JP2002015918A - Laminated electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminated electronic component, equipped with a through- hole and a lead-out electrode improved both in fraction defective of conduction, without greatly impairing its coil in Q characteristics. SOLUTION: Coil conductors 2 and magnetic or nonmagnetic insulating layers are laminated, to form a coil in the inside. A terminal electrode 3 is provided to each edge face of the laminated layer in the direction of lamination. At least one of the terminal electrodes 3 is electrically connected to the end of the coil in the laminated layer 1 through the intermediary of a conductor-filled through-hole 4, provided to one or more insulating layers and an extraction electrode 5A covering the end of the through-hole 4. The area of the extraction electrode 5A is set three times or more larger than the sectional area of the through-hole 4 and 1/3 or smaller than a coil inner area that is defined, when the laminate is seen through in the direction of lamination.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inductor formed by laminating a coil conductor and a magnetic or non-magnetic material and having terminal electrodes on both end surfaces in the laminating direction, a filter by laminating a capacitor on the inductor, and a filter. The present invention relates to a laminated electronic component forming a resonator or the like.

[0002]

2. Description of the Related Art FIG. 6 is a diagram showing the layer structure of a conventional laminated electronic component of this kind. This multilayer electronic component constitutes an inductor. Green sheets 1a to 1m each include a magnetic or non-magnetic powder.
On one side of d to 1i, a coil conductor 2 for forming a spiral coil is formed. 1c and 1j include coil conductors 2a and 2a for guiding the end of the coil to the center of the coil.
b is formed. The green sheets 1c to 1j provided with the coil conductors 2, 2a, 2b are provided with conductor filled through holes 4 for connecting the coil conductors.

The green sheets 1a, 1b, 1k, and 1m are provided with through holes 4 filled with a conductor for connecting both ends of the coil to terminal electrodes 3 at both ends (see FIG. 1B). One side of each through hole 4 has a lead electrode 5
Is formed. On the outer surface of the green sheet 1a on one end side, a lead electrode 5 for making good connection to the terminal electrode 3 is formed on a peelable film 6, and the lead electrode 5 is transferred to the green sheet 1a. The terminal electrodes 3 are provided at both ends of the laminate by coating and baking so as to enclose the extraction electrodes 5.

In general, the area of the extraction electrode 5 in the conventional multilayer electronic component is designed to be approximately twice the cross-sectional area of the through hole 4. As described above, the reason why the number of the extraction electrodes 5 is doubled is that, first, the processing accuracy of the through holes 4 formed in the green sheets 1a to 1m,
Secondly, the printing accuracy when a screen printing machine is used as a means for forming the extraction electrode 5 on the green sheets 1a, 1b, 1k, and 1m, and thirdly, for stacking the green sheets 1a to 1m. This is because, in consideration of the lamination accuracy of the lamination equipment and the like, conduction failure due to positional displacement between the through hole 4 and the extraction electrode 5 does not occur.

[0005]

In the above-described conventional multilayer electronic component, the green sheets 1a, 1b, 1
The area occupied by the extraction electrode 5 formed on the k and 1 m is
Since the area occupied by the coil conductor 2 is small, the green sheets 1a, 1b, 1k,
1 m has poor stability at the time of lamination, and the green sheet 1 a
A deviation easily occurs between 1b, 1k, and 1m, and the probability of a conduction failure increases.

To solve this problem, the extraction electrode 5
Can be dealt with by making the area as large as possible.
However, when the area of the extraction electrode 5 is increased, the flow of the magnetic flux as a coil is deteriorated, and as a result, the Q characteristic is reduced.

SUMMARY OF THE INVENTION In view of the above problems, the present invention increases the area of the extraction electrode without significantly impairing the Q characteristic of a coil as an electronic component, and does not impair the stability when laminating green sheets as much as possible. It is an object of the present invention to provide a multilayer electronic component in which a gap between a hole and a lead electrode is suppressed.

[0008]

According to a first aspect of the present invention, there is provided a laminated electronic component in which a coil conductor and an insulating layer made of a magnetic or non-magnetic material are laminated to form a coil therein, and the coil is formed at both ends in the laminating direction. Having a terminal electrode, at least a terminal electrode on one end side,
A multilayer electronic component connected to a coil end inside a multilayer body through a conductor-filled through-hole provided in one or more insulating layers and a lead electrode provided to cover an end of the through-hole. The area of the extraction electrode is set to be at least three times the cross-sectional area of the through-hole and at most one-third of the area inside the coil when the laminated body is seen through in the laminating direction.

As described above, by setting the area of the extraction electrode to be at least three times the cross-sectional area of the through hole, the stability at the time of laminating the green sheets is not impaired. Can be reduced, and the yield is improved. Further, by setting the area of the extraction electrode to be 1/3 or less of the inner area of the coil, the Q characteristic of the coil is not reduced.

According to a second aspect of the present invention, in the multilayer electronic component according to the first aspect, the through-hole and the lead-out electrode are formed as follows.
It is characterized by being located substantially at the center of a rectangular cross section perpendicular to the laminating direction.

As described above, by setting the through hole and the lead electrode at a position substantially at the center of the rectangular cross section perpendicular to the laminating direction, even if the mounting surface of the laminated electronic component is changed, the reactance of the laminated electronic component is reduced. Less change.

[0012]

FIG. 1A is a layer structure diagram showing an embodiment of a multilayer electronic component according to the present invention taking an inductor as an example, and FIG. 1B is an external view thereof. The appearance of the multilayer electronic component is the same as that of the conventional example shown in FIG. Figure 1
6A, the same reference numerals as those in FIG. 6 indicate the same components. 5A is a coil conductor 2, 2a, 2b according to the present invention.
Is a lead electrode that covers the through hole 4 that connects between the end of the coil constituted by the above and the terminal electrode 3.

This laminated electronic component is manufactured through the steps shown in FIGS. That is, as shown in FIG. 2, the coil conductors 2, 2a, 2b are arranged vertically and horizontally, respectively, and the conductor filling through holes 4 are provided at the ends of the coil conductors 2, 2a, 2b. Green sheet 1c ~
1 j are stacked so that the coil conductors 2, 2 a, 2 b vertically adjacent to each other are wound and connected via the through holes 4.

At the same time, the plurality of green sheets 1c to
1j, conductor-filled through-holes 4 are formed vertically and horizontally, and the lead-out electrodes 5A are formed so as to cover the through-holes 4.
The green sheets 1a, 1b, 1k and 1m provided with are laminated. At this time, a conductor paste for transferring the lead electrode 5A covering the lower surface of the green sheet 1a is attached to the film 6.

The green sheets 1a to 1m are formed in a sheet shape by mixing, for example, a magnetic powder or a non-magnetic powder having a low dielectric constant with a binder or a plasticizer. As the coil conductor 2, a U-shaped (3/4 turn) or L-shaped (1/2 turn) pattern as shown is used. The conductors for filling the coil conductors 2, 2a, 2b and the through holes 4 and the lead electrodes 5A are formed or filled by printing a conductor paste containing a metal powder such as silver or an alloy thereof.

The green sheets 1a to 1m have a relative dielectric constant of 30 for high frequency use in order to reduce the distributed capacitance.
It is preferable to use the following alumina, cordierite, umlite, glass having a low dielectric constant, or the like. In this example, a ceramic green sheet containing a composition of 70% by weight of glass made of strontium, calcium, alumina and silicon oxide and 30% by weight of alumina was used. In addition, silver paste was used for the coil conductor, and the coil conductors 2, 2a, and 2b were printed so as to have a width of 60 μm and a thickness of 10 μm.

Then, the whole of the laminated green sheets 1a to 1m is press-bonded to obtain a laminate material 1X for a number of laminated electronic components as shown in FIG. Thereafter, the material 1X made of the pressed green sheet is cut into individual chips along the cutting line 7 and fired.

Then, at both ends of each chip in the stacking direction,
A conductive paste made of the silver paste for forming the terminal electrode 3 shown in FIG. 1B is applied by dipping or the like and fired. Then, electroplating is further performed thereon. As the electroplating, copper, nickel and tin, nickel and gold, nickel and palladium and gold, nickel and palladium and silver, or nickel and silver are used.

FIG. 4 is a diagram for explaining the relationship between the area of the extraction electrode 5, the cross-sectional area of the through hole 4, and the area of the coil interior 8 when the coil constituted by the coil conductor 2 is seen through in the stacking direction. It is. FIG. 4A is a view of the coil conductor in the stacking direction, and FIG. 4B is a view of the through-hole 4 and the extraction electrode 5A. FIG.
4 (C) and 4 (D) respectively show FIGS. 4 (A) and 4 (B)
It shows the plane cut along the lines E and FF.

In this embodiment, one side of the coil is S
1, and the extraction electrode 5A is also formed into a square with one side indicated by S2.
Is formed in a circular shape having a diameter of S3.

Here, the area (S2) of the extraction electrode 5A
² is set as follows with respect to the area (S1) ² of the inside 8 of the coil and the cross-sectional area (S3 / 2) ² × π of the through hole 4. About ^{3 × (S3 / 2) 2} × π ≦ (S2) 2 ≦ (S1) 2/3 5 Example Comparative Example and conventional products according to the invention, the Q characteristic, the results of examining the conduction failure ratio FIG. Here, the relationship between the through hole 4, the extraction electrodes 5, 5A, and the area of the coil interior 8 of the sample used for measurement is as follows. Conventional product: area of extraction electrode 5 / area of through hole 4４2.4 area of extraction electrode 5 / area of coil 8 ≒ 0.13 Example 1: area of extraction electrode 5A / area of through hole 4 ≒ 3 0.3 Area of extraction electrode 5A / area of coil 8 ≒ 0.18 Example 2: Area of extraction electrode 5A / area of through hole 4 ≒ 5 Area of extraction electrode 5A / area of coil 8 ≒ 0.28 Example 1: Area of extraction electrode 5A / area of through hole 4４8 Area of extraction electrode 5A / area of coil 8 ≒ 0.44 Comparative Example 2: Area of extraction electrode 5A / area of through hole 4 ≒ 12 Extraction electrode 5A / (area of coil 8) で 0.69 In FIG. 5, the Q characteristic is the Q value at 100 MHz, and the Q value is the same as that of the conventional product in Examples 1 and 2. That is, as shown in the Q value of FIG.
If the area of the extraction electrode 5A is set to 1/3 or less of the area of the inside 8 of the coil, a Q characteristic almost equal to that of the conventional product can be obtained.

On the other hand, as in Comparative Examples 1 and 2, the area of the extraction electrode 5A exceeds one-third of the area of the coil 8 (4
4%, 69%), the Q characteristic is impaired.

Further, the conduction failure rate due to the through-hole 4 and the lead electrode 5A due to the displacement at the time of lamination between the green sheets is 1.9% in the conventional product, but 0.4% or less in the case of the present invention. Could be held down.

The present invention can be configured as an inductor array by setting the cutting line 7 in FIG. 3 so that one chip includes a plurality of inductors.
In this case, the present invention can be applied.

Further, the present invention can be applied to a case where not only an inductor but also a capacitor connected to the inductor is built in the laminate.

[0026]

According to the first aspect of the present invention, the area of the extraction electrode is set to be at least three times the cross-sectional area of the through-hole and at most one-third of the inner area of the coil. Without reducing the gap between the through hole between the green sheets and the extraction electrode,
The conduction failure rate can be reduced, and the yield can be improved.

According to the second aspect, the through hole and the lead electrode are located at positions substantially at the center of a rectangular cross section perpendicular to the laminating direction. Therefore, even if the mounting surface of the laminated electronic component is changed, The change in reactance is reduced.

[Brief description of the drawings]

FIG. 1A is a layer structure diagram showing an embodiment of a multilayer electronic component according to the present invention, taking an inductor as an example, and FIG.
FIG.

FIG. 2 is a multi-cavity layer structure diagram in a manufacturing process of the present embodiment.

FIG. 3 is a diagram showing a state where the sheets of FIG. 2 are stacked.

FIG. 4A is a view of a coil conductor viewed in a stacking direction;
(B) is a view of the through-hole and the lead electrode in the laminating direction, (C) and (D) are (A) and (B), respectively.
-E and FF show a section cut along the line.

FIG. 5 is a diagram showing a comparison between the Q characteristic and the conduction failure rate of an example of the present invention, a comparative example, and a conventional product.

FIG. 6 is a layer structure diagram showing a conventional multilayer electronic component.

[Explanation of symbols]

1: laminate, 1a to 1m: green sheet, 2, 2a,
2b: coil conductor, 3: terminal electrode, 4: through hole,
5A: Lead electrode, 6: Film, 7: Cutting line

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Tohru Takahashi 1-1-13 Nihonbashi, Chuo-ku, Tokyo Inside TDC Corporation (72) Inventor Hiroshi Sato 1-13-1 Nihonbashi, Chuo-ku, Tokyo No. TDC Corporation (72) Inventor Yuyuki Saito 1-13-1 Nihonbashi, Chuo-ku, Tokyo In-house T72 PC Inventor Masaharu Sudo 1-13 Nihonbashi, Chuo-ku, Tokyo No. 1 T-D-K Corporation F term (reference) 5E070 AA01 AB01 BA12 CB03 CB13 CB17 CB18 CB20 EA01 EB03

Claims (2)

[Claims] A coil is formed by laminating a coil conductor and an insulating layer made of a magnetic material or a non-magnetic material, and has terminal electrodes at both ends in the laminating direction. A multilayer electronic component connected to a coil end inside a multilayer body through a conductor-filled through-hole provided in one or more insulating layers and a lead electrode provided to cover an end of the through-hole. Wherein the area of the extraction electrode is set to be at least three times the cross-sectional area of the through-hole and at most one-third of the area inside the coil when the laminated body is viewed through in the laminating direction. Electronic components. 2. The multilayer electronic component according to claim 1, wherein the through hole and the lead electrode are located at a position substantially at the center of a rectangular cross section perpendicular to the stacking direction.