JP2002168144A - Function integrated board and manufacturing method of same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a function integrated board which is downsized and capable of reducing specific designing man-hours and hardware evaluation man-hours, and structures an on-vehicle ECU at low cost. SOLUTION: In the manufacturing method of the function integrated board for structuring the on-vehicle ECU including a base circuit for providing a base function and an optional circuit for providing an optional function, boards 40, 50 are designed so that circuits 41, 51 for providing an EFI function as the base function are arranged in an area E1, circuits 42, 52 for providing a transmission function as the optional function are arranged in an area E2, and other circuits 43, 53 are arranged in an area E3. Thereafter, exchange and deletion of the circuits are carried out.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an in-vehicle ECU (Elec).
tronic Control Unit), etc., for a method of manufacturing a function-integrated substrate and a function-integrated substrate.
It can be shared among multiple models, etc., and can meet the demands of compact, low cost, high quality, short-term development,
In particular, the present invention relates to a method of manufacturing a function-integrated substrate and a function-integrated substrate constituting an in-vehicle ECU suitable for a compact car or the like that is required to meet various needs.

[0002]

2. Description of the Related Art Gasoline injection measures the amount of air taken into an engine every moment in accordance with the control state of the engine and calculates and injects the amount of gasoline to achieve a required air ratio. In this case, EFI (Electronic Fuel Injection) controlled by an electronic circuit has become mainstream.

[0003] Recently, not only ECUs that perform an EFI function but also CVTs (Continuously Variabl
ECU and ECT (Elec)
ECU that performs tronic controlled transmission) function
And E which performs ABS (Antilock BrakeSystem) function
CUs and ECUs that perform an airbag function are also being equipped.

However, since ECUs that perform these functions have been developed as single-function ECUs, as shown in FIG. 10, for example, to manufacture a vehicle having an EFI function and an ECT function, the ECU performs the EFI function. ECU1 and ECT
It is necessary to mount two ECUs, the ECU 2 that performs the function.

[0005] If two ECUs are mounted on a vehicle, the number of harnesses and the number of cases constituting the ECU inevitably increase. In addition, as is apparent from FIG. However, there is a problem that the data is redundantly used.

[0006] In recent years, a function-integrated ECU in which a plurality of functions are mounted on a board constituting an in-vehicle ECU has been considered. FIG. 11 shows an example of a function-integrated board constituting a conventional function-integrated ECU.

The substrate 11 includes a three-cylinder EFI function, a CVT function, and an electronic throttle control function.
2 includes a three-cylinder EFI function and a CVT function, a substrate 13 includes a three-cylinder EFI function and an ECT function, and a substrate 14 includes a three-cylinder EFI function (for MT).
Contains.

The substrate 15 has a four-cylinder EFI function, a CV
The board 16 includes a 4-cylinder EFI function and a CVT function, the board 17 includes a 4-cylinder EFI function and an ECT function, and the board 18 includes a T function and an electronic throttle control function. 4-cylinder EFI function (MT
For).

As shown in FIG. 11, by realizing a plurality of functions on a single board, there is an advantage that an increase in the number of harnesses and the number of cases constituting the ECU can be suppressed.

[0010]

In order to manufacture the substrate 11, first, a circuit diagram of a circuit that performs an EFI function of three cylinders,
By designing the circuit diagram of the circuit performing the VT function and the circuit diagram performing the electronic throttle control function, and then combining these circuit diagrams, the EFI function, the CVT function, and the electronic throttle control function of the three cylinders are realized. It is necessary to design a schematic of the integrated circuit.

Further, since it is impossible to fabricate the substrate 11 as it is in this circuit diagram, in order to realize a circuit in which these functions are integrated on an actual printed circuit board, it is necessary to consider the arrangement of components and the pattern layout. It is necessary to perform design and the like (hereinafter, these operations are also referred to as specific designs), and it is necessary to perform a hardware evaluation of the substrate. This is because the actual printed circuit board pattern has resistance and inductance components, and there is stray capacitance between components and patterns. Therefore, the resistance to external electric noise (electromagnetic) and the amount of radiation noise are affected by changes in pattern design. This is because it changes every time.

In the case of developing the substrates 12 to 18, similarly to the case of manufacturing the substrate 11, the circuit diagram design of a circuit performing each function, the circuit diagram design of a function integrated circuit, and Design and hardware evaluation is required.

As shown in FIG. 11, the three-cylinder EFI function, the four-cylinder EFI function, the CVT function, the EC
The same function may be provided even if the substrates are different, such as the T function. For example, the three-cylinder EFI function is provided on the substrates 11 to 14, but the circuit diagram of the circuit that performs the three-cylinder EFI function is shown in FIG.
14 may be the same depending on the type of vehicle (however, the circuit diagram used for the board 14 is slightly different).

Therefore, it is not necessary to design a circuit diagram of a circuit that performs the EFI function of the three cylinders for each substrate, and it is sufficient to design once. Note that this is not limited to the circuit diagram of the circuit that performs the EFI function of the three cylinders, but the circuit diagram of the circuit that performs the EFI function of the four cylinders, the circuit diagram of the circuit that performs the CVT function, and the ECT function. The same applies to a circuit diagram of a circuit, a circuit diagram of a circuit performing an electronic throttle control function, and the like.

In addition, since a circuit diagram of a circuit integrating a plurality of functions is only theoretically linked to a circuit diagram designed for each function, for example, a circuit diagram of a circuit performing an EFI function of three cylinders Circuit diagram of a circuit performing the EFI function of four cylinders, circuit diagram of a circuit performing the CVT function, ECT
If a circuit diagram of a circuit that performs a function and a circuit diagram of a circuit that performs an electronic throttle control function have already been designed, a circuit diagram of a circuit in which these functions are integrated (for example, substrates 11 to
13, 15 to 17) can be designed relatively easily.

As described above, if a circuit diagram has already been designed, it can be used to design a circuit diagram for a new board relatively easily.

However, with regard to the specific design and the evaluation of the hardware of the substrate, even if a part has already been partially designed, it is almost the same as a newly manufactured one. This is because, as described above, it is impossible to manufacture a substrate as it is in a circuit diagram.

Therefore, the eight types of substrates shown in FIG.
Only 5 functions (3-cylinder EFI function, 4-cylinder EF
I function, CVT function, ECT function, and electronic throttle control function), which are related to each other. Has to be performed almost in the same manner as the production of the same, and there is a problem that the cost is too high.

In particular, a specific design and a hardware evaluation of a board are very costly, and in some cases, a specific design of one type of board and a hardware evaluation require about tens of millions of yen. .

The present invention has been made in view of the above problems, and is inexpensive in-vehicle ECU which is compact, can reduce specific design man-hours and hardware evaluation man-hours.
It is an object of the present invention to provide a method of manufacturing a function-integrated substrate and a function-integrated substrate.

[0021]

To achieve the above object, a method (1) for manufacturing a function integrated substrate according to the present invention comprises a base circuit performing a base function and an option circuit performing an optional function. In-vehicle EC with
In the method of manufacturing a function-integrated board constituting U, a board design in which the base circuit is arranged at a predetermined place and the optional circuit is arranged at a place determined for each circuit or for each type of the circuit It is characterized by including a process. ECT According to the method (1) for manufacturing a function-integrated substrate described above, a base circuit that performs a base function (for example, an EFI function) is arranged at a predetermined location, and an optional function (for example, C
The board is designed so that an optional circuit that performs a VT function, an ECT function, and an electronic throttle control function) is arranged at a location determined for each circuit or for each type of the circuit.

For example, as shown in FIG.
At least two of the FI function, the four-cylinder EFI function, the CVT function, the ECT function, and the electronic throttle control function
The base functions (for example, the three-cylinder EFI function and the four-cylinder EFI function) for the boards 21 to 26 with integrated functions
Place the base circuit in area E ₁ of fulfilling the optional features (e.g., CVT function is transmission,
ECT function) Place the option circuit area E ₂ fulfill, another option function (e.g., to place the option circuit area E ₃ fulfilling an electronic throttle control function), the substrate is designed.

As described above, in order to arrange circuits fulfilling each function at a location determined for each circuit or for each type of circuit, the arrangement of components and pattern design must be considered for each circuit. Can be.

Therefore, even when a circuit in which a plurality of functions are integrated on an actual printed circuit board is realized, not only the circuit diagram design but also the specific design (part arrangement, pattern design, etc.) Regarding hardware evaluation,
It is not a circuit in which functions are integrated, but can be considered independently for each circuit that performs each function.
For the circuit diagram design, concrete design, and hardware evaluation of the circuit that performs the EFI function of the three cylinders provided in the substrates 23 to 23, it is not necessary to perform the circuit many times for each of the substrates 21 to 23, and it is sufficient to perform once. Becomes

If the substrate 21 has already been manufactured, if a new substrate 22 or 23 is to be manufactured, the substrate 2
At the time of manufacturing the device 1, it is sufficient to use a design that has already been made, and since the hardware evaluation has already been completed by manufacturing the substrate 21, there is no need to perform a new evaluation.

It is to be noted that this is not limited to the circuit that performs the EFI function of the three cylinders, but the EFI function of the four cylinders.
Circuit that fulfills FI function, circuit that fulfills CVT function, EC
The same applies to a circuit performing the T function and a circuit performing the electronic throttle control function. Therefore, specific design man-hours and hardware evaluation man-hours can be reduced,
It is possible to provide a function-integrated board that forms an inexpensive in-vehicle ECU.

The method (2) for manufacturing a function-integrated board according to the present invention is the same as the method (1) for manufacturing a function-integrated board described above, except that a connecting portion for connecting these circuits through a connection line is provided. The method is characterized by including a board designing step of arranging the circuit at a place determined for each arrangement place of a circuit where the connection part is formed.

Manufacturing method of the above-mentioned function integrated type substrate (1)
When designing a board such that circuits that perform the respective functions are arranged at locations determined for the respective circuits or types of the circuits, the circuits that perform the respective functions are connected to each other. According to the above-described method (2) for manufacturing a function-integrated type substrate, the connection part is determined for each arrangement location of a circuit in which the connection part is formed. The board is designed so that it is placed in the place where it is located.

[0029] For example, as shown in FIG. 2, the area E ₁
CVT The base circuit B fulfill such EFI function is formed, which is arranged a connection LD ₁ to near the left end portion, placing the connection portion LD ₂ near the right end portion, it is formed in the area E ₂ in
Options circuit OP ₁ to fulfill such functions, place the connecting portion LD ₃ near the right end portion, optional circuit OP fulfill an electronic throttle control function is formed in the area E _3
2 , the connection part LD ₄ is arranged near the left end,
The board is designed, and the connection parts LD ₁ and LD ₃
A connection line LN ₁ for connecting to
₂ and a connection line LN ₂ for connecting the connection portion LD ₄
Design.

[0030] Thus, the connecting portion for the location of the LD ₁ to Ld _4, connecting portions LD ₁ for to Ld ₄ is determined for each location of the circuit to be formed, the circuit fulfilling the functions of these connecting portions Even if LD _{1 to} LD ₄ are included, the circuit diagram design and specific design of the circuit that performs each function,
The hardware evaluation can be considered independently for each circuit. Therefore, it is possible to reduce specific design man-hours and hardware evaluation man-hours.

The method (3) for manufacturing a function-integrated substrate according to the present invention is the method (1) or (2) for manufacturing a function-integrated substrate described above, wherein the base circuit to be arranged is one or two.
When there are one or two or more optional circuits, and there are one or two or more optional circuits which are candidates for arrangement at each of the optional places, two or more circuits are combined and one or two or more boards are combined. It is characterized by including the step of designing.

In the method (4) for manufacturing a function-integrated substrate according to the present invention, in the method (3) for manufacturing a function-integrated substrate, a circuit is designed and exchanged using at least two types of substrates. Thus, the method includes a step of designing a new substrate.

A method (5) for manufacturing a function-integrated substrate according to the present invention is the same as the method (3) or (4) for manufacturing a function-integrated substrate, wherein at least one type of substrate is used to design a circuit. Is characterized by including a step of designing a new board by deleting the above.

In the method (6) for manufacturing a function-integrated substrate according to the present invention, in the method (5) for manufacturing a function-integrated substrate, a connection line that becomes unnecessary when a circuit is deleted is provided. It is characterized by erasing.

Manufacturing method of the above-mentioned integrated function type substrate (3)
According to any one of (6) to (6), one or two or more types of boards are designed by combining two or more circuits. For example,
As shown in FIG. 3, a substrate 31 including a circuit 31a performing an EFI function, a circuit 31b performing an ECT function, and a circuit 31c performing an electronic throttle control function of the three cylinders.
By designing two types of boards, a circuit 32a including a four-cylinder circuit 32a performing an EFI function, a circuit 32b performing a CVT function, and a substrate 32 including a spare circuit 32c for using the EFI function for MT, This means that a total of six circuits that perform different functions have been designed.

That is, by combining two or more circuits,
By designing one or more types of boards, two or more circuits that perform different functions can be designed. Therefore, by using the designed two or more circuits, a new substrate can be easily manufactured without performing a new complicated circuit diagram design or a specific design.

Manufacturing method of the above-mentioned function integrated type substrate (4)
According to the above, a new board can be easily designed by using at least two types of boards and exchanging circuits in a design manner.

For example, the circuit 31b that performs the ECT function of the substrate 31 is replaced by the circuit 32b that performs the CVT function of the substrate 32.
By simply changing to, the substrate 21 (see FIG. 1) is designed. In addition, the circuit board 24 (see FIG. 1) is designed simply by replacing the circuit 31a of the board 31 that performs the EFI function of the three cylinders with the circuit 32a of the board 32 that performs the EFI function of the four cylinders.

Manufacturing method of the above-mentioned integrated function type substrate (5)
Alternatively, according to (6), a new substrate can be easily designed by using at least one type of substrate and deleting the circuit in a design manner. Further, according to the method of manufacturing a function integrated substrate (6), when a circuit is deleted, unnecessary connection lines are eliminated to obtain a function integrated substrate excellent in noise resistance. Can be created.

For example, the circuit board 23 (see FIG. 1) is designed only by removing the circuit 31c for performing the electronic throttle control function of the circuit board 31. At this time, the circuit 3
Since no option circuit is arranged in the area where 1c is arranged, there is no need for a connection line for connecting the circuit 31a performing the EFI function of the three cylinders and the circuit arranged in the area. FIG. 4 (a)
The connection line is erased as shown in FIG. Further, in addition to erasing the connection line, the area itself may not be formed as shown in FIG.

Further, a function integrated type substrate (1) according to the present invention.
Is characterized by being produced by using any one of the above-mentioned method (1) to (6) for producing a function integrated substrate.

According to the function integrated substrate (1) described above,
It can meet the demands of compact, low cost, high quality, short temper development, and realize a function-integrated board that constitutes an in-vehicle ECU suitable for compact cars etc. that are particularly required to respond to various needs. it can.

A function integrated substrate (2) according to the present invention.
Is provided with a base circuit performing a base function, and an optional circuit performing an optional function, in a function integrated type substrate configuring an in-vehicle ECU, the base circuit is disposed at a predetermined location, and the optional circuit is It is characterized in that it is arranged at a place determined for each circuit or for each type of circuit.

According to the function integrated substrate (2) described above,
A base circuit that performs a base function (for example, an EFI function) is disposed at a predetermined place, and an optional function (for example,
An optional circuit that performs a CVT function, an ECT function, and an electronic throttle control function) is arranged at a location determined for each circuit or for each type of the circuit.

For example, as shown in FIG.
At least two of the FI function, the four-cylinder EFI function, the CVT function, the ECT function, and the electronic throttle control function
Substrate 21 through 26 with integrated functions, base functions (e.g., 3 cylinders EFI features, 4 EFI function cylinders) base circuit fulfilling is arranged in the area E _1, optional features (e.g., CVT function is transmission, EC
Optional circuit fulfilling the T function) is arranged in the area E _2, another optional feature (e.g., optional circuit is arranged in the area E ₃ fulfilling an electronic throttle control function) is configured.

As described above, the circuits fulfilling the respective functions are arranged at the locations determined for each circuit or for each type of the circuit. Pattern design and the like can be considered for each circuit. Therefore, since the number of specific design steps and hardware evaluation steps can be reduced, it is possible to realize a function-integrated board in which manufacturing costs are reduced.

The function integrated substrate (3) according to the present invention.
Comprises a connection line, and a connection portion for connecting these circuits via the connection line in the function integrated substrate (2), wherein the connection portion corresponds to a circuit in which the connection portion is formed. It is characterized by being arranged at a place determined for each arrangement place.

As in the function-integrated substrate (2) described above,
If circuits that perform each function are arranged in a place determined for each circuit or for each type of the circuit, a connection unit and a connection line for connecting the circuits that perform each function are required. According to the method (3) for manufacturing a function-integrated substrate, the connection line and the connection portion for connecting these circuits via the connection line are provided. The connection part is arranged at a place determined for each arrangement place of the circuit where the connection part is formed.

[0049] For example, as shown in FIG. 2, the area E ₁
The base circuit B fulfill such EFI function formed, C that connect portions LD ₁ is disposed near the left end portion, the connecting portion LD ₂ is disposed near the right end portion, is formed in the area E ₂
Options circuit OP ₁ to fulfill such VT function, connecting part LD ₃ is disposed near the right end portion, the optional circuit OP ₂ fulfilling an electronic throttle control function is formed in the area E _3, connected to the left end vicinity portion Section LD ₄ is arranged,
Further connection lines LN ₂ for connecting the connection line LN ₁ for connecting the connecting part LD ₁ and the connecting part LD _3, and a connecting portion LD ₂ and the connecting part LD ₄ is arranged.

[0050] Thus, for the location of the connecting portion LD ₁ to Ld _4, connecting portions LD ₁ to Ld ₄ is determined for each location of the circuit which is formed, these connection circuits that perform the functions Even if it includes the parts LD _{1 to} LD ₄ , the circuit diagram design and the specific design of the circuit performing each function,
The hardware evaluation can be considered independently for each circuit. Therefore, it is possible to reduce specific design man-hours and hardware evaluation man-hours.

A function integrated substrate (4) according to the present invention.
Is characterized in that, in any of the function-integrated substrates (1) to (3), the optional circuit is configured to exhibit the optional function by being connected to the base circuit.

A function integrated substrate (5) according to the present invention.
Is characterized in that, in the function-integrated substrate (4), common elements such as a power supply circuit required for both the base circuit and the option circuit are formed in the base circuit.

A function integrated substrate (6) according to the present invention.
Is characterized in that in the function-integrated board (4) or (5), software that fulfills the function of the option circuit and that requires high-speed processing is formed in the option circuit. And

Since the option circuit is formed on the same substrate as the base circuit and is electrically connected to the base circuit, the function performed by the option circuit (for example,
The ECT function and the CVT function do not need to be exercised independently of the optional circuit, but may be exercised by connecting to the base circuit.

According to any one of the above-described function-integrated substrates (4) to (6), the option circuit is configured such that the function of the option circuit is exhibited by connection with the base circuit. Therefore, it is possible to realize an inexpensive function-integrated substrate with less waste.

According to the function integrated substrate (5) described above,
Common elements (power supply circuit, EEPROM, etc.) necessary for both the base circuit and the option circuit are formed in the base circuit. That is, to share a power supply circuit and the like between the base circuit and the option circuit,
Cost can be reduced.

The software for performing the function of the option circuit may be arranged not in the option circuit but in the base circuit. However, software requiring high-speed processing is arranged in the option circuit. Is more desirable. In the function-integrated board (6), among the software for fulfilling the function of the optional circuit, those requiring high-speed processing are formed in the optional circuit.

For example, in the ECT control, the transmission of the engine is efficiently performed in consideration of the output of the engine, the running characteristics of the vehicle, the fuel efficiency, and the like, so that both the improvement of the fuel efficiency and the improvement of the drivability are achieved. And the like to detect the running state of the vehicle, calculate the shift point, the lock-up clutch operating point, and the clutch oil pressure (that is, calculate the target current value applied to the linear solenoid), and control the hydraulic circuit based on the calculation result. Although the voltage duty ratio applied to the linear solenoid is controlled, high-speed processing is required to detect the actual current value and perform feedback control of the voltage duty ratio in comparison with the target current value. It is more advantageous to perform the processing in the optional circuit instead of the circuit.

A function integrated substrate (7) according to the present invention.
In any one of the function-integrated substrates (1) to (6),
Communication means for communicating information necessary for controlling the other party with each other;
Backup means for backing up information obtained by communication, monitoring means for monitoring information transmission in communication, and when the monitoring means detects an error in information transmission, the backed up information is used for control; Backup information use control means for performing

According to the function-integrated substrate (7) described above,
Necessary information can be shared by communication between the base circuit and the option circuit, and even if an error occurs in information transmission using communication, backup is performed without using error information. Since information is used, communication reliability can be ensured.

A function integrated substrate (8) according to the present invention.
A microcomputer which communicates with a base microcomputer mounted on the base circuit in any one of the above-mentioned function-integrated substrates (1) to (7) is provided with a chip select input terminal for inputting a chip select signal; The chip select terminal is connected to the base microcomputer so that the communication can be managed by the base microcomputer.

According to the function-integrated substrate (8) described above,
By managing communication with the base microcomputer,
It is possible to avoid collision of information transmitted using communication.

The function integrated substrate (9) according to the present invention.
Is characterized in that in any one of the function integrated type substrates (1) to (8), DMA is employed for communication between the base circuit and the option circuit.

According to the function-integrated substrate (9) described above,
DMA for communication between the base circuit and the option circuit
Therefore, high-speed information transfer with few signal lines can be realized.

[0065]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of a method of manufacturing a function integrated substrate according to the present invention and an embodiment of a function integrated substrate will be described with reference to the drawings. FIG. 5 is a schematic view showing a part of the method of manufacturing the function integrated substrate according to the embodiment (1).

First, a circuit that performs a three-cylinder EFI function as a base function, a circuit that performs a four-cylinder EFI function, and a circuit that performs an ECT function as an optional function.
A circuit diagram is designed with a circuit performing a VT function, a circuit performing an electronic throttle control function, and a circuit for MT.

Next, based on these designed circuit diagrams, specific designs of the boards 40 and 50 with integrated functions are made, and then, based on the specific designs, these boards 40 and 50 are used.
The fabrication of the substrates 40, 50 is completed by making 50 and performing a hard evaluation of the substrate. FIG. 6 shows the substrate 4
It is the figure which expanded 0 and 50.

[0068] For the substrate 40, the lands 41a to near the left end portion in the area E _1, and had a land 41b near the right end portion, a circuit 41 which performs the EFI function of three cylinders arranged, near the right end portion in the area E ₂ Had a land 42a,
Place the circuit 42 performs the ECT function, had a land 43a on the left end portion close to the area E _3, so as to place the circuit 43 which performs an electronic throttle control function, for further connecting the lands 41a and the land 42a A specific design is performed by arranging the connection pattern Pa and the connection pattern Pb for connecting the land 41b and the land 43a.

[0069] On the other hand, the substrate 50, the lands 5 in the area E ₁ lands 51a to near the left end portion, and near the right end portion
Had 1b, arranged circuit 51 performs the EFI functions of a four-cylinder, having a land 52a near the right end portion in the area E _2, place the circuit 52 which performs a CVT function, area E ₃
Circuit 53 having a land 53a near the left end
Lands 51a and lands 52a
Connection pattern Pc for connecting to
b and connection pattern Pd for connecting land 53a
And a specific design.

The connection patterns Pa ₁ , Pb ₁ , Pc
₁ and Pd ₁ indicate connection patterns for ground, connection patterns Pa ₂ , Pb ₂ , Pc ₂ and Pd ₂ indicate connection patterns for battery, and connection patterns Pa ₃ , Pb ₃ and Pc
₃ and Pd ₃ indicate connection patterns for the constant voltage source, and the connection patterns Pa _{4 to} Pa ₆ , Pb _{4 to} Pb ₆ , and Pc _{4 to} P
c ₆ , Pd _{4 to} Pd ₆ indicate communication connection patterns. Further, the connectors C ₁ to C ₁ to
C ₃ is intended for connecting the harness from the substrate 40 and 50 outside.

According to the method of manufacturing a function-integrated board according to the embodiment (1), even if a circuit in which a plurality of functions are integrated on an actual printed circuit board is realized,
Not only the circuit diagram design but also the specific design (arrangement of components, pattern design, etc.) and hardware evaluation can be considered independently for each circuit performing each function, not for a circuit with integrated functions. Therefore, the substrate 4
A new board can be easily designed and manufactured by exchanging circuits or deleting circuits by using 0 and 50.

Next, using these substrates 40 and 50,
The case of designing eight boards shown in FIG. 7 will be described. [1] A board 61 (corresponding to the board 11 shown in FIG. 11) including the EFI function, the CVT function, and the electronic throttle control function of the three cylinders. The circuit 42 performing the ECT function of the board 40 is replaced by the CVT function of the board 50. Is replaced by a circuit 52 that performs [2] A board 62 (corresponding to the board 12 shown in FIG. 11) including the EFI function and the CVT function of the three cylinders. The circuit 42 of the board 50 performing the ECT function is replaced by the circuit 52 of the board 50 performing the CVT function. In addition, the substrate 40
Circuit 43 that performs the electronic throttle control function of
And to delete the connection pattern Pb ₁ ~Pb _6. [3] Substrate 63 including EFI function and ECT function of three cylinders (corresponding to substrate 13 shown in FIG. 11) Circuit 43 that performs electronic throttle control function from substrate 40
Is deleted, and the connection patterns Pb _{1 to} Pb ₆ are deleted. [4] Substrate 64 including EFI function (for MT) of three cylinders (corresponding to substrate 14 shown in FIG. 11) Circuit 43 that performs electronic throttle control function of substrate 40
To the MT circuit 53 of the substrate 50 and
The functioning circuit 42 is eliminated and the connection pattern P
a _{1 to} Pa ₆ are deleted. [5] The MT circuit 53 of the board 65 (corresponding to the board 15 shown in FIG. 11) including the four-cylinder EFI function, the CVT function, and the electronic throttle control function
The circuit 43 is replaced with a circuit 43 which performs the electronic throttle control function of 0. [6] 4-cylinder EFI features, and (corresponds to the substrate 16 shown in FIG. 11) substrate 66 that CVT function is included to remove the MT circuit 53 of the substrate 50, and deletes the connection pattern Pd ₁ -PD ₆ I do. [7] A board 67 (corresponding to the board 17 shown in FIG. 11) in which the EFI function and the ECT function of the four cylinders are included. Replace with the substrate 50
From the MT circuit 53, and the connection pattern Pd
To remove a _{1 ~Pd 6.} [8] A board 68 (corresponding to the board 18 shown in FIG. 11) including the four-cylinder EFI function (for MT) The circuit 52 that performs the CVT function of the board 50 is deleted, and the connection patterns Pc _{1 to} Pc ₆ are removed. Remove.

In a function integrated type substrate manufactured by using the method for manufacturing a function integrated type substrate according to the above-described embodiment (1), an optional circuit (for example, the circuit 42 performing the ECT function) is a base circuit (for example, , 3-cylinder EF
I function is formed on the same substrate as the circuit 41, and is electrically connected to the base circuit. Therefore, it is not necessary for the optional circuit to independently perform the function performed by the optional circuit (for example, the ECT function). .

Therefore, as shown in FIGS. 8 and 9, both the base circuit 71 (here, a circuit fulfilling the EFI function) and the option circuit 73 (here, a circuit fulfilling the ECT function) are required. A common element such as a power supply circuit or an EEPROM may be provided only in the base circuit 71 so that the ECT function of the option circuit 73 and the like can be exhibited by connecting to the base circuit 71.

As described above, by arranging common elements necessary for both the base circuit 71 and the option circuit 73 on only the base circuit 71, the cost can be reduced. The base circuit 71 and the optional circuit 7
By employing DMA for communication with the C.3, high-speed information transfer with few signal lines can be realized.

The software processing for fulfilling the ECT function and the like of the option circuit 73 is performed not by the sub-microcomputer 74 provided in the option circuit 73 but by the base microcomputer 72 provided in the base circuit 71. Thus, the available memory area can be effectively used.

However, it is desirable that the processing requiring high-speed software processing be performed by the sub-microcomputer 74 of the option circuit 73, instead of being brought to the base microcomputer 72 of the base circuit 71. Next, the main software processing sharing between the base microcomputer 72 and the sub-microcomputer 74 will be described.

Processing of the base microcomputer 72) The vehicle condition is detected, and a shift request is transmitted to the sub-microcomputer 74 with the target current value (RAM value) of the linear solenoid. -Store the diagnosis result received from the sub-microcomputer 74 and communicate with the diagnosis tool.

Processing of Sub-Microcomputer 74) The transmission input shaft rotation pulse is processed, converted into a rotation speed (RAM value), and transmitted to the base microcomputer 72. The F / B (duty output update) control is performed by comparing the target current value of the linear solenoid received from the base microcomputer 72 with the actual current value. Diag diagnosis and fail-safe are performed, and the diagnosis result is transmitted to the base microcomputer 72.

In the above-mentioned function integrated type board, DMA is used for communication between the base microcomputer 72 provided in the base circuit 71 and the sub-microcomputer 74 provided in the option circuit 73. There is a case where an error occurs in the communication of information by the communication.

Therefore, backup means for backing up information obtained by DMA, monitoring means for monitoring information transmission in communication, and when an error is detected in information transmission by the monitoring means, error information is not used. By providing backup information use control means for using the information that has been backed up for control, the reliability of communication can be ensured. As a method of monitoring information transmission, a mirror check, a parity check, and the like can be given.

In order to avoid collision of transmitted information, a sub-microcomputer 74 communicating with the base microcomputer 72 includes:
A chip select input terminal for inputting a chip select signal may be provided, and the chip select input terminal may be connected to the base microcomputer 72 so that the base microcomputer 72 can manage communication.

In addition, even if the mounted boards are different for various functions such as the EFI function of the three cylinders,
The circuit diagrams of the circuits that perform the same function have been discussed on the premise that they are the same.However, even if the circuits perform the same function depending on the vehicle model, the circuit configuration may be partially different There is.

In this case, the three-cylinder E
Only the basic part of the FI function may be mounted, and a part specific to each vehicle type may be mounted on the option circuit. It goes without saying that this can be performed not only for the three-cylinder EFI function but also for other functions.

[Brief description of the drawings]

FIG. 1 is a schematic view showing an example of a function-integrated substrate according to the present invention.

FIG. 2 is an explanatory diagram for explaining a method of manufacturing a function integrated substrate according to the present invention.

FIG. 3 is an explanatory diagram for explaining a method of manufacturing a function integrated substrate according to the present invention.

FIG. 4 is an explanatory diagram for explaining a method of manufacturing a function integrated substrate according to the present invention.

FIG. 5 is a flowchart showing a part of the steps in the method for manufacturing a function integrated substrate according to the embodiment (1).

FIG. 6 is an explanatory diagram for explaining the method for manufacturing the function-integrated substrate according to the embodiment (1).

FIG. 7 is an explanatory diagram for explaining the method for manufacturing the function integrated substrate according to the embodiment (1).

FIG. 8 is an exploded view schematically showing a main part of the function integrated substrate manufactured by using the method for manufacturing a function integrated substrate according to the embodiment (1).

FIG. 9 is an exploded view schematically showing a main part of the function integrated substrate manufactured by using the method for manufacturing a function integrated substrate according to the embodiment (1).

FIG. 10 shows a conventional ECU performing an EFI function and ECT.
FIG. 9 is an explanatory diagram for comparing with an ECU that performs a function.

FIG. 11 is a schematic diagram showing a conventional function integrated type substrate.

[Explanation of symbols]

21-26, 31, 32, 40, 50, 61-68 Substrates 31a, 413 Circuits performing the EFI function of three cylinders 31b, 42 Circuits performing the ECT function 31c, 43 Circuits performing the electronic throttle control function 32a, 514 Four cylinders 32b, 52 A circuit performing the CVT function 41a, 41b, 42a, 43a, 51a, 51b, 5
2a, circuit 53a lands 53 MT B base circuit C ₁ -C ₃ connector E ₁ to E ₃ Area LD ₁ to Ld ₄ connecting section LN ₁ Ln ₂ connection lines OP _1, OP ₂ optional circuit Pa, Pb, Pc, Pd connection pattern

Claims (15)

[Claims] 1. A method of manufacturing a function-integrated board constituting an in-vehicle ECU, comprising a base circuit performing a base function and an option circuit performing an optional function, wherein the base circuit is disposed at a predetermined location. A method of manufacturing a function-integrated substrate, comprising a substrate designing step of arranging the optional circuit at a location determined for each circuit or each type of circuit. 2. The method includes a board designing step of arranging connection portions for connecting these circuits via connection lines at locations determined for each location of a circuit on which the connection portions are formed. The method for manufacturing a function-integrated substrate according to claim 1, wherein: 3. When there are one or two or more base circuits to be placement candidates, one or two or more option circuit placement places, and one or more option circuits to be placement candidates at each placement place, 2. The method according to claim 1, further comprising a step of designing one or more types of boards by combining two or more circuits.
A method for manufacturing a function-integrated substrate according to claim 2. 4. The function-integrated board according to claim 3, further comprising a step of designing a new board by using at least two types of boards and exchanging circuits in a design manner. Production method. 5. The method according to claim 3, further comprising a step of designing a new board by using at least one type of board and deleting a circuit in design. How to make a function integrated board. 6. The method according to claim 5, wherein when the circuit is deleted, unnecessary connection lines are deleted. 7. A function integrated substrate produced by using the method for producing a function integrated substrate according to claim 1. Description: 8. A function integrated board comprising a vehicle-mounted ECU, comprising a base circuit performing a base function and an option circuit performing an optional function, wherein the base circuit is arranged at a predetermined location, A function-integrated substrate, wherein a circuit is arranged in a place determined for each circuit or for each type of circuit. 9. A connection line, and a connection portion for connecting these circuits via the connection line, wherein the connection portion is determined for each arrangement location of a circuit in which the connection portion is formed. 9. The function-integrated substrate according to claim 8, wherein the substrate is arranged at a location. 10. The function integration according to claim 7, wherein the option circuit is configured to perform the optional function by connecting to the base circuit. Mold substrate. 11. The function-integrated substrate according to claim 10, wherein a common element such as a power supply circuit required for both the base circuit and the option circuit is formed in the base circuit. . 12. The software according to claim 10, wherein software required to perform high-speed processing among the software for fulfilling the function of the option circuit is formed in the option circuit. Function integrated type board. 13. A communication means for communicating information necessary for control of a partner between the base circuit and the option circuit, a backup means for backing up information obtained by communication, and information transmission in communication. Monitoring means for monitoring the information, and when the monitoring means detects an error in information transmission,
13. The function-integrated board according to claim 7, further comprising a backup information use control unit for using the information backed up for control. 14. A microcomputer that communicates with a base microcomputer mounted on the base circuit is provided with a chip select input terminal for inputting a chip select signal, the chip select terminal being connected to the base microcomputer, 14. The communication system according to claim 7, wherein said base microcomputer can manage said communication.
A function-integrated substrate according to any one of the above items. 15. The function-integrated substrate according to claim 7, wherein DMA (Direct Memory Access) is employed for communication between said base circuit and said option circuit. .