JP2002157564A - Antenna coil for ic card and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an antenna coil for an IC card which can be smoothly rewound and sheet-fed without bringing about blocking and its manufacturing method. SOLUTION: This antenna coil 1 for an IC card is provided with resin film substrate 11, a primer coat layer 15 formed on the surface of the substrate 11 and circuit pattern layers 13, made from metal foil, is formed on at least one part of the surface of the primer coat layer 15. The primer coat layer 15 is formed on one surface of the metal foil, the resin film substrate 11 is stuck onto the surface of the primer coat layer 15, resist ink layer having a prescribed pattern is printed on the other surface of the metal foil, the circuit pattern layer 13 is formed by etching a part of the metal foil by using the resist ink layer as a mask, and the resist ink layer is subsequently eliminated.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an antenna coil for an IC card and a method for manufacturing the same, and more particularly, to an antenna coil for an IC card in which a circuit pattern layer is formed of metal foil in an antenna coil used for an IC card and a method for manufacturing the same. Things.

[0002]

2. Description of the Related Art In recent years, I
C-cards have undergone remarkable development and have begun to be used for telephone cards, credit cards, prepaid cards, cash cards, ID cards, card keys and the like. These conventional IC card antenna coils are manufactured by bonding metal foil to both surfaces of a resin film such as a polyethylene terephthalate (PET) film using an adhesive,
It has been manufactured by performing an etching treatment on at least a part of the metal foil to form a circuit pattern layer made of the metal foil on the surface of the resin film.

However, when the IC coil antenna coils manufactured as described above are shipped or stored in a state where they are stacked or wound up in a belt shape, the overlapped portions come into close contact with each other (hereinafter referred to as blocking). ). For this reason, IC
When manufacturing a card, there has been a problem that the production line is stopped because the closely attached antenna coil cannot be easily separated.

In order to prevent blocking, it is conceivable to remove excess adhesive on the resin film as a base material, or to insert a release paper into a portion where the antenna coil overlaps. However, it is extremely difficult to completely remove the adhesive. Further, when a release paper is inserted, a step of removing the release paper in a subsequent step is required. Therefore, no matter which measure is adopted, there is a problem that an extra step is required and the manufacturing cost is increased.

An object of the present invention is to provide an unwinding and sheet-feeding apparatus which can smoothly rewind and feed single wafers without blocking.
An object of the present invention is to provide a C card antenna coil and a method of manufacturing the same.

[0006]

An antenna coil for an IC card according to the present invention comprises a base material containing a resin, a base coat layer formed on the surface of the base material, and a base coat layer formed on the surface of the base coat layer. A circuit pattern layer formed of a metal foil on at least a part thereof.

In the antenna coil for an IC card according to the present invention, since the undercoating layer is formed on the surface of the base material, the base materials on which the circuit pattern layer is formed can be formed even when the antenna coils are stacked. Do not adhere to each other via the undercoat layer. Therefore, it is possible to prevent the blocking from occurring. Therefore,
It is possible to prevent a trouble that the IC card production line stops.

[0008] Preferably, the antenna coil for an IC card of the present invention further includes an adhesive layer interposed between the base coat layer and the base material to bond the two. In this case, the adhesive layer preferably contains a polyurethane-based adhesive containing an epoxy resin.

Preferably, in the antenna coil for an IC card according to the present invention, the undercoat layer has a thickness of 0.1 mm.
It is 1 μm or more and 5 μm or less.

Further, preferably, the circuit pattern layer comprises:
A first circuit pattern layer formed on one surface of the base material on the surface of the base coating layer, and a second circuit pattern layer formed on the other surface of the base material on the surface of the base coating layer And In this case, it is preferable that at least a part of the first circuit pattern layer is in contact with at least a part of the second circuit pattern layer. Thus, electrical continuity between the first and second circuit pattern layers can be achieved. The contact between the first and second circuit pattern layers can be easily performed by crimping.

A method for manufacturing an antenna coil for an IC card according to the present invention includes the following steps.

(A) A step of forming a base coat layer on one surface of the metal foil. (B) a step of bonding a base material containing a resin on the surface of the undercoat layer; and (c) a step of printing a resist ink layer having a predetermined pattern on the other surface of the metal foil.

(D) forming a circuit pattern layer by etching a part of the metal foil using the resist ink layer as a mask;

(E) removing the resist ink layer after etching a part of the metal foil;

Preferably, in the method of manufacturing an antenna coil for an IC card according to the present invention, the step of bonding the base material includes the step of bonding the base material on the surface of the base coat layer using a polyurethane-based adhesive containing an epoxy resin. Including bonding.

Preferably, in the method of manufacturing an antenna coil for an IC card according to the present invention, the step of fixing the base material includes the step of fixing the base material on one surface of the first metal foil. And bonding the other surface of the substrate on the surface of the undercoat layer formed on the one surface of the second metal foil to form a circuit pattern layer. The step includes forming a first circuit pattern layer by etching a portion of the first metal foil on one surface of the substrate, and forming a portion of the second metal foil on the other surface of the substrate. To form a second circuit pattern layer by etching. As a matter of course, the etching of a part of the first metal foil and the etching of a part of the second metal foil may be performed simultaneously.

Still preferably, in a method of manufacturing an antenna coil for an IC card according to the present invention, at least a part of the first circuit pattern layer is formed by a second crimping process.
And a step of contacting at least a part of the circuit pattern layer. In this case, the first formed on both sides of the base material
In order to achieve electrical continuity between the first and second circuit pattern layers, at least a portion of the first and second circuit pattern layers can be brought into contact by crimping to achieve electrical continuity between the first and second circuit pattern layers. Can be. Therefore, the manufacturing cost can be reduced as compared with the conventional manufacturing method, and the production efficiency can be increased.

[0018]

FIG. 1 is a plan view of an antenna coil for an IC card according to an embodiment of the present invention.
FIG. 2 is a partial cross-sectional view as viewed from the direction of line II-II in FIG. 1.

As shown in FIGS. 1 and 2, the antenna coil 1 for an IC card comprises a resin film substrate 11, an adhesive layer 12 formed on both surfaces of the resin film substrate 11, and an adhesive layer 12. It comprises a primer coat layer 15 as a base coat layer formed on the surface, and a circuit pattern layer 13 made of a metal foil formed on the surface of the primer coat layer 15 according to a predetermined pattern. The circuit pattern layer 13 is formed in a spiral pattern on the surface of the substrate as shown in FIG. At the end of the circuit pattern layer 13, regions 13c and 13c for mounting an IC chip are provided.
d is formed. The circuit pattern layer indicated by a dotted line in FIG. Base material 11
The circuit pattern layer 13 formed on the front surface of the substrate 11 is bonded to the circuit pattern layer 13 formed on the back surface of the
And 13b are in electrical contact with each other. This contact is achieved by partially breaking the base material 11, the adhesive layer 12, and the primer coat layer 15 by crimping.

As the metal foil used for the circuit pattern layer 13 in the above embodiment, at least one selected from aluminum foil, copper foil, stainless steel foil, titanium foil, tin foil and the like can be used. . Among them, it is most preferable to use an aluminum foil as a material for the circuit pattern layer from the viewpoint of economy, versatility, and reliability. Here, the aluminum foil is not limited to a pure aluminum foil, but also includes an aluminum alloy foil.

The metal foil preferably has a thickness of 7 μm or more and 60 μm or less and a purity of 97.5 mass% or more and 99.7 mass% or less, and more preferably 15 μm or more and 5 μm or less.
0 μm or less, purity: 98.0 mass% to 99.5 mass%
It is as follows.

When the thickness of the metal foil is less than 7 μm, many pinholes are generated and the metal foil may be broken in the manufacturing process. On the other hand, if the thickness of the aluminum foil is 60
If the thickness exceeds μm, the etching process for forming the circuit pattern layer 13 takes time, and the material cost increases.

If the purity is less than 97.5% by mass, impurities contained in the metal foil increase, and the circuit pattern layer 13
And the electrical resistance thereof becomes high, the corrosion resistance becomes extremely poor, and corrosion may progress even with a small amount of moisture. on the other hand,
If the purity exceeds 99.7% by mass, the corrosion resistance of the metal foil is excessively improved, so that it takes a long time for the etching treatment.

Specifically, when an aluminum foil is used as the material of the circuit pattern layer 13, for example, JIS (A)
In the symbol of A), 1030, 1N30, 1050, 110
Pure aluminum foil or aluminum alloy foil such as 0, 8021, 8079 or the like can be employed.

When aluminum foil is used as the material of the circuit pattern layer 13 in the present invention, the purity of aluminum is defined as iron (Fe), silicon (Si), copper (Cu),
Manganese (Mn), magnesium (Mg), zinc (Z
n), gallium (Ga), titanium (Ti), zirconium (Zr), nickel (Ni), and chromium (Cr). In the aluminum foil used as the material of the circuit pattern layer 13 of the present invention, the iron content is 0.2 to 1.3% by mass, and the silicon content is 0.0.
It is preferable that the content is 5 to 1.0% by mass and the content of copper is 0.3% by mass or less.

From the viewpoint of the strength of the aluminum foil,
The above composition range is preferable, and the tensile strength is 70 MPa or more.
120 MPa and elongation are preferably 5% or more. Tensile strength of aluminum foil is less than 70MPa or elongation is 5%
If the ratio is less than the above range, bending or wrinkling may occur during the manufacturing process, and the dimensional accuracy of the circuit pattern layer may be deteriorated. The metal foil used is preferably a soft foil or a semi-hard foil, and is preferably annealed at a temperature of about 250 to 550 ° C. after rolling into a foil. If a hard metal foil having a tensile strength exceeding 120 MPa is used, there is a problem in terms of remaining rolling oil and flexibility (winding property), which is not preferable.

As a material for the primer coat layer, at least one selected from an epoxy primer, an acrylic primer, a vinyl chloride-vinyl acetate copolymer primer and the like can be employed. The thickness of the primer coat layer is preferably 0.1 μm or more and 5.0 μm or less. If the thickness of the primer coat layer is less than 0.1 μm,
Blocking is likely to occur. On the other hand, if the thickness of the primer coat layer exceeds 5 μm, the electrical resistance of the antenna coil increases, and conduction with other components and wiring becomes insufficient, which causes heat generation and malfunction.

The resin film used as the base material of the antenna coil for an IC card of the present invention is at least one selected from a low-shrinkage polyethylene terephthalate (PET) film, a low-shrinkage polyethylene naphthalate (PEN) film and the like. Is preferred. The thickness of this resin film is preferably in the range of 15 to 50 μm, more preferably in the range of 20 to 40 μm. When the thickness of the base material is less than 15 μm, the rigidity of the laminate with the metal foil forming the circuit pattern layer is insufficient, which causes a problem in workability in each manufacturing process. On the other hand, if the thickness of the
If it exceeds m, the crimping process described later may not be able to be performed reliably.

The heat shrinkage of the resin film used as the base material must be 0.3% or less when kept at a temperature of 150 ° C. for 30 minutes. When the heat shrinkage exceeds 0.3%, there is a problem that the dimensional accuracy of the circuit pattern layer formed on the base material is deteriorated.

The above-mentioned heat shrinkage is a linear shrinkage and is calculated by the following equation.

[0031]

(Equation 1)

In the above equation, L is 30 at a temperature of 150 ° C.
The length of the resin film when held for one minute, L ₀ is the original length of the resin film.

The adhesion between the metal foil on which the primer coat layer is formed and the resin film as the substrate is preferably performed by dry lamination using a polyurethane (PU) adhesive containing an epoxy resin. When a polyurethane-based adhesive containing no ordinary epoxy resin is used, delamination (peeling) tends to occur during an etching process for forming a circuit pattern layer or when an IC chip is mounted. This is because a polyurethane adhesive containing no epoxy resin is inferior in chemical resistance and heat resistance.

In order to bond a metal foil for forming a circuit pattern layer on a resin film as a base material,
It is preferable to apply a polyurethane adhesive containing an epoxy resin in an amount of about 1 to 15 g / m ² after drying. If the coating amount is less than 1 g / m ² , the adhesive strength will be insufficient, and if it exceeds 15 g / m ² , the crimping process to be described later will be hindered and the production cost will increase.

Next, one embodiment of a method of manufacturing an antenna coil for an IC card according to the present invention will be described.
3 to 7 are partial sectional views showing the steps of manufacturing the antenna coil for an IC card according to the present invention. In addition, FIG.
FIG. 7 shows a partial cross section viewed from the direction of the line II-II in FIG.

As shown in FIG. 3, a primer coat layer 15 is formed on one surface of each of the two metal foils 130. Thus, before bonding the metal foil 130 to the resin film substrate 11, at least a portion of the metal foil 130,
Preferably, one surface is subjected to a primer coat treatment to form a primer coat layer. The method for forming the primer coat layer is not particularly limited.
It can be performed by dipping, roll coater, bar coater, doctor blade, spraying, printing, etc.,
In particular, gravure printing is preferred. After the primer coat layer is formed, 50 to 2
It is preferable to perform a drying and curing treatment at a temperature of about 50 ° C. for about 5 to 300 seconds.

As shown in FIG. 4, the resin film substrate 11
The adhesive layer 12 is formed on both surfaces of the resin film substrate 11, and one surface of each of the two aluminum foils 130 on which the primer coat layer 15 is formed is fixed to both surfaces of the resin film substrate 11 with the adhesive layer 12. Thus, a laminate of the aluminum foil 130 and the resin film substrate 11 is prepared.

As shown in FIG. 5, the resist ink layer 14 is printed on the surface of the aluminum foil 130 so as to have a predetermined spiral pattern according to the specifications of the antenna coil. After printing, the resist ink layer 14 is cured.

As shown in FIG. 6, the resist ink layer 14
The circuit pattern layer 13 is formed by etching the aluminum foil 130 using as a mask.

Thereafter, as shown in FIG. 7, the resist ink layer 14 is peeled off. Finally, a predetermined portion of the circuit pattern layer 13 is subjected to crimping using a metal plate having irregularities and metal protrusions, thereby forming a contact portion or a crimp portion 13a of the circuit pattern layer as shown in FIG. Thus, the antenna coil 1 for IC card of the present invention is completed.

The resist ink used in the production method of the present invention is not particularly limited, but an ultraviolet curable resist ink containing an acrylic monomer having at least one carboxyl group in a molecule and an alkali-soluble resin as main components is used. Is preferred. This resist ink is suitable for continuous mass production because it can be subjected to gravure printing, has acid resistance, and can be easily peeled off with an alkali. After performing gravure printing on the metal foil with a predetermined circuit pattern using the resist ink and irradiating and curing the metal foil with ultraviolet rays, acid etching of the metal foil with, for example, ferric chloride or the like, sodium hydroxide The circuit pattern layer can be formed by peeling and removing the resist ink layer with an alkali such as.

The acrylic monomer having at least one carboxyl group in the molecule includes, for example, 2-acryloyloxyethylphthalic acid, 2-acryloyloxyethylsuccinic acid, 2-acryloyloxyethylhexahydrophthalic acid, 2-acryloyl Oxypropyl phthalic acid, 2-acryloyloxypropyl tetrahydrophthalic acid, 2-acryloyloxypropyl hexahydrophthalic acid, and the like, among them, a single acrylic monomer, or a mixture of several acrylic monomers is used. be able to. Examples of the alkali-soluble resin include a styrene-maleic acid resin, a styrene-acrylic resin, and a rosin-maleic acid resin.

In the resist ink, in addition to the above components,
Normal monofunctional acrylic monomers, polyfunctional acrylic monomers, and prepolymers can be added to the extent that they do not inhibit alkali stripping properties, and can be prepared by appropriately adding a photopolymerization initiator, a pigment, an additive, a solvent, and the like. it can. Examples of the photopolymerization initiator include benzophenone and its derivatives, benzyl, benzoin and its alkyl ethers, thioxanthone and its derivatives, lucilin PTO, Irgacure manufactured by Ciba Specialty Chemicals, and Esacure manufactured by Frattelli Lamberti. As a pigment, in addition to adding a coloring pigment so that the pattern is easy to see,
Extenders such as silica, talc, clay, barium sulfate and calcium carbonate can be used in combination. In particular, silica is effective in preventing blocking when the metal foil is wound up with the ultraviolet curable resist ink attached.
Examples of the additives include a polymerization inhibitor such as 2-tert-butylhydroquinone, an antifoaming agent such as silicon, a fluorine compound, and an acrylic polymer, and a leveling agent. These are added as needed. Ethyl acetate, ethanol,
Denatured alcohol, isopropyl alcohol, toluene,
MEK and the like. Among these, a solvent can be used alone or in combination. After the gravure printing, the solvent is preferably evaporated from the resist ink layer by hot air drying or the like.

After the circuit pattern layer is formed, crimping processing is performed at a predetermined position at a normal temperature, and a part of the front and back metal foils is brought into electrical contact to form an antenna coil. Here, the crimping process means that a resin film and an adhesive layer as a base material are broken by a drill, a file, an ultrasonic wave, or the like, and a part of the metal foil forming the circuit pattern layer is brought into physical contact with each other. That means. Specifically, the resin film and the adhesive layer and the primer coat layer are partially formed by contacting the laminate composed of the resin film and the metal foil on the metal plate having irregularities and pressing the metal protrusions. And the surfaces of the metal foils can come into contact with each other, and electrical continuity can be obtained.

Although the configuration and manufacturing method of the antenna coil for IC card according to the present invention have been described, the following steps are further performed to commercialize the IC card as an IC card. In the antenna coil 1 for an IC card shown in FIG.
An IC chip is mounted on 3d. Further, a concealing layer such as white PET can be laminated on the surface of the laminate of the metal foil and the resin film by a hot melt method or the like. The concealing layer is not limited to white, and may use known color pigments, extenders, metal pigments such as aluminum flakes, known resins, varnishes, vehicles, and the like. Of course, components used in known IC cards, such as a printing layer, a magnetic recording layer, a magnetic shielding layer, an overcoat layer, and a vapor deposition layer, can be laminated as necessary.

[0046]

(Embodiment 1) As shown in FIG.
A primer coating treatment is performed on one surface of each of aluminum foil coil (strip-shaped) (JIS 1N30-O) materials having a thickness of 30 μm and 20 μm as 0 to obtain an epoxy coating agent N such that the thickness after drying becomes 1.5 μm
o. 8800 (manufactured by Tanaka Chemical Co., Ltd.) was applied and dried and cured at a temperature of 200 ° C. for 30 seconds. Thus, the primer coat layer 15 was formed on one surface of each of the two aluminum foil coils.

Thereafter, as shown in FIG. 4, a PET film having a thickness of 38 μm as the resin film substrate 11 was coated on one surface with a primer coat layer 15 having a thickness of 3 μm.
One surface of the 0 μm aluminum foil coil is bonded to the adhesive layer 1
2 and the primer film 15 was formed on the other surface of the PET film, and one surface of a 20 μm-thick aluminum foil coil was adhered with the adhesive layer 12 to produce a laminated coil material. The adhesive used was an epoxy-urethane dry laminate adhesive AD76P1 (manufactured by Tokyo Morton Co., Ltd.), and the applied amount of the adhesive was 4 g / m ² by weight after drying.

As shown in FIG. 5, a resist ink layer 14 having a circuit pattern as shown in FIG. 1 was continuously and repeatedly printed on the other surface of the aluminum foil coil as the metal foil 130. Resist ink is Dicure-RE-9
7 (manufactured by Dainippon Ink and Chemicals, Inc.), and the applied amount of the resist ink was 5 g / m ² by weight after drying.

Using the resist ink layer 14 thus formed as a mask, the aluminum foil was etched to form the circuit pattern layer 13 as shown in FIG. An aqueous ferric chloride solution was used as an etching solution.

Thereafter, as shown in FIG. 7, the resist ink layer 14 was peeled off using an aqueous solution of sodium hydroxide.

Finally, at a predetermined position on the surface of the laminated coil material, a crimping process for obtaining electrical continuity between the front and back sides is performed by using a metal plate having irregularities and metal projections, as shown in FIG. A strip of an IC card antenna coil having such a cross section was manufactured.

Thereafter, 1.96 ×
The strip of the antenna coil for the IC card was wound into a coil at a tension of 10 ² N / m (width).

Example 2 As a primer coating treatment, an epoxy-melamine coating agent No. 1 was used such that the thickness after drying became 2 μm. Except that 952-H (manufactured by Tanaka Chemical Co., Ltd.) was applied, a strip material of an antenna coil for an IC card was manufactured in the same manufacturing process as in Example 1.

Example 3 A strip material for an antenna coil for an IC card was manufactured in the same manufacturing process as in Example 1 except that a PEN film having a thickness of 38 μm was used as a resin film substrate.

(Example 4) As a primer coating treatment, epoxy coating agent No. 1 was dried so that the thickness after drying was 0.05 μm. Except that 8800 (manufactured by Tanaka Chemical Co., Ltd.) was applied, a strip material of an antenna coil for an IC card was manufactured in the same manufacturing process as in Example 1.

(Example 5) As a primer coating treatment, the epoxy coating agent No. 1 was dried so that the thickness after drying became 6 μm. Except that 8800 (manufactured by Tanaka Chemical Co., Ltd.) was applied, the IC was manufactured in the same manufacturing process as in Example 1.
A strip material for a card antenna coil was manufactured.

Comparative Example 1 A strip of an antenna coil for an IC card was manufactured in the same manufacturing process as in Example 1 except that the aluminum foil coil material was not subjected to the primer coating treatment.

Each of the obtained strips was stored at a predetermined temperature shown in Table 1 for 48 hours, and the end of each strip was grasped with both hands to evaluate whether or not blocking would occur.
The evaluation was performed according to the following indices.

Evaluation 5: The overlapped portion is separated without any pulling when unwinding the strip.

Evaluation 4: A noise is made when the band material is rewound, but the overlapped part is separated without applying a particularly strong force.

Evaluation 3: The overlapped portion does not separate unless a force is applied when rewinding the band material, but separates when pulled with a certain amount of force.

Evaluation 2: When a force is applied when rewinding the strip, the overlapped portion is separated, but the material is partially damaged.

Evaluation 1: Even if a force is applied when rewinding the strip, the overlapping portions are completely adhered and do not separate.

Among these evaluations, the evaluation 5 is the best as a product of the band material of the antenna coil, and the evaluation 4 or more is necessary as the product so as not to cause a trouble in the IC card manufacturing line in the later process. .

The electric resistance of the crimping part of each of the obtained strips was measured with a tester.

Further, the appearance of the circuit pattern layer obtained by the etching treatment was evaluated. This evaluation was performed by visually confirming etching defects such as disconnection, thinning, and peeling of the circuit pattern layer. A sample having no etching defect was defined as “good”, and a product having a possibility of causing a problem in characteristics as an antenna coil product was defined as “defective”.

Table 1 shows the above results.

[0068]

[Table 1]

From Table 1, it can be seen that in Examples 1 to 5, the evaluation of blocking was 4 or more, whereas in Comparative Example 1 in which no primer coating treatment was performed, the evaluation of blocking was 1. In Example 4, since the thickness of the primer coat layer was less than 0.1 μm,
, Blocking is more likely to occur, and the evaluation of blocking is slightly lower. In Example 5, since the thickness of the primer coat layer exceeds 5 μm, it can be seen that the electric resistance value of the crimping portion was increased.

The embodiments and examples disclosed above are illustrative in all respects and should not be considered as limiting. The scope of the present invention is defined by the terms of the claims, rather than the embodiments or examples described above, and includes all modifications and changes within the meaning and scope equivalent to the terms of the claims.

[0071]

As described above, the antenna coil for an IC card according to the present invention can smoothly rewind and supply single wafers without blocking, so that productivity in a post-process IC card production line can be improved. Can be prevented from decreasing.

[Brief description of the drawings]

FIG. 1 is a plan view showing an antenna coil for an IC card according to one embodiment of the present invention.

FIG. 2 is a partial cross-sectional view as viewed from the direction of line II-II in FIG.

FIG. 3 is a partial cross-sectional view showing a first manufacturing step of an IC coil antenna coil according to one embodiment of the present invention.

FIG. 4 is a partial sectional view showing a second manufacturing step of the antenna coil for an IC card according to one embodiment of the present invention;

FIG. 5 is a partial cross-sectional view showing a third manufacturing step of the IC card antenna coil according to one embodiment of the present invention.

FIG. 6 is a partial sectional view showing a fourth manufacturing step of the antenna coil for an IC card according to one embodiment of the present invention;

FIG. 7 is a partial cross-sectional view showing a fifth manufacturing process of the IC coil antenna coil according to one embodiment of the present invention.

[Explanation of symbols]

1: antenna coil for IC card, 11: resin film substrate, 12: adhesive layer, 13: circuit pattern layer, 14:
Resist ink layer, 15: primer coat layer, 13
0: Metal foil.

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Hiroshi Tada 3-6-8 Kutaro-cho, Chuo-ku, Osaka-shi, Osaka Toyo Aluminum Co., Ltd. (72) Inventor Hiroyuki Sakamoto 3-chome, Kutaro-cho, Chuo-ku, Osaka, Osaka No. 6-8 F-term in Toyo Aluminum Co., Ltd. (reference) 2C005 MA18 MA19 MB01 MB02 MB06 MB07 MB08 MB09 NA08 NA09 NB03 PA03 PA18 RA04 5B035 AA04 BA05 CA01 CA23

Claims (10)

[Claims] 1. A substrate containing a resin, an undercoat layer formed on a surface of the substrate, and a circuit pattern layer formed of a metal foil on at least a part of the surface of the undercoat layer. Provided IC coil antenna coil. 2. The antenna coil for an IC card according to claim 1, further comprising an adhesive layer interposed between said base coat layer and said base material to bond them. 3. The antenna coil for an IC card according to claim 2, wherein the adhesive layer includes a polyurethane-based adhesive containing an epoxy resin. 4. The antenna coil for an IC card according to claim 1, wherein the thickness of the undercoating layer is 0.1 μm or more and 5 μm or less. 5. The circuit pattern layer according to claim 1, wherein the first circuit pattern layer is formed on one surface of the base material on a surface of the base coating layer, and the base circuit layer is formed on the other surface of the base material. The antenna coil for an IC card according to any one of claims 1 to 4, further comprising a second circuit pattern layer formed on a surface of the IC card. 6. The antenna coil for an IC card according to claim 5, wherein at least a part of the first circuit pattern layer is in contact with at least a part of the second circuit pattern layer. 7. A step of forming an undercoating layer on one surface of the metal foil, a step of bonding a base material containing a resin on the surface of the undercoating layer, and A step of printing a resist ink layer having a predetermined pattern, a step of forming a circuit pattern layer by etching a part of the metal foil using the resist ink layer as a mask, and a part of the metal foil Removing the resist ink layer after etching the antenna coil. 8. The method according to claim 7, wherein the step of bonding the base material includes bonding the base material on the surface of the base coat layer using a polyurethane-based adhesive containing an epoxy resin. Of manufacturing an antenna coil for an IC card. 9. The step of fixing the base material comprises: adhering one surface of the base material onto a surface of a base coating layer formed on one surface of the first metal foil; Bonding the other surface of the substrate on the surface of the undercoat layer formed on one surface of the foil, wherein the step of forming the circuit pattern layer comprises the steps of: A first circuit pattern layer is formed by etching a part of the first metal foil, and the second circuit pattern layer is formed on the other surface of the base material.
9. The method for manufacturing an antenna coil for an IC card according to claim 7, comprising forming a second circuit pattern layer by etching a part of the metal foil. 10. The method according to claim 1, wherein
The method for manufacturing an antenna coil for an IC card according to claim 9, further comprising a step of bringing at least a part of the circuit pattern layer into contact with at least a part of the second circuit pattern layer.