape, the possibility that the mold resin is filled without gaps can be increased, which can contribute to the improvement of the mechanical strength of the molded body.

According to a method for manufacturing an infrared data communication module according to a second aspect of the present invention, a light emitting element, a light receiving element, and an integrated circuit element are mounted on a surface of a substrate on which a conductor pattern is formed, and these are integrated. A method for manufacturing an infrared data communication module formed by resin molding, comprising: before mounting each of the above-described elements on a substrate, forming a substantially columnar concave portion on a surface of the substrate with a predetermined piercing tool; After the elements are mounted, when forming a molded body of the mold resin integrally so as to cover them, a step of injecting and solidifying the mold resin into the concave portion is provided.

According to this manufacturing method, the infrared transmitting / receiving module provided in the first aspect can be easily obtained in an actual manufacturing process, and as a result, the same operation and effect as those of the infrared data communication module can be obtained. The effect can be achieved.

The infrared data communication module provided by the third aspect of the present invention is a light emitting element, a light receiving element, and an integrated circuit element mounted on a surface of a substrate, and integrally formed with a molding resin so as to cover each element. An infrared data communication module including a molded body, wherein a shield body is formed around the integrated circuit element to prevent the influence of optical noise so as to cover the integrated circuit element. . Specifically, the shield body is formed by applying a light-blocking resin, and the light-blocking resin contains an oxide for blocking infrared light and a dye for blocking visible light. I have.

[0017] According to this configuration, by the shield body, about 300 to 1000 n including visible light and infrared light.
It is possible to block light having a wavelength of m. Therefore, the integrated circuit element covered by the shield is prevented from malfunctioning due to, for example, optical noise, and the light emitting element and the light receiving element can be controlled well.
Thereby, a highly reliable infrared data communication module can be provided.

[0018] Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be specifically described below with reference to the accompanying drawings. In addition,
In the following description, FIG. 1 and FIG. 2 described in the description of the related art will be referred to again, and the components denoted by the same reference numerals in FIG.

According to FIGS. 1 and 2, this infrared data communication module (hereinafter simply referred to as "module")
Reference numeral 1 denotes a substantially rectangular substrate 3, a light-emitting element 4, a light-receiving element 5, and an integrated circuit element 6 mounted on the substrate 3, and are formed around the elements 4, 5, and 6 so as to cover them. And a molded body 8 that integrally seals them with a mold resin.

FIG. 3 is a plan perspective view of the substrate 3.
FIG. 4 is a rear view of the substrate 3. The substrate 3 is made of, for example, a glass epoxy resin, and a predetermined conductor pattern 2 is formed on a surface 3 a of the substrate 3, and gold plating is applied to an appropriate position of the conductor pattern 2 as necessary. Conductor pattern 2
Is a conductor pattern on which each of the elements 4, 5, and 6 is directly or indirectly mounted via a green resist described later, and a conductor on which wire bonding is performed for connection with each of the elements 4, 5, and 6. It is composed of patterns and the like.

On the back surface 3b of the substrate 3, there are a conductor pattern 2 (dummy pattern) covering almost the entire surface and a conductor pattern 2 to be joined to an external circuit board (not shown) for mounting the module 1. Are formed. A substantially arc-shaped groove portion 14 is formed on the side surface 3c of the substrate 3, and a conductor layer (not shown) made of plated copper is formed on the inner peripheral surface of the groove portion 14. Via this conductor layer, the conductor pattern 2 on the front surface 3a of the substrate 3 and the connection terminal portion 13 on the back surface 3b are electrically connected.

Further, on the front surface 3a and the back surface 3b of the substrate 3,
In an appropriate upper region, an insulating layer (not shown) for protecting the green resist is formed. This insulating layer covers portions other than those that need to be exposed to the outside. For example, the connection terminal portion 13 is bonded to an external circuit board (not shown) via a solder fillet. , Not covered by an insulating layer.

The light emitting element 4 is formed of a light emitting diode or the like, and is mounted on a predetermined area 2A of the gold-plated conductor pattern 2 at one end of the surface 3a of the substrate 3. The upper surface of the light emitting element 4 is wire-bonded with a gold wire W and connected to a predetermined conductor pattern 2.

The light receiving element 5 is formed of a PIN photodiode or the like, and is mounted on a predetermined area 2 B of the conductor pattern 2 on the other end of the front surface 3 a of the substrate 3. Light receiving element 5
Is connected to a predetermined conductor pattern 2 by wire bonding at its upper surface with a gold wire W.

The integrated circuit element 6 controls the transmission / reception operation of the light emitting element 4 and the light receiving element 5.
Conductor pattern 2 located at the center of surface 3a of substrate 3
Is mounted in a predetermined area 2C. The integrated circuit element 6
Although not shown in detail, the light emitting element 4 and the light receiving element 5 are connected by the wire W and the conductor pattern 2 by wire bonding with the gold wire W.

The protector 7 is made of a translucent resin such as a silicone resin, for example. A gel-like silicone resin is applied around each of the elements 4, 5 and 6, and is heated and solidified at a predetermined temperature. Formed by The protector 7 is
It is formed so as to cover each of the elements 4, 5, 6 and the wire W connected thereto. The protective body 7 formed in this manner has rubber properties and has an action of alleviating the stress caused by the mold resin as the mold body 8.

The mold body 8 is made of a thermosetting resin such as an epoxy resin containing a pigment.
They are integrally sealed so as to cover the protection bodies 5 and 6. On the upper surface 8a of the molded body 8 corresponding to the light emitting element 4 and the light receiving element 5, a light emitting lens portion 11 and a light receiving lens portion 12 are formed, respectively. The molded body 8 does not transmit visible light, but transmits infrared light.

When the module 1 having such a configuration is mounted on an external circuit board C as shown in FIG.
So that the light receiving and emitting directions of the light emitting element 4 and the light receiving element 5 are parallel to the mounting surface of the external circuit board C. On the back surface 3b of the substrate 3
The solder fillet F is formed between the third and groove portions 14 and the wiring pattern P formed on the mounting surface of the external circuit board C, so that they are soldered and joined.

The data communication by infrared rays is performed by being arranged opposite to another module (not shown). That is, the light emitting element 4 converts an electric signal sent from the integrated circuit element 6 into an optical signal and emits infrared light as the optical signal to the outside. On the other hand, the light receiving element 5 converts infrared light as an optical signal received from the outside into an electric signal, and supplies the electric signal to the integrated circuit element 6.

The feature of the present embodiment is that, as shown in FIGS. 3 and 6, a concave portion 16 for improving the adhesion between the molded body 8 made of molding resin and the substrate 3 is formed on the surface 3a of the substrate 3. Is formed. Specifically, the recesses 16 are formed at a plurality of locations (four locations in FIG. 3) of the surface 3a of the substrate 3 except for the area where the protection body 7 is formed in each of the elements 4, 5, and 6. I have. The recess 16 is formed by excavation into a substantially columnar shape, for example, having a diameter A of about 0.2φ and a depth B of about 0.2 to
0.5 mm.

As described above, when the mold body 8 is formed so as to cover the respective protective bodies 7 on the surface 3a of the substrate 3, for example, the mold resin in a flowing state is placed in a predetermined mold mounted on the substrate 3. Flows in. At this time, since the concave portion 16 is formed on the surface 3 a of the substrate 3, the mold resin flows into the concave portion 16. Then, the mold resin that has entered the mold and into the concave portion 16 is then solidified, whereby the molded body 8 is integrally formed. Therefore, the mold body 8 formed in the concave portion 16 exerts a so-called anchor effect.
Mechanical strength at the time of joining with the mold body 8 can be improved.

Further, by forming the concave portion 16 on the surface 3a of the substrate 3, the surface area of the substrate 3 is increased, and the mold resin flows into the concave portion 16 and is solidified, so that the substrate 3 and the molded body 8 are formed. The contact area with the contact is substantially widened. Therefore, the adhesion between the substrate 3 and the mold body 8 can be further improved. Therefore, even if the silicone resin as the protection body 7 for each element 4, 5, 6 spreads somewhat on the substrate 3 as in the conventional case,
It is possible to suppress the adhesion between the substrate 3 and the molded body 8 from being impaired by the molded resin that has flowed into the concave portion 16 and has been solidified. Therefore, separation at the interface between the two 3 and 8 can be prevented, and disconnection of the wire W and separation of die bonding due to the separation can be suppressed or prevented. Therefore, the recess 1
6, a highly reliable module 1 can be provided.

As will be described later, the recess 16 is formed by excavation before the protective body 7 is formed around each of the elements 4, 5, and 6. On the surface 3a of the device 4, the protective body 7 in each of the elements 4, 5, 6 is set in advance in a region where it will not spread. That is, it is necessary to fill not the silicone resin but the mold resin as the mold body 8 in the concave portion 16. In consideration of such a point, the recess 16 is formed on the surface 3a of the substrate 3 at the location shown in FIG. 3, but the location at which the recess 16 is formed is the location shown in FIG. It is not limited.

The number of locations where the recesses 16 are formed is not limited to the number described above, and the greater the number of locations where the recesses 16 are formed, the more preferable the adhesion between the substrate 3 and the mold body 8 is. Further, the shape of the concave portion 16 is not limited to a columnar shape. However, if the concave portion 16 is formed in a substantially cylindrical shape, for example, the molding resin can be formed in the concave portion 16 without gaps as compared with a case where the concave portion 16 is formed in a polygonal column shape. Can be increased. Therefore, it can contribute to the improvement of the mechanical strength of the mold body, which is more preferable. If the recess 16 is formed in a substantially columnar shape, the recess 16 can be easily formed by, for example, a drill.

Further, the recess 16 may be formed by excavating from above the conductor pattern 2. That is, since the thickness of the conductor pattern 2 is several tens μm, which is considerably smaller than the depth of the recess 16, even if the recess 16 is formed from above the conductor pattern 2, the recess 16 penetrates the conductor pattern 2. To reach the substrate 3 easily. Therefore, the mold body 8 and the substrate 3 can be brought into sufficient contact with each other on the inner surface of the concave portion 16.

Next, a method of manufacturing the module 1 will be described. In this manufacturing method, as shown in FIG. 7, a collective substrate 18 made of a sheet-like glass epoxy resin extending in a substantially rectangular shape is used. The collective substrate 18 has a size capable of arranging a large number of modules 1, and a region 19 having a fixed size is defined for each of the modules 1. Engagement holes 20 are formed on both sides of the collective board 18 for fixing the collective board 18 as necessary in the process of manufacturing the module 1. In addition, the collective substrate 18 is provided on the collective substrate 18 every predetermined number of regions 19.
A slit 21 extending in the vertical direction for preventing warpage is formed.

Next, for each region 19, the collective substrate 18
An appropriate number of through-holes 22 that eventually become the groove portions 14 for conducting the front and back surfaces are formed. Thereafter, as shown in FIG. 8, for each region 19 of the collective substrate 18, the collective substrate 1
A predetermined conductor pattern 2 is formed on the front surface and the back surface of 8 by a known photolithography method. That is, a resist material is applied to the collective substrate 18 having a copper foil on the surface, exposed and developed using a mask on which a desired pattern is drawn, and unnecessary portions of the copper foil are removed by etching. The conductor pattern 2 is formed. In addition,
The conductor pattern 2 is formed before forming the through hole 22.
It may be formed.

Next, an insulating layer is formed on the front and back surfaces of the collective substrate 18 to cover portions other than those which need to be exposed to the outside. Also in this case, the insulating layer formed in advance on the entire surface of the collective substrate 18 is formed using photolithography, for example, using a mask (not shown) having a window hole corresponding to a portion to be exposed in the conductor pattern 2. An opening is formed in the insulating layer by performing exposure processing and then performing development.

Thereafter, as shown in FIG.
A concave portion 16 is formed at a predetermined position in each region 19 on the surface of the substrate. For this, a drill (not shown) having a cutting edge having a diameter smaller than about 0.2 mm is used, and the drill is advanced and retracted in a direction substantially orthogonal to the surface of the collective substrate 18 to form the concave portion 16.

Next, as shown in FIG.
The light emitting element 4 and the like are mounted in each of the regions 19 on the device 8, and wire bonding is performed on the elements 4, 5, and 6. Thereafter, a protective body 7 is formed on each of the elements 4, 5, and 6 so as to cover the elements. For this, a nozzle (not shown) capable of discharging a gel-like silicone resin is used, and the silicone resin is supplied to each of the elements 4, 5, and 6, and each of the elements 4, 5, and 6 is supplied.
And the wire W connected thereto is coated so as to be covered with the silicone resin. In this case, care should be taken so that the silicone resin does not flow into the recess 16 formed in the previous step. After that, the applied silicone resin is solidified by heating at a predetermined temperature to form the protective body 7.

Next, as shown in FIG. 11, a mold body 8 is formed by transfer molding for each region 19 using epoxy resin. This includes substrate 3
A predetermined mold (not shown) is mounted on the upper surface, and an epoxy resin in a flowing state is flowed into a cavity formed by the mold and solidified, thereby integrally molding each protective body 7 on the surface 3a of the substrate 3. I do. A light emitting lens portion 11 and a light receiving lens portion 12 having a substantially hemispherical shape are formed on the upper surface 8a of the molded body 8, respectively.

Then, the collective substrate 18 is cut vertically and horizontally to obtain a single module 1. Specifically, the collective substrate 18 is cut along the vertical direction along the dashed line L1 shown in FIG. 10 to obtain a vertically long intermediate product. For cutting the collective substrate 18,
A predetermined blade (not shown) is used. Next, the intermediate product is cut along a dashed line L2 shown in FIG. 10 in order to remove unnecessary portions located above and below each mold body 8 in the intermediate product. Thus, by cutting the collective board 18, a large number of modules 1 are obtained.

The module 1 manufactured by the above-described manufacturing method is mounted on an external circuit board C or the like.
It is used for a mobile phone or a notebook personal computer. In this case, in order to prevent the influence of external noise, a metallic shield case 24 as shown in FIG. Be attached.

The extraneous noise includes noise due to light from fluorescent lamps and sunlight, in addition to noise due to electromagnetic waves (excluding light), and the shield case 24 can block the effects of these noises. is there. By using this shield case 24, in the integrated circuit element 6 described above, it is possible to prevent malfunction due to noise due to electromagnetic waves or light.

Here, in the integrated circuit element 6 described above, the element itself may take measures against the noise due to the electromagnetic wave, but the noise due to light may take measures against the noise by the integrated circuit element 6 itself. In many cases, the shield case 24 is indispensable. However, since the shield case 24 is generally expensive, the component cost increases. Further, in the manufacturing process of the module 1, a step of mounting the module 1 on the module 1 is required, which causes a problem that the manufacturing cost is increased.

Therefore, in the present embodiment, the following measures are taken to prevent malfunction of the integrated circuit element 6 due to optical noise. That is, as shown in FIG. 13, a shield body for preventing the influence of optical noise is provided around the integrated circuit element 6 mounted on the substrate 3 instead of the above-mentioned protective body 7 so as to cover it. 25 are formed.

The shield 25 is formed by applying and solidifying a translucent resin. The light-transmitting resin contains, for example, an epoxy resin as a main component and an oxide (for example, titanium oxide) for blocking infrared light and a dye for blocking visible light.

[0049] By this shield body 25, about 300 to 1000 including some ultraviolet light, visible light and infrared light.
It is possible to block light having a wavelength of nm. Therefore, the integrated circuit element 6 covered by the shield 25
Can be prevented from malfunctioning due to optical noise, and can control the light emitting element 4 and the light receiving element 5 satisfactorily. Therefore, a highly reliable module 1 can be provided. Further, the use of the shield body 25 eliminates the need for the shield case 24 described above. Therefore, the cost of parts is reduced, and the module 1
Can be reduced in weight. Furthermore, since the step of mounting the shield case 24 on the module 1 can be omitted, the manufacturing time can be reduced and the manufacturing cost can be reduced.

The shield body 25 has a coefficient of thermal expansion between that of the substrate 3 and that of the mold body 8 and has thermosetting properties. 6 can be formed by coating and solidifying so as to cover the periphery of 6. Therefore, the shield 25 has a function of protecting the integrated circuit element 6 similarly to the above-described protector 7, and can sufficiently exhibit the function as a substitute for the protector 7.

In order to completely block light from entering the integrated circuit element 6, the light-transmitting resin is provided around the integrated circuit element 6, that is, the integrated circuit element 6 as described above.
Is desirably formed so as to cover the upper surface and all four side surfaces.

Of course, the scope of the present invention is not limited to the above-described embodiment, and various changes can be made within the scope of the present invention.

[Brief description of the drawings]

FIG. 1 is a perspective view of an infrared data communication module according to the present invention.

FIG. 2 is an internal configuration diagram of the infrared data communication module shown in FIG.

FIG. 3 is a plan perspective view of a substrate.

FIG. 4 is a rear view of the substrate.

FIG. 5 is a diagram showing a mounting state of the infrared data communication module on an external circuit board.

FIG. 6 is a cross-sectional view showing a recess formed in the substrate.

FIG. 7 is a diagram illustrating a method of manufacturing the infrared data communication module.

FIG. 8 is a diagram illustrating a method of manufacturing the infrared data communication module.

FIG. 9 is a diagram illustrating a method of manufacturing the infrared data communication module.

FIG. 10 is a diagram illustrating a method of manufacturing the infrared data communication module.

FIG. 11 is a diagram illustrating a method of manufacturing the infrared data communication module.

FIG. 12 is a perspective view of an infrared data communication module with a shield case.

FIG. 13 is a sectional view showing another embodiment of the infrared data communication module.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Infrared data communication module 2 Conductor pattern 3 Substrate 4 Light emitting element 5 Light receiving element 6 Integrated circuit element 7 Protective body 8 Mold body 16 Depression 25 Shield

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[Procedure amendment]

[Submission date] April 24, 2001 (2001.4.2
4)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Full text

[Correction method] Change

[Correction contents]

[Document Name] Statement

Patent application title: Infrared data communication module and method of manufacturing the same

[Claims]

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to IrDA (Infr.
The present invention relates to an infrared data communication module used for performing infrared data communication according to the ared data association) system.

[0002]

2. Description of the Related Art Conventionally, in portable information devices, notebook personal computers, and the like, infrared data communication by IrDA has been performed between the devices or peripheral devices such as a printer.

In such infrared data communication,
An infrared data communication module (hereinafter, simply referred to as a “module”) having a light emitting element and a light receiving element for infrared light provided therein is used. In this module 1, as shown in FIGS. 1 and 2, a light emitting element 4, a light receiving element 5, and an integrated circuit element 6 are mounted on a substrate 3 on which a conductor pattern 2 is formed. Each of the above elements 4, 5,
Numeral 6 is connected to the conductor pattern 2 via a wire W, and a protective body 7 is formed around each of the elements 4, 5, and 6 to alleviate the stress caused by a mold resin (described later). I have.

[0004] A mold body 8 made of a mold resin is formed on the front surface 3 a of the substrate 3 so as to integrally cover each protective body 7. On the upper surface 8a of the molded body 8, a light emitting lens portion 11 corresponding to the light emitting element 4 is provided.
The light receiving lens portions 12 are respectively formed corresponding to. On the back surface 3b of the substrate 3, there is formed a connection terminal portion 13 which is soldered and joined to an external circuit substrate (not shown). The connection terminal portion 13 is provided on the side surface 3 of the substrate 3.
The conductor pattern 2 is connected to the conductor pattern 2 formed on the front surface 3a of the substrate 3 via the groove 14 formed in the substrate c.

[0005]

In the above configuration, the protective body 7 for protecting the light emitting element 4, the light receiving element 5 and the integrated circuit element 6 must be formed in a minimum necessary volume. That is, the protective body 7 is made of a thermosetting resin such as a gelled silicone resin or the like.
6 is formed by coating and solidifying. However, among the above elements 4, 5, and 6, the light emitting element 4 in particular has a substantially rectangular shape of about 0.35 mm square, for example.
Since the size is relatively small, if the amount of the applied silicone resin is too large, the silicone resin may spread on the substrate 3 and around the light emitting element 4.

After the protection body 7 is formed, a mold body 8 made of a mold resin such as an epoxy resin is formed on the substrate 3. In this case, if the silicone resin spreads around the light emitting element 4 on the substrate 3, the contact area between the substrate 3 and the mold body 8 is limited and narrowed. As a result, the adhesion between the two 3 and 8 is hindered, peeling occurs at the interface between the two 3 and 8, and the wire W
Of the conductor pattern 2 and peeling of the conductor pattern 2 may be caused.

[0007]

DISCLOSURE OF THE INVENTION The present invention was conceived in view of the above circumstances, and provides an infrared data communication module capable of further improving the adhesion between a substrate and a molded body. The subject.

In order to solve the above problems, the present invention takes the following technical measures.

The infrared data communication module provided by the first aspect of the present invention includes a light emitting element, a light receiving element, and an integrated circuit element mounted on a surface of a substrate, and protective bodies respectively formed to cover the elements. And a molded body integrally formed of a mold resin so as to cover the protection body, wherein a concave portion is provided on the surface of the substrate for improving the adhesion between the substrate and the molded body. Is formed.

According to this configuration, when the molded body is formed so as to cover each protective body on the surface of the substrate, for example, a flowing mold resin flows into a cavity formed by a predetermined mold. At this time, since the concave portion is formed on the surface of the substrate, the mold resin flows into the concave portion. Then, the mold resin that has entered the mold and into the recesses is then solidified, thereby integrally forming a mold body. Therefore, the mold body formed in the concave portion exerts a so-called anchor effect, whereby the mechanical strength in joining the substrate and the mold body can be improved.

[0011] Further, by forming the concave portion on the surface of the substrate, the surface area of the substrate is increased, that is, if the mold resin flows into the concave portion and solidifies, the contact area between the substrate and the mold resin is substantially reduced. Will be spread out. Therefore, since the adhesion between the substrate and the mold body can be further improved, separation at the interface between the two can be prevented, and for example, wire breakage or peeling of die bonding due to the separation can be suppressed or prevented. Can be. Therefore, a highly reliable infrared data communication module can be provided.

According to a preferred embodiment of the present invention,
The concave portions are formed at a plurality of locations on the surface of the substrate except for a region where a protective body covering each element is formed. As described above, when the formation portion of the concave portion is limited to the region excluding the region where the protective body covering each element is formed, for example, the silicone resin as the protective body can be prevented from entering the concave portion, and the mold resin as the mold body can be prevented. Surely flows into the recess,
Can be solidified.

According to another preferred embodiment, the concave portion may be substantially cylindrical. According to this configuration,
For example, as compared with the case where the concave portion is formed in a polygonal column shape, the possibility that the mold resin is filled without gaps can be increased, which can contribute to the improvement of the mechanical strength of the molded body.

According to a method for manufacturing an infrared data communication module according to a second aspect of the present invention, a light emitting element, a light receiving element, and an integrated circuit element are mounted on a surface of a substrate on which a conductor pattern is formed, and these are integrated. A method for manufacturing an infrared data communication module formed by resin molding, comprising: before mounting each of the above-described elements on a substrate, forming a substantially columnar concave portion on a surface of the substrate with a predetermined piercing tool; After the elements are mounted, when forming a molded body of the mold resin integrally so as to cover them, a step of injecting and solidifying the mold resin into the concave portion is provided.

According to this manufacturing method, the infrared transmitting / receiving module provided in the first aspect can be easily obtained in an actual manufacturing process, and as a result, the same operation and effect as those of the infrared data communication module can be obtained. The effect can be achieved.

Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be specifically described below with reference to the accompanying drawings. In addition,
In the following description, FIG. 1 and FIG. 2 described in the description of the related art will be referred to again, and the components denoted by the same reference numerals in FIG.

According to FIGS. 1 and 2, this infrared data communication module (hereinafter simply referred to as "module")
Reference numeral 1 denotes a substantially rectangular substrate 3, a light-emitting element 4, a light-receiving element 5, and an integrated circuit element 6 mounted on the substrate 3, and are formed around the elements 4, 5, and 6 so as to cover them. And a molded body 8 that integrally seals them with a mold resin.

FIG. 3 is a plan perspective view of the substrate 3.
FIG. 4 is a rear view of the substrate 3. The substrate 3 is made of, for example, a glass epoxy resin, and a predetermined conductor pattern 2 is formed on a surface 3 a of the substrate 3. Conductor pattern 2
Is a conductor pattern on which each element 4, 5, 6 is mounted directly or indirectly via a green resist, which will be described later; It is composed of patterns and the like.

On the back surface 3b of the substrate 3, there are a conductor pattern 2 (dummy pattern) covering almost the entire surface and a conductor pattern 2 to be joined to an external circuit board (not shown) for mounting the module 1. Are formed. A substantially arc-shaped groove portion 14 is formed on the side surface 3c of the substrate 3, and a conductor layer (not shown) made of plated copper is formed on the inner peripheral surface of the groove portion 14. Via this conductor layer, the conductor pattern 2 on the front surface 3a of the substrate 3 and the connection terminal portion 13 on the back surface 3b are electrically connected.

Further, on the front surface 3a and the back surface 3b of the substrate 3,
In an appropriate upper region, an insulating layer (not shown) for protecting the green resist is formed. This insulating layer covers portions other than those that need to be exposed to the outside. For example, the connection terminal portion 13 is bonded to an external circuit board (not shown) via a solder fillet. , Not covered by an insulating layer.

The light emitting element 4 is formed of a light emitting diode or the like, and is mounted on a predetermined area 2A of the gold-plated conductor pattern 2 on one end of the surface 3a of the substrate 3. The upper surface of the light emitting element 4 is wire-bonded with a gold wire W and connected to a predetermined conductor pattern 2.

The light receiving element 5 is composed of a PIN photodiode or the like, and is mounted on a predetermined area 2 B of the conductor pattern 2 on the other end of the surface 3 a of the substrate 3. Light receiving element 5
Is connected to a predetermined conductor pattern 2 by wire bonding at its upper surface with a gold wire W.

The integrated circuit element 6 controls the transmitting and receiving operations of the light emitting element 4 and the light receiving element 5,
Conductor pattern 2 located at the center of surface 3a of substrate 3
Is mounted in a predetermined area 2C. The integrated circuit element 6
Although not shown in detail, the light emitting element 4 and the light receiving element 5 are connected by the wire W and the conductor pattern 2 by wire bonding with the gold wire W.

The protector 7 is made of a light-transmitting resin such as a silicone resin, for example. A gel-like silicone resin is applied around each of the elements 4, 5, and 6, and is heated and solidified at a predetermined temperature. Formed by The protector 7 is
It is formed so as to cover each of the elements 4, 5, 6 and the wire W connected thereto. The protective body 7 formed in this manner has rubber properties and has an action of alleviating the stress caused by the mold resin as the mold body 8.

The mold body 8 is made of, for example, a thermosetting resin of an epoxy resin containing a pigment.
They are integrally sealed so as to cover the protection bodies 5 and 6. On the upper surface 8a of the molded body 8 corresponding to the light emitting element 4 and the light receiving element 5, a light emitting lens portion 11 and a light receiving lens portion 12 are formed, respectively. The molded body 8 does not transmit visible light, but transmits infrared light.

When the module 1 having such a configuration is mounted on an external circuit board C as shown in FIG.
So that the light receiving and emitting directions of the light emitting element 4 and the light receiving element 5 are parallel to the mounting surface of the external circuit board C. On the back surface 3b of the substrate 3
The solder fillet F is formed between the third and groove portions 14 and the wiring pattern P formed on the mounting surface of the external circuit board C, so that they are soldered and joined.

The data communication by infrared rays is performed by being arranged opposite to another module (not shown). That is, the light emitting element 4 converts an electric signal sent from the integrated circuit element 6 into an optical signal and emits infrared light as the optical signal to the outside. On the other hand, the light receiving element 5 converts infrared light as an optical signal received from the outside into an electric signal, and supplies the electric signal to the integrated circuit element 6.

The feature of the present embodiment is that, as shown in FIGS. 3 and 6, a concave portion 16 for improving the adhesion between the molded body 8 made of molding resin and the substrate 3 on the surface 3a of the substrate 3. Is formed. Specifically, the recesses 16 are formed at a plurality of locations (four locations in FIG. 3) of the surface 3a of the substrate 3 except for the area where the protection body 7 is formed in each of the elements 4, 5, and 6. I have. The recess 16 is formed by excavation into a substantially columnar shape, for example, having a diameter A of about 0.2φ and a depth B of about 0.2 to
0.5 mm.

As described above, when the mold body 8 is formed so as to cover the respective protection bodies 7 on the surface 3a of the substrate 3, for example, the mold resin flowing in a predetermined mold mounted on the substrate 3 Flows in. At this time, since the concave portion 16 is formed on the surface 3 a of the substrate 3, the mold resin flows into the concave portion 16. Then, the mold resin that has entered the mold and into the concave portion 16 is then solidified, whereby the molded body 8 is integrally formed. Therefore, the mold body 8 formed in the concave portion 16 exerts a so-called anchor effect.
Mechanical strength at the time of joining with the mold body 8 can be improved.

Further, by forming the concave portion 16 on the surface 3a of the substrate 3, the surface area of the substrate 3 is increased, and the mold resin flows into the concave portion 16 and is solidified, so that the substrate 3 and the molded body 8 are formed. The contact area with the contact is substantially widened. Therefore, the adhesion between the substrate 3 and the mold body 8 can be further improved. Therefore, even if the silicone resin as the protection body 7 for each element 4, 5, 6 spreads somewhat on the substrate 3 as in the conventional case,
It is possible to suppress the adhesion between the substrate 3 and the molded body 8 from being impaired by the molded resin that has flowed into the concave portion 16 and has been solidified. Therefore, separation at the interface between the two 3 and 8 can be prevented, and disconnection of the wire W and separation of die bonding due to the separation can be suppressed or prevented. Therefore, the recess 1
6, a highly reliable module 1 can be provided.

The recess 16 is formed by excavation before the protective body 7 is formed around each of the elements 4, 5 and 6, as will be described later. On the surface 3a of the device 4, the protective body 7 in each of the elements 4, 5, 6 is set in advance in a region where it will not spread. That is, it is necessary to fill not the silicone resin but the mold resin as the mold body 8 in the concave portion 16. In consideration of such a point, the recess 16 is formed on the surface 3a of the substrate 3 at the location shown in FIG. 3, but the location at which the recess 16 is formed is the location shown in FIG. It is not limited.

The number of locations where the recesses 16 are formed is not limited to the number described above, and the greater the number of locations where the recesses 16 are formed, the better the adhesion between the substrate 3 and the mold body 8 is. Further, the shape of the concave portion 16 is not limited to a columnar shape. However, if the concave portion 16 is formed in a substantially cylindrical shape, for example, compared with the case where the concave portion 16 is formed in a polygonal column shape, the molding resin can be formed in the concave portion 16 without gaps. Can be increased. Therefore, it can contribute to the improvement of the mechanical strength of the mold body, which is more preferable. If the recess 16 is formed in a substantially columnar shape, the recess 16 can be easily formed by, for example, a drill.

Further, the recess 16 may be formed by excavating from above the conductor pattern 2. That is, since the thickness of the conductor pattern 2 is several tens μm, which is considerably smaller than the depth of the recess 16, even if the recess 16 is formed from above the conductor pattern 2, the recess 16 penetrates the conductor pattern 2. To reach the substrate 3 easily. Therefore, the mold body 8 and the substrate 3 can be brought into sufficient contact with each other on the inner surface of the concave portion 16.

Next, a method of manufacturing the module 1 will be described. In this manufacturing method, as shown in FIG. 7, a collective substrate 18 made of a sheet-like glass epoxy resin extending in a substantially rectangular shape is used. The collective substrate 18 has a size capable of arranging a large number of modules 1, and a region 19 having a fixed size is defined for each of the modules 1. Engagement holes 20 are formed on both sides of the collective board 18 for fixing the collective board 18 as necessary in the process of manufacturing the module 1. In addition, the collective substrate 18 is provided on each of the predetermined number
A slit 21 extending in the vertical direction for preventing warpage is formed.

Next, for each area 19, the collective substrate 18
An appropriate number of through-holes 22 that eventually become the groove portions 14 for conducting the front and back surfaces are formed. Thereafter, as shown in FIG. 8, for each region 19 of the collective substrate 18, the collective substrate 1
A predetermined conductor pattern 2 is formed on the front surface and the back surface of 8 by a known photolithography method. That is, a resist material is applied to the collective substrate 18 having a copper foil on the surface, exposed and developed using a mask on which a desired pattern is drawn, and unnecessary portions of the copper foil are removed by etching. The conductor pattern 2 is formed. In addition,
The conductor pattern 2 is formed before forming the through hole 22.
It may be formed.

Next, an insulating layer is formed on the front and back surfaces of the collective substrate 18 to cover portions other than those which need to be exposed to the outside. Also in this case, the insulating layer formed in advance on the entire surface of the collective substrate 18 is formed using photolithography, for example, using a mask (not shown) having a window hole corresponding to a portion to be exposed in the conductor pattern 2. An opening is formed in the insulating layer by performing exposure processing and then performing development.

Thereafter, as shown in FIG.
A concave portion 16 is formed at a predetermined position in each region 19 on the surface of the substrate. For this, a drill (not shown) having a cutting edge having a diameter smaller than about 0.2 mm is used, and the drill is advanced and retracted in a direction substantially orthogonal to the surface of the collective substrate 18 to form the recess 16.

Next, as shown in FIG.
The light emitting element 4 and the like are mounted in each of the regions 19 on the device 8, and wire bonding is performed on the elements 4, 5, and 6. Thereafter, a protective body 7 is formed on each of the elements 4, 5, and 6 so as to cover the elements. For this, a nozzle (not shown) capable of discharging a gel-like silicone resin is used, and the silicone resin is supplied to each of the elements 4, 5, and 6, and each of the elements 4, 5, and 6 is supplied.
And the wire W connected thereto is coated so as to be covered with the silicone resin. In this case, care should be taken so that the silicone resin does not flow into the recess 16 formed in the previous step. Thereafter, the applied silicone resin is solidified by heating at a predetermined temperature to form the protective body 7.

Next, as shown in FIG. 11, a mold body 8 is formed by transfer molding for each region 19 using epoxy resin. This includes substrate 3
A predetermined mold (not shown) is mounted on the upper surface, and an epoxy resin in a flowing state is flowed into a cavity formed by the mold and solidified, thereby integrally molding each protective body 7 on the surface 3a of the substrate 3. I do. A light emitting lens portion 11 and a light receiving lens portion 12 having a substantially hemispherical shape are formed on the upper surface 8a of the molded body 8, respectively.

Then, the collective substrate 18 is cut vertically and horizontally to obtain a single module 1. Specifically, the collective substrate 18 is cut along the vertical direction along the dashed line L1 shown in FIG. 10 to obtain a vertically long intermediate product. For cutting the collective substrate 18,
A predetermined blade (not shown) is used. Next, the intermediate product is cut along a dashed line L2 shown in FIG. 10 in order to remove unnecessary portions located above and below each mold body 8 in the intermediate product. Thus, by cutting the collective board 18, a large number of modules 1 are obtained.

Of course, the scope of the present invention is not limited to the above-described embodiment, and various changes can be made within the scope of the present invention.

[Brief description of the drawings]

FIG. 1 is a perspective view of an infrared data communication module according to the present invention.

FIG. 2 is an internal configuration diagram of the infrared data communication module shown in FIG.

FIG. 3 is a plan perspective view of a substrate.

FIG. 4 is a rear view of the substrate.

FIG. 5 is a diagram showing a mounting state of the infrared data communication module on an external circuit board.

FIG. 6 is a cross-sectional view showing a recess formed in the substrate.

FIG. 7 is a diagram illustrating a method of manufacturing the infrared data communication module.

FIG. 8 is a diagram illustrating a method of manufacturing the infrared data communication module.

FIG. 9 is a diagram illustrating a method of manufacturing the infrared data communication module.

FIG. 10 is a diagram illustrating a method of manufacturing the infrared data communication module.

FIG. 11 is a diagram illustrating a method of manufacturing the infrared data communication module.

[Description of Signs] 1 Infrared data communication module 2 Conductor pattern 3 Substrate 4 Light emitting element 5 Light receiving element 6 Integrated circuit element 7 Protective body 8 Mold body 16 Concave part

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] FIG.

[Correction method] Deleted

[Procedure amendment 3]

[Document name to be amended] Statement

[Correction target item name] FIG.

[Correction method] Deleted

Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (reference) H01L 31/12 H01L 23/30 B 33/00 F term (reference) 4M109 AA02 BA04 CA05 CA21 DA07 DB15 DB16 EA02 EA10 EC11 ED04 EE02 EE07 EE12 EE13 GA01 5F041 DA07 DA12 DA20 DA44 DA45 DA58 DA83 FF14 5F088 AA03 BB01 JA03 JA06 JA10 JA20 LA01 5F089 AA01 AB03 AC02 AC10 CA06 CA20 EA04

Claims (6)

[Claims] 1. A light-emitting element, a light-receiving element, and an integrated circuit element mounted on a surface of a substrate, a protective body formed to cover each of the elements, and a mold resin to cover the protective body. An infrared data communication module comprising: a molded body formed on the infrared data communication module, wherein a concave portion is formed on a surface of the substrate to enhance adhesion between the substrate and the molded body, Communication module. 2. The method according to claim 1, wherein the recess is formed on a surface of the substrate.
2. The infrared data communication module according to claim 1, wherein the infrared data communication module is formed at a plurality of locations in a region excluding a region where the protection body covering each element is formed. 3. The infrared data communication module according to claim 1, wherein the concave portion has a substantially cylindrical shape. 4. A light emitting element, a light receiving element and an integrated circuit element are mounted on a surface of a substrate on which a conductor pattern is formed,
What is claimed is: 1. A method for manufacturing an infrared data communication module comprising integrally molding them with a resin, wherein before mounting each of the elements on the substrate, a substantially columnar recess is formed on a surface of the substrate with a predetermined punch. And, after mounting each of the elements on the substrate, when forming a molded body of the mold resin integrally so as to cover them, a step of flowing the mold resin into the recess and solidifying the mold. A method for manufacturing an infrared data communication module. 5. An infrared data communication module comprising: a light emitting element, a light receiving element, and an integrated circuit element mounted on a surface of a substrate; and a molded body integrally formed of a mold resin so as to cover each element. An infrared data communication module, wherein a shield body for preventing the influence of optical noise is formed around the integrated circuit element so as to cover the integrated circuit element. 6. The shield body is formed by coating a light-shielding resin, and the light-shielding resin contains an oxide for blocking infrared light and a dye for blocking visible light. Have been
An infrared data communication module according to claim 5.