JP2002168348A - O-ring structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an O-ring structure providing an easy and quick detection of a use limit and an embodiment of a proper O-ring replacement. SOLUTION: An O-ring is provided on a member circumferential rim such as a pipe or a lid needing junction or adherence, and seals members with each other allowing a deformation to some extent. As shown in figure 1, the O-ring 10 is provided with a distinguishable internal signal member 102 exposed in accordance with the deterioration of an O-ring surface 101. As a condition for distinguishing, the internal signal member comprises a material different from that composing at least the O-ring surface, and a color visually comparable with the O-ring surface is preferably fitted thereto.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for manufacturing a semiconductor device, and more particularly to an O-ring structure applied to an intensely worn O-ring provided at a contact portion exposed to a gas such as plasma.

[0002]

2. Description of the Related Art Microfabrication of wafers in the manufacture of semiconductor devices utilizes isotropic etching and anisotropic etching techniques at key points. For example, plasma etching is one of the common techniques as dry etching that supports the technique.

[0003] Inside a semiconductor manufacturing apparatus, for example, a plasma etching apparatus, there are many close contact portions between members such as a valve system, a pipe, and a lid which are exposed to a plasma gas, and all of them require high sealing performance. O-rings for sealing are provided at these contact portions. That is, the O-ring is provided on the periphery of a member such as a pipe or a lid that requires joining or close contact, and seals the members with some deformation.

The O-ring gradually loses its original shape by being repeatedly pressed down, released, and deformed. That is, the O-ring is a consumable whose surface deteriorates with use. Therefore, the O-ring needs to be replaced as appropriate, for example, by periodically observing the deterioration state.

[0005]

The O-ring is used for sealing, and is made of a material which is hardly deteriorated and which is resistant to stress such as crushing.
Although various ideas have been devised, they are consumables in any case, and the timing of replacement is important.

The timing of replacement of the O-ring has been determined based on deterioration of the sealing property, increase in the number of particles, observation of the O-ring itself with a microscope, inspection results, and the like. For this reason, much time is wasted in determining the state of deterioration of the O-ring. Further, there is a concern about a case where the O-ring is replaced after a quality abnormality occurs in the wafer product. Alternatively, the frequency of replacement of the O-ring becomes excessive in order to prevent quality abnormality, which is not economically preferable. Further, according to such a current situation, there is a problem that the production efficiency of the semiconductor manufacturing apparatus is reduced.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an O-ring structure capable of easily detecting a usage limit in a short time and performing appropriate O-ring replacement. .

[0008]

An O-ring structure according to the present invention includes an O-ring used for a contact portion in a semiconductor manufacturing apparatus, which has an identifiable internal signal member exposed according to deterioration of the O-ring surface. It is characterized by the following.

According to the O-ring structure of the present invention,
If the ring surface breaks or cracks, etc., and the damage reaches a predetermined depth, the internal signal member that can be identified is exposed, and it can be confirmed that it is time to replace the O-ring. it can.

The internal signal member is different from at least the material constituting the O-ring surface so that it can be identified. Also, the internal signal member is characterized in that it has a color that can be visually compared with the O-ring surface.

An O-ring structure according to a more preferred embodiment of the present invention includes, in an O-ring used for a contact portion in a semiconductor manufacturing apparatus, a colored member for detecting a deterioration state of the O-ring. It is characterized in that it is fixed in an area that defines a use limit.

According to the O-ring structure of the present invention,
A colored member for detecting the deterioration state of the O-ring is fixed in an area defining a use limit. If a colored member in an area that defines the service limit due to collapse of the O-ring surface or cracking is confirmed, it can be considered that the O-ring needs to be replaced.

[0013]

FIG. 1 is a sectional view showing a main part of an O-ring used in a semiconductor manufacturing apparatus according to an embodiment of the present invention. For example, inside a plasma etching apparatus (not shown), there are many close contact portions between members such as a valve system, a pipe, and a lid which are exposed to a plasma gas, and all of them require high sealing properties. These sealing portions have O
A ring is provided. That is, the O-ring is provided on the periphery of a member such as a pipe or a lid that requires joining or close contact, and seals the members with some deformation.

As shown in FIG. 1, the O-ring 10 of the present invention is characterized by its cross section. O-ring surface 101
Internal signal member 1 that is exposed according to deterioration of
02. The internal signal member is different from at least the material constituting the O-ring surface as a condition that can be identified, and preferably has a color that can be visually compared with the O-ring surface.

FIGS. 2 (a) and 2 (b) respectively show O in FIG.
It is sectional drawing which shows the deterioration stage of a ring as an example. The O-ring 10 gradually loses its original shape by being pressed and released between the members 21 and 22 constituting the device, and by repeated deformation.

FIG. 2A shows that the surface of the O-ring is broken or cracked during use, but the O-ring is in the initial stage and does not hinder the sealing property and can withstand use. In FIG. 2B, the O-ring surface 101 is greatly collapsed by further use, and the O-ring surface is deeply cracked, so that the damage reaches a predetermined depth. In such a deteriorated state, the identifiable internal signal member 102 is exposed, and it is possible to easily confirm that the time to replace the O-ring 10 has come.

FIG. 3 is an external view showing an example of a method for detecting the deterioration state of the O-ring. At the time of maintenance when the apparatus is stopped, the O-ring 10 is visually inspected. At that time, a deep portion is observed by applying a load such as twisting. In this case, a colored member (equivalent to the internal signal member 102) is fixed to an area defining a use limit, for example, for detecting the deterioration state of the O-ring. That is, if the damage is in a deteriorated state that reaches a predetermined depth (a region that defines a use limit), the internal signal member 102 that is a colored member can be visually confirmed.

According to the above configuration, an appropriate replacement time of the O-ring 10 can be specified clearly and in a short time. Conventionally, the timing of replacing the O-ring has been determined based on the deterioration of the sealing property, the tendency of increasing the number of particles, and observation of the O-ring itself using a microscope or the like, inspection results, and the like. For this reason, much time is wasted in determining the state of deterioration of the O-ring. According to the configuration of the present invention described above, it is possible to avoid O-ring replacement after a quality abnormality has occurred in a wafer product or excessive O-ring replacement, and to perform appropriate O-ring replacement. As a result, not only is it economically improved, but it also contributes to improving the production efficiency of the semiconductor manufacturing apparatus.

In the above embodiment, the O-ring has a substantially concentric cross-sectional structure, but is not limited to this. The configuration of the present invention can also be applied to dovetails and chemuratz, which are known to have a cross-sectional shape that is not easily deteriorated by repeated pressing and release or deformation.
That is, an O-ring having a cross-sectional shape such as a dovetail or a chemuratz may include an identifiable internal signal member that is exposed according to the deterioration of the O-ring surface.

FIG. 4 is a cross-sectional view of a main part of an O-ring having a cross-sectional shape called a dovetail, which employs the structure according to the present invention. A colored member 402 is fixed at least in a deep region that defines a use limit from the O-ring surface 401 for detecting the deterioration state of the O-ring 40.
The O-ring 40 gradually loses its original shape by being repeatedly pressed or released or deformed between the members 41 and 42 constituting the device.

Although not shown, the O-ring surface 401 is greatly collapsed by long-term use, and the O-ring surface 401 is deeply cracked. In such a deteriorated state, when the O-ring is inspected, the exposure of the colored member 402 can be confirmed, and it can be easily known that the time to replace the O-ring 40 has come.

FIG. 5 is a cross-sectional view of a main part of an O-ring having a cross-sectional shape called a chemuratz, which employs the configuration according to the present invention. A colored member 502 is fixed at least in a deep region that defines a use limit from the O-ring surface 501 for detecting the deterioration state of the O-ring 50.
The O-ring 50 gradually loses its original shape by being repeatedly pressed and released or deformed between the members 51 and 52.

Although not shown, the O-ring surface 501 is greatly collapsed and cracked deeply due to long-time use, so that damage reaches a predetermined depth. In such a deteriorated state, when the O-ring is inspected, the exposure of the colored member 502 can be confirmed, and it can be easily known that the time to replace the O-ring 50 has come.

[0024]

As described above, according to the O-ring structure according to the present invention, the O-ring surface is deteriorated such that the O-ring surface is damaged or cracked, and the O-ring is damaged to a predetermined depth that defines the service limit. In this state, the identifiable internal signal member (colored member) is exposed, and it is possible to confirm that the O-ring replacement time has come. Thereby, it is possible to specify an appropriate replacement time of the O-ring 10 clearly and in a short time.
As a result, it is possible to provide an O-ring structure capable of easily detecting the usage limit in a short time and performing appropriate O-ring replacement.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a main part of an O-ring used in a semiconductor manufacturing apparatus according to an embodiment of the present invention.

FIGS. 2A and 2B are cross-sectional views each showing an example of a deterioration stage of the O-ring in FIG. 1;

FIG. 3 is an external view showing an example of a method for detecting a deterioration state of an O-ring.

FIG. 4 is a cross-sectional view of a main part of an O-ring having a cross-sectional shape called a dovetail, which employs a configuration according to the present invention.

FIG. 5 is a cross-sectional view of a main part of an O-ring having a cross-sectional shape called a chemuratz, which employs a configuration according to the present invention.

[Explanation of symbols]

10, 40, 50 O-ring 101, 401, 501 O-ring surface 102 Internal signal member 402, 502 Colored member 21, 22, 41, 42, 51, 52 Member constituting device

Claims (4)

[Claims] 1. An O used for a contact portion in a semiconductor manufacturing apparatus.
An O-ring structure comprising a ring and an identifiable internal signal member that is exposed according to deterioration of the O-ring surface. 2. The O-ring structure according to claim 1, wherein the internal signal member is different from at least a material forming an O-ring surface. 3. The O-ring structure according to claim 1, wherein the internal signal member has a color that can be visually compared with the O-ring surface. 4. An O used for a contact portion in a semiconductor manufacturing apparatus.
The ring includes a colored member for detecting a deterioration state of the O-ring,
An O-ring structure characterized in that the colored member is fixed at least in a region defining a use limit.