JP2002038123A - Heat-sensitive adhesive and heat-sensitive adhesive sheet - Google Patents
Heat-sensitive adhesive and heat-sensitive adhesive sheetInfo
- Publication number
- JP2002038123A JP2002038123A JP2000230270A JP2000230270A JP2002038123A JP 2002038123 A JP2002038123 A JP 2002038123A JP 2000230270 A JP2000230270 A JP 2000230270A JP 2000230270 A JP2000230270 A JP 2000230270A JP 2002038123 A JP2002038123 A JP 2002038123A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- sensitive adhesive
- hydroxy
- resin
- adhesive sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 64
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 63
- 239000007787 solid Substances 0.000 claims abstract description 22
- 239000004014 plasticizer Substances 0.000 claims abstract description 21
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 16
- SXJSETSRWNDWPP-UHFFFAOYSA-N (2-hydroxy-4-phenylmethoxyphenyl)-phenylmethanone Chemical compound C=1C=C(C(=O)C=2C=CC=CC=2)C(O)=CC=1OCC1=CC=CC=C1 SXJSETSRWNDWPP-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 abstract description 7
- 150000001875 compounds Chemical class 0.000 abstract description 6
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 abstract description 4
- 229920005989 resin Polymers 0.000 description 19
- 239000011347 resin Substances 0.000 description 19
- -1 polyethylene Polymers 0.000 description 15
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 14
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 13
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 13
- 239000003208 petroleum Substances 0.000 description 8
- 239000002245 particle Substances 0.000 description 7
- 239000006185 dispersion Substances 0.000 description 6
- 125000001931 aliphatic group Chemical group 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000005011 phenolic resin Substances 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 229920002554 vinyl polymer Polymers 0.000 description 4
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- 150000003505 terpenes Chemical class 0.000 description 3
- 235000007586 terpenes Nutrition 0.000 description 3
- LUNMJRJMSXZSLC-UHFFFAOYSA-N 2-cyclopropylethanol Chemical compound OCCC1CC1 LUNMJRJMSXZSLC-UHFFFAOYSA-N 0.000 description 2
- MOZDKDIOPSPTBH-UHFFFAOYSA-N Benzyl parahydroxybenzoate Chemical compound C1=CC(O)=CC=C1C(=O)OCC1=CC=CC=C1 MOZDKDIOPSPTBH-UHFFFAOYSA-N 0.000 description 2
- QFOHBWFCKVYLES-UHFFFAOYSA-N Butylparaben Chemical compound CCCCOC(=O)C1=CC=C(O)C=C1 QFOHBWFCKVYLES-UHFFFAOYSA-N 0.000 description 2
- KCXZNSGUUQJJTR-UHFFFAOYSA-N Di-n-hexyl phthalate Chemical compound CCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCC KCXZNSGUUQJJTR-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000002174 Styrene-butadiene Substances 0.000 description 2
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000002518 antifoaming agent Substances 0.000 description 2
- 229920005601 base polymer Polymers 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 2
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- RRWWMZSWDPQGLO-UHFFFAOYSA-N diethyl 2-hydroxybenzene-1,3-dicarboxylate Chemical compound CCOC(=O)C1=CC=CC(C(=O)OCC)=C1O RRWWMZSWDPQGLO-UHFFFAOYSA-N 0.000 description 2
- 125000004177 diethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- JJXVDRYFBGDXOU-UHFFFAOYSA-N dimethyl 4-hydroxybenzene-1,2-dicarboxylate Chemical compound COC(=O)C1=CC=C(O)C=C1C(=O)OC JJXVDRYFBGDXOU-UHFFFAOYSA-N 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- YKUCHDXIBAQWSF-UHFFFAOYSA-N methyl 3-hydroxybenzoate Chemical compound COC(=O)C1=CC=CC(O)=C1 YKUCHDXIBAQWSF-UHFFFAOYSA-N 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- UEZVMMHDMIWARA-UHFFFAOYSA-M phosphonate Chemical compound [O-]P(=O)=O UEZVMMHDMIWARA-UHFFFAOYSA-M 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920005672 polyolefin resin Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- QELSKZZBTMNZEB-UHFFFAOYSA-N propylparaben Chemical compound CCCOC(=O)C1=CC=C(O)C=C1 QELSKZZBTMNZEB-UHFFFAOYSA-N 0.000 description 2
- 238000010526 radical polymerization reaction Methods 0.000 description 2
- 239000011115 styrene butadiene Substances 0.000 description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 description 2
- 229920001909 styrene-acrylic polymer Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- 125000005591 trimellitate group Chemical group 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- LVTPRIAGCBEGPW-UHFFFAOYSA-N (2-benzoyloxyphenyl) benzoate Chemical compound C=1C=CC=CC=1C(=O)OC1=CC=CC=C1OC(=O)C1=CC=CC=C1 LVTPRIAGCBEGPW-UHFFFAOYSA-N 0.000 description 1
- BYFJLAHGKYACPI-UHFFFAOYSA-N (4-methylphenyl)methyl 4-hydroxybenzoate Chemical compound C1=CC(C)=CC=C1COC(=O)C1=CC=C(O)C=C1 BYFJLAHGKYACPI-UHFFFAOYSA-N 0.000 description 1
- WIZIBEDAPVILNL-UHFFFAOYSA-N 1h-pyrrolo[2,3-b]pyridine-2,3-dione Chemical compound C1=CC=C2C(=O)C(=O)NC2=N1 WIZIBEDAPVILNL-UHFFFAOYSA-N 0.000 description 1
- ZMWRRFHBXARRRT-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4,6-bis(2-methylbutan-2-yl)phenol Chemical compound CCC(C)(C)C1=CC(C(C)(C)CC)=CC(N2N=C3C=CC=CC3=N2)=C1O ZMWRRFHBXARRRT-UHFFFAOYSA-N 0.000 description 1
- OLFNXLXEGXRUOI-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4,6-bis(2-phenylpropan-2-yl)phenol Chemical compound C=1C(N2N=C3C=CC=CC3=N2)=C(O)C(C(C)(C)C=2C=CC=CC=2)=CC=1C(C)(C)C1=CC=CC=C1 OLFNXLXEGXRUOI-UHFFFAOYSA-N 0.000 description 1
- LHPPDQUVECZQSW-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4,6-ditert-butylphenol Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC(N2N=C3C=CC=CC3=N2)=C1O LHPPDQUVECZQSW-UHFFFAOYSA-N 0.000 description 1
- IYAZLDLPUNDVAG-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4-(2,4,4-trimethylpentan-2-yl)phenol Chemical compound CC(C)(C)CC(C)(C)C1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 IYAZLDLPUNDVAG-UHFFFAOYSA-N 0.000 description 1
- QSRJVOOOWGXUDY-UHFFFAOYSA-N 2-[2-[2-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoyloxy]ethoxy]ethoxy]ethyl 3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCC(=O)OCCOCCOCCOC(=O)CCC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 QSRJVOOOWGXUDY-UHFFFAOYSA-N 0.000 description 1
- VFBJXXJYHWLXRM-UHFFFAOYSA-N 2-[2-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]ethylsulfanyl]ethyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCCSCCOC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 VFBJXXJYHWLXRM-UHFFFAOYSA-N 0.000 description 1
- XFDQLDNQZFOAFK-UHFFFAOYSA-N 2-benzoyloxyethyl benzoate Chemical compound C=1C=CC=CC=1C(=O)OCCOC(=O)C1=CC=CC=C1 XFDQLDNQZFOAFK-UHFFFAOYSA-N 0.000 description 1
- ROGIWVXWXZRRMZ-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical compound CC(=C)C=C.C=CC1=CC=CC=C1 ROGIWVXWXZRRMZ-UHFFFAOYSA-N 0.000 description 1
- PVOSMOVHDHSYCE-UHFFFAOYSA-N 2-phenylethyl 4-hydroxybenzoate Chemical compound C1=CC(O)=CC=C1C(=O)OCCC1=CC=CC=C1 PVOSMOVHDHSYCE-UHFFFAOYSA-N 0.000 description 1
- UWSMKYBKUPAEJQ-UHFFFAOYSA-N 5-Chloro-2-(3,5-di-tert-butyl-2-hydroxyphenyl)-2H-benzotriazole Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC(N2N=C3C=C(Cl)C=CC3=N2)=C1O UWSMKYBKUPAEJQ-UHFFFAOYSA-N 0.000 description 1
- ZVVFVKJZNVSANF-UHFFFAOYSA-N 6-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]hexyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCCCCCCOC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 ZVVFVKJZNVSANF-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- AFHAKFAAFZBUJQ-UHFFFAOYSA-N CC.C(C1=CC=CC=C1)(=O)OCO.C(C1=CC=CC=C1)(=O)OCO.C(C1=CC=CC=C1)(=O)OCO Chemical compound CC.C(C1=CC=CC=C1)(=O)OCO.C(C1=CC=CC=C1)(=O)OCO.C(C1=CC=CC=C1)(=O)OCO AFHAKFAAFZBUJQ-UHFFFAOYSA-N 0.000 description 1
- VOWAEIGWURALJQ-UHFFFAOYSA-N Dicyclohexyl phthalate Chemical compound C=1C=CC=C(C(=O)OC2CCCCC2)C=1C(=O)OC1CCCCC1 VOWAEIGWURALJQ-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 1
- XPJVKCRENWUEJH-UHFFFAOYSA-N Isobutylparaben Chemical compound CC(C)COC(=O)C1=CC=C(O)C=C1 XPJVKCRENWUEJH-UHFFFAOYSA-N 0.000 description 1
- CMHMMKSPYOOVGI-UHFFFAOYSA-N Isopropylparaben Chemical compound CC(C)OC(=O)C1=CC=C(O)C=C1 CMHMMKSPYOOVGI-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- ZIJKGAXBCRWEOL-SAXBRCJISA-N Sucrose octaacetate Chemical compound CC(=O)O[C@H]1[C@H](OC(C)=O)[C@@H](COC(=O)C)O[C@@]1(COC(C)=O)O[C@@H]1[C@H](OC(C)=O)[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1 ZIJKGAXBCRWEOL-SAXBRCJISA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 239000001344 [(2S,3S,4R,5R)-4-acetyloxy-2,5-bis(acetyloxymethyl)-2-[(2R,3R,4S,5R,6R)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxyoxolan-3-yl] acetate Substances 0.000 description 1
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 1
- 238000001994 activation Methods 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000012736 aqueous medium Substances 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 150000001565 benzotriazoles Chemical class 0.000 description 1
- 235000013361 beverage Nutrition 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- HAOWVEVISIQKSC-UHFFFAOYSA-N cyclohexyl 4-hydroxybenzoate Chemical compound C1=CC(O)=CC=C1C(=O)OC1CCCCC1 HAOWVEVISIQKSC-UHFFFAOYSA-N 0.000 description 1
- OIVQLSUKOZNNCT-UHFFFAOYSA-N dibenzyl benzene-1,3-dicarboxylate Chemical compound C=1C=CC(C(=O)OCC=2C=CC=CC=2)=CC=1C(=O)OCC1=CC=CC=C1 OIVQLSUKOZNNCT-UHFFFAOYSA-N 0.000 description 1
- KKMCIRDYHDDOEL-UHFFFAOYSA-N dicyclohexyl 4-hydroxybenzene-1,2-dicarboxylate Chemical compound C1CCCCC1OC(=O)C1=CC(O)=CC=C1C(=O)OC1CCCCC1 KKMCIRDYHDDOEL-UHFFFAOYSA-N 0.000 description 1
- SAZCDOMDAJRNDD-UHFFFAOYSA-N dicyclohexyl benzene-1,4-dicarboxylate Chemical compound C=1C=C(C(=O)OC2CCCCC2)C=CC=1C(=O)OC1CCCCC1 SAZCDOMDAJRNDD-UHFFFAOYSA-N 0.000 description 1
- XESMXDXQZBMELS-UHFFFAOYSA-N diethyl 4-hydroxybenzene-1,2-dicarboxylate Chemical compound CCOC(=O)C1=CC=C(O)C=C1C(=O)OCC XESMXDXQZBMELS-UHFFFAOYSA-N 0.000 description 1
- PUZBTHGPBGQFLW-UHFFFAOYSA-N diethyl 5-hydroxybenzene-1,3-dicarboxylate Chemical compound CCOC(=O)C1=CC(O)=CC(C(=O)OCC)=C1 PUZBTHGPBGQFLW-UHFFFAOYSA-N 0.000 description 1
- HJZOAEXBCOTMIU-UHFFFAOYSA-N dimethyl 2-hydroxybenzene-1,3-dicarboxylate Chemical compound COC(=O)C1=CC=CC(C(=O)OC)=C1O HJZOAEXBCOTMIU-UHFFFAOYSA-N 0.000 description 1
- CJOJIAKIRLKBOO-UHFFFAOYSA-N dimethyl 2-hydroxybenzene-1,4-dicarboxylate Chemical compound COC(=O)C1=CC=C(C(=O)OC)C(O)=C1 CJOJIAKIRLKBOO-UHFFFAOYSA-N 0.000 description 1
- VNGOYPQMJFJDLV-UHFFFAOYSA-N dimethyl benzene-1,3-dicarboxylate Chemical compound COC(=O)C1=CC=CC(C(=O)OC)=C1 VNGOYPQMJFJDLV-UHFFFAOYSA-N 0.000 description 1
- JQLRTVBTFCQYFV-UHFFFAOYSA-N diphenyl 2-hydroxybenzene-1,3-dicarboxylate Chemical compound OC1=C(C(=O)OC=2C=CC=CC=2)C=CC=C1C(=O)OC1=CC=CC=C1 JQLRTVBTFCQYFV-UHFFFAOYSA-N 0.000 description 1
- DWNAQMUDCDVSLT-UHFFFAOYSA-N diphenyl phthalate Chemical compound C=1C=CC=C(C(=O)OC=2C=CC=CC=2)C=1C(=O)OC1=CC=CC=C1 DWNAQMUDCDVSLT-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- MCPKSFINULVDNX-UHFFFAOYSA-N drometrizole Chemical compound CC1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 MCPKSFINULVDNX-UHFFFAOYSA-N 0.000 description 1
- 238000010556 emulsion polymerization method Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- MWSMNBYIEBRXAL-UHFFFAOYSA-N ethyl 3-hydroxybenzoate Chemical compound CCOC(=O)C1=CC=CC(O)=C1 MWSMNBYIEBRXAL-UHFFFAOYSA-N 0.000 description 1
- CVEOWBRXZJEZRQ-UHFFFAOYSA-N ethyl 3-hydroxynaphthalene-2-carboxylate Chemical compound C1=CC=C2C=C(O)C(C(=O)OCC)=CC2=C1 CVEOWBRXZJEZRQ-UHFFFAOYSA-N 0.000 description 1
- 239000004403 ethyl p-hydroxybenzoate Substances 0.000 description 1
- 235000010228 ethyl p-hydroxybenzoate Nutrition 0.000 description 1
- 229940043351 ethyl-p-hydroxybenzoate Drugs 0.000 description 1
- NUVBSKCKDOMJSU-UHFFFAOYSA-N ethylparaben Chemical compound CCOC(=O)C1=CC=C(O)C=C1 NUVBSKCKDOMJSU-UHFFFAOYSA-N 0.000 description 1
- 239000003925 fat Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 125000005456 glyceride group Chemical group 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 125000004464 hydroxyphenyl group Chemical group 0.000 description 1
- QQVIHTHCMHWDBS-UHFFFAOYSA-L isophthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC(C([O-])=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-L 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- YVVBECLPRBAATK-UHFFFAOYSA-N methyl 3-hydroxynaphthalene-2-carboxylate Chemical compound C1=CC=C2C=C(O)C(C(=O)OC)=CC2=C1 YVVBECLPRBAATK-UHFFFAOYSA-N 0.000 description 1
- 239000004292 methyl p-hydroxybenzoate Substances 0.000 description 1
- 235000010270 methyl p-hydroxybenzoate Nutrition 0.000 description 1
- LXCFILQKKLGQFO-UHFFFAOYSA-N methylparaben Chemical compound COC(=O)C1=CC=C(O)C=C1 LXCFILQKKLGQFO-UHFFFAOYSA-N 0.000 description 1
- RQAQWBFHPMSXKR-UHFFFAOYSA-N n-(4-chlorophenyl)-3-(phosphonooxy)naphthalene-2-carboxamide Chemical compound OP(O)(=O)OC1=CC2=CC=CC=C2C=C1C(=O)NC1=CC=C(Cl)C=C1 RQAQWBFHPMSXKR-UHFFFAOYSA-N 0.000 description 1
- DKYVVNLWACXMDW-UHFFFAOYSA-N n-cyclohexyl-4-methylbenzenesulfonamide Chemical compound C1=CC(C)=CC=C1S(=O)(=O)NC1CCCCC1 DKYVVNLWACXMDW-UHFFFAOYSA-N 0.000 description 1
- ITYCRFXTOMEQFF-UHFFFAOYSA-N octadecyl 4-hydroxybenzoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C1=CC=C(O)C=C1 ITYCRFXTOMEQFF-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000003002 pH adjusting agent Substances 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- QHDYIMWKSCJTIM-UHFFFAOYSA-N phenyl 1-hydroxynaphthalene-2-carboxylate Chemical compound C1=CC2=CC=CC=C2C(O)=C1C(=O)OC1=CC=CC=C1 QHDYIMWKSCJTIM-UHFFFAOYSA-N 0.000 description 1
- SRMZHGJLSDITLO-UHFFFAOYSA-N phenyl 3-hydroxynaphthalene-2-carboxylate Chemical compound OC1=CC2=CC=CC=C2C=C1C(=O)OC1=CC=CC=C1 SRMZHGJLSDITLO-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000002685 polymerization catalyst Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 230000002335 preservative effect Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- NVNSVQJVBIWZNM-UHFFFAOYSA-N prop-2-enyl 4-hydroxybenzoate Chemical compound OC1=CC=C(C(=O)OCC=C)C=C1 NVNSVQJVBIWZNM-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 229940013883 sucrose octaacetate Drugs 0.000 description 1
- SYDJVRWZOWPNNO-UHFFFAOYSA-N sucrose-benzoate Natural products OCC1OC(OC2(COC(=O)c3ccccc3)OC(CO)C(O)C2O)C(O)C(O)C1O SYDJVRWZOWPNNO-UHFFFAOYSA-N 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 238000007725 thermal activation Methods 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- CBKMOPGKNJBDFA-UHFFFAOYSA-N tricyclohexyl 2-hydroxypropane-1,2,3-tricarboxylate Chemical compound C1CCCCC1OC(=O)CC(C(=O)OC1CCCCC1)(O)CC(=O)OC1CCCCC1 CBKMOPGKNJBDFA-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
Landscapes
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
ãïŒïŒïŒïŒã[0001]
ãçºæã®å±ããæè¡åéãæ¬çºæã¯ãåžžæž©ã§ã¯éç²çæ§
ã§ãããå ç±ã«ããç²çæ§ãçºçŸãããããç²çæ§çºçŸ
åŸãå ç±æºãåãå»ã£ãŠãæ«ãç²çæ§ãæç¶ããæç±æ§
æ¥çå€ããã³æç±æ§æ¥çã·ãŒãã«é¢ãããBACKGROUND OF THE INVENTION The present invention relates to a heat-sensitive adhesive which is non-tacky at room temperature but develops tackiness by heating, and after tackiness is developed, the tackiness is maintained for a while even if a heating source is removed. The present invention relates to a heat-sensitive adhesive sheet.
ãïŒïŒïŒïŒã[0002]
ãåŸæ¥ã®æè¡ãåŸæ¥ã®æç±æ§æ¥çå€ã¯ãå¡åžã»ä¹Ÿç¥åŸã«
ãããŠç²çæ§ãæããªãããã«ããããã«ãæ°Žåæ£åæ¥
çå€ã䜿çšãããå Žåãå€ããäŸãã°ããæ¥ç䟿芧ã
ïŒç¬¬12çãæå55幎ãé«åååè¡äŒçºè¡ïŒã«èšèŒãããŠ
ããããã«ãçµæãšããŠãç±å¯å¡æ§æš¹èãç²çä»äžå€ã
ãã³åºäœå¯å¡å€ãåºæ¬éªšæ Œãšããæ°Žåæ£åæ¥çå€ã䜿çš
ããããç±å¯å¡æ§æš¹èã¯ãæç±æ§æ¥çå€ã®åºæ¬ãšãªãã
ãŒã¹ããªããŒã§ãããç²çåã»æ¥çåã®æ ¹æºãšãªããã®
ã§ãããåºäœå¯å¡å€ã¯ãåºæ¬çã«ã¯ãåžžæž©ã§ã¯åºäœã§ã
ãããæš¹èã«å¯å¡æ§ãäžãããå ç±ã«ãã溶èããŠæš¹è
ãèšæœ€ãããã¯è»åãããããšã«ãã£ãŠãåžžæž©ã§ã¯éç²
çæ§ã®ç²çå€ã«ãç²çæ§ãçºçŸãããæ©èœãæ
ãããã®
éãç²çä»äžå€ãååšããŠãããšãç²çæ§ãäžå±€é¡èã«
çŸããå®çšç¹æ§ãåäžãããå³ã¡ãç²çä»äžå€ã¯ããã
èªèº«æ¥çæ§ãæããªãã§éåžžã¯ç²çæ§ã®ä»äžãæ¥çæ§ã®
åäžçã®ç®çã§ããŒã¹ããªããŒã«é
åãããæåã§ãã
ïŒãç²çãã³ãããã¯ãïŒç¬¬ïŒçïŒãå¹³æïŒå¹Žæ¥æ¬ç²ç
ããŒãå·¥æ¥äŒçºè¡ïŒã2. Description of the Related Art Water-dispersible adhesives are often used in conventional heat-sensitive adhesives so that they do not have tackiness after application and drying. For example, "Glue manual"
As described in (12th edition, published by the Society of Polymer Publishing, 1980), a water-dispersed adhesive having a basic skeleton of a thermoplastic resin, a tackifier and a solid plasticizer is used as a composition. You. A thermoplastic resin is a base polymer that is a basic component of a heat-sensitive adhesive, and is a source of tackiness and adhesion. Solid plasticizers are basically solid at room temperature and therefore do not impart plasticity to the resin.The solid plasticizer melts when heated to swell or soften the resin, giving the adhesive a non-adhesive at room temperature. Responsible for expressing function. At this time, when the tackifier is present, the tackiness is more remarkably exhibited, and the practical characteristics are improved. That is, the tackifier is a component which is usually added to the base polymer for the purpose of imparting tackiness and improving adhesion without itself having adhesiveness ("Adhesion Handbook" (second edition), Published by the Japan Adhesive Tape Industry Association in 1995).
ãïŒïŒïŒïŒãæç±æ§æ¥çå€ã¯ãäžè³ªçŽãã³ãŒãçŽãã¢ãŒ
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ãã©ã¹ããã¯åºæäžã«å¡åžããæç±æ§æ¥çã·ãŒããšãã
ä¿ãæç±æ§æ¥çã·ãŒããéå±ãã¬ã©ã¹ããããã¯ãã©ã¹
ããã¯çã®é¢ã«ã©ãã«çãšããŠè²Œãä»ã䜿çšããããé£
åå
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çšéã«ã¯ãããªãšãã¬ã³ãããªãããã¬ã³çã®ã
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çšéã«ã¯ããªãšãã¬ã³ãã¿ã¬ãŒãã«ä»£è¡šãããããªãšã¹
ãã«ç³»æš¹èãšãã£ãè¡šé¢èªç±ãšãã«ã®ãŒãäœããããã
ãé£æ¥çæ§ã®ãã©ã¹ããã¯å®¹åšã䜿çšãããããšãå€
ãããããã®åéã§ã®ã©ãã«ã«ã¯éåžžã®æ¥çå€ãæå§æ§
æ¥çå€ãã°ã«ãŒç³ãããã¯æç±æ§æ¥çå€ãçšããããŠã
ãã[0003] Heat-sensitive adhesives include paper such as high-quality paper, coated paper, art paper, vapor-deposited paper, synthetic paper, polyethylene, and the like.
Polyolefin resin such as polypropylene, applied on a plastic substrate such as a polyester resin represented by polyethylene terephthalate, to form a heat-sensitive adhesive sheet,
Such a heat-sensitive adhesive sheet is used as a label or the like on a metal, glass, or plastic surface. So-called poorly-adhesive plastic containers with low surface free energy, such as polyolefin resins such as polyethylene and polypropylene for food packaging applications and polyester resins typified by polyethylene phthalate for beverage bottles, cookware, and pharmaceutical bottle applications Is often used. Labels in these fields use conventional adhesives, pressure-sensitive adhesives, glue glues or heat-sensitive adhesives.
ãïŒïŒïŒïŒã[0004]
ãçºæã解決ããããšãã課é¡ãåŸæ¥ã¯ãåºäœå¯å¡å€ãš
ããŠããã¿ã«é
žãšã¹ãã«ç³»ååç©ã䜿çšãããŠãããæ¬
çºæã¯ããã¿ã«é
žãšã¹ãã«ç³»ååç©ãšåæ§ã«ãåºäœå¯å¡
å€ãšããŠåžžæž©ã§ã¯éç²çæ§ã§ãããå ç±ã«ããç²çæ§ã
çºçŸãããããšã®ã§ããååç©ãèŠåºãã該ååç©ãå«
æããæç±æ§æ¥çå€ããã³æç±æ§æ¥çã·ãŒããæäŸãã
ããšãç®çãšãããHeretofore, phthalate compounds have been used as solid plasticizers. The present invention, like the phthalate compound, finds a compound that is non-tacky at room temperature as a solid plasticizer but can exhibit tackiness by heating, and a heat-sensitive adhesive containing the compound and a heat-sensitive adhesive It is intended to provide a functional adhesive sheet.
ãïŒïŒïŒïŒã[0005]
ã課é¡ã解決ããããã®æ段ãæ¬çºæã¯ãç±å¯å¡æ§æš¹è
ããã³åºäœå¯å¡å€ãå«æããæç±æ§æ¥çå€ã«ãããŠãåº
äœå¯å¡å€ãäžèšäžè¬åŒïŒïŒïŒã§ç€ºãããïŒâããããã·
âïŒâãã³ãžã«ãªãã·ãã³ãŸãã§ãã³ãããã¿ã«é
žãšã¹
ãã«ç³»ååç©ãšåæ§ã«ãåºäœå¯å¡å€ãšããŠãåžžæž©ã§ã¯é
ç²çæ§ã§ãããå ç±ã«ããç²çæ§ãçºçŸãããããšã®ã§
ããååç©ã§ããããšãèŠãã ããæ¬çºæãå®æãããSUMMARY OF THE INVENTION The present invention relates to a heat-sensitive adhesive containing a thermoplastic resin and a solid plasticizer, wherein the solid plasticizer is 2-hydroxy-4-benzyloxy represented by the following general formula (1). Benzophenone was found to be a non-tacky compound at room temperature as a solid plasticizer, similar to a phthalic acid ester compound, but could develop tackiness by heating, and completed the present invention.
ãïŒïŒïŒïŒã[0006]
ãåïŒã Embedded image
ãïŒïŒïŒïŒãããªãã¡ã第ïŒã®çºæã¯ãç±å¯å¡æ§æš¹èã
ãã³åºäœå¯å¡å€ãå«æããæç±æ§æ¥çå€ã«ãããŠãåºäœ
å¯å¡å€ãïŒâããããã·âïŒâãã³ãžã«ãªãã·ãã³ãŸã
ã§ãã³ã§ããããšãç¹åŸŽãšããæç±æ§æ¥çå€ã§ãããThat is, the first invention is a heat-sensitive adhesive containing a thermoplastic resin and a solid plasticizer, wherein the solid plasticizer is 2-hydroxy-4-benzyloxybenzophenone. Agent.
ãïŒïŒïŒïŒããŸãã第ïŒã®çºæã¯ãäžèšæç±æ§æ¥çå€
ããåºæã«å¡åžããŠãªãæç±æ§æ¥çã·ãŒãã§ãããFurther, a second invention is a heat-sensitive adhesive sheet obtained by applying the heat-sensitive adhesive to a substrate.
ãïŒïŒïŒïŒã[0009]
ãçºæã®å®æœã®åœ¢æ
ãåžžæž©ã§ã¯éç²çæ§ã®æ¬çºæã®æç±
æ§æ¥çå€ã¯ãïŒâããããã·âïŒâãã³ãžã«ãªãã·ãã³
ãŸãã§ãã³ãå«æãããã®ã§ãããå ç±ããããšã«ãã
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æ¥çå€ã«ã¯ãããã«ç²çä»äžå€ãå«æããããšã«ãã£ãŠ
ãšå®çšç¹æ§ãããåäžãããBEST MODE FOR CARRYING OUT THE INVENTION The heat-sensitive adhesive of the present invention which is non-tacky at room temperature contains 2-hydroxy-4-benzyloxybenzophenone. By heating, the heat-sensitive adhesive becomes tacky. Express. Further, the heat-sensitive adhesive of the present invention further improves practical properties by further containing a tackifier.
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ããšã奜ãŸãããIn the present invention, if necessary, a material known as a solid plasticizer may be used in addition to 2-hydroxy-4-benzyloxybenzophenone as a solid plasticizer. Solid plasticizers used in combination, for example, diphenyl phthalate, dihexyl phthalate, dicyclohexyl phthalate, dicyclohexyl terephthalate, dihydroabiethyl phthalate, dimethyl isophthalate, sucrose benzoate, ethylene glycol dibenzoate, trimethylol tribenzoate Ethane, glyceride tribenzoate, pentaerythritol tetrabenzoate, sucrose octaacetate, tricyclohexyl citrate, N-cyclohexyl-p-toluenesulfonamide, dibenzyl isophthalate, dibenzyl terephthalate, tribenzyl trimellitate, dicyclohexyl terephthalate 1,4-cyclohexanedimethanol ditoluate, 1,4-cyclohexanedimethanol di-p-tert-butylbenzoate, 1,4-bishydroxyethoxyben Njitorueto, 1,4
Cyclohexane dimethanol bisphenyl acetate,
Di-2-phenoxyethyl terephthalate, di-2-phenoxyethyl isophthalate, methyl m-hydroxybenzoate, ethyl m-hydroxybenzoate, phenyl m-hydroxybenzoate, methyl p-hydroxybenzoate,
Ethyl p-hydroxybenzoate, iso-propyl p-hydroxybenzoate, n-propyl p-hydroxybenzoate, n-butyl p-hydroxybenzoate, iso-butyl p-hydroxybenzoate, secondary p-hydroxybenzoate Butyl, n-butyl p-hydroxybenzoate, stearyl p-hydroxybenzoate, cyclohexyl p-hydroxybenzoate, benzyl p-hydroxybenzoate, allyl p-hydroxybenzoate, β-phenylethyl p-hydroxybenzoate, p-hydroxy 4-chlorobenzyl benzoate, 4-methylbenzyl p-hydroxybenzoate, methyl 2-hydroxy-3-naphthoate,
Ethyl 2-hydroxy-3-naphthoate, phenyl 2-hydroxy-3-naphthoate, phenyl 1-hydroxy-2-naphthoate, dimethyl 4-hydroxyphthalate, diethyl 4-hydroxyphthalate, di-hydroxyhydroxyphthalate n-propyl, diiso-propyl 4-hydroxyphthalate, dicyclohexyl 4-hydroxyphthalate, dimethyl 2-hydroxyisophthalate, diethyl 2-hydroxyisophthalate, diphenyl 2-hydroxyisophthalate, dimethyl 4-hydroxyisophthalate, 4- Phenolic hydroxyl group-containing aromatic carboxylic esters such as diethyl hydroxyisophthalate, diethyl 5-hydroxyisophthalate, and dimethyl hydroxyterephthalate, catechol dibenzoate, pentaerythritol tetrakis [3- (3,5 -Di-tert-butyl-4-hydroxyphenyl) propionate], thiodiethylenebis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate], ethylenebis (oxyethylene) bis [3- (5-tert-butyl-4-
Hydroxy-m-tolyl) propionate], hexamethylenebis [3- (3,5-di-tert-butyl-4)
-Hydroxyphenyl) propionate], 2- (2H-benzotriazol-2-yl) -p-cresol, 2- (2H-benzotriazol-2-yl) -4,6-bis ( 1-methyl-1-phenylethyl) phenol, 2-benzotriazol-2-yl-4,6-di-tert-butylphenol, 2- [5-chloro (2H) -benzotriazol-2-yl)]-4 -Methyl-6- (tert-butyl) phenol, 2,4-di-tert-butyl-6-
(5-chlorobenzotriazol-2-yl) phenol, 2- (2H-benzotriazol-2-yl)-
4,6-di-tert-pentylphenol, 2- (2
H-benzotriazol-2-yl) -4- (1,1,
Benzotriazole compounds such as (3,3-tetramethylbutyl) phenol, triphenylphosphine, 1,3
-Phenylenebis (dixylenylphosphate), diethyl [[3,5-bis (1,1-dimethylethyl) -4]
Phosphorus-based compounds such as -hydroxyphenyl] methyl] phosphonate. When another solid plasticizer is used in combination, pentaerythritol tetrabenzoate, tribenzyl trimellitate, benzyl p-hydroxybenzoate, hexamethylene Bis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate], 2-
(2H-benzotriazol-2-yl) -4- (1,
1,3,3-tetramethylbutyl) phenol, diethyl [[3,5-bis (1,1-dimethylethyl) -4-
It is preferred to use [hydroxyphenyl] methyl] phosphonate.
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ã§æç±æ§æ¥çå€ã«äŸããããšã奜ãŸãããThe dispersed particle size of 2-hydroxy-4-benzyloxybenzophenone considerably affects the smoothness of the surface to which the heat-sensitive adhesive is applied. If the particle size is too large, the heat-sensitive adhesive is applied. Since the smoothness of the coated surface of the heat-sensitive adhesive sheet is deteriorated and the thermal activation time is prolonged, it is preferable to adjust the maximum particle diameter to 50 ÎŒm or less. On the other hand, if the particle size of 2-hydroxy-4-benzyloxybenzophenone is too small, the blocking resistance of the heat-sensitive adhesive sheet tends to deteriorate, so that the minimum particle size is 0.1 ÎŒm or more and the average particle size is 1 ÎŒm or more. It is preferably 2 to 5 ÎŒm from a practical viewpoint. The 2-hydroxy-4-benzyloxybenzophenone is mechanically pulverized in the presence of an aqueous resin having a protective colloid function, a surfactant, or a mixture of both, to give an aqueous dispersion of particles of the above size. 2-hydroxy-4-benzyloxybenzophenone is preferably provided to the heat-sensitive adhesive in the form of such an aqueous dispersion.
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åãšãªãããããThe thermoplastic resin used in the present invention includes acrylic, styrene-acrylic, styrene-butadiene, styrene-butadiene-acrylic, and the like.
Ethylene-vinyl acetate, ethylene-vinyl acetate-vinyl chloride, ethylene-vinyl chloride, ethylene-vinyl acetate-acryl, ethylene-vinyl acetate-acrylate, vinyl acetate, vinyl acetate-acryl,
Polymers such as ethylene-acrylic, butadiene-based, urethane-based, styrene-isoprene-based, isoprene-based, acrylonitrile-butadiene-based, and isobutylene-based polymers can be used, and one or more of them can be used in combination. Among these thermoplastic resins, in particular, acrylic, styrene-acrylic,
Styrene-butadiene, ethylene-vinyl acetate, ethylene-vinyl acetate-vinyl chloride, and ethylene-vinyl acetate-acrylic polymers are preferred. Further, the glass transition temperature of these thermoplastic resins is preferably 50 ° C. or lower. When the glass transition temperature is higher than 50 ° C., the tackiness when the heat-sensitive adhesive is activated by heat tends to be insufficient.
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ããšãã§ãããAmong the thermoplastic resins used in the present invention, those obtained by radical polymerization can be obtained, for example, by a usual emulsion polymerization method. That is, in a dispersion system having water, a surfactant, each monomer, and a radical polymerization catalyst as the basic components, the monomers are polymerized, and a polymer as a thermoplastic resin can be obtained in an aqueous dispersion state.
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æãŸãããç¹ã«ããžã³ãšã¹ãã«ç³»ã奜ãŸãããAs the tackifier for improving the adhesive performance of the heat-sensitive adhesive, conventionally known tackifiers can be used. However, those having a low softening temperature have poor blocking resistance, so that the softening temperature is 80 ° C. or higher. Are preferred. In the present invention, like the 2-hydroxy-4-benzyloxybenzophenone and the thermoplastic resin, it is more preferable that the tackifier is also incorporated into the heat-sensitive adhesive in the form of an aqueous dispersion. Examples of the tackifier include terpene resin, aliphatic petroleum resin, aromatic petroleum resin, cumarone-indene resin, phenol resin, terpene-phenol resin, rosin derivative (rosin, polymerized rosin, hydrogenated rosin and their glycerin, Esters with pentaerythritol, resin acid dimer, etc.), among which rosin derivatives are desirable, and rosin ester compounds are particularly desirable.
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ããšãã§ãããThe tackifiers may be used alone or in combination of two or more. That is, as the combination of the heat-sensitive adhesive, terpene resin and aliphatic petroleum resin,
Aromatic petroleum resin and cumarone-indene resin, terpene-phenol resin and rosin derivative, terpene resin and rosin derivative, aliphatic petroleum resin and rosin derivative, aromatic petroleum resin and rosin derivative, cumarone-indene resin and rosin derivative It is also possible to use a mixture of two or more of a phenol resin and a rosin derivative, or three or more of a rosin derivative, an aliphatic petroleum resin and an aromatic petroleum resin.
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ããæåã§ãããThe 2-hydroxy-4-benzyloxybenzophenone, thermoplastic resin, and tackifier used in the heat-sensitive adhesive of the present invention have a property of melting or softening when heated. ,
The state after melting or softening differs. That is, 2-hydroxy-4-benzyloxybenzophenone exhibits a distinct melting point, and after melting does not itself have tackiness. On the other hand, the thermoplastic resin itself has tackiness after softening. Further, the tackifier has a smaller molecular weight than a thermoplastic resin and does not itself have adhesiveness / tackiness after softening, but is a component that contributes to imparting tackiness and improving adhesiveness.
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ããIn addition, fillers and the like can be added to the heat-sensitive adhesive of the present invention in a range not to impair the object of the present invention. For example, inorganic substances such as titanium oxide, alumina, kaolin, and talc; Organic substances such as natural waxes, synthetic waxes, and natural fats and oils, and resin powders can be used. Further, if necessary, a dispersant, an antifoaming agent, a leveling agent, a lubricant, a thickener, a preservative, an ultraviolet absorber, an antioxidant, a pH adjuster, a surfactant and the like can be used.
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åªäœãé€å»ããããšã«ãã£ãŠåŸãããšãã§ãããThe heat-sensitive adhesive sheet of the present invention can be obtained by applying the above-mentioned heat-sensitive adhesive in an aqueous dispersion state to a substrate, and removing the aqueous medium.
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ãŠãè¯ããThe heat-sensitive adhesive can be applied to the substrate using various coating apparatuses such as a gravure coater, an air doctor coater, a floating knife coater, a die coater, and a lip coater. For example, it may be provided so as to cover one entire surface of the base material, or may be provided so as to cover both ends or the periphery of one surface of the base material, and a stripe shape on one surface of the base material, They may be provided in a lattice or dot shape.
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ãŒãçŽã®äžæ¹ã®é¢ã«ã也ç¥æã®å¡åžéãïŒïŒg/m2ãšãªã
ããã«å¡åžããïŒïŒâã§ïŒåé也ç¥ããæç±æ§æ¥çã·ãŒ
ããåŸãã該ã·ãŒãã¯ã也ç¥åŸã®ç¶æ
ã§ã¯ç²çæ§ã¯ãªã
ã£ããæç±æ§æ¥çã·ãŒãã«ã€ããŠã以äžã«ç€ºãããã«ã
ãŠæ¥çåã®è©äŸ¡ãè¡ãããã®çµæãè¡šïŒã«ç€ºããThe present invention will be specifically described below with reference to examples. However, the scope of the present invention is not limited at all by the following Examples. In the examples, âpartsâ means âparts by weightâ and â%â means â% by weightâ. [Examples 1 to 3 and Reference Example 1] A maleic acid resin solution was first added to a solid plasticizer such as 2-hydroxy-4-benzyloxybenzophenone in a pebble mill pot according to the formulation (non-volatile content) shown in Table 1. Add antifoam and water, 24
After pulverization for an hour, an emulsion of a tackifier and an emulsion of a thermoplastic resin were added, and mixed and stirred for 5 minutes to prepare a heat-sensitive adhesive. The obtained heat-sensitive adhesive was applied to one side of a double-side coated paper so that the coating amount at the time of drying was 15 g / m 2, and dried at 40 ° C. for 4 minutes to obtain a heat-sensitive adhesive sheet. . The sheet was not tacky after drying. The adhesive strength of the heat-sensitive adhesive sheet was evaluated as shown below, and the results are shown in Table 1.
ãïŒïŒïŒïŒãæ¥ ç å ïŒæç±æ§æ¥çã·ãŒãã 150â
ã§60ç§éå ç±ãç²çæ§ãçºçŸãããåŸãéããã«ã¬ã©ã¹
æ¿ã«è²Œãä»ãã 180床å¥é¢ã«ããæ¥ç匷床ã枬å®ãã以
äžã®åºæºã§è©äŸ¡ããã âã»ã»ã»ã»ã»ã»5000mN/25mm 以äžã Ãã»ã»ã»ã»ã»ã»5000mN/25mm æªæºãAdhesive strength: 150 ° C. for heat-sensitive adhesive sheet
After heating for 60 seconds to develop the adhesiveness, the film was immediately attached to a glass plate, and the adhesive strength was measured by 180-degree peeling, and evaluated according to the following criteria. â ã» ã» ã» ã» ã» ã» 5000mN / 25mm or more. Ã: Less than 5000mN / 25mm.
ãïŒïŒïŒïŒã[0022]
ãè¡šïŒã [Table 1]
ãïŒïŒïŒïŒãïŒïŒïŒ äžæ®çºå ïŒïŒïŒ ã¬ã©ã¹è»¢ç§»æž©åºŠ ïŒïŒïŒ è»å枩床* 1) Non-volatile content * 2) Glass transition temperature * 3) Softening temperature
ãïŒïŒïŒïŒãè¡šïŒã®çµæãããïŒâããããã·âïŒâã
ã³ãžã«ãªãã·ãã³ãŸãã§ãã³ãå«æããæç±æ§æ¥çå€ã
å¡åžããŠãªãæç±æ§æ¥çå€ã·ãŒãã¯ããã¿ã«é
žãšã¹ãã«
ç³»ååç©ãåºäœå¯å¡å€ãšããæç±æ§æ¥çå€ãšåæ§ã«ç±æŽ»
æ§ããããšã«ããæ¥çæ§ãåŸãããããšãå€ã£ããFrom the results shown in Table 1, the heat-sensitive adhesive sheet coated with the heat-sensitive adhesive containing 2-hydroxy-4-benzyloxybenzophenone showed that the heat-sensitive adhesive sheet was prepared by using a phthalate compound as a solid plasticizer. It has been found that adhesiveness can be obtained by heat activation as in the case of the adhesive.
ãïŒïŒïŒïŒã[0025]
ãçºæã®å¹æãæ¬çºæã«ãããåŸæ¥ã®åºäœå¯å¡å€ãå«æ
ããæç±æ§æ¥çå€ãå¡åžããŠãªãæç±æ§æ¥çã·ãŒããšå
æ§ã«ãïŒâããããã·âïŒâãã³ãžã«ãªãã·ãã³ãŸãã§
ãã³ãåºäœå¯å¡å€ãšããŠäœ¿çšããããšã«ãããæ¥çåã
å®çšç¹æ§ãæºè¶³ããããšãã§ããæç±æ§æ¥çã·ãŒããåŸ
ãããããã«ãªã£ããå¥é¢çŽã®èŠããªãã©ãã«ãããŒ
ããå
è£
ç©ã®ã·ãŒã«çãšããŠãçè³æºåã§çµæžçãªæç
æ§ãè¿œæ±ããããšãã§ããããã«ãªã£ãããšã®ç£æ¥çæ
矩ã¯ã極ããŠå€å€§ã§ãããAccording to the present invention, 2-hydroxy-4-benzyloxybenzophenone is used as a solid plasticizer in the same manner as a conventional heat-sensitive adhesive sheet coated with a heat-sensitive adhesive containing a solid plasticizer. As a result, a heat-sensitive adhesive sheet capable of satisfying practical characteristics in terms of adhesive strength has been obtained. The industrial significance of being able to pursue economical benefits by saving resources, such as labels, tapes, and packaging seals that do not require release paper, is extremely significant.
ããã³ãããŒãžã®ç¶ã ã¿ãŒã (åèïŒ 4J004 AA05 AA06 AA07 AA09 AA10 AB03 CA02 CA04 CA06 CC02 CE01 DB01 FA01 4J040 CA031 CA071 CA081 DA031 DA051 DA061 DA141 DB051 DB061 DC041 DE021 DE031 DF031 HB19 JA03 JB01 KA26 KA31 LA02 MA02 MA05 MA09 MA10 MA11 MB03 NA06Continued on the front page F term (reference) 4J004 AA05 AA06 AA07 AA09 AA10 AB03 CA02 CA04 CA06 CC02 CE01 DB01 FA01 4J040 CA031 CA071 CA081 DA031 DA051 DA061 DA141 DB051 DB061 DC041 DE021 DE031 DF031 HB19 MA03 MA02 MA03 MA02 MA03 MA02
Claims (2)
ãæç±æ§æ¥çå€ã«ãããŠãåºäœå¯å¡å€ãäžèšäžè¬åŒ
ïŒïŒïŒã§ç€ºãããïŒâããããã·âïŒâãã³ãžã«ãªãã·
ãã³ãŸãã§ãã³ã§ããããšãç¹åŸŽãšããæç±æ§æ¥çå€ã ãåïŒã 1. A heat-sensitive adhesive containing a thermoplastic resin and a solid plasticizer, wherein the solid plasticizer is 2-hydroxy-4-benzyloxybenzophenone represented by the following general formula (1). Heat-sensitive adhesive. Embedded image
å¡åžããŠãªãæç±æ§æ¥çã·ãŒãã2. A heat-sensitive adhesive sheet obtained by applying the heat-sensitive adhesive according to claim 1 to a substrate.
Priority Applications (1)
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JP2000230270A JP2002038123A (en) | 2000-07-31 | 2000-07-31 | Heat-sensitive adhesive and heat-sensitive adhesive sheet |
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JP2000230270A JP2002038123A (en) | 2000-07-31 | 2000-07-31 | Heat-sensitive adhesive and heat-sensitive adhesive sheet |
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JP2002038123A true JP2002038123A (en) | 2002-02-06 |
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JP2000230270A Pending JP2002038123A (en) | 2000-07-31 | 2000-07-31 | Heat-sensitive adhesive and heat-sensitive adhesive sheet |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006342208A (en) * | 2005-06-07 | 2006-12-21 | Ricoh Co Ltd | Heat-sensitive adhesive and adhesive material |
EP2072597A1 (en) | 2007-12-17 | 2009-06-24 | Ricoh Company, Ltd. | Heat-Sensitive Adhesive and Heat-Sensitive Adhesive Material |
US7989529B2 (en) | 2005-11-17 | 2011-08-02 | Ricoh Company, Ltd. | Thermosensitive adhesive composition, method of manufacturing the same and thermosensitive adhesive material |
US7993732B2 (en) | 2006-07-28 | 2011-08-09 | Ricoh Company, Ltd. | Heat-sensitive pressure-sensitive adhesive and heat-sensitive adhesive material |
US8354359B2 (en) | 2006-09-11 | 2013-01-15 | Ricoh Company, Ltd. | Heat-sensitive adhesive agent and heat-sensitive adhesive sheet |
-
2000
- 2000-07-31 JP JP2000230270A patent/JP2002038123A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006342208A (en) * | 2005-06-07 | 2006-12-21 | Ricoh Co Ltd | Heat-sensitive adhesive and adhesive material |
US7989529B2 (en) | 2005-11-17 | 2011-08-02 | Ricoh Company, Ltd. | Thermosensitive adhesive composition, method of manufacturing the same and thermosensitive adhesive material |
US7993732B2 (en) | 2006-07-28 | 2011-08-09 | Ricoh Company, Ltd. | Heat-sensitive pressure-sensitive adhesive and heat-sensitive adhesive material |
US8354359B2 (en) | 2006-09-11 | 2013-01-15 | Ricoh Company, Ltd. | Heat-sensitive adhesive agent and heat-sensitive adhesive sheet |
EP2072597A1 (en) | 2007-12-17 | 2009-06-24 | Ricoh Company, Ltd. | Heat-Sensitive Adhesive and Heat-Sensitive Adhesive Material |
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