JP2002158930A - Solid-state image pickup device, its manufacturing method and system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a solid-state image pickup device in which a warpage of a solid-state image pickup element chip 1 is avoided and disconnections of conductors between a TAB film 6 and bumps 4 and between the bumps 4 and bonding pads are avoided. SOLUTION: This solid-state image pickup device has a solid-state image pickup element chip 1 on which a plurality of solid-state image pickup elements are mounted, wirings 6 which are connected electrically to the solid-state image pickup element chip 1 and through which respective signals from the plurality of the solid-state image pickup elements are transmitted, and a protective cap 2 which is provided on the light incident side of the solid-state image pickup element chip 1 and protects the solid-state image pickup elements. The solid- state image pickup element chip 1 and the protective cap 2 are sealed with a soft sealing resin 3, and the wirings 6 and the protective cap 2 are bonded to each other with a hardening adhesive.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state imaging device, a method and a system for manufacturing the same, and more particularly, to a video camera,
The present invention relates to a solid-state imaging device such as a digital still camera, a method of manufacturing the same, and a system.

[0002]

2. Description of the Related Art Conventionally, CCD image sensors and MOS image sensors used in image input devices such as video cameras and digital still cameras are often formed on semiconductor substrates such as silicon wafers. The silicon wafer after the semiconductor process is formed in the color filter and microlens forming step using an acrylic material in the order of the color filter and the microlens.

[0003] The solid-state image pickup device chip, which has been divided into dimensions required in a post-process, is housed in a ceramic package or the like, and is electrically connected between the chip and the lead by wire bonding. Is glued on the package.

In recent years, there has been a demand for smaller, thinner, and lighter packages for digital cameras and the like, as disclosed in Japanese Patent Application Laid-Open No. 7-99214 and TOG (October 1998).
The technology for this is described in, for example, IEICE Toshiba).

FIG. 4 is a schematic sectional view of a solid-state imaging device described in the above publication. As shown in FIG. 4, a conventional solid-state image pickup device includes a plurality of solid-state image pickup devices such as a CCD image pickup device and a MOS type image pickup device.
A copper foil 61 sandwiched between polyimide films 62 and 63 via bumps 4 on a solid-state imaging device chip 1 provided with
Is electrically connected.

Further, one surface of the protective glass 2 and TA
The solid-state imaging device chip 1 to which the B film 6 is connected
A desired gap is left therebetween, and they are bonded by a sealing resin 3 such as an epoxy resin filled with a high amount of filler. A solid-state imaging device using such a TAB film 6 can be smaller and thinner than, for example, a wire-bonded ceramic package.

[0007]

However, in the prior art, one surface of the protective glass 2 and the solid-state image pickup device chip 1 to which the TAB film 6 is connected are hardened with a hard sealing resin filled with a high amount of filler. Due to the difference in linear expansion coefficient between the solid-state image sensor chip and the protective glass,
Warpage may occur in the solid-state imaging device chip.

On the other hand, if a sealing resin having a small amount of filler is used, the sealing resin is soft and functions as a buffer layer, so that warpage can be prevented. However, since the sealing resin is soft, disconnection between the copper foil and the bump or between the bump and the bonding pad may occur when the copper foil receives a mechanical force.

Accordingly, the present invention provides a solid-state imaging device in which no warpage occurs in the solid-state imaging device chip and no disconnection occurs between the copper foil and the bump or between the bump and the bonding pad. Make it an issue.

[0010]

In order to solve the above-mentioned problems, the present invention provides a solid-state imaging device chip having a plurality of solid-state imaging devices mounted thereon, and a plurality of the solid-state imaging devices electrically connected to the solid-state imaging device chips. In a solid-state imaging device including wiring for transmitting signals from each of the elements and a protective cap provided on a light incident side of the solid-state imaging device chip to protect the solid-state imaging device chip, the solid-state imaging device chip and the The protective cap is sealed with a flexible sealing resin, and the wiring and the protective cap are bonded with a curable adhesive.

Further, the present invention provides a solid-state image sensor chip having a plurality of solid-state image sensors mounted thereon, and a wiring electrically connected to the solid-state image sensor chips for transmitting signals from each of the plurality of solid-state image sensors. A method for manufacturing a solid-state imaging device, comprising: a protection cap provided on a light incident side of the solid-state imaging device chip to protect the solid-state imaging device chip; wherein the wiring and the protection cap are hardened by an adhesive having curability. The solid-state imaging device chip and the protective cap are sealed with a flexible sealing resin.

Further, a solid-state imaging system according to the present invention includes the above-described solid-state imaging device, an optical system that forms light on the solid-state imaging device, and a signal processing circuit that processes an output signal from the solid-state imaging device. It is characterized by the following.

[0013]

Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment 1) FIG. 1 is a schematic sectional view of a solid-state imaging device according to Embodiment 1 of the present invention. FIG. 2 shows FIG.
FIG. 1 and 2 show a CCD image pickup device and an M
A TAB (tape-automated bonding) film 6 is electrically connected via a bump 4 to a solid-state image sensor chip 1 provided with a plurality of solid-state image sensors such as an OS-type image sensor and provided with a microlens 7. .

The TAB film 6 has a copper foil as a wiring sandwiched between insulating films such as a polyimide film. Further, the TAB film 6 may be connected to the solid-state imaging device chip 1 by ultrasonic bonding, or may be connected to the solid-state imaging device chip 1 via an anisotropic conductive film or a conductive paste. Furthermore, although the material of the bump 4 is usually gold, it may be formed of another metal or alloy such as copper or nickel and the surface may be plated with gold.

Further, one surface of the protective glass 2 which is a protective cap for protecting the solid-state image sensor from outside air, moisture, and the like, and the solid-state image sensor chip 1 to which the TAB film 6 is connected are separated by a desired gap. , For example, urethane-based,
Silicone-based, styrene-based, ester-based, vinyl chloride-based, epoxy-based, etc., having an elastic modulus of, for example, 1000
The solid-state imaging device chip 1 is hermetically sealed by bonding with a sealing resin 3 of Mpa or less.

On the side surface of the sealing resin 3 in FIG. 1, the protective glass 2 and the TAB film 6 are made of epoxy, acrylic, phenol or the like filled with a high filler such as silica, and have an elastic modulus. Is 100
It is bonded by an adhesive material 8 of Mpa or less.

The protective glass 2 is assumed to use, for example, non-alkali glass as a material.
Any material that transmits light, such as quartz, and can protect the solid-state imaging device from the outside air and moisture may be used. Further, an optical low-pass filter or an infrared cut filter may be laminated.

Although not shown, the protective glass 2 is covered with the bumps 4 and the copper foil so as to cover the bumps 4 and the copper foil so as to cover the bumps 4 and the copper foil so that the incident light is not irregularly reflected and does not adversely affect the image. A membrane is provided.

Here, as shown in FIG. 2, the TAB film 6 is provided with an opening 5. Therefore, the opening 5
By the anchor effect of the above, it is possible to more firmly fix to the adhesive 8.

In this embodiment, before the solid-state image sensor chip and the protective glass 2 are bonded by the sealing resin 3, the TAB film 6 and the protective glass 2
And are glued. This is because if the bonding order is reversed, the sealing resin 3 having fluidity may flow to the end of the protective glass 2.
This is because the adhesive is applied on the TAB film 6 and the protective glass 2 by the adhesive 8 may be insufficient.

(Embodiment 2) FIG. 3 is a configuration diagram of a solid-state imaging system using the solid-state imaging device described in Embodiment 1. In FIG. 3, reference numeral 21 denotes a barrier functioning both as protection of the lens and as a main switch, 22 as a lens for forming an optical image of a subject on the solid-state imaging device 24, 23 as an aperture for varying the amount of light passing through the lens, and 24 as a lens. 2
A solid-state imaging device for capturing the subject formed in 2 as an image signal; 25, an imaging signal processing circuit for performing various corrections, clamping, and the like on an image signal output from the solid-state imaging device 24; An A / D converter for performing analog-digital conversion of an image signal output from the element 24; a signal processing unit 27 for performing various corrections on the image data output from the A / D converter 26 and compressing the data;
28 is a solid-state imaging device 24, an imaging signal processing circuit 25,
A timing generator for outputting various timing signals to the D converter 26 and the signal processor 27, an overall control / arithmetic unit 29 for controlling various arithmetic operations and the entire still video camera, and a numeral 10 for temporarily storing image data. A memory unit, 11 is a recording medium control interface unit for recording or reading on a recording medium, 12 is a detachable recording medium such as a semiconductor memory for recording or reading image data,
Reference numeral 13 denotes an external interface (I / F) unit for communicating with an external computer or the like.

Next, the operation of FIG. 3 will be described. When the barrier 1 is opened, the main power is turned on, then the power of the control system is turned on, and the A / D converter 6 is turned on.
The power of the imaging system circuit is turned on. Then, in order to control the exposure amount, the overall control / arithmetic unit 9 opens the aperture 3 and the signal output from the solid-state imaging device 4 passes through the imaging signal processing circuit 5 to the A / D converter 6. Is output. The A / D converter 6 A / D converts the signal and outputs the signal to the signal processing unit 7. The signal processing unit 7 performs an exposure calculation based on the data in the overall control / calculation unit 9.

The brightness is determined based on the result of the photometry, and the overall control / arithmetic unit 9 controls the aperture according to the result. Next, based on the signal output from the solid-state imaging device 4, high-frequency components are extracted, and the distance to the subject is calculated by the overall control / calculation unit 9. Thereafter, the lens is driven to determine whether or not the lens is focused, and when it is determined that the lens is not focused,
The lens is driven again to measure the distance.

Then, after the focusing is confirmed, the main exposure starts. When the exposure is completed, the image signal output from the solid-state imaging device 4 is corrected in an imaging signal processing circuit 5, further A / D-converted by an A / D converter 6, and passed through a signal processing unit 7 to perform overall control. The data is stored in the memory unit 10 by the operation 9. Thereafter, the data stored in the memory unit 10 is
Under the control of the overall control / arithmetic unit 9, the data is recorded on a removable recording medium 12 such as a semiconductor memory through a recording medium control I / F unit. Further, the image may be processed by inputting it directly to a computer or the like through the external I / F unit 13.

[0026]

As described above, according to the present invention, the solid-state imaging device chip and the protective cap are sealed with a flexible sealing resin, and the wiring and the protective cap have a higher elastic modulus than the sealing resin. Since the bonding is performed with a low adhesive, it is possible to prevent the occurrence of warpage of the solid-state imaging device chip and the occurrence of disconnection between the copper foil and the bump or between the bump and the bonding pad.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view of a solid-state imaging device according to a first embodiment of the present invention.

FIG. 2 is a plan view of FIG.

FIG. 3 is a configuration diagram of a solid-state imaging system using a solid-state imaging device according to a second embodiment of the present invention.

FIG. 4 is a schematic sectional view of a conventional solid-state imaging device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Solid-state image sensor chip 2 Protective glass 3 Sealing resin 4 Bump 5 Opening 6 TAB film 7 Micro lens 8 Adhesive

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4M118 AA08 AA10 AB01 BA10 BA14 GC11 GC20 GD04 HA11 HA23 HA27 HA31 5C024 CY17 CY47 CY48 EX11 EX22 EX23 EX24 EX25 EX34 GY01 GY31 HX09 HX23 HX57 5F088 AB03 BA16 BB03 JA06 JA06

Claims (8)

[Claims] 1. A solid-state imaging device chip on which a plurality of solid-state imaging devices are mounted; a wiring electrically connected to the solid-state imaging device chip for transmitting signals from each of the plurality of solid-state imaging devices; In a solid-state imaging device including a protection cap provided on a light incident side of an element chip and protecting the solid-state imaging element chip, the solid-state imaging element chip and the protection cap are sealed with a flexible sealing resin. A solid-state imaging device, wherein the wiring and the protective cap are adhered with an adhesive having curability. 2. The solid-state imaging device according to claim 1, wherein the adhesive is a resin such as an epoxy resin, an acrylic resin, or a phenol resin. 3. The solid-state imaging device according to claim 1, wherein the sealing resin is a resin of urethane type, silicone type, styrene type, ester type, vinyl chloride type, epoxy type or the like. 4. The solid-state imaging device according to claim 1, wherein an elastic modulus of the adhesive is 100 Mpa or more, and an elastic modulus of the sealing resin is 1000 Mpa or less. . 5. The solid-state imaging device according to claim 1, wherein said solid-state imaging device chip is a silicon chip. 6. The wiring, wherein the wiring is covered with an insulating film, and the insulating film has an irregular shape on an application surface of the adhesive or has an opening in the application surface. The solid-state imaging device according to any one of claims 1 to 5. 7. A solid-state imaging device chip on which a plurality of solid-state imaging devices are mounted; a wiring electrically connected to the solid-state imaging device chip to transmit signals from each of the plurality of solid-state imaging devices; A method for manufacturing a solid-state imaging device comprising: a protection cap provided on a light incident side of an element chip and protecting the solid-state imaging element chip; wherein the wiring and the protection cap are adhered to each other with a curable adhesive; A method of manufacturing the solid-state imaging device, wherein the solid-state imaging device chip and the protection cap are sealed with a sealing resin having flexibility. 8. A solid-state imaging device according to claim 1, an optical system that forms an image on the solid-state imaging device, and a signal processing circuit that processes an output signal from the solid-state imaging device. And a solid-state imaging system.