JP2002151252A - Organic el display device - Google Patents
Organic el display deviceInfo
- Publication number
- JP2002151252A JP2002151252A JP2000348945A JP2000348945A JP2002151252A JP 2002151252 A JP2002151252 A JP 2002151252A JP 2000348945 A JP2000348945 A JP 2000348945A JP 2000348945 A JP2000348945 A JP 2000348945A JP 2002151252 A JP2002151252 A JP 2002151252A
- Authority
- JP
- Japan
- Prior art keywords
- organic
- display device
- spacer
- electrode
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 100
- 125000006850 spacer group Chemical group 0.000 claims abstract description 73
- 238000007789 sealing Methods 0.000 claims abstract description 62
- 239000011347 resin Substances 0.000 claims abstract description 17
- 229920005989 resin Polymers 0.000 claims abstract description 17
- 238000004519 manufacturing process Methods 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 8
- 239000011368 organic material Substances 0.000 claims abstract description 8
- 238000004140 cleaning Methods 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 17
- 238000009434 installation Methods 0.000 claims description 15
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 88
- 238000001035 drying Methods 0.000 description 17
- 239000011521 glass Substances 0.000 description 13
- 239000002274 desiccant Substances 0.000 description 8
- 239000010408 film Substances 0.000 description 8
- 230000005525 hole transport Effects 0.000 description 7
- 239000011159 matrix material Substances 0.000 description 7
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 239000012298 atmosphere Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 239000000428 dust Substances 0.000 description 4
- 150000002894 organic compounds Chemical class 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 238000001771 vacuum deposition Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 229910001148 Al-Li alloy Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 101100321669 Fagopyrum esculentum FA02 gene Proteins 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 235000010210 aluminium Nutrition 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 150000002484 inorganic compounds Chemical class 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000009751 slip forming Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- MAUWVEYTZRYXDX-UHFFFAOYSA-N 2-methyl-n-[2-[1-[2-(2-methyl-n-(2-methylphenyl)anilino)phenyl]cyclohexyl]phenyl]-n-(2-methylphenyl)aniline Chemical compound CC1=CC=CC=C1N(C=1C(=CC=CC=1)C1(CCCCC1)C=1C(=CC=CC=1)N(C=1C(=CC=CC=1)C)C=1C(=CC=CC=1)C)C1=CC=CC=C1C MAUWVEYTZRYXDX-UHFFFAOYSA-N 0.000 description 1
- BTEAMLUWLVUBFF-UHFFFAOYSA-N 5-(3-methylphenyl)-4-phenylcyclohexa-2,4-diene-1,1-diamine Chemical compound CC=1C=C(C=CC1)C1=C(C=CC(C1)(N)N)C1=CC=CC=C1 BTEAMLUWLVUBFF-UHFFFAOYSA-N 0.000 description 1
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 1
- 229910020366 ClO 4 Inorganic materials 0.000 description 1
- 101100496858 Mus musculus Colec12 gene Proteins 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- 229910004529 TaF 5 Inorganic materials 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- JFBZPFYRPYOZCQ-UHFFFAOYSA-N [Li].[Al] Chemical compound [Li].[Al] JFBZPFYRPYOZCQ-UHFFFAOYSA-N 0.000 description 1
- 229910000272 alkali metal oxide Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- SGUXGJPBTNFBAD-UHFFFAOYSA-L barium iodide Chemical compound [I-].[I-].[Ba+2] SGUXGJPBTNFBAD-UHFFFAOYSA-L 0.000 description 1
- OOULUYZFLXDWDQ-UHFFFAOYSA-L barium perchlorate Chemical compound [Ba+2].[O-]Cl(=O)(=O)=O.[O-]Cl(=O)(=O)=O OOULUYZFLXDWDQ-UHFFFAOYSA-L 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 239000010406 cathode material Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- GBRBMTNGQBKBQE-UHFFFAOYSA-L copper;diiodide Chemical compound I[Cu]I GBRBMTNGQBKBQE-UHFFFAOYSA-L 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- -1 for example Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- INHCSSUBVCNVSK-UHFFFAOYSA-L lithium sulfate Inorganic materials [Li+].[Li+].[O-]S([O-])(=O)=O INHCSSUBVCNVSK-UHFFFAOYSA-L 0.000 description 1
- OTCKOJUMXQWKQG-UHFFFAOYSA-L magnesium bromide Chemical compound [Mg+2].[Br-].[Br-] OTCKOJUMXQWKQG-UHFFFAOYSA-L 0.000 description 1
- SJCKRGFTWFGHGZ-UHFFFAOYSA-N magnesium silver Chemical compound [Mg].[Ag] SJCKRGFTWFGHGZ-UHFFFAOYSA-N 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- DCZNSJVFOQPSRV-UHFFFAOYSA-N n,n-diphenyl-4-[4-(n-phenylanilino)phenyl]aniline Chemical compound C1=CC=CC=C1N(C=1C=CC(=CC=1)C=1C=CC(=CC=1)N(C=1C=CC=CC=1)C=1C=CC=CC=1)C1=CC=CC=C1 DCZNSJVFOQPSRV-UHFFFAOYSA-N 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical class OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000128 polypyrrole Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229910001631 strontium chloride Inorganic materials 0.000 description 1
- AHBGXTDRMVNFER-UHFFFAOYSA-L strontium dichloride Chemical compound [Cl-].[Cl-].[Sr+2] AHBGXTDRMVNFER-UHFFFAOYSA-L 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- YRGLXIVYESZPLQ-UHFFFAOYSA-I tantalum pentafluoride Chemical compound F[Ta](F)(F)(F)F YRGLXIVYESZPLQ-UHFFFAOYSA-I 0.000 description 1
- RBTVSNLYYIMMKS-UHFFFAOYSA-N tert-butyl 3-aminoazetidine-1-carboxylate;hydrochloride Chemical compound Cl.CC(C)(C)OC(=O)N1CC(N)C1 RBTVSNLYYIMMKS-UHFFFAOYSA-N 0.000 description 1
- DLYUQMMRRRQYAE-UHFFFAOYSA-N tetraphosphorus decaoxide Chemical compound O1P(O2)(=O)OP3(=O)OP1(=O)OP2(=O)O3 DLYUQMMRRRQYAE-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8723—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、有機ＥＬ素子、有
機エレクトロルミネセンス素子、有機電界発光素子、有
機ＬＥＤ素子等と称される有機薄膜のエレクトロルミネ
センス現象を利用した有機エレクトロルミネセンス素子
（以下、有機ＥＬ素子という）を用いた有機ＥＬ表示装
置に関するもので、例えばドットマトリクス表示装置な
どのディスプレイパネルや、液晶表示器のバックライト
等に使用され、特に大面積の有機ＥＬ表示装置に好適に
適用され得るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic electroluminescent device utilizing an electroluminescence phenomenon of an organic thin film called an organic EL device, an organic electroluminescent device, an organic electroluminescent device, an organic LED device or the like. The present invention relates to an organic EL display device using an organic EL device, and is used, for example, for a display panel such as a dot matrix display device and a backlight of a liquid crystal display, and is particularly suitable for a large-area organic EL display device. It can be applied to
【０００２】[0002]
【従来の技術】従来、有機ＥＬ表示素子８０は、例えば
図５に示すように構成されている。ガラス基板８１上に
設けたストライプ状のＩＴＯ（Indium Tin Oxide）透明
電極からなる陽極層８２と、その上に積層した有機ＥＬ
層８３と、陽極層８２と直交するストライプ状の陰極層
８４と、から構成されている。2. Description of the Related Art Conventionally, an organic EL display element 80 is constituted, for example, as shown in FIG. An anode layer 82 formed of a stripe-shaped ITO (Indium Tin Oxide) transparent electrode provided on a glass substrate 81, and an organic EL layer laminated thereon
It is composed of a layer 83 and a striped cathode layer 84 orthogonal to the anode layer 82.
【０００３】このような構成の有機ＥＬ素子８０によれ
ば、一対の電極８２、８４間に図示しない電源から所望
の電力を供給することにより、電極８２、８４間に挟ま
れた有機ＥＬ層８３から発光が生じ、これが視認される
ものとなる。この例においては、ストライプ状の電極を
用いた単純ドットマトリクス型としているので、ストラ
イプ状の陽極層８２および陰極層８４に所望の信号を入
力することにより、各電極間に挟まれた有機ＥＬ層８３
をドット単位で発光を制御することができる。According to the organic EL element 80 having such a configuration, by supplying desired power from a power source (not shown) between the pair of electrodes 82 and 84, the organic EL layer 83 sandwiched between the electrodes 82 and 84 is provided. Then, light emission is generated, and this is visually recognized. In this example, since a simple dot matrix type using stripe-shaped electrodes is used, a desired signal is input to the stripe-shaped anode layer 82 and the cathode layer 84, so that the organic EL layer sandwiched between the electrodes is formed. 83
Can be controlled in dot units.
【０００４】陽極層８２は、ニッケル、金、白金、パラ
ジウムやこれらの合金或いは酸化錫（ＳｎＯ２）、沃化
銅などの仕事関数の大きな金属やそれらの合金、化合
物、更にはポリピロール等の導電性ポリマーなどを用い
ることができるが、一般にはＩＴＯ透明電極が多く用い
られている。陰極層８４は、電子注入性に優れた材料を
用いることが好ましく、電子注入効率の向上が図れる仕
事関数の小さな金属材料（低仕事関数金属材料）が用い
られている。一般的にはマグネシウム−銀や、アルミニ
ウム−リチウム等が用いられている。有機ＥＬ層８３
は、例えば陽極層８２側から順に正孔輸送層８３ａと有
機発光層８３ｂを積層した２層構造とされ、正孔輸送層
８３ａとしてはＮ，Ｎ−ジフェニル−Ｎ，―ビス（３−
メチルフェニル）１，１−ビフェニル−４，４−ジアミ
ン（Triphenyldiamine、以下ＴＰＤと略記する）を、有
機発光層８３ｂとしてはトリス（８−ヒドロキシキナリ
ナト）アルミニウム（Tris(8-hydroxyquinolinato)Alum
inium、以下Ａｌｑと略記する）等が用いられている。The anode layer 82 is made of nickel, gold, platinum, palladium, alloys thereof, or metals having a large work function such as tin oxide (SnO 2) or copper iodide, or alloys or compounds thereof, or conductive materials such as polypyrrole. Although a polymer or the like can be used, an ITO transparent electrode is generally used in many cases. For the cathode layer 84, it is preferable to use a material having an excellent electron injecting property, and a metal material having a small work function (low work function metal material) capable of improving electron injection efficiency is used. Generally, magnesium-silver and aluminum-lithium are used. Organic EL layer 83
Has, for example, a two-layer structure in which a hole transport layer 83a and an organic light emitting layer 83b are laminated in this order from the anode layer 82 side. As the hole transport layer 83a, N, N-diphenyl-N, -bis (3-
Methylphenyl) 1,1-biphenyl-4,4-diamine (Triphenyldiamine, hereinafter abbreviated as TPD), and tris (8-hydroxyquinolinato) aluminum (Tris (8-hydroxyquinolinato) Alum
inium, hereinafter abbreviated as Alq).
【０００５】このような構成の有機ＥＬ素子８０を大気
中でそのまま駆動した場合には、低電圧で発光が可能な
反面、湿気や熱等により劣化が促進され発光特性が劣化
する。特に、素子の周囲に酸素や水分があった場合に
は、酸化が促進され有機材料の変質、膜の剥がれ、ダー
クスポット（非発光部）が成長し発光しなくなるなどの
現象が表れ、結果として寿命が短いという問題がある。When the organic EL element 80 having such a configuration is driven as it is in the atmosphere, it can emit light at a low voltage, but on the other hand, its deterioration is accelerated by moisture, heat and the like, and its light emission characteristics deteriorate. In particular, when there is oxygen or moisture around the device, oxidization is promoted, and phenomena such as deterioration of the organic material, peeling of the film, dark spots (non-light emitting portions) growing and no light emission appear, and as a result, There is a problem that the life is short.
【０００６】そこで、このような問題に対して、有機Ｅ
Ｌ素子が大気に触れないように封止することが提案され
ている。例えば図６に示す有機ＥＬ表示装置９０は、有
機ＥＬ素子８０を形成した一方の素子基板８１と、有機
ＥＬ層８３等を覆うように所定の間隔を隔てて対向配設
した他方の封止基板９１と、有機ＥＬ層８３が外気に曝
されないよう両基板８１、９１間を接着固定して封止す
るシール層９２と、該シール層よりも外側に引き出され
た陽極層８２および陰極層８４とからなる。また、封止
基板９１の内面には乾燥剤９３を配設して封止空間９４
内における水分量を低減させている。封止基板９１とし
ては例えばステンレス製の金属板等が用いられ、乾燥剤
９３としては例えば酸化バリウム粉末をテープ等で固定
して用いる。[0006] To solve such a problem, organic E
It has been proposed to seal the L element so that it does not come into contact with the atmosphere. For example, an organic EL display device 90 shown in FIG. 6 includes one element substrate 81 on which an organic EL element 80 is formed, and the other sealing substrate which is disposed to face the organic EL layer 83 and the like with a predetermined interval therebetween. 91, a seal layer 92 for bonding and fixing the two substrates 81 and 91 to each other so that the organic EL layer 83 is not exposed to the outside air, and an anode layer 82 and a cathode layer 84 drawn out of the seal layer. Consists of A desiccant 93 is provided on the inner surface of the sealing substrate 91 to form a sealing space 94.
The amount of water inside is reduced. As the sealing substrate 91, for example, a metal plate made of stainless steel is used, and as the desiccant 93, for example, barium oxide powder is used by being fixed with a tape or the like.
【０００７】このような構成の有機ＥＬ表示装置９０に
よれば、有機ＥＬ素子８０が外部雰囲気に曝されること
がないので、ダークスポット不良の発生等が抑制され寿
命を長くした有機ＥＬ表示装置が提供される。According to the organic EL display device 90 having such a structure, the organic EL element 80 is not exposed to the external atmosphere, so that the occurrence of dark spot defects is suppressed and the organic EL display device has a longer life. Is provided.
【０００８】[0008]
【発明が解決しようとする課題】ところで、このような
有機ＥＬ表示装置９０を用いた平面ディスプレイパネル
は実用化され始めており、ＴＦＴを用いたパッシブマト
リクスカラーディスプレイも発表されており、有機ＥＬ
表示装置９０を大面積化、軽量化するための検討もなさ
れてきている。例えば、発光エリア（表示部）を大面積
化するために上記した有機ＥＬ表示装置９０の面積をそ
のまま大きくすると、有機ＥＬ素子８０を傷つけ電流リ
ークやショートが発生することがあった。この原因は、
有機ＥＬ素子を形成したガラス基板８１および封止基板
９１が自重によりたわみが発生し、たわみ量が多い場合
には封止空間９４内において有機ＥＬ素子８０と封止基
板９１若しくは乾燥剤９３とがぶつかりあい、これによ
り有機ＥＬ素子８０を傷つけ、電極間でショートした
り、電極と封止基板等との接触によるリーク電流が発生
したりしたものと思われる。また、軽量化、薄型化のた
めにガラス基板８１および／または封止基板９１を薄く
したり、封止空間９４の基板間距離を小さくした場合に
おいても、同様のリークやショートが発生した。これら
のリークやショートは、振動テストにより顕著に発生す
る。そのため、携帯・移動機器に使用したり、振動の生
じやすい機器に使用する場合には、たわみの発生しにく
い条件の基板、基板間距離、面積とした有機ＥＬ表示装
置としなければならないため必然的に厚い表示装置とな
り、軽量化、薄型化、大面積化の全ての条件を低コスト
で満たすことは難しかった。By the way, a flat display panel using such an organic EL display device 90 has begun to be put into practical use, and a passive matrix color display using a TFT has been announced.
Studies have been made to reduce the area and weight of the display device 90. For example, if the area of the organic EL display device 90 is increased as it is in order to enlarge the light emitting area (display section), the organic EL element 80 may be damaged, causing a current leak or a short circuit. This is because
The glass substrate 81 and the sealing substrate 91 on which the organic EL elements are formed are bent by their own weight. When the amount of bending is large, the organic EL elements 80 and the sealing substrate 91 or the desiccant 93 are sealed in the sealing space 94. It is thought that the collision caused damage to the organic EL element 80, causing a short circuit between the electrodes, or a leak current due to contact between the electrodes and the sealing substrate or the like. Further, even when the glass substrate 81 and / or the sealing substrate 91 are made thinner for reducing the weight and thickness, or when the distance between the substrates in the sealing space 94 is made smaller, the same leak or short circuit occurs. These leaks and short circuits are remarkably generated by the vibration test. Therefore, when used in a portable / mobile device or in a device that is liable to vibrate, an organic EL display device having a substrate, a distance between the substrates, and an area that is unlikely to be bent must be used. It is difficult to satisfy all the conditions of weight reduction, thinning and large area at low cost.
【０００９】そこで、かかる問題を解決するために、図
６において有機ＥＬ素子８０上に紫外線硬化樹脂を塗布
形成し、その後に有機ＥＬ素子の発光エリア（表示部）
全面を露光して封止空間９４内を樹脂層にて固定した有
機ＥＬ表示装置９０を作成した。この場合においては、
上記した問題は発生しなくなったものの、有機ＥＬ素子
８０を形成した後に、有機ＥＬ素子上に樹脂層にて固定
する必要があるため、製造工程が煩雑であった。また、
一般に有機ＥＬ素子は、有機ＥＬ層８３に用いられる有
機材料の耐水性、耐溶剤性、耐熱性が低く、使用する陰
極材料の耐湿性も低いために、有機ＥＬ層を形成した後
の工程において、有機ＥＬ素子上に積層するために使用
できる樹脂材料が限定される。更に素子全体を覆うこと
は、製造コストが高くなると共に、全体の重量が増加す
る傾向にある。さらに有機ＥＬ素子８０全体を覆うため
熱膨張係数の相違等に起因して陰極界面での剥離が発生
し、特に薄型大面積を実現するためには大きな支障とな
っていた。Therefore, in order to solve such a problem, an ultraviolet curable resin is applied on the organic EL element 80 in FIG. 6 and then the light emitting area (display section) of the organic EL element is formed.
The entire surface was exposed to produce an organic EL display device 90 in which the inside of the sealing space 94 was fixed with a resin layer. In this case,
Although the above-mentioned problem no longer occurs, the manufacturing process is complicated because it is necessary to fix the organic EL element 80 on the organic EL element with a resin layer after forming the organic EL element 80. Also,
In general, the organic EL element has low water resistance, solvent resistance, and heat resistance of the organic material used for the organic EL layer 83, and low humidity resistance of the cathode material used. In addition, resin materials that can be used for lamination on an organic EL element are limited. Further, covering the entire element tends to increase the manufacturing cost and increase the overall weight. Further, since the entire organic EL element 80 is covered, separation at the cathode interface occurs due to a difference in thermal expansion coefficient and the like, which has been a serious obstacle to realizing a thin and large area.
【００１０】本発明は、以上の点から、薄型化、大面積
化、軽量化の可能な、有機ＥＬ素子を封止した有機ＥＬ
表示装置およびその製造方法を提供することを目的とし
ている。In view of the above, the present invention provides an organic EL device in which an organic EL element is sealed, which can be reduced in thickness, increased in area, and reduced in weight.
It is an object to provide a display device and a method for manufacturing the same.
【００１１】[0011]
【課題を解決するための手段】上記目的は、本発明の態
様によれば、（１）第１電極と、有機材料を含む発光層
を備えた有機ＥＬ層と、第２電極を積層形成した有機Ｅ
Ｌ素子を設けた設置基板、および上記有機ＥＬ素子を覆
い設置基板と対向配設した封止基板により閉空間中に有
機ＥＬ素子を封止した有機ＥＬ表示装置において、上記
有機ＥＬ素子の発光エリア内には有機ＥＬ層とともに非
導電性のスペーサを有しており、上記スペーサは有機Ｅ
Ｌ素子表面よりも封止基板側に突出し、且つ少なくとも
設置基板および／または封止基板がたわんで閉空間が狭
まった際に封止基板内面に当接する厚みを有し、閉空間
を形成する両基板内面間の間隙が１０〜１００μｍの範
囲である、ことを特徴とする有機ＥＬ表示装置、により
達成される。According to an aspect of the present invention, there is provided a liquid crystal display device comprising: (1) a first electrode, an organic EL layer having a light emitting layer containing an organic material, and a second electrode. Organic E
In an organic EL display device in which an organic EL element is sealed in a closed space by an installation substrate provided with an L element and a sealing substrate that covers the organic EL element and is disposed to face the installation substrate, the light emitting area of the organic EL element Has a non-conductive spacer together with the organic EL layer.
A projection that projects toward the sealing substrate from the surface of the L element and has a thickness that abuts against the inner surface of the sealing substrate when at least the installation substrate and / or the sealing substrate flexes and narrows the closed space; This is achieved by an organic EL display device, wherein the gap between the inner surfaces of the substrates is in the range of 10 to 100 μm.
【００１２】この態様では、大面積化したり、薄い基板
を用いたり、基板間距離を極めて小さくした有機ＥＬ表
示装置を作成した場合であっても、基板間にスペーサが
存在するのでショートやリークの発生を防止した有機Ｅ
Ｌ表示装置を提供することができ得る。In this embodiment, even when an organic EL display device having a large area, a thin substrate, or an extremely small inter-substrate distance is used, short-circuits and leaks occur because of the presence of the spacer between the substrates. Organic E which prevented generation
An L display device may be provided.
【００１３】また、上記目的はさらに、（２）上記スペ
ーサの設置面積が、有機ＥＬ素子の発光エリアの面積に
対し１０％以下である（１）に記載の有機ＥＬ表示装
置、および（３）上記スペーサは６０μｍ以下の径の柱
状をなして第１電極上に形成されており、有機ＥＬ素子
の発光エリア内に点在している（２）に記載の有機ＥＬ
表示装置、により達成される。これらの態様によれば、
スペーサの占有面積を小さくして非発光部となるスペー
サ設置箇所が目立ちにくい有機ＥＬ表示装置を提供する
ことができ、（３）の場合には観察者の近傍で直接観視
する表示装置において、発光（表示）部内にスペーサに
よる非発光部が存在する場合であっても、さらにスペー
サが目立ちにくい有機ＥＬ表示が提供でき得る。The above object is further achieved by: (2) the organic EL display device according to (1), wherein the installation area of the spacer is 10% or less of the area of the light emitting area of the organic EL element; and (3) The organic EL according to (2), wherein the spacer is formed on the first electrode in the form of a column having a diameter of 60 μm or less, and is scattered in a light emitting area of the organic EL element.
Display device. According to these aspects,
It is possible to provide an organic EL display device in which the occupied area of the spacer is reduced so that the spacer installation portion serving as a non-light emitting portion is not conspicuous. Even when a non-light emitting portion due to the spacer exists in the light emitting (display) portion, it is possible to provide an organic EL display in which the spacer is less noticeable.
【００１４】また、上記目的は、（４）上記スペーサが
感光性樹脂を含み１０μｍ以上の厚みである（１）〜
（３）のいずれかに記載の有機ＥＬ表示装置、の発明の
態様により達成できる。この態様によれば、従来では得
ることのできなかった位にギャップを狭くして薄形化を
図り且つ面積を大きくした有機ＥＬ表示装置が、比較的
簡便な構造で提供され、上記した目的が達成される。[0014] The object of the present invention is also as follows. (4) The spacer has a thickness of 10 µm or more including a photosensitive resin.
This can be achieved by the aspect of the invention of the organic EL display device according to any one of (3). According to this aspect, an organic EL display device in which the gap is narrowed to a point where it could not be obtained in the past, the thickness is reduced, and the area is increased is provided with a relatively simple structure. Achieved.
【００１５】また、本発明の他の態様によれば、（５）
設置基板上に第１電極を形成する工程と、第１電極上に
有機ＥＬ層および第２電極を形成して有機ＥＬ素子を作
成する工程と、封止基板を設置基板に対向配設して有機
ＥＬ素子を覆って封止する工程とを順に実施して有機Ｅ
Ｌ表示装置を製造する方法において、上記第１電極形成
工程と有機ＥＬ素子形成工程の間に、第１電極上に感光
性樹脂材料層を形成し、これを露光して所定形状のスペ
ーサを設けるスペーサ形成工程を実施する、ことを特徴
とする有機ＥＬ表示装置の製造方法、により比較的簡便
な方法で、上記目的を達成する有機ＥＬ表示装置を得る
ことができる。さらに、（６）上記スペーサ形成工程が
スペーサ形成後に物理的な基板洗浄を実施するサブ工程
を含む（５）に記載の有機ＥＬ表示装置の製造方法によ
り、上記目的が達成できる。この態様によれば、有機Ｅ
Ｌ素子を形成した後の状態で洗浄することの困難な有機
ＥＬ素子において、有機ＥＬ層を形成する前の段階で念
入りに洗浄を実施することができるので、スペーサを設
けることで発生しがちな埃塵等の付着物による汚染を防
止して、ダークスポット等の発生原因と推定される付着
物等が殆ど存在しない清浄な状態の第１電極上に有機Ｅ
Ｌ層を形成し、安定した特性の有機ＥＬ素子を歩留まり
よく製造することができ得る。According to another aspect of the present invention, (5)
A step of forming a first electrode on an installation substrate, a step of forming an organic EL layer and a second electrode on the first electrode to produce an organic EL element, and disposing a sealing substrate to face the installation substrate. And sealing the organic EL element in this order.
In the method for manufacturing an L display device, a photosensitive resin material layer is formed on the first electrode between the first electrode forming step and the organic EL element forming step, and is exposed to provide a spacer having a predetermined shape. An organic EL display device that achieves the above object can be obtained by a relatively simple method by a method for manufacturing an organic EL display device, which includes performing a spacer forming step. Further, the above object can be achieved by the method for manufacturing an organic EL display device according to (5), wherein (6) the spacer forming step includes a sub-step of physically cleaning the substrate after forming the spacer. According to this embodiment, the organic E
In an organic EL element that is difficult to clean after the L element is formed, cleaning can be performed carefully before the organic EL layer is formed. Prevention of contamination by extraneous matter such as dust and organic E on the first electrode in a clean state where there is almost no extraneous matter presumed to be a cause of dark spots or the like.
By forming the L layer, an organic EL device having stable characteristics can be manufactured with high yield.
【００１６】[0016]
【発明の実施の形態】以下、この発明の好適な実施形態
を図１から図６を参照しながら、詳細に説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to FIGS.
【００１７】図１および図２は、本発明による有機ＥＬ
表示装置の一実施形態の構成を示している。有機ＥＬ表
示装置１は、ガラス等からなる透光性基板２と、その表
面に形成した有機ＥＬ素子１０と、有機ＥＬ素子１０が
水分等の外部雰囲気の影響を受けないように有機ＥＬ素
子１０から所定の間隔を隔てて配設した封止基板３と、
両基板２，３を接着固定する外周部に設けられたシール
４と、から構成されており、これにより閉空間となる封
止空間５が両基板間に形成される。また、封止空間５内
の封止基板３表面には乾燥手段６が配設されている。FIGS. 1 and 2 show an organic EL according to the present invention.
1 shows a configuration of an embodiment of a display device. The organic EL display device 1 includes a translucent substrate 2 made of glass or the like, an organic EL element 10 formed on the surface thereof, and an organic EL element 10 so that the organic EL element 10 is not affected by an external atmosphere such as moisture. A sealing substrate 3 disposed at a predetermined distance from
And a seal 4 provided on an outer peripheral portion for bonding and fixing the two substrates 2 and 3, whereby a sealed space 5 which is a closed space is formed between the two substrates. A drying unit 6 is provided on the surface of the sealing substrate 3 in the sealing space 5.
【００１８】上記有機ＥＬ子１０は、透光性基板２表面
に形成された透光性の第１電極１１と、第１電極１１上
に積層した有機化合物からなる発光層を備えた有機ＥＬ
層１２と、第１電極と仕事関数の異なる第２電極１３
を、例えば蒸着法により順次積層して形成する。また、
必要に応じて有機ＥＬ素子１０を覆う封止層１４が、例
えば無機化合物膜と有機化合物膜とを積層形成する等の
方法により形成されている。また、第１電極１１と第２
電極１３は、その一部が封止空間５の外部の基板端部に
まで延長され、この第１電極１１と第２電極１３との間
に電界を印加することにより有機ＥＬ層１２にて発光
し、第１電極１１および透光性基板２を透過して光りが
出射される。図１においてはシール４にて囲まれた封止
空間５内の第１電極１１と第２電極１３とが重なってい
る領域が発光（表示）エリア７となる。The organic EL element 10 includes a first light-transmitting electrode 11 formed on the surface of the light-transmitting substrate 2 and a light-emitting layer made of an organic compound laminated on the first electrode 11.
Layer 12 and second electrode 13 having a different work function from the first electrode
Are sequentially laminated by, for example, a vapor deposition method. Also,
If necessary, a sealing layer 14 covering the organic EL element 10 is formed by a method such as laminating an inorganic compound film and an organic compound film. Also, the first electrode 11 and the second
The electrode 13 is partially extended to the end of the substrate outside the sealing space 5, and emits light in the organic EL layer 12 by applying an electric field between the first electrode 11 and the second electrode 13. Then, light is emitted through the first electrode 11 and the light transmitting substrate 2. In FIG. 1, a region where the first electrode 11 and the second electrode 13 overlap in the sealing space 5 surrounded by the seal 4 is a light emitting (display) area 7.
【００１９】以上の構成は、従来の有機ＥＬ表示装置と
ほぼ同様の構成であるが、本発明実施形態による有機Ｅ
Ｌ表示装置１においては、以下の点で異なる構成になっ
ている。有機ＥＬ表示素子１０と封止基板３の間の封止
空間５には、非導電性材料からなる柱状のスペーサ８が
配設され、封止空間５のギャップの極小値を制御して有
機ＥＬ素子１０と封止基板３もしくは乾燥手段６、即ち
有機ＥＬ素子１０と対向する封止基板３の内面側表面が
接触することを防止している。スペーサ８は第１電極１
１表面上もしくは透光性基板２表面上に形成されてお
り、かつ、封止した有機ＥＬ表示装置１の発光（表示）
エリア７の領域内に少なくとも１個以上が存在してい
る。The above configuration is almost the same as that of the conventional organic EL display device.
The L display device 1 has a different configuration in the following points. In the sealing space 5 between the organic EL display element 10 and the sealing substrate 3, a columnar spacer 8 made of a non-conductive material is provided, and the minimum value of the gap in the sealing space 5 is controlled to control the organic EL. The contact between the element 10 and the sealing substrate 3 or the drying means 6, that is, the inner surface of the sealing substrate 3 facing the organic EL element 10 is prevented. The spacer 8 is the first electrode 1
Light emission (display) of the organic EL display device 1 formed on the surface of one or the surface of the translucent substrate 2 and sealed.
There is at least one or more in the area 7.
【００２０】上記のような有機ＥＬ表示装置１を形成す
るには、例えば図３に示す工程により製造する。まず、
有機ＥＬ素子１０を形成するための透光性基板２を準備
する。好適にはＩＴＯ透明電極付きガラス基板２を用意
し、公知のフォトリスグラフィ工程を実施して所定形状
のパターニングを施して洗浄する。図３（ａ）はガラス
基板２表面の略全域にＩＴＯ透明電極からなる第１電極
１１を形成した後の状態を示す。In order to form the organic EL display device 1 as described above, it is manufactured, for example, by the process shown in FIG. First,
The translucent substrate 2 for forming the organic EL element 10 is prepared. Preferably, a glass substrate 2 with an ITO transparent electrode is prepared, a known photolithography process is performed, patterning of a predetermined shape is performed, and cleaning is performed. FIG. 3A shows a state after the first electrode 11 made of an ITO transparent electrode is formed over substantially the entire surface of the glass substrate 2.
【００２１】次に図３（ｂ）に示したスペーサ形成工程
を実施する。第１電極１１上に感光性樹脂層２２をスピ
ンナー、ロールコータ、スプレー等を用いて塗布形成
し、プリベークを施した後にスペーサ設置位置に応じた
開口を有する露光マスク２０を介して光線２１を照射し
て露光、現像、リンス、ポストベーク等の処理を施す。
これにより図３（ｃ）に示したようにスペーサ８が第１
電極１１上に形成される。感光性樹脂として紫外線など
の所定の波長の光線を照射することで照射部分の樹脂が
重合して硬化する性質を有するネガタイプを用いる場合
には、スペーサ設置位置に開口部を形成し他の領域に遮
光膜を形成した露光マスク２０を用いる。Next, a spacer forming step shown in FIG. 3B is performed. A photosensitive resin layer 22 is applied and formed on the first electrode 11 using a spinner, a roll coater, a spray, or the like, and after prebaking, is irradiated with a light beam 21 through an exposure mask 20 having an opening corresponding to a spacer installation position. Then, processing such as exposure, development, rinsing, and post baking is performed.
As a result, as shown in FIG.
It is formed on the electrode 11. When using a negative type that has the property that the resin at the irradiated part is polymerized and cured by irradiating a light beam of a predetermined wavelength such as ultraviolet light as the photosensitive resin, an opening is formed at the spacer installation position and another area is formed. An exposure mask 20 having a light-shielding film is used.
【００２２】スペーサ８は、図３（ｃ）のように第１電
極１１上に柱状に形成され、発光（表示）エリア７内に
おいて点在するようにする。スペーサ８を設けた箇所は
非発光部となるので、発光（表示）エリア７内に形成す
る際には該領域全体に対して該領域内に形成するスペー
サ総面積が２０％以下、実用的には１０％以下、対角２
０インチ以下の有機ＥＬ表示装置の場合には０．００１
〜２％以下の占有面積とすることが好ましい。スペーサ
占有面積が大きくなると非発光部が欠陥として目立って
くるようになるからである。街頭の大型表示装置のよう
に観察者との距離が著しく離れている表示装置や全面に
拡散板等を設ける表示装置などのように、用途によって
はスペーサ占有面積が２０％より大きいものであっても
実質的に欠陥として認識されないものならば、これより
も大きな占有面積を占めていても構わないが、効率が低
下するので実用的ではない。また、スペーサ８は後に形
成する有機ＥＬ素子１０よりも、その先端が封止基板３
側に突出する高さを有していなければならない。The spacers 8 are formed in a column shape on the first electrode 11 as shown in FIG. 3C, and are scattered in the light emitting (display) area 7. Since the portion where the spacer 8 is provided is a non-light emitting portion, when the light emitting (display) area 7 is formed in the area, the total area of the spacer formed in the area is 20% or less of the entire area. Is less than 10%, diagonal 2
0.001 for an organic EL display device of 0 inch or less
It is preferable to set the occupied area to ２2% or less. This is because if the area occupied by the spacer increases, the non-light-emitting portion becomes noticeable as a defect. Depending on the application, the space occupied by the spacer may be larger than 20%, such as a display device that is far away from the observer, such as a large display device on the street, or a display device in which a diffusion plate is provided on the entire surface. If it is not recognized as a defect, it may occupy a larger area, but it is not practical because the efficiency is reduced. Further, the tip of the spacer 8 is closer to the sealing substrate 3 than the organic EL element 10 to be formed later.
Must have a height protruding to the side.
【００２３】次に有機ＥＬ層形成工程を実施する。図３
（ｄ）に示すようにスペーサ８を設けた透光性基板２上
に蒸着法等を用いて有機ＥＬ層１２および第２電極１３
を連続して形成する。有機ＥＬ層１２は、第１電極１１
−第２電極１２間に通電することにより有機ＥＬ層１２
から所望の発光が得られる有機材料が用いられる。例え
ば、第１電極を陽極、第２電極を陰極とした場合には、
第１電極１１側から順に、正孔注入輸送層と有機発光層
の２層構造として形成したり、さらに有機発光層上に陰
極から電子を注入され易くする機能を有する電子輸送層
を設けた３層構造の有機ＥＬ層１２とする。有機ＥＬ層
１２は、これに限らず正孔注入層／正孔輸送層／発光層
／電子輸送層、正孔注入層／正孔輸送層／発光層、正孔
輸送層／発光層／電子輸送層とした多層構造を低分子系
の有機化合物を真空蒸着法を用いて構成したものや単層
有機化合物層を形成した構成などでも良い。本発明にお
いて有機ＥＬ層とは有機材料を含む発光層を備えたこれ
らの様々な構成の層を総称して広義の意味で用いてい
る。例えば、低分子系の有機材料としては正孔輸送層は
芳香族アミン誘導体のジトリル−ジフェニル−ビフェニ
ル−ジアミン（ＴＰＤ）やビス（ジトリルアミノフェニ
ル）シクロヘキサン（ＴＰＡＣ）などを用いることがで
き、有機発光層としてはトリス（８−キノリノラト）ア
ルミニウム錯体（Ａｌｑ）等を用いることができる。有
機発光層にドーパントを添加することによりアンドープ
発光層を用いた素子に比べて異なる発光波長の素子を得
ることができる。有機ＥＬ層１２は真空蒸着法等のドラ
イプロセスを用いて成膜すると良い。有機ＥＬ層１２お
よび第２電極１３をドライプロセスにて形成する場合に
は各層の界面が汚染されないように真空を保った環境下
にて連続して成膜する。Next, an organic EL layer forming step is performed. FIG.
As shown in (d), the organic EL layer 12 and the second electrode 13 are formed on the light transmitting substrate 2 provided with the spacers 8 by using an evaporation method or the like.
Are formed continuously. The organic EL layer 12 includes the first electrode 11
The organic EL layer 12
An organic material capable of obtaining desired light emission is used. For example, when the first electrode is an anode and the second electrode is a cathode,
In order from the first electrode 11 side, a two-layer structure of a hole injecting and transporting layer and an organic light emitting layer was formed, and further, an electron transporting layer having a function of easily injecting electrons from a cathode was provided on the organic light emitting layer. The organic EL layer 12 has a layer structure. The organic EL layer 12 is not limited thereto, and may be a hole injection layer / a hole transport layer / a light emitting layer / an electron transport layer, a hole injection layer / a hole transport layer / a light emitting layer, a hole transport layer / a light emitting layer / an electron transport. The multi-layered structure of the layers may be formed by using a low molecular weight organic compound by a vacuum evaporation method or may be formed by forming a single-layer organic compound layer. In the present invention, the term “organic EL layer” is used in a broad sense to refer to these various layers having a light emitting layer containing an organic material. For example, as a low molecular weight organic material, the hole transport layer can use an aromatic amine derivative such as ditolyl-diphenyl-biphenyl-diamine (TPD) and bis (ditolylaminophenyl) cyclohexane (TPAC). As the light emitting layer, a tris (8-quinolinolato) aluminum complex (Alq) or the like can be used. By adding a dopant to the organic light emitting layer, an element having a different emission wavelength can be obtained as compared with an element using an undoped light emitting layer. The organic EL layer 12 is preferably formed using a dry process such as a vacuum evaporation method. When the organic EL layer 12 and the second electrode 13 are formed by a dry process, they are continuously formed in an environment where a vacuum is maintained so that the interface between the layers is not contaminated.
【００２４】また、有機ＥＬ層１２を形成する前には洗
浄工程を実施する。本発明においては透光性基板２表面
に柱状のスペーサ８を形成した後、有機ＥＬ層形成工程
に入るまでの間に第１電極１１表面に少なくとも物理的
な洗浄工程を施すことが好適である。物理的な洗浄工程
とは、基板表面をブラシで摩擦して基板表面に付着した
埃等を除去する等の物理的な接触を用いた洗浄工程を意
味する。一般的に、有機ＥＬ素子は大気中に放置するだ
けでダークスポットと呼ばれる非発光領域が拡大する現
象が生じる。そのため有機ＥＬ層形成工程を実施した後
に水洗等の工程も行う物理的な洗浄工程を実施すること
は殆ど不可能であるが、本願発明においては有機ＥＬ層
形成工程を実施する前にスペーサ８が形成してあるので
水洗等を伴う物理的な洗浄工程を実施することができ
る。よって、埃等を高効率で除去した有機ＥＬ素子を得
ることができ、塵等の微少付着物質に起因する不良が低
減する。スペーサ８は洗浄工程を実施した後に、高い割
合で残存するようにして形成する。枚葉式ブラシ洗浄機
を用いたテストではポリスチレン系化学増幅型レジスト
により形成した柱状スペーサは略１００％の確率で洗浄
前の膜厚、外観形状を保っていた。また、アセトン、イ
ソプロピルアルコールや半導体洗浄用の中性洗浄液中に
浸漬して行った超音波洗浄においてもまったく問題がな
かった。Before the organic EL layer 12 is formed, a cleaning step is performed. In the present invention, it is preferable to perform at least a physical cleaning step on the surface of the first electrode 11 before forming the organic EL layer forming step after forming the columnar spacers 8 on the surface of the translucent substrate 2. . The physical cleaning step means a cleaning step using physical contact such as removing the dust and the like attached to the substrate surface by rubbing the substrate surface with a brush. Generally, a phenomenon in which a non-light-emitting region called a dark spot expands when an organic EL element is left alone in the air occurs. For this reason, it is almost impossible to perform a physical cleaning step in which a step such as water washing is performed after the organic EL layer forming step is performed. However, in the present invention, the spacer 8 is formed before the organic EL layer forming step is performed. Since it is formed, a physical cleaning step involving washing with water or the like can be performed. Therefore, an organic EL element from which dust and the like are removed with high efficiency can be obtained, and defects due to minute attachment substances such as dust can be reduced. The spacers 8 are formed so as to remain at a high ratio after performing the cleaning step. In a test using a single-wafer brush washer, the columnar spacer formed of a polystyrene-based chemically amplified resist maintained the film thickness and appearance before cleaning with a probability of approximately 100%. Also, there was no problem in ultrasonic cleaning performed by dipping in acetone, isopropyl alcohol or a neutral cleaning solution for cleaning semiconductors.
【００２５】有機ＥＬ層形成工程が終了した後には封止
工程を実施する。図３（ｅ）は封止工程を示す。封止基
板３表面に乾燥手段６を設け、封止基板３と有機ＥＬ素
子１０を形成した透光性基板２とを所定の封止空間５が
得られるように対向配設し、有機ＥＬ素子１０の周囲部
分をシール４を介して接着固定する。このとき、スペー
サ８が封止基板３もしくは乾燥手段６に直接に接触する
ように、または当接しないようにして封止する。封止工
程実施時においてスペーサ８が封止基板３内表面に当接
しないようにして封止した場合には、封止基板３もしく
は透光性基板２がたわむ等して封止空間５の容積が小さ
くなったときにスペーサ８が封止基板内表面に当接する
ものとし、その際に封止基板３内表面と有機ＥＬ素子１
０とが直接にぶつからないような高さのスペーサ８とす
る。スペーサ８が有機ＥＬ素子表面から突出する寸法は
概ね１０〜１００μｍが好ましい。スペーサ８の弾力性
によっても異なるが、これより薄いと封止基板３内表面
と有機ＥＬ素子１０とが接触しやすくなり、厚いと薄型
化のメリットが乏しいからである。After the organic EL layer forming step is completed, a sealing step is performed. FIG. 3E shows a sealing step. A drying unit 6 is provided on the surface of the sealing substrate 3, and the sealing substrate 3 and the light-transmitting substrate 2 on which the organic EL element 10 is formed are disposed so as to face each other so as to obtain a predetermined sealing space 5. The peripheral portion of 10 is adhered and fixed via the seal 4. At this time, the sealing is performed such that the spacer 8 is in direct contact with the sealing substrate 3 or the drying unit 6 or is not in contact therewith. When the sealing is performed such that the spacer 8 does not contact the inner surface of the sealing substrate 3 during the sealing process, the sealing substrate 3 or the translucent substrate 2 is bent and the volume of the sealing space 5 is increased. When the distance becomes smaller, the spacer 8 comes into contact with the inner surface of the sealing substrate.
The spacer 8 has a height such that 0 does not directly collide with the spacer 8. The dimension of the spacer 8 projecting from the surface of the organic EL element is preferably about 10 to 100 μm. Although it depends on the elasticity of the spacer 8, if the thickness is smaller than this, the inner surface of the sealing substrate 3 easily contacts the organic EL element 10, and if the thickness is larger, the merit of thinning is poor.
【００２６】この実施形態においては、封止基板内面の
スペーサ８と当接する箇所には乾燥手段６を設けないよ
うにしているので、スペーサ８の厚みとしては少なくと
も［乾燥手段６＋有機ＥＬ層１２＋第２電極１３］の厚
みよりも厚くしなければならない。乾燥手段６を封止基
板３内面の全域に形成した場合にはスペーサ８が乾燥手
段６に当接する。通常はスペーサ占有面積を小さくする
ために断面積の小さな柱状スペーサ８とするので、乾燥
手段６にスペーサ８が当接するようにするとスペーサ８
が乾燥手段を貫通したり、斜め方向の力が加わって折れ
たりすることもあり得るので、スペーサ８が封止基板３
に直接に当接するようにした方が好ましい。ただし、ス
ペーサ８の［短辺側の径／高さ］の比率を略２以上とし
た場合には、かかる問題はほとんど発生しなかった。In this embodiment, since the drying means 6 is not provided at a position in contact with the spacer 8 on the inner surface of the sealing substrate, the thickness of the spacer 8 is at least [drying means 6 + the organic EL layer 12 + the 2 electrode 13]. When the drying unit 6 is formed on the entire inner surface of the sealing substrate 3, the spacer 8 comes into contact with the drying unit 6. Usually, since the columnar spacers 8 having a small cross-sectional area are used in order to reduce the area occupied by the spacers, when the spacers 8 are brought into contact with the drying means 6, the spacers 8 are formed.
May penetrate the drying means, or may be broken by the application of an oblique force.
It is preferable that the contact is made directly. However, when the ratio of [diameter / height on the short side] of the spacer 8 was about 2 or more, such a problem hardly occurred.
【００２７】なお、乾燥手段６は例えば水分を捕らえる
乾燥剤を両面テープで封止基板表面に固定した後に表面
をテープにて覆って固定したり、乾燥剤を結着樹脂内に
分散させて基板表面に塗膜を形成するなどして得ること
ができる。乾燥剤としては例えば活性炭、ゼオライト、
活性アルミナ、シリカゲルなどの水分を物理的に吸着す
る乾燥剤や、水分を化学的に吸着する五酸化二燐（Ｐ２
Ｏ５）、酸化バリウム（ＢａＯ）、酸化カルシウム（Ｃ
ａＯ）、酸化マグネシウム（ＭｇＯ）、酸化ナトリウム
（Ｎａ２Ｏ）などのアルカリ金属酸化物、硫酸リチウム
（Ｌｉ２ＳＯ４）、硫酸ナトリウム（Ｎａ２ＳＯ４）、
硫酸カルシウム（ＣａＳｏ４）などの硫酸塩、塩化カル
シウム（ＣａＣｌ２）、塩化ストロンチウム（ＳｒＣｌ
２）、弗化タンタル（ＴａＦ５）、臭化マグネシウム
（ＭｇＢｒ２）、沃化バリウム（ＢａＩ２）などの金属
ハロゲン化物、過塩素酸バリウム（Ｂａ（ＣｌＯ
４）２）などの過塩素酸塩などを用いることができる。
これらは、粒径を１〜３０μｍ、好適には約１０μｍ以
下としたものが好ましい。粒径が大きすぎると有機ＥＬ
表示装置が厚くなるし、スペーサ８が封止基板３表面に
直接に当接するようにして形成した場合には、その分ス
ペーサ８を厚く設けなければならなくなるからである。
なお、乾燥剤の平均粒径を１０μｍ以下と細かくした場
合には封止基板３に散布するのみでも基板に付着するの
で特別に固定することなく乾燥手段６とすることもでき
る。The drying means 6 may be, for example, a desiccant for capturing moisture fixed on the surface of the sealing substrate with a double-sided tape and then fixed by covering the surface with a tape, or by dispersing the desiccant in a binder resin to form a substrate. It can be obtained by forming a coating film on the surface. As a drying agent, for example, activated carbon, zeolite,
A drying agent such as activated alumina and silica gel which physically adsorbs moisture, and a phosphoric pentoxide (P 2
O 5 ), barium oxide (BaO), calcium oxide (C
aO), alkali metal oxides such as magnesium oxide (MgO), sodium oxide (Na 2 O), lithium sulfate (Li 2 SO 4 ), sodium sulfate (Na 2 SO 4 ),
Sulfates such as calcium sulfate (CaSo 4 ), calcium chloride (CaCl 2 ), strontium chloride (SrCl
2), fluoride tantalum (TaF 5), magnesium bromide (MgBr 2), metal halides such as barium iodide (BaI 2), barium perchlorate (Ba (ClO
4) Perchlorates such as 2 ) can be used.
These preferably have a particle size of 1 to 30 μm, preferably about 10 μm or less. Organic EL if particle size is too large
This is because if the display device becomes thicker and the spacer 8 is formed so as to directly contact the surface of the sealing substrate 3, the spacer 8 must be provided thicker accordingly.
When the average particle size of the desiccant is reduced to 10 μm or less, it can be used as the drying means 6 without being specially fixed, because it can be attached to the sealing substrate 3 even if it is sprayed only.
【００２８】以上の工程により有機ＥＬ表示装置１を形
成する。このようにして形成した有機ＥＬ表示装置１は
比較的低コストで薄型化、大面積化、軽量化を図ること
ができ、特に大面積の有機ＥＬ表示装置１を得る際に非
常に有効である。The organic EL display 1 is formed by the above steps. The organic EL display device 1 formed in this manner can be made relatively thin at a relatively low cost, and can be made thinner, larger in area, and lighter in weight. This is very effective in obtaining the organic EL display device 1 having a large area. .
【００２９】スペーサ８は、柱状のものに限らず壁状に
形成したものであっても構わないし、ＩＴＯ電極上のみ
でなく透光性基板２上に直接形成するものであっても構
わない。また、スペーサ８をＳｉＯ２などの無機化合物
により第１電極１１全面に形成した後に公知のフォトリ
ソグラフィ法を用いて形成することにより得ることも可
能である。しかしながらスペーサ８は、上記した理由に
より実用的には１０μｍ以上、好適には１５〜４０μｍ
程度の厚みで、且つ、物理的な洗浄工程にも耐えられる
必要があるので、感光性樹脂材料からなるスペーサを用
いることが実用的である。通常の半導体フォトリスグラ
フィーにて多用されているフォトレジストは厚く形成す
る場合であっても概ね５μｍ程度の厚みが上限であるの
で、好ましくは化学増幅型ネガレジストを用いると良
い。また、１度に所望厚みのスペーサ８を得るのが困難
な場合には、これらの材料の任意の組合せからなる多層
構造のスペーサ８としても良い。The spacer 8 is not limited to a columnar one and may be formed in a wall shape, or may be formed directly on the light transmitting substrate 2 as well as on the ITO electrode. Alternatively, the spacer 8 can be obtained by forming the spacer 8 on the entire surface of the first electrode 11 using an inorganic compound such as SiO 2 and using a known photolithography method. However, the spacer 8 is practically 10 μm or more, preferably 15 to 40 μm for the above-described reason.
It is necessary to use a spacer made of a photosensitive resin material because it is necessary to have a thickness of about the same level and to withstand a physical cleaning step. Even if the photoresist used frequently in ordinary semiconductor photolithography is formed to be thick, the thickness of the photoresist is generally about 5 μm as the upper limit, so that a chemically amplified negative resist is preferably used. If it is difficult to obtain a spacer 8 having a desired thickness at one time, a spacer 8 having a multilayer structure made of an arbitrary combination of these materials may be used.
【００３０】以下、具体的な実施例について図３に示す
工程図を参照しながら説明する。 （実施例）透光性基板２として厚さ０．３ｍｍの１５０
ｍｍ×１５０ｍｍのガラス基板を用意し、その表面上に
有機ＥＬ表示装置に対応する所定パターンのＩＴＯ透明
電極からなる第１電極１１を０．２μｍ形成した。その
上にポリスチレン系化学増幅型ネガレジスト（ＪＳＲ社
製ＢＰＲ５０１Ｈ、粘度１６０ｃＰｓ）をスピンナーに
より塗布、プリベークを施して約２０μｍの感光性樹脂
層２２を形成した。約５０μｍの方形の開口部を有する
露光マスク２０を介して紫外線２１により露光（３６５
ｎｍ、２００ｍＪ／ｃｍ２）し、現像、リンス、ポスト
ベーク処理を施して柱状のスペーサ８を形成した。図４
（ａ）はスペーサ間ピッチを約１５０μｍとして多数形
成したスペーサ８の顕微鏡観察結果で、図４（ｂ）がそ
の拡大観察結果である。なお、発光（表示）エリア７の
大きさは２６ｍｍ×３６ｍｍである。次に、この基板を
枚葉式ブラシ洗浄によるガラス基板洗浄装置（大日本ス
クリーン製）にてブラシ洗浄、薬品洗浄を施した後に、
真空チャンバー内にセットした。有機ＥＬ層１２として
正孔輸送層としてＴＰＤおよび有機発光層としてＡｌｑ
をそれぞれ２０ｎｍずつ連続して真空蒸着法により成膜
した。その後、第２電極１３としてＡｌ−Ｌｉ合金から
なる陰極を成膜マスクを用いて５０ｎｍ蒸着して有機Ｅ
Ｌ素子１０を形成した。次に、厚さ０．３ｍｍの１５０
ｍｍ×１５０ｍｍのガラス製の封止基板３表面に平均粒
径が約１０μｍのＢａＯ粒子を散布した乾燥手段６を設
けておいた基板を、乾燥手段６が有機ＥＬ素子１０と対
向するようにして貼り合せ、有機ＥＬ素子周辺部をシー
ル４により接着固定して封止した。その後図示しないス
クライブ装置により切断してシール４の外側のガラス基
板２，３を除去して有機ＥＬ表示装置を得た。このよう
にして作成した有機ＥＬ表示装置１は、ノギスにて測定
したところ略０．６５ｍｍの厚さであった。Hereinafter, a specific embodiment will be described with reference to the process chart shown in FIG. (Example) As the light-transmitting substrate 2, 150 having a thickness of 0.3 mm was used.
A glass substrate of mm × 150 mm was prepared, and a first electrode 11 composed of an ITO transparent electrode having a predetermined pattern corresponding to an organic EL display device was formed on the glass substrate to a thickness of 0.2 μm. A polystyrene-based chemically amplified negative resist (BPR501H manufactured by JSR, viscosity: 160 cPs) was applied thereon by a spinner and prebaked to form a photosensitive resin layer 22 of about 20 μm. Exposure (365) with ultraviolet rays 21 through an exposure mask 20 having a square opening of about 50 μm.
nm, 200 mJ / cm2), followed by development, rinsing, and post-baking to form columnar spacers 8. FIG.
FIG. 4A is a microscopic observation result of a large number of spacers 8 formed with a spacer pitch of about 150 μm, and FIG. 4B is an enlarged observation result thereof. The size of the light emitting (display) area 7 is 26 mm × 36 mm. Next, the substrate is subjected to brush cleaning and chemical cleaning with a glass substrate cleaning apparatus (manufactured by Dainippon Screen) by single-wafer brush cleaning.
It was set in a vacuum chamber. TPD as the hole transport layer as the organic EL layer 12 and Alq as the organic light emitting layer
Were continuously formed by a vacuum evaporation method in a thickness of 20 nm. Thereafter, a cathode made of an Al—Li alloy is deposited as a second electrode 13 to a thickness of 50 nm using a film forming mask to form an organic E layer.
The L element 10 was formed. Next, 150 mm with a thickness of 0.3 mm
A substrate provided with a drying unit 6 in which BaO particles having an average particle size of about 10 μm are sprayed on the surface of a glass sealing substrate 3 having a size of 150 mm × 150 mm is placed in such a manner that the drying unit 6 faces the organic EL element 10. The peripheral portion of the organic EL element was bonded and fixed with a seal 4 and sealed. Thereafter, the glass substrate was cut by a scribe device (not shown) to remove the glass substrates 2 and 3 outside the seal 4 to obtain an organic EL display device. The organic EL display device 1 produced in this manner had a thickness of about 0.65 mm when measured with a vernier caliper.
【００３１】比較例として、スペーサ形成工程を実施し
ない以外は、すべて同一条件にて有機ＥＬ表示装置も作
製し、実施例サンプルおよび比較例サンプルについて寿
命試験等を実施した。その結果、両サンプルとも初期特
性、寿命特性とも大きな違いはなかったが、各サンプル
の有機ＥＬ表示装置の中心部に重りを載せた状態で温度
環境テストを実施したところ、比較例サンプルにおいて
はリークやショートの発生が見られたが、実施例サンプ
ルにおいてはリークやショートの発生が観察されなかっ
た。なお、ダークスポットの発生・成長等の様子や発光
特性については顕著な違いはなかった。As a comparative example, an organic EL display device was also manufactured under the same conditions except that the spacer forming step was not performed, and a life test and the like were performed on the example sample and the comparative example sample. As a result, there was no significant difference between the initial characteristics and the life characteristics of both samples. However, when the temperature environment test was performed with a weight placed on the center of the organic EL display device of each sample, the leakage was found in the comparative sample. Although a short circuit or short circuit was observed, no leak or short circuit was observed in the example sample. It should be noted that there was no remarkable difference in the appearance and growth of dark spots and the light emission characteristics.
【００３２】本発明実施形態による有機ＥＬ表示装置は
以上のように構成されており、薄型化、大面積化、軽量
化を図ることができ、比較的簡便な方法で製造すること
ができる。特に大画面化を図った場合や、薄い厚さの基
板を用いた場合においては、基板のたわみ量が大きくな
るため、スペーサを設ける本発明が好適に適用され得
る。The organic EL display device according to the embodiment of the present invention is configured as described above, and can be made thinner, larger in area and lighter in weight, and can be manufactured by a relatively simple method. In particular, when the screen is enlarged or when a substrate having a small thickness is used, the amount of deflection of the substrate increases, so that the present invention in which a spacer is provided can be suitably applied.
【００３３】尚、上記した実施形態は、本発明の好適な
具体例であるから、技術的に好ましい種々の限定が付さ
れているが、本発明の範囲はこれらの態様に限られるも
のではない。例えば第１電極を陽極、第２電極を陰極と
した例で説明したが、第１電極を陰極、第２電極を陽極
とした構成の有機ＥＬ素子１０とすることもできる。ま
た、有機ＥＬ素子１０を設置した基板である透光性基板
２側から光りを照射するのではなく封止基板３側から光
りを照射する場合には、例えばプラスチック性の透光性
基板２の外面にアルミニウム反射膜を設け、封止基板３
を透光性プラスチックにより形成して封止基板３側から
光りを照射する構成とすることもできる。また、平面発
光素子の発光（表示）エリア内にスペーサを設ける例で
説明したが、単純マトリクスやアクティブマトリクスの
ようなドットマトリクス表示装置において、その表示画
素以外の走査電極等の上にスペーサを設けたり、表示画
素で形成する電極間に設ける等の種々の応用も本願発明
に包含される。Although the above-described embodiment is a preferred specific example of the present invention, various technically preferable limitations are given, but the scope of the present invention is not limited to these embodiments. . For example, although an example has been described in which the first electrode is an anode and the second electrode is a cathode, the organic EL element 10 may have a configuration in which the first electrode is a cathode and the second electrode is an anode. In the case where light is irradiated from the sealing substrate 3 side instead of the light transmitting substrate 2 side on which the organic EL element 10 is installed, for example, the plastic light transmitting substrate 2 An aluminum reflective film is provided on the outer surface, and the sealing substrate 3
May be formed of a light-transmitting plastic to irradiate light from the sealing substrate 3 side. Also, in the example described above, the spacer is provided in the light emitting (display) area of the flat light emitting element. However, in a dot matrix display device such as a simple matrix or an active matrix, the spacer is provided on a scanning electrode or the like other than the display pixel. The present invention also includes various applications such as providing between electrodes formed by display pixels.
【００３４】[0034]
【発明の効果】以上述べたように、本発明によれば、薄
型化、大面積化、軽量化を図った有機ＥＬ表示装置が提
供できる。As described above, according to the present invention, an organic EL display device having a reduced thickness, a larger area, and a reduced weight can be provided.
【図１】本発明に係る有機ＥＬ表示装置の一実施形態の
概略平面図である。FIG. 1 is a schematic plan view of an embodiment of an organic EL display device according to the present invention.
【図２】図１の有機ＥＬ表示装置のＡ−Ａ線断面図であ
る。FIG. 2 is a cross-sectional view taken along line AA of the organic EL display device of FIG.
【図３】本発明に係る有機ＥＬ表示装置の製造工程を
（ａ）〜（ｅ）の順に説明する概略断面図である。FIG. 3 is a schematic cross-sectional view for explaining a manufacturing process of the organic EL display device according to the present invention in the order of (a) to (e).
【図４】本発明に係る有機ＥＬ表示装置のスペーサ作成
後の状態を示す顕微鏡観察図である。（ａ）は発光（表
示）エリアに作成したスペーサの正面観察図、 （ｂ）
はその拡大図。FIG. 4 is a microscopic observation view showing a state of the organic EL display device according to the present invention after the spacer is formed. (A) is a front view of the spacer created in the light emitting (display) area, (b)
Is the enlarged view.
【図５】従来の単純ドットマトリクスタイプの有機ＥＬ
素子の構成を説明する概略斜視図である。FIG. 5 shows a conventional simple dot matrix type organic EL.
It is a schematic perspective view explaining the structure of an element.
【図６】従来の封止した有機ＥＬ表示装置の一例を示す
概略断面図である。FIG. 6 is a schematic sectional view showing an example of a conventional sealed organic EL display device.
１，９０ 有機ＥＬ表示装置 ２ 透光性基板 ３，９１ 封止基板 ４ シール ５，９４ 封止空間 ６，９３ 乾燥手段 ７ 発光（表示）エリア ８ スペーサ １０，８０ 有機ＥＬ素子 １１ 第１電極 １２，８３ 有機ＥＬ層 １３ 第２電極 １４ 封止層 ２０ 露光マスク ２１ 光線 ２２ 感光性樹脂層 ８１ ガラス基板 ８２ 陽極層（ＩＴＯ電極） ８４ 陰極層 ９２ シール層 1,90 organic EL display device 2 translucent substrate 3,91 sealing substrate 4 seal 5,94 sealing space 6,93 drying means 7 light emitting (display) area 8 spacer 10,80 organic EL element 11 first electrode 12 , 83 Organic EL layer 13 Second electrode 14 Sealing layer 20 Exposure mask 21 Light beam 22 Photosensitive resin layer 81 Glass substrate 82 Anode layer (ITO electrode) 84 Cathode layer 92 Seal layer
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０５Ｂ 33/22 Ｈ０５Ｂ 33/22 Ｚ Ｆターム(参考） 3K007 AB00 AB11 AB18 BA06 BB01 BB05 CA01 CB01 DA01 DB03 EA00 EB00 FA02 5C094 AA15 AA36 AA43 AA47 BA03 BA27 CA19 DA12 DA13 EA04 EA05 EB02 EC03 FA01 FA02 FB01 FB15 GB01 JA08 ──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 7 Identification code FI Theme coat ゛ (Reference) H05B 33/22 H05B 33/22 Z F term (Reference) 3K007 AB00 AB11 AB18 BA06 BB01 BB05 CA01 CB01 DA01 DB03 EA00 EB00 FA02 5C094 AA15 AA36 AA43 AA47 BA03 BA27 CA19 DA12 DA13 EA04 EA05 EB02 EC03 FA01 FA02 FB01 FB15 GB01 JA08
Claims (6)
えた有機ＥＬ層と、第２電極を積層形成した有機ＥＬ素
子を設けた設置基板、および上記有機ＥＬ素子を覆い設
置基板と対向配設した封止基板により閉空間中に有機Ｅ
Ｌ素子を封止した有機ＥＬ表示装置において、 上記有機ＥＬ素子の発光エリア内には有機ＥＬ層ととも
に非導電性のスペーサを有しており、上記スペーサは有
機ＥＬ素子表面よりも封止基板側に突出し、且つ少なく
とも設置基板および／または封止基板がたわんで閉空間
が狭まった際に封止基板内面に当接する厚みを有し、閉
空間を形成する両基板内面間の間隙が１０〜１００μｍ
の範囲である、ことを特徴とする有機ＥＬ表示装置。An installation substrate provided with an organic EL element having a first electrode, a light-emitting layer containing an organic material, and a second electrode, and an installation substrate covering the organic EL element. Organic E in the closed space by the sealing substrate
In the organic EL display device in which the L element is sealed, a non-conductive spacer is provided in the light emitting area of the organic EL element together with the organic EL layer, and the spacer is closer to the sealing substrate than the surface of the organic EL element. And has a thickness that abuts on the inner surface of the sealing substrate when at least the installation substrate and / or the sealing substrate is bent and the closed space is narrowed, and the gap between the inner surfaces of both substrates forming the closed space is 10 to 100 μm.
An organic EL display device, characterized in that:
子の発光エリアの面積に対し１０％以下である、ことを
特徴とする請求項１に記載の有機ＥＬ表示装置。2. The organic EL display device according to claim 1, wherein an installation area of the spacer is 10% or less of an area of a light emitting area of the organic EL element.
をなして第１電極上に形成されており、有機ＥＬ素子の
発光エリア内に点在している、ことを特徴とする請求項
２に記載の有機ＥＬ表示装置。3. The method according to claim 2, wherein the spacer is formed on the first electrode in the form of a column having a diameter of 60 μm or less, and is scattered in a light emitting area of the organic EL element. The organic EL display device according to the above.
ｍ以上の厚みである、ことを特徴とする請求項１から請
求項３のいずれかに記載の有機ＥＬ表示装置。4. The method according to claim 1, wherein the spacer contains a photosensitive resin and has a thickness of 10 μm.
The organic EL display device according to claim 1, wherein the thickness is not less than m.
と、第１電極上に有機ＥＬ層および第２電極を形成して
有機ＥＬ素子を作成する工程と、封止基板を設置基板に
対向配設して有機ＥＬ素子を覆って封止する工程とを順
に実施して有機ＥＬ表示装置を製造する方法において、 上記第１電極形成工程と有機ＥＬ素子形成工程の間に、
第１電極上に感光性樹脂材料層を形成し、これを露光し
て所定形状のスペーサを設けるスペーサ形成工程を実施
する、ことを特徴とする有機ＥＬ表示装置の製造方法。5. A step of forming a first electrode on an installation substrate, a step of forming an organic EL layer and a second electrode on the first electrode to produce an organic EL element, and a step of attaching a sealing substrate to the installation substrate. A method of manufacturing an organic EL display device by sequentially performing a step of disposing and covering the organic EL element so as to face the organic EL element, wherein the first electrode forming step and the organic EL element forming step
A method for manufacturing an organic EL display device, comprising: forming a photosensitive resin material layer on a first electrode, exposing the photosensitive resin material layer to light, and providing a spacer having a predetermined shape.
に物理的な基板洗浄を実施するサブ工程を含む、ことを
特徴とする請求項５に記載の有機ＥＬ表示装置の製造方
法。6. The method according to claim 5, wherein the step of forming a spacer includes a sub-step of physically cleaning the substrate after the formation of the spacer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000348945A JP2002151252A (en) | 2000-11-16 | 2000-11-16 | Organic el display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000348945A JP2002151252A (en) | 2000-11-16 | 2000-11-16 | Organic el display device |
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| Publication Number | Publication Date |
|---|---|
| JP2002151252A true JP2002151252A (en) | 2002-05-24 |
Family
ID=18822431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000348945A Pending JP2002151252A (en) | 2000-11-16 | 2000-11-16 | Organic el display device |
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| Country | Link |
|---|---|
| JP (1) | JP2002151252A (en) |
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