JP2002009226A - Semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor device of three-dimensional mounting module constitution using a flexible printed circuit board which possesses structurally an excellent assembability, repair workability and a noise proof performance. SOLUTION: Mainly electronic arts 121, 122 and 123 are mounted on respective mounting regions 111, 112 and 113 of the flexible printed circuit board 11. A flexible printed circuit board 13 is constituted such that respective mounting regions 111 to 113 are to be folded and fixed in a predetermined order (f1 to f3) on a base region 110. A conductive region 116 of a specified potential, for example, the ground potential is formed at the periphery of each mounting regions 111 to 113. Each of the conductive processing spacers 13 is folded and fixed on the flexible printed circuit board, having a specified outer frames for protecting the above electronic parts 121-123 and is electrically connected to conductive areas 116.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device using a flexible circuit board, and more particularly to a semiconductor device constituting a three-dimensional mounting module which is required to be inexpensive, small, thin, and lightweight.

[0002]

2. Description of the Related Art Unlike a rigid circuit board, a flexible circuit board has the advantage of being soft and deformable. This is advantageous for high-density mounting of ICs and downsizing of modules. That is, the flexible circuit board has a TC
P (Tape Carrier Package) and COF (Chip On Flexib)
le or Film), and is particularly indispensable for miniaturization of various media devices.

[0003] In addition, the technology of the system LSI is also important in realizing the miniaturization, thinning, and weight reduction of media devices.
The system LSI has steadily advanced the technology for one chip while taking in the LSI of the peripheral circuit. But,
In the development of a system LSI, a long development period and an increase in chip cost due to a mixture of heterogeneous processes are caused. As a result, the current situation is that short delivery times and low costs required by media devices cannot be satisfied.

[0004]

For the above-mentioned reasons, 3
There has been an increasing demand for implementation of system functions mainly in three-dimensional implementation, and integration of system LSI and implementation technology has become important. In the media equipment industry, the degree of growth is determined by frequency (higher speed) and delivery time (short delivery time). For this reason, the connection length and the wiring length of the built-in LSI must be reduced as much as possible by mounting and package technology. For these reasons, various ideas have been devised for the three-dimensional mounting module and the three-dimensional mounting module has entered the stage of practical use.

For example, conventionally, a three-dimensional mounting module is
The following configuration is in practical use or in practical use.
First, as (A), TCP (Tape Carrier Package)
And connection between chip stacks is achieved by outer leads of TCP. Also, as (B), a wiring frame is provided between the stacks of TCPs to achieve connection between the chip stacks. In addition, as (C), there are various techniques such as stacking at a chip level and connecting the chip stacks with a conductive material.

According to such a conventional technique, it is necessary to electrically connect the chip stacks via some kind of interposer. The connection configuration between the interposers includes an external connection configuration as in the above (A) and (C) and an internal connection configuration as in the above (B).
In any case, only when the structure of the three-dimensional mounting module is achieved, electrical operation as a module product is recognized, and measurement and inspection can be performed.

[0007] Therefore, if the three-dimensional mounting module is determined to be defective as a result of measurement, inspection, or the like, repair (or rework) work is performed for non-defective products. That is, in the three-dimensional mounting module, at the stage of three-dimensional assembling, it is important to consider a processing method of the common electrode and the non-common electrode and a connection form in consideration of repair (or rework) workability. In this respect, there is a problem that time and cost increase in the above-described conventional technology.

[0008] Furthermore, there are many media devices that handle high frequencies. At present, a chipset as a conventional three-dimensional mounting module as described above does not take aggressive measures against intrusion of noise.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-described circumstances, and is excellent in ease of assembling into a three-dimensional structure, excellent in repair (or rework) workability, and has a structurally noise-resistant flexible circuit. An object of the present invention is to provide a semiconductor device having a three-dimensional mounting module configuration using a substrate.

[0010]

According to the present invention, there is provided a semiconductor device comprising:
It has a base region and one or more mounting regions connected to the periphery thereof, and a conductive region of a predetermined potential provided at a peripheral portion of the mounting region, and is formed such that each mounting region is folded over the base region. A flexible circuit board, an electronic component mounted corresponding to the mounting area, and a laminated support electrically connected to the conductive area having a predetermined outer shape frame to protect the electronic component. And an adhesive member for laminating and fixing the electronic component by the laminated support and the flexible circuit board. Further, the semiconductor device of the present invention relates to a flexible circuit board, and further includes an external terminal region.

According to the semiconductor device of the present invention, the operation as a module product becomes possible when electronic components are mounted on the flexible circuit board. Thus, measurement, inspection, and the like can be performed before being assembled as a three-dimensional mounting module.

Further, the structure in which the conductive region of a predetermined potential provided on the peripheral portion of the mounting region is electrically connected to the laminated support is such that when assembled as a three-dimensional mounting module, the electric shield of the electronic component is provided. Act as

The semiconductor device of the present invention is more preferably
A positioning mechanism for arranging the laminated support on a predetermined area of the flexible circuit board is further provided. Thereby, the assembling accuracy can be improved.

[0014]

1A to 1C are schematic views showing the structure of a semiconductor device according to a first embodiment of the present invention in the order of assembly. As shown in FIG. 1A, the flexible circuit board 11 has a base region 110 and mounting regions 111, 112, 113 provided continuously around the base region 110, and a predetermined conductive pattern (not shown) under the protective film. ) Is formed. Further, an external terminal portion 115 is provided in a region around the base region 110 where the mounting region is not provided. The external terminal 115 is a connector terminal here.

In the flexible circuit board 11, electronic components 121, 122 and 123 mainly correspond to the mounting areas 111, 112 and 113, respectively, and are mounted face-down. The electronic components 121, 122, and 123 may be various types such as a memory chip, a system LSI chip, a control unit, and the like.

Such electronic components 121, 122, 12
As the face-down mounting of No. 3, for example, soldering of the bump electrode of each electronic component and a predetermined conductive pattern of the flexible circuit board 11 can be considered. AC
Connection by F (anisotropic conductive film) is also conceivable. That is, an ACF (anisotropic conductive film) is interposed between the bump electrode of each of the electronic components and a predetermined conductive pattern of the flexible circuit board 11, and then heat-pressed. Thereby, each electronic component 121, 1 is formed by the conductive particles in the ACF.
The necessary electrical connection between the conductive patterns 22 and 123 and the conductive pattern of the flexible circuit board 11 is obtained. Other, ACP
(Anisotropic conductive paste) bonding, NCP bonding for obtaining electrical connection by contraction force of insulating resin, gold-gold by bump,
Various methods such as eutectic bonding of metal such as gold-tin can be considered. In some cases, face-up mounting using a wire bonding method is also applicable. In addition, the ultra-thin I
Mounting of the C package is also conceivable, and the mounting form of the electronic component is not particularly limited.

The flexible circuit board 11 is made of a soft base material such as polyimide which can be bent freely. The flexible circuit board 11 is configured such that the mounting areas 111 to 113 are folded over the base area 110 in a predetermined order (f1 to f3).

In this flexible circuit board 11,
A conductive region 116 having a predetermined potential, for example, a ground potential is formed on the peripheral portion of each of the mounting regions 111 to 113. The conductive region 116 is provided as a linear land as illustrated. Alternatively, they may be provided as lands in some places.

The conductive processing spacers 13 (13a, 13b, 13c) are mounted on the flexible circuit board 11. The conductive processing spacer 13 is provided with the electronic components 121 to 121.
In order to protect 123, each has a predetermined outer frame and is electrically connected to the conductive region 116.

Regarding the conductive treatment spacer 13, here,
FIG. 1A shows a conductive treatment spacer 13a which is disposed first to protect the electronic component 121. Further, the conductive processing spacer for protecting the electronic component 122, which is formed by folding the mounting area 111 and arranging thereon, is provided.
3b and shown in FIG. 1 (b). The mounting region 112 is folded and the conductive processing spacer 13 disposed thereon is provided.
1c is provided below the mounting area 113 folded as shown in FIG. 1C to protect the electronic component 123.

As shown in FIGS. 1B and 1C, the conductive processing spacer 13 is fixedly overlapped on the flexible circuit board and surrounds each of the electronic components 121 to 123. That is, when the mounting regions 111 to 113 are folded, the electronic components 121 to 123 support the respective layers.

Conductive treatment spacer 13 (13a to 13c)
Various types are conceivable, such as those obtained by plating a resin material in consideration of reflow heat resistance. For example, a molded article of a polyimide resin is nickel-plated. The conductive processing spacer 13 and the conductive region 116 are connected and fixed with a conductive adhesive material containing a metal filler, a conductive double-sided tape, or the like.

Although not shown, the electronic component 12
Some small electronic components (peripheral elements) related to 1, 122, and 123 may be mounted. For example, a chip capacitor or a chip resistor is used. Furthermore, a crystal required for clock generation may be mounted. It is desirable that these peripheral elements are also provided inside the conductive processing spacer 13. However, if priority is given to miniaturization of the product, the product may be arranged along the outside of the conductive processing spacer 13.

FIGS. 2A and 2B are cross-sectional views each showing a part of the semiconductor device of FIG. The mounting region 111 is bent, and the electronic component 121 is disposed above the base region 110. Regarding the mounting of the electronic component 121, a mounting example using an ACF (anisotropic conductive film) is used. FIG. 2B is an enlarged view showing further partial details of FIG. That is, the flexible circuit board 11 has a conductive pattern 102 formed on a base material 101 such as polyimide, and is protected by the resist layer 103. A predetermined terminal on the conductive pattern 102 and the electronic component 1
This is a configuration in which 21 bump electrodes BMP are electrically connected via an ACF (anisotropic conductive film).

As shown in FIGS. 2A and 2B, the conductive treatment spacer 13 (FIG. 13A) includes a resin material 131 and a plating layer 132. The conductive processing spacer 13 uses a conductive adhesive (or a conductive double-sided tape or the like) for the bonding region 21 and is electrically connected to a conductive region (for example, a GND line) 116 on the flexible circuit board 11. I have. Further, an adhesive member is used in the adhesive region 22 for fixing on the base region 110. The fixation on the base region 110 does not need to be a conductive adhesive member. Thus, the illustrated electronic component 121 is protected by being surrounded by the conductive processing spacer 13.

Although there are other electronic components 122 and 123 and other small electronic components in the vicinity, not shown, as described above, the electronic components are arranged above the base region 110.
Each of the mounting areas 112 and 113 is sequentially folded. As a result, the electronic component (121 to 123 and others) is laminated and fixed with the conductive processing spacer 13 and the flexible circuit board 11 integrated.

According to the configuration of the first embodiment, when electronic components (121 to 123 and others) are mounted on the flexible circuit board 11, operation as a module product becomes possible. Thus, measurement, inspection, and the like can be performed before being assembled as a three-dimensional mounting module.

Further, the conductive processing spacer 13 is configured to be electrically connected to a conductive region 116 of a predetermined potential (here, a ground potential) provided on the peripheral portion of each of the mounting regions 111 to 113. Thereby, when at least each of the electronic components 121 to 123 is assembled as a three-dimensional mounting module as shown in FIG.
123 electrical shields are configured.

Thus, for example, the conductive region 116 contributes to shielding (protection) against noise entering from the end of the flexible circuit board 11. In addition, for example, the conductive processing spacer 13 contributes to shielding (protection) against noise entering from the end portions of the electronic components 121 to 123.

From the above, the configuration of the present invention is as follows.
Repair (or rework) as a dimension mounting module
Excellent workability. In addition, the three-dimensional mounting module configuration of the present invention provides the electronic components (1) on the flexible circuit board 11.
21 to 123, etc.), and are folded together with the flexible circuit board 11 and the conductive processing spacer 13. This makes it possible to stack IC chips
It can be said that the restrictions on the IC size and pad arrangement are extremely loose compared to the package and the like. The stacked package has various restrictions such as the size of the IC to be combined and the positions of the IC terminals.

That is, the three-dimensional mounting module according to the present invention has the advantage that the degree of freedom of the types and combinations of ICs is wide and that a plurality of peripheral elements can be mounted. Moreover, protection means (conductive region 116 and conductive processing spacer 13) against noise intrusion can be provided. By taking these factors into account, it is possible to make a multi-chip module that is optimal also in terms of electrical characteristics.

FIGS. 3A to 3C are schematic views showing the configuration of a semiconductor device according to a second embodiment of the present invention in the order of assembly. The same parts as those in the first embodiment are denoted by the same reference numerals.

In this embodiment, a flexible circuit board 11 is used instead of the conductive region 116 in the first embodiment.
Is provided with an opening land 31 also serving as a positioning. Each of the conductive processing spacers 13 (13a to 13c) also has a connection opening 32 of the same size that matches the position of the opening land 31.
Is provided. The aperture land 31 in the flexible circuit board 11 is connected to a predetermined potential, for example, a ground potential, as in the first embodiment. The conductive processing spacer 13 is mounted with a conductive adhesive member so that the connection opening 32 is aligned with the opening land 31 of the flexible circuit board 11 (FIG. 3).
(A), (b)).

Although not shown, for example, a thermosetting conductive adhesive is used for the conductive adhesive member. In addition, a conductive adhesive sheet or the like is conceivable. In the case of a conductive adhesive sheet, it is preferable that openings of the same size are formed in the same manner as the opening lands 31 of the flexible circuit board 11 and the connection openings 32 of the conductive processing spacer 13.

As shown in FIG. 3C, the conductive pins 33 are inserted as indicated by broken arrows after the mounting area is laminated as a module. The pins 33 may be inserted and fixed together with a conductive adhesive. Alternatively, a screw may be cut in the pin 33 and the conductive processing spacer 13 may be screwed. Alternatively, the pins 33 may be inserted in advance from the back surface of the base region 110 in advance, and the mounting regions and the conductive processing spacers may be stacked and fixed together with the positioning of the pins 33. Although not shown, a heat sink such as a radiation fin provided on the uppermost layer may be connected to the pin 33.

With such a configuration, the conductive processing spacer 13 overlaps and is fixed on the flexible circuit board as in the first embodiment, and takes a form surrounding each of the electronic components 121 to 123. That is, each mounting area 11
When the electronic components 121 to 113 are folded,
The electrical shield is formed by supporting each of the 123 layers.

Thus, for example, the conductive region 116 is protected against noise entering from the end of the flexible circuit board 11 or the end of the electronic components 121 to 123.
And the conductive processing spacer 13 contributes to the shield (protection).

According to the second embodiment, not only the repair (or rework) workability is excellent as a three-dimensional mounting module, but also the positioning at the time of assembly becomes extremely easy. That is, the opening lands 31 and 32 which also serve as positioning.
By the insertion of the pins 33, the assemblability (speed and accuracy of assembling) is significantly improved. By improving the positioning accuracy, there is an advantage that a product can be designed with a smaller clearance. Further, since the occupied area is narrowed as compared with the conductive area 116 of the first embodiment, there is an advantage that the normal wiring area can be increased. Thereby, a more compact three-dimensional mounting module can be realized.

Other effects are the same as those of the first embodiment. That is, there is an advantage that the degree of freedom of the types and combinations of ICs is wide and that a plurality of peripheral elements can be mounted. Moreover, protection means (conductive region 116 and conductive processing spacer 13) against noise intrusion can be provided. By taking these factors into account, it is possible to make a multi-chip module that is optimal also in terms of electrical characteristics.

FIGS. 4A to 4C are schematic views showing the configuration of a semiconductor device according to the third embodiment of the present invention in the order of assembly. The same parts as those in the first embodiment are denoted by the same reference numerals.

In this embodiment, a boss (projection) 41 also serving as a positioning and an opening 42 in which the boss 41 is fitted are provided on each of the conductive processing spacers 13 (13a to 13c) and the flexible circuit board 11 as compared with the first embodiment. ing.
The opening 42 is formed at a predetermined depth on the back surface of the conductive processing spacer 13 in accordance with the height of the boss 41. Although not shown, consideration should be given to shortening the boss of the conductive processing spacer 13a so as not to protrude much from the lower part of the flexible circuit board 11. This is so as not to hinder the mounting on the main board.

Although the conductive region 116 (eg, GND line) is separated, it is electrically connected by the conductive processing spacer 13. That is, the conductive processing spacer 13 is
Is fitted and fixed to the opening 42 provided on the back surface side of the flexible circuit board 11 (FIG. 4A). afterwards,
The mounting area 112 on which the electronic component 122 is mounted is folded and fixed with a conductive adhesive member (FIG. 4).
(B)).

As shown in FIG. 4C, the uppermost flexible circuit board 11 may be provided with an opening 42 reaching a part of the conductive processing spacer 13. In that case, it contributes to positioning when a heat sink or the like is provided above the three-dimensional module.

With such a configuration, the conductive processing spacer 13 overlaps and is fixed on the flexible circuit board as in the first embodiment, and takes a form surrounding each of the electronic components 121 to 123. That is, each mounting area 1
When the electronic components 121 and 113 are folded,
To 123 are supported to form an electric shield.

Thus, for example, the conductive region 116 contributes to shielding (protection) against noise entering from the end of the flexible circuit board 11. In addition, for example, the conductive processing spacer 13 contributes to shielding (protection) against noise entering from the end portions of the electronic components 121 to 123.

In the third embodiment, as in the second embodiment, not only the repair (or rework) workability is excellent as a three-dimensional mounting module, but also the positioning during assembly becomes extremely easy. In other words, the boss 41 also serving as the positioning and the opening 42 into which the boss 41 is fitted, the assemblability (the speed and accuracy of assembling) is remarkably improved. By improving the positioning accuracy, there is an advantage that a product can be designed with a smaller clearance. Thereby, a more compact three-dimensional mounting module can be realized.

The other effects are the same as those of the first embodiment. That is, there is an advantage that the degree of freedom of the types and combinations of ICs is wide and that a plurality of peripheral elements can be mounted. Moreover, protection means (conductive region 116 and conductive processing spacer 13) against noise intrusion can be provided. By taking these factors into account, it is possible to make a multi-chip module that is optimal also in terms of electrical characteristics.

FIGS. 5A and 5B show the configuration of a semiconductor device according to a fourth embodiment of the present invention, wherein FIG. 5A is a plan view before assembling, and FIG. 5B is three-dimensional after assembling. FIG. 3 is an arbitrary cross-sectional view illustrating a schematic configuration of a mounting module. The first
The same parts as those in the embodiment are denoted by the same reference numerals, and description thereof will be omitted.

In the fourth embodiment, a flexible circuit board 51 is different from the first embodiment. As shown in the figure, on the back surface of the base region 110 of the flexible circuit board 51, an external terminal portion (for example, a ball electrode) 52 is provided as shown by a broken line. That is, the external terminal portion 11 shown in the first embodiment (FIG. 1)
5 is replaced by an array-type electrode (5
2).

On the main surface of the flexible circuit board 51 on which the mounting regions (111 to 113) are arranged, the ends of the conductive patterns corresponding to the external terminals (not shown) are connected to the external terminal portions (not shown) via via patterns (not shown). Ball electrode) 52.

Also in this flexible circuit board 51, as in the first embodiment, each of the mounting areas 111 to 11
A conductive region 1 at a predetermined potential, for example, a ground potential,
16 are formed. The conductive region 116 is provided as a linear land as illustrated. Alternatively, they may be provided as lands in some places.

Further, the conductive processing spacer 13 is electrically connected to the conductive region 116. The conductive processing spacers 13 each have a predetermined outer frame, and
21 to 123 and constitute an electric shield. That is, when the mounting regions 111 to 113 are folded, the electronic components 121 to 123 support the respective laminated layers and are also electrically shielded. The conductive processing spacer 13 and the conductive region 116 are connected and fixed with a conductive adhesive material containing a metal filler, a conductive double-sided tape, or the like.

Although not shown, the electronic component 12
Some small electronic components (peripheral elements) related to 1, 122, and 123 may be mounted. For example, a chip capacitor or a chip resistor is used. Furthermore, a crystal required for clock generation may be mounted. It is desirable that these peripheral elements are also provided inside the conductive processing spacer 13. However, if priority is given to miniaturization of the product, the product may be arranged along the outside of the conductive processing spacer 13.

Thus, the flexible circuit board 51
Are folded in a predetermined order with the conductive processing spacers 13 (thick regions 131), and each electronic component (121 to 1
23) are laminated and fixed in the same manner as in the first embodiment (FIG. 5B).

Although not shown, also in the fourth embodiment, as described in the second embodiment, each of the flexible circuit board 11 and the conductive processing spacer 13 has an opening land (also serving as a positioning). 31, 32),
A configuration corresponding to the pin (33) may be provided. Alternatively, as described in the third embodiment, the flexible circuit board 11 and the conductive processing spacer 13 may each be provided with a configuration corresponding to a boss (41) also serving as a positioning and an opening (42). Good. As a result, an improvement in the accuracy of module assembly can be expected.

In the fourth embodiment, a configuration in which each mounting area is provided on all four sides around the base area 110 is sufficiently conceivable. Also in this case, the electronic components are stacked together with the conductive processing spacer in a predetermined order, and the first
It is fixed in the same manner as in the embodiment.

As described above, according to the configuration of the fourth embodiment, similarly to the first embodiment, the operation as a module product becomes possible when electronic components are mounted on the flexible circuit board 51. Thus, measurement, inspection, and the like can be performed before being assembled as a three-dimensional mounting module.

Further, at least each of the electronic components 121 to 1
When 23 is assembled as a three-dimensional mounting module,
An electric shield for each of the electronic components 121 to 123 is configured. Thus, for example, the conductive region 116 contributes to shielding (protection) against noise entering from the end of the flexible circuit board 11. Also, for example, electronic components 121 to 121
The conductive processing spacer 13 contributes to shielding (protection) against noise entering from the end of the 123.

According to each of the above embodiments, as a three-dimensional mounting module, electronic components (121 to 123 and others) are mounted on the flexible circuit board 11 and folded together with the flexible circuit board 11 and the conductive processing spacer 13. is there. Thereby, the repair (or rework) workability is excellent. Further, in order to improve the assembling accuracy, it is possible to add a configuration for devising positioning such as the opening lands (31, 32) and the pin (33), the boss (41) and the opening (42).

Further, according to the three-dimensional mounting module configuration of the present invention, the restrictions on the size and pad arrangement of the IC are extremely loose as compared with a stacked package in which IC chips are stacked. That is, there is an advantage that the degree of freedom of the types and combinations of ICs is wide and that a plurality of peripheral elements can be mounted. Moreover, protection means (conductive region 116 and conductive processing spacer 13) against noise intrusion can be provided. By taking these factors into consideration, it is possible to make a multi-chip module that is optimal in terms of electrical characteristics.

[0061]

As described above, according to the semiconductor device of the present invention, electronic components are mounted on a flexible circuit board so as to be folded into a three-dimensional mounting module. As a result, measurement, inspection, and the like can be performed before assembly into a three-dimensional mounting module.

Further, when assembled as a three-dimensional mounting module, the electronic components are stacked and fixed together with a noise-resistant configuration.
That is, the conductive region at the peripheral edge of the flexible circuit board and the conductive processing spacer connected thereto can be provided. Further, a positioning configuration of the conductive processing spacer can be added.

As a result, it is excellent in the assemblability into a high-density three-dimensional mounting module, the repair (or rework) workability, the flexibility, the noise resistance, the structure, and the flexibility optimal. A highly reliable semiconductor device having a three-dimensional mounting module configuration using a circuit board can be provided.

[Brief description of the drawings]

FIGS. 1A to 1C are schematic views showing the configuration of a semiconductor device according to a first embodiment of the present invention in the order of assembly.

FIGS. 2A and 2B are cross-sectional views each showing a part of the semiconductor device of FIG. 1;

FIGS. 3A to 3C are schematic views showing the configuration of a semiconductor device according to a second embodiment of the present invention in the order of assembly.

FIGS. 4A to 4C are schematic views showing the configuration of a semiconductor device according to a third embodiment of the present invention in the order of assembly.

FIGS. 5A to 5C are schematic views showing the configuration of a semiconductor device according to a fourth embodiment of the present invention in the order of assembly.

[Explanation of symbols]

 11, 51 ... flexible circuit board 101 ... base material 102 ... conductive pattern 103 ... resist layer 110 ... base region 111, 112, 113 ... mounting region 115, 52 ... external terminal part 116 ... conductive region 121, 122, 123 ... electronic components DESCRIPTION OF SYMBOLS 13 ... Conductive processing spacer 21 ... Adhesion area 31, 32 ... Opening land 33 ... Pin 41 ... Boss (projection) 42 ... Opening part ACF ... Anisotropic conductive film BMP ... Bump electrode

Claims (4)

[Claims] 1. A base region and a peripheral region surrounding the base region.
One or more mounting areas, and a flexible circuit board having a conductive area of a predetermined potential provided at a peripheral portion of the mounting area, and formed such that each mounting area is folded over the base area; and An electronic component mounted correspondingly; a laminated support having a predetermined outer shape frame to protect the electronic component and electrically connected to the conductive region; and the laminated support and the flexible circuit board. A semiconductor device, comprising: an adhesive member for laminating and fixing the electronic components. 2. The semiconductor device according to claim 1, wherein the flexible circuit board further includes an external terminal region provided continuously around the base region. 3. The semiconductor device according to claim 1, wherein the flexible circuit board further includes an external terminal area provided on a surface below the base area. 4. The semiconductor device according to claim 1, further comprising a positioning mechanism for disposing the laminated support on a predetermined area of the flexible circuit board.